detailed ic packages

8/7/2019 DETAILED IC PACKAGES

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FUJITSU MICROELECTRONICS

IC PACKAGE

IC PACKAGE

For further information please contact:

North and South AmericaFUJITSU MICROELECTRONICS AMERICA, INC.1250 E. Arques Avenue, M/S 333Sunnyvale, CA 94085-5401, U.S.A.Tel: +1-408-737-5600 Fax: +1-408-737-5999http://www.fma.fujitsu.com/

Europe

FUJITSU MICROELECTRONICS EUROPE GmbHPittlerstrasse 47, 63225 Langen,GermanyTel: +49-6103-690-0 Fax: +49-6103-690-122http://emea.fujitsu.com/microelectronics/

KoreaFUJITSU MICROELECTRONICS KOREA LTD.206 KOSMO TOWER, 1002 Daechi-Dong,Kangnam-Gu,Seoul 135-280KoreaTel: +82-2-3484-7100 Fax: +82-2-3484-7111http://www.fmk.fujitsu.com/

Specifications are subject to change without notice. For further information please contact each office.

All Rights Reserved.The contents of this document are subject to change without notice.Customers are advised to consult with sales representatives before ordering.The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference toshow examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operationof the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must

assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoeverarising out of the use of the information.Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise ofany intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSUMICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information.FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which wouldresult from the use of information contained herein.The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation,ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) foruse accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly todeath, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, masstransport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersiblerepeater and artificial satellite).Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection withabove-mentioned uses of the products.Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safetydesign measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operatingconditions.Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the ForeignExchange and Foreign Trade Control Law of Japan and/or US export control laws.The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

2002-2008 FUJITSU MICROELECTRONICS LIMITED Printed in JapanAD81-00001-12Ea April, 2004Edited: Strategic Business Development Dept.

Asia PacificFUJITSU MICROELECTRONICS ASIA PTE LTD.151 Lorong Chuan, #05-08New Tech ParkSingapore 556741Tel : +65-6281-0770 Fax : +65-6281-0220http://www.fujitsu.com/sg/services/micro/semiconductor/

FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.Rm. 3102, Bund Center, No.222 Yan An Road (E),Shanghai 200002, ChinaTel : +86-21-6335-1560 Fax : +86-21-6335-1605http://cn.fujitsu.com/fmc

FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.10/F., World Commerce Centre, 11 Canton RoadTsimshatsui, KowloonHong KongTel : +852-2377-0226 Fax : +852-2376-3269http://cn.fujitsu.com/fmc/tw

FUJITSU MICROELECTRONICS LIMITEDShinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387http://jp.fujitsu.com/fml/en/


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Bottom View

Top View

Bottom View

Top View

LSI Chip Heat Spreader PC Board

Au wire Potting ResinSolder Ball

LSI Chip

ResinAu Wire

PC Board

Solder Ball

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CONTENTS

Technologies of the Future Available NowSupported by LSI technologies, the marketsfor personal computers, cellular telephones,mobile information terminals and otherelectronic equipment continue to experiencesharp demand growth. Continuing into thefuture, electronic equipment is expected tobecome thinner and more compact. LSIpackages allowing high-density mounting,such as chip size packages or chip scalepackages (CSPs) and ball grid arrays (BGAs),have been developed and become commonthroughout the market.

As packages grow ever more compact, Fujitsucontinues to lead the industry in CSPs bybeginning mass-production of SON packagesthat incorporate 16Mbit flash memories.Further efforts to achieve more compact, high-density mounting include the mass productionof FBGAs, CSOPs, MCPs and various stacked

MCPs. Fujitsu also mass-produces multipinpackages, chiefly PBGAs, EBGAs and LGAs.We continue to break new ground in the fieldof electronics, devoting tireless efforts to thedevelopment of packages for a wide variety ofapplications, including next-generation andcustom packages.sMultipin packagesQFP, PBGA, EBGA, E-BGA, TAB-BGA, FC-BGA, LGAsThin, compact packagesSSOP, TQFP, BCC, FBGA, CSOP, S-MCP,

Super CSPsPackages for card modulesTSOP, TQFPsPackages featuring high power dissipation

or for large chipsHQFP, PBGA, EBGA, TAB-BGA, FC-BGA, LGA

Package Lineup

Package Overview and Cross -section Structure

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Top View

Features

q Stacked MCP (Multi Chip Package) stacks 2 chips in one

package to correspond to increased capacities of memory.

qOne package can have the functions of two chips because

chips are stacked. Corresponds to high performance

systems and smaller mounting area.

ResinLSI Chip-2 Au Wire

LSI Chip-1

AdhesiveSolder Ball

Polyimide Tape

Stacked Multi Chip Package

S-MCP

Features

qHigh density mounting available

qSuperior electrical characteristics from multilayre structure

q Low thermal resistance, and superior cost performance to

ceramic PGA

Enhanced Ball Grid Array

EBGA

Features

q High cost performance by the sealing of plastic resin

q Excellent application to high pin count LSIs

Plastic Ball Grid Array

PBGA

Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES

7

5

3

4

8

8

9

10

11

11

19

9

12

12

13

13

14

14

15

15

16

16

17

17

PBGA

FBGA

HQFP

S-MCP

TAB-BGA

BCC

Flat type

Tape carrier

Dual lead

MCP

Quad lead

Dual lead

BGA

C-lead type

Matrix type

Bumped type

Surface mounted type

Dual lead

Quad lead

LGA

SOP

SSOP

TSOP

EBGA

FC-BGA

CSOP

CSOP

QFP

LQFP

TQFP

HQFP

CSOP

S-MCP

PBGA

TAB-BGA

FDH-BGA

FBGA

FC-BGA

LGA

FLGA

BCC

DTP

Super CSP

EBGAPackage

A typical package is introduced withpackage overview and a cross-sectional structure figure.


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Bottom View

Top View

Die Pad LSI ChipAu Wire

Outer LeadResin

Top View

Top View

Bottom View

Bottom View

Top View

Top View

Bottom View

5

Features

With the same packaging capabilities as those of SSOP,

this very small package provides space for COB

16-pin Bump chip carrier is about 40% smaller in packaging

area and about 70% smaller in packaging capacity than

conventional SSOP

This plated resin bump package introduces selective etching

technology to enable reductions in both size and cost

Bump chip carrier

BCC

Features

Chip-size package

High price -performance using TSOP packaging technology

Packaging strength and reliability equal to or better than

TOSP

Same packaging technology as TSOP

40% packaging density max. as compared to TOSP

C-lead Small Outline Package

CSOP

Features

Excellent thermal dissipation

The same size as current packages (adopting high standoff

configuration)

QFP with Heat Sink

HQFP-HS (current)

Features

Excellent mulit-pin as signment applicability

Excellent thiickness-reduction applicability

High thermal dissipation

Excellent narrow-pitch and size-reduction applicability

Chip size reduction using narrow PAD

TAB-Ball Grid Array

TAB-BGA

Features

Excellent ultra-multi-pin assignment and high-packaging

density applicability

Superior electrical characteristics from multilayer structure of

board with low dielectric constand and Low-resistivity wiring

Low thermal resistance due to heat dissipation from

back of chip

Flip chip-Ball Grid Array

FC-BGA

Features

Low-cost assembly using existing facilities

Fan-in and fan-out types

Fine pitch using Polymide (PI) tape

Fine pitch Ball Grid Array

Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES

4

LSI ChipHeat Spreader

Polyimide Tape Encapsulation Solder Ball

Stiffener

Bottom View

Top View

FBGA

Encapsulation

Thermal Compound

LSI Chip

Chip Capacitor

Glass Ceramic (thick-film)

Lid

Area Bump

Au WireLSI Chip

Resin

Die attach materialResin Bump

Adhesive Tape

Heat Spreader

Au Wire

Lead FrameResin

LSI ChipResin

Solder BallAdh esive L SI Ch ipPCB (2Layer)

Au Wire


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Surface mount device package

Surfacemountdevicepackage

Lead Pitch Pin CountNominal Dimensions

EIAJ TYPE

1.27mm(50mil)

600mil/VI

450mil/IV

375mil/III

300mil/II

44

28

16 24 28

8 14 16 20 24

80.80mm : 30-PIN1.00mm : 38-PIN1.27mm : 8-PIN

76

SOP(Small Outline L-leaded Package)


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CSOP(C-lead Small Outline Package)

1010

P in Cou nt 48

0.4

Body Size(mm)

Lead Pitch(mm)

P in Count 8 16 20 24 30 34

0.8 0.65 0.65 0.65 0.65 0.65

1.45 1.45 1.45 1.45 1.45 1.45

Lead Pitch(mm)

Mounting Height(mm)

Pi n Count 16 20 24

0.65 0.65 0.65

1.10 1.10

Lead Pitch(mm)

Mounting Height(mm)

1.101.20

81 8. 4 1 01 8.4 1 21 8.4 1 21 2. 4 1 41 8.4 1 212.4

P in Count 32 40 48 48 56 56

0.50 0.50 0.50 0.50 0.50 0.40

1.20 1.20 1.20 1.20 1.20 1.20

Body Size(mm)

Lead Pitch(mm)

Mounting Height(mm)

98

SSOP/TSSOP(ShrinkSmall Outline L-leaded Package)/(Thin Shrink Small Outline L-leaded Package)

TSOP TYPE I(Thin Small Outline L-leaded Package)


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1414 1616 2020 2424 2828 77 1010 1212 1414 1616 2020 2424 2828 1212 1414 77

P in Count 120 144 176 216 256 48 64 80 100 120 144 176 208 64 80 32

0.40 0.50 0.65 0.80

TQFP(Thin Quad Flat L-leaded Package)

Body Size(mm)

Lead Pitch(mm)

Body Size(mm)

1010 1212 1212 1414 1414

P in C oun t 64 80 100 100 120

0.50 0.50 0.40 0.50 0.40

1.20

Lead Pitch(mm)

Mounting Height(mm)

2828 3232 2020 2424 2828 3232 4040 1420 2828 1010 1212 1420 2828 1420

Pin Count 256 296 120 144 176 208 240 304 100 144 160 44 48 48

0.40 0.50 0.65 0.80 1.00

Body Size(mm)

Lead Pitch(mm)

80 64120

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QFP(Quad Flat-leaded Package)

LQFP(Low-profile Quad Flat L-leaded Package)


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PBGA (Over mold Type)(Plastic Ball Grid Array)

2727 3535 3535

B al l C oun t 256 352 420

1.27 1.27 1.27

35353 .1 4 0403 .1 3 5353 .1 4 0403 .1 4 0402 .9 4 5453 .1 4 0402 .9 4 0402.9

B al l C oun t 352 416 420 576 660 672 792 896

1.27 1.27 1.27 1.27 1.0 1.27 1.0 1.0

Body Size(mm)

Ball Pitch(mm)

Body Size(mm)

Ball Pitch(mm)

Stacked MCP(Stacked Multi Chip Package)

3.517 .0 5 3 .5 17 .0 5 3 .5 14 .7 0 3 .5 14.70

B al l C ou nt 48 48 48 48

Package Type BGA LGA BGA LGA

0.5 0.5 0.5 0.5

Body Size(mm)

Ball Pitch(mm)

77.21.2 791.2 991.4 991.34 8111.4 7121.2 7111.2 811.61.4 811.61.34 10.410.81.311121 .3 4 1 091.4 9101.4 9121.4

B al l C ou nt 56 59 61 65 69 71 71 73 73 85 101 103 107 115

Stack 2 2 2 2 2 2 2 2 2 3 2 4 3 4 3 4

0.80

Body Size(mm)

Ball Pitch(mm)

1312

Super CSP(Super Chip Size Package)

EBGA (Enhanced BGA)(Plastic Ball Grid Array)


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TAB-BGA(Tape Automated Bonding Ball Grid Array)

2727 2727 3535 3535 4040

B al l C ou nt 256* 264* 352 436 576*

1.27 1.0 1.27 1.0 1.27

Body Size(mm)

Ball Pitch(mm)

FC-BGA(Flip Chip Ball Grid Array)

42.542.54.6 45.045.04.6 47.547.54.6

B al l C ou nt 1681 1849 2116

1.00 1.00 1.00

Body Size(mm)

Ball Pitch(mm)

21211 .4 2 3231 .4 2 7271 .3 3 1311 .3 3 5351 .3 4 0401 .4 4 0401 .3 4 0401.3

B al l C ou nt 304 352 400 480 560 576 660 720

0.8 0.8 1.0 1.0 1.0 1.27 1.0 1.0

Body Size(mm)

Ball Pitch(mm)

681.2 681.2 691.2 891.2 714.51.2 891.2 7111 .2 1 0111.2 991.2 7111.2 8111.2 9121.2 8111.2 9.514.51.2

B al l C ou nt 48 48 48 48 52 60 63 63 64 80 80 80 84 96

Package Type FBGA PFBGA FBGA FBGA FBGA PFBGA FBGA FBGA PFBGA PFBGA PFBGA PFBGA PFBGA FBGA

0.80

Body Size(mm)

Ball Pitch(mm)

881 .1 3 1 0101.33 12121.3 14141.33

B al l C ou nt 112 144 224 272 144 176 240 304 360 368 480

Package Type PFBGA PFBGA PFBGA PFBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA

0.80 0.50

Body Size(mm)

Ball Pitch(mm)

42.542.54.7 45.045.54.7 47.547.54.7

B al l C ou nt 1089 1225 1369

1.27 1.27 1.27

Body Size(mm)

Ball Pitch(mm)

*: Under planning

1514

FDH-BGA(Face Down Heat spreader BGA)

FBGA/PFBGA(Fine-Pitch Ball Grid Array)/(Plastic Fine-Pitch Ball Grid Array)


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LGA(Land Grid Array)

42.50

L an d C ou nt 889

1.27

Body Size(mm)

Land Pitch(mm)

9.09 .0 4 .05 .5 7 .07 .0 5 .05 .0 7 .07 .0 7 .07.0 11.011.011.011.012.012.014.314.316.016.0

L an d C ou nt 80 20 64 64 80 120 144 176 208 224 288

0.8 0.65 0.65 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65

Body Size(mm)

Land Pitch(mm)

SLIM DTP(Slim Dual Tape-carrier Package)

Pi n count 44 233 255 463

0.8 0.1 0.16 0.06Lead Pitch

(mm)

3.44.550.8 4.24.550.83.43.60.83.43.60.64.04.00.85.05.00.87.07.00.89.09.00.87.07.00.57.07.00.88.08.00.59.09.00.810.010.00.8

P in Count 16 16 20 20 24 32 48 64 64 64 80 92 100

0.65 0.65 0.5 0.5 0.5 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65

Body Size(mm)

Lead Pitch(mm)

1716

FLGA(Fine pitch Land Grid Array)

BCC(Bump Chip Carrier)


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HQFP(QFP with Heat Sink)

Pi n count 160 208 240 256 304

Heat spreader

0.65 0.50 0.50 0.40 0.50

Heat SpreaderHeat SpreaderHeat Spreader Heat Spreader Heat Spreader

Lead Pitch(mm)

Low thermal resistance package

Lowt

hermalresistancepackage

1918

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