cutting diamond tools 2017 diamond tools... · • laser beam focused into nozzle aperture •...
TRANSCRIPT
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Cutting Diamond Tools By Laser MicroJet®
New developments in the wet laser machining of industrial diamond tools
Sébastien KURZEN
Application Engineer Synova S.A.
Innovative Laser Systems
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Speaker introduction • Sébastien Kurzen
• Synova S.A. – Switzerland
• Application Engineer • Diamond tools
• Simultaneous 5-axis machining for diamond tools and
CAD/CAM software
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Presentation Contents 1. Company
2. Laser MicroJet® technology
3. LCS 50-5
4. State of the art results cutting PCD/WC
5. State of the art results cutting SCD
6. Conclusions
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1. Company • Laser cutting machines (using the Laser-MicroJet
principle)
• HQ in Duillier, near Geneva, Switzerland
• Founded in 1997
• 75 employees
• Micro-Machining Centers (MMC’s) in the USA, India, Korea, Japan
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2. Laser MicroJet® (LMJ) technology
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2. Laser MicroJet® (LMJ) technology • Laser beam focused into nozzle aperture
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2. Laser MicroJet® (LMJ) technology • Laser beam focused into nozzle aperture
• Laser light guided within water jet by total internal
reflection
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2. Laser MicroJet® (LMJ) technology • Laser beam focused into nozzle aperture
• Laser light guided within water jet by total internal
reflection
• Laser pulses evaporate material, water cools and cleans between the pulses
• By scanning, a trench is formed which becomes deeper with each pass
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2. Laser MicroJet® (LMJ) technology
https://youtu.be/Q_lRaONosxc?t=54s
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2. Laser MicroJet® (LMJ) technology Advantages are: • No focus adjustment
• Parallel sided kerf
• Minimal heat affected zone
• High material removal rate
• Debris washed from kerf
LMJ Dry laser
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3. LCS 50-5 • Compact solution for a new 5-axis Laser Cutting
System
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3. LCS 50-5
Mainly used to cut:
• Polycrystalline diamond (on WC) & PcBN
• Single crystal diamond (HPHT or CVD)
• Natural diamond
• Ceramics
• Metals
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3. LCS 50-5
Mainly used to cut:
• Polycrystalline diamond (on WC) & PcBN
• Single crystal diamond (HPHT or CVD)
• Natural diamond
• Ceramics
• Metals
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3. LCS 50-5
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4. State of the art results cutting PCD/WC • All kinds of tools / geometries can be cut
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4. State of the art results cutting PCD/WC
LMJ EDM
Uniform cut surface profile Parallel cutting
LMJ vs EDM LMJ vs dry laser
PCD/WC cutting
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4. State of the art results cutting PCD/WC
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4. State of the art results cutting PCD/WC
20x
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4. State of the art results cutting PCD/WC
Edge waviness ≤ 1 micron
500x
0.5 µm PCD grains
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4. State of the art results cutting PCD/WC
5000x
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4. State of the art results cutting PCD/WC
Rake face
Primary & secondary
Clearance angles
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4. State of the art results cutting PCD/WC
Programmed Measured
Primary clearance angle 8.0° 8.2°
Primary clearance depth
500 µm 510 µm
Secondry clearance angle
20.0° 20.1°
Cutting edge radius - < 2 µm
Roughness below cutting edge
- Ra = 0.21 µm, Rz = 1.5 µm
Effective cutting speed - 1.5 mm/min
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5. State of the art results cutting SCD • All kinds of tools / geometries can be cut
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5. State of the art results cutting SCD
100x
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5. State of the art results cutting SCD
Edge waviness ≤ 0.5 micron
500x
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5. State of the art results cutting SCD
Edge waviness ≤ 0.5 micron
500x
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5. State of the art results cutting SCD
Edge waviness ≤ 0.5 micron
500x
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5. State of the art results cutting SCD
Edge waviness ≤ 0.5 micron
1000x
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5. State of the art results cutting SCD
Cutting trenches are visible but no impact on roughness
20x
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5. State of the art results cutting SCD
Wave height < 1 µm
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5. State of the art results cutting SCD
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5. State of the art results cutting SCD
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5. State of the art results cutting SCD
One clearance angle
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5. State of the art results cutting SCD
Programmed Measured
Clearance angle 10.0° 9.9°
Cutting edge radius - 2.7 µm
Roughness below cutting edge
- Ra = 0.25 µm, Rz = 1.4 µm
Effective cutting speed - 2.6 mm/min
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6. Conclusion 1/3 – The results • Sub-micron surface finish can be reached for both
PCD and SCD materials
• Such result is possible even at cutting speeds up to 1.5 mm/min for PCD and 2.6 mm/min for SCD
• HAZ depth is 5 µm, according to Sumitomo • Edge micro-cracking compared to dry lasers reduced
or eliminated
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6. Conclusion 2/3 – the machine • Very compact machine (800 x 1200 x 1650 mm)
• Full 5-axis capability
• Very easy to operate (HMI)
• Intuitive CAM software for diamond tools including
auto-probe-correction and batch processing
• Automatic probe-based correction by CAD/CAM for more complex tools (“SynovaCut”)
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6. Conclusion 3/3 – the machine • Cutting strategies can be implemented in a
production mode
• Unlimited choice of materials and thicknesses
• Low cost of ownership
• Faster cutting/shaping means fewer machines
required → reduced capital investment
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6. Appendix – SynovaCut demo
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