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Contech Research An Independent Test and Research Laboratory Test Laboratory DECEMBER 14, 2009 TEST REPORT #209527 QUALIFICATION TESTING PART NUMBERS SEAMP-40-02.0-L-06-TR SEAF-40-05.0-L-06-2-A-TR SAMTEC, INC. APPROVED BY: ALICE HATHAWAY PROJECT ENGINEER CONTECH RESEARCH, INC.

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Page 1: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

Contech Research An Independent Test and Research Laboratory

Test Laboratory

DECEMBER 14, 2009

TEST REPORT #209527

QUALIFICATION TESTING

PART NUMBERS

SEAMP-40-02.0-L-06-TR

SEAF-40-05.0-L-06-2-A-TR

SAMTEC, INC.

APPROVED BY: ALICE HATHAWAY

PROJECT ENGINEER

CONTECH RESEARCH, INC.

Page 2: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 2 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

REVISION HISTORY

DATE REV. NO. DESCRIPTION ENG.

12/14/2009

1.0

Initial Issue

APH

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TR#209527, REV.1.0 3 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

CERTIFICATION

This is to certify that the evaluation described herein was

designed and executed by personnel of Contech Research, Inc.

It was performed with the concurrence of Samtec, Inc. of New

Albany, IN who was the test sponsor.

All equipment and measuring instruments used during testing

were calibrated and traceable to NIST according to ISO 10012-1

and ANSI/NCSL Z540-1 and MIL-STD-45662 as applicable.

All data, raw and summarized, analysis and conclusions

presented herein are the property of the test sponsor. No copy

of this report, except in full, shall be forwarded to any

agency, customer, etc., without the written approval of the

test sponsor and Contech Research.

APPROVED BY: ALICE HATHAWAY

PROJECT ENGINEER

CONTECH RESEARCH, INC.

APH:cf

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TR#209527, REV.1.0 4 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

SCOPE

To perform Qualification testing on SEAMP connectors as

manufactured and submitted by the test sponsor Samtec, Inc.

APPLICABLE DOCUMENTS

1. Unless otherwise specified, the following documents of

issue in effect at the time of testing performed form a

part of this report to the extent as specified herein. The

requirements of sub-tier specifications and/or standards

apply only when specifically referenced in this report.

2. Samtec test plan: QualTC0932-2678REV1

3. Standard: EIA Publication 364

TEST SAMPLES AND PREPARATION

1. The following test samples were submitted by the test

sponsor, Samtec, Inc., for the evaluation to be performed

by Contech Research, Inc.

Part Numbers

a) SEAMP-40-02.0-L-06-TR

b) SEAF-40-05.0-L-06-2-A-TR

2. Test samples were supplied assembled and terminated to test

boards by the test sponsor.

3. The test samples were tested mounted to printed circuit

boards.

4 Test leads were attached to the appropriate measurement

areas of the test samples and applicable mating elements.

5. The test samples were tested in their ‘as received’

condition.

6. Unless otherwise specified in the test procedures used, no

further preparation was used.

7. The mated test samples were secured via a stabilizing medium

to maintain mechanical stability during testing.

Page 5: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 5 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

TEST SELECTION

1. See Test Plan Flow Diagram, Figure #1, for test sequences

used.

2. Test set ups and/or procedures which are standard or common

are not detailed or documented herein provided they are

certified as being performed in accordance with the

applicable (industry or military) test methods, standards

and/or drawings as specified in the detail specification.

SAMPLE CODING

1. All samples were coded. Mated test samples remained with

each other throughout the test group/sequences for which

they were designated. Coding was performed in a manner

which remained legible for the test duration.

2. The test samples were coded in the following manner:

Sequence A: Group A1 – A-A1-1, A-A1-2

Group A2 – A-A2-1, A-A2-2

Group B – A-B-1, A-B-2

Sequence B: Group A1 – B-A1-1 through B-A1-9 (Signal)

Sequence B: Group A2 – B-A2-1, B-A2-2 (Compliant Pin)

Sequence C: Group A1 – C-A1-1 through C-A1-9 (Signal)

Sequence C: Group A2 – C-A2-1, C-A2-2 (Compliant Pin)

Sequence D: Group A – D-A-1, D-A-2, D-A-3

Board Number

Group ID

Sequence

Page 6: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 6 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

FIGURE #1

TEST PLAN FLOW DIAGRAM

Part: SEAMP-40-02.0-L-06-TR

Mate: SEAF-40-05.0-L-06-2-A-TRSample Preparation

Solder Joint Inspection

IR-DWV

Thermal Shock

(100 hrs)

UNMATED

IR-DWV

Cyclic

Humidity

(240 hrs)

UNMATED

IR-DWV

DWV

UNMATED

Pin to Pin

Test to

Breakdown

voltage

Sequence a

Group A1

2 mated

pairs

Group B

2 pairs, mated

& unmated

Group A2

2 SEAMP

unmated

LLCR

Mechanical

Shock

LLCR

Random

Vibration

LLCR

Sequence c

Group A1

9 mated pairs

Sequence b

Compliant Pin

Resistance (CPR)

UNMATED

Thermal Shock

(100 hrs)

UNMATED

CPR

UNMATED

Cyclic

Humidity

240 hrs

UNMATED

CPR

UNMATED

Group A1

9 mated pairs

50 Nanosecond

Characterization

Mechanical

Shock

Random

Vibration

Sequence d

Group A1

3 mated

pairs

DWV

MATED

Pin to Pin

Test to

Breakdown

voltage

LLCR

Durability

100x

LLCR

Thermal Shock

(100 hrs)

MATED

LLCR

Cyclic

Humidity

240 hrs

MATED

LLCR

Group A2

2 SEAMP unmated

Compliant Pin

Resistance (CPR)

UNMATED

Mechanical

Shock

UNMATED

CPR

UNMATED

Random

Vibration

UNMATED

CPR

UNMATED

Group A2

2 SEAMP unmated

Page 7: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 7 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

DATA SUMMARY

TEST REQUIREMENTS RESULTS

SEQUENCE A

GROUP B

INSULATION RESISTANCE 5000 MEGOHMS MIN. >50,000 MEGOHMS

DWV 690 VAC PASSED

THERMAL SHOCK NO DAMAGE PASSED

INSULATION RESISTANCE 5000 MEGOHMS MIN. >50,000 MEGOHMS

DWV 690 VAC PASSED

CYCLIC HUMIDITY NO DAMAGE PASSED

INSULATION RESISTANCE 5000 MEGOHMS MIN. >50,000 MEGOHMS

DWV 690 VAC PASSED

SEQUENCE B

GROUP A1 - SIGNAL

LLCR SIGNAL RECORD 8.0 m MAX.

DURABILITY NO DAMAGE PASSED

LLCR SIGNAL <15.0 m MAX.CHG. +1.8 MAX.CHG.

THERMAL SHOCK NO DAMAGE PASSED

LLCR SIGNAL <15.0 m MAX.CHG. +2.9 m MAX.CHG.

CYCLIC HUMIDITY NO DAMAGE PASSED

LLCR SIGNAL <15.0 m MAX.CHG. +4.2 m MAX.CHG.

Group A2 - CPR

CPR RECORD 2.7 m MAX.

THERMAL SHOCK NO DAMAGE PASSED

CPR +1.0 m MAX.CHG. +0.3 m MAX.CHG.

CYCLIC HUMIDITY NO DAMAGE PASSED

CPR +1.0 m MAX.CHG. +0.5 m MAX.CHG.

-continued on next page.

Page 8: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 8 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

DATA SUMMARY-continued

TEST REQUIREMENTS RESULTS

SEQUENCE C

GROUP A1 - SIGNAL

LLCR SIGNAL RECORD +13.0 m MAX.

MECHANICAL SHOCK NO DAMAGE PASSED

LLCR SIGNAL <15.0 m MAX.CHG. +3.7 m MAX.CHG.

RANDOM VIBRATION NO DAMAGE PASSED

LLCR SIGNAL <15.0 m MAX.CHG. +3.5 m MAX.CHG.

Group A2 - CPR

CPR RECORD 3.7 m MAX.

MECHANICAL SHOCK NO DAMAGE PASSED

CPR +1.0 m MAX.CHG. +0.2 m MAX.CHG.

RANDOM VIBRATION NO DAMAGE PASSED

CPR +1.0 m MAX.CHG. +0.4 m MAX.CHG.

SEQUENCE D

GROUP A1 SIGNAL

MECHANICAL SHOCK NO DAMAGE PASSED

50 NANOSECOND PASSED

RANDOM VIBRATION NO DAMAGE PASSED

50 NANOSECOND PASSED

LLCR: Low Level Circuit Resistance

CPR: Compliant Pin Resistance

DWV: Dielectric Withstanding Voltage

IR: Insulation Resistance

Page 9: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 9 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

EQUIPMENT LIST

ID# Next Cal Last Cal Equipment Name Manufacturer Model # Serial # Accuracy Freq.Cal

33 Vib. Power Amp Ling Dynamics MPA4 149 N/A N/A

34 Shock Machine Avco SM110-3 1047 N/A Ea Test

86 Shaker Table MB Elect. C10E 141 N/A N/A

192 5/27/2010 5/27/2009 Vertical Thermal Shock Cincinnati Sub-Zero VTS-1-5-3 88-11094 See Cal Cert 12mon

244 9/24/2010 9/24/2009 Micro-Ohm Meter Keithley Instr. 580-1 467496 See Cal Cert 12mon

282 Vibration Shaker Table Ling Dynamics V-730 163 N/A N/A

321 3/19/2010 3/19/2009 AC-DC Hipot/Megometer Hipotronics Co. H300B DS16-201 See Cal Cert 12 mon.

323 Computer Legatech 286-12 N/A N/A N/A

340 X-Y Table NE Affiliated Tech. XY-6060 N/A N/A N/A

466 12/3/2010 12/3/2009 Precision Resistor Victoreen Co. 50,000 mego N/A ± 1 % 12 mon.

545 5/8/2010 5/8/2009 Event Detector Anatech 32/64 EHD 941206 See Cal Cert 12mon

553 3/13/2010 3/13/2009 12 channel Power Unit PCB Co. 483A 1303 See Cal Cert 12mon

570 12/31/2009 12/31/2008 PCB Power Supply Piezotronics Co. 482A 5260 See Manual 12mon

632 Bench Oven Blue M. Co. ESP 400C-5 ESP 282 N/A Ea Test

666 12/8/2010 12/8/2009 Digital Thermometer Omega Eng. DP116-KC2 7380236 ±1.1DegC 12mon

684 4/29/2010 4/29/2009 Accelerometer PCB. Co. 353B04 47648 See Cal Cert. 12mon

874 Computer M&P Vectra us75203327 N/A N/A

991 Sig Processor interface Agilent 35651B n/a N/A N/A

1010 Plotter Hewlett Packard 7225B 2160A2293 N/A N/A

1045 7/28/2010 7/28/2009 Microohm Meter Keithley 580 708216 See Cal Cert 12mon

1145 12/4/2010 12/4/2009 Digital Timer VWR 62379-036 99319122 ±.001% 12mon

1147 12/10/2010 12/10/2009 Digital O-Scope Tektronix 11801C B030915 See Cal Cert. 12mon.

1166 8/24/2010 8/24/2009 Sine/Rndm Vib Control

Digitizer

Hewlett Packard E1432A US39342279 See Cal Cert 12mon

1167 Interface Hewlett Packard E8491B US390100753 N/A N/A

1168 Mainframe Hewlett Packard E8408A US39000357 N/A N/A

1230 Temp-humid-Chamber Blue M. FRM-256B FRM277 See Manual Ea Test

1243 Computer ARC Co. P450 BU-001 N/A N/A

Page 10: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 10 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

EQUIPMENT LIST –continued

ID# Next Cal Last Cal Equipment Name Manufacturer Model # Serial # Accuracy Freq.Cal

1271 Amplifier Unholtz Dickie SA15 3483 N/A N/A

1272 Shaker Table Unholtz Dickie S202PB 263 N/A N/A

1315 1/21/2010 1/21/2009 Data Aquisition Multimeter Keithley Co. 2700 0862680 See CERT 12mon

1345 Drill Press Stand Milescraft 5000 N/A N/A N/A

1366 Main Frame Agilent H.P. 8408A N/A N/A

1367 Interface Agilent H.P. E8491A N/A N/A

1368 4/22/2010 4/22/2009 Sine/Rnd Control digitizer Agilent H.P. E1432A US35470169 See Manual 12mon

1438 Main Frame Hewlett Packard 35650 2911A00927 N/A Ea Test

1439 1/22/2010 1/22/2009 Programable DAC Unit Hewlett Packard 35656A 3244A00342 See Cal Cert 12 mo

1457 1/9/2010 1/9/2009 Precision Resistor Victorine 5KMOHM 465 See Cal Cert 12mon

1474 Vib Pwr Amp tira A58312 003/06 N/A N/A

1521 4/20/2010 4/20/2009 Accelerometer PCB 353B04 118492 See Cal Cert 12mon

1549 1/30/2010 1/30/23009 Multiplexer Card Keithley 7708 171629 See Cert 12mon

1550 1/21/2010 1/21/2009 Multiplexer Card Keithley 7708 171626 See Cert 12mon

1556 2/4/2010 2/4/2009 Accelerometer PCB 353B04 122769 See Cal Cert 12mon

1576 Computer DELL-E E N/A N/A N/A

1620 2/11/2010 2/11/2009 Accelerometer PCB 353B04 132590 See Cal Cert 12mon

1626 Antenna 10-50ns

Interference

Contech Research CR-A-050 01 N/A N/A

1633 9/11/2010 9/11/2009 Digitizing Scope Hewlett Packard 54200A 2511A00705 ±2% 12 mon

5045 12/10/2010 12/10/2009 TDR -Sampling Head Tektroniks SD-24 B0221502 See Cal Cert 12 mon

Page 11: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 11 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

TEST RESULTS

SEQUENCE A

GROUP B

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TR#209527, REV.1.0 12 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 2 Pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/22/09 COMPLETE DATE: 10/22/09

------------------------------------------------------------

ROOM AMBIENT: 22 C RELATIVE HUMIDITY: 41%

------------------------------------------------------------

EQUIPMENT ID#: 321, 466, 1145, 1457

------------------------------------------------------------

INSULATION RESISTANCE(IR)

PURPOSE:

To determine the resistance of insulation materials to leakage

of current through or on the surface of these materials when a

DC potential is applied.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 21.

2. Test Conditions:

a) Between Adjacent Contacts : Yes

b) Mated Condition : Mated and Unmated

c) Mounting Condition : Mounted

d) Test Voltage : 500 VDC

3. The test voltage was applied to specific test points on the

test board, mated and on unmated connectors.

------------------------------------------------------------

REQUIREMENTS:

When the specified test voltage is applied, the insulation

resistance shall not be less than 5,000 megohms.

------------------------------------------------------------

RESULTS:

The insulation resistance exceeded 5,000 megohms.

Page 13: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 13 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 2 Pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/23/09 COMPLETE DATE: 10/23/09

------------------------------------------------------------

ROOM AMBIENT: 22 C RELATIVE HUMIDITY: 38%

------------------------------------------------------------

EQUIPMENT ID#: 321, 466, 1145, 1457

------------------------------------------------------------

DIELECTRIC WITHSTANDING VOLTAGE (SEA LEVEL)

PURPOSE:

To determine if the mated connectors can operate at its rated

voltage and withstand momentary overpotentials due to

switching, surges and other similar phenomenon.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 20.

Test Conditions:

a) Between Adjacent Contacts : Yes

b) Mated Condition : Mated and Unmated

c) Mounting Condition : Mounted

d) Hold Time : 60 seconds

e) Rate of Application : 500 volts/sec.

f) Test Voltage : 75% of Breakdown voltage

g) Applied Voltage : 690 VAC (applied voltage)

2. Per the test sponsor’s request, the Dielectric Withstanding

Voltage (DWV) was determined by applying AC voltage to the

specified test points until breakdown. Seventy-five percent

(75%) of the breakdown voltage was used to perform all of

the DWV testing. The samples from Sequence a Groups A1 and

A2 were used to determine the breakdown voltage.

3. The test voltage was applied to specific test points on the

test board, mated and on unmated connectors.

------------------------------------------------------------

REQUIREMENTS: See Next Page

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TR#209527, REV.1.0 14 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

REQUIREMENTS:

When the specified test voltage is applied, there shall be no

evidence of breakdown, arcing, etc.

------------------------------------------------------------

RESULTS:

All test samples as tested met the requirements as specified.

Page 15: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 15 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 2 Pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/23/09 COMPLETE DATE: 10/27/09

------------------------------------------------------------

ROOM AMBIENT: 22 C RELATIVE HUMIDITY: 38%

------------------------------------------------------------

EQUIPMENT ID#: 192, 1315, 1549, 1550

------------------------------------------------------------

THERMAL SHOCK

PURPOSE:

To determine the resistance of a given electrical connector to

exposure at extremes of high and low temperatures and the shock

of alternate exposures to these extremes, simulating the worst

probable conditions of storage, transportation and application.

------------------------------------------------------------

PROCEDURE:

1. The test environment was performed in accordance with EIA

364, Test Procedure 32, with the following conditions.

2. Test Conditions:

a) Number of Cycles : 100 Cycles

b) Hot Extreme : +85°C +3 C/-0 C

c) Cold Extreme : -55°C +0 C/-3 C

d) Time at Temperature : 30 Minutes

e) Mating Conditions : Unmated

f) Mounting Conditions : Mounted

g) Transfer Time : < 5.0 minutes

3. The total number of cycles was performed continuously.

4. All subsequent variable testing was performed in accordance

with the procedures as previously indicated.

5. Variable measurements were taken within 1 hour of removal

from the chamber.

------------------------------------------------------------

REQUIREMENTS: See Next Page

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TR#209527, REV.1.0 16 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples as tested.

2. The insulation resistance shall not be less than

5,000 megohms.

3. When the specified test voltage is applied, there shall be

no evidence of breakdown, arcing, etc.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. The insulation resistance exceeded 5,000 megohms when taken

within 1 hour of removal from the chamber.

3. When the specified test voltage was applied, there was no

evidence of breakdown, arcing, etc.

Page 17: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 17 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 2 Pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/29/09 COMPLETE DATE: 11/09/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 40%

------------------------------------------------------------

EQUIPMENT ID#: 632, 666, 1230, 1315, 1549, 1550

------------------------------------------------------------

HUMIDITY (THERMAL CYCLING)

PURPOSE:

The purpose of this test is to permit evaluation of the

properties of materials used in connectors as they are

influenced or deteriorated by the effects of high humidity and

heat conditions. Measurements made under high humidity

conditions may reflect the peculiar conditions under which the

readings were made, and should be compared only to initial

readings when careful analysis indicates that such a comparison

is valid and applicable.

------------------------------------------------------------

PROCEDURE:

1. The test environment was performed in accordance with

EIA 364, Test Procedure 31, with the following conditions.

Test Conditions:

a) Preconditioning (24 hours) : 50 C ± 5 C

b) Relative Humidity : 90% to 95%

c) Temperature Conditions : 25 C to 65 C

d) Cold Cycle : No

e) Polarizing Voltage : No

f) Mating Conditions : Unmated

g) Mounting Conditions : Mounted

h) Duration : 240 hours

2. Variable measurements were taken within 1 hour of removal

from the chamber.

-continued on next page.

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TR#209527, REV.1.0 18 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROCEDURE: -continued

3. All subsequent variable testing was performed in accordance

with the procedures previously indicated.

------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical deterioration of

the test samples as tested.

2. The final insulation resistance shall not be less than

5,000 megohms.

3. When the specified test voltage is applied, there shall be

no evidence of breakdown, arcing, etc.

------------------------------------------------------------

RESULTS:

1. The test samples as tested showed no evidence of physical

deterioration.

2. The final insulation resistance exceeded 5,000 megohms when

taken within 1 hour of removal from the chamber.

3. When the specified test voltage was applied, there was no

evidence of breakdown, arcing, etc.

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TR#209527, REV.1.0 19 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

TEST RESULTS

SEQUENCE B

GROUP A1

GROUP A2

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TR#209527, REV.1.0 20 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/20/09 COMPLETE DATE: 10/20/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 35%

------------------------------------------------------------

EQUIPMENT ID#: 323, 1045

------------------------------------------------------------

LOW LEVEL CIRCUIT RESISTANCE (LLCR)

PURPOSE:

1. To evaluate contact resistance characteristics of the

contact systems under conditions were applied voltages and

currents do not alter the physical contact interface and

will detect oxides and films which degrade electrical

stability. It is also sensitive to and may detect the

presence of fretting corrosion induced by mechanical or

thermal environments as well as any significant loss of

contact pressure.

2. This attribute was monitored after each preconditioning

and/or test exposure in order to determine said stability

of the contact systems as they progress through the

applicable test sequences.

3. The electrical stability of the system is determined by

comparing the initial resistance value to that observed

after a given test exposure. The difference is the change

in resistance occurring whose magnitude establishes the

stability of the interface being evaluated.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 23 with the following conditions.

-continued next page.

Page 21: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 21 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROCEDURE:-continued

2. Test Conditions:

a) Test Current : 10 milliamps maximum

b) Open Circuit Voltage : 20 millivolts

c) No. of Positions Tested : 24 per test sample

------------------------------------------------------------

REQUIREMENTS:

Low level circuit resistance shall be measured and recorded.

------------------------------------------------------------

RESULTS:

1. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Sample ID# Avg. Max. Min.

B-A1-1 6.7 7.7 5.7

B-A1-2 5.8 6.4 5.2

B-A1-3 6.2 7.1 5.7

B-A1-4 5.8 6.9 5.1

B-A1-5 6.1 6.9 5.5

B-A1-6 6.0 6.8 5.3

B-A1-7 6.3 8.0 5.4

B-A1-8 5.8 7.0 5.1

B-A1-9 6.4 7.4 5.5

2. See data files 20952701 through 20952709 for individual

signal data points.

-continued on next page.

Page 22: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 22 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

RESULTS:-continued

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

COMPLIANT PIN

Sample ID# Avg. Max. Min.

B-A2-1 2.2 2.3 2.1

B-A2-2 2.4 2.7 2.2

3. See data files 20952710 and 20952711 for individual

compliant pin data points.

Page 23: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 23 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 9 Pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/21/09 COMPLETE DATE: 10/22/09

------------------------------------------------------------

ROOM AMBIENT: 21ºC RELATIVE HUMIDITY: 38%

------------------------------------------------------------

EQUIPMENT ID#: 340, 1345

------------------------------------------------------------

DURABILITY

PURPOSE:

1. This is a conditioning sequence which is used to induce the

type of wear on the contacting surfaces which may occur

under normal service conditions. The connectors are mated

and unmated a predetermined number of cycles. Upon

completion, the units being evaluated are exposed to the

environments as specified to assess any impact on

electrical stability resulting from wear or other wear

dependent phenomenon.

2. This type of conditioning sequence is also used to

mechanically stress the connector system as would normally

occur in actual service. This sequence in conjunction with

other tests is used to determine if a significant loss of

contact pressure occurs from said stresses which in turn,

may result in an unstable electrical condition to exist.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 09.

2. Test Conditions:

a) No. of Cycles : 100

b) Rate : 1.0 inch per minute

3. The plug side was assembled to special holding devices, the

receptacle side was attached to an X-Y table. Speed is

approximate.

-continued on next page.

Page 24: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 24 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROCEDURE:-continued

4. The test samples were axially aligned to accomplish the

mating and unmating function allowing for self-centering

movement.

5. Care was taken to prevent the mating faces of the test

samples from contacting each other.

6. All subsequent variable testing was performed in accordance

with the procedures previously indicated.

------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples so tested.

2. The change in low level circuit resistance shall be less

than +15.0 milliohms.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Avg. Max.

Sample ID# Change Change

B-A1-1 +0.1 +1.8

B-A1-2 +0.3 +1.1

B-A1-3 +0.5 +1.1

B-A1-4 +0.0 +1.0

B-A1-5 +0.5 +1.6

B-A1-6 +0.5 +1.3

B-A1-7 +0.3 +1.0

B-A1-8 +0.5 +1.3

B-A1-9 +0.2 +1.0

3. See data files 20952701 through 20952709 for individual

signal data points.

Page 25: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 25 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/23/09 COMPLETE DATE: 10/27/09

------------------------------------------------------------

ROOM AMBIENT: 22ºC RELATIVE HUMIDITY: 41%

------------------------------------------------------------

EQUIPMENT ID#: 192, 1315, 1549, 1550

------------------------------------------------------------

THERMAL SHOCK

PURPOSE:

To determine the resistance of a given electrical connector to

exposure at extremes of high and low temperatures and the shock

of alternate exposures to these extremes, simulating the worst

probable conditions of storage, transportation and application.

------------------------------------------------------------

PROCEDURE:

1. The test environment was performed in accordance with EIA

364, Test Procedure 32, with the following conditions.

2. Test Conditions:

a) Number of Cycles : 100 Cycles

b) Hot Extreme : +85°C +3°C/-0°C

c) Cold Extreme : -55°C +0°C/-3°C

d) Time at Temperature : 30 Minutes

e) Mating Conditions : Mated

f) Mounting Conditions : Mounted

g) Transfer Time : < 5.0 minutes

3. The total number of cycles was performed continuously.

4. All subsequent variable testing was performed in accordance

with the procedures as previously indicated.

5. Prior to performing variable measurements, the test samples

were allowed to recover to room ambient conditions.

------------------------------------------------------------

REQUIREMENTS: See Next Page

Page 26: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 26 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples as tested.

2. The change in low level circuit resistance shall be less

than +15.0 milliohms.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. The following is a summary of the observed data:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Avg. Max.

Sample ID# Change Change

B-A1-1 +0.2 +1.2

B-A1-2 +0.8 +2.0

B-A1-3 +0.8 +1.7

B-A1-4 +0.5 +1.9

B-A1-5 +0.2 +1.5

B-A1-6 +0.8 +1.8

B-A1-7 +0.6 +1.7

B-A1-8 +0.4 +1.0

B-A1-9 +0.7 +2.9

3. See data files 20952701 through 20952709 for individual

signal data points.

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(Milliohms)

COMPLIANT PIN

Avg. Max.

Sample ID# Change Change

B-A2-1 +0.1 +0.3

B-A2-2 +0.2 +0.3

4. See data files 20952710 and 20952711 for individual

compliant pin data points.

Page 27: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 27 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/29/09 COMPLETE DATE: 11/09/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 40%

------------------------------------------------------------

EQUIPMENT ID#: 632, 666, 1230, 1315, 1549, 1550

------------------------------------------------------------

HUMIDITY (THERMAL CYCLING)

PURPOSE:

The purpose of this test is to permit evaluation of the

properties of materials used in connectors as they are

influenced or deteriorated by the effects of high humidity and

heat conditions. Measurements made under high humidity

conditions may reflect the peculiar conditions under which the

readings were made, and should be compared only to initial

readings when careful analysis indicates that such a comparison

is valid and applicable.

------------------------------------------------------------

PROCEDURE:

1. The test environment was performed in accordance with

EIA 364, Test Procedure 31, with the following conditions.

2. Test Conditions:

a) Preconditioning (24 hours) : 50°C ± 5°C

b) Relative Humidity : 90% to 95%

c) Temperature Conditions : 25°C to 65°C

d) Cold Cycle : No

e) Polarizing Voltage : No

f) Mating Conditions : Mated

g) Mounting Conditions : Mounted

h) Duration : 240 hours

3. Prior to performing variable measurements, the test samples

were allowed to recover to room ambient conditions.

-continued on next page.

Page 28: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 28 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROCEDURE:-continued

4. All subsequent variable testing was performed in accordance

with the procedures previously indicated.

------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical deterioration of the

test samples as tested.

2. The change in low level circuit resistance shall be less

than +15.0 milliohms.

------------------------------------------------------------

RESULTS:

1. The test samples as tested showed no evidence of physical

deterioration.

2. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Avg. Max.

Sample ID# Change Change

B-A1-1 +0.0 +0.9

B-A1-2 +0.4 +1.1

B-A1-3 +0.9 +4.2

B-A1-4 +0.3 +1.7

B-A1-5 +0.3 +1.6

B-A1-6 +0.8 +3.4

B-A1-7 +0.7 +2.0

B-A1-8 +0.4 +1.3

B-A1-9 +0.8 +2.6

3. See data files 20952701 through 20952709 for individual

signal data points.

-continued on next page.

Page 29: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 29 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

RESULTS:-continued

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

COMPLIANT PIN

Avg. Max.

Sample ID# Change Change

B-A2-1 +0.1 +0.4

B-A2-2 +0.2 +0.5

4. See data files 20952710 and 20952711 for individual

compliant pin data points.

Page 30: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 30 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

LLCR DATA FILES

FILE NUMBERS

20952701

20952702

20952703

20952704

20952705

20952706

20952707

20952708

20952709

20952710

20952711

Page 31: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 31 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952701

Description: ID# B-A1-1

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 6.8 -0.5 0.3 -0.1

2 6.4 -0.4 0.0 0.0

3 5.8 0.2 0.3 0.4

4 5.8 0.8 0.3 0.3

5 6.6 -0.6 0.3 0.3

6 5.8 1.8 0.2 0.3

7 7.0 -0.8 0.2 0.1

8 6.2 0.6 0.0 -0.5

9 6.8 -0.9 0.5 0.3

10 5.7 1.5 0.3 0.6

11 7.6 -0.9 -0.3 -0.6

12 6.3 -0.6 0.4 -0.3

13 6.4 0.3 0.1 -0.5

14 7.0 -0.2 0.3 0.0

15 7.6 -1.1 -0.4 -0.5

16 6.3 0.1 0.7 0.2

17 6.6 1.1 -0.2 -0.3

18 7.7 -0.4 -0.4 -0.4

19 7.0 0.2 0.5 0.6

20 7.1 -0.5 0.4 0.0

21 6.4 0.8 -0.2 0.1

22 7.1 0.1 0.6 0.7

23 6.6 0.6 1.2 0.9

24 7.7 1.8 -1.2 -1.1

MAX 7.7 1.8 1.2 0.9

MIN 5.7 -1.1 -1.2 -1.1

AVG 6.7 0.1 0.2 0.0

STD 0.6 0.9 0.5 0.5

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

Page 32: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 32 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952702

Description: ID# B-A1-2

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 5.9 0.2 2.0 -0.1

2 5.8 -0.6 0.1 0.9

3 5.5 0.3 1.1 1.1

4 5.4 0.5 1.4 1.1

5 5.4 0.4 0.6 0.4

6 6.4 0.5 0.5 0.6

7 6.3 1.1 0.6 0.6

8 6.0 0.3 0.7 0.8

9 5.7 0.4 0.5 0.3

10 6.1 0.9 0.5 -0.8

11 6.3 0.8 0.4 0.3

12 5.8 0.6 1.3 0.5

13 5.9 0.5 0.7 0.7

14 5.6 0.4 0.6 0.1

15 5.7 0.5 0.8 0.2

16 6.1 0.5 0.3 0.5

17 6.0 -0.5 -0.1 -0.1

18 5.9 0.3 0.3 0.2

19 5.9 0.4 0.1 0.0

20 5.2 0.4 2.0 0.4

21 5.9 0.0 1.1 0.2

22 5.5 0.1 0.9 0.0

23 5.4 0.4 0.8 0.4

24 5.9 -0.1 1.3 0.1

MAX 6.4 1.1 2.0 1.1

MIN 5.2 -0.6 -0.1 -0.8

AVG 5.8 0.3 0.8 0.4

STD 0.3 0.4 0.5 0.4

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

Page 33: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 33 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952703

Description: ID# B-A1-3

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 7.1 0.6 1.1 0.4

2 6.1 1.1 0.8 1.1

3 5.7 1.0 1.2 1.6

4 6.2 1.1 1.3 0.9

5 5.9 0.5 1.1 1.1

6 5.8 1.0 1.1 1.3

7 6.5 0.7 0.8 1.3

8 6.6 0.8 1.1 0.5

9 6.5 0.0 0.4 0.4

10 6.1 0.9 0.4 0.2

11 6.4 0.8 1.7 1.2

12 5.8 0.4 0.4 0.2

13 5.9 0.2 0.7 0.2

14 5.8 0.7 0.8 0.3

15 5.9 0.5 1.4 0.8

16 6.0 0.0 0.0 0.0

17 6.2 -0.1 0.0 -0.2

18 6.3 0.4 1.4 1.1

19 5.9 0.1 0.7 0.3

20 6.7 0.3 1.1 1.8

21 6.4 0.1 -0.1 0.9

22 6.6 -0.2 0.4 4.2

23 6.5 0.7 0.8 1.2

24 6.6 0.0 0.3 0.1

MAX 7.1 1.1 1.7 4.2

MIN 5.7 -0.2 -0.1 -0.2

AVG 6.2 0.5 0.8 0.9

STD 0.4 0.4 0.5 0.9

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

Page 34: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 34 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952704

Description: ID# B-A1-4

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 5.5 0.3 0.6 0.5

2 5.8 0.4 0.3 0.7

3 5.1 0.2 0.5 0.7

4 5.9 0.0 0.4 0.6

5 5.9 -0.6 0.7 0.4

6 5.1 1.0 0.5 0.5

7 6.2 -0.6 0.6 0.4

8 6.2 -1.1 0.2 0.6

9 5.9 -0.3 0.3 0.1

10 6.9 -0.4 -0.7 -0.9

11 5.9 0.1 1.1 0.6

12 5.9 -0.6 0.6 0.4

13 5.8 0.1 0.1 0.0

14 5.8 0.1 0.6 0.1

15 5.5 0.1 1.0 0.5

16 5.4 0.0 0.7 0.7

17 6.3 -0.2 -0.2 -0.5

18 5.9 -0.3 1.3 0.9

19 5.4 -0.2 0.7 0.4

20 6.5 -0.3 -0.6 -1.0

21 5.4 0.0 1.9 1.7

22 5.5 0.6 0.3 0.3

23 5.4 -0.1 0.8 0.9

24 6.9 1.0 -0.6 -1.1

MAX 6.9 1.0 1.9 1.7

MIN 5.1 -1.1 -0.7 -1.1

AVG 5.8 0.0 0.5 0.3

STD 0.5 0.5 0.6 0.6

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

Page 35: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 35 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952705

Description: ID# B-A1-5

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 6.8 0.3 0.3 0.0

2 6.9 -0.9 -1.2 -1.0

3 5.8 -0.1 0.0 0.4

4 5.7 0.5 0.4 0.1

5 5.6 0.4 0.1 0.4

6 5.6 0.1 0.6 1.6

7 6.6 0.4 -0.4 0.0

8 6.2 0.0 0.6 0.2

9 6.4 0.0 -0.2 -0.3

10 5.5 0.6 0.9 0.1

11 6.0 0.2 -0.5 0.2

12 5.8 0.5 0.8 0.0

13 6.4 0.1 0.3 0.7

14 5.7 0.1 0.5 0.0

15 6.1 0.5 -0.3 0.0

16 6.3 1.1 1.5 0.8

17 5.9 0.6 0.4 -0.2

18 6.2 1.4 -0.3 0.2

19 5.5 0.8 1.2 0.9

20 6.8 1.6 -0.7 0.3

21 6.2 0.6 -0.2 0.5

22 6.1 0.9 0.1 0.2

23 5.8 1.1 0.5 1.2

24 6.1 0.7 -0.2 0.1

MAX 6.9 1.6 1.5 1.6

MIN 5.5 -0.9 -1.2 -1.0

AVG 6.1 0.5 0.2 0.3

STD 0.4 0.5 0.6 0.5

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

Page 36: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 36 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952706

Description: ID# B-A1-6

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 6.1 1.3 1.1 1.0

2 6.4 0.4 1.4 1.2

3 5.7 0.1 0.5 2.0

4 6.5 1.2 1.8 3.4

5 6.0 0.6 1.0 1.5

6 6.2 0.8 1.1 0.8

7 6.6 0.5 1.5 1.4

8 6.3 0.5 0.6 0.6

9 5.3 0.5 0.8 0.3

10 5.6 0.7 1.2 0.0

11 6.4 0.3 0.9 0.4

12 5.7 0.9 0.9 0.2

13 5.7 0.8 0.6 1.3

14 6.0 0.2 0.6 0.1

15 6.2 0.6 0.9 0.3

16 6.2 0.8 1.1 0.5

17 5.6 0.0 0.5 0.1

18 5.8 0.0 0.3 0.1

19 5.4 0.5 0.6 0.4

20 6.5 -0.9 -0.1 0.3

21 6.2 0.7 1.0 1.1

22 5.9 0.5 0.6 0.9

23 5.4 0.3 0.1 0.1

24 6.8 -0.2 1.0 0.1

MAX 6.8 1.3 1.8 3.4

MIN 5.3 -0.9 -0.1 0.0

AVG 6.0 0.5 0.8 0.8

STD 0.4 0.5 0.4 0.8

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

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TR#209527, REV.1.0 37 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952707

Description: ID# B-A1-7

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 6.5 0.0 0.2 0.4

2 5.7 0.2 0.3 0.5

3 5.7 0.3 0.7 0.4

4 5.9 0.4 0.5 0.3

5 5.9 0.6 1.0 1.0

6 5.9 0.5 0.8 0.7

7 8.0 -0.3 0.2 0.5

8 6.1 1.0 1.7 1.2

9 6.5 0.6 0.6 0.6

10 5.4 0.3 0.7 0.5

11 7.5 0.1 0.7 1.0

12 6.3 -0.2 0.3 0.3

13 5.5 0.3 0.6 0.6

14 5.6 0.6 0.5 0.4

15 6.2 0.2 0.6 0.8

16 6.8 -0.5 0.0 -0.1

17 6.0 0.2 1.0 0.8

18 6.3 0.5 0.9 1.2

19 5.6 0.2 0.5 0.5

20 6.4 0.6 0.7 1.1

21 6.4 0.4 0.4 0.4

22 6.7 0.3 0.4 1.9

23 6.8 0.3 0.6 2.0

24 6.7 0.2 0.6 0.4

MAX 8.0 1.0 1.7 2.0

MIN 5.4 -0.5 0.0 -0.1

AVG 6.3 0.3 0.6 0.7

STD 0.6 0.3 0.4 0.5

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

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TR#209527, REV.1.0 38 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952708

Description: ID# B-A1-8

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 5.8 0.0 0.0 0.2

2 5.8 0.7 0.0 -0.1

3 5.5 0.4 0.6 0.6

4 5.6 0.6 0.8 0.8

5 5.6 0.2 0.5 0.6

6 5.1 1.3 0.6 0.4

7 5.7 0.9 0.7 1.1

8 5.4 0.5 1.0 0.9

9 5.4 0.7 0.6 0.5

10 5.9 0.1 -0.1 -0.2

11 7.0 -0.7 0.7 -0.1

12 6.1 0.0 0.3 0.2

13 5.3 0.9 0.7 0.4

14 6.1 0.3 0.1 0.0

15 6.2 0.6 0.5 0.6

16 6.2 0.2 0.6 0.4

17 5.6 0.3 0.7 1.1

18 5.4 0.5 0.6 1.3

19 5.8 0.2 -0.1 0.2

20 5.6 0.7 0.4 0.6

21 5.8 0.6 0.8 0.8

22 5.6 0.9 0.8 0.9

23 5.7 0.2 0.9 0.5

24 7.0 1.3 -0.7 -1.2

MAX 7.0 1.3 1.0 1.3

MIN 5.1 -0.7 -0.7 -1.2

AVG 5.8 0.5 0.4 0.4

STD 0.5 0.4 0.4 0.5

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

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TR#209527, REV.1.0 39 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A1

Product: SEAMP/SEAF Connector File No: 20952709

Description: ID# B-A1-9

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 22 21 21

R.H. % 35 41 41 34

Date: 20Oct09 22Oct09 28Oct09 10Nov09

Pos. ID Initial Dura 100X T.Shock Hum

1 6.4 0.1 0.3 0.4

2 6.4 0.1 0.7 0.9

3 5.5 0.3 0.8 0.5

4 5.7 0.3 0.8 1.8

5 5.9 -0.2 0.4 1.1

6 6.2 0.4 0.7 1.1

7 7.4 1.0 0.6 0.7

8 5.6 0.8 0.8 1.2

9 5.9 0.3 0.0 0.9

10 5.9 0.1 0.4 1.4

11 6.4 -0.1 0.5 0.5

12 6.7 -0.2 0.2 0.2

13 5.8 0.4 1.7 0.4

14 5.8 0.7 0.4 0.7

15 7.2 -0.5 1.4 1.5

16 6.8 0.4 0.3 0.9

17 7.1 -0.1 0.4 0.1

18 6.2 0.1 1.0 0.7

19 5.9 -0.5 0.8 1.4

20 7.0 0.3 2.9 0.1

21 7.1 0.1 0.4 0.9

22 6.5 -0.2 0.3 0.3

23 6.2 -0.1 0.5 2.6

24 7.4 0.2 0.0 -0.1

MAX 7.4 1.0 2.9 2.6

MIN 5.5 -0.5 0.0 -0.1

AVG 6.4 0.2 0.7 0.8

STD 0.6 0.4 0.6 0.6

Open 0 0 0 0

Tech DAM DAM DAM DAM

Equip ID 323 323 323 323

1045 1045 1045 1045

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TR#209527, REV.1.0 40 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A2

Product: SEAMP/SEAF Connector File No: 20952710

Description: ID# B-A2-1

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 21 21

R.H. % 35 41 34

Date: 20Oct09 28Oct09 10Nov09

Pos. ID Initial T.Shock Hum

1 2.3 0.0 0.0

2 2.3 0.1 0.1

3 2.2 0.1 0.3

4 2.3 0.2 0.3

5 2.2 0.3 0.4

6 2.2 0.1 0.0

7 2.2 0.2 0.2

8 2.1 0.1 0.1

9 2.3 0.1 0.0

10 2.1 0.2 0.0

11 2.2 0.0 0.1

12 2.3 0.1 0.2

13 2.2 0.1 0.1

14 2.2 0.1 0.0

15 2.2 0.1 0.2

MAX 2.3 0.3 0.4

MIN 2.1 0.0 0.0

AVG 2.2 0.1 0.1

STD 0.1 0.1 0.1

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 41: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 41 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq B Gr A2

Product: SEAMP/SEAF Connector File No: 20952711

Description: ID# B-A2-2

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 21 21 21

R.H. % 38 41 34

Date: 21Oct09 28Oct09 10Nov09

Pos. ID Initial T.Shock Hum

1 2.3 0.0 0.2

2 2.5 0.2 0.2

3 2.4 0.1 0.2

4 2.4 0.0 0.1

5 2.4 0.0 0.0

6 2.4 0.2 0.3

7 2.4 0.2 0.1

8 2.2 0.3 0.5

9 2.7 0.0 0.0

10 2.3 0.3 0.3

11 2.6 0.2 0.2

12 2.6 0.3 0.4

13 2.3 0.3 0.3

14 2.3 0.1 0.1

15 2.5 0.2 0.2

MAX 2.7 0.3 0.5

MIN 2.2 0.0 0.0

AVG 2.4 0.2 0.2

STD 0.1 0.1 0.1

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

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TR#209527, REV.1.0 42 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

TEST RESULTS

SEQUENCE C

GROUP A1

GROUP A2

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TR#209527, REV.1.0 43 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See Page 4 PART DESCRIPTION: See Page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/27/09 COMPLETE DATE: 11/24/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 37%

------------------------------------------------------------

EQUIPMENT ID#: 244, 323, 1045, 1576

------------------------------------------------------------

LOW LEVEL CIRCUIT RESISTANCE (LLCR)

PURPOSE:

1. To evaluate contact resistance characteristics of the

contact systems under conditions were applied voltages and

currents do not alter the physical contact interface and

will detect oxides and films which degrade electrical

stability. It is also sensitive to and may detect the

presence of fretting corrosion induced by mechanical or

thermal environments as well as any significant loss of

contact pressure.

2. This attribute was monitored after each preconditioning

and/or test exposure in order to determine said stability

of the contact systems as they progress through the

applicable test sequences.

3. The electrical stability of the system is determined by

comparing the initial resistance value to that observed

after a given test exposure. The difference is the change

in resistance occurring whose magnitude establishes the

stability of the interface being evaluated.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 23 with the following conditions.

-continued on next page.

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TR#209527, REV.1.0 44 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROCEDURE: -continued

2. Test Conditions:

a) Test Current : 10 milliamps maximum

b) Open Circuit Voltage : 20 millivolts

c) No. of Positions Tested : 24 per test sample

------------------------------------------------------------

REQUIREMENTS:

Low level circuit resistance shall be measured and recorded.

------------------------------------------------------------

RESULTS:

1. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Sample ID# Avg. Max. Min.

C-A1-1 6.6 7.6 5.8

C-A1-2 6.4 8.1 5.7

C-A1-3 6.3 7.6 5.1

C-A1-4 6.9 8.5 5.6

C-A1-5 6.5 7.4 5.5

C-A1-6 7.7 13.0 6.3

C-A1-7 6.6 9.4 5.6

C-A1-8 5.9 6.7 5.3

C-A1-9 6.2 7.6 5.2

2. See data files 20952720 through 20952728 for individual

signal data points.

-continued on next page.

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TR#209527, REV.1.0 45 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

RESULTS: -continued

3. The following is a summary of the data observed:

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

COMPLIANT PIN

Sample ID# Avg. Max. Min.

C-A2-1 2.1 2.2 2.0

C-A2-2 2.6 3.7 2.2

4. See data files 20952729 and 20952730 for individual

compliant pin data points.

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TR#209527, REV.1.0 46 of 75 Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See page 4 PART DESCRIPTION: See page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 11/10/09 COMPLETE DATE: 11/11/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 40%

------------------------------------------------------------

EQUIPMENT ID#: 34, 570, 1010, 1521, 1633

------------------------------------------------------------

MECHANICAL SHOCK (SPECIFIED PULSE)

PURPOSE:

To determine the mechanical and electrical integrity

of connectors for use with electronic equipment subjected to

shocks such as those expected from handling, transportation,

etc.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance EIA 364, Test

Procedure 27.

2. Test Conditions:

a) Peak Value : 100 G

b) Duration : 6 Milliseconds

c) Wave Form : Half-Sine

d) Velocity : 12.3 Feet Per Second

e) No. of Shocks : 3 Shocks/Direction, 3 Axis (18 Total)

3. A stabilizing medium was used such that the mated test

samples did not separate during the test.

4. Figure #2 illustrates the test sample fixturing utilized

during the test.

5. All subsequent variable testing was performed in accordance

with the procedures previously indicated.

------------------------------------------------------------

REQUIREMENTS: See Next Page

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TR#209527, REV.1.0 47 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples as tested.

2. The change in low level circuit resistance shall be less

than +15.0 milliohms.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test samples

as tested.

2. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Avg. Max.

Sample ID# Change Change

C-A1-1 +0.2 +3.7

C-A1-2 +0.1 +0.9

C-A1-3 +1.0 +2.4

C-A1-4 +1.0 +2.3

C-A1-5 +0.6 +1.5

C-A1-6 +0.5 +2.7

C-A1-7 +0.3 +2.0

C-A1-8 +0.6 +1.5

C-A1-9 +0.4 +1.2

3. See data files 20952720 through 20952728 for individual

signal data points.

-continued on next page.

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TR#209527, REV.1.0 48 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

RESULTS:-continued

4. There was no evidence of physical damage to the test

samples as tested.

5. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

COMPLIANT PIN

Avg. Max.

Sample ID# Change Change

C-A2-1 +0.0 +0.2

C-A2-2 +0.0 +0.2

6. See data files 20952729 through 20952730 for individual

compliant pin data points.

7. The Mechanical Shock characteristics are shown in Figures #3

(Calibration Pulse) and #4 (Test Pulse). Each figure

displays the shock pulse contained within the upper and

lower limits as defined by the appropriate test

specification.

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TR#209527, REV.1.0 49 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

FIGURE #2

TYPICAL FIXTURING – MECHANICAL SHOCK

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TR#209527-1, REV.1.0 50 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

FIGURE #3

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TR#209527, REV.1.0 51 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

FIGURE #4

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TR#209527, REV.1.0 52 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See page 4 PART DESCRIPTION: See page 4

------------------------------------------------------------

SAMPLE SIZE: 9 prs plus 2 TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 11/12/09 COMPLETE DATE: 11/17/09

------------------------------------------------------------

ROOM AMBIENT: 20ºC RELATIVE HUMIDITY: 34%

------------------------------------------------------------

EQUIPMENT ID#: 33, 86, 282, 553, 684, 874, 991, 1166, 1167,

1168, 1169, 1243, 1271, 1272, 1366, 1367, 1368,

1438, 1439, 1474, 1556, 1620

------------------------------------------------------------

VIBRATION, RANDOM

PURPOSE:

1. To establish the mechanical integrity of the test samples

exposed to external mechanical stresses.

2. To determine if the contact system is susceptible to

fretting corrosion.

3. To determine if the electrical stability of the system has

degraded when exposed to a vibratory environment.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 28.

2. Test Conditions:

a) Power Spectral Density : 0.01 G2/Hz

b) G ’RMS’ : 7.56

c) Frequency : 50 to 2000 Hz

d) Duration : 2.0 hour per axis (3 axes total)

3. A stabilizing medium was used such that the mated test

samples did not separate during the test.

4. Figure #5 illustrates the test sample fixturing utilized

during the test.

-continued on next page.

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TR#209527, REV.1.0 53 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

PROCEDURE:-continued

5. All subsequent variable testing was performed in accordance

with procedures previously indicated.

------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples as tested.

2. The change in low level circuit resistance shall be less

than +15.0 milliohms.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

SIGNAL DATA

Avg. Max.

Sample ID# Change Change

C-A1-1 +0.1 +0.9

C-A1-2 -0.1 +0.7

C-A1-3 +0.6 +1.5

C-A1-4 +0.2 +2.3

C-A1-5 -0.1 +0.4

C-A1-6 -0.3 +0.9

C-A1-7 +0.4 +3.5

C-A1-8 -0.4 +0.1

C-A1-9 +0.4 +1.4

3. See data files 20952720 through 20952728 for individual

signal data points.

-continued on next page.

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TR#209527, REV.1.0 54 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

RESULTS:-continued

4. The following is a summary of the data observed:

CHANGE IN

LOW LEVEL CIRCUIT RESISTANCE

(milliohms)

COMPLIANT PIN

Avg. Max.

Sample ID# Change Change

C-A2-1 +0.0 +0.1

C-A2-2 +0.1 +0.4

5. See data files 20952729 and 20952730 for individual

compliant pin data points.

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TR#209527, REV.1.0 55 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

FIGURE #5

TYPICAL FIXTURING RANDOM VIBRATION

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TR#209527, REV.1.0 56 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

LLCR DATA FILES

FILE NUMBERS

20952720

20952721

20952722

20952723

20952724

20952725

20952726

20952727

20952728

20952729

20952730

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TR#209527, REV.1.0 57 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952720

Description: ID# C-A1-1

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 19

R.H. % 41 41 43

Date: 24Nov09 25Nov09 30Nov09

Pos. ID Initial M. Shock Vibe

1 7.1 0.6 0.0

2 6.3 0.1 0.1

3 6.4 0.2 -0.3

4 6.3 0.2 0.4

5 6.8 0.1 0.3

6 6.0 0.0 0.0

7 7.4 0.2 -0.3

8 6.4 0.1 0.7

9 6.0 0.0 0.3

10 6.5 0.1 0.4

11 7.2 -1.0 -0.4

12 6.5 0.4 0.3

13 6.2 0.0 0.0

14 7.5 -0.7 -0.6

15 7.1 0.3 -0.1

16 7.2 3.7 0.0

17 6.7 -0.2 -0.5

18 6.6 0.0 -0.1

19 6.2 0.1 -0.1

20 6.3 0.5 0.5

21 7.6 0.0 -0.2

22 6.2 0.3 0.9

23 6.5 0.4 0.3

24 5.8 0.2 0.3

MAX 7.6 3.7 0.9

MIN 5.8 -1.0 -0.6

AVG 6.6 0.2 0.1

STD 0.5 0.8 0.4

Open 0 0 0

Tech AJP AJP AJP

Equip ID 244 244 244

1576 1576 1576

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TR#209527, REV.1.0 58 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952721

Description: ID# C-A1-2

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 19

R.H. % 41 41 43

Date: 24Nov09 25Nov09 30Nov09

Pos. ID Initial M. Shock Vibe

1 6.9 0.3 0.3

2 6.3 0.4 0.7

3 6.1 0.7 -0.5

4 6.7 0.6 -0.9

5 5.7 0.0 0.6

6 6.6 -0.3 -0.5

7 6.9 0.0 0.0

8 5.9 0.9 -0.1

9 6.1 0.2 0.3

10 5.9 0.1 0.4

11 6.3 0.0 0.1

12 6.0 0.2 0.3

13 6.0 0.2 0.4

14 7.1 -0.5 0.1

15 6.6 0.7 0.3

16 6.3 0.6 -0.1

17 8.1 -1.5 -1.2

18 6.7 0.7 0.6

19 6.4 0.0 -2.1

20 6.9 0.2 0.1

21 6.4 -0.3 -0.2

22 5.7 0.2 -0.8

23 6.3 0.4 0.1

24 5.7 0.0 0.3

MAX 8.1 0.9 0.7

MIN 5.7 -1.5 -2.1

AVG 6.4 0.1 -0.1

STD 0.5 0.5 0.6

Open 0 0 0

Tech AJP AJP AJP

Equip ID 244 244 244

1576 1576 1576

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TR#209527, REV.1.0 59 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952722

Description: ID# C-A1-3

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 19

R.H. % 37 36 34

Date: 27Oct09 11Nov09 18Nov09

Pos. ID Initial M.Shock Vib

1 5.8 0.9 1.4

2 6.6 0.9 0.6

3 5.8 0.6 0.6

4 6.7 0.7 0.9

5 7.3 1.2 0.8

6 7.0 0.8 0.6

7 6.8 0.7 0.5

8 6.4 1.1 0.4

9 6.5 0.8 0.3

10 5.6 0.7 0.9

11 7.6 2.3 1.5

12 5.7 0.7 0.3

13 6.6 -0.3 0.6

14 6.0 2.4 0.5

15 7.1 1.0 -0.2

16 5.8 1.0 0.9

17 6.2 1.1 0.5

18 6.7 0.9 -0.2

19 6.0 1.0 0.6

20 5.7 1.5 1.0

21 5.1 0.7 0.7

22 5.8 1.0 0.2

23 5.3 0.7 0.1

24 6.2 2.0 0.2

MAX 7.6 2.4 1.5

MIN 5.1 -0.3 -0.2

AVG 6.3 1.0 0.6

STD 1 0.6 0.4

Open 0 0 0

Tech AJP DAM DAM

Equip ID 244 323 323

1576 1045 1045

Page 60: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 60 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952723

Description: ID# C-A1-4

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 40 36 45

Date: 29Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 6.1 2.3 0.2

2 7.6 1.2 -0.3

3 5.9 0.8 0.2

4 6.3 0.8 -0.4

5 8.5 2.0 0.8

6 5.6 1.1 -0.1

7 6.4 1.0 0.4

8 6.7 1.2 0.1

9 7.6 1.0 0.3

10 6.4 0.4 0.2

11 7.3 0.4 -0.7

12 7.1 1.3 -0.5

13 5.7 0.9 0.6

14 8.4 0.5 -0.2

15 6.4 0.5 0.1

16 5.9 0.5 0.0

17 7.0 0.2 0.3

18 7.7 0.9 0.9

19 6.9 1.6 0.1

20 6.9 0.4 2.3

21 6.3 1.1 1.4

22 6.6 1.9 -0.1

23 6.9 0.9 -0.5

24 8.5 0.9 -0.7

MAX 8.5 2.3 2.3

MIN 5.6 0.2 -0.7

AVG 6.9 1.0 0.2

STD 0.8 0.5 0.7

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 61: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 61 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952724

Description: ID# C-A1-5

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 37 36 45

Date: 27Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 7.0 1.4 -0.1

2 6.1 0.8 -0.1

3 5.5 0.7 0.3

4 6.1 0.5 0.2

5 6.2 0.2 0.0

6 5.7 0.3 -0.1

7 6.5 1.5 0.3

8 6.2 0.8 0.1

9 6.4 0.7 0.0

10 6.5 0.8 -0.2

11 7.1 -0.1 -0.7

12 6.6 0.7 -0.4

13 5.9 0.6 0.2

14 7.4 1.0 -0.2

15 7.1 -0.3 -0.9

16 5.8 0.5 -0.1

17 7.4 0.0 -1.2

18 7.2 0.0 -0.9

19 6.3 0.1 -0.2

20 6.8 0.5 0.1

21 6.4 0.6 0.1

22 6.0 0.6 0.3

23 6.3 1.4 0.4

24 6.8 0.7 -0.3

MAX 7.4 1.5 0.4

MIN 5.5 -0.3 -1.2

AVG 6.5 0.6 -0.1

STD 0.5 0.5 0.4

Open 0 0 0

Tech AJP DAM DAM

Equip ID 244 323 323

1576 1045 1045

Page 62: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 62 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952725

Description: ID# C-A1-6

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 19

R.H. % 41 41 43

Date: 24Nov09 25Nov09 30Nov09

Pos. ID Initial M. Shock Vibe

1 7.8 2.4 0.9

2 7.2 0.2 -0.1

3 6.5 0.1 -0.9

4 8.7 -0.2 -1.1

5 7.9 0.0 -0.6

6 7.4 1.4 -0.2

7 8.3 0.0 -1.3

8 6.5 0.7 0.2

9 6.5 0.0 -0.2

10 7.0 0.0 -0.5

11 9.5 0.3 -1.1

12 7.0 -0.2 -0.3

13 6.3 -0.1 -0.3

14 8.7 0.1 0.2

15 8.7 0.3 0.1

16 7.2 -0.2 -0.7

17 6.8 0.4 -0.5

18 9.8 0.5 -0.4

19 8.0 2.7 0.5

20 13.0 1.1 -1.1

21 6.7 0.1 -0.2

22 6.3 1.2 -0.2

23 6.5 0.1 0.3

24 7.1 0.4 -0.6

MAX 13.0 2.7 0.9

MIN 6.3 -0.2 -1.3

AVG 7.7 0.5 -0.3

STD 1.5 0.8 0.5

Open 0 0 0

Tech AJP AJP AJP

Equip ID 244 244 244

1576 1576 1576

Page 63: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 63 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952726

Description: ID# C-A1-7

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 19

R.H. % 41 41 43

Date: 24Nov09 25Nov09 30Nov09

Pos. ID Initial M. Shock Vibe

1 7.6 0.3 -0.4

2 6.2 0.1 0.2

3 6.2 -0.3 -0.8

4 6.4 0.0 1.3

5 5.9 -0.1 0.1

6 6.2 0.5 0.4

7 7.2 1.2 -0.1

8 6.7 0.2 0.0

9 5.7 0.1 0.2

10 5.6 0.1 0.2

11 7.9 -0.6 -0.9

12 6.4 -0.4 -0.5

13 5.6 -0.1 1.1

14 5.7 1.2 1.0

15 6.4 0.1 0.9

16 6.8 0.1 0.0

17 9.4 2.0 3.5

18 7.6 0.5 0.7

19 6.0 1.0 0.9

20 6.1 0.2 0.3

21 8.9 0.1 0.0

22 5.9 0.1 0.2

23 6.2 0.2 0.3

24 6.8 0.3 0.0

MAX 9.4 2.0 3.5

MIN 5.6 -0.6 -0.9

AVG 6.6 0.3 0.4

STD 1.0 0.6 0.9

Open 0 0 0

Tech AJP AJP AJP

Equip ID 244 244 244

1576 1576 1576

Page 64: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 64 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952727

Description: ID# C-A1-8

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 37 36 45

Date: 27Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 6.2 -0.1 -0.6

2 6.2 0.5 -0.5

3 5.5 0.2 -0.6

4 6.4 0.7 -0.8

5 5.5 0.5 -0.3

6 5.7 0.3 -0.5

7 5.8 0.6 -0.2

8 6.6 0.5 -0.8

9 5.6 1.1 0.0

10 5.4 0.4 -0.4

11 6.7 0.3 -0.7

12 6.0 0.6 -0.3

13 5.4 0.5 -0.2

14 6.0 0.6 -0.3

15 5.7 0.6 -0.5

16 6.0 0.7 -0.3

17 5.9 1.1 -0.2

18 5.8 0.6 -0.4

19 6.1 0.6 -0.5

20 6.2 0.7 0.1

21 5.3 0.8 0.0

22 5.4 0.7 -0.1

23 5.7 1.5 0.0

24 5.9 0.1 -0.6

MAX 6.7 1.5 0.1

MIN 5.3 -0.1 -0.8

AVG 5.9 0.6 -0.4

STD 0.4 0.3 0.3

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 65: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 65 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A1

Product: SEAMP/SEAF Connector File No: 20952728

Description: ID# C-A1-9

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 40 36 45

Date: 29Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 5.9 0.8 0.7

2 6.2 0.7 0.2

3 5.8 -0.2 -0.2

4 5.4 0.4 0.4

5 5.6 0.5 0.6

6 6.2 1.2 0.5

7 6.6 -0.4 -0.3

8 6.3 -0.3 -0.1

9 6.3 0.1 0.4

10 5.9 0.4 0.4

11 7.6 0.7 0.4

12 6.6 -0.3 -0.3

13 5.2 0.6 0.6

14 6.0 0.9 1.0

15 6.3 1.0 1.4

16 6.2 0.1 -0.1

17 6.6 0.3 0.2

18 6.9 1.1 0.7

19 6.1 0.7 0.7

20 6.2 0.4 0.5

21 5.8 0.5 1.2

22 6.6 0.1 0.1

23 5.4 0.4 0.0

24 7.1 -0.4 -0.3

MAX 7.6 1.2 1.4

MIN 5.2 -0.4 -0.3

AVG 6.2 0.4 0.4

STD 0.5 0.5 0.5

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 66: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 66 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A2

Product: SEAMP/SEAF Connector File No: 20952729

Description: ID# C-A2-1

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 40 36 45

Date: 29Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 2.1 0.1 0.1

2 2.0 -0.1 0.0

3 2.2 -0.1 -0.1

4 2.1 0.0 0.0

5 2.2 0.1 0.0

6 2.0 0.0 0.1

7 2.2 -0.1 -0.1

8 2.0 0.0 0.0

9 2.2 0.2 0.1

10 2.1 0.1 0.0

11 2.1 0.1 0.1

12 2.2 0.0 0.0

13 2.0 -0.1 0.1

14 2.0 0.1 0.1

15 2.1 0.0 0.0

MAX 2.2 0.2 0.1

MIN 2.0 -0.1 -0.1

AVG 2.1 0.0 0.0

STD 0.1 0.1 0.1

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 67: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 67 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

Low Level Circuit Resistance - Delta Values

Project: 209572 Tech: DAM

Customer: Samtec Subgroup: Seq C Gr A2

Product: SEAMP/SEAF Connector File No: 20952730

Description: ID# C-A2-2

Open circuit voltage: 20mv Current: 100ma

Units: milliohms

Temp ºC 20 20 20

R.H. % 40 36 45

Date: 29Oct09 11Nov09 17Nov09

Pos. ID Initial M.Shock Vib

1 2.5 0.2 0.3

2 3.7 0.1 0.4

3 2.4 0.1 0.1

4 2.7 0.1 0.2

5 3.1 0.1 0.0

6 2.3 0.0 -0.2

7 2.8 0.1 0.2

8 2.2 0.0 0.2

9 3.2 0.1 0.3

10 2.4 0.1 0.0

11 2.3 0.0 -0.1

12 2.4 0.1 0.1

13 2.5 -0.2 -0.3

14 2.9 -0.1 -0.1

15 2.2 0.0 0.2

MAX 3.7 0.2 0.4

MIN 2.2 -0.2 -0.3

AVG 2.6 0.0 0.1

STD 0.4 0.1 0.2

Open 0 0 0

Tech DAM DAM DAM

Equip ID 323 323 323

1045 1045 1045

Page 68: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 68 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

TEST RESULTS

SEQUENCE D

GROUP A1

Page 69: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 69 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See page 4 PART DESCRIPTION: See page 4

------------------------------------------------------------

SAMPLE SIZE: 3 pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/27/09 COMPLETE DATE: 10/30/09

------------------------------------------------------------

ROOM AMBIENT: 20 C RELATIVE HUMIDITY: 37%

------------------------------------------------------------

EQUIPMENT ID#: 553, 545, 1147, 1166, 1167, 1168, 1169, 1271,

1272, 1556, 1626, 5045R

------------------------------------------------------------

MECHANICAL SHOCK (SPECIFIED PULSE)

PURPOSE:

To determine the mechanical and electrical integrity

of connectors for use with electronic equipment subjected to

shocks such as those expected from handling, transportation,

etc.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 27, Test Condition C.

2. Test Conditions:

a) Peak Value : 100 G

b) Duration : 6 Milliseconds

c) Wave Form : Half Sine

d) Velocity : 12.3 feet Per Second

e) No. of Shocks : 3 Shocks/Direction, 3 Axes (18 Total)

3. Figure #6 illustrates the test sample fixturing utilized

during the test.

4. The samples were characterized to assure that the low

nanosecond event being monitored will trigger the detector.

5. After characterization, it was determined the samples could

be monitored for a 50 nanosecond event.

6. The low nanosecond monitoring was performed in accordance

with EIA 364, Test Procedure 87.

------------------------------------------------------------

REQUIREMENTS: See Next Page

Page 70: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 70 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

REQUIREMENTS:

1. There shall be no evidence of axial movement of the test

samples relative to each other.

2. There shall be no low nanosecond event detected greater

than 50 nanoseconds.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. There was no low nanosecond event detected greater than

50 nanoseconds.

3. The Mechanical Shock characteristics are shown in Figures

#7 (Calibration Pulse) and #8 (Test Pulse). Each figure

displays the shock pulse contained within the upper and

lower limits as defined by the appropriate test

specification.

Page 71: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 71 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

FIGURE #6

TYPICAL FIXTURING - SHOCK & RANDOM VIBRATION

Page 72: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 72 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

FIGURE #7

0.480 0.485 0.490 0.495 0.500 0.505 0.510 0.515 0.522

[s]

-40

-20

0

20

40

60

80

100

120

[g]

Channel 1Classical Shock

C:\VcpNT\Daten\Daten\m+p\209527 Samtec100G 6ms Halfsine RT_001.rcs

ACCELERATION (g)

LOWER LIMIT-----

ACTUAL PULSE-----

UPPER LIMIT------

Project:209527

100G's 6ms

Half-sine

Tech:DAM

Date:30Oct09

Cal 1

DURATION (Seconds)

Page 73: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 73 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

FIGURE #8

0.480 0.485 0.490 0.495 0.500 0.505 0.510 0.515 0.522

[s]

-40

-20

0

20

40

60

80

100

120

[g]

Channel 1Classical Shock

C:\VcpNT\Daten\Daten\m+p\209527 Samtec100G 6ms Halfsine RT_001.rcs

ACCELERATION (g)

LOWER LIMIT-----

ACTUAL PULSE-----

UPPER LIMIT------ Project:209527

100G's 6ms

Half-sine

Tech:DAM

Date:30Oct09

Actual

DURATION (Seconds)

Page 74: dave heading and bp1 - Samtec Microelectronicssuddendocs.samtec.com/testreports/209527_test_report_qua.pdf · Solder Joint Inspection IR-DWV Thermal Shock (100 hrs) UNMATED IR-DWV

TR#209527, REV.1.0 74 of 75

Contech Research An Independent Test and Research Laboratory

Test Laboratory

PROJECT NO.: 209527 SPECIFICATION: TC0932-2678REV1

------------------------------------------------------------

PART NO.: See page 4 PART DESCRIPTION: See page 4

------------------------------------------------------------

SAMPLE SIZE: 3 pairs TECHNICIAN: DAM

------------------------------------------------------------

START DATE: 10/27/09 COMPLETE DATE: 11/03/09

------------------------------------------------------------

ROOM AMBIENT: 20 C RELATIVE HUMIDITY: 37%

------------------------------------------------------------

EQUIPMENT ID#: 553, 545, 1147, 1166, 1167, 1168, 1169, 1271,

1272, 1556, 1626, 5045R

------------------------------------------------------------

VIBRATION, RANDOM

PURPOSE:

1. To determine if electrical discontinuities at the level

specified exist.

2. To determine if the contact system is susceptible to

fretting corrosion.

3. To determine if the electrical stability of the system has

degraded when exposed to a vibratory environment.

------------------------------------------------------------

PROCEDURE:

1. The test was performed in accordance with EIA 364, Test

Procedure 28, Test Condition V, Test Letter B.

2. Test Conditions:

a) Power Spectral Density : 0.01 G2/Hz

b) G ’RMS’ : 7.56

c) Frequency : 50 to 2000 Hz

d) Duration : 2.0 hours per axis

(3 axes total)

3. Figure #6 illustrates the test sample fixturing utilized

during the test.

4. Prior to testing, the connectors were characterized to

assure that the desired event being monitored was capable

of being detected.

-continued on next page.

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TR#209527, REV.1.0 75 of 75

Test Laboratory Contech Research An Independent Test and Research Laboratory

PROCEDURE:-continued

5. After characterization, it was determined the samples could

be monitored for a 50 nanosecond event.

6. The low nanosecond event detection was performed in

accordance with EIA 364, Test Procedure 87.

7. Due to the design of the PCB only the signal contacts were

monitored for the 50 nanosecond detection.

------------------------------------------------------------

REQUIREMENTS:

1. There shall be no evidence of physical damage to the test

samples as tested.

2. There shall be no events detected greater than

50 nanoseconds.

------------------------------------------------------------

RESULTS:

1. There was no evidence of physical damage to the test

samples as tested.

2. There was no evidence of low nanosecond events in excess of

50 nanoseconds.