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© 2015 TechSearch International, Inc. www.techsearchinc.com

Development of Cost Effec1ve Mul1 Die Integra1on Solu1ons for Emerging Connec1vity (IoT) Applica1ons

Trevor Yancey, Senior Analyst


Evolu1on of Internet

Source: Cisco.


Growth in 200mm Foundry Capacity Driven by IoT/IoE

•  Expansion of IoT/IoE means much greater use of MEMS sensors and actuators, as well as RF power devices and control logic chips

•  Most of these type devices fabricated on 200mm wafers; not going to 300mm any1me soon

•  Mature process technologies, repurposed equipment, fully depreciated fabs

Source: SEMI.


Connected Factory and Factory Automa1on

•  Assembly opera1ons with sensors to detect: Color, Rota1on, Speed, Tensil, Compression, Strain, Roughness, Warpage, Sound…

•  Op1miza1on of process flows and equipment u1liza1on to maximize efficiency and reduce costs

•  Increase in robo1cs for repe11ve tasks

Source: Cisco.


Things Sensors/Actuators

Data Acquisition and Control Systems

IT Infrastructure

System on Module

Torque Sensor

Motor Drives

Single-Board RIO

Wired or Wireless

Smart Tools Plant Node Server Desktop

Network & PLM

RGB Camera

RFID

Switches

RFID

CompactRIO Manipulator RFID

Motor Drives

PWM

Smart Glasses

Th

e

Ed

ge

100,000 30,000 2,000 60 sites

Embedded Vision: Factory-‐wide Online Monitoring and Control

•  Image sensor-‐based monitoring and control system

•  Machines and systems understand their environment through visual means

•  Beside this factory seZng, other examples are: –  Camera surveillance and face recogni4on –  Gesture interfaces for games and other consumer devices –  Augmented reality –  Smart headlamps and ADAS (Advanced Driver Assist Systems) –  And more

Source: National Instruments, Embedded Vision Alliance.


Preventa1ve Maintenance: Avoiding Unplanned Down1me

•  Huge produc1vity improvements can be achieved if problems and failures are iden1fied before they happen

•  In automo1ve manufacturing, “unplanned down1me costs $20K for every minute of down1me, or >$1M for every hour”

Acceptable Operating Zone

Operating Time

Machine Health Failure Predictive

Maintenance Preventative Maintenance

Source: National Instruments.


NTSB: Calls for Collision Avoidance Systems Standard in Cars

•  ~ 1.7M Rear-‐end crashes in the US/year resul1ng in ~500K injuries & ~1700 deaths

•  The addi1on of systems in all new cars and commercial trucks that automa1cally brake or warn drivers to avoid rear-‐end collisions could prevent or mi1gate more than 80% of them.

Source: Mercedes-Benz.


Automo1ve Driver Assistance/Autonomous Driving

•  Infineon’s CEO says –  Traffic fatali4es (1.3 million deaths per

year; 90% caused by human errors)

–  Less accidents, lower insurance rates –  Less traffic conges4on (U.S. commuters

spend 38 hours per year in traffic jams; cost of $121 billion/year)

–  Increased commuter produc4vity

–  Improved fuel efficiency (up to 50%)

•  Many safety features for automo1ve –  Sensor technology to collect and process

informa4on

–  Compu4ng for data analysis

•  FO-‐WLP, many are SiP, used for radar modules –  FO-‐WLP format (Freescale, Infineon, NXP)

•  SiP for other sensor modules

LRR Radar (77 GHz)

SRR Radar (24 / 79 GHz)

Sensor Technologies for Driver Assistance Systems

Source: Freescale.


Three Levels of Driver Assist and Car Automa1on

•  Increasing degree of automa1on means more sensors, sensor fusion, more compu1ng power and intelligence, and greater automo1ve network bandwidth needs

•  Par1al automa1on adds $100-‐150 of semiconductor content to exis1ng $330 in today’s cars; highly automated adds as much as $550

Source: Freescale.


Smartphones Control Connected Devices

•  Smartphones are central part of IoT/IoE –  Tool with diverse wireless connec4vity and sensors –  Pressure on package design and cost

•  Connec1ng with cars for safer driving –  Hands-‐ and eyes-‐free communica4on –  Naviga4on and traffic flow –  Driving pa_ern detec4on –  OBD data and alerts

•  Industrial and enterprise leveraging consumer technologies and vast smartphone installed base –  Real-‐4me process and produc4on monitoring –  System diagnos4cs and configura4on –  B2C interac4on in retail space

• Medical products using signal to smartphone for body monitoring

• Home security control and energy monitoring

Source: BMW.

Source: Siemens.

Source: Samsung.

Source: Numerex.


SiPs for IoT/IoE Applica1ons

•  Expansion of IoT/IoE means an increased number of sensors, but also more connec1vity, signal processing, and data storage

•  Primary device requirements are low power and low cost •  No single package format

–  Many applica4ons may adopt system-‐in-‐package (SiP) –  Many just SMT modules on FR-‐4 board, not counted as SiP

•  One main reason IoT/IoE is expanding rapidly is the low cost of sensors and mul1-‐die packages and modules

Product Application 2014~2016 PKG Roadmap

SMART Phone/

Tablet PC �Application Processor; �Baseband; �Connectivity �PMIC �PA

IoT & Wearable Devices �Connectivity �MCU �Memory �MEMS

Packaging Technology Roadmap(Focus on high growth products)

Available On+going Candidate

HBW PoP ePoP BD+PoP

FO?PoP Panel FO FO?MCM

Package on Package

Fan?Out WLP

3D?IC

SiP Module

EMI?SiP (partition shielding)

SiP (Stack Die on Passives) Antenna in SiP

2.5DIC LCI (Low Cost Interposer)

Si Interposer IC IC IC IC

2.5DIC NTI (No TSV Interposer)

Substrate

IC IC

Si Interposer

2.5DIC

Finger Print

Finger Print Module(LGA)

Memory

16S VTLGA FOD FOW

FOD FOW

38 Source: SPIL.


SiPs Commonly Found in Mobile Devices: Highest Volume

•  Power amplifier module (PA)

•  Front end module (FEM)

• RF module

•  Transceiver + RF frontend •  Some eSSDs (with controller, NAND memory, and power source)

•  Connec1vity modules •  Power management module • MEMS integra1on with ASIC (this could be stacked in a QFN)

•  3G/4G modem

Avago PA module includes FBAR

4.4 x 4.25 x 0.88 mm FLGA with 18 pads

9.8 x 7.5mm LGA with 58 pads

RF module typically contains filters, antennas, and switches (CMOS and/or GaAs/GaN)

Murata WiFi 802.11/ Bluetooth / FM Radio module


Renesas and LinkLabs radio module for M2M communica1on -‐  Renesas MCU -‐  Semtech long distance

radio transceiver

System-‐in-‐Package: Key to Connected Devices

Source: Samsung.

Freescale FXTH870s TPMS package 7 x 7 x 2.2 mm mul4-‐chip QFN -‐  8-‐bit MCU -‐  Pressure sensor -‐  Accelerometer -‐  RF transmi_er

Atmel ATA6614Q for In-‐Vehicle LIN networks 7 x 7 x 0.85 mm mul4-‐chip QFN -‐  LIN system-‐basis-‐chip with

LIN transceiver, voltage regulator, watchdog 4mer

-‐  AVR 8-‐bit automo4ve MCU

Samsung Ar1k module 12 x 12 module -‐  Contains dual-‐core AP,

Bluetooth LE chip, flash memory package, 9-‐axis mo4on sensor

-‐  All essen4al elements for connected gadgets

Source: LinkLabs.

Source: Freescale.

Source: Atmel.


FO-‐WLP as SiP

•  Smaller form factor, lower profile package: similar to conven1onal WLP in profile (can be ≤0.4 mm)

•  Support increased I/O density –  Fine L/S (10/10µm)

–  Roadmaps for <5/5µm L/S, future 2/2µm L/S

•  Split die package or mul1-‐die package/SiP

–  Mul4ple die in package possible

–  Die fabricated from different technology nodes can be assembled in a single package

–  Can integrate passives •  SiP applica1ons

–  Radar modules for automo4ve electronics

–  Connec4vity modules for smart home

Source: STATS ChipPAC.

Source: Freescale.


Routable QFN Including MIS •  Molded interconnect substrate (MIS) or coreless substrate packages

– Based on a modified leadframe technology – Leadframe is molded before die a_ach – Wire bond or Cu pillar flip chip interconnect – Mul4ple die possible – Baseband processors and connec4vity devices targe4ng this

•  Routable QFNs –  Routable package allows area under die to be used, provides easy saw singula4on, is strip testable, and can be used as a mul4-‐die solu4on

–  Many OSATs offering versions of routable QFNs today –  Mul4ple die possible

Source: Amkor Technology.

Bo_om View Cross sec4on view

Substrate

Mold

Die

Solder ball

Cu pillar


ASE’s Chip Last Process

• Uses low-‐cost coreless substrate – Fine pitch capable (15µm L/S, 12µm L/S in development) – Manufactured in double panel format – Assembled in strip format – Mul4-‐die and passives possible – Can be bo_om PoP

• Thin package (<375 µm)

• High current and thermal handling capabili1es – Due to thicker Cu (15-‐20 µm)

• Uses exis1ng FC infrastructure – Flip chip with Cu pillar mounted on coreless substrate

– Mass reflow and molded underfill

Source: ASE.

Mul4-‐Die Coreless “Chip Last” Package


Conclusions

•  IoT means increased connec1vity (radios everywhere) •  IoT means increased use of sensors (many types, many packages) •  Demand for lower cost solu1ons drives adop1on of new package designs –  No single format (Laminate substrate, FO-‐WLP, Leadframe package, etc.)

–  No “one size fits all” solu4on, but economics and business considera4ons will drive package adop4on

–  Package selec4on important: Can’t stretch the selected package op4on past its capability

•  MEMS sensors in mul1-‐die packages, but not considered SiP •  SiP is an enabler of many products for the trend in connec1vity

TechSearch Interna4onal, Inc. 4801 Spicewood Springs Road, Suite 150

Aus4n, Texas 78759 USA +1.512.372.8887

[email protected]


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