Cutting Out the Cracks: Advantages

of Thermal Stress Cutting

pv magazine Webinar, June 3rd, 2021

© 3D-Micromac AG2

3D-Micromac – Micromachining Excellence

Our mission:

• Development and production of unique

process and machine solutions for various

high-tech markets

• Customer support from product

development to high-volume production

• Enabling laser micromachining techniques

for new devices

• Superior production efficiency and reliable

process stability “Our international customers place great value on future-oriented and user-friendly

processes. Our solutions help them increase production efficiency and lower cost”.

Uwe Wagner, CEO

We are the leading specialist in laser micromachining.

© 3D-Micromac AG3

3D-Micromac – The Specialist in Laser Micromachining

» Founded in 2002

» 180 employees

» Based in Chemnitz, Germany

» Branch offices in US, Taiwan,

China

» Feasibility studies & process

development in house

» Production of limited lots and

ramp up production

» Worldwide sales & service network

ServicesKey Facts Machine Base

» > 600 installations worldwide

» > 100 systems in PV industry

4 © 3D-Micromac AG

Content

1. Motivation

2. Thermal Laser Separation explained

3. Mechanical Strength Advantage

4. „Cutting out the Cracks“

5. Economic Impact

6. microCELL next Generation Cutting Tools

© 3D-Micromac AG5

Motivation

Standard industry process:

• Laser ablation "scribe and break"

• Trench 40 – 60 % of the cell's thickness

• Subsequent mechanical breaking

• Limitations in:

• Throughput

• Process quality

• Particle generation

• Electrical and mechanical performance

© 3D-Micromac AG6

Thermal Laser Separation (TLS)

• Starting point (and optional

straightness) defined by scribe

• TLS is a cleaving process, initiated by

heat and cooling

CoolingLaser

Initial scribe

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TLS-Cutting Technology

Cracking zone

Dicing direction

Tensile stress

Compressivestress

Guided crack

Wafer/cell

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TLS-Cutting vs. Scribe and Break – Results Breaking Edge

→ Extensive chipping

→ Very rough structure

→ Very smooth structure

→ No chipping visible

ResultsMechanical Strength

Laser Scribe and Cleaving (LSC)

Mechanical strength:cell (-35%)

module (-23%)

Cell vs Module

Thermal Laser Separation (TLS)

No damage visible on cells and modules

→ Cell and module results in good agreement

Solar cells Module laminates

© 3D-Micromac AG

→ Courtesy Fraunhofer CSP

Cutting Outthe Cracks

610N

610N

650N

600N

610N

650N

650N

650N

740N

820N

830N

690N

750N

890N

840N 590N

810N

870N

630N

220N

Fracture Origin: Surface Edge

EL pictures after testing | brightness and contrast adjusted

Laser Scribe and Cleaving (LSC)Thermal Laser Separation (TLS)Full Cells (reference)

surface defects → pads surface defects → pads mostly edge defects → cutting process

EL images from module laminate test

→ Courtesy Fraunhofer CSP

© 3D-Micromac AG

© 3D-Micromac AG11

TLS and Economic Benefit for Module Manufacturing

Cell cutting with Thermal Laser Separation

Additional module

power output

Low cost of ownership

and fast RoI

Less module power

degradation

Ability to passivate

cutting edge

© 3D-Micromac AG12

microCELL – Next Generation Cell Cutting

• Worldwide install base > 10 GW

• > 6,000 wph for 1/2 to 1/6 cut cells

• Contactless and ablation-free

cutting

• Improved module performance/

less power degradation

TLS-Cutting provides excellent cleaving results in combination with higher

yield and throughput.

Capabilities:

• Evaluation of new processes and technologies on customer’s demands

• Production of limited lots, batches and ramp up production

• Offered at Chemnitz headquarters

Customer Benefits:

• Reduced overhead and flexible capex model

• No need for machine budget at beginning of product development

• Tool investment can be made once product design is finalized

• Speeds development and optimization of new product designs

• Reduced risk

© 3D-Micromac AG13

Process Development & Contract Manufacturing Services

© 3D-Micromac AG14

Thank you for your attention!

Thomas Kießling

sales@3d-micromac.com

+49 371 40043 222

+49 371 400 43 0 info@3d-micromac.com www.3d-micromac.com

Headquarters 3D-Micromac AG

Technologie-Campus 8

09126 Chemnitz

Germany

Financial support from theEuropean Union’s Horizon2020Programme for research,technological development anddemonstration (Grant Agreementno. 857793) is acknowledged.