cx900e hardware

CX900e HardwareReference Manual

Part #: 3006M100-002

Date: June 2000

PROPRIETARY NOTICE

This publication contains information proprietary and confidential to Memotec Communications Inc. Any reproduction, disclosure or unauthorized use of this publication is expressly prohibited except as Memotec Communications Inc. may otherwise authorize in writing.

Memotec Communications Inc. reserves the right to make changes without notice in product or component design as warranted by evolution in user needs or progress in engineering or manufacturing technology. Changes which affect the operation of the unit will be documented in the next revision of the manual.

© 2000 Memotec Communications Inc.

Printed in Canada

Memotec Communications Inc.600 McCaffrey Street,Montreal, QuebecCANADA H4T 1N1

Tel.: (514) 738-4781FAX:(514) 738-4436Website: http://www.memotec.com

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WARRANTY

Memotec warrants each new Product sold by Memotec will be free from defective material and workmanMemotec agrees to remedy in accordance with terms specified below any such defect which is disclosedconditions of normal installation, use and service. To exercise the warranty the Distributor/Business Partnany person or corporation which purchases such Product from the Distributor/Business Partner ("end-usedeliver the product intact for examination, with all transportation charges prepaid, to the facility designateMemotec.

The specific terms of the warranty are as follows:

1. The warranty period commences on the date the unit is shipped by Memotec;

2. The warranty applies to the Distributor/Business Partner, provided however, that when Distor/Business Partner resells any Products, pursuant to its rights hereunder, the said warranapply to any end-users which purchase such Products from Distributor/Business Partner;

3. Memotec will be responsible for both material and labour required to effect all repairs undeterms of the warranty for a warranty period of twelve (12) months (North America), fifteen (months (International), from the date of shipment of the Product by Memotec, providing this returned to Memotec as specified above; and

4. During the warranty period, the Distributor/Business Partner or end-user may return defecparts for replacement at no charge, in lieu of returning the complete Product.

This warranty does not apply if :

1. the Product has been modified by the Distributor/Business Partner or end-user or subjectemisuse, neglect, or accident, or

2. the Product has been repaired or altered by an unauthorized service depot so that its perfoor reliability has been impaired, or

3. the Product has had the serial number altered, effaced or removed, or

4. the Product has been damaged by accessories peripherals, and/or other attachments not by Memotec.

Software is warranted to substantially conform to Memotec’s specifications for a period of ninety (90) daythe date of delivery. Memotec’s sole obligation under this warranty shall be limited to using its best effortcorrect such Software as soon as practical after Distributor/Business Partner or end-user has notified Mesuch defects. Memotec does not warrant that operation of any of the Software shall be uninterrupted or eor that functions contained in the licensed Software shall operate in combinations which may be selectedby the Distributor’s/Business Partner or end-user or meet the Distributor’s/Business Partner’s or end-userequirements. No warranty shall apply to any Software that is modified without Memotec’s written conse

This warranty is in lieu of all other warranties, expressed or implied and no representative or person is auto assume for Memotec any other liability in connection with the sale of the Product and Software.

IN NO EVENT SHALL MEMOTEC BE LIABLE, WHETHER IN CONTRACT OR IN TORT OR ON ANY OTHER BASIS, FOR ANY DAMAGES SUSTAINED BY THE DISTRIBUTOR/ BUSINESS PARTNER ORANY OTHER PERSON ARISING FROM OR RELATED TO LOSS OF USE, FAILURE OR INTERRUPTION IN OPERATION OF ANY PRODUCTS, OR DELAY IN MAINTENANCE OR FOR INCIDENTAL, CONSEQUENTIAL, INDIRECT OR SPECIAL DAMAGES OR LIABILITIES , OR FOR LOSS OF REVENUE, LOSS OF BUSINESS OR OTHER FINANCIAL LOSS ARISING OUT OF OR IN CONNECTION WITH THE SALE, LEASE, MAINTENANCE, USE PERFORMANCE, FAILURE OR INTERRUPTION OF THE PRODUCTS.

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FEDERAL COMMUNICATIONS COMMISSION (FCC) NOTIFICATIONS

Part 15 Advisements: This equipment has been tested and found to comply within the limits for a Clasdigital device, pursuant to Part 15 of the FCC Rules. These limits are designed tprovide reasonable protection against harmful interference when the equipment operated in a commercial environment. This equipment generates, uses, and caradiate radio frequency energy and, if not installed and used in accordance with instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference atown expense.

Changes or modifications not expressly approved by Memotec Communicationscould void the users’ authority to operate the equipment.

Shielded cables must be used for the serial port line interface drivers to ensure continued compliance with FCC emission requirements. All cables are available Memotec Communications Inc.

Ferrites must be installed on certain cables for compliance with radiated Radio Frequency emissions limits. Please see “Attaching Electromagnetic Interference(EMI) Filters” on pag e20 - 27 for more information.

NOTE:

Please read and comply with the attached FCC Part 68 Advisement if you have included one or more of the following in your CX900e configuration: CSU/DSU, V.34 modem, Analog Voice I/O card (with FXO interface), DAV I/O card (with FXOinterface), and the T1 I/O card.

Part 68 Advisements: The CX900e complies with Part 68 of the FCC Rules. The FCC registration numand Ringer Equivalence Number (REN) are indicated below and on the label attato the bottom of the chassis cover. Upon request, the user shall provide the FCCregistration number and ringer equivalence to the telephone company.

FCC Registration No.: 2PDCAN-23858-DE-N

Ringer Equivalence Number (REN):

0.9B (V.34 Modem), 0.4B (FXO), 0.1B (DAV FXO

Service Order Codes: 6.0Y, 9.0F

Facility Interface Codes and USOC Jacks:

I/O Card Facility CodesUSOC Jack

Analog Voice (FXO) 02LS2, 02GS2 RJ11C

DAV FXO 02LS2 RJ11C

V.34 Modem 02LS2 RJ11C

56K CSU/DSU 04DU5-19, 04DU5-24, 04DU5-48, 04DU5-56, 04DU5-96 RJ48S

64K CSU/DSU04DU5-19, 04DU5-24, 04DU5-48, 04DU5-56, 04DU5-64, 04DU5-96

RJ48S

T1/E1 04DU9-1SN RJ48C

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This equipment is designed to be connected to a telephone network or premiseswiring using a cable with a compatible plug and modular jack which are FCC Pacompliant. See installation instructions (in this manual) for details on hardware connection.

The number of devices which may be connected to one telephone line is determby summing the RENs of the devices. This sum must not exceed 5.

If the CX900e should cause harm to the telephone network, the telephone compwill notify you (the customer) in advance (as soon as is practical or possible) thatemporary discontinuance of service may be required. Also, you will be advised your right to file a complaint with the FCC if you believe it is warranted.

The telephone company may make changes in its facilities, equipment, operatioprocedures that could affect the operation of the CX900e. If this happens, the telephone company will provide advance notice in order for you to make necessmodifications to maintain uninterrupted service.

If you encounter problems or have trouble with the CX900e and require service owarranty information, please contact:

Memotec Communications Inc.

1-800-766-7782

If problems arise such that the CX900e causes harm to the telephone network, ttelephone company may request that you disconnect the equipment until the prois resolved.

The CX900e cannot be used on public coin phone service provided by the telephcompany. Connection to party line service is subject to state tariffs. Contact the spublic utility commission, public service commission or corporation commission fadditional information.

NOTE:

FCC requires the user/customer to complete the Affidavit For Connection To DigServices (a copy is located in Appendix A) and to give the affidavit to the local exchange carrier (telephone company). This affidavit affirms that the CX900e is transmitting encoded analog content or billing information, or that the CX900e oumeets Part 68 content specifications when connected to a 1.544 Mbps or subratdigital service.

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INDUSTRY CANADA (IC) NOTIFICATIONS

CP-01 Advisements: NOTICE: The Industry Canada label identifies certified equipment. This certificameans that the equipment meets certain telecommunications network protectiveoperational and safety requirements. Industry Canada does not guarantee the equipment will operate to the users’ satisfaction.

Before installing this equipment, users should ensure that it is permissible to be connected to the facilities of the local telecommunications company. The equipmmust also be installed using an acceptable method of connection. The customer should be aware that compliance with the above conditions may not prevent degradation of service in some situations.

Repairs to certified equipment should be made by an authorized Canadian maintenance facility designated by the supplier. Any repairs or alterations made the user to this equipment, or equipment malfunctions, may give the telecommunications company cause to request the user to disconnect the equip

Users should ensure, for their own protection, that the electrical ground connectiof the power utility, telephone lines and internal metallic water pipe system, if present, are connected together. This precaution may be particularly important inareas.

CAUTION: Users should not attempt to make such connections themselves, butshould contact the appropriate electrical inspection authority, or electrician, aappropriate.

ICES-003 Advisements: This class A digital apparatus meets all requirements of the Canadian interferencausing equipment regulations. Shielded cables must be used for the serial portinterface drivers to ensure continued compliance with emission requirements. Alcables are available from Memotec Communications Inc.

Directive PH-01: AVIS: L’étiquette d’Industrie Canada identifie le matériel homologué. Cette étiquecertifie que le matériel est conforme à certaines normes de protection, d’exploitaet de sécurité des réseaux de télécommunications. Industrie Canada n’assure toutefois pas que le matériel fonctionnera à la satisfaction de l’utilisateur.

Avant d’installer ce matériel, l’utilisateur doit s’assurer qu’il est permis de le raccorder aux installations de l’entreprise locale de télécommunications. Le madoit également être installé en suivant une méthode acceptée de raccordement.L’abonné ne doit pas oublier qu’il est possible que la conformité aux conditions énoncées ci-dessus n’empêche pas la dégradation du service dans certaines sit

Les réparations de matériel homologué doivent être effectuées par un centre d’entretien canadien autorisé désigné par le fournisseur. La compagnie de télécommunications peut demander à l’utilisateur de débrancher un appareil à lade réparations ou de modifications effectuées par l’utilisateur ou en raison d’un mauvais fonctionnement.

Pour sa propre protection, l’utilisateur doit s’assurer que tous les fils de mise à lade la source d’énergie électrique, les lignes téléphoniques et les canalisations d’métalliques, s’il y en a, sont raccordés ensemble. Cette précaution est particulièrement importante dans les régions rurales.

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AVERTISSEMENT: L’utilisateur ne doit pas tenter de faire ces raccordements lumême; il doit avoir recours à un service d’inspection des installations électriques,un électricien, selon le cas.

Directive NMB-003: Cet appareil numérique de la classe A respecte toutes les exigences du règlemele matériel brouilleur du Canada. Des câbles blindés doivent être utilisés pour leinterfaces de jonction au port série afin de respecter les normes d’émission. Cecâbles sont disponibles chez Memotec Communications inc.

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CONFORMITY MARKINGS FOR EUROPEAN UNION (EU) DIRECTIVES AND NATIONAL REQUIREMENTS

Several or all of the following markings may be located on CX900e products.

This marking on the chassis identifies the CX900e as fully compliant with the requirements of the European Low Voltage (safety) Directive (or LVD), number 723/EEC and the European EMC Directive, number 89/336/EEC (and amendmenthat apply to both directives).

This marking on the chassis identifies the CX900e chassis as fully compliant withrequirements of the European Telecommunication Terminal Directive, number 9263/EEC (and amendments) and continued compliance with the LVD and EMC Directives mentioned above. The approved interfaces are E1 (120 Ohms) (incluT1/E1 I/O), X.21, V.24 (including Multi I/O), V.35EU, Universal I/O, BRI-DV, Analog Voice I/O, DAV I/O and ISDN-S/T I/O.

This marking identifies certain interfaces in the CX900e that are not approved foconnection to PTO-provided networks. Such interfaces are for private or internalonly, e.g., CX900e console port.

This marking identifies the boards in the CX900e chassis that have interfaces approved for connection to UK telecommunications networks. The approved interfaces are E1 (75 Ohms T1/E1 I/O) and ISDN S/T I/O.

This marking on the chassis identifies the CX900e as fully compliant with the requirements of all applicable ACA Telecommunications standards. The approveinterfaces are ISDN S/T, DAV I/O (FXO) and Analog Voice (FXO). The E1(T1/E1I/O) is for behind PBX use only (not approved for direct connection to the telecommunication network).

This marking on the chassis identifies the CX900e as fully compliant with applicaAustralian EMC requirements.

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To our customers in Australia:

All cabling connected to telecommunications ports must be TS 008 compliant. Inherent delays in packet-switched technology prevent the CX900e from meetingcertain Standard Telephone Service requirements as defined by the Telecommunications Act 1997. For this reason, it is recommended that local outgcalls should not be routed through the CX900e.

NOTE: This equipment will be inoperable when AC mains power fails.

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TABLE OF CONTENTS

1 OVERVIEW 1-1

1. 1 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1. 2 Hardware Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.1 Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.2 Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.3 Motherboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.4 I/O Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.5 Constraints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.6 Optional Cards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1. 3 Recommended Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 CHASSIS 2-1

2. 1 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1.1 Physical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1.2 Electrical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1.3 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2. 2 Front Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2. 3 Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 MOTHERBOARD 3-1

3. 1 Motherboard Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.1 Processing Section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.2 I/O Section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.3 Power Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 DATA EXPANSION MODULE 4-1

4. 1 DEM Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1.1 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1.2 Seventh Port Option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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4. 2 DTE/DCE Configuration for Seventh Port Option . . . . . . . . . . . . . . . .

4. 3 Signal Handling for Seventh Port Option . . . . . . . . . . . . . . . . . . . . . . .

5 SERIAL I/O CARDS 5-1

5. 1 V.24 Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1.1 V.24 Serial I/O Card Components. . . . . . . . . . . . . . . . . . . . . .

5.1.2 Speeds Supported by the V.24 Serial I/O . . . . . . . . . . . . . . . . 5-

5.1.3 DTE/DCE Interface Configuration . . . . . . . . . . . . . . . . . . . . . 5

5.1.4 V.24 Serial I/O Card Signal Handling. . . . . . . . . . . . . . . . . . .

5.1.5 V.24 Serial I/O Card Power Consumption . . . . . . . . . . . . . . .

5. 2 V.35EU Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2.1 V.35EU Serial I/O Card Components . . . . . . . . . . . . . . . . . . .

5.2.2 Speeds Supported by the V.35EU Serial I/O. . . . . . . . . . . . . . 5-


5.2.4 V.35EU Serial I/O Card Signal Handling . . . . . . . . . . . . . . . . 5

5.2.5 V.35EU Serial I/O Card Power Consumption . . . . . . . . . . . .

5. 3 V.35H Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3.1 V.35H Serial I/O Card Components . . . . . . . . . . . . . . . . . . . .

5.3.2 Speeds Supported by the V.35H Serial I/O . . . . . . . . . . . . . . 5-1

5.3.3 DTE/DCE Interface Configuration . . . . . . . . . . . . . . . . . . . . 5-

5.3.4 V.35H Serial I/O Card Signal Handling . . . . . . . . . . . . . . . . 5-

5.3.5 V.35H Serial I/O Card Power Consumption . . . . . . . . . . . . . 5

5. 4 X.21 Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4.1 X.21 Serial I/O Card Components. . . . . . . . . . . . . . . . . . . . . 5

5.4.2 Speeds Supported by the X.21 Serial I/O . . . . . . . . . . . . . . . 5-1

5.4.3 X.21 DTE/DCE Interface Configuration. . . . . . . . . . . . . . . . 5-

5.4.4 X.21 Serial I/O Card Signal Handling. . . . . . . . . . . . . . . . . . 5

5.4.5 X.21 Serial I/O Card Power Consumption . . . . . . . . . . . . . . 5

6 MULTI I/O CARD 6-1

6. 1 Multi I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


6.1.2 Multi I/O Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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6.1.3 Signal LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.4 Multi I/O Signal Handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.1.5 Multi I/O Card Power Consumption . . . . . . . . . . . . . . . . . . . . 6

7 UNIVERSAL I/O CARD 7-1

7. 1 Universal I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1.1 CX900e I/O Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1.2 Communications Controller . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1.3 Programmable Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1.4 Universal I/O Connector Plate . . . . . . . . . . . . . . . . . . . . . . . .

7. 2 Universal I/O Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7. 3 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3.1 Physical Protocol Configuration . . . . . . . . . . . . . . . . . . . . . . .

7.3.2 DTE/DCE Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3.3 Clock Source Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .

7. 4 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8 ANALOG VOICE I/O CARD 8-1

8. 1 Analog Voice I/O Card Components. . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 2 Compression Rates Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 3 Line Interface Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.3.1 E&M Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.3.2 FXO and FXS Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 4 Voice LID Signal Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 5 Layouts for E&M Signaling Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 6 Analog Voice I/O Cables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8. 7 E&M Pin-Outs and Wiring for Octopus Cables . . . . . . . . . . . . . . . . . 8

8. 8 Analog Voice I/O Card Power Consumption . . . . . . . . . . . . . . . . . . . 8

9 DUAL ANALOG VOICE I/O CARD 9-1

9. 1 DAV I/O Card Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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9.1.1 CX900e I/O Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1.2 Digital Signal Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1.3 Analog Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1.4 Programmable Logic Device . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1.5 DAV I/O Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9. 2 Speeds Supported by the DAV I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

9. 3 SLIM Line Interface Drivers (SLIM LIDs) . . . . . . . . . . . . . . . . . . . . . . 9

9.3.1 FXS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.3.2 FXO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.3.3 E&M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9. 4 Configuring Voice SLIM LIDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

9.4.1 E&M 2/4-wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.4.2 FXO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.4.3 FXS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

9. 5 Voice SLIM LID Connector Pin Assignments . . . . . . . . . . . . . . . . . . 9

9. 6 Voice I/O Cables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9. 7 E&M Pin-outs and Wiring for Octopus Cables . . . . . . . . . . . . . . . . . . 9

9. 8 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.8.1 Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

9.8.2 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 -48V/RING GENERATOR MODULE 10-1

10. 1 -48V/Ring Generator Components . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11 CSU/DSU I/O CARD 11-1

11. 1 CSU/DSU I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11.1.1 CSU/DSU I/O Card Signal Handling . . . . . . . . . . . . . . . . . . 1

11.1.2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12 ISDN BRI-U I/O CARD 12-1

12. 1 ISDN BRI-U I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . . 1

xiv 3006M100-002

2-3

12-3

3-2

3-3

-3

13-4

3-5

-2

-3

-3

14-4

15-2

5-3

15-3

15-4

15-4

6-2

16-3

16-3

17-2

17-3

17-3

12.1.1 ISDN Port Signal Handling . . . . . . . . . . . . . . . . . . . . . . . . . . 1

12.1.2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

13 ISDN BRI-S/T I/O CARD 13-1

13. 1 ISDN BRI-S/T I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . 1

13.1.1 ISDN BRI-S/T Jumper Settings . . . . . . . . . . . . . . . . . . . . . . 1

13.1.2 ISDN BRI-S/T Port Signal Handling . . . . . . . . . . . . . . . . . . 13

13.1.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

13. 2 Dual Digital Voice Compression Card . . . . . . . . . . . . . . . . . . . . . . . . 1

14 ISDN BRI-S/T DIGITAL VOICE I/O CARD 14-1

14. 1 ISDN BRI-S/T Digital Voice I/O Card Components. . . . . . . . . . . . . . 14

14.1.1 ISDN BRI-S/T Digital Voice I/O Jumper Settings . . . . . . . . 14

14.1.2 ISDN BRI-S/T Port Signal Handling . . . . . . . . . . . . . . . . . . 14

14. 2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

15 V.34 MODEM I/O CARD 15-1

15. 1 V.34 Modem I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . . . .

15.1.1 V.34 Modem Signal Handling. . . . . . . . . . . . . . . . . . . . . . . . 1

15. 2 Modem Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

15.2.1 Test Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

15.2.2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

16 TOKEN RING LAN I/O CARD 16-1

16. 1 Token Ring LAN I/O Card Components . . . . . . . . . . . . . . . . . . . . . . . 1

16. 2 Token Ring Port Signal Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . .

16. 3 Token Ring I/O Card Power Consumption . . . . . . . . . . . . . . . . . . . . .

17 ETHERNET LAN I/O CARD 17-1

17. 1 Ethernet LAN I/O Card Components. . . . . . . . . . . . . . . . . . . . . . . . . .

17. 2 Ethernet Port Signal Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

17.2.1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3006M100-002 xv

18-2

18-3

8-3

18-4

19-2

9-3

19-5

20-2

0-5

20-8

0-10

-15

0-22

0-28

18 FAST ETHERNET LAN I/O CARD 18-1

18. 1 Fast Ethernet LAN I/O Card Components . . . . . . . . . . . . . . . . . . . . . .

18.1.1 Fast Ethernet Signal LEDs . . . . . . . . . . . . . . . . . . . . . . . . . .

18.1.2 Fast Ethernet Port Signal Handling . . . . . . . . . . . . . . . . . . . . 1

18.1.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

19 T1/E1 CSU/DSU I/O CARD 19-1

19. 1 T1/E1 CSU/DSU I/O Card Components . . . . . . . . . . . . . . . . . . . . . . .

19.1.1 Port Configuration Jumpers. . . . . . . . . . . . . . . . . . . . . . . . . . 1

19. 2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

20 INSTALLATION AND CONFIGURATION 20-1

20. 1 Installation Preparations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

20. 2 EPROM/RAM Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

20. 3 Standard I/O Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

20. 4 Data Expansion Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . 2

20. 5 Voice I/O Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

20. 6 External Equipment Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

20. 7 Powering Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

. .1-1.2-3. .3-2. .3-3. .3-4 . .3-. .4-2 .4-3. .5-2. .5-3 .5-4. .5-6. .5-7 .5-8.5-10.5-105-12.5-14.5-145-16. .6. .6-36-4

. .6-. .7-2.7-3 . .7-4. .7-6 .7-6. .7-7.8-2. .8-3 .8-6.8-7.8-7.8-89-29-3. .9-4 .9-6.9-6.9-7

LIST OF FIGURES

Figure 1-1 The CX900e Access Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 2-1 CX900e Front Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 3-1 Motherboard Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 3-2 Motherboard’s Processing Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 3-3 Motherboard’s I/O Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 3-4 Power Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Figure 4-1 Data Expansion Module (DEM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 4-2 DEM DTE/DCE Configuration Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 5-1 V.24 Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-2 V.24 Serial I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-3 V.24 DTE/DCE Configuration Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 5-4 V.35EU Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-5 V.35EU Serial I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-6 V.35EU DTE/DCE Configuration Jumper . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 5-7 V.35H Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-8 V.35H Serial I/O Card, Connector Plate. . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-9 V.35H DTE/DCE Configuration Jumper . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 5-10 X.21 Serial I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-11 X.21 Serial I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5-12 X.21 DTE/DCE Configuration Jumper. . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 6-1 Multi I/O Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2Figure 6-2 Multi I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 6-3 Multi I/O DTE/DCE Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 6-4 Multi I/O Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Figure 7-1 Universal I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 7-2 Universal I/O Card, Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . Figure 7-3 Universal I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 7-4 Configuring the V.35 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 7-5 Configuring DTE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 7-6 TXC Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8-1 Analog Voice I/O Card (without LIDs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8-2 Analog Voice I/O Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8-3 E&M Signal, 4-Wire Type I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 8-4 E&M Signal, 4-Wire Type II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8-5 E&M Signal, 4-Wire Type III. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8-6 E&M Signal, 4-Wire Type IV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-1 DAV I/O Card (without SLIM LIDs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 9-2 DAV I/O Card, Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 9-3 DAV I/O Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-4 E&M Signal, 4-Wire Type I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 9-5 E&M Signal, 4-Wire Type II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-6 E&M Signal, 4-Wire Type III. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3006M100-002 xvii

.9-7.9-8. .9-9 .9-10.9-11 .9-11.10-2.11-2.11-312-212-213-2.13-24-24-2

.15-2

.15-2

.16-216-2.17-2.17-2.18-2.18-3.19-2.19-3.19-4 .20-4 .20-60-7

20-720-720-100-110-12

20-120-1420-150-160-170-170-180-190-200-200-22

Figure 9-7 E&M Signal, 4-Wire Type IV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-8 E&M Signal, 4-Wire Type V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-9 E&M 2/4-Wire Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-10 FXO Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 9-11 FXO Jumper Settings for Australia. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 9-12 FXS Jumper Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 10-1 -48V/Ring Generator Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 11-1 CSU/DSU I/O Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 11-2 CSU/DSU I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 12-1 ISDN BRI-U I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 12-2 ISDN BRI-U I/O Card, Connector Plate. . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 13-1 ISDN BRI-S/T I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 13-2 ISDN BRI-S/T Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 14-1 ISDN BRI-S/T Digital Voice I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Figure 14-2 ISDN BRI-S/T Digital Voice I/O Connector Plate . . . . . . . . . . . . . . . . . . . . 1Figure 15-1 V.34 Modem I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 15-2 V.34 Modem I/O Card, Connector Plate. . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 16-1 Token Ring I/O Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 16-2 Token Ring LAN I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . .Figure 17-1 Ethernet LAN I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 17-2 Ethernet LAN I/O Card Connector Plate . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 18-1 Fast Ethernet LAN I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 18-2 Fast Ethernet LAN I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . Figure 19-1 T1/E1 CSU/DSU I/O Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 19-2 T1/E1 CSU/DSU I/O Card, Connector Plate . . . . . . . . . . . . . . . . . . . . . . . Figure 19-3 T1/E1 CSU/DSU Configuration Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 20-1 Releasing the CX900e Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-2 Changeable Memory on Motherboard . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-3 DRAM SIMM Alignment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-4 DRAM SIMM Insertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-5 DRAM SIMM in Position. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-6 Standard I/O Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-7 Data Expansion Module Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-8 Data Expansion Module Alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-9 Data Expansion Module Insertion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-10 Ribbon Cable Connection to DEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-11 Ribbon Cable Connection to Rear Panel. . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-12 Connection between DEM and -48V/Ring Generator . . . . . . . . . . . . . . .2Figure 20-13 Assembled DEM and -48V/Ring Generator Module . . . . . . . . . . . . . . . .2Figure 20-14 DEM and -48V/Ring Generator Alignment . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-15 -48V/Ring Generator Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-16 -48V/Ring Generator Module Installation . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-17 -48V/Ring Generator Module Alignment. . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 20-18 -48V/Ring Generator Module Mounting . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-19 Analog Voice I/O Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

xviii 3006M100-002

0-2720-30.20-30

Figure 20-20 Attaching the EMI Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Figure 20-21 Fuse Bank Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Figure 20-22 Fuse Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3006M100-002 xix

. 1-6. 4-4. 5-5. 5-8 5-12 5-16 6-5. 7-4 7-7 8-4 8-4. 8-5. 8-5 8-8 8-8-10 8-1

. 9-9 9-109-10 9-12 9-12

9-13 9-1 11-312-3 13-313-414-314-4 15-3

16-3 17-3 18-3 19-3 19-4 19-420-25

LIST OF TABLES

Table 1-1 Recommended Configurations for the CX900e . . . . . . . . . . . . . . . . . . . . . . . Table 4-1 Seventh Port Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 5-1 Signal Pin-Outs for V.24 I/O Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 5-2 Signal Pin-Outs for V.35EU Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 5-3 Signal Pin-Outs for V.35H Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 5-4 Signal Pin-Outs for X.21 Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 6-1 Signal Pin-Outs for Multi I/O V.24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 7-1 Universal I/O Card LED Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 7-2 TXC/EXTXC Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 8-1 Jumper Settings for E&M 2/4-wire Line Impedance. . . . . . . . . . . . . . . . . . . .Table 8-2 Jumper Settings for E&M 2/4-wire Analog Interface . . . . . . . . . . . . . . . . . . . .Table 8-3 Voice Connector Signal Output (RJ-12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 8-4 Voice Connector Signal Output (PB-45). . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 8-5 E&M Signal, 4-Wire Type V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 8-6 RJ-12 Pin-out. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10Table 8-7 PB-45 Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 8-8 RJ-12 Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Table 8-9 PB-45 Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-11Table 9-1 FXO Jumper Settings for LK1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9-2 FXO Jumper Settings for Australia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9-3 FXO Jumper Settings and Current Limit for LK2 . . . . . . . . . . . . . . . . . . . . . Table 9-4 Voice Connector Signal Output (RJ-12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9-5 Voice Connector Signal Output (RJ-45) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9-6 PB-45 Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9-7 RJ-45 Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3Table 11-1 CSU/DSU Port Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 12-1 Signal Pin-Outs for ISDN BRI-U Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 13-1 ISDN BRI-S/T Connector Jumper Settings. . . . . . . . . . . . . . . . . . . . . . . . . . Table 13-2 Signal Pin-Outs for ISDN BRI-S/T Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 14-1 ISDN BRI-S/T Digital Voice Connector Jumper Settings . . . . . . . . . . . . . . Table 14-2 Signal Pin-Outs for the ISDN BRI-S/T Port . . . . . . . . . . . . . . . . . . . . . . . . . Table 15-1 V.34 Modem Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 15-2 V.34 Modem Protocol/Rate Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-3Table 16-1 Token Ring Port Signal Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 17-1 Ethernet Port signal Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 18-1 Connector Pin-outs for Ethernet Ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 19-1 T1/E1 CSU/DSU Connector Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 19-2 T1 Line Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 19-3 E1 Line Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Table 20-1 Cables Available from Memotec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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1 OVERVIEW

Memotec's CX900e is a Frame Relay access switch that provides local access and multiplexing capabilities for regional and remote sites. As an access device, thCX900e handles a wide range of protocols from user devices including legacSNA/SDLC, Async, 3270 Bisync, HDLC and X.25; Frame Relay; LAN traffic (both Ethernet and Token Ring); or voice, fax and video data. It supports transmission over a range of services including X.25, Frame Relay, ISDN, QSIG and the PSTN (Public Switched Telephone Network). As a switch, it offers multiplexing capabilities for X.25 and Frame Relay.

Plug-in I/O modules provide connections to protocols or services, for either thuser side (voice/fax, legacy data, LAN, ISDN, QSIG, and video) or the network side (X.25, Frame Relay, ISDN, PSTN). Optional integrated solutions include 5664K, T1/E1 CSU/DSU, ISDN (PRI, BRI) and V.34 dial back-up.

This chapter presents a functional and hardware overview of the components that make up the CX900e. The CX900e consists of a chassis, power supply, motherboard, and I/O cards.

Figure 1-1 The CX900e Access Switch

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CX900e Hardware Reference Manual

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1.1 Functional Overview

The CX900e is an access/switching device with multiple ports that accept incoming transmissions from multiple links and output the transmissions to the appropriate end-user destinations.

The functions and capabilities of the CX900e system are controlled primarily by the motherboard and the software residing in its memory. The motherboard can support up to six I/O cards.

The I/O cards provide connectivity to protocols and services, such as digital voice, analog voice, fax, legacy data, and LAN on the user side, and WAN protocols, such as X.25, ISDN, and Frame Relay, on the network side. The I/O cards also provide the port connectors that physically connect the CX900e to the user and network devices.

1.2 Hardware Overview

The CX900e system consists of a chassis housing the power supplies, motherboard and input/output (I/O) cards. The following paragraphs provide an overview of the CX900e system components.

1.2.1 Chassis

The CX900e chassis provides the framework for mounting the power supplies, fans, power entry module, and the motherboard. The front panel is equippedone LED for indicating power and system status. The rear panel provides an on/off switch, console port, power entry module with integral fuses, and access to threar connectors of the I/O cards.

1.2.2 Power Supply

The CX900e contains one universal-input (85V - 264 VAC) DC power supply that provides +5V and +12V to the motherboard. Voice applications require a RinGenerator card to provide -12VDC, -48VDC, and 86 VAC (ringing voltage) to thVoice I/O cards.

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1.2.3 Motherboard

The motherboard contains the software, CPU and associated circuitry to supconnectivity through its six I/O expansion slots.

The following card types are compatible with the expansion slots of thmotherboard. Certain restrictions apply, however, to the location of some card types; refer to Table 1-1.

The Motherboard also provides connectors for installing the optional Data Expansion Module (DEM) and Ring Generator card.

1.2.4 I/O Cards

All Serial I/O card ports can be configured for DTE or DCE operation.

V.24 Serial I/Card

The V.24 Serial I/O card provides a single port with unbalanced signals for control, data, and timing. The card supports synchronous or asynchronous transmission at speeds up to 128 Kbps.

Multi I/O Card The Multi-I/O card provides five V.24 ports which fully comply with ITU-T’s V.24 and EIA-232D standards. The card uses a high-density DB-60 connector foconnection to the external devices. A special breakout (octopus) cable is used to distribute the I/O signals to five DB-25 connectors. Each V.24/EIA-232 port can support synchronous or asynchronous transmission at speeds up to 128 Kbps.

X.21 Serial I/Card

The X.21 Serial I/O card provides a single port which supports the X.21 standThe card supports synchronous transmission at speeds up to E1 (2.048 Mbps).

V.35H Serial I/O Card

The V.35H Serial I/O Card provides a single port which supports the V.35 standard. However, it uses a V.11 driver/receiver for data and timing signals through a DB-25 port for connection to external devices. An adapter cable is to provide the physical V.35 connector. The card supports synchronous transmission at speeds up to 2.048 Mbps.

V.35H Serial card Analog Voice I/O card

V.35EU Serial card Dual Analog Voice (DAV) I/O card

X.21 Serial card V.34 Dial Modem

V.24 Serial card ISDN BRI (S/T or U)

V.24 Multi-I/O Serial card DDVC card

Universal I/O card ISDN BRI S/T Digital Voice card

10 Mbps Ethernet LAN card T1/E1 CSU/DSU

10/100 Mbps Ethernet LAN card 56K/64K DSU/CSU

4/16 Mbps Token Ring LAN card

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V.35EU SerialI/O Card

The V.35 (European Union version) Serial I/O card provides a single port whichfully compliant to the V.35 standard. The card supports synchronous transmission at speeds up to 2.048 Mbps.

Universal Serial I/O Card

The Universal I/O card supports five serial ports with maximum port speeds of 2.048 Mbps. The physical interface for each port is independently configurabfor V.24, V.35, or X.21. A custom breakout cable is required for the single highdensity port connector. The cable provides DB-25 connectors which, through thuse of adapters, provide V.24, V.35, and X.21 connections (in any combination).

Analog VoiceI/O Card

The Analog Voice I/O card features one analog voice/fax port controlled by anFXO, FXS, or an E&M (two-wire or four-wire) Line Interface Driver. The card uses a C31 Digital Signal Processor (DSP) to provide voice compression andsignaling.

Dual Analog Voice I/O Card

The Dual Analog Voice (DAV) I/O cards enable the CX900e to transmit and receive voice and fax data. Each card supplies two analog voice/fax ports controlled by FXO, FXS, or E&M SLIM Line Interface Drivers (SLIM LIDs). The card uses a C54 Digital Signal Processor (DSP) to provide voice compression and signaling.

Token Ring I/O Card

The Token Ring I/O card supports both Type 1 (DB-9) and Type 3 (RJ-45) devices of which only one may be configured as the active port. The DB-9 connector provides a Token Ring connection to networks using shielded, twisted-pair (STPwiring. The RJ-45 connector provides Token Ring connection to networks using unshielded, twisted-pair (UTP) wiring. The card can be configured for either 416 Mbps operation.

Ethernet I/O Card

The Ethernet I/O card features MAC (Media Access Control) addressing, and status and control registers that provide it with bridge/router functionality. The card is equipped with one 10BaseT port and one Attachment Unit Interface (AUI) port.

Fast Ethernet LAN I/O Card

The Fast Ethernet LAN I/O card enables the CX900e to connect to either a 10BaseT or 100BaseTX Ethernet LAN. The Fast Ethernet LAN I/O card features auto-sensing of data transmission speeds of 10 Mbps or 100 Mbps.

ISDN BRI-U I/O Card

The ISDN BRI-U I/O card enables the CX900e to exchange data over an Integrated Services Digital Network (ISDN) as a Basic Rate Interface-U (BRIconnecting to the PSTN. The Basic Rate Interface features 2 Bearer channels of 64Kbps each and one Data channel of 16 Kbps.

ISDN BRI-S/TI/O Card

The ISDN BRI-S/T I/O card enables the CX900e to exchange data over an ISDN or QSIG BRI-S/T interface. The ISDN BRI-S/T I/O card is required in locations where the telco or PBX supplies Network Termination 1 (NT1).

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DDVC Card The Dual Digital Voice Compression (DDVC) card is used in conjunction with the ISDN BRI-S/T I/O card to provide two compressed voice channels to the CX900e. The card uses a C31 Digital Signal Processor (DSP) to provide voiccompression and signaling.

ISDN BRI S/T Digital Voice I/O Card

The Basic Rate Interface (BRI) Digital Voice card enables the CX900e to transmit data and compressed voice over a BRI-S/T to a QSIG or ISDN interface. Theuses a C54 Digital Signal Processor (DSP) to provide voice compression andsignaling.

V.34 Modem Card

The V.34 Modem I/O card can be used as a dial backup for connections to a network or for establishing simple dial-up connections to the PSTN. The cardacts as an originate or answer modem using a variety of protocols and operating at speeds up to 28.8 Kbps.

56K/64K CSU/DSU Card

The CSU/DSU cards enable the CX900e to exchange data over digital netwoks. The cards feature 56K, switched-56, and 64K Clear Channel capabilities.

T1/E1 I/O Card The T1/E1 I/O card provides a non-channelized interface, and enables the CX900e to connect to a full or fractional public T1/E1 network.

1.2.5 Constraints

Certain I/O cards cannot coexist in the same CX900e chassis. A C54 DSP ison the DAV I/O card and the ISDN BRI-S/T Digital Voice I/O card. These cards therefore cannot be used in the same chassis as the DDVC card (which must bused with the ISDN BRI S/T I/O Card) and the Analog Voice I/O card, which a C31 DSP.

1.2.6 Optional Cards

The following paragraphs describe optional plug-in cards that support the functionality of specific I/O cards on the motherboard.

DataExpansion Module

The Data Expansion Module (DEM) provides Serial Communications Controllers (SCCs) for I/O slots 5 and 6. The DEM must be installed whenever an I/O card requiring access to a serial communication controller is installed in one of these slots (5or 6).

Ring Generator

The Ring Generator supplies -12VDC, -48VDC, and 86VAC (ringing voltage) to the Analog Voice I/O card. The Ring Generator is required for the Dual AnaloVoice I/O card (DAV I/O) as well, however, the LIDs on the DAV I/O card generate their own ringing voltage.

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1.3 Recommended Configurations

The motherboard accommodates up to six I/O cards. Most I/O cards supply one port with the exception of the Multi-I/O card, and the Universal I/O card, which supply five ports each, and the DAV I/O card which supports two ports. An additional V.24 port is available with the Data Expansion Module (DEM) option. Table 1-1 shows the recommended CX900e configurations along with their capabilities and limitations.

* must be used in conjunction with ISDN BRI-S/T

Legend for Table 2-1:OK The I/O in this slot can be used without special requirements.BEST Use these slots first for the I/O card specified. Filling these slots with the speci-

fied I/O cards means that a Data Expansion Module (DEM) is not required.OK with DEM DEM is required when filling the slot with the specified I/O card. The DEM sup-

plies the SCC’s for serial I/O cards in slots 5 and 6, and an additional V.24 port.NO The specified I/O card cannot be used in these slots.† The +1 indicates an extra port from the DEM card.

Table 1-1 Recommended Configurations for the CX900

I/O CardMaximum

Speed

Max. cards of this type

Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6

Multi EIA-232/V.24 128 Kbps 5 OK OK with DEM

EIA-232/V.24 128 Kbps 6+1† OK OK with DEM

V.35H orV.35EU

2.048 Mbps 6 OK OK with DEM

X.21 2.048 Mbps 6 OK OK with DEM

Universal I/O 2.048 Mbps 1 OK OK with DEM

56K/64K DSU/CSU 56K/64K bps 5 OK OK with DEM

V.34 Modem 28.8 Kbps 5 OK OK with DEM

Analog Voice I/O (with Ring Generator)

n/a 4 OK BEST

Dual Analog Voice I/O(DAV I/O)(with Ring Generator)

n/a 3 OK BEST

10BaseTEthernet

10 Mbps 1 OK NO

Fast Ethernetautosense10 or 100 Mbps

1 OK

Token Ring4 or 16 Mbps

1 OK

ISDN BRI-UISDN BRI-S/T

128 Kbps 5 OK

DDVC* n/a 2* OK

ISDN BRI-S/T Digital Voice 128Kbps 3 OK

T1/E1 CSU/DSU1.544 Mbpsor2.048 Mbps

1 OK NO

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The compact CX900e conveys voice, fax, data, and LAN traffic between Ethernet, Fast Ethernet or Token Ring LANs over X.25 or Frame Relay WANs running on PDN (public or private), PSTN, DDS, T1, E1 or ISDN lines.

The CX900e chassis holds a motherboard whose expansion slots can mounsix I/O cards. These I/O cards include

* The DDVC card provides voice compression and is not considered an I/O card, although it occupies an I/O card slot.

A seventh expansion slot on the motherboard can mount an optional Data Expansion Module. This module can provide an additional V.24 port. The DatExpansion Module must be installed if a V.24 Serial I/O, a Multi V.24 Serial I/OV.35 Serial I/O, an X.21 Serial I/O, a Universal I/O, a V.34 Data Modem I/O, oCSU/DSU I/O is installed in slot 5 or slot 6.

V.35H Serial card Analog Voice I/O card

V.35EU Serial card Dual Analog Voice (DAV) I/O card

X.21 Serial card V.34 Dial Modem

V.24 Serial card ISDN BRI (S/T or U)

V.24 Multi-I/O Serial card DDVC* card

Universal I/O card ISDN BRI S/T Digital Voice card

10 Mbps Ethernet LAN card T1/E1 CSU/DSU

10/100 Mbps Fast Ethernet LAN card 56K/64K DSU/CSU

4/16 Mbps Token Ring LAN card

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2.1 Specification

Consider the characteristics below when choosing an installation site for CX900e.

2.1.1 Physical

The CX900e is a standalone, tabletop device with an internal power supply. It is enclosed in a plastic and steel case, and mounted on four rubber supports.

WARNING: Rubber supports must be secured to the chassis bottom at all times.Failure to ensure minimum clearance will reduce ventilation and maresult in overheating of the unit.

Dimensions Height:4.10 in. (10.4 cm)Width:12.25 in. (31.2 cm)Depth:12.80 in. (32.5 cm)

2.1.2 Electrical

Ratings 100-127V; 50-60 Hz; 0.7A200-240V; 50-60 Hz; 0.32A

Power Consumption

22 Watts (with no cards installed)120 VA (max.)

Fuse Requirements

0.4A 250V time-delay fuse for 200-240V0.8A 250V time-delay fuse for 100-127V

WARNING: This equipment uses double pole/neutral fusing. For continued protetion against risk of fire, replace only with the same type and rating ofuses.

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2.1.3 Environmental

Operating Temperature

32° to 112° F (0° to 45° C)

Storage Temperature

-40° to 176° F (-40° to 80° C)

Humidity 0 to 95% (non-condensing)

Cooling Forced air

2.2 Front Panel

The CX900e front panel has one green POWER/STATUS LED. When lit, theLED indicates system power is on at a suitable level to ensure proper function. When flashing, the LED indicates a system failure.

2.3 Rear Panel

All communication cables and the power cord connect to the CX900e on the rear panel.

We recommend that you power off the CX900e with the ON/OFF switch before you attach or detach the power cable. You need not power off the CX900e to attach or detach cables for the console port or I/O cards.

I/O Slots The rear panel has six standard I/O slots. When a slot has no I/O card, it remains covered with a blank metal plate to limit dust accumulation and electromagnetic radiation. When an I/O card has been mounted in a slot, the connector plate I/O card replaces the panel’s blank metal plate.

Figure 2-1 CX900e Front Panel

P O W ER /STATU S LED

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3 MOTHERBOARD

The CX900e’s motherboard holds all integrated circuits and other components required to achieve I/O card interoperability.

The motherboard’s expansion slots support at one time and in any combination up to six differently configured I/O cards and a number of ports (a seventh slot can provide an optional V.24 port). Each of these I/O cards is detailed further in this manual.

Actions taken by a given I/O card in relation to the protocol and traffic of the network it communicates with, as well as in relation to other cards within the CX900e, are controlled by a sophisticated microprocessor on the motherboard that carries out instructions from programming residing in memory.

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3.1 Motherboard Layout

Components of the CX900e’s motherboard are organized in three general functional areas:

• processing section (including CPU and memory)

• input/output section (including expansion slots)

• power section (including transformers and fuse)

3.1.1 Processing Section

CPU The Motorola QUICC 68EN360, at U9, is the CX900e’s central processing unit. This 32-bit CPU can handle 5.9 MIPS at 33 MHz. A built-in System Integration Module, including an interrupt controller, memory controller and various clocking mechanisms, aids the CPU in its housekeeping activities.

Also integrated in the 68EN360 is a Communications Processor Module that includes:

• a serial management controller

Figure 3-1 Motherboard Layout

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• four SCCs (Serial Communication Controllers) for handling traffic on slots 1-4; slo5-6 are handled by an optional Data Expansion Module (DEM)

• four baud rate generators

Memory The motherboard holds the following types of memory:

• 128K x 8 bit (up to 256K x 8 bit) EPROM for booting the system after powering upreset, located at U22

• 128K x 8 bit FLASH for storing configuration data, located at U23

• 2M x 32 bit (8 M) of DRAM SIMM for data storage, located at U47

• four 512K x 8 bit (2M) FLASH memory for storing application code, located at U2U31

• 256K x 32 bit (1M), 512K x 32 bit (2M), 1M x 32 bit (4M) FLASH SIMM for extra application code storage, located at U46

A system bus on the motherboard allows the CPU and I/O cards to communicatwith each other and with memory via buffers located at U32-U34.

3.1.2 I/O Section

In the middle of the motherboard are six 120-pin card-edge connectors (located at J5, J7, J9, J11, J13 and J15). They seat the I/O cards in their slots and connthem to the I/O bus.

A seventh 120-pin card-edge connector at J3 provides a connector to seat the optional DEM (Data Expansion Module) and connect it to the I/O bus.

Figure 3-2 Motherboard’s Processing Unit

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3.1.3 Power Section

The power connector module delivers 110/220 VAC (nominal) from the poweline to the primary coil of a step-down transformer. A secondary coil supplies 14 VAC through P2 to the motherboard’s on-board power supply. This power supply produces +5 VDC regulated for the CPU and logic. It also produces +5 VDC the I/O cards which it delivers via the system bus. Finally, it produces +15 VDC and -15 VDC unregulated for use by the -48V/Ring Generator card for the Voice I/O card(s), if mounted.

A 4 Amp time-delay fuse located at F1 and a crow-bar circuit protect the electronics (the motherboard and I/O cards) from power regulator malfunctions.

A -48V/Ring Generator card is installed at J2 to power the Voice I/O cards, if installed.

Figure 3-3 Motherboard’s I/O Section

Figure 3-4 Power Section

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4 DATA EXPANSION MODULE

The Data Expansion Module (DEM) supplies three (3) Serial Communication Controllers (SCCs), memory, and other intelligence to I/O cards mounted in slots 5 and 6. The DEM also provides support to an optional V.24 port connected via a ribbon cable (see Figure 4-1).

The DEM must be used when serial I/O cards associated with slots 5 and 6 arrequired. This includes the Multi I/O, Universal I/O, EIA-232/V24 I/O, V.35H I/O, V.35EU I/O, X.21 I/O, V.34 Modem or the 56K CSU/DSU.

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4.1 DEM Component

Important components on the Data Expansion Module (DEM) include:

• edge connector

• Integrated Multiprotocol Processor (including three SCCs)

• seventh port option

4.1.1 Processor

An Integrated Multiprotocol Processor (IMPP) at U9 controls the DEM’s circuits and logic. The IMPP incorporates two serial communication controllers to handle serial ports provided by cards mounted in slot 5 and slot 6. The IMPP also controls the third SCC which handles traffic from the optional seventh port (V.which is connected via a ribbon cable.

4.1.2 Seventh Port Option

Port Connector

The IMPP provides the SCC for an optional seventh port. This port is a V.24 (EIA-232D) with a female DB-25 connector. This connector mounts on the rear panel of the chassis through a knock-out; its ribbon cable attaches to a 26-pisocket on the DEM at J1.

Speed The optional seventh port can operate without split clocking at the following synchronous speeds:

• 50 bps - 128 Kbps for external clocking

• 1875 bps - 128 Kbps for internal clocking

Figure 4-1 Data Expansion Module (DEM)

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It can also operate asynchronously at following speeds:

• 134 bps - 128 Kbps

4.1.3 Power

The DEM receives +5 VDC from the 120-pin connector of the motherboard areturns ground to it.

4.2 DTE/DCE Configuration for Seventh Port Option

The optional seventh port can be physically configured either as a DTE or a DCE device. The factory default configuration is DCE.

DCE When configured as a DCE device, the port transmits DCD, DSR, and CTS athe synchronous clocks - TXC and RXC. The port must receive DTR and RTfrom the attached DTE. Terminals, printers, controllers and hosts are alwaysdevices.

DTE When configured as a DTE device, the port transmits DTR, RTS and ETXC and receives DCD, DSR, and CTS and the synchronous clocks (TXC and RXC) from the attached DCE.

Two jumper banks socketed at U3 and U4 provide DTE/DCE configuration. Permanent metal bands on the top surface of the jumper banks strap signals according to DCE/DTE requirements. The orientation of these jumper banks determines whether the port will be DTE or DCE. Rotating each jumper 180°changes the port from one kind of device to the other, as illustrated below.

Figure 4-2 DEM DTE/DCE Configuration Jumpers

3006M100-002 4-3


4.3 Signal Handling for Seventh Port Option

Signaling through the optional seventh port complies fully with the ITU-T’s (CCITT) V.24 and IEEE’s EIA-232D standards for a DB-25 connector.

* These pins are not used in the present V.24 interface.

Table 4-1 Seventh Port Pin-Outs

V.24Signal

CircuitFunction EIA CCITT

DB-25Pin No.

Signal DirectionDTE

Signal DirectionDCE

PG Protective Ground (Shield) AA 101 1 not applicable not applicable

TXD Transmitted Data BA 103 2 Out In

RXD Received Data BB 104 3 In Out

RTS Request to Send CA 105 4 Out In

CTS Clear to Send CB 106 5 In Out

DSR Data Set Ready CC 107 6 In Out

SG Signal Ground AB 102 7 not applicable not applicable

DCD Data Carrier Detect CF 109 8 In Out

*Reserved 9 not used not used


*Unassigned 11 not used not used

*SCD Secondary Received LineSignal Detector

SCF 123 12 not used not used

*SCTS Secondary Clear To Send SCB 121 13 not used not used

*STD Secondary Transmitted Data SBA 118 14 not used not used

TXC Transmit Timing DB 114 15 In Out

*SRD Secondary Received Data SBB 119 16 not used not used

RXC Receive Timing DD 115 17 In Out

LL Local Loopback LL 141 18 Out In

*SRTS Secondary Request To SendSCA 120 19 not used not used

DTR Data Terminal Ready (DTE Ready)

CD 108.2 20 Out In

RL Remote Loopback/Signal Quality Detector

CG 110 21 Out In

RI Ring Indicator RL 140 22 In Out

DRS Data Rate Selector CH 111 23 Out In

ETXC Terminal Timing DA 113 24 Out In

TM Test Mode TM 142 25 In Out

4-4 3006M100-002


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Cable The V.24 (EIA-232) Serial I/O Card connects to external devices through a separately-ordered three-meter (10 ft.) straight through, shielded cable (part no. CBLA0006-010 with 4-40 screws and no. CBLA0006-110 with M3 screws) with a male DB-25 connector (ISO 2110) at each end. The V.24 I/O port can drive a maximum of 1880 pF cable capacitance while maintaining compliance with the applicable regulatory standards. If using cables other than those supplied by Memotec, ensure that the capacitance does not exceed 1880pF. This can be calculated from the cable manufacturer’s specifications of capacitance per fo(pF/Ft), which differs from one cable to the next.

3006M100-002 4-5

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5 SERIAL I/O CARDS

There are four types of Serial I/O cards which mount on the motherboard in any of slots 1-4, and in slots 5-6 if the Data Expansion Module (DEM) is installed. They enable the CX900e to exchange data with a variety of external serial devices. Other serial devices include the Multi I/O, discussed in Chapter 6, and the Universal I/O, discussed in Chapter 7.

NOTE: The serial I/O cards must be configured as DTE to connect to a PTO-provided service (X.25 PSS or Digital Leased Line). Interconnecting cablesused between the Memotec interface and the PTO provided network mupresent a DTE interface to the network.

The interconnection cables supplied by Memotec provide the correct connectype and pin-out assignments required by a PTO-provided network port in Europe.

3006M100-002 5-1


5.1 V.24 Serial I/O Card

The V.24 Serial I/O card and its single port provide V.24 interface capabilities with unbalanced signals for control, data and timing signals. It supports synchronous or asynchronous transmission at speeds up to 128 Kbps.

5.1.1 V.24 Serial I/O Card Components

Important components on the V.24 Serial I/O Card include:

• edge connector

• port connector plate

• signal LEDs

• port configuration jumpers

The edge connector fixes the card to any one of the motherboard’s expansion slots 1-6.

The connector plate fixes the female DB-25 connector to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 5-1 V.24 Serial I/O Card

5-2 3006M100-002

5 SERIAL I/O CARDS

up to

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Cable The V.24 (EIA-232) Serial I/O Card connects to external devices through a separately-ordered three-meter (10 ft.) straight through, shielded cable (part no. CBLA0006-010 with 4-40 screws and no. CBLA0006-110 with M3 screws) with a male DB-25 connector (ISO 2110) at each end. The V.24 I/O port can drive a maximum of 1880 pF cable capacitance while maintaining compliance with the applicable regulatory standards. If using cables other than those supplied by Memotec, ensure that the capacitance does not exceed 1880pF. This can be calculated from the cable manufacturer’s specifications of capacitance per fo(pF/Ft), which differs from one cable to the next.

5.1.2 Speeds Supported by the V.24 Serial I/O

Speeds for slots 1 to 4

The V.24 port can operate without split clocking at the following synchronous speeds:


• 375 bps - 128 Kbps for internal clocking

and at the following asynchronous internal clock speeds:

• 50 bps - 128 Kbps

Speeds for slots 5 and 6

The V.24 port in slots 5 and 6 can operate, without split clocking, at the following synchronous speeds:


• 1,875 bps - 128 Kbps for internal clocking

Figure 5-2 V.24 Serial I/O Card, Connector Plat

3006M100-002 5-3


d the S

DTE

and at the following asynchronous internal clock speeds:

• 134 bps - 128 Kbps

5.1.3 DTE/DCE Interface Configuration

The V.24 Serial I/O Card’s port can be configured either as a DTE or a DCE device. The DCE/DTE strapping has been silk-screened on the I/O card to aid in configuration.

DCE When configured as a DCE device, the port transmits DCD, DSR and CTS ansynchronous clock signals TXC and RXC. The port must receive DTR and RTfrom the attached DTE. Terminals, printers, controllers and hosts are alwaysdevices.

DTE When configured as a DTE device, the port transmits DTR, RTS and ETXC and receives DCD, DSR and CTS and the synchronous clock signals EXTC and RXC from the attached DCE.

Two jumper banks socketed at U10 and U11 provide DTE/DCE configuration. Permanent metal bands on the top surface of the jumper banks strap signals according to DCE/DTE requirements. The orientation of these jumper banks determines whether the port will be DTE or DCE. Rotating each jumper 180°changes the port from one kind of device to the other, as illustrated below.

Figure 5-3 V.24 DTE/DCE Configuration Jumpers

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5 SERIAL I/O CARDS

5.1.4 V.24 Serial I/O Card Signal Handling

Signaling through the V.24 Serial I/O Card’s port complies fully with the ITU-T’s (CCITT) V.24 and the EIA-232D standards for a DB-25 connector.

* These pins are not used in the present V.24 interface.

Table 5-1 Signal Pin-Outs for V.24 I/O Port

V.24 Signal

Circuit Function EIA CCITTDB-25

Pin No.Signal DTE

Direction-DCE

PG Protective Ground (Shield) AA 101 1 GND GND



RTS Request to send CA 105 4 Out In



SG Signal Ground AB 102 7 GND GND





*SCDSecondary Received Line Signal Detector

SCF 123 12 not used not used

*SCTS Secondary Clear to Send SCB 121 13 not used not used

*STD Secondary Transmitted Data SBA 118 14 not used not used


*SRD Secondary Receive Data SBB 119 16 not used not used


LL Local Loopback LL 141 18 Out In

*SRTS Secondary Request To Send SCA 120 19 not used not used

DTRData Terminal Ready (DTE Ready)

CD 108.2 20 Out In

RLRemote Loopback/Signal Quality Detector

CG 110 21 Out In

RI Ring Indicator RL 140 22 Out In

DRS Data Rate Selector CH 111 23 Out In

EXTC Terminal Timing DA 113 24 Out In

TM Test Mode TM 142 25 In Out

3006M100-002 5-5


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5.1.5 V.24 Serial I/O Card Power Consumption

Power consumption for the V.24 Serial I/O Card is 0.35 Watts (1.2 BTU/hr).

5.2 V.35EU Serial I/O Card

The V.35EU (European Union version) Serial I/O card and its single port adherestrictly to the V.35 standard. Unlike the V.35H Serial I/O card, which uses alternate means to achieve V.35 signaling, the V.35EU Serial I/O card uses specified electrical levels for control, timing and data signals and also uses an M-34 block connector for connection to external devices.

5.2.1 V.35EU Serial I/O Card Components

Important components on the V.35EU Serial I/O Card include:

• edge connector

• port connector

• signal LEDs

• port configuration jumper


The connector plate fixes the female M-34 block connector to the chassis’ repanel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 5-4 V.35EU Serial I/O Card

5-6 3006M100-002

5 SERIAL I/O CARDS

ly-t no.

eed

Cable The V.35EU Serial I/O Card connects to external devices through a separateordered three-meter (10 ft.) straight through, shielded twisted pair cable (parCBLA0015-010) with a male M-34 block connector (ISO 2593) at each end. The V.35EU I/O port can drive up to a maximum of 2150 pF cable capacitance while remaining compliant with applicable regulatory standards. If using cables oththan those supplied by Memotec, ensure that the capacitance does not exce2150pF. This can be calculated from the cable manufacturer’s specifications of capacitance per foot (pF/Ft), which differs from one cable to the next.

5.2.2 Speeds Supported by the V.35EU Serial I/O

The V.35EU Serial I/O card supports asynchronous or synchronous transmission at speeds up to T1/E1.


The V.35 port at slots 1 to 4 can operate, without split clocking, at the following speeds:

• 50 bps - 2,048 Kbps for external clocking

• 375 bps - 2,048 Kbps for internal clocking


The V.35 port at slots 5 and 6 can operate, without split clocking, at the following speeds:



Figure 5-5 V.35EU Serial I/O Card, Connector Plate

3006M100-002 5-7


d the S

DTE

DCE/


The V.35EU Serial I/O Card’s port can be configured either as a DTE or a DCE device. The DCE/DTE strapping has been silk-screened on the I/O card to aid in configuration.


DTE When configured as a DTE device, the port transmits DTR, RTS and ETXC and receives DCD, DSR and CTS and the synchronous clock signals TXC and RXC from the attached DCE.

A jumper bank socketed at U8 provides DTE/DCE configuration. Permanentmetal bands on the top surface of the jumper bank strap signals according toDTE requirements. The orientation of the jumper bank determines whether the port will be DTE or DCE. Rotating the jumper 180° changes the port from one kind of device to the other, as illustrated below.

5.2.4 V.35EU Serial I/O Card Signal Handling

Signaling through the V.35EU Serial I/O Card’s port complies fully with the ITU-T’s (CCITT) V.35 standard for an M-34 block connector.

Figure 5-6 V.35EU DTE/DCE Configuration Jumper

Table 5-2 Signal Pin-Outs for V.35EU Port

V.35EU Signal

Circuit Function ITU-TM-34

Pin No.Signal DTE

Direction-DCE

F. GND Protective Ground 101 A n/a n/a

TXDA Transmitted Data (Set A) 103-A P Out In

RXDA Received Data (Set A) 104-A R In Out

RTS Request to Send 105 C Out In

5-8 3006M100-002

5 SERIAL I/O CARDS

Separate A and B signals in the V.35 interface indicate differential pair signals.

5.2.5 V.35EU Serial I/O Card Power Consumption

Power consumption is 1.45 Watts (5.0 BTU/hr).

5.3 V.35H Serial I/O Card

The V.35H (North American) Serial I/O card and its single port also supports the V.35 standard. However, it uses a V.11 driver/receiver for data and timing signals and a DB-25 connector for connection to external devices.

5.3.1 V.35H Serial I/O Card Components

Important components on the V.35H Serial I/O Card include:

• edge connector

• port connector

• signal LEDs


CTS Clear to Send 106 D In Out

DSR Data Set Ready 107 E In Out

S. GND Signal Ground 102 B n/a n/a

DCD Data Carrier Detect 109 F In Out

RXCB Receiver Clock (Set B) 115 X In Out

ETXCBExternal Transmitter Clock (Set B)

113-B W Out In

TXCB Transmitter Clock (Set B) 114-B AA In Out

TXDB Transmitted Data (Set B) 103-B S Out In

TXCA Transmitter Clock (Set A) 114-A Y In Out

RXDB Received Data (Set B) 104-B T In Out

RXCA Receiver Clock (Set A) 115-A V In Out

DTR Data Terminal Ready 108 H Out In

RI Ring Indicator 125 J In Out

ETXCAExternal Transmitter Clock (Set A)

113-A U Out In

Table 5-2 Signal Pin-Outs for V.35EU Port

V.35EU Signal

Circuit Function ITU-TM-34

Pin No.Signal DTE

Direction-DCE

3006M100-002 5-9




Figure 5-7 V.35H Serial I/O Card

Figure 5-8 V.35H Serial I/O Card, Connector Plat

5-10 3006M100-002

5 SERIAL I/O CARDS

e

e

on at

d the S

DTE

DCE/

Cable The V.35H Serial I/O Card connects to external devices through either of two separately-ordered cables:

• three-meter (10 ft) shielded, twisted pair cable with a male DB-25 connector at onend and a male M-34 block connector at the other (part no. CB007112)

• three-meter (10 ft) shielded, twisted pair cable with a male DB-25 connector at onend and a female M-34 block connector at the other (part no. CB007113)

5.3.2 Speeds Supported by the V.35H Serial I/O

The V.35H Serial I/O card supports asynchronous or synchronous transmissispeeds up to T1/E1.

Speed for slots 1 to 4

The V.35 port at slots 1 to 4 can operate, without split clocking, at the following speeds:



Speed for slots 5 and 6

The V.35 port at slots 5 and 6 can operate, without split clocking, at the following speeds:




The V.35H Serial I/O Card’s port can be configured either as a DTE or a DCE device. The DCE/DTE strapping has been silk-screened on the I/O card to aid in configuration.



A jumper bank socketed at U9 provides DTE/DCE configuration. Permanentmetal bands on the top surface of the jumper bank strap signals according toDTE requirements. The orientation of the jumper bank determines whether the port will be DTE or DCE. Rotating the jumper 180° changes the port from one

3006M100-002 5-11


-

kind of device to the other, as illustrated below.

5.3.4 V.35H Serial I/O Card Signal Handling

Signaling through the V.35H Serial I/O Card’s port complies fully with the ITUT’s (CCITT) V.35 standard. Signaling, however, occurs through a DB-25 connector rather than an M-34 block connector.

Figure 5-9 V.35H DTE/DCE Configuration Jumpe

Table 5-3 Signal Pin-Outs for V.35H Port

V.35H Signal

Circuit Function ITU-TDB-25 Pin No.

Signal DTE

Direction DCE

F. GND Protective Ground 101 1 n/a n/a

TXDA Transmitted Data (Set A) 103-A 2 Out In

RXDA Received Data (Set A) 104-A 3 In Out

RTS Request to Send 105 4 Out In

CTS Clear to Send 106 5 In Out

DSR Data Set Ready 107 6 In Out

S. GND Signal Ground 102 7 n/a n/a

DCD Data Carrier Detect 109 8 In Out

RXCB Receiver Clock (Set B) 115 9 In Out

*Unassigned 10 n/a n/a

ETXCB External Transmitter Clock (Set B 113-B 11 Out In

TXCB Transmitter Clock (Set B) 114-B 12 In Out


TXDB Transmitted Data (Set B) 103-B 14 Out In

TXCA Transmitter Clock (Set A) 114-A 15 In Out

RXDB Received Data (Set B) 104-B 16 In Out

RXCA Receiver Clock (Set A) 115-A 17 In Out


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5 SERIAL I/O CARDS

Separate A and B signals in the V.35 interface indicate differential pair signals.

5.3.5 V.35H Serial I/O Card Power Consumption

Power consumption for the V.35H Serial I/O Card is 1.5 Watts (5.15 BTU/hr).

5.4 X.21 Serial I/O Card

The X.21 I/O Card and its single port supports synchronous transmission at speeds up to 2,048 Kbps.

5.4.1 X.21 Serial I/O Card Components

Important components on the X.21 Serial I/O Card include:

• edge connector

• port connector

• signal LEDs



DTR Data Terminal Ready 108 20 Out In


RI Ring Indicator 125 22 In Out


ETXCA External Transmitter Clock (Set A 113-A 24 Out In


Table 5-3 Signal Pin-Outs for V.35H Port

V.35H Signal

Circuit Function ITU-TDB-25 Pin No.

Signal DTE

Direction DCE

3006M100-002 5-13




Cable The X.21 Serial I/O Card connects to external devices through a separately-ordered three-meter (10 ft.) shielded, twisted pair cable (part no. CBLA0012-110) with a male DB-15 connector (ISO 4903) at each end.

Figure 5-10 X.21 Serial I/O Card

Figure 5-11 X.21 Serial I/O Card, Connector Plate

5-14 3006M100-002

5 SERIAL I/O CARDS

d the S

DTE

5.4.2 Speeds Supported by the X.21 Serial I/O


The X.21 port at slots 1 to 4 can operate, without split clocking, at the following speeds:




The X.21 port at slots 5 and 6 can operate, without split clocking, at the following speeds:



5.4.3 X.21 DTE/DCE Interface Configuration

The X.21 Serial I/O Card’s port can be configured either as a DTE or a DCE device. The DCE/DTE strapping has been silk-screened on the I/O card to aid in configuration.



A jumper at LK3 provides DTE/DCE configuration. The presence or absence of the jumper determines whether the port will be DTE or DCE.

• DTE mode - jumper is off

• DCE mode - jumper is on

3006M100-002 5-15


5.4.4 X.21 Serial I/O Card Signal Handling

The following table identifies the X.21 signals supported on the I/O port connector. The information identifies the pin through which the signal passes on the DB-15 port connector.

5.4.5 X.21 Serial I/O Card Power Consumption

Power consumption for the X.21 Serial I/O card is 1.5 Watts (5.15 BTU/hr).

Figure 5-12 X.21 DTE/DCE Configuration Jumper

Table 5-4 Signal Pin-Outs for X.21 Port

X.21 Signal

Circuit Function ITU-TDB-15

Pin No.Signal DTE

Direction DCE

F. GND Protective Ground 101 1 n/a n/a

TXDA Transmitted Data (Set A) 103-A 2 Out In

DTRA Data Terminal Ready (Set A) 108-A 3 Out In

RXDA Received Data (Set A) 104-A 4 In Out

DCDA Data Carrier Detect (Set A) 109-A 5 In Out

RXCA Receive Clock (Set A) 115-A 6 In Out

DTE Signal Element Timing (Set A) 7 not used not used

S. GND Signal Ground 102 8 n/a n/a

TXDB Transmitted Data (Set B) 103-B 9 Out In

DTRB Data Terminal Ready (Set B) 108-B 10 Out In

RXDB Received Data (Set B) 104-B 11 In Out

DCDB Data Carrier Detect (Set B) 109-B 12 In Out

RXCB Receiver Clock (Set B) 115-B 13 In Out

DTE Signal Element Timing (Set B) 14 not used not used

Reserved 15 not used not used

5-16 3006M100-002

6 MULTI I/O CARD

The Multi I/O card mounts on the motherboard in any of slots 1-4 and also slots 5-6 if the Data Expansion Module (DEM) is installed. When used with the Multi I/O cable, the card provides a higher serial port density for the CX900e. Each Multi I/O supports five V.24/EIA-232 ports. Each V.24/EIA-232 can support synchronous or asynchronous transmission at speeds up to 128 Kbps.

3021M100-002 6-1

CX950 Hardware Reference Manual

6.1 Multi I/O Card Components

Important components of the Multi I/O Card include:

• edge connector

• port connector

• port configuration jumpers

• signal LEDs

• multi I/O cable

The edge connector fixes the card to any one of the motherboard’s expansion slots 1-6. The connector plate fixes the connectors to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 6-1 Multi I/O Card

6-2 3021M100-002

6 MULTI I/O CARD

E

d the S

DTE

for


Each of the five V.24/EIA-232 ports can be configured either as a DTE or DCdevice.

NOTE: Other V.24/EIA-232 ports in the CX900e are DTE/DCE configured with ajumper bank. Each port on the Multi I/O are DTE/DCE configured with ajumper bank and a suitcase jumper.


DTE When configured as a DTE device, the port transmits DTR, RTS and EXTC and receives DCD, DSR and CTS and the synchronous clock signals TXC and RXC from the attached DCE.

Each port has a jumper bank (located at U29 through U33) and a set of pins suitcase jumpers (located at LK1 through LK5) to provide DTE/DCE configuration. The orientation of each jumper bank determines whether the port will be DTE or DCE. Rotating each jumper 180 degrees changes the port from one kind of device to the other. The configuration guide for both DTE and DCE is printed on the Multi I/O.

In addition, suitcase jumpers, at LK1 through LK5, must also be installed to configure clocking. For each port configured as DTE, connect pin 1 to pin 2, for each port configured as a DCE, connect pin 2 to pin 3.

Figure 6-2 Multi I/O Card, Connector Plate

3021M100-002 6-3


6.1.2 Multi I/O Cable

The Multi I/O Card connects to external devices through a Multi I/O cable (part no. CBLA0017-024 or CBLA0017-124) with one DB-60 and five DB-25 connectors.

Each DB-25 is labelled Port 1 through Port 5 to ensure that the DTE/DCE configuration for each port is correct.

Figure 6-3 Multi I/O DTE/DCE Configuration

Figure 6-4 Multi I/O Cable

6-4 3021M100-002

6 MULTI I/O CARD

6.1.3 Signal LEDs

There are 3 LEDs for each port on the Multi I/O. The DCE LED glows red when the port is configured as a DCE, the RXD LED blinks green when data is received and the TXD LED blinks green when data is transmitted.

6.1.4 Multi I/O Signal Handling

Signaling through each V.24 port complies fully with ITU-T’s V.24 and EIA-232D standards for each DB-25 on the Multi I/O cable.

6.1.5 Multi I/O Card Power Consumption

Power consumption is 3 Watts (10.3 BTU/hr).

Table 6-1 Signal Pin-Outs for Multi I/O V.24

V.24 Signal

Circuit Function EIA CCITTDB-25

Pin No.Signal DTE

Direction-DCE



RTS Request to send CA 105 4 Out In



SG Signal Ground AB 102 7 n/a n/a



*SRD Secondary Receive Data SBB 119 16 not used not used


DTRData Terminal Ready (DTE Ready)

CD 108.2 20 Out In

EXTC Terminal Timing DA 113 24 Out In

3021M100-002 6-5

as

7 UNIVERSAL I/O CARD

The Universal I/O card supports five serial ports with maximum port speeds of 2.048 Mbps. The physical interface for each port is configured independentlyV.24, V.35, or X.21, and DTE or DCE operation. A custom breakout cable is required for the single high-density port connector.

3006M100-002 7-1


th

7.1 Universal I/O Card Components

This section describes the major components of the Universal I/O card. Thphysical layout of the components is shown in Figure 7-1. Figure 7-2 provides a functional block diagram of the card.

7.1.1 CX900e I/O Bus

The CX900e I/O bus carries the address bus, data bus, and clocking/control signals from the motherboard CPU to the Universal I/O card. Transceivers interface the local buses to the CX900e I/O bus. Connection of the I/O bus tomotherboard is via a 120-pin card edge connector.

7.1.2 Communications Controller

The MC68EN360, located at U3, is a Quad Universal Integrated Communications Controller (QUICC) containing four Serial Communication Controllers (SCCs) which serve ports 2 to 5. The SCC for Port 1 is provided by the motherboard.

An additional QUICC is required when Universal I/O cards are installed in slots 5 or 6. This QUICC is located on the Data Expansion Module (DEM) which is plug-in card inserted into a 144-pin SODIMM connector on the motherboard on U3.

Figure 7-1 Universal I/O Card

(to m oth erb oa rd e xp an s io n s lo ts )e dg e con n e c to r

co n figu ratio n co n n ec to rp h ys ica l in te rfa ceD T E /D C E p o rt

co nfig u ra tion co nn e c to r

L K Ju m pe rs (LK 1 to L K 5 ) co n fig uratio n co n n e cto rc lo ck so u rce

7-2 3006M100-002


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le

tat

7.1.3 Programmable Headers

Programmable headers enable the hardware configuration of the serial I/O ports. The Universal I/O card contains three sets of five miniature surface-mount sokets that are populated with small PCBs. The orientation of the PCBs determines the configuration of the physical protocol (V.24, V.35, or X.21), interface (DTE or DCE), and clock source (internal or external) for each port.

7.1.4 Universal I/O Connector Plate

Port Connector

The Universal I/O connector plate features one 68-pin Very High Density CabInterconnect (VHDCI) connector for external connections to the network; seFigure 7-3. All five I/O ports share this single connector.

Status-indicator LED

Three LEDs are visible through the connector plate which indicate the status othe link. Any of the five links can be monitored by setting the thumbwheel to the appropriate port. The LEDs are under software control and can display two ses: ON and OFF. Table 7-1 lists the indications associated with the LED states and their applicability to either DTE or DCE operation.

Figure 7-2 Universal I/O Card, Simplified Block Diagram

C X 950I/O B U S

Q U IC C LIN EIN TE R FA C E

D R IV E R S

A D D R E S SB U S

D ATAB U S

C O N TR O L

A D D R E S SL AT C H E S

D ATAX C E IV E R S

P O R T 2

P O R T 2

P O R T 5 P O R T 5

P O R T 1

P O R T 1

P O R T 4 P O R T 4

P O R T 3P O R T 3

P R O G R A M M A B L EH E A D E R S

S TATU SIN D IC AT IN G

LE D S

I/OC O N N E C TO R

P LAT E

3006M100-002 7-3


e
Thumbwheel The connector plate features a thumbwheel that is used in conjunction with thstatus-indicator LEDs for port monitoring. Each serial port can be monitored, in turn, by setting the thumbwheel to the appropriate port number (1-5).
LED LED State Indication

TXDOn Data is being transmitted.

Off Data is not being transmitted.

RXDOn Data is being received.

Off Data is not being received.

DCEOn This port is set as DCE.

Off This port is set as DTE.

Table 7-1 Universal I/O Card LED Status

Figure 7-3 Universal I/O Card, Connector Plate

T X D D C E

M O N .S E L .

P O R T S1 T O 5

VH D C Icon nector

U N IV E R S A LS E R IA L

I/O

Thum bw heel

R X D

7-4 3006M100-002


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7.2 Universal I/O Cable

The Universal I/O module is equipped with an octopus cable that features a VHDCI connector on one end and 5 cable legs equipped with RS-232 connecon the other end. This allows the Universal I/O module to support 5 interfaces through a single port. The Universal I/O cable is available for 3 types of interfaces: V.24, X.21, and V.35. A combination of these interfaces can bachieved by using the RS-232/V.24 cable, and adding X.21 and/or V.35 interfadaptors.

7.3 Configuration

Each port of the Universal I/O card is hardware configurable for the following:

• physical interface (V.24, V.35, or X.21)

• DTE or DCE operation

• clock source (internal or external) and split clock

Miniature PCBs are used to configure each port. The PCBs enable cross-connections for the various options and do not contain active components. Thorientation of the three PCBs, one for each configurable option, determines the setting of the port’s attributes. Each of the five ports must be individually configured using this method.

7.3.1 Physical Protocol Configuration

The PCB for selecting the physical protocol has contacts on three edges, one edge for each protocol. To configure a protocol, simply insert the PCB edge that islabelled with the required protocol into the connector. Physical interface connectors are located at J12, J22, J32, J42 and J52. Figure 7-4 shows thorientation of the PCB for configuring the V.35 protocol.

3006M100-002 7-5


7.3.2 DTE/DCE Configuration

DTE/DCE selection for each port is configured by inserting the appropriate edge of the PCB into the connector. DTE/DCE port configuration connectors are located at J11, J21, J31, J41 and J51. Figure 7-5 demonstrates the PCB orientation for DTE configuration.

Figure 7-4 Configuring the V.35 Protocol

1 V.3511 2 1 12X .21

V.24

Figure 7-5 Configuring DTE Operation

1 21D T E

DCE

7-6 3006M100-002


ck is

it

TXC

7.3.3 Clock Source Configuration

Each port is configurable for TXC or ETXC mode. TXC mode means that only the standard transmit clock TXC is available for the transmit data, i.e., the clooutput from the DCE and input to the DTE. ETXC mode means that only the standard external (or DTE) transmit clock (ETXC) is available for the transmdata (from DTE to DCE). Clock source configuration connectors are located at J15, J25, J35, J45 and J55. Figure 7-6 demonstrates the PCB orientation forconfiguration.

Split Clocking The TXC/EXTXC selector is used to support split clocking on the Universal I/O. An external adapter (part # CBLA0031-000) is required to perform split clocking. Table 7-2 summarizes the appropriate configuration required:

7.4 Power Requirements

PowerConsumption

1.63 Watts (3.3V5.4 Watts (5V)

Power Source The motherboard 120-pin connector supplies +12 VDC to the card and provides the Ground return. An on-board switching regulator provides +5 VDC and +3.3 VDC to the card circuits.

Figure 7-6 TXC Configuration

TXC

ETXC

Table 7-2 TXC/EXTXC Settings

Protocol Mode TXC/EXTXC Adapter

V.24/V.35 (DCE/DTE) non-split clock TXC not required

V.24/V.35 (DCE/DTE) split clock EXTXC CBLA0031-000

X.21 (DCE/DTE) split clock/non-split clock EXTXC not required

3006M100-002 7-7

pplies

ni-

or as

s

8 ANALOG VOICE I/O CARD

The Analog Voice I/O Cards, which mount on the motherboard in any of slots 1-6, enable the CX900e to transmit and receive voice and fax data. Each card sua single analog voice/fax port controlled by a C31 Digital Signaling Processor (DSP), and a Line Interface Driver (LID).

WARNING: The Analog Voice I/O card cannot coexist with the following C54 DSP-based cards in the same CX900e chassis:- Dual Analog Voice I/O Card (DAV I/O)- BRI Digital Voice I/O Card (BRI-DV I/O)

The Analog Voice I/O Card requires a -48V/Ring Generator card to be mounted on the motherboard.

NOTE: To Our Users in Australia

According to the certification requirements of the Australian TeleCommucations Authority, we advise you that:

When connecting the Analog Voice I/O card via FXO, FXS, E&M 2-wire, E&M 4-wire LIDs, you should only use CCL listed interconnection cablesthey adhere to technical standard TS 008.When using E&M 2-wire LIDs, you should only use drivers with 600 Ohmcomplex impedance (Australian Complex).

3006M100-002 8-1


or

ut her

8.1 Analog Voice I/O Card Components

User-relevant components on the Analog Voice I/O Card include:

• edge connector

• port connector

• Line Interface Driver (LID)


The connector plate fixes the female six-wire RJ-12 and the female eight-wire PB-45 connectors to the chassis rear panel with two Phillips-head screws.

NOTE: Attachment of the connector plate to the chassis is required at all times fgood grounding.

The LID is a daughterboard which mounts on the Analog Voice I/O card and controls the voice channel signalling and network line interface. The LIDs arfurther described in paragraph 8.3.

NOTE: The PB-45 connector is mechanically identical to an RJ-45 connector, bthe PB-45 connector is used in equipment-to-equipment connections ratthan equipment-to-network connections.

Figure 8-1 Analog Voice I/O Card (without LIDs)

8-2 3006M100-002


rs

and

n

8.2 Compression Rates Supported

The card supports compression of the 64 Kbps voice stream to rates of 5.8 Kbpsor 8 Kbps using Algebraic Code-Excited Linear Prediction II (ACELP II); 40, 32, 24, or 16 Kbps (G.726); or 64 Kbps (G.711) on the system bus.

8.3 Line Interface Drivers

A line interface driver (LID) is a daughterboard which is mounted in connectoJ1, J3 and J5 on the Analog Voice I/O Card. The LIDs provide the interface configuration for transformerless telephone connections (FXO and FXS only)control the signaling on the channel. Each Analog Voice I/O Card and its associated port requires a LID.

LIDs are of five types: E&M 2-wire, E&M 4-wire, E&M 2/4-wire, FXO, and FXS.

8.3.1 E&M Drivers

The E&M drivers provide connections to telephone equipment such as a PBX using either a two-wire or four-wire voice connection. They can be configured to comply with E&M types I, II, III, IV and V standards. The following paragraphs describe the three types of E&M driver that are available. The LIDs support aRJ-12 and a PB-45 port connector.

Figure 8-2 Analog Voice I/O Connector Plat

3006M100-002 8-3


1 R in

e.

E&M 2-wire and 4-wire

The E&M 2-wire and E&M 4-wire LIDs feature 600 Ohm line impedance.

Unlike the E&M 4-wire LID, the E&M 2-wire LID does not require the T1 to Tor R1 to R1 connections in straight-through signalling or the T1 to T or R1 to reverse signalling.

E&M 2/4-wire The E&M 2/4-wire driver can accommodate both types of analog interface (2- o4-wire) and several line impedances. Configuration is achieved through jumpesettings on the LID.

Table 8-1 and Table 8-2 list the jumper settings for configuring the line impedance and analog interface, respectively.

NOTE: Default settings are 600-Ohm line impedance and 4-wire analog interfac

Table 8-1 Jumper Settings for E&M 2/4-wire Line Impedance

Line Impedance Jumper Required

LK2 LK1

600 Ohms resistive Yes Yes

900 Ohms resistive Yes No

ATT Complex: 900 Ohms in series with 2.16µF No Yes

Australian Complex: 220 Ohms in series with (820 Ohms//120nF) No No

Table 8-2 Jumper Settings for E&M 2/4-wire Analog Interface

Analog Interface LK3 Jumper Required

4-wire Yes

2-wire No

8-4 3006M100-002


r

8.3.2 FXO and FXS Drivers

The FXS (Foreign eXchange Station) LID is used for connection to a telephone. The FXS LID provides -48 VDC battery voltage, generates the ring signal and supports Loop Start detection, Direct Inward Dialing (DID), and Flash Hook signaling.

The FXO (Foreign eXchange Office) LID is used for connection to a central Public Switched Telephone Network (PSTN) office. The FXO LID supports Loop Start as well as Direct Inward Dialing (DID) and Flash Hook signaling. The FXO also detects ringing, and is compatible with -24 or -48 VDC phone interfaces.

Both FXS and FXO LIDs may be used for direct connections to the PBX.

Both LIDs support 2-wire connections via RJ-12 port connectors. Line impedancfor the FXO and FXS LIDs is software-configurable for 600 Ohms, 900 Ohms, oAT&T compromise impedance.

8.4 Voice LID Signal Handling

The following tables describe the signal outputs for North America and Europe for the 6-pin RJ-12 connector and the 8-pin PB-45 connectors. The FXO detects -48V and ringing signals. It can also connect to a PBX.

Table 8-3 Voice Connector Signal Output (RJ-12)

6-pin North American European

1 E E

2 T1 RxA

3 R TxB

4 T TxA

5 R1 RxB

6 M M

Table 8-4 Voice Connector Signal Output (PB-45)


1 M M

2 E E

3 T1 RxA

4 R TxB

5 T TxA

3006M100-002 8-5


8.5 Layouts for E&M Signaling Leads

The following diagrams illustrate the arrangements for normal signaling of E&M 4-wire Types I, II, III, IV and V. The same diagrams apply to the E&M 2-wirdriver except that T1 to T1 and R1 to R1 connections are not present. The E&M connects to a PBX which would determine the type.

6 R1 RxB

7 SG SG

8 SB SB

Table 8-4 Voice Connector Signal Output (PB-45)


Figure 8-3 E&M Signal, 4-Wire Type I

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8-6 3006M100-002


Figure 8-4 E&M Signal, 4-Wire Type II

Figure 8-5 E&M Signal, 4-Wire Type III

! "# !$$ "#

! "# !$$ "#

!

"

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3006M100-002 8-7


Figure 8-6 E&M Signal, 4-Wire Type IV

Table 8-5 E&M Signal, 4-Wire Type V

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! "# !$$ "#

G .D.

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8-8 3006M100-002


d

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8.6 Analog Voice I/O Cables

The Analog Voice I/O Card connects to external devices through one of thfollowing separately-ordered cables:

• three meter (10 ft) straight-through cable with a male RJ-12 connector at each en(part no. 60300049; used with FXS, FXO, and E&M type I or V voice interface).

• three meter (10 ft) straight-through cable with a male RJ-45 connector at each en(part no. 60300050; used with E&M types I through V voice interfaces).

• one-meter (40 in) octopus cable with eight male RJ-12 connectors (each supportinsignals) at one end for connection to voice ports, and forming a single cable at thother end with a standard 25-pair telco female connector (part no. 60300051; useconnect to PBX punch block with E&M type I or V voice interface).

• one-meter (40 in) octopus cable with six male RJ-45 connectors (each supportingsignals) at one end for connection to voice ports, and forming a single cable at thother end with a standard 25-pair telco female connector (part no. 60300052; useconnect to PBX punch block with E&M types I through V voice interfaces).

3006M100-002 8-9


-

nd

8.7 E&M Pin-Outs and Wiring for Octopus Cables

Two types of Octopus cables are available. Each type terminates at the userend with a USOC standard Telco 25-pair female connector. At the Analog Voice I/O side:

• 8-leg cables with RJ-12 connectors, this type is used with E&M (4-wire) Types I aV.

• 6-leg cables with PB-45 connectors, this type is used with E&M (4-wire) Types I through V.

Table 8-6 RJ-12 Pin-out

Pin Signal

1 E

2 T1

3 R

4 T

5 R1

6 M

Table 8-7 PB-45 Pin-out

Pin Signal

1 M

2 E

3 T1

4 R

5 T

6 R1

7 SG

8 SB

8-10 3006M100-002


Table 8-8 RJ-12 Wiring

Leg#RJ-12

PinCable

PinConductor

RJ-12 Pin

Cable Pin

Conductor

1356

123

blue/whiteorange/whitegreen/white

421

262728

white/bluewhite/orangewhite/green

2356

456

brown/whiteslate/whiteblue/red

421

293031

white/brownwhite/slatered/blue

3356

789

orange/redgreen/redbrown/red

421

323334

red/orangered/greenred/brown

4356

101112

slate/redblue/blackorange/black

421

353637

red/slateblack/blueblack/orange

5356

131415

green/blackbrown/blackslate/black

421

383940

black/greenblack/brownblack/slate

6356

161718

blue/yelloworange/yel-lowgreen/yellow

421

414243

yellow/blueyellow/orangeyellow/green

7356

192021

brown/yellowslate/yellowblue/violet

421

444546

yellow/brownyellow/slateviolet/blue

8356

222324

orange/violetgreen/violetbrown/violet

421

474849

violet/orange/violet/green/violet/brown

N/C 25 slate/violet N/C 50 violet/slate

Table 8-9 PB-45 Wiring

Leg#RJ-12

PinCable

PinConductor

RJ-12 Pin

Cable Pin

Conductor

1

4678

1234

blue/whiteorange/whitegreen/whitebrown/white

5321

26272829

white/bluewhite/orangewhite/greenwhite/brown

2

4678

5678

slate/whiteblue/redorange/redgreen/red

5321

30313233

white/slatered/bluered/orangered/green/

3

4678

9101112

brown/redslate/redblue/blackorange/black

5321

34353637

red/brownred/slateblack/blueblack/orange

3006M100-002 8-11

8.8 Analog Voice I/O Card Power Consumption

The power consumption is 2.5 Watts (8.5 BTU/hr) with LID.

4

4678

13141516

green/blackbrown/blackslate/blackyellow/blue

5321

38394041

black/greenblack/brownblack/slateblue/yellow

5

4678

17181920

orange/yel-lowgreen/yellowbrown/yellowslate/yellow

5321

42434445

yellow/orangeyellow/greenyellow/brownyellow/slate

6

4678

21222324

blue/violetorange/violetgreen/violetbrown/violet

5321

46474849

violet/blueviolet/orangeviolet/greenviolet/brown


Table 8-9 PB-45 Wiring

Leg#RJ-12

PinCable

PinConductor

RJ-12 Pin

Cable Pin

Conductor

ny

ni-

ere

9 DUAL ANALOG VOICE I/O CARD

The Dual Analog Voice (DAV) I/O cards, which mount on the motherboard in aof slots 1-6, enable the CX900e to transmit and receive voice and fax data. Each card uses a C54 DSP to supply two analog voice/fax ports controlled by SLIM Line Interface Drivers (SLIM LIDs).

WARNING: The Dual Analog Voice I/O card cannot coexist with the following C31 DSP-based cards in the same CX900e chassis:- Analog Voice I/O Card- DDVC (Dual Digital Voice Compression) Card

The DAV I/O card requires a -48V/Ring Generator card to be mounted on themotherboard.

NOTE: To Our Users in Australia

According to the certification requirements of the Australian TeleCommucations Authority, we advise you that:

When connecting the DAV I/O card via FXO, FXS, or E&M 2/4-wire SLIMLIDs, you should only use CCL listed interconnection cables as they adhto technical standard TS 008.When using FXO SLIM LIDs, you must set them to Australian Complex impedance.

3006M100-002 9-1


cal

9.1 DAV I/O Card Components

This section describes the major components of the DAV I/O card. The physilayout of the components is shown in Figure 9-1. Figure 9-2 provides a functional block diagram of the card.

9.1.1 CX900e I/O Bus

The CX900e I/O bus carries the address bus, data bus, and clocking and control signals from the motherboard CPU to the DAV I/O card. Transceivers interface the local buses to the CX900e I/O bus. Connection of the I/O bus to the motherboard is via a 120-pin card edge connector.

9.1.2 Digital Signal Processor

The Digital Signal Processor (DSP) is the core of the DAV I/O card. The DSP uses fixed point arithmetic suitable for G.729 voice compression. A 64k x 16 SRAM provides external memory to the DSP.

9.1.3 Analog Interface Controller

Two Analog Interface Controllers (AICs) provide bi-directional analog interfaces to the voice SLIM LIDs. The analog interface between the SLIM LIDs and the AICs are differential to minimize noise.

Figure 9-1 DAV I/O Card (without SLIM LIDs)

e dge c onne cto r(to m o th erboa rd expa nsion s lo ts )

con nec to r p la teL ID soc ke ts

L ID s ock e ts

D S P

P L D

9-2 3006M100-002


9.1.4 Programmable Logic Device

The Programmable Logic Device (PLD) performs three main functions: 1) An interface between the DSP and the motherboard, 2) a logic interface between thDSP and the SLIM LIDs, and 3) a clock distribution circuit for the AICs and the DSP.

9.1.5 DAV I/O Connector Plate

The DAV I/O connector plate features two RJ connectors for external connections to the voice/fax equipment; see Figure 9-3. The RJ connector is an integral part of each SLIM LID.

Figure 9-2 DAV I/O Card, Simplified Block Diagram

CX 900eI/O B US

ADDRE SSB US

DATAB US

CONTROL

V OICECHANNE L 2

VOICECHA NNEL 1

I/OC O N N E CTO R

P LATE

P L D DS P

S RA M

A IC

A IC

V O IC ES L IML ID

VO ICES LIMLID

S TATU S & CO NT RO L

TX, RX

TX, RX

SE RIALPORT 1

SE RIALPORT 2

3006M100-002 9-3


e

of 8

ach set

r

WARNING: Attachment of the connector plate to the chassis is required at all timfor good grounding.

9.2 Speeds Supported by the DAV I/OThe DAV I/O card supports compression of the 64 Kbps voice stream to ratesKbps (G.729) and 40, 32, 24, or 16 Kbps (G.726), or 64 Kbps (G.711).

9.3 SLIM Line Interface Drivers (SLIM LIDs)

One SLIM LID is required for each channel and is selected according to the interface requirement (FXS, FXO, or E&M). It features an on-board jumper configuration. The SLIM LID provides the RJ-45 or RJ-12 I/O connector and drives the port signaling. Each SLIM LID is plugged into the DAV I/O card viatwo sets of sockets (J1 and J2 for channel 1, and J3 and J4 for channel 2). Econsists of one socket for analog and digital signals, and one socket for high voltage signals (-48V and ring). The FXS SLIM LID has its own ring generatosupplying the ring voltage.

Figure 9-3 DAV I/O Connector Plate

D U A LA N A LO GV O IC E

C H -1

C H -2

9-4 3006M100-002


4

WARNING: Contrary to the original FXO and FXS, LIDs, the new FXO and FXSSLIM LIDs do not support Groud Start.

9.3.1 FXS

The FXS (Foreign eXchange Station) SLIM LID is used for connection to a telephone. The FXS SLIM LID provides -48 VDC battery voltage, generates the ring signal and supports Loop Start detection, Direct Inward Dialing (DID), and Flash Hook signaling.

9.3.2 FXO

The FXO (Foreign eXchange Office) SLIM LID is used for connection to a central PSTN office. The FXO SLIM LID supports Loop Start as well as Direct Inward Dialing (DID) and Flash Hook signaling. The FXO also detects ringing, and is compatible with -24 or -48 VDC phone interfaces.

Both FXS and FXO SLIM LIDs may be used for direct connections to the PBX.

9.3.3 E&M

The E&M 2/4-wire SLIM LID is used for direct connection to a Private Branch Exchange (PBX) using either a two-wire or four-wire voice connection. It can be configured to E&M types I, II, III, IV and V, normal and reverse.

The PBX determines the type of signaling. Figures 9-4 to 9-8 illustrate E&M wire Types I, II, III, IV and V. The same diagrams apply to an E&M 2-wirinterface except that there is no T1-to-T1and R1-to-R1 connection.

3006M100-002 9-5


Figure 9-4 E&M Signal, 4-Wire Type I

Figure 9-5 E&M Signal, 4-Wire Type II

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9-6 3006M100-002


Figure 9-6 E&M Signal, 4-Wire Type III

Figure 9-7 E&M Signal, 4-Wire Type IV

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! "# !$$ "#

!"

#

$ "

%&" "

'( )) '(

" # "

'( )) '(

# " "

G .D .

3006M100-002 9-7


9.4 Configuring Voice SLIM LIDs

Voice SLIM LIDs are hardware configured using jumper banks. In order to reconfigure a voice SLIM LID, the relevant jumper bank(s) must be removed and reinserted in the required location. Jumper locations are silk-screened on theSLIM LID.

9.4.1 E&M 2/4-wire

The E&M 2/4-wire SLIM LID is hardware configurable, with a number of jumper banks, to match:

• a 2 or 4 wire interface

• line impedance

• signalling type

• normal or reverse signalling

NOTE: Normal signalling is also known as B side or Channel Equipment side.

Figure 9-8 E&M Signal, 4-Wire Type V

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9-8 3006M100-002


ur

The default settings are 2-wire, 600 Ohm, Type 1, Normal signaling. Figure 9-9 shows the jumper bank locations for the default configuration.

NOTE: Do not remove LK19. It must remain in position at all times.

9.4.2 FXO

FXO line impedance is hardware configurable through jumper settings; see Table 9-1. As an example, Figure 9-10 demonstrates the jumper bank position for configuring 600 Ohm impedance.

FXO SLIM LID for Australia

Table 9-2 provides the FXO jumper settings for Australia. As an example, Fig9-11 demonstrates the jumper bank position for configuring 600 Ohm impedance.

Figure 9-9 E&M 2/4-Wire Jumper Settings

R E V N O R V IV III II I

2W4W

90 0 6 00 A U S A T T

IIIIIIIVV

R everses igna ling

s igna lingN orm al typesigna ling

ΩΩ

900600

AT& T

A ustra liaC om plex

2-w ire4-w ire

R J-45 L K 1 9

Jum per Banks

Jum per Banks

L ine Im pedance

Table 9-1 FXO Jumper Settings for LK1

Location 600 Ohm 900OhmAT&T Com-

promise

LK1 connect A-B connect B-C connect C-D

3006M100-002 9-9


n th

Current Limit for France

For FXO in France, there is a limit on the amount of current that may be drawn from the Public Switched Telephone Network (PSTN). There is a transistor oFXO SLIM LID which monitors and controls the current so that it does not exceedthe limit. The restriction is shown below in Table 9-3.

Table 9-2 FXO Jumper Settings for Australi

Location900 Ohm

Australia Special

LK1 n/a connect C-D

Table 9-3 FXO Jumper Settings and Current Limit for LK2

LocationCurrent

Limit

LK2 connect 1-2 no limit

LK2 France connect 2-3 60 mA

Figure 9-10 FXO Jumper Settings

P 2

ATT

600

900

Ω

Ω

AT& T

RJ-11

ABCD

Jumper Bank

600

900

1 2 3

Normal: 1 - 2 France: 2 - 3

LK 2

9-10 3006M100-002


9.4.3 FXS

Line impedance is hardware configurable through jumper settings. As an example, Figure 9-12 shows the jumper bank position for configuring 900 Ohm impedance.

Figure 9-11 FXO Jumper Settings for Australia

AUS

600 Ω

R J-11

ABCD

Jum pe r Bank

600

Figure 9-12 FXS Jumper Settings

600 900

ATTL K 1

R J-11

Ju m per B an k

P 2

P 1

IMPORTANT: B ra ck e t m u st b e se cu re ly fas tene d torea r pane l o f cha ss is b e fo re pow e ring up th e un it,o th e rw is e o ve rvo lta ge p ro tec tion w il l be d is ab led .

3006M100-002 9-11


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9.5 Voice SLIM LID Connector Pin Assignments

The following tables describe the signal outputs for North America and Europe for the 6-pin RJ-12 connector and the 8-pin RJ-45 connectors.

9.6 Voice I/O Cables

The DAV I/O card connects to external devices through one of the following separately-ordered cables:

• three meter (10 ft) straight-through cable with a male RJ-12 connector at each en(part no. 60300049; used with FXS and FXO).

• three meter (10 ft) straight-through cable with a male RJ-45 connector at each en(part no. 60300050; used with E&M types I through V voice interfaces).

• one-meter (40 in) octopus cable with six male RJ-45 connectors (each supportingsignals) at one end for connection to voice ports, and forming a single cable at thother end with a standard 25-pair telco female connector (part no. 60300052; useconnect to PBX punch block with E&M types I through V voice interfaces).



1 E E

2 T1 RxA

3 R TxB

4 T TxA

5 R1 RxB

6 M M



1 M M

2 E E

3 T1 RxA

4 R TxB

5 T TxA

6 R1 RxB

7 SG SG

8 SB SB

9-12 3006M100-002


5-

9.7 E&M Pin-outs and Wiring for Octopus Cables

The octopus cable terminates at the user-end with a USOC standard Telco 2pair female connector. The other side of the cable features 6-leg cables with RJ-45 connectors.

Table 9-6 PB-45 Pin-out

Pin Signal

1 M lead

2 E lead

3 Tip1

4 Ring

5 Tip

6 Ring1

7 SG

8 SB

Table 9-7 RJ-45 Wiring

Leg#RJ-45

PinCable

PinConductor

RJ-45 Pin

Cable Pin

Conductor

1

4678

1234

blue/whiteorange/whitegreen/whitebrown/white

5321

26272829

white/bluewhite/orangewhite/greenwhite/brown

2

4678

5678

slate/whiteblue/redorange/redgreen/red

5321

30313233

white/slatered/bluered/orangered/green/

3

4678

9101112

brown/redslate/redblue/blackorange/black

5321

34353637

red/brownred/slateblack/blueblack/orange

4

4678

13141516

green/blackbrown/blackslate/blackyellow/blue

5321

38394041

black/greenblack/brownblack/slateblue/yellow

5

4678

17181920

orange/yel-lowgreen/yellowbrown/yellowslate/yellow

5321

42434445

yellow/orangeyellow/greenyellow/brownyellow/slate

6

4678

21222324

blue/violetorange/violetgreen/violetbrown/violet

5321

46474849

violet/blueviolet/orangeviolet/greenviolet/brown


3006M100-002 9-13


9.8 Power Requirements

9.8.1 Power Supply

The DAV I/O card is completely powered by the 5V source from the motherboard. The 5V source supplies the 3.3V switching regulator and the 5V analog powefilter. The 3.3V source supplies the 2.5V regulator.

The DAV I/O card also receives -48V, -15V, +15V power from the Ring Generator card which it distributes to the SLIM LID connectors.

9.8.2 Power Consumption

The power consumption is 2.1 Watts with SLIM LID.

9-14 3006M100-002

10 -48V/RING GENERATOR MODULE

The -48V/Ring Generator Module supplies -48 VDC and ringing voltage to thAnalog Voice I/O card, and the Dual Analog Voice (DAV) I/O card. The -48V/Ring Generator Module must be installed whenever these cards are used.

3006M100-002 10-1


10.1 -48V/Ring Generator Components

Important components on the -48V/Ring Generator Module include:

• motherboard connector

• fasteners to optional DEM

10.1.1 Features

-48V Power Output Voltage:48 to -52 VDC

Current:0 to 200 m

RingGenerator

Output Voltage:86V (root mean squared)

Load:4 Phone sets

Frequency:20 Hz

Signal Shape:Square-wave filtered

Figure 10-1 -48V/Ring Generator Module

10-2 3006M100-002

11 CSU/DSU I/O CARD

There are two types of CSU/DSU I/O cards: 56K (with switched 56K capabilityand 64K Clear Channel. The I/O mounts on the motherboard in any of slots 1-4 and also slots 5-6 if the DEM is installed. This card enables the CX900e to exchange data over Digital Data Service (DDS) networks.

3006M100-002 11-1


11.1 CSU/DSU I/O Card Components

Important components on the CSU/DSU I/O Card include:

• edge connector

• port connector

• option sticker (indicating 56Kbps or 64Kbps)

• EPROM

• programmable logic device


The connector plate fixes the female RJ-45 connector to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 11-1 CSU/DSU I/O Card

11-2 3006M100-002

11 CSU/DSU I/O CARD

11.1.1 CSU/DSU I/O Card Signal Handling

The following table gives the signal Pin-Outs for the RJ-45 connector.

11.1.2 Power

Power Consumption

2.0 Watts (6.8 BTU/hr).

Power Source The motherboard 120-pin connector supplies +5 VDC to the card and its Ground return.

Figure 11-2 CSU/DSU I/O Card, Connector Plate

Table 11-1 CSU/DSU Port Signals

Signal Pin No.

R1 (Ring 1, Transmit Data) 1

T1 (Tip 1, Transmit Data) 2

not used 3

not used 4

not used 5

not used 6

T (Tip, Receive Data 7

R (Ring, Receive Data) 8

3006M100-002 11-3

12 ISDN BRI-U I/O CARD

The ISDN BRI-U I/O Card, mounts on the motherboard in any of slots 1-6. It enables the CX900e to exchange data over an Integrated Services Digital Network (ISDN) as a Basic Rate Interface-U (BRI-U).

Basic Rate ISDN provides one D channel for signaling and two B channels for data transmission at 64 Kbps each.

3006M100-002 12-1


12.1 ISDN BRI-U I/O Card Components

Important components on the ISDN BRI-U I/O Card include:

• edge connector

• port connector

• signal LEDs

Figure 12-1 ISDN BRI-U I/O Card

Figure 12-2 ISDN BRI-U I/O Card, Connector Plate

12-2 3006M100-002

12 ISDN BRI-U I/O CARD

l

el.



12.1.1 ISDN Port Signal Handling

When the ISDN BRI-U I/O Card is connected to the network, signal LEDs indicate the status of the connection. The SYNC LED indicates that the D channeis signaling the switch at the Local Exchange (LE). The 2 LEDs labeled B1, for B channel 1, and B2, for B channel 2, indicate data transmission on that chann

12.1.2 Power

Power Consumption


Power Source The motherboard 120-pin connector supplies +5 VDC to the card and provides the Ground return.

Table 12-1 Signal Pin-Outs for ISDN BRI-U Port

Signal Pin No.

not connected 1

not connected 2

not connected 3

Tip 4

Ring 5

not connected 6

not connected 7

not connected 8

3006M100-002 12-3

is:

13 ISDN BRI-S/T I/O CARD

The ISDN BRI-S/T I/O Card mounts on the motherboard in any of slots 1-6. When used alone, it enables the CX900e to exchange data over a BRI-S/T interface. With a C31 DSP-based Dual Digital Voice Compression (DDVC) Card, the ISDN BRI-S/T I/O card can exchange compressed voice over both Bearer (B) channels.

WARNING: The Dual Digital Voice Compression (DDVC) Card cannot coexist with the following C54 DSP-based cards in the same CX900e chass- Dual Analog Voice I/O Card (DAV I/O)- ISDN BRI-S/T Digital Voice I/O Card

In networks where the telco supplies Network Termination 1 (NT1), the CX900e must use a BRI-S/T (4-wire) interface.

3006M100-002 13-1


13.1 ISDN BRI-S/T I/O Card Component

Important components on the ISDN BRI-S/T I/O Card include:

• edge connector

• port connector

• configuration jumpers

• signal LEDs

Figure 13-1 ISDN BRI-S/T I/O Card

Figure 13-2 ISDN BRI-S/T Connector Plate

13-2 3006M100-002


rd. e

.

.


The connector plate fixes the female RJ-45 connector and signal LEDs to the chassis rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

The configuration jumpers allow the ISDN BRI-S/T I/O card to be configured as Terminal Equipment (TE) or as Network Termination (NT).

13.1.1 ISDN BRI-S/T Jumper Settings

The ISDN BRI-S/T I/O card has a number of pin connectors that can be modified with suitcase jumpers to change the configuration of the ISDN BRI-S/T I/O caThese include jumpers for configuration and termination. The location of thesconnectors, labeled LK 1 through LK 9, are shown in Figure 13-1.

Configuration For Network Termination (NT) configuration, connect pins 1 and 2 of thappropriate connector. For Terminal Equipment (TE) configuration, connect pins 2 and 3 of the same connector. The following table provides the list of connectors and their jumper settings.

Termination For a CX900e with an I/O configured as NT or if it is the last TE on the line, termination must be turned ON by connecting pins 1 and 2 at LK 7 and LK 9. The ISDN BRI-S/T I/O card comes from the factory with the termination set to ON

If the ISDN BRI-S/T I/O is configured as TE and it is not the last TE on the line, termination must be turned OFF by connecting pins 2 and 3 at LK 7 and LK 9

13.1.2 ISDN BRI-S/T Port Signal Handling

The signal-to-pin relationships on the RJ-45 connector are different for an ISDN BRI-S/T I/O card configured as TE (user side) or NT (network side). Table 13-2 shows the signal pin-outs for each configuration.

Table 13-1 ISDN BRI-S/T Connector Jumper Settings

Connector NT Configuration TE Configuration (Default)

LK1 pins 1-2 pins 2-3







3006M100-002 13-3


8.

NOTE: To Our Users in AustraliaWhen connecting an ISDN BRI-S/T interface, you should only use CCL listed interconnection cables as they adhere to technical standard TS 00

13.1.3 Power

PowerConsumption


Power Source The motherboard 120-pin connector supplies +5 and +15 VDC to the card and provides the Ground return.

On-board Power Supply and Detection

In the NT configuration, the card can supply (between the Tx and Rx lines) up to 25mA at 40 VDC (PS1 or phantom power) to an external device.

In the TE configuration, the card is able to detect the 40VDC (PS1 or phantom power) from the ISDN S/T line.

WARNING:This equipment will not operate when main power fails.

Table 13-2 Signal Pin-Outs for ISDN BRI-S/T Port

Pin # TE Signal NT Signal

1 not used not used

2 not used not used

3 +Transmit +Receive

4 +Receive +Transmit

5 - Receive - Transmit

6 - Transmit - Receive

7 not used not used

8 not used not used

13-4 3006M100-002


ility

is:

13.2 Dual Digital Voice Compression Card

A C31 DSP-based Dual Digital Voice Compression (DDVC) Card must binstalled with an ISDN BRI-S/T I/O Card to provide compressed voice capabto the CX900e. The card can be mounted in any I/O slot but we recommend that it be installed next to the ISDN BRI-S/T I/O Card.

WARNING: The Dual Digital Voice Compression (DDVC) Card cannot coexist with the following C54 DSP-based cards in the same CX900e chass- Dual Analog Voice I/O Card (DAV I/O)- BRI Digital Voice I/O Card (BRI-DV I/O)

The DDVC provides two voice channels that can be software configured for voice compression at 5.8 or 8.0 Kbps (ACELP II) or 16, 24, 32 or 40 Kbps (G.726), o64 Kbps (PCM).

NOTE: Each CX900e chassis can support a maximum of two DDVC Cards (4 voice channels).

The power consumption for the card is 3 Watts (10.3 BTU/hr).

3006M100-002 13-5

ps

14 ISDN BRI-S/T DIGITAL VOICE I/O CARD

The ISDN BRI-S/T Digital Voice I/O card mounts on the motherboard in any of slots 1-6. It enables the CX900e to transmit compressed voice, and data over an ISDN BRI-S/T interface. The B channels can be software configured for voice compression at 8.0 Kbps (G.729) and 40, 32, 24, or 16 Kbps (G.726), or 64 Kb(G.711).

WARNING: The ISDN BRI-S/T Digital Voice I/O card cannot coexist with the fol-lowing C31 DSP-based cards in the same CX900e chassis:- Analog Voice I/O Card- Dual Digital Voice Compression (DDVC) Card

In networks where the telco supplies Network Termination 1 (NT1), the CX900e must use an ISDN-S/T (4-wire) interface.

3006M100-002 14-1


14.1 ISDN BRI-S/T Digital Voice I/O Card Components

Important components on the ISDN BRI-S/T Digital Voice I/O Card include:

• edge connector

• port connector


• signal LEDs

Figure 14-1 ISDN BRI-S/T Digital Voice I/O Card

Figure 14-2 ISDN BRI-S/T Digital Voice I/O Connector Plate

edge connecto r(to m o the rboa rd expans ion s lo ts)

14-2 3006M100-002

14 ISDN BRI-S/T DIGITAL VOICE I/O CARD

can

8


The connector plate fixes the female RJ-45 connector and signal LEDs to the chassis rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

The configuration jumpers allow the ISDN BRI-S/T Digital Voice I/O card to be configured as Terminal Equipment (TE) or as Network Termination (NT).

14.1.1 ISDN BRI-S/T Digital Voice I/O Jumper Settings

The ISDN BRI-S/T Digital Voice I/O card has a number of pin connectors thatbe modified with suitcase jumpers to change the configuration of the ISDN BRIS/T Digital Voice I/O card. These include jumpers for configuration and termination. The location of these connectors, labeled LK 1 through LK 10, are shown in Figure 14-1.

Configuration For Network Termination (NT) configuration, connect pins 1 and 2 of thappropriate connector. For Terminal Equipment (TE) configuration, connect pins 2 and 3 of the same connector. The following table provides the list of connectors and their jumper settings. Please note that LK1 is not used.

Termination For a CX900e with an I/O configured as NT or if it is the last TE on the line, termination must be turned ON by connecting pins 1 and 2 at LK 8 and LK 10. The ISDN BRI-S/T Digital Voice I/O card comes from the factory with the termination set to ON.

If the ISDN BRI-S/T Digital Voice I/O is configured as TE and it is not the last TE on the line, termination must be turned OFF by connecting pins 2 and 3 at LKand LK 10.

Table 14-1 ISDN BRI-S/T Digital Voice Connector Jumper Settings

Connector NT Configuration TE Configuration (Default)

LK1 NOT USED







LK8 see text below


LK10 see text below

3006M100-002 14-3


e).

14.1.2 ISDN BRI-S/T Port Signal Handling

The signal-to-pin relationships on the RJ-45 connector are different for a ISDN BRI-S/T Digital Voice I/O card configured as TE (user side) or NT (network sidTable 14-2 below shows the signal pin-outs for each configuration.

NOTE: To Our Users in AustraliaWhen connecting an ISDN-S/T interface, you should only use CCL listedinterconnection cables as they adhere to technical standard TS 008.

14.2 Power

PowerConsumption


Power Source The motherboard 120-pin connector supplies +5 and +15 VDC to the card and provides the Ground return.

On-board Power Supply and Detection

In the NT configuration, the card can supply (between the Tx and Rx lines) up to 25mA at 40 VDC (PS1 or phantom power) to an external device.

In the TE configuration, the card is able to detect the 40VDC (PS1 or phantom power) from the ISDN S/T line.

WARNING:This equipment will not operate when main power fails.

Table 14-2 Signal Pin-Outs for the ISDN BRI-S/T Port

Pin # TE Signal NT Signal

1 not used not used

2 not used not used

3 +Transmit +Receive

4 +Receive +Transmit

5 - Receive - Transmit

6 - Transmit - Receive

7 not used not used

8 not used not used

14-4 3006M100-002

d

15 V.34 MODEM I/O CARD

The V.34 Modem I/O Card, mounts on the motherboard in any of slots 1-4 analso slots 5 and 6 if the DEM is installed. It enables the CX900e to establish eithea dial backup connection to the network in case its direct connection goes down, or a simple public or private network dialup connection.

3021M100-002 15-1


15.1 V.34 Modem I/O Card Components

Important components on the V.34 Modem I/O Card include:

• edge connector

• port connectors

Figure 15-1 V.34 Modem I/O Card

Figure 15-2 V.34 Modem I/O Card, Connector Plate

15-2 3021M100-002

15 V.34 MODEM I/O CARD

f


The connector plate fixes the female RJ-11 connector and audio jack to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

15.1.1 V.34 Modem Signal Handling

The following table describes the signal to pin relationships for the V.34 modem.

15.2 Modem Capabilitie

The V.34 Modem I/O card acts as an originate or answer modem using any othe protocols listed in the table below.

Table 15-1 V.34 Modem Pin-Outs

Signal Pin No.

not connected 1

not connected 2

Ring 3

Tip 4

not connected 5

not connected 6

not connected 7

not connected 8

Table 15-2 V.34 Modem Protocol/Rate Support

Protocol Possible Data Rates (bps)

Bell 103 300

V.21 300

Bell 212 1200

V.22 1200

V.22bis 2400 or 1200

V.23 1200

V.32 9600 or 4800

V.32bis 14400, 12000, 9600, 7200 or 4800

V.FC 28800, 26400, 24000, 21600, 19200, 16800 or 14400

V.34 28800, 26400, 21600, 19200, 16800, 14400, 12000, 9600, 7200, 4800 or 2400

3021M100-002 15-3


15.2.1 Test Features

The V.34 Modem I/O Card implements the following test features:

• Central Office (CO) activated loopbacks

• V.54 loopbacks including Remote Loop 2

• 511 test pattern insertion and detection, with or without error insertion

• Modem Self-Test

15.2.2 Power

Power Consumption



15-4 3021M100-002

for

16 TOKEN RING LAN I/O CARD

The Token Ring LAN I/O Card mounts on the motherboard in any of slots 1-6. It enables the CX900e to connect to a Token Ring local area network. The Token Ring I/O card features a Token Ring 4/16 Mbps physical interface, MAC (Media Access Control) Addressing, status and control registers and address filteringboth transparent and Source Routing bridging that provide it with bridge/router functionality.

3006M100-002 16-1


16.1 Token Ring LAN I/O Card Components

Important components on the Token Ring LAN I/O Card include:

• edge connector

• port connectors


The connector plate fixes the female DB-9 connector (for shielded twisted-pair, or STP, cable) and female RJ-45 connector (for unshielded twisted-pair, or UTP, cable) to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 16-1 Token Ring I/O Card

Figure 16-2 Token Ring LAN I/O Card, Connector Plate

16-2 3006M100-002

16 TOKEN RING LAN I/O CARD

16.2 Token Ring Port Signal Handling

The following table describes the signal to pin relationships for both the DB-9 and RJ-45 connectors.

16.3 Token Ring I/O Card Power ConsumptionThe power consumption is 5 Watts (17 BTU/hr).

Table 16-1 Token Ring Port Signal Handling

SignalDB-9

Pin No.Signal

RJ-45 Pin No.

RCV+ 1 not connected 1

not connected 2 not connected 2

not connected 3 XMT- 3

not connected 4 RCV+ 4

XMT+ 5 RCV- 5

RCV- 6 XMT+ 6



XMT- 9

3006M100-002 16-3

17 ETHERNET LAN I/O CARD

The Ethernet LAN I/O Card mounts on the motherboard only in slot 1. It enables the CX900e to connect with an Ethernet Local AreaNetwork (LAN). The Ethernet LAN I/O card features an LXT901 Ethernet Interface Adapter, MAC (Media Access Control) Addressing and status and control registers that provide it with bridge/router functionality.

3006M100-002 17-1


17.1 Ethernet LAN I/O Card Components

Important components on the Ethernet LAN I/O Card include:

• edge connector

• port connectors

Figure 17-1 Ethernet LAN I/O Card

Figure 17-2 Ethernet LAN I/O Card Connector Plate

edge connector(to m otherboard expansion slo t)

connector p la te

17-2 3006M100-002

17 ETHERNET LAN I/O CARD

The edge connector fixes the card to expansion slot 1 of the motherboard.

The connector plate fixes the female 10BaseT connector and the female Attachment Unit Interface (AUI) DB-15 connector to the chassis’ rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Port selection may be set for automatic or software-controlled when both connectors are in use.

17.2 Ethernet Port Signal Handling

17.2.1 Power

Power Consumption

2.0 Watts (400 mA at 5 VDC).

Power The motherboard 120-pin connector supplies +5 VDC to the card and provides the Ground return.

Converter A DC-DC converter converts +5 VDC to -12 VDC for the AUI. The power consumption of the converter is 6.0 Watts (500 mA at 12 VDC).

Table 17-1 Ethernet Port signal Pin-Outs

AUI 10BaseT

Signal Pin # Signal Pin #

Chassis Gnd 1 RX+ 1

CIP 2 RX- 2

DOP 3 TX- 3

Chassis Gnd 4 not connected 4

DIP 5 not connected 5

SGnd 6 TX+ 6



CIN 9

DON 10

Chassis Gnd 11

DIN 12

+12 VDC 13

Chassis Gnd 14

not connected 15

3006M100-002 17-3


Overcurrent Protection

The Ethernet LAN I/O card contains a non-resettable 0.5 Amp fuse across the -12 VDC output.

17-4 3006M100-002

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18 FAST ETHERNET LAN I/O CAR

The Fast Ethernet LAN I/O Card mounts on the motherboard in any of slots 1-6. It enables the CX900e to connect to either a 10BaseT or 100BaseTX Ethernetocal Area Network (LAN). The Fast Ethernet LAN I/O card features autosensing odata transmission speeds of 10 Mbps or 100 Mbps. It also has a built-in Content Addressable Memory (CAM) to filter unwanted traffic. The CAM can hold up 4096 filter addresses.

3006M100-002 18-1


18.1 Fast Ethernet LAN I/O Card Components

Important components on the Fast Ethernet LAN I/O Card include:

• edge connector

• port connector

• signal LEDs

The edge connector fixes the card to any of slots 1-6 of the motherboard.


Figure 18-1 Fast Ethernet LAN I/O Card

18-2 3006M100-002

18 FAST ETHERNET LAN I/O CARD

18.1.1 Fast Ethernet Signal LEDs

The Fast Ethernet connector plate has LEDs labelled TX, RX, 100 and LINK. ThTX LED blinks green when data is transmitted, the RX LED blinks green when data is received, the 100 LED glows green to indicate connection to a 100BaseTX LAN and the LINK LED glows green to indicate a good link to the network.

18.1.2 Fast Ethernet Port Signal Handling

The following table describes the signal to pin relationships for both 10BaseT o100BaseT.

Figure 18-2 Fast Ethernet LAN I/O Card, Connector Plate

Table 18-1 Connector Pin-outs for Ethernet Ports

Signal Pin No.

RX+ 1

RX- 2

TX- 3

not connected 4

not connected 5

TX+ 6

not connected 7

not connected 8

3006M100-002 18-3


18.1.3 Power

Power Consumption


Power The motherboard 120-pin connector supplies +5 VDC to the card and provides the Ground return.

18-4 3006M100-002

,

19 T1/E1 CSU/DSU I/O CARD

The T1/E1 CSU/DSU I/O card mounts on the motherboard in any of slots 1-4and slots 5 and 6 if the DEM is installed. For T1, the card must be jumper configured for connection through the RJ-48 connector. For E1, the card can be jumpeconfigured for connection through either the RJ-48 connector or two Bayonet Nut Connectors (BNCs). The T1/E1 CSU/DSU I/O card enables the CX900e to connect to a full or fractional T1 or E1 public network, and provides a non-channelized interface.

3006M100-002 19-1


19.1 T1/E1 CSU/DSU I/O Card Components

Important components of the T1/E1 CSU/DSU I/O Card include:

• edge connector

• port connectors

• LID connectors


The edge connector fixes the card to any one of the motherboard’s expansion slots 1-4. The connector plate fixes the connector to the chassis rear panel with two Phillips-head screws and limits dust accumulation and electromagnetic radiation.

Figure 19-1 T1/E1 CSU/DSU I/O Card

19-2 3006M100-002


19.1.1 Port Configuration Jumpers

The T1/E1 CSU/DSU I/O Card has connectors to mount either a T1 or E1 Line Interface Driver (LID). The I/O also has a number of 2-pin connectors that can be modified with suitcase jumpers to select the port and match line impedance. For T1, the I/O must be configured for connection through the RJ-48 connector. For E1, the I/O can use either the RJ-48 or the two BNCs, depending on the network. When the correct port has been selected the line impedance can be set.

Table 19-1 describes the jumper configurations required to select either the RJ-48 or the BNC connectors. Table 19-2 and Table 19-3 describe the jumper configuration required to match the correct line impedance.

.

The following table describes the jumper settings for the correct line impedance for T1 through the RJ-48 connector.

Figure 19-2 T1/E1 CSU/DSU I/O Card, Connector Plate

Table 19-1 T1/E1 CSU/DSU Connector Selection

For RJ-48 Connector For BNC Connectors

Connect pin 3 of P3 to pin 3 of P4 Connect pin 1 of P3 to pin 1 of P4




3006M100-002 19-3


The following table describes jumper settings for the correct line impedance foE1 through either the RJ-48 or the BNCs.

* Installing these jumpers at LK7 and LK8 will connect the BNC Ring terminal to Frame Ground.

Table 19-2 T1 Line Impedance

Jumper Port T1 RJ-48 (100 Ohms) Configuration

LK2 T1 Transmit Connect pin 1 to 2

LK3 T1 Transmit Connect pin 1 to 2

LK5 T1 Receive Connect pin A1 to B1

LK6 T1 Receive Connect pin A1 to B1

LK7 T1 Transmit Remove Jumper

LK8 T1 Receive Remove Jumper

Table 19-3 E1 Line Impedance

Jumper Port RJ-48 (120 Ohms) Configuration BNC (75 Ohms) Configuration

LK2 E1 Transmit Connect pin 2 to 3 Connect pin 2 to 3

LK3 E1 Transmit Connect pin 2 to 3 Connect pin 2 to 3

LK5 E1 Receive Connect pin A2 to B2 Connect pin A3 to B3

LK6 E1 Receive Connect pin A2 to B2 Connect pin A3 to B3

LK7 E1 Transmit Install Jumper Install Jumper*

LK8 E1 Receive Install Jumper Install Jumper*

Figure 19-3 T1/E1 CSU/DSU Configuration Jumper

19-4 3006M100-002


19.2 Power

Power Consumption



3006M100-002 19-5

by

n-

20 INSTALLATION AND CONFIGURATION

This section provides step-by-step procedures to install and configure the CX900e’s hardware components. These procedures must be performed onlyqualified service personnel.

WARNING: These procedures must be performed only by qualified service personel.

3006M100-002 20-1


ther-

ts 5-

dered ale

20.1 Installation Preparations

The CX900e ships with:

• the chassis and its cover

• the motherboard (installed in the chassis)

• the power supply (110-120 VAC or 220-240 VAC, as ordered, installed on the moboard)

• the console port cable (a male RJ-11 to female DB-9)

The CX900e may include the following options:

• one of or some combination of the following I/O cards (separately packaged as ordered):

• a Data Expansion Module (DEM) card (if serial I/O cards are to be installed in slo6)

• a -48V/Ring Generator card (if an Analog Voice I/O card is to be installed)

• Communication cables to match each type of connector and interface must be orseparately; see Table 20-1. They come in varying lengths with either male or femconnectors.

• V.24 (EIA-232D) Serial I/O

• Multi V.24 Serial I/O

• Universal I/O

• V.35EU Serial I/O

• V.35H Serial I/O

• X.21 Serial I/O

• 56K/64K DSU/CSU

• ISDN BRI-U I/O

• ISDN BRI-S/T I/O

• ISDN BRI-S/T Digital Voice I/

• T1/E1 CSU/DSU I/O

• V.34 Data Modem I/O

• Analog Voice I/O (with FXS, FXO or E&M-Interface, as ordered)

• DAV I/O (with FXS, FXO & E&M-Interface, as ordered)

• Ethernet LAN I/O card

• Fast Ethernet LAN I/O card

• Token Ring I/O card

20-2 3006M100-002


ge.

ther

r

hip

Procedure 1: Unpacking and Inspecting the CX900e

When you receive your CX900e shipment, you should confirm its contents.

To unpack and inspect the CX900e:

1. Examine the shipping boxes and note the type and amount of any dama

2. Open the shipping boxes and match their contents with the packing slip.

You should make a list of any discrepancies.

3. Examine the exterior of the chassis and cover for cracks, scratches or osigns of damage.

You should fully describe the type, amount and location of damage.

4. Confirm that optional cards (I/O, DEM, -48V/Ring Generator) match youorder.

5. Confirm that ports of serial I/O cards are in a proper DTE to DCE relationswith external devices to which they will be connected.

You can correct a mismatch by referring to:

- Figure 4-2 for the Data Expansion Module (DEM)- Figure 5-3 for V.24 I/O Cards- Figure 5-6 for V.35EU I/O Cards- Figure 5-9 for V.35H I/O Cards- Figure 5-12 for X.21 I/O Card- Figure 6-3 for Multi I/O Cards

6. Store the shipping boxes and protective foam for future use.

7. Inform your sales representative of shipping discrepancies or damage.

3006M100-002 20-3


g

D).

assis.

ssis;

m the

rear , and le

Procedure 2: Opening and Closing Chassis

Installing or rearranging the CX900e’s I/O cards, DEM and/or -48V/Ring Generator Module requires that you first remove the CX900e’s cover, then replace it when work is done.

WARNING: If the chassis is connected to a network, do not remove the CX900eSafety Ground. Always remove network connections before removinthe power cord.

To open and close the chassis:

1. Disconnect all network connections.

2. Disconnect the power cord.

3. Ground yourself to protect the I/O cards from electrostatic discharge (ES

4. Remove the single Phillips-head screw located on the right side of the ch

5. Slide the front corner latches outwards to release the cover from the chasee Figure 20-1.

6. Raise the cover at the front until the metal tabs at the rear disengage froslots in the cover. Lift the cover away from the chassis.

7. When you have completed work inside the chassis, align the slots at theof the cover with the metal tabs. Lower the cover back onto the chassissecure it in place by sliding the corner latches inward. Replace the singretaining screw on the right side of the chassis.

Figure 20-1 Releasing the CX900e Cover

20-4 3006M100-002


20.2 EPROM/RAM Installation

At some point you may need to change the motherboard’s EPROM-resident software or increase the motherboard’s RAM.

3006M100-002 20-5


D).

et is

d

Procedure 3: Installing New EPROM or More RAM

This procedure assumes that you have removed the cover from the chassis (Procedure 2).

To change memory on the motherboard:


2. Locate and, if necessary, remove the memory on the motherboard.

• 128K x 8 bit (or 256K x 8) EPROM that boots the system after power up or reslocated at U22

• 2M x 32 bit (8M) of data storage is located at U47

3. Insert the upgrade module in the vacated socket (DRAM SIMM illustratebelow).

Figure 20-2 Changeable Memory on Motherboard

U 22

U 47

20-6 3006M100-002


assis.
4. Replace the cover (see Procedure 2) or proceed with other work in the ch
Figure 20-3 DRAM SIMM Alignment

Figure 20-4 DRAM SIMM Insertion

Figure 20-5 DRAM SIMM in Position

3006M100-002 20-7


20.3 Standard I/O Card Installation

Standard I/O cards are defined as cards which use only the 120-pin edge connector for mounting into the motherboard expansion slot. Standard I/O cards include:

* A Data Expansion Module (DEM) is required if you are installing this card in slots 5-6.

**The Dual Digital Voice Compression (DDVC) card is not considered an I/O card, although it occupies an I/O card slot.

• V.24 (EIA-232D) Serial I/O*

• Multi V.24 Serial I/O*

• Universal I/O*

• V.35EU Serial I/O*

• V.35H Serial I/O*

• X.21 Serial I/O*

• 56K/64K DSU/CSU*

• ISDN BRI-U I/O

• ISDN BRI-S/T I/O

• DDVC**

• ISDN BRI-S/T Digital Voice I/

• T1/E1 CSU/DSU I/O*

• V.34 Data Modem I/O*

• Analog Voice I/O (with FXS, FXO or E&M-Interface, as ordered)

• DAV I/O (with FXS, FXO & E&M-Interface, as ordered)

• Ethernet LAN I/O card

• Fast Ethernet LAN I/O card

• Token Ring I/O card

20-8 3006M100-002


n put or

D).

he

the plate ttach

e

Procedure 4: Installing Standard I/O Cards


To install a standard I/O card:

1. Select a slot where you want to install the I/O card.

2. Unscrew the selected slot’s cover plate from the chassis’ rear panel, thethe screws aside for later attachment of the standard I/O card’s connectplate.


4. Remove the I/O card with its connector plate from its packaging.

5. If the card is a Multi, V.24, V.35EU, V.35H or X.21 Serial I/O, and if you have not already done so, confirm its DTE/DCE configuration and, if necessary, unseat its jumpers, rotate them 180°, then reseat them. For tMulti I/O, the suitcase jumpers must also be changed.

DTE/DCE jumper orientations are described in:

- Figure 4-2 for the Data Expansion Module (DEM)- Figure 5-3 for V.24 I/O Cards- Figure 5-6 for V.35EU I/O Cards- Figure 5-9 for V.35H I/O Cards- Figure 5-12 for X.21 I/O Card- Figure 6-3 for Multi I/O Cards

NOTE: The rear panel cutouts do not provide adequate clearance for installing V.35EU I/O card via the rear panel. You must first remove the card faceand install the card from within the chassis. Once the card is installed, athe faceplate to the card.

6. Insert the card through the slot’s opening in the rear panel, then align thcard’s edge connector over the slot’s associated connector on the motherboard.

3006M100-002 20-9


assis.

I

7. Press the card firmly, but gently, into place.

8. Fasten the card’s connector plate to the rear panel.

9. Repeat steps 1-8 for each I/O card you want to install.


20.4 Data Expansion Module Installation

This section assumes that you have installed or will install a serial I/O card (including Multi Serial I/O, V.24 Serial I/O, V.35EU Serial I/O, V.35H Serial I/O, X.21 Serial I/O, DSU/CSU I/O, and V.34 Data Modem I/O) in slot 5 or slot 6. you have installed or will install a Analog Voice I/O Card in addition to installing a serial I/O card in slot 5 or slot 6, disregard this procedure and complete Procedure 9, Analog Voice I/O Card Installation.

Figure 20-6 Standard I/O Card Installation

20-10 3006M100-002


n to

.

Procedure 5: Installing the Data Expansion Module (Standalone)


To install the DEM:

1. Remove the DEM from its packaging.

You should safeguard the enclosed ribbon cable and screws for possibleinstallation of an optional seventh V.24 port (see Procedure 6). If you plainstall this port, confirm the DEM’s DTE/DCE configuration and, if necessary, unseat its jumpers, rotate them 180°, then reseat them.

2. Align the DEM’s edge connector over connector J3 on the motherboard

Figure 20-7 Data Expansion Module Installation

3006M100-002 20-11


3. Press the card firmly but gently into place.

Figure 20-8 Data Expansion Module Alignment

Figure 20-9 Data Expansion Module Insertion

20-12 3006M100-002


6. rk in

4. If you want to install the DEM’s optional V.24 port, complete Procedure Otherwise, replace the cover (see Procedure 2) or proceed with other wothe chassis.

3006M100-002 20-13


g

on m

Procedure 6: Installing DEM’s V.24 Port

This procedure assumes that you have installed the DEM and want to install thDEM’s optional V.24 port to provide the CX900e with a seventh port. If you have installed or will install a Voice I/O Card, complete Procedure 7 before followinthis procedure.


To install the DEM’s V.24 port:

1. If you have not already done so, confirm the DEM’s DTE/DCE configuratiafter removing it from its slot. If necessary, unseat its jumpers, rotate the180°, reseat them (as suggested in “Figure 4-2 DEM DTE/DCE Configuration Jumpers” ), then return the DEM to its slot.

2. Remove the V.24 port knock-out on the chassis’ rear panel.

3. Push the the ribbon cable’s plug onto the DEM’s header at J1.

4. Fasten the ribbon cable’s DB-25 connector to the chassis’ rear panel.

Figure 20-10 Ribbon Cable Connection to DEM

20-14 3006M100-002


assis.

or


20.5 Voice I/O Card Installation

The Voice I/O Card can be installed in any of slots 1-6.

NOTE: If you install a Voice I/O Card, you must also install a -48V/Ring GeneratModule. If the Data Extension Module card has been installed, the -48V/Ring Generator Module must be fastened to the DEM.

Figure 20-11 Ribbon Cable Connection to Rear Panel

3006M100-002 20-15


D).

n to

ule

Procedure 7: Installing -48V/Ring Generator Module and DEM

This procedure assumes that you will be installing the DEM as well as the -48V/Ring Generator Module. If you are installing only the -48V/Ring Generator Module, disregard this procedure and complete Procedure 8.


To install the -48V/Ring Generator Module and DEM:


2. Remove -48V/Ring Generator Module from its packaging.

3. Remove the DEM from its packaging.

You should safeguard the enclosed ribbon cable and screws for possibleinstallation of an optional seventh V.24 port (see Procedure 6). If you plainstall this port, confirm the DEM’s DTE/DCE configuration and, if necessary, unseat its jumpers, rotate them 180°, then reseat them (as suggested in “Figure 4-2 DEM DTE/DCE Configuration Jumpers” ).

4. Remove the V.24 port knock-out on the chassis’ rear panel if you are installing the DEM’s port option.

5. Screw the DEM onto the binding posts of the -48V/Ring Generator Modwith two Phillips-head screws

Figure 20-12 Connection between DEM and -48V/Ring Generator

20-16 3006M100-002


the 1 i

6. Align the assembled DEM and -48V/Ring Generator Module over the motherboard so that the DEM’s edge connector is over connector J3 on motherboard and the -48V/Ring Generator Module’s 12-pin header at Pover connector J2 on the motherboard.

7. Press the assembled cards firmly but gently into place.

8. Fasten the mounting post on the -48V/Ring Generator Module to the motherboard with its packaged bolt.

Figure 20-13 Assembled DEM and -48V/Ring Generator Module

Figure 20-14 DEM and -48V/Ring Generator Alignment

3006M100-002 20-17


, e 9). the

9. Complete Procedure 6 if you are installing the DEM’s optional V.24 portthen, if you have not already done so, install a Voice I/O Card (ProcedurOtherwise, replace the cover (Procedure 2) or proceed with other work inchassis.

Figure 20-15 -48V/Ring Generator Mounting

20-18 3006M100-002


D).

12-

Procedure 8: Installing -48V/Ring Generator Module (Standalone)

This procedure assumes that you will be installing only the -48V/Ring Generator Module. If you are installing the -48V/Ring Generator Module and DEM, disregard this procedure and complete Procedure 7.


To install the -48V/Ring Generator Module:


2. Remove -48V/Ring Generator Module from its packaging.

3. Align the -48V/Ring Generator Module over the motherboard so that its pin header at P1 is over connector J2 on the motherboard.

Figure 20-16 -48V/Ring Generator Module Installation

3006M100-002 20-19


the

4. Press the assembled cards firmly but gently into place.

5. Fasten the mounting post on the -48V/Ring Generator Module to the motherboard and the rear panel with its packaged bolt.

6. If you have not already done so, install a Voice I/O Card (Procedure 9). Otherwise, replace the cover (Procedure 2) or proceed with other work inchassis.

Figure 20-17 -48V/Ring Generator Module Alignment

Figure 20-18 -48V/Ring Generator Module Mounting

20-20 3006M100-002


av

D).

n put

ted

sis.

Procedure 9: Installing Analog Voice I/O Card

This procedure assumes that you have installed or will install the -48V/Ring Generator Module (Procedure 7 or Procedure 8). It also assumes that you hremoved the cover from the chassis (Procedure 2).

To install the Analog Voice I/O Card:


2. Select a slot where you want to install the Analog Voice I/O Card.

3. Unscrew the selected slot’s cover plate from the chassis’ rear panel, thethe screws aside for later attachment of the Analog Voice I/O Card’s connector plate.

You should safeguard the cover plate for possible future use.

4. Remove the Analog Voice I/O Card with its connector plate from its packaging.

5. Align the card’s edge connector and 6-pin header over the slot’s associapair of connectors on the motherboard.

6. Press the card firmly, but gently, into place.

7. Fasten the card’s connector plate to the rear panel.

8. Replace the cover (Procedure 2) or proceed with other work in the chas

3006M100-002 20-21


ing its s

20.6 External Equipment Cabling

Once you have installed the I/O cards you require, you can physically connect them to their network devices after connecting the CX900e to its power source.

WARNING: Never connect an I/O card to a network device without first connectthe CX900e to its power source. Never disconnect the CX900e frompower source without first disconnecting the cables of all its I/O cardfrom their network devices.

Figure 20-19 Analog Voice I/O Card Installation

20-22 3006M100-002


v

Procedure 10: Connecting CX900e to Power Source

This procedure assumes that no I/O cards are cabled to external network deices.

To connect the CX900e to a power source:

1. Confirm that the CX900e’s voltage rating is compatible with the voltage available in the country where it will operate.

2. Push the power cable’s female three-wire plug onto the male three-pin connector in the power entry module on the chassis’ rear panel.

3. Plug the opposite connector of the power cable to the source of power.

3006M100-002 20-23


the

male

at

Procedure 11: Connecting CX900e to a PC

This procedure assumes that the CX900e is connected to its power source but remains powered-off.

To connect the CX900e to a Personal Computer (PC):

1. Locate the RJ-12 -DB9 cable (part # CBLA0024-610) that is shipped withunit. Push the RJ-12 connector into the jack labeled CONSOLE on the chassis’ rear panel until it clicks into place.

2. Connect and screw down the cable’s female DB-9 connector to the PC’sDB-9 connector.

Once the CX900e and PC are powered-up, you can configure the software thresides on the CX900e’s motherboard or monitor its I/O card’s traffic.

20-24 3006M100-002


.

ork

ctor,

Procedure 12: Connecting CX900e to Network Devices

This procedure assumes that the CX900e is connected to its power source but remains powered off.

To connect the CX900e to network devices:

1. Determine the kind of I/O card you want to connect to its network device

2. Determine the kind of cable you need to connect this I/O card to its netwdevice.

3. Locate the connector on the cable that matches the I/O card’s port connethen attach these connectors.

Table 20-1 Cables Available from Memotec

Interface Cable Part # Description

V.24 (EIA-232) CBLA0006-010male DB-25 to male DB-25 (3 m; 10 ft) with 4-40 screws

V.24 (EIA-232) CBLA0006-110 male DB-25 to male DB-25 (3 m; 10 ft) with M3 screws

V.35EU CBLA0015-010male M-34 block to male M-34 block (3 m; 10 ft

Multi V.24 (EIA-232) CBLA0017-024male DB-60 to 5 female DB-25s (0.6 m; 2 ft)

Multi V.24 (EIA-232) CBLA0017-124male DB-60 to 5 female DB-25s (0.6 m; 2 ft) with M-3 screws

V.35H CBLA0014-010male M-34 block to male DB-25 (3 m; 10 ft)

V.35H CBLA-0014-210male M-34 block to female DB-25 (3 m; 10 ft

X.21 CBLA0005-010 male DB-15 to male DB-26 (3 m; 10 ft)

Universal Serial (V.24) CBLA0027-000 male VHDCI to female DB-25

Universal Serial (V.24) CBLB0002-001 female to male gender changer

Universal Serial (V.35) CBLA0032-000 male DB-25 to male M.34

Universal Serial (V.35) CBLA0032-200 male DB-25 to female M.34

Universal Serial (X.21) CBLA0033-000 male DB-25 to male DB-15

Universal Serial (X.21) CBLA0033-200 male DB-25 to female DB-15

V.24/V.35 (DCE/DTE) CBLA0031-000 adapter for split clocking

RJ-45/BNC CBLB0001-000 adapter RJ-45 to 2 BNC connectors

Voice 60300049male RJ-12 to male RJ-12, straight-through (3 m; 10 ft)

Voice (E&M) 60300050male RJ-45 to male RJ-45, straight-through (3 m; 10 ft)

Voice (E&M I or V) 60300051

eight male RJ-12 (each carrying six signals) to one standard 25-pair telco female connector (to PBX punch block); octopus (1 m; 40 in)

Voice (E&M II, III or IV) 60300052

six male RJ-45 (each carrying eight signals) to one standard 25-pair telco female connector (to PBX punch block); octopus (1 m; 40 in)

3006M100-002 20-25


ork

evice.

4. Attach the connector at the other end of the cable to the port of the netwdevice.

5. Repeat steps 1-4 for each I/O card you want to connect to its network d

20-26 3006M100-002


Procedure 13: Attaching Electromagnetic Interference (EMI) Filters

When using some unshielded cables, an EMI filter (ferrite box) must be attached to the cable to reduce electromagnetic emissions. The following cards require EMI filters to be attached to their respective I/O cables:

• Token Ring I/O

• Fast Ethernet LAN I/O

• T1/E1 CSU/DSU I/O

The EMI filter is included with your equipment. See the illustration below for attachment instructions.

The CX900e is now ready to be powered up. Once the CX900e and PC arpowered up, you can configure the software that resides on the CX900e’s

Figure 20-20 Attaching the EMI Filter

lay cab le in cen ter groo veon one side o f the boxan d w rap the cab learou nd th at s id e of th e bo x

Fe rriteBox

leave 1" (2.54 cm )b etw ee n theconn ec tor an dth e top of the box

c lose the box

Step 1 S tep 2

3006M100-002 20-27


motherboard or monitor its I/O traffic.

20.7 Powering Up

This procedure assumes that you have connected the CX900e to its power sourcand to its terminal, and have also connected its I/O cards to their network devices.

20-28 3006M100-002


ER nge ir or

Procedure 14: Powering Up CX900e

To power up the CX900e:

1. Locate the power switch on the rear panel.

2. Depress the power switch to the ON position.

3. Check the LEDs on the front panel.

The POWER LED should light immediately and the FAULT LED should light then turn off in less than a second.

4. If the POWER LED does not light, proceed to Procedure 15. If the POWLED lights and the FAULT LED remains on for more than a second, arrathrough your sales representative to return the unit to the factory for repareplacement.

3006M100-002 20-29


ower

rd

ving

Procedure 15: Checking/Replacing CX900e Fuses

This procedure assumes the POWER LED did not light when you powered up theCX900e. It further assumes that power is present at the source and that the pcord was properly connected between the source and the CX900e.

To check and, if necessary, replace the CX900e’s fuses:

1. Locate the power entry module on the rear panel.

2. Push the power switch to the OFF position and disconnect the power cofrom the CX900e.

3. Gently pry the fuse bank out of the power entry module.

4. Remove the fuses from the fuse bank and examine them for signs of hablown.

Figure 20-21 Fuse Bank Removal

Figure 20-22 Fuse Check

20-30 3006M100-002


ower nge ir or

5. If the fuses have blown, replace them, then return the fuse bank to the pentry module and proceed to Procedure 14. If they have not blown, arrathrough your sales representative to return the unit to the factory for repareplacement.

3006M100-002 20-31


20-32 3006M100-002

pur-letee ap-lco

igitaltionhichd re-

in-rt 68

ex-b-

oice

APPENDIX A: AFFIDAVIT FOR CONNECTION

According to regulations defined by the FCC in Part 68, the customer chasing the CX900e CSU/DSU I/O Card or T1/E1 I/O Card must compthe attached affidavit and ensure that it is notarized and delivered to thpropriate Telco office prior to connection of the equipment to the Telines.

An affidavit is required to be given the telephone company whenever dterminal equipment without encoded analog content and billing protecis used to transmit digital signals containing encoded analog content ware intended for eventual conversion into voiceband analog signals antransmitted on the network.

The affidavit shall affirm that either no encoded analog content or billingformation is being transmitted or that the output of the device meets Paencoded analog content or billing protection specifications.End user/customer will be responsible to file an affidavit with the local change carrier when connecting unprotected CPE to a 1.544 Mbps or surate digital services.

Until such time as subrate digital terminal equipment is registered for vapplications, the affidavit requirement for subrate services is waived.

3006M100-002 A-1

).

____

speci-priate

t to

r th

AFFIDAVIT FOR CONNECTION OFCUSTOMER PREMISE EQUIPMENT (CPE)

TO 1.544 MBPS AND/OR SUBRATE DIGITAL SERVICES

For the work to be performed in the certified territory of _________________________ (Telco Name

State of ___________________________________ County of ___________________________

I, _________________________________________(name)

___________________________________________(business address)

___________________________________________(business telephone number)

being duly sworn, state:

I have responsibility for the operation and maintenance of the terminal equipment to be connected to1.544 Mbps and/or _________ subrate digital services. The terminal equipment to be connected com-plies with Part 68 of the FCC rules except for the encoded analog content and billing protectionfications. With respect to encoded analog content and billing protection (check the approparagraph below):

I attest that all operations associated with the establishment, maintenanceand adjustment of the digital CPE (Customer Premise Equipment) with respecanalog content and encoded billing protection information continuously com-plies with Part 68 of the FCC Rules and Regulations.

The digital CPE does not transmit digital signals containing encoded analog content or billing information which is intended to be decoded within the tele-communications network.

The encoded analog content and billing protection is factory set and is notunder the control of the customer.

I attest that the operator(s)/maintainer(s) of the digital CPE responsible foestablishment, maintenance and adjustment of the encoded analog content and billing information has (have) been trained to perform these functions by suc-cessfully having completed one of the following: (check the box identifying the appropriate paragraph below):

A. A training course provided by the manufacturer/grantee of the equipment used to encode analog signals; or

B. A training course provided by the customer or authorized representative, using training materials and instructions provided by the manufacturer/grantee of the equipment used to encode analog signals; or

C. An independent training course (e.g., trade school or technical institutionrecognized by the manufacturer/grantee of the equipment used to encode analog signals; or

D. In lieu of the proceding training requirements, the operator(s)/maintainer(s) is (are) under the control of a supervisor trained in accordance with paragraph _____ (A, B, or C above).

I agree to provide (Telco’s Name) with proper documentation to demonstrate compliance with the in-formation as provided in the preceeding paragraph, if so requested.

_________________________________________Signature

_________________________________________Title

_________________________________________Date

Subscribed and sworn to before me

_________________________________________Notary Public

This _____________ day of ___________ , 19__

My commission expires: _____________________

APPENDIX B: CARD POWER CONSUMPTION SUMMARY

Card Type Consumption (Watts)

V.24 Serial I/O .35

V.35EU Serial I/O 1.45

V.35H Serial I/O 1.5

X.21 Serial I/O 1.5

Multi I/O 3.0

Universal I/O 7.0

Analog Voice I/O 2.5

Dual Analog Voice I/O 2.1

56K/64K CSU/DSU I/O 2.0

ISDN BRI-U I/O 2.5

ISDN BRI-S/T I/O 4.0

ISDN BRI-S/T Digital Voice I/O 3.0

V.34 Modem I/O 2.5

Token Ring LAN I/O 5.0

Ethernet LAN I/O 2.0

Fast Ethernet LAN I/O 3.75

T1/E1 CSU/DSU I/O 1.5

-48V/Ring Generator 36

3006M100-002 B-1

r ne the res

APPENDIX C: RECORDING SYSTEM CONFIGURATION

Accurate system configuration information (hardware and software) is necessary to enhance Memotec’s ability to respond quickly and effectively to service requests.

The following table is provided to facilitate the task of recording the hardware and/or software revisions of circuit cards installed in CX900e products. Complet-ing the table will ensure that all necessary revision information is available foMemotec service personnel at the time a service request is made. To determicurrent hardware and/or software version of a circuit card, follow the proceduoutlined below.

* Enter the card name indicated on the faceplate.

3006M100-002 C-1


he

How to Identify the Hardware Revision of a Circuit Card

The procedure for identifying hardware revision numbers is the same for all CX900e circuit cards. The location of the revision information, however, varies according to card type.

The following paragraph provides an example of how to identify the hardware revision of a CX900e I/O card.

1. Position the circuit card with the component side up and the faceplateto the right.

2. You will find the hardware revision information located in one of tcorners of the card, as shown in the following figure.

3. Note the silk-screened revision (REV.) number and the hand-writtenletter(s) that follow the number.

4. Determine the current revision of the card by appending the last letterappearing on the right with the REV number. In the example above,the current revision number of the card would be 3D.

5. Enter the hardware revision in the H/W Revision column of the table.

C-2 3006M100-002

ap-

oft-

How to Identify the Software Revision of the CPU

Method 1: Using CXView

1. Start CXView.

2. Highlight a device address from the left side of the screen, then clickon the “ViewDevice” button on the right side of the screen.

3. From the Navigational panel, select “CPU”. The following screen pears:

4. Refer to the “Software” column of the CPU List and record the sware revision number of the CPU. In the example above, we see thatthe software revision is CXC0304M. A breakdown of the software re-vision format follows:

CXx0304x

S o ftw a reO p tion S o ftw a re

Ve rs ion

S o ftw a reR e lease N o .

C X 900e

3006M100-002 C-3


f

Method 2: Using the Command Line Interface

1. Enter module at the command line prompt.

2. The software revision will appear on the screen in the format outlinedin method 1.

3. Record and enter the software revision in the S/W Revision column othe table.

C-4 3006M100-002

APPENDIX D: GETTING IN TOUCH WITH US

The information in this appendix tells you how to:

• get in touch with our Service organization

• return equipment for repair

• contact our Documentation group

3006M100-002 D-1


you

s-

you

Getting Help from the Service Group

If you encounter problems with your system and you cannot find the information you need, we suggest you call one of our service hotlines:

• (800) 363-2611 (Canada)

• (800) 766-SRVC

• (514) 738-8631 (24-hour service)

• (514) 738-3661 (Fax)

Procedures for Returning Equipment for RepairIf for any reason, you need to return a piece of equipment to Memotecwill find it much easier to do so if you use the following procedure.

NOTE: Returns for repair will not be accepted without prior authorization from Memotec’s head office Sales or Service administration depart-ment.

Canadian Goods to be Returned for Repair• Obtain RA# from your Memotec representative or by calling Memotec’s Cu

tomer Service (800) 766-7782.

• Please mark the outside of the shipping box with the RA#. All paperwork con-cerning the returned equipment must refer to the RA#. Please include a description of the problem.

• For your convenience, we have included Return for Repair forms to assistin exercising these procedures.

• Ship goods to:

MEMOTEC COMMUNICATIONS INC.

600 McCaffrey

Montreal, Quebec

H4T 1N1 Canada

D-2 3006M100-002

-

t you

U.S.A. Goods to be Returned• Obtain RA# from your Memotec representative or by calling Memotec Cus

tomer Service (800) 766-7782.

• Please mark the outside of the shipping box with the RA#. All paperwork con-cerning the returned equipment must refer to the RA#. Please include a description of the problem.

• For your convenience, we have included Return for Repairs forms to assisin exercising these procedures.

• Ship goods to:

CIMETRA c/o Memote

8396 Route 9 North

West Chazy, N.Y., 12992

U.S.A.

Export Goods to be Returned• Obtain RA# from your Memotec representative.

• Please mark the outside of the shipping box with the RA#. All paperwork con-cerning the returned equipment must refer to the RA#. Please include a description of the problem or the reason for the return.

• For your convenience, we have included Return for Repairs forms to assist you in exercising these procedures.

• Ship goods to:

CIMETRA c/o Memote

8396 Route 9 North

West Chazy, N.Y., 12992

3006M100-002 D-3


Return for RepairsRA#: ___________________________________________

Material being returned:

SO#: ___________________________________________PO#: ___________________________________________

Returned To: _____________________________________

Customer Name: __________________________________Address:_____________________________________________________________________________________________________________________________________________

Returned By:_____________________________________Date: ___________________________________________

Reason for return_______________________________________________

______________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________

D-4 3006M100-002

Getting in Touch with the Documentation Group

If you have any difficulties using this document or you discover an error, pleascontact the Technical Documentation group in Montreal.

E-mail: [email protected]

Fax: (514) 738-4436

We invite your comments on this manual. Your feedback is important in produc-ing documentation that best fulfills your needs, and it will be taken into consider-ation in future revisions of this document.

3006M100-002 D-5

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