data sheet - lattice semi

Package Diagrams

Data Sheet

FPGA-DS-02053-6.3

April 2021

Package Diagrams Data Sheet

© 2007-2021 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

2 FPGA-DS-02053-6.3

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FPGA-DS-02053-6.3 3

Contents 1. 16-Ball WLCSP Package Option 1: iCE40 LP .................................................................................................................. 6 2. 16-Ball WLCSP Package Option 2: iCE40 UltraLite™ ..................................................................................................... 7 3. 20-Pin (300-Mil) CERDIP Package ................................................................................................................................. 8 4. 20-Pin LCC Package ....................................................................................................................................................... 9 5. 20-Pin PLCC Package ................................................................................................................................................... 10 6. 20-Pin Plastic DIP Package .......................................................................................................................................... 11 7. 24-Pin (300-Mil) CERDIP ............................................................................................................................................. 12 8. 24-Pin Plastic DIP ........................................................................................................................................................ 13 9. 24-Pin QFNS Package .................................................................................................................................................. 14 10. 25-Ball WLCSP Package (0.40 mm Pitch) .................................................................................................................... 15 11. 25-Ball WLCSP Package (0.35 mm Pitch) .................................................................................................................... 16 12. 28-Pin LCC Package ..................................................................................................................................................... 17 13. 28-Pin PLCC Package ................................................................................................................................................... 18 14. 28-Pin Plastic DIP Package .......................................................................................................................................... 19 15. 28-Pin SSOP Package .................................................................................................................................................. 20 16. 30-Ball WLCSP Package ............................................................................................................................................... 21 17. 32-Pin QFN Package Option 1: Power Manager II, iCE40™ ........................................................................................ 22 18. 32-Pin QFN Package Option 2: MachXO2™ ................................................................................................................ 23 19. 32-Pin QFN Package Option 3: MachXO2 SG32C ........................................................................................................ 24 20. 36-Ball ucBGA Package ............................................................................................................................................... 25 21. 36-Ball ucfBGA Package: iCE40 Ultra™ ....................................................................................................................... 26 22. 36-Ball WLCSP Package Option 1: iCE40 Ultra ............................................................................................................ 27 23. 36-Ball WLCSP Package Option 2: MachXO2, MachXO3™ .......................................................................................... 28 24. 36-Ball WLCSP Package Option 3: CrossLink™ ............................................................................................................ 29 25. 44-Pin JLCC Package .................................................................................................................................................... 30 26. 44-Pin PLCC Package ................................................................................................................................................... 31 27. 44-Pin TQFP Package .................................................................................................................................................. 32 28. 44-Pin LQFP Package .................................................................................................................................................. 33 29. 48-Pin TQFP Package .................................................................................................................................................. 34 30. 48-Pin LQFP Package .................................................................................................................................................. 35 31. 48-Pin QFN Package: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2 ..................................................................... 36 32. 49-Ball caBGA Package ............................................................................................................................................... 37 33. 49-Ball ucBGA Package ............................................................................................................................................... 38 34. 49-Ball WLCSP Package ............................................................................................................................................... 39 35. 56-Ball csBGA Package ................................................................................................................................................ 40 36. 64-Ball csBGA Package ................................................................................................................................................ 41 37. 64-Pin QFNS Package .................................................................................................................................................. 42 38. 64-Ball ucBGA Package ............................................................................................................................................... 43 39. 64-Ball ucfBGA Package .............................................................................................................................................. 44 40. 64-Pin LQFP Package .................................................................................................................................................. 45 41. 68-Pin JLCC Package .................................................................................................................................................... 46 42. 68-Pin PLCC Package ................................................................................................................................................... 47 43. 72-Pin QFN Package Option 1: CrossLink™-NX ........................................................................................................... 48 44. 72-Pin QFN Package Option 2: MachXO3D ................................................................................................................. 49 45. 72-Pin WLCSP Package: CrossLink-NX ......................................................................................................................... 50 46. 80-Ball ctfBGA Package ............................................................................................................................................... 51 47. 80-Ball ckfBGA Package .............................................................................................................................................. 52 48. 81-Ball csBGA Package ................................................................................................................................................ 53 49. 81-Ball csfBGA Package .............................................................................................................................................. 54 50. 81-Ball ucBGA Package ............................................................................................................................................... 55 51. 81-Ball WLCSP Package ............................................................................................................................................... 56 52. 84-Pin CPGA Package .................................................................................................................................................. 57




4 FPGA-DS-02053-6.3

53. 84-Pin PLCC Package ................................................................................................................................................... 58 54. 84-Pin QFN Package .................................................................................................................................................... 59 55. 100-Ball caBGA Package ............................................................................................................................................. 60 56. 100-Ball csBGA Package .............................................................................................................................................. 61 57. 100-Ball fpBGA Package .............................................................................................................................................. 62 58. 100-Pin PQFP Package ................................................................................................................................................ 63 59. 100-Pin LQFP Package Option 1: MachXO2, MachXO™, ispMACH® 4000 .................................................................. 64 60. 100-Pin VQFP Package Option 2: iCE40 ...................................................................................................................... 65 61. 120-Pin PQFP Package ................................................................................................................................................ 66 62. 121-Ball caBGA Package (9 mm x 9 mm Body) ........................................................................................................... 67 63. 121-Ball csBGA Package .............................................................................................................................................. 68 64. 121-Ball csfBGA Package ............................................................................................................................................. 69 65. 121-Ball ucBGA Package ............................................................................................................................................. 70 66. 128-Pin PQFP Package ................................................................................................................................................ 71 67. 128-Pin LQFP Package ................................................................................................................................................. 72 68. 132-Ball csBGA Package Option 1: MachXO2, MachXO, LatticeXP2™ ........................................................................ 73 69. 132-Ball csBGA Package Option 2: iCE40 .................................................................................................................... 74 70. 132-Ball ucBGA Package ............................................................................................................................................. 75 71. 133-Pin CPGA Package ................................................................................................................................................ 76 72. 144-Ball csBGA Package .............................................................................................................................................. 77 73. 144-Ball fpBGA Package .............................................................................................................................................. 78 74. 144-Pin LQFP Package ................................................................................................................................................. 79 75. 160-Pin PQFP Package ................................................................................................................................................ 80 76. 176-Pin LQFP Package ................................................................................................................................................. 81 77. 184-Ball csBGA Package .............................................................................................................................................. 82 78. 196-Ball caBGA Package ............................................................................................................................................. 83 79. 196-Ball csBGA Package .............................................................................................................................................. 84 80. 208-Ball ftBGA Package .............................................................................................................................................. 85 81. 208-Ball fpBGA Package .............................................................................................................................................. 86 82. 208-Pin PQFP Package ................................................................................................................................................ 87 83. 225-Ball ucBGA Package ............................................................................................................................................. 88 84. 237-Ball ftBGA Package .............................................................................................................................................. 89 85. 256-Ball caBGA Package ............................................................................................................................................. 90 86. 256-Ball csfBGA Package ............................................................................................................................................. 91 87. 256-Ball ftBGA Package Option 1: ispMACH 4000, MachXO, LatticeXP2 ................................................................... 92 88. 256-Ball ftBGA Package Option 2: LatticeECP3™ ........................................................................................................ 93 89. 256-Ball ftBGA Package Option 3: MachXO2 .............................................................................................................. 94 90. 256-Ball fpBGA Package .............................................................................................................................................. 95 91. 256-Ball SBGA Package ............................................................................................................................................... 96 92. 272-Ball BGA Package ................................................................................................................................................. 97 93. 284-Ball csBGA Package .............................................................................................................................................. 98 94. 285-Ball csfBGA Package ............................................................................................................................................. 99 95. 289-Ball csBGA Package (9.5 mm x 9.5 mm Body) ................................................................................................... 100 96. 320-Ball SBGA Package ............................................................................................................................................. 101 97. 324-Ball caBGA Package ........................................................................................................................................... 102 98. 324-Ball csfBGA Package ........................................................................................................................................... 103 99. 324-Ball ftBGA Package ............................................................................................................................................ 104 100. 328-Ball csBGA Package ............................................................................................................................................ 105 101. 332-Ball caBGA Package ........................................................................................................................................... 106 102. 352-Ball SBGA Package ............................................................................................................................................. 107 103. 381-Ball caBGA Package ........................................................................................................................................... 108 104. 388-Ball BGA Package ............................................................................................................................................... 109 105. 388-Ball fpBGA Package ............................................................................................................................................ 110 106. 400-Ball caBGA Package ........................................................................................................................................... 111




FPGA-DS-02053-6.3 5

107. 416-Ball fpBGA Package ............................................................................................................................................ 112 108. 432-Ball SBGA Package ............................................................................................................................................. 113 109. 484-Ball caBGA Package (19 mm x 19 mm Body) ..................................................................................................... 114 110. 484-Ball fpBGA Package ............................................................................................................................................ 115 111. 484-Ball fcBGA Package: Mach™-NX ........................................................................................................................ 116 112. 516-Ball fpBGA Package ............................................................................................................................................ 117 113. 554-Ball caBGA Package ........................................................................................................................................... 118 114. 672-Ball fpBGA Package ............................................................................................................................................ 119 115. 676-Ball fpBGA Package ............................................................................................................................................ 120 116. 676-Ball fcBGA Package ............................................................................................................................................ 121 117. 680-Ball fpBGA Package ............................................................................................................................................ 122 118. 680-Ball fpSBGA Package .......................................................................................................................................... 123 119. 756-Ball caBGA Package ........................................................................................................................................... 124 120. 900-Ball fpBGA Package ............................................................................................................................................ 125 121. 1020-Ball Organic fcBGA Package ............................................................................................................................. 126 122. 1020-Ball Organic fcBGA Package Rev. 2 .................................................................................................................. 127 123. 1036-Ball ftSBGA Package......................................................................................................................................... 128 124. 1152-Ball Organic fcBGA Package Option 1: LatticeSC/SCM40 ................................................................................ 129 125. 1152-Ball Organic fcBGA Package Option 2: LatticeSC/SCM80 & SC/SCM115 ......................................................... 130 126. 1152-Ball Ceramic fcBGA Package ............................................................................................................................ 131 127. 1152-Ball fpBGA Package .......................................................................................................................................... 132 128. 1156-Ball fpBGA Package .......................................................................................................................................... 133 129. 1704-Ball Organic fcBGA Package ............................................................................................................................. 134 130. 1704-Ball Ceramic fcBGA Package ............................................................................................................................ 135 Appendix A. Package Archive ........................................................................................................................................... 136

32-Pin QFN (Punch Singulated) Package ....................................................................................................................... 136 Technical Support Assistance ........................................................................................................................................... 137 Revision History ................................................................................................................................................................ 138




FPGA-DS-02053-6.3 6

1. 16-Ball WLCSP Package Option 1: iCE40 LP Dimensions in Millimeters

Cccc

C1A

A

aaa(4X)

.015

.05 BMM

CC A

PIN #1 ID FIDUCIALLOCATED IN THIS AR EA

REF. Min. Nom. Max.

0.4130.122

0.188

0.452

0.152

0.218

0.491

0.182

0.248

1.40 BSC

1.48 BSC

1.05 BSC

1.05 BSC

0.35 BSC

0.03

0.03

0.175

0.215

4

AB

CD

3 .16 X bE

BA

D

ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M - 1994.

ALL DIMENSIONS ARE IN MILLIMETERS.

DIMENSION b IS MEASURES AT THE MAXIMUM BUMP DIAMETERPARALLEL TO PRIMARY DATUM C.

PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS.

BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THEPACKAGE BODY.

NOTES:

3

4

5

1.

2.

4 3 2 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW




FPGA-DS-02053-6.3 7

2. 16-Ball WLCSP Package Option 2: iCE40 UltraLite™ Dimensions in Millimeters

Cccc

C1A

A

aaa(4X)

eeeddd B

MM

CC A



DIMENSION b IS MEASURES AT THE MAXIMUM BUMP DIAMETER

PARALLEL TO PRIMARY DATUM C.


BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE

PACKAGE BODY.

NOTES:

3

4

5

1.

2.

TOP VIEW

BOTTOM VIEW

SIDE VIEW

sbe s

e

sbd D1

s

e

E1

163 b

A

B

C

D

4 3 2 1

5

D

BE

A

PIN #1 FIDUCIALLOCATED IN THIS AREA

REF. Min. Nom Max.A

A1bD

ED1E1es

sbDsbEaaacccdddeee

0.4130.1220.188

0.0670.067

0.4520.1520.218

1.409 BSC1.409 BSC

BSCBSCBSC

1.051.050.35

0.180

0.0710.071

0.0720.072

0.030.03

0.0500.015

4

0.491

0.1820.248




8 FPGA-DS-02053-6.3

3. 20-Pin (300-Mil) CERDIP Package Dimensions in Inches

.100 BSC

.300 REF

BASE METAL

INCHES

DIMENSIONS A, A1 AND L ARE MEASURED WITH THE5. 1E

ALLOWED LEAD TIP POSITION RANGE.

E3 IS TO BE MEASURED AT THE LEAD TIPS.

PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.

6.

7.NL

e

.125

E3

E2

.325

OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS

.060 INCHES FROM THE LEAD TIP.MEASUREMENTS TO BE TAKEN AT A MINIMUM OF

ALL DIMENSIONS ARE IN INCHES.

DIMENSIONING AND TOLERANCING PERANSI Y14.5M.

4.

3.

2.

1.1A

E

D

.308

.942

c1

c

.008

.008

b2

b1

.045

A2

b

X4 3b

B

A

LO

-MIN.

S

MY

(b)

3

.296.288

20

.200-

.410-

.045

.325

.970

-

.950

.012

.014-

-

.010

.065

.021

-

.018

.023

.175

-

-

- -

MAX..200

NOM.-

E2

LEAD FINISHWITH

E3

b2

M.010

b

C

BASE PLANE

SEATING PLANE

A1

Z Z

B

(c) c1

b1

A

e

4

D

L 7

A2

A

e/2

DETAIL A

E

N/2

N

1

4

E1

B

(DATUM A)

c

(DATUM B)

E

NOTES:

DETAIL ASECTION Z-Z

TOP VIEW

SIDE VIEW

.015

.140

.015

.015

.023

.280

b3

C A




FPGA-DS-02053-6.3 9

4. 20-Pin LCC Package Dimensions in Inches

OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN

D2

D4

D

L (19 PLACES)

FLATNESS TOLERANCE IS .004 INCHES PER INCH.

NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE.

DIMENSIONS D AND E MAY HA VE MATERIAL PROTRUSION


DIMENSIONING AND TOLERANCING PERANSI Y14.5.

3

4.

3.

2.

1.

3

E

B

(3 PLACES)

X 45

X 45

.030

.050

.020

.010

A

.075

.042

.270

.342

.270

.342

.022

.007

.054

.064

MIN.

E4

L1

L

e

A2

e

L1

A

E2

E

D4

D2

D

B

A2

A1

S

B

MY

L

O

.315

.095

.058

.050 BSC

(TYPICAL)

.200

.050

.030RADIUS

MAX.

.358

.315

.358

.028

.015

.200

.089

.074

INCHES

E2 E4

4

A1

NOTES:

TOP VIEW

BOTTOM VIEW

SIDE VIEW




10 FPGA-DS-02053-6.3

5. 20-Pin PLCC Package Dimensions in Inches

A-B //

.007 S H

.002 S

A-B S S D

.007 S A-B H S D S

A-B S .002

3 2 1

20

A-B .007 S H

.007 S H

S S D

D S A-B S

DIMENSION APPLIES TO BASE METAL ONLY

TOP POINT OF MEASUREMENT IS DATUM

MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE

DEFINED BY D3/E3

ALLOWABLE PROTRUSION IS .010 PER SIDE.

8

7 ; BOTTOM POINT OF -H-

LOCATED AT TOP OF MOLD PARTING LINE AND

TO BE MEASURED AT SEATING PLANE

EXIT PLASTIC BODY AT DATUM PLANE

DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.

COINCIDENT WITH TOP OF LEAD WHERE LEAD EXITS PLASTIC BODY

ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982

DATUMS

DATUM PLANE

6

5

4 AND A-B -D-

-H-

NOTES:

CONTACT POINT

TO BE DETERMINED WHERE CENTER LEADS

-C-

-H-

7

7

7

E E1 -D-

E3 E3

6

4

D

D1 6

-B- 4

4 -D-

0.05 0

D3

D3

-A-

D/E

(N-4PLACES)

D2/E2 D2/E2

-H- 3

A1

A

-C-

SEATING PLANE

-A-B-

-A-B-

-D-

5 5

.00 4 C

A A

A2

.02 0 (MIN)

PI N 1 ID ZONE

DETAIL "J"

SECTION A-A

.02 1

.01 3

8

.01 05

.00 75

.01 8

.01 3

.01 25

.00 75

8

ALL DIMENSIONS IN INCHES

H S .007 D S S A-B .03 2

.02 6

.007 M A-B C D S S

.02 1

.01 3

DETAIL "J" (TYP ALL SID ES)

SEATING PLANE .02 5 MIN.

.04 5 MIN.

3

1.

2.

-C-

L

E

N

E2 E3

E1

D

D2 D3

D1

A1 A2

A

S

Y

B M

O MAX. NOM. MIN.

20

.395 .390 .385

.353

.155

.075

.141

.350

.169

.356

.172

.105

-

.090

.062

.165

.120

.083

.180

.075

.169

.356

.395

.141

.350

.385

.155

.353

.390

BOTTOM VIEWTOP VIEW

SIDE VIEW




FPGA-DS-02053-6.3 11

6. 20-Pin Plastic DIP Package Dimensions in Inches

.000

.115

-

eCeB

L-

-

.130 47.0607.430

.150

OF LEAD , WHERE LEAD EXITS BODY11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010

8. N IS THE MAXIMUM NUMBER OF LEAD

2. DIMENSIONING AND TOLERANCING PER

3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR

THE PACKAGE SEATED IN JEDEC SEATING4. DIMENSIONS A, A1 & L ARE MEASURED WITH

DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

6. E AND eA MEASURED WITH THE LEADS CONSTRAINEDTO BE PERPENDICULAR TO DATUM -C-

7. eB AND eC ARE MEASURED AT THE LEAD TIPS

9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED

PROTRUSIONS SHALL NOT EXCEED .010INCLUDE DAMBAR PROTRUSIONS. DAMBAR

10. b2 MAXIMUM DIMENSION DOES NOTTO EASE INSERTION

WITH THE LEADS UNCONSTRAINED.

POSITIONS.

5. DIMENSIONS D, D1 AND E1

1. CONTROLLING DIMENSION: INCH.

PLANE GAUGE GS-3.

PROTRUSIONS TO BE .005 MINIMUM.

ANSI Y14.5M

c .008 .014.010

E .300

.240E1

eAe

.310

.100 BSC

.300 BSC

.250

.005

.008

.980

D1

c1D

-

.0101.030

.325

6

6.280 5

- 5

.0111.060 5

.115A 2

.014

.014

.045b1b

b2.018

.018

.060

MIN.

.015

-

1

LO

AA -

-NOM.

.195

10

.020

.022

.070

- 44

MAX..210

TE

N = 20

INCHESS

BM

Y

NO

eC

PLANEGAGE

PLANESEATING

.010

b

A1

10

b2

BASE PLANE

D Z

-A- 5

-C-

4x

CMD1

5

Le -H-

.015

A

Z

A2

4

c

N

N/2 1

E1 (c)

(b)

c1

5

-B-b1

BASE METAL

WITHLEA D FINISH

eB

7

6

eA

DE TAIL SEE

A

6

E

DETAIL ANOTES:

SECTION Z-Z

CL

CLTOP VIEW

SIDE VIEW

.130




12 FPGA-DS-02053-6.3

7. 24-Pin (300-Mil) CERDIP Dimensions in Inches

BASE METAL

.100 BSC

.300 REF

INCHES

DIMENSIONS A, A1 AND L ARE MEASURED WITH THE5. E2

ALLOWED LEAD TIP POSITION RANGE.

E3 IS TO BE MEASURED AT THE LEAD TIPS.

PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.

6.

7.NL

E3e

.325

OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.

DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS

.060 INCHES FROM THE LEAD TIP.

MEASUREMENTS TO BE TAKEN AT A MINIMUM OF


DIMENSIONING AND TOLERANCING PERANSI Y14.5M.

4.

3.

2.

1.1A

c

E1E

.280

.308Dc1

1.242.008

b2b1

.045

.015

A2b

.140

(b)

A

L

O

-MIN.

S

B

MY

3

.200-24

.410-

.014

.296

.325-.288

1.270.012

1.250.010

.065

.021

--

.018.023.175

--

MAX..200

NOM.

--

-

b

.010

BASE PLANE

SEATING PLANE

C

b2

A1

7L

(c)

CM Bb1

Z Z

LEAD FINISH

c1

WITH

4

D

e

A2

A

A

E

N/2

e/2N

B

E1

1

4

(DATUM A)

E2

c

(DATUM B)

E

E3

NOTES:

SECTION Z-Z

TOP VIEW

SIDE VIEW

A

.015

.015

.008

.125




FPGA-DS-02053-6.3 13

8. 24-Pin Plastic DIP Dimensions in Inches

.130eCL

eB---

.000

.115.060.150

.43077

OF LEAD , WHERE LEAD EXITS BODY11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010

8. N IS THE MAXIMUM NUMBER OF LEAD

2. DIMENSIONING AND TOLERANCING PER

3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR

THE PACKAGE SEATED IN JEDEC SEATING4. DIMENSIONS A, A1 & L ARE MEASURED WITH

DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

6. E AND eA MEASURED WITH THE LEADS CONSTRAINEDTO BE PERPENDICULAR TO DATUM -C-

7. eB AND eC ARE MEASURED AT THE LEAD TIPS

9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED

PROTRUSIONS SHALL NOT EXCEED .010INCLUDE DAMBAR PROTRUSIONS. DAMBAR

10. b2 MAXIMUM DIMENSIONS DOES NOTTO EASE INSERTION

WITH THE LEADS UNCONSTRAINED.

POSITIONS.

5. DIMENSIONS D, D1 AND E1

1. CONTROLLING DIMENSION: INCH.

PLANE GAUGE GS-3.

PROTRUSIONS TO BE .005 MINIMUM.

ANSI Y14.5M

.010c .008 .014

1.250

.300 BSC

.100 BSC

.310

.250E

E1e

eA

.300

.240

D1

c1D

-

.010.0081.230

.005.325

.280

6

65

-

.011

1.280 55

NOM.

.018

.060

.018

.130A2 .115

b1b2

b.014

.014

.045

LO

A1A

--

.015

MIN.

.195

.022

.020

.070 10

-.210MAX.

4

4

TE

INCHES

N = 24

B

Y

S

M

ON

eC

6

PLANEGAGE

eA

eB

c

E

PLANESEATING

.010

b

A110

b2

BASE PLANE

D Z

-A- 5

-C-

4xCM

D1

5

Le -H-

.015

A

Z

A24

N

N/2 1

E1 (c)

(b)

c1

5

-B-b1

BASE METAL

WITHLEAD FINISH

7

DETAILSEE

A

6

DETAIL ANOTES:

CSECTION Z-Z

CL

L

TOP VIEW

SIDE VIEW

-




14 FPGA-DS-02053-6.3

9. 24-Pin QFNS Package Dimensions in Millimeters




FPGA-DS-02053-6.3 15

10. 25-Ball WLCSP Package (0.40 mm Pitch) Dimensions in Millimeters

Notes:1 ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M - 1994.2 ALL DIMENSIONS ARE IN MILLIMETERS.3 DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER

PARALLEL TO PRIMARY DATUM C.4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BUMPS.

AA1bDE

D1E1eaaabbbcccdddeee

REF.

2.492 BSC2.546 BSC1.60 BSC1.60 BSC0.40 BSC0.0250.0600.0150.1500.050

0.6150.2300.280

0.5750.2000.250

0.5350.1700.220

PIN #1 ID FIDUCIAL

LOCATED IN THIS AREA

A

B

C

D

E

5 4 3 2 1

dd d

e e e

e

E 1

C

C

e

D 1

E B

D

C

A

aaa

2x

2x

aaa C

b25 X

TOP VIEW

BOTTOM VIEW

SIDE VIEW

A B

3

A

bbb C

ccc C

C 4A

1

Min. Nom. Max.




16 FPGA-DS-02053-6.3

11. 25-Ball WLCSP Package (0.35 mm Pitch) Dimensions in Millimeters

Cccc

C1A

A

aaa(4X)

.015

.05 BMM

CC A

BA

Notes:1 ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M - 1994.2 ALL DIMENSIONS ARE IN MILLIMETERS.3 DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER

PARALLEL TO PRIMARY DATUM C.4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BUMPS.5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE

PACKAGE BODY.

PIN #1 ID FIDUCIAL


25 X bE

D

D1e

s

e

s

E1

A

B

C

D

E

5 4 3 2 1

A

A1

b

D

E

D1

E1

e

aaa

ccc

s

REF.

1.71 BSC

1.71 BSC

1.40 BSC

1.40 BSC

0.35 BSC

0.03

0.03

0.015

0.491

0.182

0.248

0.452

0.152

0.218

0.413

0.122

0.188

BOTTOM VIEW

TOP VIEW

SIDE VIEW

5

4

3

Min. Nom. Max.




FPGA-DS-02053-6.3 17

12. 28-Pin LCC Package Dimensions in Inches

OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN

L (27 PLACES)

FLATNESS TOLERANCE IS .004 INCHES PER INCH.


DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION


DIMENSIONING AND TOLERANCING PER

4.

3

ANSI Y14.5.

3.

2.

1.

E

B

(3 PLACES)

X 45

X 45

.030

.050

.020

.010

A

.075

.042

.370

.440

.370

.440

.022

.007

.054.064

MIN.

E4

L1L

e

3

e

D

L1

A

A2

E2ED4D2DBA2A1

S

B

MY

L

O

.403

.095

.058.050 BSC

(TYPICAL)

.300

.050

.030RADIUS

MAX.

.460

.403

.460

.028

.015

.300

.089

.074

INCHES

4

E2

D2

D4

E4

A1

NOTES:

TOP VIEW

SIDE VIEW

BOTTOM VIEW




18 FPGA-DS-02053-6.3


A-B//

.00 7 S H

.00 2 S

A-B S SD

.007 S A-BH SS

A-B S.00 2

1 28

A-B.00 7 S H

.00 7 S H

SS D

DSA-B S

DIM ENSION APPLIES TO BASE META L ONLY

TOP POINT OF M EASUREMENT IS DA TUM

MEASUREMENT IS AT MA JOR FLAT AREA OF LOWER PLASTIC SURFACE

DEFINED BY D3/E3

ALLOW ABLE PROTRUS ION IS .010 PER SIDE.

8

7 ; BOTTOM POINT OF-H-


TO BE M EA SURED A T SEATING PL ANE

EXIT PLA STIC BODY AT DATUM PLANE

DIM ENSIONS D1 AND E1 DO NOT INCL UDE MOLD PROTRUSION.

COINCIDENT W ITH TOP OF LEAD W HERE L EAD EXITS PLA STIC BODY

ALL DIM ENSIONS AND TOLERA NCES CONFORM TO ANSI Y14.5M-1982

DATUMS

DATUM PLANE

6

5

4 ANDA-B -D-

-H-

NOTES:

CONTACT POINT

TO BE DETERMINED W HERE CENTER L EADS

-C-

-H-

7

7

7

E E1-D-

E3E3

6

4

D

D16

-B- 4

4-D-

D3

D3

-A-

D/E

D2/E2 D2/E2

-H- 3

A1A

-C-

SEATING PLANE

-A-B-

-A-B-

-D-

5 5

.004 C

A A

A2

.020(MIN)

PIN 1 ID ZONE

DETAIL "J"

SECTION A-A

.021

.013

8

.0105

.0075

.018

.013

.0125

.0075

8

ALL DIM ENSIONS IN INCHES

HS.00 7 D SSA-B.032

.026

.007 M A-BC DS S

.021

.013

DETAIL "J" (TYP ALL SIDES)

SEATING PLANE.025 MIN.

.045 MIN.

3

1.

2.

-C-

Y

E2

NE3

28

E1

D3E

.125

.191

.485

.450

.062

D2D1

A2D

.453

.205

.490

-

.090

MIN..165

A1A

O

B

M

L

.172

.105

NOM.

.219

.456

.083

.495

.180

.120

MAX.

S

.125

.219

.456

.495

.191

.450

.485

.205

.453

.490

0.050 (N-4PLACES)

BOTTOM VIEW TOP VIEW

SIDE VIEW

D




FPGA-DS-02053-6.3 19

14. 28-Pin Plastic DIP Package Dimensions in Inches

+0.010 M A

0.015 M A B C

1.300 BSC

INCHES

.100 BSC

.300 BSC

NOM.

1.365

NL

28

.110 .130

C

B

A

ee

e

.000--

-

1Ee

E.275 .285

.300 .310

B .014

C .008

D1D 1.345

2

1BB .030

.045

A1

2AA

.120 .135.015

-

-

OB

MY

MIN.-

L

.150

.430

.060

.295

.325

.022

.015

1.385

.045

.060

.180

.150-

MAX.

S

e

B1

B

4x

B2

A

A1

A2

-A-

SEATING PLANE

D1L

C

-B-

Be

D

eA

e

CLC

PER ANSI Y14.5M-1982

DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS

9 B1 AND B2 MAXIMUM DIMENSIONS DO NOT INCLUDE

6 E AND eA MEASURED WITH THE LEADS

CONSTRAINED TO BE PERPENDICULAR TO PLANE A

8 N IS THE NUMBER OF TERMINAL POSITIONS

WITH THE LEADS UNCONSTRAINED. eC MUST BE

7 eB AND eC ARE MEASURED AT THE LEAD TIPS

FLASH OR PROTRUSION. MOLD FLASH AND

5 D AND E1 DIMENSIONS DO NOT INCLUDE MOLD

PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3

4 DIMENSION A, A1, AND L ARE MEASURED WITH THE

3 ALL END LEADS IN THIS FAMILY ARE 1/2 LEADS

N

E SHALL NOT EXCEED 0.010

E

-C-N/2 1

PROTRUSION SHALL NOT EXCEED 0.010

ZERO OR GREATER

1

2 DIMENSIONING AND TOLERANCING

1 CONTROLLING DIMENSION: INCHES

NOTE:

TOP VIEW

SIDE VIEW

.018

.050

.040

.010




20 FPGA-DS-02053-6.3

15. 28-Pin SSOP Package Dimensions in Millimeters

0.55L 0.75

DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.

"D" & "E1" DO NOT INCLUDE MOLD FLASH ORPROTRUSIONS, BUT DO INCLUDE MOLD MISMATCHAND ARE MEASURED AT THE PARTING LINE.MOLD FLASH OR PROTRUSIONS SHALL NOT

TO BE DETERMINED AT THE SEATING PLANE

CONTROLLING DIMENSION: MILLIMETERS.

4.

EXCEED 0.20mm PER SIDE.

2.

3.

1.

0.090

R1

L1N

OC 4--

1.25 REF.28

DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MOREEXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN

THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD

THAN 0.07mm AT LEAST MATERIAL CONDITION.

BETWEEN 0.10 & 0.25mm FROM THE LEAD TIP

"N" IS THE NUMBER OF TERMINAL POSITIONS7.

6.

5.

8--

6

c

(b)

5

b1

c1

BASE METAL

10.50

DIMENSIONS

-B-

S COMMON

0.22b 0.30

7.40

5.009.90

0.090.09

E1e

E

D

c1

c1

10.20

0.65 BSC7.80

5.30

--

0.15

0.221.650.05

--MIN.

2Ab

A1

Y

O

L

A

B

M

1.75--

-

NOM.--

N

3

E1

3

D

3

-A-

SEATING PLANE

GAUGE PLANE

PARTING LINE

WITH LEAD FINISH

2 NX R R1

C

0.33

8.20

5.60

0.210.25

1.850.38

--

MAX.2.0 O

L

L1

4

A

A

0.25 BSC

DETAIL "A"

BM+ 0.20 C A S S

SEE

2A

0.10

S

PLANESEATING

Pin 1 Identifier

E

- C -

1A

A

e 5

0.15

b

+ M AC

C

B S

NOTES:

SECTION A-A

TOP VIEW

DETAIL 'A'

END VIEW

SIDE VIEW

2 1

0.95




FPGA-DS-02053-6.3 21

16. 30-Ball WLCSP Package Dimensions in Millimeters

E15 4 3 2 1

sD

D1

A

B

C

D

E

Fe

sE

eDEADBUG VIEW

3 30 b

dddeee

MM

C

C

A B

PIN #1 ID FIDUCIALLOCATED IN THIS AREA

5

aaa

(4x)

B

D

AE

LIVEBUG VIEW

A

4

ccc C

C SIDE VIEWA1

Notes:1. ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M – 1994.2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER PARALLEL TO PRIMARY DATUM C.

4. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS.

5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

REF. Min. Nom. Max.AA1bDED1E1e

sDsE

aaaccc

dddeee

0.6000.1400.230 0.260 0.290

2.537 BSCBSCBSCBSC

2.114

2.001.60

0.400.270.260.0300.0500.0150.050




22 FPGA-DS-02053-6.3

17. 32-Pin QFN Package Option 1: Power Manager II, iCE40™ Dimensions in Millimeters




FPGA-DS-02053-6.3 23

18. 32-Pin QFN Package Option 2: MachXO2™ Dimensions in Millimeters

5

4

3

SEATINGPLANE

0.15

C

PIN 1 ID AREA

3

1

N

DA

2X

(CORNER CHAMFER)

PIN #1 ID FIDUCIAL

B e

0.15

2X

C B 32

AC

D2

b 0.10 4 C M B

E

3

0.08 5C

A3A1

A

32X

L

0.45 TYP4X

E2

1

APPLIES TO EXPOSED PORTION OF TERMINALS.

DIMENSIONS AND TOLERANCES

EXACT SHAPE AND SIZE OF THIS

DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP.

NOTES: UNLESS OTHERWISE SPECIFIED

ALL DIMENSIONS ARE IN MILLIMETERS.2.

1.

FEATURE IS OPTIONAL.

PER ANSI Y14.5M.

SYMBOL

A

A1

A3

D

D2

E

E2

b

e

L

NOM. MAX.MIN.

0.00

3.10

0.20

0.55

0.02

3.20

0.25

0.60

0.05

3.30

0.30

0.35 0.40 0.45

0.50

0.2 REF

5.0 BSC

5.0 BSC

3.10 3.20 3.30

0.50 BSC

SIDE VIEW

TOP VIEW

BOTTOM VIEW

VIEW AVIEW A

A




24 FPGA-DS-02053-6.3

19. 32-Pin QFN Package Option 3: MachXO2 SG32C Dimensions in Millimeters

2x0.15 C A

A

N

D

2x0.15 C A

13

PIN 1 ID AREA

D2

L

32X32

PIN #1 ID FIDUCIAL(CORNER CHAMFER)

3

1

E2

eb 4

0.45 TYP4X

BOTTOM VIEW

0.10 M C A B0.05 M C

VIEW A

A

A1A3

0.08 C 5

E

B

TOP VIEW

VIEW A

SIDE VIEW

C

SEATINGPLANE


1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL.

4. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP.

5. APPLIES TO EXPOSED PORTION OF TERMINALS.

6. JEDEC REFERENCE MO-248 AND DR-4.2.

SYMBOL MIN. NOM. MAX.

A

A1

A3

D

D2

E

E2

b

e

L

0.50

0.00

0.02 REF

5.0 BSC

3.40

3.40

0.18

0.35

0.55

0.02

3.50

5.0 BSC

3.50

0.25

0.50 BSC

0.40

0.65

0.05

3.60

3.60

0.30

0.45




FPGA-DS-02053-6.3 25

20. 36-Ball ucBGA Package Dimensions in Millimeters

C4 ddd

bbb C

C

1A

A 2A


BILATERAL TOLERANCE ZONE IS APPLIED

PLANE ARE DEFINED BY THE SPHERICAL

EXACT SHAPE AND SIZE OF THIS FEATURE

DIMENSION "b" IS MEASURED AT THE

TO EACH SIDE OF THE PACKAGE BODY.

PRIMARY DATUM C AND SEATING

IS OPTIONAL.

CROWNS OF THE SOLDER BALLS.4

5

6

PER ANSI Y14.5M.



PARALLEL TO PRIMARY DATUM CMAXIMUM SOLDER BALL DIAMETER,

2.

1.

3

0.20 0.25 03.0b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

- 0.10

0.10

0.10

NOM.

0.20 BSC

2.00 BSC

2.50 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.10

MAX.

1.00

0.90

----

6

--

b

.05

.153

BMM

CC A

e

S

N

S

e

M

aaa

4X 6

D

E

B

A

5(4X)

PIN #1 ID FIDUCIAL LOCATED IN THIS AREA


SIDE VIEW




26 FPGA-DS-02053-6.3

21. 36-Ball ucfBGA Package: iCE40 Ultra™ Dimensions in Millimeters








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

BOTTOM VIEW

TOP VIEW

SIDE VIEW

C

b

.05

.153

BMM

CC A

4 ddd

e

S

N

S

e

M

0.20 0.25 03.0b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

0.20 BSC

2.00 BSC

2.50 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.12

bbb C

C

MAX.

0.91

0.70

1A

aaa

4X 6

D

E

A2 A

B

A

5(4X)

- -

--

6

0.81-

6 5 4 3 2 1

A

B

C

D

E

F

0.10





FPGA-DS-02053-6.3 27

22. 36-Ball WLCSP Package Option 1: iCE40 Ultra Dimensions in Millimeters

Cccc

C1A

A

eeeddd B

MM

CC A

REF. Min. Nom. Max.

0.4130.122

0.188

0.452

0.152

0.218

0.491

0.182

0.248

2.078 BSC

2.078 BSC

1.75 BSC

1.75 BSC

0.35 BSC

0.164

0.055

0.030



DIMENSION b IS MEASURES AT THE MAXIMUM BUMP DIAMETERPARALLEL TO PRIMARY DATUM C.



NOTES:

3

4

5

1.

2.

0.157 0.172

0.0550.051 0.056

0.051 0.056

0.030

0.050

0.015

SIDE VIEW

TOP VIEWBOTTOM VIEW

sbE

sbD

s

e

D1

6 5 4 3 2 1A

B

C

D

E

F

s

e

E1

3 36 b


5 (4X)

aaa

D

BE

A

4




28 FPGA-DS-02053-6.3

23. 36-Ball WLCSP Package Option 2: MachXO2, MachXO3™ Dimensions in Millimeters

Cccc

bbb C

C 1A

A

REF. Min. Nom. Max.

0.5100.167

0.239

0.543

0.196

0.266

0.576

0.225

0.319

2.487 BSC

2.541 BSC

2.00 BSC

2.00 BSC

0.40 BSC

0.244

0.060



DIMENSION b IS MEASURES AT THE MAXIMUM BUMP DIAMETERPARALLEL TO PRIMARY DATUM

PRIMARY DATUM AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS.

NOTES:

3

4

1.

2.

- -

0.271- -

0.030

0.025

0.0150

0.050

SIDE VIEW

TOP VIEWBOTTOM VIEW

sD

e

D1

e

sEE1

6 5 4 3 2 1

A

B

C

D

E

F

3 36 b

ddd M C A B

eee C

PIN #1 ID FIDUCIALLOCATED IN THIS AREA A

D

aaa C2x

BE

aaa C

2x

4

C.

C.




FPGA-DS-02053-6.3 29

24. 36-Ball WLCSP Package Option 3: CrossLink™ Dimensions in Millimeters

REF. Min. Nom. Max.

0.113

0.188 0.218

0.600

0.248

2.535 BSC

2.583 BSC

2.00 BSC

2.00 BSC

0.40 BSC

0.030

0.015



DIMENSION b IS MEASURES AT THE MAXIMUM BUMP DIAMETER




NOTES:

3

4

1.

2.

0.050

0.0505

-

-

-

-

SIDE VIEW

TOP VIEWBOTTOM VIEW

e

D1

e

E1

3 36 b

dddeee

M

MC

C

A B


5 (4X)

aaa

D

BE

A

A

A1C

Cccc

4

6 5 4 3 2 1

A

B

C

D

E

F




30 FPGA-DS-02053-6.3

25. 44-Pin JLCC Package Dimensions in Inches

CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.

DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.

3.

.050


-A-

.004

PLANE

SEATING

2.

1.

E4

D4

DETAIL A

D

D1

D2

E2

SECTION B-B

N

R

Q

L2

L1

L

.020 MIN.

A1

LO

BM

Y

D4/E4

A

B1

C

B

A

D2/E2

D1/E1

D/E

C1

C

B2

B1

B

A1

S

-

-

-

-

-

-

-

-

-

44

.040.020

.003

.025

.020

.005

-

-

-

-

-

-

-

.500 BSC

.660.620

.690

.013.007

.065 REF

C1

WITHLEAD FINISH

BASE METAL

MAX.

.700

.010

.035

.020

.023

.630 BSC

.675

.007

.022

.013

.013

.115 .190

MIN.

INCHES

(N PLACES)

DETAIL AE1 E

M.011

B2

B

R

L2

L1

Q

A

L

C

B

B

NOTES:

BOTTOM VIEW

SIDE VIEW




FPGA-DS-02053-6.3 31


A-B //

.00 7 S H

.00 2 S

A-B S S D

.00 7 S A-B H S D S

A-B S .00 2

1 44

A-B .00 7 S H

.00 7 S H

S S D

D S A-B S




DEFINED BY D3/E3


8






COINCIDENT WITH TOP OF LEAD WHERE L EAD EXITS PLA STIC BODY


DATUMS

DATUM PLANE

6

5

4 AND A-B -D-

-H-

NOTES:

CONTACT POINT


-C-

-H-

7

7

7

E E1 -D-

E3 E3

6

4

D

D1 6

-B- 4

4 -D-

D3

D3

-A-

D/E

D2/E2 D2/E2

-H- 3

A1 A

-C-

SEATING PLANE

-A-B-

-A-B-

-D-

5 5

.004 C

A A

A2

.020 (MIN)

PIN 1 ID ZONE

DETAIL "J"

SECTION A-A

.021

.013

8

.0105

.0075

.018

.013

.0125

.0075

8


H S .00 7 D S S A-B .032

.026

.00 7 M A-B C D S S

.021

.013


SEATING PLANE .025 MIN.

.045 MIN.

3

1.

2.

-C-

NOM.

S

L

A

Y M

B

O MIN. .165 .172

MAX. .180

A1 .090 .120 .105

A2 .062 .083 -

D .685 .695 .690

D1 .650 .656 .653

D2 .291 .319 .305

D3 .225

E E1 E2 E3 .225

N 44

.291

.685

.650

.319 .305

.656

.695 .690

.653

0.050 (N-4PLACES)


SIDE VIEW




32 FPGA-DS-02053-6.3

27. 44-Pin TQFP Package Dimensions in Millimeters




FPGA-DS-02053-6.3 33

28. 44-Pin LQFP Package Dimensions in Millimeters




34 FPGA-DS-02053-6.3

29. 48-Pin TQFP Package Dimensions in Millimeters




FPGA-DS-02053-6.3 35


EXACT SHAPE O F EACH CORNER IS O PTIO NAL.

TO THE LOWEST POINT ON THE PACKAGE BODY.

7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE

BASE METAL

LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.

THESE DIMENSIONS APPLY TO THE FLAT SECTION O F THE

ALLOWABLE MOLD PR OTRUSION IS 0.254 MM ON D1 AND E1

DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.

4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MO LD PROTRUSION.

5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM

8.

OF THE PACKAGE BY 0.15 MM.

DIMENSIONS.


6. SECTION B-B:

3.

1b

0.220.17 72.0b

0.16

0.23

0.200.09c

c1 0.09

b1 0.17

0.15

0.13

0.20

MAX.

1.60

0.15

0.75

1.45

e

N

L 0.45

0.50 BSC

0.60

48

E1

E

D1

D

9.00 BSC

7.00 BSC

9.00 BSC

7.00 BSC

A2

A1

1.35

0.05

SYMBOL

A -

MIN.

1.40

-

NOM.

-

C A-B

SEE DETAIL "A"

LEAD FINISH

C SEATING PLANE

A3.

0.08

c

b

1c

M C

b

A -B D

3.D

4X8.

e

B 3.

E

D0.20

GAUGE PLANE

A10.08 C

A A2

1.00 REF.

L

0.20 MIN. 0-7

H

E1

0.25

0.20 DD A-BH D1

SECTION B - B

DETAIL "A"

NOTES:

PIN 1 INDICATO R

1

N

MA RKING

ORIENTATION

TOP VIEW

BOTTOM VIEW




36 FPGA-DS-02053-6.3

31. 48-Pin QFN Package: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2

Dimensions in Millimeters







1.


PER ANSI Y14.5M.

SYMBOL

A

A1

A3

D

D2

E

E2

b

e

L

NOM. MAX.MIN.

0.00

5.20

0.15

0.90

0.02

5.35

0.225

1.00

0.05

5.50

0.30

0.35

0.80

0.2 REF

7.0 BSC

7.0 BSC

0.50 BSC

5.20 5.35

SIDE VIEW

WEIV MOTTOBWEIV POT

A D

N

2X0.15 C A

2X0.15 C B

1

3PIN 1 ID AREA

E

B

VIEW A

C

SEATINGPLANE

D2

L3

CHAMFER 0.30x4548X

N

1

0.2500


E2

e

0.50 TYP4X

48Xb 0.10 M C A B

0.05 M C

4

VIEW AA

0.10 C

0.08 C 5

A1A3

3.

4.

5.

5.50

0.40 0.45




FPGA-DS-02053-6.3 37

32. 49-Ball caBGA Package Dimensions in Millimeters

IDENTIFIERA1 BALL I.D.







C

b


CROWNS OF THE SOLDER BALLS.

IS OPTIONAL.6

5

4

.15

.08

MAXIMUM SOLDER BALL DIAMETER,PARALLEL TO PRIMARY DATUM C



PER ANSI Y14.5M.

3

1.

2.

3AC

C

M

M

B

ddd4

e

S

N

S

e

M

0.52b 0.460.40

0.80 BSC

bbb

ddd

aaa

e

-

-

0.10

0.12

0.10-

-

-

7.00 BSC

4.80 BSC

0 BSC

NOM.

0.36

1.04

1.40

SYMBOL MIN.

M/N

D/E

A1

A2

S

A

0.31

0.99

1.30

C

Cbbb

MAX.

0.41

1.09

1.50

A 1

aaa

4X6

D

E

A 2A

A

B

(4X) 5

TOP VIEWBOTTOM VIEW

SIDE VIEW

-




38 FPGA-DS-02053-6.3


C4 ddd

bbb C

C1A

A2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25 03.0b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

2.40 BSC

3.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

- -

--

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)

PIN #1 ID FIDUCIAL


BOTTOM VIEWTOP VIEW

SIDE VIEW

0.10




FPGA-DS-02053-6.3 39


Cccc

bbb C

C 1A

A

Notes:1 ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M - 1994.2 ALL DIMENSIONS ARE IN MILLIMETERS.

3 DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER PARALLEL TO PRIMARY DATUM C.

4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS.

AA1bDED1E1esDsEaaabbbcccdddeee

REF. Min. Nom. Max.

2.40 BSC2.40 BSC0.40 BSC

0.6000.2320.3193.1553.225

-0.1990.2663.1063.185

-0.1670.2393.0553.125

0.0300.0600.0500.0150.050

0.3530.388

0.3830.418

- -

TOP VIEW

BOTTOM VIEW

SIDE VIEW

7 6 5 4 3 2 1sD

e

A

B

C

D

E

F

G

D1

e

sEE1

3 49 X b

ddd M C A BCeee M


aaa C

2x

D

B

aaa C2x

E

4




40 FPGA-DS-02053-6.3

35. 56-Ball csBGA Package Dimensions in Millimeters





DIMENSION "b" IS ME ASURED AT THE



IS OPTIONAL.


5

6

PER ANSI Y14.5M.



PARALLEL TO PRIMARY DATUM C

MAXIMUM SOLDER BALL DIAMETER,

2.

1.

3

0.25 0.30 53.0b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

1.23

NOM.

0.25 BSC

4.50 BSC

6.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.10

0.15

MAX.

1.35

1.10

--

--

C

4

ddd

bbb C

C

1A

A 2Ab

.05

.153

B

M

M

C

C A

e

S

N

S

e

M

A1 BALL I.D.

IDENTIFIER

aaa

4X6

D

E

B

A

5

(4X)BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.10




FPGA-DS-02053-6.3 41


C







b


IS OPTIONAL.


5

6

PER ANSI Y14.5M.




.05

.15

2.

1.

3

3B

MM

CC A

4 ddd

e

S

N

S

e

M

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

NOM.

0.25 BSC

3.50 BSC

5.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.90

0.15

bbb C

C

MAX.

1.10

0.85

1A

aaa

4X 6

D

E

A2A

B

A

5(4X)

- -

--

PIN #1 ID FIDUCIAL

LOCAT ED IN TH IS AREA

6

1.00

TOP VIEWBOTTOM VIEW

SIDE VIEW

0.10

0.35




42 FPGA-DS-02053-6.3

37. 64-Pin QFNS Package Dimensions in Millimeters




FPGA-DS-02053-6.3 43


C4 ddd

bbb C

C

1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.20 0.25 03.0b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

NOM.

0.20 BSC

2.80 BSC

4.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.10

MAX.

1.00

0.90

- -

--

6

--

b

.05

.153

BMM

CC A

e

S

N

S

e

M

aaa

4X 6

D

E

B

A

5(4X)



SIDE VIEW

0.10




44 FPGA-DS-02053-6.3

39. 64-Ball ucfBGA Package Dimensions in Millimeters








IS OPTIONAL.


5

6

PER ANSI Y14.5M.



PARALLEL TO PRIMARY DATUM C.MAXIMUM SOLDER BALL DIAMETER,

2.

1.

3

0.25b

0.40 BSC

aaa

ccc

bbb

e

0.10

0.08

NOM.

0.20 BSC

2.80 BSC

3.50 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.11

MAX.

1.00

M A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2

A

1

-

0.20 0.30

0.62 -

eee

ddd

0.08

0.10

--

-

-


SIDE VIEW

0.15




FPGA-DS-02053-6.3 45





46 FPGA-DS-02053-6.3

41. 68-Pin JLCC Package Dimensions in Inches

CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.


3.

2.

1.

-A-

.00 4

PLANE

SEATING


.05 0

E4

D4

DETAIL A

D

D1

D2

E2

O

SECTION B-B

D4/E4D2/E2D1/E1

NRQL2L1L

.02 0 MIN.

A1

SY

MBA

B1

C

B

A

D/EC1CB2B1BA1

---

-----

68.040.020

.003

.025

.020

.005.930 BSC

-

-----

-

L

.800 BSC.960.920

.990

.013.007

.080 REF

C1

WI THLEAD FINISH

BASE METAL

MAX.

1.000.010

.035

.020

.023

.975

.007

.022

.013

.013

.115MIN.

INCHES

(N PLACES)

DETAIL A

E1 E

M.01 1

B2

B

R

L2

L1

A

Q

L

C

B

B

NOTES:

BOTTOM VIEW

SIDE VIEW

-

.190




FPGA-DS-02053-6.3 47


A-B //

.007 S H

.002 S

A-B S S D

.007 S A-B H S D S

A-B S .002

1 68

A-B .007 S H

.007 S H

S S D

D S A-B S

DIMENSION A PPLIES TO BASE METAL ONLY

TOP POINT OF MEASUREMENT IS DATUM

MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE

DEFINED BY D3/E3


8


LOCATED AT TOP OF MOLD PA RTING LINE AND

TO BE MEA SURED AT SEATING PLANE

EXIT PLASTIC BODY AT DATUM PLANE

DIMENSIONS D1 AND E1 DO NOT INCLUDE M OLD PROTRUSION.

COINCIDENT WITH TOP OF LEA D WHERE LEAD EXITS PLA STIC BODY

ALL DIMENSIONS A ND TOLERANCES CONFORM TO ANSI Y14.5M-1982

DA TUMS

DA TUM PLANE

6

5

4 AND A-B -D-

-H-

NOTES:

CONTACT POINT


-C-

-H-

7

7

7

E E1 -D-

E3 E3

6

4

D

D1 6

-B- 4

4 -D-

D3

D3

-A-

D/E

D2/E2 D2/E2

-H- 3

A1 A

-C-

SEATING PLANE

-A-B-

-A-B-

-D-

5 5

.004 C

A A

A2

.020 (MIN)

PIN 1 ID ZONE

DETAIL "J"

SECTION A-A

.021

.013

8

.0105

.0075

.018

.013

.0125

.0075

8

ALL DIMENSIONS IN INCHES

H S .007 D S S A-B .032

.026

.007 M A-B C D S S

.021

.013



.045 MIN.

3

1.

2.

-C-

E3 N 68

E1 E2

E D3 .375

MAX.

.120

.180

.995

.083

.958

.469 D1 D2

.950

.441

D A2 .062

.985

.455

.954

.990

-

MIN. A A1

.165

.090

L

M

B

O

.105

.172

NOM.

S

Y

.455 .441

.375

.950

.985 .990

.954

.469

.995

.958

0.050 (N-4PLACES)


SIDE VIEW




48 FPGA-DS-02053-6.3

43. 72-Pin QFN Package Option 1: CrossLink™-NX Dimensions in Millimeters

SIDE VIEW

TOP VIEW

BOTTOM VIEW

A D0.10 C A

0.10 C B

0.10 C B

0.10 C A B

0.10 C 0.05 CA

A2A3A1

E

C

1

SEATINGPLANE

0.10 M C A BD2

0.4500

PIN1 ID0.20 R 1

72

18

19

0.4200+0.18

0.4200+0.18

E2

0.10 M C A B

36

37

Leb

0.10 M C A B

0.05 M C

54

55


1. DIMESNIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS.


4. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP.



A

A1

A3

D

D2

E

E2

b

e

L

0.00

6.05

6.05

0.20

0.50 BSC

0.30

0.01

0.2 REF

10.0

6.20

10.0

6.20

0.25

0.40

0.90

0.05

6.35

6.35

0.30

0.50




FPGA-DS-02053-6.3 49

44. 72-Pin QFN Package Option 2: MachXO3D Dimensions in Millimeters

A D

D1

aaa C A

aaa C B

E1 E

bbb C B

bbb C AB

ccc CA

eee C

A3

A1

1

SEATINGPLANEC

SIDE VIEW

TOP VIEW

0.4500

PIN1 ID0.20 R

D2fff M C A B

1

72

18

19

0.4200+0.18

0.4200+0.18

R

E2

1.0110

1.011055

L54

36

37b e L

fffM

CA

Bbbb M C A B

ddd M C

BOTTOM VIEW




3. EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL.4. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP.



A

A1

A3

D

D2

E

E2

b

e

L

TOLERANCES OF FORM & POSITION

aaa

bbb

ccc

ddd

eee

fff

ggg

0.100

0.100

0.100

0.050

0.050

0.100

0.200

0.00

7.078

7.07

0.20

0.30

0.01

0.2 REF

10.0

7.178

10.0

7.178

0.25

0.50 BSC

0.40

0.90

0.05

7.278

7.278

0.30

0.50




50 FPGA-DS-02053-6.3

45. 72-Pin WLCSP Package: CrossLink-NX Dimensions in Millimeters

BOTTOM VIEWBOTTOM VIEW TOP VIEWTOP VIEW

SIDE VIEWSIDE VIEW

CCcccccc

bbbbbb CC

CC11AA

AA

9 8 7 6 5 4 3 2 1sD

e

A

B

C

D

E

F

G

H

D1

3 72 X b

ddd M C A Beee M C

e

sEE1


aaa C

2x

D

BE

aaa C2x

NOTES:

1. ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M – 1994.


3. DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER PARALLEL TO PRIMARY DATUM C.

4. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS.

REF. Min. Nom. Max.A

A1b

D

ED1E1e

sD

sE

aaa

bbb

ccc

dddeee

0.164

0.239

3.8074 BSC4.1251 BSC

2.800 BSC3.200 BSC

0.40 BSC

0.485

0.445

0.030.060

0.03

0.015

0.050

0.1940.269

0.608

0.224

0.299

0.515

0.475




FPGA-DS-02053-6.3 51

46. 80-Ball ctfBGA Package Dimensions in Millimeters








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25b

0.65 BSC

aaa

ccc

bbb

e

0.10

0.08

NOM.

0.325 BSC

5.85 BSC

6.50 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.11

MAX.

1.00

M A1 CORNERINDEX AREA

aaa

4X 6

D

E

B

A

5

(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2 A

1

-

0.20 0.30

0.61 -

eee

ddd 0.15

0.05

0.10

--

-

-


SIDE VIEW

109

87

65

43

21

A

B

C

D

E

F

G

H

J

K




52 FPGA-DS-02053-6.3

47. 80-Ball ckfBGA Package Dimensions in Millimeters

B


SIDE VIEW

1 2 3 4 5 6 7 8 9 10

K

J

H

G

F

E

D

C

B

A

e

D D1

A

aaa (4X) C

e

E1

E

b n X

eee M C A B

fff M C

PIN A1 CORNER

M

cccC D

dd

dC

SC A1 A

SymbolCommon Dimensions

MIN. NOM. MAX.

Package: MFC TFBGA

Body Size:XY

ED

7.0007.000

Ball Pitch: e 0.650

Total Thickness: A 0.962 1.082 1.200

Mold Thickness: M 0.490 0.530 0.570

Substrate Thickness: S 0.252 0.282 0.312

Ball Diameter: 0.350

Stand Off: A1 0.220 0.270 0.320

Ball Width: b 0.320 0.370 0.420

Package Edge Tolerance: aaa 0.100

Mold Parallelism: ccc 0.100

Coplanarity: ddd 0.080

Ball Offset (Package): eee 0.150

Ball Offset (Ball): fff 0.050

Ball Count: n 80

Edge Ball Center to Center: XY

E1D1

5.8505.850




FPGA-DS-02053-6.3 53


C4 ddd

bbb C

C

1A

A2

A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25 03.0b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

- 0.10

0.10

0.10

NOM.

4.00 BSC

5.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

----

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)

PIN #1 ID FIDUCIAL



SIDE VIEW




54 FPGA-DS-02053-6.3

49. 81-Ball csfBGA Package Dimensions in Millimeters








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25b

0.50 BSC

aaa

ccc

bbb

e

0.10

0.08

NOM.

0.00 BSC

4.00 BSC

4.50 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.11

MAX.

1.00

M A1 CORNERINDEX AREA aaa

4X6

D

E

B

A

5

(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2A

1

-

0.20 0.30

0.64 -

eee

ddd 0.15

0.08

0.10

--

-

-

98

76

54

3

21

A

B

C

D

E

F

G

H

J


SIDE VIEW




FPGA-DS-02053-6.3 55


C4 ddd

bbb C

C

1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25 03.0b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

3.20 BSC

4.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

- -

--

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)



SIDE VIEW

0.10




56 FPGA-DS-02053-6.3


Cccc

bbb C

C 1A

A

Notes:1 ALL DIMENSIONS AND TOLERANCE PER ASME Y 14.5M - 1994.2 ALL DIMENSIONS ARE IN MILLIMETERS.3 DIMENSION b IS MEASURED AT THE MAXIMUM BUMP DIAMETER PARALLEL TO PRIMARY DATUM C.4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BUMPS.

AA1bDED1E1esDsEaaabbbcccdddeee

REF. Min. Nom. Max.

3.20 BSC3.20 BSC0.40 BSC

0.5670.2250.319

0.5430.1960.266

3.797 BSC3.693 BSC

0.5100.1670.239

0.0250.0600.0300.0150.050

--

--

0.2990.247

BOTTOM VIEWTOP VIEW

9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

b

sDe

D1

e

sEE1

3 81 X

ddd M C A B

eee M C


A

aaa C2x

D

B

Eaaa C

2x




FPGA-DS-02053-6.3 57

52. 84-Pin CPGA Package Dimensions in Inches


.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN

DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF 3.


.080 MAX.

SECTION X-X


NOTES:

2.

1.

BASE METAL

.020

.016.0215

.0165

3

.100

.100

1.180

1.140

D

E1.180

1.140

-B-

3

-A-

.145

.045

SEATING PLANE-C-

.200

.100

.075

X

X

.10

.30

.008

.070

M

M

M A

C

C MB

BOTTOM VIEWSIDE VIEW




58 FPGA-DS-02053-6.3


A-B //

.00 7 S H

.00 2 S

A-B S S D

.00 7 S A-B H S D S

A-B S .00 2

1 84

A-B .00 7 S H

.00 7 S H

S S D

D S A-B S




DEFINED BY D3/E3


8






COINCIDENT WITH TOP OF LEAD WHERE L EAD EXITS PLA STIC BODY


DATUMS

DATUM PLANE

6

5

4 AND A-B -D-

-H-

NOTES:

CONTACT POINT


-C-

-H-

7

7

7

E E1 -D-

E3 E3

6

4

D

D1 6

-B- 4

4 -D-

D3

D3

-A-

D/E

D2/E2 D2/E2

-H- 3

A1 A

-C-

SEATING PLANE

-A-B-

-A-B-

-D-

5 5

.004 C

A A

A2

.020 (MIN)

PIN 1 ID ZONE

DETAIL "J"

SECTION A-A

.021

.013

8

.0105

.0075

.018

.013

.0125

.0075

8


H S .00 7 D S S A-B .032

.026

.00 7 M A-B C D S S

.021

.013



.045 MIN.

3

1.

2.

-C-

E3 N 84

E1 E2

D3 E

.475

.180

MAX.

.080

1.158

1.195

.120

.569 D1 D2

1.150

.541

A2 D

.059

1.185

1.154

.555

1.190

-

MIN. A A1

.165

.090

M

B

O

L

.172

.105

NOM.

Y

S

.541

1.150

.475

.555

1.154

1.185 1.190

.569

1.158

1.195

0.050 (N-4PLACES)

BOTTOM VIEWTOP VIEW

SIDE VIEW




FPGA-DS-02053-6.3 59

54. 84-Pin QFN Package Dimensions in Millimeters







1.


PER ANSI Y14.5M.

SYMBOL

A

A1

A3

D

D2

E

E2

b

e

f

NOM. MAX.MIN.

0.00

4.30

0.17

0.85

0.02

-

0.22

0.95

0.05

4.50

0.27

0.75

0.15 REF

7.0 BSC

7.0 BSC

0.50 BSC

-

g

S

L

M 0.30 0.40 0.50

0.50 BSC

0.65 BSC

0.25 BSC

0.30 0.40 0.50

0.15

PIN 1 ID

3

DA

2X

B

L

0.15

2X

C

E2

A1

AC

eb0.10 4M B


N

1

E

5

4

3

3

SEATINGPLANE

C

0.08 5C

A3A1

A

B1

A12

B9

B10

A13

B18

A24

B19

A25

B27

A36

A37

B28

A48

B36

f

D2

M

S

g

0.10 CM B

0.10 M B

0.05 C

0.10 M B

84X

84X

TOP VIEW

BOTTOM VIEW

VIEW B

VIEW A

SIDE VIEW

VIEW B

VIEW A

B

A

C A

C A

C A

4.30 4.50




60 FPGA-DS-02053-6.3


MIN.SYMBOL MAX.NOM.





IS OPTIONAL.






PER ANSI Y14.5M.




6

5

4

3

1.

2.

bbb

ddd

-

-

0.10

0.12

-

-

7.20 BSC

10.00 BSC

0.46

0.80 BSC

0.40 BSC

0.36

1.04

1.40

M/N

b

aaa

e

S

0.40

-

D/E

A1

A2

A

0.31

0.99

1.30

0.52

0.10-

0.41

1.09

1.50

b

3

e

S

10

A1 BALL I.D.

4X

.08

.15C

C

M

M

S

A B

Cddd

4 C

e

Cbbb

59 8 7 16 2

NE

K

J

H

G

F

IDENTIFIER

B

D

C

A

6

A

1A

A 2

E

B

M

aaa(4X)

D

5

A

TOP VIEWBOTTOM VIEW

SIDE VIEW

4 3




FPGA-DS-02053-6.3 61


C

4

ddd

bbb C

C1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

1.23

NOM.

0.25 BSC

6.50 BSC

8.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.90

0.15

MAX.

1.35

1.10

- -

--

A1 BALL I.D.IDENTIFIER

aaa

4X6

D

E

B

A

5(4X)

b

.05

.153

BMM

CC A

e

S

N

S

e

M


SIDE VIEW

0.35

0.10




62 FPGA-DS-02053-6.3

57. 100-Ball fpBGA Package Dimensions in Millimeters

bbb







IDENTIFIER

A1 BALL I.D.

2.

1.

3

4


5

6 IS OPTIONAL.


PER ANSI Y14.5M.





4

ddd C

S

e

A

b

3.25

.10 M

M

C

C

10 9 8 7 6 5

M

B

S

e

J

K

H

G

4 3 2 1

D

E

F

C

B

N

A

0.70

1.70

MAX.

0.20

0.20

0.25

0.70

D/E

e

aaa

ddd

bbb

S

M/N

b

C

A

A2

A1

SYMBOL

11.00 BSC

0.50 BSC

1.00 BSC

9.00 BSC

-

-

-

0.40

-

-

-

0.55

1.10 REF

1.501.30

0.30

MIN. NOM.

0.50

2

5(4X)

4X

C

6

aaa

A A

1A

D A

E

B

BOTTOM VIEWTOP VIEW

SIDE VIEW




FPGA-DS-02053-6.3 63

58. 100-Pin PQFP Package Dimensions in Millimeters

0.13/0.30 R.

23.20 BSC

17.20 BSC

20.00 BSC

ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1

TO THE LOWEST POINT ON TH E PACKAGE BODY.

5. 0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM

THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TI P.

7. 0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE

EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.

EXACT SHAPE OF EACH CORNER IS OPTIONAL.

OF THE PACKAG E BY 0.15 MM.

8.

9.

6. 0 SECTION B-B:

DIMENSIONS.

c

c1

b

b1

0.11

0.11

0.22

0.22

-

-

0.30

N

e

E

E1

L

0.65 BSC

100

14.00 BSC

0.73 0.88

BASE METAL

LEAD FINIS H


4. 0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.

1. 0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.

c1c

2. 0 ALL D IMENSIONS ARE IN MILLIMETERS.

3.

1b

b

A

D1

D

A1

A2

-

0.25

2.50

-

-

2.70

SYMBOL MIN. NOM.

1.60 REF.

L

R. MIN.0.13

0.40 MIN.

0° MIN.

0.23

0.19

0.40

0.36

1.03

3.40

0.50

2.90

MAX.

GAGE PLANE

0-7°

0.25

NOTES:

PLANE

-C-

SEATING

bM0.12 C A-B D

SEE DETAIL "A"

(N-4)X e

C0.10

A

A1

-H-

A2

-D-

83 -B-

PIN 1 INDICATOR

3N

1

E

-A-

D D1

3

C X4B-A D52.0

E1

H X4B-A D02.0

SECTION B - B

DETAIL "A"

TOP VIEW

BOTTOM VIEW

0.15




64 FPGA-DS-02053-6.3

59. 100-Pin LQFP Package Option 1: MachXO2, MachXO™, ispMACH® 4000


LEAD FINISH

BASE METAL

5. THE TOP OF PACKAG E MAY BE SMALLER THAN THE BOTTOM

4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.





THESE DIMENSIONS APPLY TO TH E FLAT SECTION OF THE




EXACT SHAPE OF EACH CORNER IS OPTI ONAL.8.

DIMENSIONS.


6. SECTION B-B:

3.

SECTION B-B

b1

c

b

c 1

0.160.130.09c1

0.50 BSC

0.17

0.09c

b1

0.17b

e

0.15

0.20

0.20

0.23

0.22 0.27

14.00 BSC

16.00 BSC

0.45

N

L

E1

E

100

0.60 0.75

14.00 BSC

16.00 BSC

D1

D

0.05

1.35A2

A1

1.40

-

1.45

0.15

SYMBOL

DETAIL 'A'

A1

0.10 C

MIN.

A -

NOM.

1.60

MAX.

0.20 MIN.

1.00 REF.

0-7

L

SIDE VIEW

SEATING PLANE0.20 CM B-A D

b

TOP VIEW

8

e

D

A

3

D

GAUGE PLANE

SEE DETAIL 'A'

C

A A2

0.204X A-BH D

H

0.25

BOTTOM VIEW

3

3

B

E1E

D1

0.20 C B-A D 100X

N

1

NOTES:

PIN 1 INDICATOR

MARKINGORIENTATION

-




FPGA-DS-02053-6.3 65

60. 100-Pin VQFP Package Option 2: iCE40 Dimensions in Millimeters

NOTES:

PIN 1 INDICATOR

MARKINGORIENTATION

LEAD FINISH

BASE METAL











EXACT SHAPE OF EACH CORNER IS OPTIONAL.8.

DIMENSIONS.


6. SECTIO N B-B:

3.

SECTION B-B

b1

c

b

c 1

0.160.130.09c1

0.50 BSC

0.17

0.09c

b1

0.17b

e

0.15

0.20

0.20

0.23

0.22 0.27

14.00 BSC

16.00 BSC

0.45

N

L

E1

E

100

0.60 0.75

14.00 BSC

16.00 BSC

D1

D

0.05

0.95A2

A1

1.00

-

1.05

0.15

SYMBOL

DETAIL 'A'

A10.08 C

MIN.

A - -

NOM.

1.20

MAX.

0.20 MIN.

1.00 REF.

0-7°

L

SIDE VIEW

SEATING PLANE0.20 CM DA-B

b

TOP VIEW

8

e

D

A

3

D

GAUGE PLANE

SEE DETAIL 'A'

C

A A2

0.204X A-BH D

H0.25

BOTTOM VIEW

3

3

B

E1E

D1

0.20 A-BC D 100X

N

1




66 FPGA-DS-02053-6.3


0° MIN.

0.20 MIN.

-

NOM.

-

3.40

31.20 BSC

0.88

31.20 BSC

28.00 BSC

28.00 BSC

120

0.80 BSC

-

0.35

0.15

-

3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.






THESE DIMENSI ONS APPLY TO THE FLAT SECTION OF THE



EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.9.

6. 0 SECTION B-B:

8.

DIMENSIONS.


c1

N

e

b

b1

c

0.29

0.29

E

E1

L

D1

0.73

2. 0 ALL DIMENSIONS ARE IN MILLI METERS.


c

BASE METAL1b

c1

A

SYMBOL

A1

A2

D

0.25

3.20

-

MIN.

L

1.60 REF.

LEAD FINISHb

R. MIN.0.13

0.19

0.41

0.23

0.45

1.03

0-7°

0.50

3.60

4.10

MAX.

GAGE PLANE

0.25

0.13/0.30 R.

SECTION B - B

DETAIL "A"

TOP VIEW

BOTTOM VIEW

SEE DETAIL "A"

(N-4)X

NOTES:

0.20 M C DA-B

PLANE

C

SEATING

b

0.10

e

CA1

A A2

H

D

8

A3

1

N

PIN 1 INDICATOR

3

D 3

B

E E1

0.25 C 4X

D1

A-BH0.20 D 4X

DA-B

0.11

0.11




FPGA-DS-02053-6.3 67

62. 121-Ball caBGA Package (9 mm x 9 mm Body) Dimensions in Millimeters


SIDE VIEW

D

M

11

10

9

8

7

6

5

4

3

2

1

A

B

C

D

E

F

G

H

J

K

L

N E

S

e

S

eb

3 .15 M C A B

.08 M C

5

aaa

D

(4X)

A

BA1 CORNER INDEX AREA

E

64X

A A2

bbb C

ddd C

C

4


A

A1

A2

D/E

M/N

S

b

e

aaa

bbb

ddd

0.15

0.55

1.10

9.00 BSC

8.00 BSC

0.00 BSC

0.30 0.40 0.50

0.80 BSC

0.15

0.20

0.10


1. DIMENSIONS AND TOLERANCES PER ANSI Y14. 5M.


3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C.

4. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.






68 FPGA-DS-02053-6.3


C4 ddd

bbb C

C

1A

A2

A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

5.00 BSC

6.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

-

--

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)



SIDE VIEW

0.10

0.30

-




FPGA-DS-02053-6.3 69





70 FPGA-DS-02053-6.3


C4 ddd

bbb C

C

1A

A2

A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

4.00 BSC

5.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

- -

--

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)

PIN #1 ID FIDUCIAL



SIDE VIEW

0.10

0.30




FPGA-DS-02053-6.3 71


0° MIN.

0.20 MIN.

-

NOM.

-

3.40

31.20 BSC

0.88

31.20 BSC

28.00 BSC

28.00 BSC

128

0.80 BSC

-

0.35

0.15

-











6. 0 SECTION B-B:

8.

DIMENSIONS.


c1

N

e

b

b1

c

0.29

0.29

E

E1

L

D1

0.73



c

BASE METAL1b

c1

A

SYMBOL

A1

A2

D

0.25

3.20

-

MIN.

L

1.60 REF.

LEAD FINISHb

R. MIN.0.13

0.19

0.41

0.23

0.45

1.03

0-7°

0.50

3.60

4.10

MAX.

GAGE PLANE

0.25

0.13/0.30 R.

SECTION B - B

DETAIL "A"

TOP VIEW

BOTTOM VIEW

SEE DETAIL "A"

(N-4)X

NOTES:

0.20 M C DA-B

PLANE

C

SEATING

b

0.10

e

CA1

A A2

H

D

8

A3

1

N

PIN 1 INDICATOR

3

D 3

B

E E1

0.25 C A-B D 4X

D1

A-BH0.20 D 4x

0.11

0.11




72 FPGA-DS-02053-6.3





BASE METAL








8.


DIMENSIONS.


6. SECTION B-B:

3.

1b

c c 1

c1

c

0.09

0.09

b1

b

0.13

0.13

0.13

0.15

0.16

0.20

0.16

0.18

0.19

0.23

16.00 BSCE

0.45L

N

e

E1

0.60 0.75

0.40 BSC

128

14.00 BSC

D1

D

A2

A1

1.35

0.05

16.00 BSC

14.00 BSC

1.40

-

1.45

0.15

SYMBOL

A -

MIN.

-

NOM.

1.60

MAX.

SEE DETAIL "A"

LEAD FINISH

C SEATING PLANE

8.

b

0.07

b

-BCM A D

4X

D 3.

e

3. A

B

D

GAUGE PLANE

0.08 C

A1

A A2

1.00 REF.

0.20 MIN.

L

0-7

H

0.25

E

3.

E1

A-BC A-B0.20

H0.20 DD

D1

SECTION B - B

DETAIL "A"

NOTES:

PIN 1 INDICATOR

1

N

MARKING ORIENTATION

TOP VIEW

SIDE VIEW

BOTTOM VIEW

SIDE VIEW




FPGA-DS-02053-6.3 73

68. 132-Ball csBGA Package Option 1: MachXO2, MachXO, LatticeXP2™









IS OPTIONAL.


5

6

PER ANSI Y14.5M.





2.

1.

3

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

1.23

NOM.

0.25 BSC

6.50 BSC

8.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.90

0.15

MAX.

1.35

1.10

- -

--

C

4

ddd

bbb C

C

1A

A 2Ab

.05

.153

B

M

M

C

C A

e

S

N

S

e

M


aaa

4X6

D

E

B

A

5(4X)

BOTTOM VIEWTOP VIEW

SIDE VIEW

0.10

0.35




74 FPGA-DS-02053-6.3

69. 132-Ball csBGA Package Option 2: iCE40 Dimensions in Millimeters

C

4

ddd

bbb C

C1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

-

NOM.

0.25 BSC

6.50 BSC

8.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

-

0.15

MAX.

1.00

0.85

- -

--


aaa

4X6

D

E

B

A

5(4X)

b

.08.15

3B

MM

CC A

e

S

N

S

e

M


SIDE VIEW

0.10

0.35




FPGA-DS-02053-6.3 75


C







b


IS OPTIONAL.


5

6

PER ANSI Y14.5M.




.05

.15

2.

1.

3

3B

MM

CC A

4 ddd

e

S

N

S

e

M

0.20 0.25b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

NOM.

0.20 BSC

4.40 BSC

6.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.10

bbb C

C

MAX.

1.00

0.90

1A

aaa

4X 6

D

E

A 2A

B

A

5(4X)

- -

--

PIN #1 ID FIDUCIAL


6

--

BOTTOM VIEWTOP VIEW

SIDE VIEW

0.30

0.10




76 FPGA-DS-02053-6.3

71. 133-Pin CPGA Package Dimensions in Inches

ALL DIMENSIONS ARE IN INCHES.2.


.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWNDIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF

3.


D -A-

-B-.050

BASE METAL

SECTION X-X

NOTES:

1.

.100

.016

.020

.0165

.0215

.080 MAX.

.100

.050

1.440

1.480

1.480

1.440E 3

3

.070

.100

SEATING PLANE

-C-

.045

.075

.200

X

X

.008

A

.10

.30M

M

C

C MB

.145BOTTOM VIEWSIDE VIEW

M




FPGA-DS-02053-6.3 77


C







b


IS OPTIONAL.


5

6

PER ANSI Y14.5M.




.05

.15

2.

1.

3

3B

MM

CC A

4 ddd

e

S N

S

e

M

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

1.00

NOM.

0.25 BSC

5.50 BSC

7.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.90

0.15

bbb C

C

MAX.

1.10

0.85

1A

aaa

4X 6

D

E

A 2A

B

A

5(4X)

- -

--

PIN #1 ID FIDUCIAL

LOCATED IN T HIS AREA

6TOP VIEWBOTTOM VIEW

SIDE VIEW

0.10

0.35




78 FPGA-DS-02053-6.3


A

E

0.50

1.70

0.60

0.50 BSC

1.00 BSC

11.00 BSC

11.60

13.00 BSC

0.50

NOM.

11.00B/C




PLANE ARE DEFINED BY THE SPHERICALPRIMARY DATUM C AND SEATING


MAXIMUM SOLDER BALL DIAMETER,DIMENSION "b" IS MEASURED AT THE


IS OPTIONAL.6

5

4

3

ddd

ccc

bbb

aaa

e

b

S

M/N

D/E

-

-

-

-

-

-

-

-

0.50

C




PER ANSI Y14.5M.1.

2.

ddd

4 C

C

bbb

.10

.253

b

e

S

A

M

M

C

C B

S

e

GN

K

J

H

M

L

E

D

C

B

F

Cccc

A2

A1

A

SYMBOL

0.30

1.30

0.30

MIN.

4X6

A2

1

AA

C

12.20

0.25

0.35

0.20

0.20

0.70

0.70

0.70

2.10

MAX.

B

A1 CORNER

INDEX AREA

101112 1

M

9 678 345 2

aaa

(4X)

B

D A

5

BOTTOM VIEW

TOP VIEW

SIDE VIEW




FPGA-DS-02053-6.3 79





BASE METAL








8.


DIMENSIONS.


6. SECTION B-B:

3.

1b

c c 1

c1

c

0.09

0.09

b1

b

0.17

0.17

0.13

0.15

0.16

0.20

0.20

0.22

0.23

0.27

22.00 BSCE

0.45L

N

e

E1

0.60 0.75

0.50 BSC

144

20.00 BSC

D1

D

A2

A1

1.35

0.05

22.00 BSC

20.00 BSC

1.40

-

1.45

0.15

SYMBOL

A -

MIN.

-

NOM.

1.60

MAX.

SEE DETAIL "A"

LEAD FINISH

C SEATING PLANE

8.

b

0.08

b

-BCM A D

4X

D 3.

e

3. A

B

D

GAUGE PLANE

0.08 C

A1

A2A

1.00 REF.

0.20 MIN.

L

0-7

H

0.25

E

3.

E1

A-BC A-B0.20

H0.20 DD

D1

SECTION B - B

DETAIL "A"

NOTES:

PIN 1 INDICATOR

1

N

MARKINGORIENTATION

TOP VIEW BOTTOM VIEW

SIDE VIEW




80 FPGA-DS-02053-6.3


0° MIN.

0.20 MIN.

-

NOM.

-

3.40

31.20 BSC

0.88

31.20 BSC

28.00 BSC

28.00 BSC

160

0.65 BSC

-

0.30

0.15

-


TO THE LOWEST POINT ON THE PACKAGE BODY .









6. 0 SECTION B-B:

8.

DIMENSIONS.


c1

N

e

b

b1

c

0.22

0.22

E

E1

L

D1

0.73



c

BASE METAL1b

c1

A

SYMBOL

A1

A2

D

0.25

3.20

-

MIN.

L

1.60 REF.

LEAD FINISHb

R. MIN.0.13

0.19

0.36

0.23

0.40

1.03

0-7°

0.50

3.60

4.10

MAX.

GAGE PLANE

0.25

0.13/0.30 R.

SECTION B - B

DETAIL "A"

TOP VIEW

BOTTOM VIEW

SEE DETAIL "A"

(N-4)X

NOTES:

0.13 M C DA-B

PLANE

C

SEATING

b

0.10

e

CA1

A A2

H

D

8

A3

1

N

PIN 1 INDICATOR

3

D 3

B

E E1

0.25 C A-B 4X

D1

A-BH0.20 D 4X

D

0.11

0.11




FPGA-DS-02053-6.3 81





BASE METAL








8.


DIMENSIONS.


6. SECTION B-B:

3.

1b

c c 1

c1

c

0.09

0.09

b1

b

0.17

0.17

0.13

0.15

0.16

0.20

0.20

0.22

0.23

0.27

26.00 BSCE

0.45L

N

e

E1

0.60 0.75

0.50 BSC

176

24.00 BSC

D1

D

A2

A1

1.35

0.05

26.00 BSC

24.00 BSC

1.40

-

1.45

0.15

SYMBOL

A -

MIN.

-

NOM.

1.60

MAX.

SEE DETAIL "A"

LEAD FINISH

C SEATING PLANE

8.

b

0.08

b

-BCM A D

4X

D 3.

e

3. A

B

D

GAUGE PLANE

0.08 C

A1

A A2

1.00 REF.

0.20 MIN.

L

0-7

H

0.25

E

3.

E1

A-BC A-B0.20

H0.20 DD

D1

SECTION B - B

DETAIL "A"

NOTES:

PIN 1 INDICATOR

1

N

MARKINGORIENTATION

TOP VIEW BOTTOM VIEW

SIDE VIEW




82 FPGA-DS-02053-6.3


C








b


IS OPTIONAL.


5

6

PER ANSI Y14.5M.




.05

.15

2.

1.

3

3B

MM

CC A

4

ddd

e

S

N

S

e

M

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

1.35

NOM.

0.25 BSC

6.50 BSC

8.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.20

0.16

bbb C

C

MAX.

1.50

1.34

1A

aaa

4X6

D

E

A2A

B

A

5(4X)

- -

--

TOP VIEWBOTTOM VIEW

SIDE VIEW

14 13 12 11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

0.10

0.35




FPGA-DS-02053-6.3 83


C


b

.08

.153

BMM

CC A

4

ddd

e

S

N

Se

M

bbb C

C1A

aaa

4X 6

D

E

A2A

B

A

5(4X)

7.








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

JEDEC REFERENCE: JEP95DR4.5

0.45 0.50b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

- 0.20

0.15

-

NOM.

0.40 BSC

10.40 BSC

12.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

-

0.27

MAX.

1.60

1.10--

0.20

0.55


SIDE VIEW




84 FPGA-DS-02053-6.3


C

4

ddd

bbb C

C

1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25 0.30b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

-

NOM.

0.25 BSC

6.50 BSC

8.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

-

0.15

MAX.

1.00

0.85

- -

--


aaa

4X6

D

E

B

A

5(4X)

b

.08.15

3B

MM

CC A

e

S

N

S

e

M


SIDE VIEW

0.10

0.35




FPGA-DS-02053-6.3 85

80. 208-Ball ftBGA Package Dimensions in Millimeters

C

4

ddd

bbb C

C

1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.40 0.50b

1.0 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.20

1.40

NOM.

0.50 BSC

15.0 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.25

0.30

MAX.

1.55

1.25

- -

--


aaa

4X6

D

E

B

A

5(4X)

b

.10

.253

BMM

CC A

e

S

N

S

e

M


SIDE VIEW

0.60

0.25




86 FPGA-DS-02053-6.3


S

1.

2.


6

4

5

3

0.50 BSC

1.00 BSC

15.00 BSC

15.30

17.00 BSC







IS OPTIONAL.



--ccc

ddd -

aaa

bbb

e

b

S

M/N

D/E

B/C

-

-

0.50

-

-

0.60

14.80

bbb

DIMENSIONS AND TOLERANCES PER ANSI Y14.5M.

ddd

4 C

C

A

b

3

e

.10

.25

M

M

C

C B

S

e

L

T

R

P

N

M

K

J

H

G

F

N

Cccc

SYMBOL

A

A2

A1

C

MIN.

1.30

0.30

0.30

1.70

0.50

0.50

NOM.

4X6

A

C

0.35

0.20

0.20

0.25

0.70

15.80

2.10

0.70

0.70

MAX.

2

1

AA

E

A1 CORNER

INDEX AREA

1415 0161 111213 139 45678 2

M

E

D

C

B

A

aaa(4X)

AD

B

5

B

BOTTOM VIEW

TOP VIEW

SIDE VIEW

-




FPGA-DS-02053-6.3 87


0° MIN.

0.20 MIN.

-

NOM.

-

3.40

30.60 BSC

0.60

30.60 BSC

28.00 BSC

28.00 BSC

208

0.50 BSC

-

0.20

0.12

-


TO THE LOWEST POINT ON THE PACKAGE BODY .









6. 0 SECTION B-B:

8.

DIMENSIONS.


c1 0.09

N

e

b

b1

c 0.09

0.17

0.17

E

E1

L

D1

0.45



c

BASE METAL1b

c1

A

SYMBOL

A1

A2

D

0.25

3.20

-

MIN.

L

1.30 REF.

LEAD FINISHb

R. MIN.0.08

0.16

0.23

0.20

0.27

0.75

0-8°

0.50

3.60

4.10

MAX.

GAGE PLANE

0.25

0.08/0.25 R.

SECTION B - B

DETAIL "A"

TOP VIEW

BOTTOM VIEW

SEE DETAIL "A"

(N-4)X

NOTES:

0.08 M C DA-B

PLANE

C

SEATING

0.08

b

e

CA1

A A2

H

D

8

A3

1

N

PIN 1 INDICATOR

3

D 3

B

E E1

0.25 A-B 4X

D1

A-BH0.20 D 4X

DC




88 FPGA-DS-02053-6.3


C4 ddd

bbb C

C1A

A2

A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

30.20 0.25b

0.40 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.10

0.10

NOM.

5.60 BSC

7.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.10

MAX.

1.00

0.90

- -

--

6

--

b

.05

.153

BMM

CC A

e

N

e

M

aaa

4X 6

D

E

B

A

5(4X)



SIDE VIEW

0.30

0.10




FPGA-DS-02053-6.3 89


C








b


IS OPTIONAL.


5

6

PER ANSI Y14.5M.




.10

.25

2.

1.

3

3B

MM

CC A

4

ddd

e

S

N

S

e

M

0.40 0.50 06.0b

1.0 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.15

0.20

1.55

NOM.

0.50 BSC

15.0 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.40

0.30

bbb C

C

MAX.

1.70

1A

aaa

4X6

D

E

A2A

B

A

5(4X)

- -

-

DEPOPULATED 13G TO 13R, 10G TO 10K,AND 9F TO 9L.7

7

- 1.24

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

A

B

CD

E

F

GH

J

K

L

M

NP

RT

0.25


SIDE VIEW




90 FPGA-DS-02053-6.3


C

4

ddd

bbb C

C1A

A2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.40 0.45 05.0b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.20

0.15

NOM.

0.40 BSC

12.0 BSC

14.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

MAX.

1.70

-

-

-

-0.65

REFERENCE JEDEC MO-275, VARIATION JJAB-2.7.

A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)

b

.08

.153

BMM

CC A

e

S

N

S

e

M

-

-

0.20




FPGA-DS-02053-6.3 91









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.30b

0.50 BSC

aaa

ccc

bbb

e

0.10

0.08

0.10

NOM.

0.25 BSC

7.50 BSC

9.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.15

MAX.

1.00- -

0.66

M A1 CORNERINDEX AREA aaa

4X6

D

E

B

A

5

(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2A

1

0.24 -

0.25 0.35

- -

eee

ddd

0.05

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

A

BC

D

EF

GH

J

KL

M

NP

RT

0.15




92 FPGA-DS-02053-6.3

87. 256-Ball ftBGA Package Option 1: ispMACH 4000, MachXO, LatticeXP2









IS OPTIONAL.

CROWNS OF THE SOLDER BALLS. 4

5

6

PER ANSI Y14.5M.





2.

1.

3

0.40 0.50 b

1.00 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.20

1.40

NOM.

0.50 BSC

15.0 BSC

17.0 BSC

MIN. SYMBOL

A2

A1

D/E

M/N

A

S

1.25

0.30

MAX.

1.55

1.25

-

- -

C

4

ddd

bbb C

C

1 A

A 2 A b

.10

.25 3

B

M

M

C

C A

e

S

N

S

e

M

A1 BALL I.D. IDENTIFIER

aaa

4X 6

D

E

B

A

5 (4X)

0.60

0.25

-


SIDE VIEW




FPGA-DS-02053-6.3 93

88. 256-Ball ftBGA Package Option 2: LatticeECP3™ Dimensions in Millimeters

C

4

ddd

bbb C

C1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

b

1.0 BSC

aaa

ddd

bbb

e

-

-

-

NOM.

0.50 BSC

15.0 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.30

0.30

MAX.

1.40 REF

0.50

1.70

0.50

0.20

0.25

0.20

-

-

-

b

.10

.253

BMM

CC A

e

S

N

S

e

M

aaa

4X6

D

E

B

A

5(4X)

INDEX AREAA1 CORNER

2.10

0.70

0.60 0.70




94 FPGA-DS-02053-6.3

89. 256-Ball ftBGA Package Option 3: MachXO2 Dimensions in Millimeters

C

4

ddd

bbb C

C1A

A 2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.40 0.50 06.0b

1.0 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.20

1.55

NOM.

0.50 BSC

15.0 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

1.40

0.30

MAX.

1.70

- -

- -1.00


aaa

4X6

D

E

B

A

5(4X)

b

.10

.253

BMM

CC A

e

S

N

S

e

M

0.25




FPGA-DS-02053-6.3 95


AD

4X

ccc

ddd

aaa

bbb

M/N

D/E

B/C

SYMBOLNOTES: UNLESS OTHERWISE SPECIFIED







IS OPTIONAL.




PER ANSI Y14.5M.

4

6

5

2.

3

1.

12

M

M

b

3 .10

.25

S

e

141516 13

4

ddd C

A

C

C

S

e

Cccc

C

Cbbb

L

T

R

P

N

M

K

J

H

G

F

N

10 9 4567811

M

123

E

D

C

B

A

-

-

-

-

1.00 BSC

0.60

-

-

-

-

0.50

e

b

0.35

0.20

0.20

0.25

0.70

0.50 BSC

15.00 BSC

15.30

17.00 BSC

1.70

0.50

0.50

NOM.

14.80

S

MIN.

1.30

0.30

0.30

A

A2

A1

15.80

2.10

0.70

0.70

MAX.

6

1

A

A2A

C

B

E

B

A1 CORNER

INDEX AREA (4X) aaa

5 TOP VIEW

BOTTOM VIEW

SIDE VIEW

B




96 FPGA-DS-02053-6.3

91. 256-Ball SBGA Package Dimensions in Millimeters

A-A SECTION VIEW

Y

W

P

R

T

U

V

K

L

M

N

E

F

G

H

J

A

B

C

D


IS OPTIONAL.


PER ANSI Y14.5M.










4

6

5

3

2.

1.

0.20

1.00

1.70

0.90

0.20

0.25

0.80

--A

1.27 BSCe

-

0.25

0.10

-

-

aaa

ddd

bbb

A4

Q

-

-

-

-

-

0.80

0.60

0.50

M/N

S

b

D/E

A2

A1

0.75

0.635 BSC

24.13 BSC

0.90

27.00 BSC

0.65

MIN.SYMBOL NOM.

-

-

MAX.

Q

1

C

ddd

bbb

4

C

C

4A AA2A

b

3 .15

.30M

M

C

C

e

S

A

e

S

A A

N

M

4X6

A1 BALL I.D.

IDENTIFIER

5(4X)

aaa

D

E

AB

TOP VIEWBOTTOM VIEW

SIDE VIEW

B




FPGA-DS-02053-6.3 97

92. 272-Ball BGA Package Dimensions in Millimeters

1.


6

5

4

3

2.

0.635 BSC

1.27 BSC

24.13 BSC

27.00 BSC

0.650.50A1PER ANSI Y14.5M.









IS OPTIONAL.



ddd

ccc

bbb

-

-

-

-

-

-

M/N

aaa

e

b

S

B/C

D/E

A2

-

0.60

-

0.75

23.80

0.28

24.30

0.54


SYMBOL

A

MIN.

1.90

NOM.

2.25

0.80

0.20

0.35

0.25

0.20

0.90

24.80

0.80

MAX.

2.80

4ddd C

bbb

C

CC

ccc

1A

A2A

SG

b

3

e

M

M

.15

.30 BA

C

C

Se

U

Y

W

V

M

P

N

R

T

J

H

L

KN

8182019 15

1617 11

1213

149

10

M

7 56 2

34

C

F

E

D

1

B

A

4X6

C E

A1 BALL I.D.

IDENTIFIER

aaa

B

D

(4X) 5

B

A

TOP VIEW

BOTTOM VIEW

SIDE VIEW




98 FPGA-DS-02053-6.3


C

4

ddd

bbb C

C1A

A2A








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25 0.31 73.0b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

NOM.

0.25 BSC

10.50 BSC

12.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.15

MAX.

1.00

0.85

-

--

-


aaa

4X6

D

E

B

A

5(4X)

b

.05

.153

BMM

CC A

e

S

N

S

e

M

-

-

0.10




FPGA-DS-02053-6.3 99









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.30b

0.50 BSC

aaa

ccc

bbb

e

0.10

0.08

0.10

NOM.

0.25 BSC

8.50 BSC

10.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.15

MAX.

1.30- -

1.00

MA1 CORNER

INDEX AREAaaa

4X6

D

E

B

A

5(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2A

1

-

0.25 0.35

-

eee

ddd

0.05

-

-

18

17

16

1514

1312

1110

98

76

54

32

1

AB

C

DE

FG

H

JK

L

M

N

PR

T

UV

0.15


SIDE VIEW




100 FPGA-DS-02053-6.3

95. 289-Ball csBGA Package (9.5 mm x 9.5 mm Body) Dimensions in Millimeters

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U




FPGA-DS-02053-6.3 101





102 FPGA-DS-02053-6.3


C








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

4

ddd

0.40 0.45 05.0b

0.80 BSC

aaa

ddd

ccc

e

-

-

-

-

-

-

0.20

0.15

NOM.

0.40 BSC

13.6 BSC

15.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

ccc C

C

MAX.

1.70

1A

A2A

0.35

1.00

- -

-0.80

N

A1 CORNERINDEX AREA

aaa

4X 6

D

E

B

A

5(4X)

M

S

e

b

.08

.153

BMM

CC A

S

e

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

-

0.20




FPGA-DS-02053-6.3 103









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.30b

0.50 BSC

aaa

ccc

bbb

e

0.10

0.08

0.10

NOM.

0.25 BSC

8.50 BSC

10.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.15

MAX.

1.00- -

0.66

MA1 CORNER

INDEX AREAaaa

4X6

D

E

B

A

5(4X)

N

e

b

eeeddd

3B

MM

CC A

S

e

C

4

ccc

bbb C

CA

A2A

1

0.24 -

0.25 0.35

- -

eee

ddd 0.15

0.05




104 FPGA-DS-02053-6.3









IS OPTIONAL.

CROWNS OF THE SOLDER BALLS. 4

5

6

PER ANSI Y14.5M.



PARALLEL TO PRIMARY DATUM C MAXIMUM SOLDER BALL DIAMETER,

2.

1.

3

0.40 0.60 07.0 b

1.00 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.20

0.20

1.50

NOM.

0.50 BSC

17.0 BSC

19.0 BSC

MIN. SYMBOL

A2

A1

D/E

M/N

A

S

1.25

0.30

MAX.

1.70

1.40

-

- -

C

4

ddd

bbb C

C

1 A

A 2 A b

.10

.25 3

B M M

C C A

e

S

N

S

e

M

A1 BALL I.D. IDENTIFIER

aaa

4X 6

D

E

B

A

5 (4X)


SIDE VIEW

0.25

-




FPGA-DS-02053-6.3 105









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.25b

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.08

0.10

NOM.

9.00 BSC

10.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.15

MAX.

1.50

- -

-

1.351.05

-

A1 BALL

IDENTIFIER

aaa

4X6

D

E

B

A

5(4X)

b

.05

.153

BMM

CC A

e

N

e

M

C

4

ddd

bbb C

C

1A

A 2A


SIDE VIEW








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.50 BSC

aaa

ddd

bbb

e

-

-

-

-

-

NOM.

9.00 BSC

10.0 BSC

MIN.

A2

A1

D/E

M/N

A

0.15

MAX.

1.351.05

-

A1 BALL

IDENTIFIER

aaa

4X6

D

E

B

A

5(4X)

b

.05

.153

BCC A

e

N

e

M

C

4

ddd

bbb C

C

1A

A 2A


SIDE VIEW

0.10

1.20

0.350.30




106 FPGA-DS-02053-6.3


C

4

ddd

bbb C

CA

A 2A

1








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.40 0.45 05.0b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.20

0.15

NOM.

0.40 BSC

15.2 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

MAX.

2.00

- -

- -

0.65

A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)

b

.08

.153

BMM

CC A

e

S

N

S

e

M

BOTTOM VIEWTOP VIEW

SIDE VIEW

0.20

- -




FPGA-DS-02053-6.3 107


Cddd

Q4 C

A 4

A

bbb C

1A 2 A

AD

AC

AB

AL

e

3

b

BM.15 C

S

.30 M C A

Y

AF

AE

AA

W

T

U

V

M

N

P

R

S

M

B

G

H

J

K

C

D

E

F

A

A

e

N

4X6

aaa


(4X) 5

D A

E

B











4

5

6 IS OPTIONAL.

A-A SECTION VIEW

1.

3

2.

PER ANSI Y14.5M.

1.00

1.70

0.20

0.90

0.25

0.20

0.80

MAX.

A4

Q

ddd

bbb

aaa

e

--

0.10

-

-

0.25

-

-

-

1.27 BSC

-

b

S

M/N

D/E

A2

A1

A

SYMBOL

0.650.50

0.635 BSC

31.75 BSC

35.00 BSC

0.60

0.80

0.75

0.90

-

MIN. NOM.

-

-

-

BOTTOM VIEW

TOP VIEW

SIDE VIEW




108 FPGA-DS-02053-6.3



BILATERAL TOLERAN CE ZONE IS APPLIED

PLANE AR E DEFINED BY THE SPHERICAL


DIMENSIO N "b" IS MEASURED AT THE



IS OPTIONAL.


5

6

PER ANSI Y14.5M.

NOTES: UNLESS O THERWISE SPECIFIED

DIMENSIONS AND TOLERAN CES


2.

1.

3

0.35 0.40b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.15

NOM.

0.40 BSC

15.20 BSC

17.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

MAX.

1.76

0.30

- -

0.80

A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)M

N

e

b

.08

.153

BMM

CC A

S

e

C

4

ddd

bbb C

CA

A2A

1

0.35

- -

0.20

0.45




FPGA-DS-02053-6.3 109

104. 388-Ball BGA Package Dimensions in Millimeters

ddd4

1

C

C

bbb CCccc

AA

2A

SJ

3

b

e

A.30 C

.15 CM

S

B

e

V

AC

AD

AE

AF

W

Y

AA

AB

PN

R

T

U

K

L

M

N

13

M

202425

2632 12

2217

1819

61 4115

21 0111

81

F

E

G

H

B

C

D

A

4X6

C E

aaa


AD

B

(4X) 5

B











6

5

IS OPTIONAL.

2.

4

3

1.PER ANSI Y14.5M.

1.27 BSCe

0.20

0.35

0.25

0.20ddd

ccc

bbb

aaa

-

-

-

-

-

-

-

-

0.80

3.25

33.80

0.90

0.80

MAX.

M/N

D/E

B/C

A2

A1

A

SYMBOL

b

S 0.635 BSC

31.75 BSC

35.00 BSC

0.60

29.80

0.75

31.80

1.90

0.28

0.50

MIN.

2.80

0.54

0.65

NOM.

BOTTOM VIEWTOP VIEW

SIDE VIEW

76

54

32

M




110 FPGA-DS-02053-6.3


S

1.

2.


6

4

5

3

0.50 BSC

1.00 BSC

21.00 BSC

19.80

23.00 BSC

A







IS OPTIONAL.



--ccc

ddd

aaa

bbb

e

b

S

M/N

D/E

B/C

-

-

0.50

-

-

0.60

19.30

B

M

M

.103

.25C

C

4


Cddd

C

bbb C

e

b

S

Y

e

AB

AA

P

V

U

T

R

W

M

L

K

J

NN

SYMBOL

A

A2

A1

ccc C

MIN.

1.70

0.30

0.30

2.15

0.50

0.50

NOM.

64X

A

0.35

0.20

0.20

0.25

0.70

20.30

1

2.60

0.70

0.70

MAX.

2A

C E

A1 CORNER

INDEX AREA

2122 1720 91 81 141516 13

M

491012 11 578 6

G

F

E

D

C

H

3 2 1

A

B

(4X)aaa

B

D

5

B

ABOTTOM VIEW

TOP VIEW

SIDE VIEW

A

--




FPGA-DS-02053-6.3 111










IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.40 0.45 05.0b

0.80 BSC

aaa

ddd

ccc

e

-

-

-

-

-

-

0.20

0.15

NOM.

0.40 BSC

15.2 BSC

17.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

MAX.

1.70

0.35 -

- -

0.80

S

e

b

.08

.153

BMM

CC A

S

e

N

M

A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)

C

4

ddd

ccc C

CA

A2 A

1

2019

1817

1615

1413

12

1110

9

8

7

6

5

4

3

2

1

A

BC

D

E

F

G

HJ

KL

M

N

P

R

T

UV

WY

0.20

1.00 -




112 FPGA-DS-02053-6.3


NN

IS OPTIONAL.




6

5

4

3

2.

1.

3

b

e

0.70

2.60

25.80

0.20

0.70

0.35

0.25

0.20

0.70

MAX.

PER ANSI Y14.5M.







--bbb

ddd

ccc

-

-

-

-

0.30

23.80

0.50

e

aaa

b

S

M/N

D/E

B/C

A2

0.60

0.50 BSC

1.00 BSC

--

0.50

25.00 BSC

24.80

27.00 BSC

ccc

B.25 C


M.10 C

4

bbb

Cddd

C

C

Se

AF

AE

W

AD

AC

AB

AA

Y

V

U

T

R

P

1.70

0.30

MIN.SYMBOL

A1

A

C

2.15

0.50

NOM.

4X6

A

C

2AA 1

E

S

A1 CORNER

18

23

26 24

25

22 20

21 19

M

1416

17 15

12 10

13 11

A

G

M

L

K

J

H

F

E

D

C

B

IND EX AREA

5

8 6

9 7

4

3

2

1

5

aaa (4X)

D

B

A

B

BOTTOM VIEWTOP VIEW

SIDE VIEW

AM




FPGA-DS-02053-6.3 113


DIMENSIO NS AND TOLERANCES





PLANE ARE DEFINED B Y THE SPHERICAL




DIMENSIO N "b" IS MEASURED AT THE



5

6 IS OPTIONAL.

3

4

2.

1.

PER ANSI Y14.5M.

A-A SECTION VIEW

A4 0.10 --

0.20

0.25

0.20ddd

bbb

aaa

-

-

-

-

-

-

1.00

1.70

0.90

0.80

MAX.

M/N

D/E

A2

A1

A

e

Q

b

S

38.10 BSC

0.00 BSC

1.27 BSC

0.25

0.60

-

0.75

40.00 BSC

0.80

0.50

-

0.90

0.65

-

SYMBOL MIN. NOM.

-

4A

Q

2

Cddd

4 C

bbb C

AA 1

A

3

b

e

A

.15

.30

M C

M C

S

B

e

M

A S

N

A

4X6

aaaA1 BALL I.D.

IDENTIFIER

5(4X)

D A

E

B

AG

AK

AJ

AH

AL

AF

AE

AD

AC

V

Y

AB

AA

W

P

R

T

U

J

K

L

M

N

E

F

G

H

A

B

C

D

BOTTOM VIEW

TOP VIEW

SIDE VIEW




114 FPGA-DS-02053-6.3

109. 484-Ball caBGA Package (19 mm x 19 mm Body) Dimensions in Millimeters

M

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

21

A

BC

DE

F

G

HJ

K

LN

MN

P

R

T

U

VW

Y

AAAB

e

S

e

b

3 eee M C A BCfff M

A1 CORNERINDEX AREA aaa (4X)

5

D A

B

E

64X

ccc C

4

ddd CC

A2 A

A1




3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C

4. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.



7. JEDEC REFERENCE: MO-275A

SYMBOL

A

A1

A2

D/E

M/N

S

b

e

aaa

ccc

ddd

eee

fff

MIN. NOM. MAX.

1.70

0.25

0.65

19.0 BSC

16.8 BSC

0.40 BSC

0.40 0.45 0.50

0.80 BSC

0.15

0.20

0.20

0.15

0.08

S


SIDE VIEW




FPGA-DS-02053-6.3 115


S

1.

2.


6

4

5

3

0.50 BSC

1.00 BSC

21.00 BSC

19.80

23.00 BSC

A







IS OPTIONAL.



--ccc

ddd

aaa

bbb

e

b

S

M/N

D/E

B/C

-

-

0.50

-

-

0.60

19.30

B

M

M

.103

.25C

C

4


Cddd

C

bbb C

e

b

S

Y

e

AB

AA

P

V

U

T

R

W

M

L

K

J

NN

SYMBOL

A

A2

A1

ccc C

MIN.

1.70

0.30

0.30

2.15

0.50

0.50

NOM.

64X

A

0.35

0.20

0.20

0.25

0.70

20.30

1

2.60

0.70

0.70

MAX.

2A

C E

A1 CORNER

INDEX AREA

2122 1720 91 81 141516 13 491012 11 578 6

G

F

E

D

C

H

3 2 1

A

B

M

(4X)

aaa

B

D

5

B

ABOTTOM VIEW

TOP VIEW

SIDE VIEW

A

--




116 FPGA-DS-02053-6.3

111. 484-Ball fcBGA Package: Mach™-NX








IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

b

0.80 BSC

aaa*

ccc

bbb*

e

-

-

-

NOM.

0.40 BSC

16.80 BSC

19.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

-

0.27

MAX.

2.086 REF

- -

- 2.736

0.45 0.50 0.55

0.20

0.25

0.35

-

-

-

ddd 0.20JEDEC REFERENCE: JEP95 DR4.57.

* THESE VALUES ARE BASED ON SUBCON CAPABILITY

SIDE VIEW

TOP VIEW

BOTTOM VIEW




FPGA-DS-02053-6.3 117


R

ECN

.10

.25

IS OPTIONAL.




6

5

4

3

2.

3

1.

b

e

0.70

2.60

29.30

0.20

0.70

0.35

0.25

0.20

0.70

MAX.

PER ANSI Y14.5M.







--bbb

ddd

ccc

-

-

-

-

0.30

25.80

0.50

e

aaa

b

S

M/N

D/E

B/C

A2

0.60

0.50 BSC

1.00 BSC

--

0.50

29.00 BSC

27.55

31.00 BSC

M C


4

bbb

ddd C

C

C

AC B

S

A F

e

A K

A J

A H

A G

A A

A E

A D

A C

A B

Y

W

V

U

T

1.70

0.30

MIN.SYMBOL

A1

A

Cccc

2.15

0.50

NOM.

4X6

A1A

A2

27

S

30 28

29

INDEX AREA

1826 24 22 20

2325 21 19

16 14 12 10

17 15 13 11

M

C

J

P

N

M

L

K

H

G

F

E

D

8 6 4 2

59 7 3 1

A

B

A1 CORNER

aaa (4X)

B

D

5

B

A

6

OPTIONAL FEATURE

(HEAT SINK)

BOTTOM VIEWTOP VIEW

SIDE VIEW

M




118 FPGA-DS-02053-6.3









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.35 0.40 54.0b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.15

NOM.

0.40 BSC

20.0 BSC

23.0 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

S

0.25

MAX.

1.76

0.30

- -

0.80 -

M

A1 CORNERINDEX AREA

aaa

4X6

D

E

B

A

5(4X)

N

e

b

.08

.153

BMM

CC A

S

e

C

4

ddd

bbb C

CA

A2A

1

25

1826 24 22 20

2123 19

16 14 12 10

17 15 13 11

8 6 4 2

59 7 3 1

R

AF

AA

AE

AD

AC

AB

Y

WV

U

T

C

J

P

N

M

L

K

H

G

F

E

D

A

B

0.20

0.35

-




FPGA-DS-02053-6.3 119


NN

IS OPTIONAL.




6

5

4

3

2.

1.

3

b

e

0.70

2.60

25.80

0.20

0.70

0.35

0.25

0.20

0.70

MAX.

PER ANSI Y14.5M.







--bbb

ddd

ccc

-

-

-

-

0.30

23.80

0.50

e

aaa

b

S

M/N

D/E

B/C

A2

0.60

0.50 BSC

1.00 BSC

--

0.50

25.00 BSC

24.80

27.00 BSC

ccc

B.25 C


M.10 C

4

bbb

Cddd

C

C

Se

AF

AE

W

AD

AC

AB

AA

Y

V

U

T

R

P

1.70

0.30

MIN.SYMBOL

A1

A

C

2.15

0.50

NOM.

4X6

A

C

2AA 1

E

S

A1 CORNER

18

23

26 24

25

22 20

21 19

M

1416

17 15

12 10

13 11

A

G

M

L

K

J

H

F

E

D

C

B

IND EX AREA

5

8 6

9 7

4

3

2

1

5

aaa (4X)

D

B

A

B

BOTTOM VIEWTOP VIEW

SIDE VIEW

AM




120 FPGA-DS-02053-6.3


A C

MIN.

0.30

1.70

0.30

25.80

0.50

.25

.10


6

4

5

3

2.

1.

b

3

e

A










IS OPTIONAL.

PER ANSI Y14.5M.

S

bbb

ccc

ddd

e

b

aaa

B/C

D/E

M/N

A1

A2

4

Cddd

BCM A

CM

S

Cbbb

C

ccc

SYMBOL

C

e

A D

A E

A G

A H

A J

A K

A F

64X

2.602.15

0.50 BSC

1.00 BSC

-

-

-

-

-

-

-

0.60

-

0.25

0.35

0.20

0.70

0.20

31.00 BSC

29.00 BSC

27.55

0.50

0.50

29.30

0.70

0.70

A 2A

NOM. MAX.

1

A

28

S

29

30

5INDEX AREAA1 CORNER

15

22

25 23

2426

27 17

16

1921

20 18

M

8

91113

101214

37 5

2

F

P

T

U

V

W

Y

A B

A A

NR

G

H

K

L

M

N

J

B

A

1

D

E

C

aaa (4X)

B

EC

B

D A

BOTTOM VIEW

TOP VIEW

SIDE VIEW

6 4




FPGA-DS-02053-6.3 121

116. 676-Ball fcBGA Package Dimensions in Millimeters

A 1

ddd

DIMENSIONS AND TO LERANCES


DIMENSION "b" IS MEASURED AT THEMAXIMUM SOLDER BALL DIAMETER,

PRIMARY DATUM C AND SEATINGPLANE ARE DEFINED BY THE SPHERICAL




NOTES: UNLESS OTHERW ISE SPECIFIED



5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

- -aaa

ddd

ccc

bbb

-

-

-

-

-

0.20

-

M/N

b

e

S

D/E

B/C

A2

25.00 BSC

1.00 BSC

0.50 BSC

0.600.50 0.70

27.00 BSC

26.60

1.20 REF

26.55 26.65

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

2.902.55

0.40

MIN.

3.25

0.60

MAX.

A1 CORNER

A

C

2A

E

A

(4X)aaaINDEX AREA

B

D

5

B

64X

0.35

G

F

F/G 18.6018.55 18.65

NN

3

b

e

B.25 CM.10 C

S e

AF

AE

W

AD

AC

AB

AA

Y

V

U

T

R

P

S

18

23

26 24

25

22 20

21 19

M

1416

17 15

12 10

13 11

A

G

M

L

K

J

H

F

E

D

C

B

5

8 6

9 7

4

3

2

1

BOTTOM VIEWTOP VIEW

SIDE VIEW

AM

0.20

0.25




122 FPGA-DS-02053-6.3

117. 680-Ball fpBGA Package (with or without Internal Heat Spreader) Dimensions in Millimeters











6

5

IS OPTIONAL.

2.

4

3

1.PER ANSI Y14.5M.

1.00 BSCe

0.20

0.35

0.25

0.20ddd

ccc

bbb

aaa

-

-

-

-

-

-

-

-

0.80

30.80

0.70

0.70

2.60

MAX.

M/N

D/E

B/C

A2

A1

A

SYMBOL

b

S

30.3029.80

0.50 BSC

33.00 BSC

35.00 BSC

0.50

1.90

0.40

0.30

MIN.

2.25

0.60

0.50

NOM.

ddd4

1

Cbbb

C

C

Cccc

AA 2A

N

e

b

3

eS

M

.15

.30M

BCC

S

M

A

B

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

C

DE

FG

HJ

KL

MN

PR

TU

VW

YAA

ABAC

ADAE

AFAG

AHAJ

AKAL

AMAN

AP

EC

4X6

aaaA1 CORNERINDEX AREA

B

(4X)

D

5

A

B

OP TIO NAL FEATURE

6

(HEAT SINK)

BOTTOM VIEW

TOP VIEW

SIDE VIEW

A

0.60




FPGA-DS-02053-6.3 123

118. 680-Ball fpSBGA Package Dimensions in Millimeters

A-A SECTION VIEW

SEATING PLANE

C

bbb C

ddd

AA

DIM ENS IONS AND TOLERANCES

IS OPTIONAL.

PARAL LEL TO PRIMARY DA TUM C

PER ANS I Y14.5M.

CROWNS OF THE SOLDER BALL S.

ALL DIMENS IONS A RE IN M ILL IM ETERS.

BILATER AL TOLERANCE ZONE IS A PPLIED

PLANE A RE DEFINED BY THE SPHERICAL


EXA CT SHAPE A ND SIZE OF THIS FEATURE

MA XIM UM S OLDER BALL DIA METER,

DIM ENS ION "b" IS MEASURED AT THE

TO EACH S IDE OF THE PACKAGE BODY.

NOTES: UNLESS OTHERWISE SPECIF IED

5

6

4

1.

3

2.

b

3 C

C

.10

.25

M

M B

A

e

0.00 BSCS

1.00 BSC

0.10A4

bbb

ddd

aaa

-

-

-

e

Q

b

0.25

0.50

--

-

-

-

0.25

0.20

0.20

-

0.65

-

0.80

38.00 BSC

40.00 BSC

0.45A1

D/E

M/N

A2 0.90

SYMBOL

A -

MIN.

0.600.53

0.98

NOM.

- 1.70

MAX.

Q

4A

A

1A

A 2A

4X

S

AN

AWAV

e

AU

ARAT

AP

AG

AL

AJ

AM

AK

AH

AE

AC

AF

AD

AB

6

4

2238 36 34 32 30 28 26 24

S

3139 37 35 33 2729 25 23

aaa

20 18 16 14 12 10 8 6 4 2

131721 19 15 11 9 7 5

JK

R

W

U

Y

V

T

N

N

L

P

M

D

G

E

H

F

C

A

3 1

B

A1 B ALL I.D.

IDENTIFIER

M

(4X) 5

DB

E

A

BOTTOM VIEWTOP VIEW

SIDE VIEW

A

1.05




124 FPGA-DS-02053-6.3









IS OPTIONAL.


5

6

PER ANSI Y14.5M.




2.

1.

3

0.35 0.40 54.0b

0.80 BSC

aaa

ddd

bbb

e

-

-

-

-

-

-

0.12

0.15

NOM.

24.80 BSC

27.00 BSC

MIN.SYMBOL

A2

A1

D/E

M/N

A

0.25

MAX.

1.76

0.30

- -

0.80 -

6

5

4

3

0.40 BSCS

A1 CORNERINDEX AREA

aaa

4X

D

E

B

A

(4X)

A

AA

M

e

b

.08

.15 BMM

CC A

e

N

S

Cddd

bbb C

C

2

1

0.35

-

0.20




FPGA-DS-02053-6.3 125


RECN

.10

.25

IS OPTIONAL.




6

5

4

3

2.

3

1.

b

e

0.70

2.60

29.30

0.20

0.70

0.35

0.25

0.20

0.70

MAX.

PER ANSI Y14.5M.



BILATERAL TO LERANCE ZONE IS APPLIED


MAXIMUM SO LDER BALL DIAMETER,DIMENSION "b" IS MEASURED AT THE


--bbb

ddd

ccc

-

-

-

-

0.30

25.80

0.50

e

aaa

b

S

M/N

D/E

B/C

A2

0.60

0.50 BSC

1.00 BSC

--

0.50

29.00 BSC

27.55

31.00 BSC

M C


4

bbb

ddd C

C

C

AC B

S

AF

e

AK

AJ

AH

AG

AA

AE

AD

AC

AB

Y

W

V

U

T

1.70

0.30

MIN.SYMBOL

A1

A

Cccc

2.15

0.50

NOM.

4X6

A1A

A2

27

S

30 28

29

INDEX AREA

1826 24 22 20

2325 21 19

16 14 12 10

17 15 13 11

M

C

J

P

N

M

L

K

H

G

F

E

D

8 6 4 2

59 7 3 1

A

B

A1 CORNERaaa (4X)

B

D

5

B

A


SIDE VIEW

M




126 FPGA-DS-02053-6.3

121. 1020-Ball Organic fcBGA Package Dimensions in Millimeters

A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

- -aaa

ddd

ccc

bbb

-

-

-

-

-

0.20

0.35

-

M/N

b

e

S

D/E

B/C

A2

31.00 BSC

1.00 BSC

0.50 BSC

0.600.50 0.70

33.00 BSC

32.00

1.24 REF

31.10 32.90

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

3.122.52

0.30

MIN.

3.82

0.70

MAX.

A1 CORNER

b

e

S

S

e

A

C

2A

E

A

(4X)aaaINDEX AREA

B

D

5

B

3 .10.25 AC B

M C

4

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

13

2

31

32

A

AA

AF

AH

AK

AJ

AG

AB

AD

AE

AC

L

T

NV

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

AM

AL

64X

BOTTOM VIEWTOP VIEW

SIDE VIEW

M

0.25

0.20




FPGA-DS-02053-6.3 127

122. 1020-Ball Organic fcBGA Package Rev. 2 Dimensions in Millimeters

A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

- -aaa

ddd

ccc

bbb

-

-

-

-

-

0.20

-

M/N

b

e

S

D/E

B/C

A2

31.00 BSC

1.00 BSC

0.50 BSC

0.600.50 0.70

33.00 BSC

32.60

1.20 REF

32.40 32.80

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

2.902.55

0.40

MIN.

3.25

0.60

MAX.

A1 CORNER

b

e

S

S

e

A

C

2A

E

A

(4X)aaaIND EX AREA

B

D

5

B

3 .10.25 AC B

M C

4

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

13

2

31

32

A

AA

AF

AH

AK

AJ

AG

AB

AD

AE

AC

L

TN

V

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

AM

AL

64X

0.35

G

F

F/G 24.6024.50 24.70

102 0X

BOTTOM VIEW

TOP VIEW

SIDE VIEW

M

0.20

0.25




128 FPGA-DS-02053-6.3

123. 1036-Ball ftSBGA Package Dimensions in Millimeters

Cbbb



DIMENSIO N "b" IS MEASURED AT THEMAXIMUM SOLDER BALL DIAMETER,


PRIMARY DATUM C AND SEATINGPLANE AR E DEFINED BY THE SPHERICAL

BILATERAL TOLERAN CE ZONE IS APPLIED




DIMENSIO NS AND TOLERANCES

6

5

IS OPTIONAL.

4

3

2.

1.PER ANSI Y14.5M.

A-A SECTION VIEW

Q

4

A4

--0.25Q

ddd

aaa

bbb

A4

-

-

-

0.10

- 0.20

- 0.35

- -

-A 1.80

M/N

b

e

S

A2

D/E

A1

43.00 BSC

0.65

1.00 BSC

0.50 BSC

0.50 0.80

0.55

0.98

45.00 BSC

0.90

0.40

1.10

0.70

SYMBOL

C

ddd C

NOM.MIN. MAX.

3

b

e

S

CM.30 A.10 CM

B

A

S

M

A

e

4X6

A

N

12A A

E

A

aaa

A

IDENTIFIERA1 BALL I.D.

5

(4X)

DB

C

E

G

J

L

N

R

U

W

AA

AC

AE

AG

AJ

AL

AN

AR

AU

AW

BA

BC

B

D

F

H

K

M

P

T

V

Y

AB

AD

AF

AH

AK

AM

AP

AT

AV

AY

BB

BD

-


SIDE VIEW

0.20-




FPGA-DS-02053-6.3 129

124. 1152-Ball Organic fcBGA Package Option 1: LatticeSC/SCM40


A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

- -aaa

ddd

ccc

bbb

-

-

-

-

-

0.20

-

M/N

b

e

S

D/E

B/C

A2

33.00 BSC

1.00 BSC

0.50 BSC

0.600.50 0.70

35.00 BSC

34.50

1.20 REF

34.25 34.75

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

2.902.55

0.35

MIN.

3.25

0.65

MAX.

A1 CORNER

b

e

S

S

e

A

C

2A

E

A

(4X)aaaIND EX AREA

B

D

5

B

3 .10.25 AC B

M C

4

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

13

2

31

32

A

AA

AF

AH

AK

AJ

AG

AB

AD

AE

AC

L

T

NV

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

AM

AL

64X

0.35

33

34

AP

AN

26.6 REF

26

.6 REF

(115 2X)

BOTTOM VIEW

TOP VIEW

SIDE VIEW

M

0.20

0.25




130 FPGA-DS-02053-6.3

125. 1152-Ball Organic fcBGA Package Option 2: LatticeSC/SCM80 & SC/SCM115


A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

-aaa

ddd

ccc

bbb

-

-

-

-

-

0.23

-

M/N

b

e

S

D/E

B/C

A2

33.00 BSC

1.00 BSC

0.50 BSC

0.600.50 0.70

35.00 BSC

34.60

1.20 REF

34.30 34.90

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

3.152.80

0.35

MIN.

3.50

0.65

MAX.

A1 CORNER

b

e

S

S

e

A

C

2A

E

A

(4X)aaa

INDEX AREA

B

D

5

B

3 .10

.25 AC B

M C

4

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

13

2

31

32

A

AA

AF

AH

AK

AJ

AG

AB

AD

AE

AC

L

T

NV

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

AM

AL

64X

0.35

33

34

AP

AN

(11 52X)

6

A1 CORNERINDEX AREA

6

BOTTOM VIEW

TOP VIEW

SIDE VIEW

M

0.20

0.25

-




FPGA-DS-02053-6.3 131

126. 1152-Ball Ceramic fcBGA Package Dimensions in Millimeters

A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

-aaa

ddd

ccc

bbb

-

-

-

-

-

0.20

0.35

-

M/N

b

e

S

D/E

B/C

A2

33.00 BSC

1.00 BSC

0.50 BSC

0.600.50

35.00 BSC

34.00

1.40 REF

33.10

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

4.604.00

0.30

MIN.

5.20

0.70

MAX.

4

b

e

S

S

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

A

AA

e 64X

AF

AH

AK

AJ

AG

AB

AD

AE

AC

A

L

T

NV

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

C

2A

E

A

(4X)aaa

13

2

B

D

5

B

3 .10

.25 AC B

M C

3133

34 32

AM

AN

AP

AL

A1 CORNER

INDEX AREABOTTOM VIEWTOP VIEW

SIDE VIEW

M

34.90

0.70

0.20

0.25

-




132 FPGA-DS-02053-6.3


ECN

e

ddd











6

5

IS OPTIONAL.

2.

4

3

1.PER ANSI Y14.5M.

b

3

eS

M

.10

.25M

BCC

4

1.00 BSCe

0.20

0.35

0.25

0.20ddd

ccc

bbb

aaa

-

-

-

-

-

-

-

-

0.80

30.80

0.70

0.70

2.60

MAX.

1

M/N

D/E

B/C

A2

A1

A

SYMBOL

b

S

30.3029.80

0.50 BSC

33.00 BSC

35.00 BSC

0.50 0.60

1.90

0.40

0.30

MIN.

2.25

0.60

0.50

NOM.

Cbbb

C

C

Cccc

4X6

AA 2A

S

M

A

B

1

2


B

(4X)

D

5

A

B

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

C

DE

FG

HJ

KL

MN

PR

TU

VW

YAA

ABAC

ADAE

AFAG

AHAJ

AKAL

AMAN

AP

Note: Depopulated ball locations areM12, M23, AC12, and AC23.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

A




FPGA-DS-02053-6.3 133












6

5

IS OPTIONAL.

2.

4

3

1.PER ANSI Y14.5M.

1.00 BSCe

0.20

0.35

0.25

0.20ddd

ccc

bbb

aaa

-

-

-

-

-

-

-

-

0.80

30.80

0.70

0.70

2.60

MAX.

M/N

D/E

B/C

A2

A1

A

SYMBOL

b

S

30.3029.80

0.50 BSC

33.00 BSC

35.00 BSC

0.50 0.60

1.90

0.40

0.30

MIN.

2.25

0.60

0.50

NOM.

ddd4

1

Cbbb

C

C

Cccc

AA 2A

N

e

b

3

eS

M

.10

.25M

BCC

S

M

A

B

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

C

DE

FG

HJ

KL

MN

PR

TU

VW

YAA

ABAC

ADAE

AFAG

AHAJ

AKAL

AMAN

AP

EC

4X6


B

(4X)

D

5

A

B

BOTTOM VIEW

TOP VIEW

SIDE VIEW

A




134 FPGA-DS-02053-6.3

129. 1704-Ball Organic fcBGA Package Dimensions in Millimeters

A 1

ddd











5

6 IS OPTIONAL.

PER ANSI Y14.5M.

4

3

2.

1.

4

-aaa

ddd

ccc

bbb

-

-

-

-

-

0.23

-

M/N

b

e

S

D/E

B/C

A2

42.50 BSC

1.00 BSC

0.50 BSC

0.600.50

42.50 BSC

42.00

1.20 REF

41.70 42.30

SYMBOL

A

A1

ccc

C

C

bbb CC

NOM.

0.50

2.902.55

0.35

MIN.

3.25

0.65

MAX.

A1 CORNER

b

e

S

S

e

A

C

2A

E

A

(4X)aaa

INDEX AREA

B

D

5

B

3 .10.25 AC B

M C

64X

0.35

4

29

30 16

2327 25

82 62 24

21 1719

2022 18

M

10

1315 11

14 12

79 5

8 6

13

2

31

32

33

34

35

36

37

38

39

40

41

42

A

AA

AF

AH

AK

AJ

AG

AB

AD

AE

AC

L

T

N

V

Y

W

U

M

P

R

N

F

H

K

J

G

B

D

E

C

AM

AL

AP

AN

AT

AR

AV

AU

AY

AW

BB

BA

(1704X)

BOTTOM VIEW

TOP VIEW

SIDE VIEW

M

0.70

0.20

0.25

-




FPGA-DS-02053-6.3 135

130. 1704-Ball Ceramic fcBGA Package Dimensions in Millimeters

AV

PACKAGE BODY INCLUDES SUBSTRA TE AND LID.

bbb




PRIMARY DATUM C AND SEATINGPLANE ARE DEF INED BY THE SPHERICAL




NOTES: UNLESS OTHERWISE SPECIF IED



IS OPTIONAL.6

4

5

3

PER ANSI Y14.5M.

2.

1.

3

4ddd C

C

C.10 M.25 M A B

b S

ddd

ccc

-

-

-

-

0.20

0.35

2

SYMBOL

M/N

e

aaa

bbb

b

S

D/E

A2

A

A1

41.00 BSC

0.50 BSC

1.00 BSC

-

-

-

-

0.50

0.20

0.25

0.70

42.50 BSC

1.30

4.30

0.30

MIN.

4.80

0.50

NOM.

1.90

5.30

0.70

MAX.

ccc C

C

C

e

B B

AY

AW

B A

4X 6

A 1

AA

A1 BALL I.D.

IDENTIFIER

1 0

e

S

2 7

3 64 04 2

4 1 3 9

3 8

3 7 3 1

3 2

3 5

3 4

3 3

03 82

2 9

1 8

2 3

2 6

2 5

2 4

1 92 1

2 2 2 0

M

1 4

1 51 7

1 6

1 11 3

1 2

H

AC

AL

AT

AR

AU

AP

AM

AN

AG

AH

AK

AJ

AF

AD

AE

T

AA

AB

Y

N

V

W

U

M

P

R

N

L

K

J

A

F

G

E

B

D

C

17

6

9

8

3

2

5

4

aaa (4X)

5

D A

E

B

MAXIMUM OFFSET: 0.20 mm

BOTTOM VIEWTOP VIEW

SIDE VIEW

1.60

0.60




136 FPGA-DS-02053-6.3

Appendix A. Package Archive

32-Pin QFN (Punch Singulated) Package Dimensions in Millimeters




FPGA-DS-02053-6.3 137

Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport.


http://www.latticesemi.com/techsupport



138 FPGA-DS-02053-6.3

Revision History

Revision 6.3, April 2021

Section Change Summary

44-Pin TQFP Package Removed (1.0 mm thick)

44-Pin LQFP Package Changed TQFP to LQFP. Removed (1.4 mm thick)

48-Pin TQFP Package Removed (1.0 mm thick)

48-Pin LQFP Package Removed (1.4 mm thick)

64-Pin LQFP Package Changed TQFP to LQFP.

100-Pin LQFP Package Option 1: MachXO2, MachXO™, ispMACH® 4000

Changed TQFP to LQFP.




Revision 6.2, March 2021


— Removed 48-Pin QFN Package Option 1.

48-Pin QFN Package: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2

Removed Option 2 from heading.

Revision 6.1, January 2021


36-Ball WLCSP Package Option 2: MachXO2, MachXO3™

Added MachXO2.

36-Ball WLCSP Package Option 3: CrossLink™

Added ball labels and changed LIFMD to CrossLink.

72-Pin QFN Package Option 1: CrossLink™-NX

Indicated Pin 1.

72-Pin QFN Package Option 2: MachXO3D

Indicated Pin 1.

Multiple Restored labels that indicate top. bottom, and side views in the following packages:

36-Ball ucBGA Package

81-Ball csfBGA Package

237-Ball ftBGA Package

256-Ball ftBGA Package Option 1: ispMACH 4000, MachXO, LatticeXP2

285-Ball csfBGA Package

484-Ball caBGA Package (19 mm x 19 mm Body)

Multiple Corrected alignment of pin order labeling.

Revision 6.0, December 2020


All Updated document template.

196-Ball caBGA Package Added 196-Ball caBGA Package.

484-Ball fcBGA Package for Mach-NX

Added 484-Ball fcBGA Package: Mach™-NX.




FPGA-DS-02053-6.3 139

Revision 5.9, August 2020


All Added table of contents

Changed WLCS Package to WLCSP Package in all heading.

Moved Disclaimers to second page.

30-Ball WLCSP Package Corrected the 30-Ball WLCSP Package sD and sE values. Fixed heading typo.

72-Pin WLCSP Package: CrossLink-NX

Added 72-Pin WLCSP Package: CrossLink-NX.

121-Ball csBGA Package Updated D and E dimension lines in 121-Ball csBGA Package.



36-Ball ucBGA Package Removed Option 1 from 36-Ball ucBGA Package heading.

48-Pin LQFP Package (1.4 mm thick)

Changed 48-Pin TQFP Package (1.4 mm thick) heading to 48-Pin LQFP Package (1.4 mm thick).

Multiple Specified device(s) in the following packages:

48-Pin QFN Package Option 1: L-ASC10, iCE40 LP, iCE40 UltraPlus, MachXO2

72-Pin QFN Package Option 1: CrossLink™-NX


289-Ball csBGA Package (9.5 mm x 9.5 mm Body).

Added 289-Ball csBGA Package (9.5 mm x 9.5 mm Body).

Revision 5.7, November 2019


48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2

Updated 48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2. Revised values for Lead Width (b) and Bottom Pad (E2, D2).


Added 72-Pin QFN Package Option 2: MachXO3D.

Disclaimers Added this section.



All Changed document ID from pkg to FPGA-DS-02053. When downloaded from the Lattice website, the PDF file name is now FPGA-DS-02053-<X-X>-Package-Diagrams.pdf (previously PackageDiagrams.pdf).

72-Pin QFN Package Added 72-Pin QFN Package.



80-Ball ckfBGA Package Added 80-Ball ckfBGA Package.




140 FPGA-DS-02053-6.3



100-Pin TQFP Package Option 1: MachXO2, MachXO™, ispMACH® 4000

Added ispMACH 4000 to 100-Pin TQFP Package Option 1: MachXO2, MachXO™, ispMACH® 4000.

121-Ball caBGA Package (9 mm x 9 mm Body)

Added 121-Ball caBGA Package (9 mm x 9 mm Body).



32-Pin QFN Package Updated “32-Pin QFNS Package” headings to “32-Pin QFN Package”.

32-Pin QFN Package Option 3: MachXO2 SG32C

Added 32-Pin QFN Package Option 3: MachXO2 SG32C.

30-Ball WLCSP Package Added 30-Ball WLCSP Package.


Added iCE40 UltraPlus and MachXO2 to 48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2.


Revision 5.2, June 2016


285-ball csfBGA Package Updated 285-ball csfBGA package outline drawing.

36-Ball WLCSP Package Option 3: LIFMD

Added 36-Ball WLCSP Package Option 3: LIFMD.


Fixed typo in 48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra, iCE40 UltraPlus, MachXO2.

64-Ball ucfBGA Package Added 64-Ball ucfBGA Package.


Added 72-Pin QFN Package Option 2: MachXO3D.

81-Ball csfBGA Package Added 81-Ball csfBGA Package.

Revision 5.1, February 2015


36-Ball ucfBGA Package: iCE40 Ultra

Added 36-Ball ucfBGA Package: iCE40 Ultra.

36-Ball ucBGA Package Option 1 Updated 36-Ball ucBGA Package heading to 36-Ball ucBGA Package Option 1.

48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra

Updated 48-Pin QFN Package Option 2: L-ASC10 heading to 48-Pin QFN Package Option 2: L-ASC10, iCE40 Ultra.



16-Ball WLCSP Package Option 2: iCE40 UltraLite

Added 16-Ball WLCSP Package Option 2: iCE40 UltraLite.

16-Ball WLCSP Package Option 1: iCE40 LP

Updated 16-Ball WLCSP Package heading to 16-Ball WLCSP Package Option 1: iCE40 LP.




FPGA-DS-02053-6.3 141

Revision 4.9, October 2014


48-Pin QFN Package Updated 48-Pin QFN Package heading and moved the section after 48-Pin QFN Package Option 1 (previously Option 2).



— Removed 20-Ball WLCSP Package.



121-Ball csfBGA Package Updated 121-Ball csfBGA Package. Revised M/N dimension.

Revision 4.6, September 2014


84-Pin QFN Package Updated 84-Pin QFN Package. Revised pin numbers from A36 and B27 to A37 and B28.



16-Ball WLCSP Package Updated 16-Ball WLCSP Package. Changed second E to e in REF. column.

36-Ball WLCSP Package Option 1: iCE40 Ultra

Updated 36-Ball WLCSP Package Option 1: iCE40 Ultra heading.

36-Ball WLCSP Package Option 2: MachXO3

Added 36-Ball WLCSP Package Option 2: MachXO3.







84-Pin QFN Package Updated 84-Pin QFN Package. Revised dimension “b” maximum value.

256-Ball ftBGA Package Option 1: ispMACH 4000, MachXO, LatticeXP2

Updated 256-Ball ftBGA Package Option 1: ispMACH 4000, MachXO, LatticeXP2. Revised dimension “A” values.



48-Pin QFN Package Updated 48-Pin QFNS Package to 48-Pin QFN Package.

48-Pin QFN Package Option 2 Added 48-Pin QFN Package Option 2.


237-Ball ftBGA Package Added 237-Ball ftBGA Package.







142 FPGA-DS-02053-6.3



All Restored references to indicate top. bottom, and side views.






100-Pin TQFP Package Option 1: MachXO2, MachXO

Added "1" and "N" characters to 100-Pin TQFP Package Option 1: MachXO2, MachXO diagram (Top View).



16-ball WLCSP Package Added 16-ball WLCSP package.

25-Ball WLCSP Package (0.40 mm Pitch)

Revised 25-Ball WLCSP Package title to 25-Ball WLCSP Package (0.40mm Pitch).

25-Ball WLCSP Package (0.35 mm Pitch)

Added 25-Ball WLCSP Package (0.35mm Pitch).

All Added references to indicate top. bottom, and side views.



144-pin TQFP Package Revised 144-pin TQFP package diagram.



184-ball csBGA Package. Added 184-ball csBGA package.



32-pin QFNS Option 1 Added iCE40 to the list of applicable products for the 32-pin QFNS Option 1 package.



324-ball ftBGA Package Revised 324-ball ftBGA package drawing.



iCE40 100-Pin VQFP Package Option 2

Nomenclature change – “iCE40 100-Pin TQFP Package Option 2” changed to “iCE40 100-Pin VQFP Package Option 2”.




FPGA-DS-02053-6.3 143



Multiple Added 36-ball ucBGA, 49-ball ucBGA, 81-ball ucBGA, 81-ball csBGA, 84-pin QFN, 100-pin TQFP Option 2, 121-ball csBGA, 121-ball ucBGA, 132-ball csBGA Option 2, 196-ball csBGA, 225-ball ucBGA, 284-ball csBGA packages.

Revision 3.4, July 2012


676-ball fcBGA Package Added 676-ball fcBGA package.



Appendix A Added new 32-Pin QFNS Package Option 2 for MachXO2. Moved 32-pin QFN (punch singulated) package drawing to new Package Archive Appendix.



All Updated document with new corporate logo.



Multiple Updated WLCSP package offering.



Multiple Added 49-ball WLCSP package and updated 25-ball WLCSP package.



328-ball csBGA Package Added 328-ball csBGA package.

Revision 2.8, July 2011


Multiple Included revised diagrams for the following packages: 56-ball csBGA, 100-ball csBGA and 132-ball csBGA. Added new 256-ball ftBGA Option 3 package.

Revision 2.7, May 2011


256 ftBGA Option 1 Package Added MachXO2 to the list of applicable products for the 256 ftBGA Option 1 package outline.



Multiple Added 25-ball WLCSP and 332-ball caBGA package drawings. Revised 100-pin PQFP, 120-pin PQFP, 128-pin PQFP, 160-pin PQFP and 208-pin PQFP package drawings. Removed obsolete packages including 144-, 240- and 304-pin PQFP packages.




144 FPGA-DS-02053-6.3



208-ball ftBGA Package Added 208-ball ftBGA package.



Multiple Revised maximum coplanarity values on Organic 1152 Flip Chip BGA – Option 2 and on Organic 1704 Flip Chip BGA from 0.20 mm to 0.23 mm.



Multiple Added new 1020-ball Organic fcBGA rev.2, 1152-ball Organic fcBGA, and 1704-ball Organic fcBGA package drawings. Removed obsolete 492-Ball BGA package.



256-Ball caBGA Package Revised 256-ball caBGA nominal solder ball diameter from 0.5 mm to 0.45 mm to better match actual dimension.



256-ball caBGA Package Revised 256-ball caBGA package to specify correct JEDEC reference number.

Revision 2.0, May 2009


Multiple Added new 256-ball caBGA and 256-ball ftBGA (Option A) packages.



Multiple Added 24-pin QFNS package diagram. Removed discontinued and obsolete packages (16 SOIC, 20 SOIC, 24 SOIC, 28 SOIC, 16 PDIP, 240 MQFP, 269 fcBGA, 304 MQFP, 600 SBGA).



Multiple Added 32-pin QFNS, 48-pin QFNS and 64-pin QFNS package diagrams.



Multiple Added 64-ball ucBGA and 132-ball ucBGA package diagrams.



Multiple Added 64-ball csBGA and 144-ball csBGA package diagrams.




FPGA-DS-02053-6.3 145



1152-ball fpBGA Package Added 1152-ball fpBGA package diagram.



1036 ftSBGA Package Revised 1036 ftSBGA package diagram. Removed 1036 fpSBGA.



1036 ftSBGA Package Added 1036 ftSBGA package diagram.



1704 fcBGA Package Revised 1704 fcBGA package drawing: removed lid dimension, clarified package body dimension as the combination of substrate and lid.



Multiple Added Marking Orientation text for all TQFP packages (1.0 mm and 1.4 mm thick).



Multiple Added 64-pin TQFP and 1704-ball fcBGA package diagrams.


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