Curriculum Vitae Updated 1/09 Ampere A. Tseng (曾安培)

Professor, Department of Mechanical and Aerospace Engineering Arizona State University

Tempe, Arizona 85287-6106 USA Voice (480) 965-8201; Fax (480) 965-1384; E-Mail: ampere.tseng@asu.edu

Home Page: http://www.eas.asu.edu/~tsengpap/ Education Diploma Manufacturing Engineering, Taipei Institute of Technology, Taiwan, 1968 M.S. Theoretical and Applied Mechanics, University of Illinois, Urbana, IL, 1974 Ph.D. Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 1978 Professional Background Dr. Tseng is interested in conducting research in the area of manufacturing and design; currently his major research projects include fabrication of micro- and nano-scale devices. He has well-established records in publication and research funding. Over the past twenty years, he has published more than two hundred technical papers and given more than two hundred technical seminars or presentations. Dr. Tseng has received more than three million dollars in research funding from government agencies and industries. Professor Tseng has developed several new techniques in macro- and micro-fabrication and is an inventor or a co-inventor of nine US patents. Active research collaborations are under way with colleagues in China, Czech Republic, Finland, and Taiwan. He has been awarded a Nippon Steel fellowship to perform research in Japan, two National Science Council professorships to conduct research in Taiwan and two grants by US-Czechoslovak Science and Technology Program to perform research with colleagues in Czech. He was bestowed an Honorary Guest Professor by Shanghai Jiao Tong University in 2000 and by Beijing Tsinghua University and University of Science and Technology of China in 2003. In 2007, Dr. Tseng was appointed as a University Chair Professor by National Taiwan University of Science and Technology. From 1990 to 1994, Dr. Tseng was the Director of the DOE sponsored Center for Automation Technology at Drexel University. He adopted a highly innovative approach by gearing their curriculum and research programs to the technological and human resource needs for the manufacturing industry. From 1997 to 2001, Professor Tseng was the founding Co-Director of the Manufacturing Institute at Arizona State University. The Manufacturing Institute has been established by both Colleges of Business and of Engineering to foster multi-disciplinary manufacturing research and to elevate the quality of engineering and business education, working in direct partnership with industry and government. In 1997, the nine million dollars’ commitment from Motorola to Manufacturing Institute was the largest single gift in ASU history. In 2001, he was bestowed the ASU Faculty Award for excellence in teaching, research, and service. Professor Tseng was also a recipient of many industrial awards, including the Superior Performance Award of Martin Marietta Laboratories (1979-1984), RCA Service Award (1985), and Alcoa Foundation Research Award (1987). Professor Tseng has participated in both undergraduate and graduate teaching. In the past twenty years, he has supervised more than thirty Senior Design teams and thirty graduate students, of whom ten were granted Ph.D. degrees. He has also sponsored more than twenty

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postdoctoral scholars and visiting professors. Dr. Tseng has developed more than ten new manufacturing courses, more than half of them graduate. Dr. Tseng is heavily involved in professional society activities and has been a member of the editorial boards of several professional journals. Dr. Tseng was the Chair of the ASME Materials Division (1991-1992) and of the 2000 NSF Workshop on Manufacturing of Micro-Electro-Mechanical Systems Workshop. He also co-chaired the 1992 International Conference on Transport Phenomena in Processing and the 1999 NSF USA-China Workshop on Advanced Machine Tool Research, and First International Workshop on Tip-Based Nanofabrication, Taipei, 2008. Currently, Professor Tseng was sanctioned by ASME becoming its Fellow in 1995. Academic Experience 1996-present Professor of Mechanical Engineering, Arizona State University 2008-Summer University Chair Professor, National Taiwan University of Science and

Technology, Taipei, Taiwan 2007-Summer University Chair Professor, National Taiwan University of Science and

Technology, Taipei, Taiwan 2003-Spring Honorary Guest Professor, Tsinghua University, Beijing, China 2001-Summer National Science Council Professor, National Taiwan University, Taipei,

Taiwan 1997-2001 Co-Director, Manufacturing Institute, College of Business and College of

Engineering and Applied Sciences, Arizona State University 1992-1993 Nippon Steel Fellow, Nippon Steel Corp., Japan, and National Science Council

Professor, National Cheng Kung University, Tainan, Taiwan 1991-1996 Professor of Mechanical Engineering, Drexel University 1990-1994 Co-Director, Center for Automation Technology, Drexel University 1985-1991 Associate Professor of Mechanical Engineering, Drexel University

Industrial Experience 1984-1985 Member of Technical Staff and Group Leader, RCA Laboratories, Princeton, NJ 1979-1984 Staff Engineer and Project Leader, Martin Marietta Laboratories, Baltimore, MD 1977-1979 Development Engineer, Westinghouse Electric Corp., Tampa, FL 1969-1971 Manufacturing Engineer, Titan (Taiwan) Industries Pty, Ltd., Chungli, Taiwan Honors and Awards A. Honors 1. Invited Distinguished Lecturer, Thermomechanical Aspects of Manufacturing and Materials

Processing, sponsored by Indian Institute of Technology and funded by United Nations and US National Science Foundation, January 1989.

2. Invited Keynote Lecturer, XXII ICHMT International Symposium on Manufacturing and Materials Processing, funded by US National Science Foundation, Dubrovnik, Yugoslavia, August 1990.

3. Invited Principal Lecturer, Symposium on Manufacturing Analysis, sponsored by National Cheng Kung University and funded by ROC Ministry of Education, Taiwan, March 1991.

4. Invited Theme Speaker, International Conference on Transport Phenomena in Processing, funded by the US National Science Foundation, Hawaii, March, 1992.

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5. Invited Speaker, US/French Workshop on Deformation Processing of Metals, sponsored by Cornell University and funded by US National Science Foundation, Ithaca, New York, May, 1992.

6. Invited Participant, US/French Workshop on Numerical Simulation of Metal Forming Processes, sponsored by Ecole des Mines de Paris and funded by US National Science Foundation, Sophia Antipolis, France, September, 1993.

7. Invited Principal Lecturer, Workshop on Precision Engineering, sponsored by China Productivity Center and funded by ROC National Youth Commission, Ministry of Economic Affairs, and National Science Council, Taiwan, June, 1995

8. Invited Speaker, EUROMECH Colloquium 408: Interactive Dynamics of Convection and Solidification, funded by US National Science Foundation, Chamonix, France, March, 2000.

9. Honorary Guest Professor Bestowed by Shanghai Jiao Tong University, China, April 25, 2000

10. Invited Feature Speaker, Cooperation and Exchange Convention of Overseas Chinese Enterprises in Science and Technology, sponsored and funded by Ministry of Science & Technology and Overseas Chinese Affairs Office of State Council, People’s Rep. of China, Hangzhou, China, June 1-4, 2002

11. Invited Speaker, 2002 Japan-USA Symposium on Flexible Automation, Institute of Systems, sponsored by the Institute of Systems, Control and Information Engineers and funded by funded by US National Science Foundation, Hiroshima, Japan, July 14-19, 2002.

12. Invited Keynote Speaker, 2002 International Workshop on Nano-size Manufacturing, Processing and Its Applications, sponsored and funded by Ministry of Education and Southern Taiwan University of Technology, Taiwan, December 16-17, 2002.

13. Honorary Guest Professor Bestowed by Tsinghua University, Beijing, China, February 13, 2003.

14. Invited Speaker, Workshop on Nano and Micro Manufacturing Technology, sponsored and funded by ROC National Science Council and Chung Yuan Christian University, Taiwan, March 24-28, 2003.

15. Invited Speaker, Shenzhen IC Symposium, 2003 China Hi-Tech Fair in Shenzhen, sponsored and funded by Shenzhen Municipal Government, National IC Design (Shenzhen) Industrial Base, and Chinese American Semiconductor Professional Society, Shenzhen, China, October 13-14, 2003.

16. Honorary Guest Professor Bestowed by University of Science and Technology of China, Hefei, China, October 16, 2003.

17. Invited Speaker, 2004 International Integrated Circuit Industrial Development Symposium, sponsored and funded by Chengdu Municipal Government, Chengdu, China, June 4-5, 2004.

18. Invited Feature Speaker, Workshop on Nanofabrication: Fundamentals and Applications, sponsored and funded by ROC Ministry of Education, National Cheng Kung University, National Tsing Hua University, and National Taiwan University, Taiwan, October 17-20, 2006.

19. Invited Speaker, “Nanoscale Fabrication,” Haythornthwaite Distinguished Lecture Series, Temple University, Philadelphia, PA, April 9, 2007.

20. Invited Speaker, 2007 Changsha International Conference on Microelectronics Industrial Development, sponsored and funded by Changsha Municipal Government, Changsha, China, July 1-3, 2007.

21. Invited Keynote Speaker, “Development of tip-based nanofabrication and its roadmap,” in ICAM2007 on Advanced Manufacture, sponsored and funded by National Cheng Kung University, Tainan, Taiwan, November 28, 2007.

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22. Workshop Opening Speaker, First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008

B. Awards 1. Superior Performance Award, 1979-1984, Martin Marietta Laboratories, 1984. 2. Certificate of Appreciation, Aluminum Extruders Council, Aluminum Association, 1984. 3. RCA Performance Award, RCA Laboratories, 1984. 4. Certificate of Recognition, 1986 WAM, Production Engineering Division, ASME, 1986. 5. Alcoa Foundation Research Award, Alcoa Foundation, 1987. 6. Certificate of Appreciation, Delaware Valley Section, American Society of Naval Eng.,

1988. 7. Certificate of Appreciation, 1988 WAM, Materials Division, ASME, 1988. 8. Certificate of Appreciation, 1990 WAM, Materials Division, ASME, 1990. 9. Appreciation Plaque, ANTEC 92. Thermoforming Division, SPE, 1992. 10. Appreciation Plaque, ANTEC 92, Moldmaking and Mold Design Division, SPE, 1992. 11. ASME Service Award, ASME, 1992. 12. Certificate of Appreciation, 1993 WAM, Materials Division, ASME, 1993. 13. Outstanding Faculty Citation, Barrett Honors College, ASU, 2000 14. Certificate of Appreciation, Board of Governors, ASME International, 2000 15. ASU Faculty Award, College of Engineering and Applied Science, 2002 16. Innovator of Tomorrow Award from Arizona Technology Enterprises (AzTE) in 2006 17. Visiting Consultant Award, School of Electrical and Electronic Engineering, Nanyang

Technological University, Singapore, October, 2008. 18. Visiting Professorship Award, School of Opto-electronics Engineering, Beijing University

of Aeronautics and Astronautics, Beijing, China, June, 2009. C. Editorships 1. Member, Editorial Board, Advanced Manufacturing Processes, Marcel Dekker, 1986-1988. 2. Member, Advisory Board, Drexel Polymer Notes, Drexel University, 1987-1991. 3. Associate Editor, ASME Journal of Engineering Materials & Technology, 1987-1994. 4. Member, Editorial Board, ASME Manufacturing Review, 1991-1995. 5. Member, Editorial Board, J. Materials Processing & Manufacturing Science, Sage

Publication (formerly by Technomic), 1992-2003. 6. Member, Editorial Board, Advances in Polymer Technology, John Wiley & Sons, 1995-2004. 7. North American Editor, J. Chinese Society of Mechanical Engineers, 1997-present. 8. Guest Technical Editor, Theme Issue on Modeling of Metal Forming Processes, Arabian

Journal for Science and Engineering (AJSE), King Fahd University of Petroleum and Minerals, Dhahran, Kingdom of Saudi Arabia, 2004.

D. Selected Biographical Listings 1. Listed in Who's Who in Frontiers of Science & Technology, Marquis, 1st ed., 1984. 2. Listed in Who's Who in the World, Marquis, 7th to present ed., 1984-2006. 3. Listed in Who's Who in Science and Engineering 2000-2001, Marquis, 5th ed., 1999. 4. Listed in Who's Who in America, Marquis, 54th to present ed., 1999-2006.

Selected Professional Activities A. Award Examiner

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1. National Chair Award, Ministry of Education, Rep. of China, 2000, 2005, 2006, 2007, 2008. 2. National Academic Award, Ministry of Education, Rep. of China, 2000, 2005, 2006, 2007,

2008. 3. National Science and Technology Awards, Singapore. 4. NSF Presidential Faculty Fellow Award, 1995.

B. Proposal & Thesis Reviewer 1. Advanced Technology Center of Southeastern Pennsylvania, USA 2. Cooperative Grants Proposals, US Civilian Research and Development Foundation 3. Petroleum Research Fund, American Chemical Society 4. US Department of Energy Phase I Small Business Innovation Research Proposals 5. US National Institute of Standard and Technology 6. US National Science Foundation 7. City University of Hong Kong 8. Division for Physical and Engineering Science, Swiss National Science Foundation (2005) 9. High Education Research Program, Ministry of Education, Czech Republic 10. Indian Institute of Technology, Madras, India (Ph.D. Thesis Examiner) 11. Israel Binational Science Foundation (2005, 2007, 2008) 12. National Science Council, Rep. of China 13. Research Proposals, United Arab Emirates University, 2005 14. Singapore-Japan Joint Research Program, Nanyang Technological Univ., Singapore 15. Swinburne University of Technology, Victoria, Australia (Ph.D Thesis Examiner) 16. University Grants Committee, Hong Kong, 1998-2007 17. Frontier and Innovative Research Projects of National Taiwan University, 2009

C. Panelist 1. Advanced Technology Center of Southeastern Pennsylvania (Proposal), 1986. 2. NSF Workshop on Manufacturing Issues, National Science Foundation, 1987. 3. Future Directions in Transport Phenomena, 1st Int. Conf. Trans. Pheno. in Processing, 1992. 4. NSF Manufacturing Processes and Equipment Program (Proposal), 1992. 5. NSF Materials and Mechanics Program (Proposal), 1993. 6. NSF Engineering Research Deployment Teaching Initiative Proposals, 1994. 7. NSF Presidential Faculty Fellow Award, Phase I (Nomination), 1995. 8. NSF Panel on Manufacturing Processes and Equipment Program CAREER Proposals, 1997. 9. NSF Instrumentation and Laboratory Improvement, ILI (Proposal), 1997. 10. NSF Phase I Small Business Innovation Research Proposals, 1997. 11. NSF Phase I Small Business Innovation Research Proposals (Chair), 1998. 12. NSF Course, Curriculum and Laboratory Improvement (CCLI) Proposals (Chair), 1999. 13. NSF Phase I Small Business Innovation Research Proposals, 1999. 14. Future Decision and Control in Industry: Theoretical Development and Applications, 38th

IEEE Conference on Decision and Control, 1999. 15. NSF Proposal Panel on Materials Processing & Manufacturing Program, 2003. 16. NSF Panel on Phase I Small Business Innovation Research Proposals, 2004. 17. NSF Panel on Phase I Small Business Innovation Research Proposals, 2005. 18. NSF Proposal Panel on Materials Processing & Manufacturing Program, 2006. 19. NSF Proposal Panel on Materials Processing & Manufacturing Program, 2007 20. NSF SBIR Phase I: NAM-Photovoltaics I Panel, 2009 21. NSF SBIR Phase I: NAM-Nano Manufacturing Applications Panel, 2009

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D. Selected Professional Society Activities 1. Liaison to Production Engineering Division, ASME Materials Division, 1986-1988. 2. Liaison to Materials Division, ASME Production Engineering Division, 1986-1989. 3. Chair, Technical Panel on Manufacturing Systems, Management, and Optimization, ASME

Production Engineering Division, 1986-1989. 4. Member, Main Committee, ASME Code for Welded Alum. Alloy Storage Tanks, 1986-

2000. 5. Chair, Program Committee, ASME Materials Division, 1987-1988. 6. Chair, Polymer Committee, ASME Materials Division, 1988-1991. 7. Chair, ASME Materials Division, 1991-1992. 8. Member of Advisory Board, SPE Plastics Educational Foundation, 1991-1994. 9. Member, ASME Materials and Structures Group Operating Board, 1992-1994. 10. ASME Representative to International Conference on Creep, 1992-2002. 11. Member, ASME National Nominating Committee, 1998-2000. 12. Chair, ASME Industry Relations Committee, 1997-2001. 13. Member, SEMI Educational Partnership Roundtable, Semiconductor Equipment and

Materials International, 1997-2007. 14. Member, SEMI Information and Control Committee, Semiconductor Equipment and

Materials International, 1997-2007. 15. Member and Advisor, Phoenix Chapter, Chinese American Semiconductor Professional

Association, 2000-present E. Selected Conference Activities 1. Session Organizer, ASME/CSME Pressure Vessels and Piping Conference, 1978. 2. Organizer, Symposium on Manufacturing Simulation and Processes, ASME 1986 Winter

Annual Meeting. 3. Co-organizer, Session on Advances in Materials Characteristics Techniques, ASME 1986

Winter Annual Meeting. 4. Co-organizer, Symposium on Composites in Severe Environments, ASME 1987 Winter

Annual Meeting. 5. Organizer, Symposium on Modeling of Materials Processing, ASME 1987 Winter Annual

Meeting. 6. Organizer, Symposium on Interdisciplinary Issues in Materials Processing and

Manufacturing, ASME 1987 Winter Annual Meeting. 7. Member, Program Committee of U.S.A.-Japan Symposium on Flexible Automation, 1988. 8. Organizer, Session on Heat Transfer in Deformation Processes, 25th National Heat Transfer

Conference, Houston, Texas, 1988. 9. Co-organizer, Symposium on Advances in Mechanical Behavior and Properties Evaluations,

ASME 1988 Winter Annual Meeting. 10. Co-organizer, Symposium on New Directions in Nondestructive Evaluation of Advanced

Materials, ASME 1988 Winter Annual Meeting. 11. Co-organizer, Symposium on Friction and Material Characterizations, ASME 1988 Winter

Annual Meeting. 12. Member, Organizing Committee of XXII TCHMT International Symposium on Heat and

Mass Transfer in Manufacturing Technologies, Dubrovnik, Yugoslavia, 1990. 13. Co-organizer, Symposium on Processing of Polymers and Polymeric Composites, ASME

1990 Winter Annual Meeting.

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14. Co-Chair, Organizing Committee of International Conference on Transport Phenomena in Processing, Hawaii, 1992.

15. Member, Honorary Committee, 4th Int. Conf. Technology of Plasticity, Beijing, China, 1993.

16. Organizer, Panel Sessions on Federal Research Programs in Materials Processing, ASME 1993 Winter Annual Meeting.

17. Member, International Organizing Committee of 6th International Conference on Creep and Fatigue, IMechE, London, UK, 1996.

18. Member, Int. Technical Committee of 6th International Conference on Automation Technology, Chinese Institute of Automation Engineers, Taipei, Taiwan, May 9-11, 2000.

19. Member, Organizing Committee of FiberOptic Automation Expo 2002, Surface Mount Technology Association, San Jose, CA, December 3-6, 2002.

20. Member, Editorial Committee of 2003 International Symposium on Nano Science and Technology, Southern Taiwan University of Technology, Tainan, Taiwan, November 4-7, 2003.

21. General Co-chair, First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

22. Chair, Scientific Committee, First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

F. Selected Conference Chairmanship 1. Session Chair, ASME/CSME Pressure Vessels and Piping Conference, 1978. 2. Session Chair, 19th Annual Meeting of Society of Engineering Science, 1982. 3. Session Chair, 13th North American Manufacturing Research Conference, SME, 1985. 4. Chair, Session on Manufacturing Simulation and Processes, ASME 1986 Winter Annual

Meeting. 5. Chair, Session on Advances in Materials Characteristics Techniques, ASME 1986 Winter

Annual Meeting. 6. Chair, Session on Modeling of Materials Processing, ASME 1987 Winter Annual Meeting. 7. Chair, Session on Interdisciplinary Issues in Materials Processing and Manufacturing,

ASME 1987 Winter Annual Meeting. 8. Chair, Session on Design and Manufacturing II, ASME Manufacturing International '88,

Atlanta, GA, 1988. 9. Chair, Session on Heat Transfer in Deformation Processes, 25th National Heat Transfer

Conference, Houston, Texas, 1988. 10. Chair, Session on Advances in Mechanical Behavior and Properties Evaluations, ASME

1988 Winter Annual Meeting. 11. Chair, Session on Friction and Material Characterizations, ASME 1988 Winter Annual

Meeting. 12. Chair, Session on Polymer Processing: Modeling and Validation, ASME 1989 Winter

Annual Meeting. 13. Chair, Session on Mechanics of Plastics and Plastic Composites, ASME 1989 Winter

Annual Meeting. 14. Chair, Session 1: Fundamental Thermal Problems in Materials Processing, XXII TCHMT

International Symposium on Heat and Mass Transfer in Manufacturing Technologies, Dubrovnik, Yugoslavia, 1990.

16. Chair, Session on Processing of Polymers and Polymeric Composites, ASME 1990 Winter Annual Meeting.

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17. Chair, Sessions on International Conference on Transport Phenomena in Processing, Hawaii, March 1992.

18. Moderator, Panel Sessions on Federal Research Programs in Materials Processing, ASME 1993 Winter Annual Meeting, New Orleans, Louisiana.

19. Chair, Session on Symposium on Recent Advances in Heat Transfer and Micro-Structure Modeling for Metal Processing, ASME 1995 Mechanical Engineering Congress and Exposition, San Francisco, CA.

20. Co-Chair, NSF USA-China Workshop on Advanced Machine Tool Research, Los Angeles CA and Tempe, AZ, 1999.

21. Chair, Organizing Committee of NSF USA-China Workshop on Advanced Machine Tool Research, Los Angeles, CA and Tempe, AZ, 1999.

22. Chair, NSF 2000 Workshop on Manufacturing of Micro-Electro-Mechanical Systems, Orlando, Florida, November 2000.

23. Co-Chair, Session on SCM and Globalization I (A5), 2002 Japan-USA Symposium on Flexible Automation, Hiroshima, Japan, 2002.

24. Co-Chair, Session on Fixturing/Part Handling I (D1), 2002 Japan-USA Symposium on Flexible Automation, Hiroshima, Japan, 2002.

25. Co-Chair, Session 4, 2nd Int. Conf. on Rapid Prototyping and Manufacturing, Beijing, 2002 (www.urban.ne.jp/home/hagi/pdf/ICRPM2002_Program.pdf).

Publications A. Refereed Journal Papers 1. Tseng, A.A. and Berry, J.T. (1979), “Calculation of stress intensity factors using special

three-dimensional elements,” Nucl. Eng. Des., Vol. 54, pp. 91-95 (SCI, EI). 2. Tseng, A.A. and Berry, J.T. (1979), “3-dimensional finite element analysis of the double

torsion test,” ASME J. Pressure Vessel Technol., Vol. 101, pp. 328-335 (SCI, EI). 3. Tseng, A.A. (1980), “A three-dimensional finite element analysis of the three-point bend

specimen,” Eng. Fract. Mech., Vol. 13, pp. 939-943 (SCI, EI). 4. Tseng, A.A. (1981), “A comparison of the three-dimensional finite element solutions for the

compact specimen,” Int. J. Fract., Vol. 17, pp. R125-129 (EI). 5. Tseng, A.A. (1983), “Prestressing evaluation of a grooved duplex tube,” Int. J. Pressure

Vessels and Piping, Vol. 11, pp. 191-205 (SCI, EI). 6. Tseng, A.A. (1983), “Magnetohydrodynamic poiseuille flow through a porous media,” J.

Chinese Institute of Engineers, Vol. 6, No. 4, pp. 251-255 (EI). 7. Tseng, A.A. (1984), “A numerical heat transfer analysis of strip rolling,” ASME J. Heat

Transfer, Vol. 106, pp. 512-517 (SCI, EI). 8. Tseng, A.A. (1984), “Finite difference solutions for heat transfer in a roll rotating at high

speed,” Numerical Heat Transfer, Vol. 7, pp. 113-125 (SCI, EI). 9. Tseng, A.A. (1984), “A generalized finite-difference scheme for convection-dominated

metalforming problems,” Int. J. Num. Meth. Eng., Vol. 20, pp. 1885-1900 (SCI, EI). 10. Tseng, A.A. (1985), “Inelastic considerations of the instability behavior of an imperfect

steam generator tube,” Res. Mechanica, Vol. 16, pp. 103-115. (SCI, EI). 11. Tseng, A.A. (1986), “Computer-aided design and operation of induction furnace for taper

heating,” Advanced Manufacturing Processes, Vol. 1, pp. 553-574 (EI). 12. Tseng, A.A., Mills, J.J., and Maslen, S.H. (1988), “Mathematical model of extrusion

preheater,” Materials Science & Technology, Vol. 4, pp. 361-365 (SCI, EI). 11. Tseng, A.A. (1988), “Electroheating modeling in metal industry: a review, “Advances in

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Engineering Software, Vol. 10, No. 2, pp. 58-71 (cover article) (SCI, EI). 12. Tseng, A.A. (1988), “Computer-aided forming for sheet-metal parts,” JOM (J. of Metals),

Vol. 40, No. 4, pp. 12-15, April (SCI, EI). 13. Tseng, A.A. (1988), “A thermal study of a gunn diode in microstrip circuits,” Archiv für

Elektrotechnik, Vol. 71, pp. 349-355. (SCI, EI). 14. Taya, M. and Tseng, A.A. (1988), “Papers from the symposium on performance of

composites in severe environments,” ASME J Eng Materials Tech., Vol. 110, No. 2, p. 69 (SCI, EI).

15. Tseng, A.A., Kolluri, S.P., and Radhakrishnan, P. (1988), “Design and construction of a CNC machining system for education and software development,” J. Manufacturing Systems, Vol. 8, pp. 207-214 (SCI, EI).

16. Kolluri, S.P. and Tseng, A.A. (1989), “Simulation of CNC controller features in graphics-based programming,” Computers in Industry, Vol. 11, No. 2, pp. 135-146 (SCI, EI).

17. Tseng, A.A. and Gu, S.X. (1989), “A finite difference scheme with arbitrary mesh systems for solving high-order partial differential equations,” Computers & Structures, Vol. 31, No. 3, pp. 319-328 (SCI, EI).

18. Tseng, A.A. (1989), “Thermal analysis of a new IMPATT semiconductor device,” ASME J. Electronic Packaging, Vol. 111, No. 2, pp. 135-142 (EI).

19. Tseng, A.A. (1989), “Software for robotic simulation,” Advances in Engineering Software, Vol. 11, No. 1, pp. 26-36 (SCI, EI).

20. Tseng, A.A., Lin, F.H., Gunderia, A.S., and Ni, D.S. (1989), “Roll cooling and its relationship to roll life,” Metallurgical Trans. A, Vol. 20A, pp. 2305-2320 (SCI, EI).

21. Tseng, A.A., Tong, S., and Lin, F.H. (1989), “Thermal-stresses of rotating roll in rolling processes,” J. Thermal Stresses, Vol. 12, No. 4, pp. 427-450 (SCI, EI).

22. Dong, C.M. and Tseng, A.A. (1989), “Multivariable self-tuning controller for injection molding machines,” Computers in Industry, Vol. 13, pp. 107-122 (SCI, EI).

23. Tseng, A.A., Tong, S., Maslen, S.H., and Mills, J.J. (1990), “Thermal behavior of aluminum rolling,” ASME J. Heat Transfer, Vol. 112, pp. 301-308 (SCI, EI).

24. Tseng, A.A. (1990), “Material characterization and finite element simulation for forming miniature metal parts,” Finite Elements in Analysis & Design, Vol. 6, pp. 251-265 (EI).

25. Hoole, S.R.H., Sathilingham, V., and Tseng, A. (1990), “Computation of hyperthermia-SAR distributions in 3-D,” IEEE Trans. Magnetics, Vol. 26, No. 2, pp. 1011-1014 (SCI, EI).

26. Tseng, A.A., Lin, F.H., and Zhao, T.J. (1990), “Online model for gauge control of calendering processes,” Advances in Engineering Software, Vol. 12, pp. 181-189 (SCI, EI).

27. Tseng, A.A. and Sun, P.F. (1990), “A finite difference study of roll design in calendering processing,” Int. Polymer Processing, Vol. V, No. 4, pp. 292-299 (SCI).

28. Tseng, A.A., Borrosky, M.A., O'Connor, S.M., and Knotts, J.J. (1990), “Impact behavior of modified PVC for outdoor applications,” Advances in Polymer Technology, Vol. 10, No. 3, pp. 205-218 (EI).

29. Chen, S. J., Kothari, J., and Tseng, A.A. (1991), “Cooling of a moving plate with an impinging circular water jet,” Experimental Thermal and Fluid Science, Vol. 4, pp. 343-353 (SCI, EI).

30. Tseng, A.A., Gunderia, A.S., and Sun, P.F. (1991), “Cooling of roll and strip in steel rolling,” Steel Research, Vol. 62, No. 5, pp. 207-215 (SCI, EI).

31. Tseng, A.A. (1991), “Layflat behavior and temperature variation in calendering: a review,” J. Thermoplastic Composite Materials, Vol. 4, pp. 123-139 (EI).

32. Tseng, A.A. and Sun, P.F. (1991), “Thermal behavior of steel rolling with nonconventional

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rolls,” Metallurgical Trans. A, Vol. 22A, No. 8, pp. 1767-1774 (SCI, EI). 33. Tseng, A.A. and Cheng, J.C. (1991), “Computer-aided modeling of polymer processing: a

review,” ASME J. Engineering Materials and Technology, Vol. 113, No. 4, pp. 363-371 (SCI, EI).

34. Zou, J. and Tseng, A.A. (1992), “Microscopic modeling of fundamental phase transformation in continuous casting of steel,” Metallurgical Trans. A, Vol. 23A, No. 2, pp. 457-467 (SCI, EI).

35. Tseng, A.A., Arinze, B., and Kaplan, J.D. (1992), “Knowledge-based design approach for injection molding of plastic balls,” Advances in Polymer Technology, Vol. 11, pp. 109-120 (EI).

36. Tseng, A.A., Zou, J., Wang, H.P., and Hoole, S.R.H. (1992), “Numerical modeling of modeling of macro- and micro-behaviors in material processing,” J. Computational Physics, Vol. 102, pp. 1-17 (SCI).

37. Chen, S.J. and Tseng, A.A. (1992), “Spray and jet cooling in steel rolling,” Int. J. Heat and Fluid Flow, Vol. 13, No. 4, pp. 358-369 (SCI, EI).

38. Too, J.J.M. and Tseng, A.A. (1992), “Recent developments in micro- and macro-modeling of hot rolling of metals,” J. Materials Processing & Manufacturing Science, Vol. 1, No. 2, pp. 121-156 (SCI, EI).

39. Tseng, A.A., Tong, S.X., Chen, T.C., and Hashemi, J. (1992), “Thermomechanical behavior in radial forging of 718 super alloys,” Metals Materials and Processes, Vol. 4, No. 3, pp. 171-188.

40. Shamasunder, S., Tseng, A.A., Aung, W., and Biswas, S.K. (1993), “Numerical and experimental study of the thermal behavior of coining and upsetting processes,” J. Materials Processing Technology, Vol. 36, pp. 199-221 (SCI, EI).

41. Chen, S.J., Frazier, W.E., and Tseng, A.A. (1993), “Heat transfer in melt spinning of intermetallic materials,” J. Materials Processing & Manufacturing Science, Vol. 1, No. 4, pp. 417-429 (SCI, EI).

42. Hashemi, J., Rasty, J., Li, S., and Tseng, A.A. (1993), “Integral hydro-bulge forming of single and multi-layered spherical pressure vessels,” ASME J. Pressure Vessel Technology., Vol. 115, No. 3, pp. 249-255 (SCI, EI).

43. Tseng, A.A., Shih, W.H., Thomas, C.L., and Chen, S.J. (1993), “Intelligent processing of polymer sheets for calendering,” Advances in Polymer Technology, Vol. 12, No. 4, pp. 361-378 (SCI, EI).

44. Hashemi, J., Helm, J., Sheets, C. L., and Tseng, A.A. (1994), “New method in design and manufacturing of fluid-filled multi-layered spherical pressure vessels,” Int. J. Pres. Vessel & Piping, Vol. 58, pp. 355-360 (SCI, EI).

45. Tseng, A.A., Wang, S.R., Traynor, J.S., and Kothari, J.B. (1994), “Temperature variation in calendering and its relationship to SPC analysis of layflatness,” J. Plastic Film & Sheeting, Vol. 10, No. 1, pp. 21-64 (EI).

46. Tseng, A.A., Wang, S.R., and Hashemi, J. (1994), “On-line modeling for gage control of calendering,” ASME Manufacturing Review, Vol. 7, pp. 72-85 (EI).

47. Tseng, A.A. and Kaplan, J.D. (1994), “A computer-aided analysis of automatic degating molds for injection molding of plastic balls,” Polymer Engineering & Science, Vol. 34, No. 3, pp. 238-248 (SCI, EI).

48. Tseng, A.A., Tong, S.X., Chen, T.C., and Hashemi, J. (1994), “Thermomechanical simulation of a radial forging process,” Materials & Design, Vol. 15, No. 2, pp. 87-98 (SCI, EI).

49. Raudensky, M., Horsky, J., Tseng, A.A., and Weng, C. I. (1994), “Heat-transfer evaluation

11

of impingement cooling in hot rolling of shaped steels,” Steel Research, Vol. 65, No. 9, pp. 375-381 (SCI, EI).

50. Tseng, A.A., Chen, T.C., Jen, K.P., and Ochiai, T. (1994), “Forming and fractographical characteristics of copper-nickel-beryllium sheets under tension and bending,” J. Materials Engineering & Performance, Vol. 3, No. 5, pp. 619-634 (SCI, EI).

51. Hashemi, J., Tseng, A.A., and Chou, P.C. (1994), “Finite element modeling of segmental chip formation in high speed orthogonal cutting,” J. Materials Engineering & Performance, Vol. 3, No. 6, pp. 712-721 (SCI, EI).

52. Tseng, A.A., Chen, T.C., and Zhao, F.Z. (1995), “Direct sensitivity coefficient method for solving two-dimensional inverse heat conduction problems by finite element scheme,” Numerical Heat Transfer, Part B: Fundamentals, Vol. 27, No. 3, pp. 291-307 (SCI, EI).

53. Chen, J. S-J., Ren, R.C., and Tseng, A.A. (1995), “Interface heat transfer in metal casting on a moving substrate,” J. Mat. Processing & Manufacturing Science, Vol. 3, No. 4, pp. 373-386 (SCI, EI).

54. Huang, C.H., Ju, T. M., and Tseng, A.A. (1995), “The estimation of surface thermal behavior of the working roll in hot rolling process,” Int. J. Heat Mass Transfer, Vol. 38, No. 6, pp. 1019-1031 (SCI, EI).

55. Wang, S.R. and Tseng, A.A. (1995), “Macro- and micro-modeling of hot rolling of steel coupled by a micro-constitutive relationship,” Materials & Design, Vol. 16, No. 6, pp. 315-336 (SCI, EI) (a conference version also published in Iron and Steel Maker (I&SM), Vol. 23, No. 9, pp. 49-61, Sep.) (SCI, EI).

56. Shih, W.H., Pwu, L.L., and Tseng, A.A. (1995), “Boehmite coating as a consolidation and forming aid in aqueous silicon-nitride processing,” J. American Ceramic Society, Vol. 78, No. 5, pp. 1252-1260 (SCI, EI).

57. Tseng, A.A, Chang, J.G., Raudensky, and M., Horsky, J. (1995), “An inverse finite element evaluation of roll cooling in hot rolling of steels,” J. Mat. Processing & Manufacturing Science, Vol. 3, No. 4, pp. 387-408 (SCI, EI).

58. Tseng, A.A., Jen, K.P., Chen, T.C., Kondetimmamhalli, R., and Murty, Y.V. (1995), “Forming properties and springback evaluation of copper beryllium sheets,” Metallurgical & Mat. Trans. A, Vol. 26A, pp. 2111-2121 (SCI, EI).

59. Praisner, T.J., Chen, J.S.J. and Tseng, A.A. (1995), “Experimental study of process behavior in planar flow melt spinning,” Metallurgical & Mat. Trans. B, Vol. 26B, pp. 1199-1208, (in MetTran05) (SCI, EI).

60. Thomas, C.L., Tseng, A.A., Rose, J.L., and Bur, A.J. (1995), “Closed loop control of injection molding hold time,” Engineering Plastics, Vol. 8, No. 2, pp. 100-113 (SCI, EI).

61. Chen, T.C., Jang, H.I., and Tseng, A.A. (1995), “Transient thermal stress in a multilayered anisotropic medium,” ASME J. Appl. Mech, Vol. 117, pp. 1067-1069 (SCI, EI).

62. Finkel, M., Shegay, V.V., Tseng, A.A., and Chen, J.S.J. (1996), “Heterogeneity generation by thermodiffusional mechanism in rapidly solidified amorphous alloys,” Materials Science & Engineering, Vol. A206, No. 2, pp. 120-127 (SCI, EI).

63. Tseng, A.A. and Wang, S.R. (1996), “Effects of interface resistance on heat transfer in steel cold rolling,” Steel Research, Vol. 67, No. 2, pp. 44-51 (SCI, EI).

64. Tseng, A.A. and Zhao, F.Z. (1996), “Multidimensional inverse transient heat conduction problems by direct sensitivity coefficient method using a finite element scheme,” Numerical Heat Transfer, Part B: Fundamentals, Vol. 29, No. 3, pp. 365-380 (SCI, EI).

65. Tseng, A.A., Muller, J., and Hahn, Y. -H. (1996), “Mechanical and bending characteristics of invar sheets,” Materials & Design, Vol. 17, No. 2, pp. 89-96 (SCI, EI).

66. Thomas, C.L., Tseng, A.A., Bur, A.J., and Rose, J.L. (1996), “Solidification sensing for

12

closed loop control of injection molding hold time,” Advances in Polymer Technology, Vol. 15, No. 2, pp. 151-163 (in APTSensing06). (SCI, EI).

67. Tseng, A.A., Tong, S.X., and Chen, T.C. (1997), “Thermal expansion and crown evaluations in rolling processes,” Materials & Design, Vol. 18, No. 1, pp. 29-41 (SCI, EI), 1997 (a non-proofread version also published in Steel Research, Vol. 67, No. 5, pp. 188-198 (SCI, EI).

68. Tseng, A.A., Chaidilokpattanakul, C., Chen, J.S. and Westgate, C.R. (1997), “A fast electro-optical sensing system for measuring thermal response of a rotating roll without generating contact noise,” ASME Manufacturing Science and Engineering, Vol. 119, No. 2, pp. 193-200 (SCI, EI).

69. Tseng, A.A. (1997), “Thermal characteristics of roll and strip interface in modeling rolling processes,” J. Mat. Processing & Manufacturing Science, Vol. 6, No. 1, pp. 3-18 (SCI, EI).

70. Chen, S.-J., Zhang, K., Sadiku, M.N.O., and Tseng, A.A. (1998), “The electromagnetic enhancement of melt spinning and strip casting,” JOM-e, Vol. 50, No. 2 (February) (in http://www.tms.org/pubs/journals/JOM/9802/Chen).

71. Tseng, A.A., Wang, S.R., and Lau, A.C.W. (1998), “Local variations of strain and strain rate in roll bite region during rolling of steels,” ASME J. Eng. Mat. Tech, Vol. 120, No. 1, pp. 86-96 (SCI, EI).

72. Lee T.-W. and Tseng, A.A. (1998), “Planar and variable-diameter jets for uniform droplet sprays,” JOM, Vol. 50, No. 8 (August), pp. 24-25 (SCI, EI).

73. Lin, F. H. and Tseng, A.A. (1998), “A finite element analysis of elasto-plastic contact problems in metal forming,” Materials and Design, Vol. 19, No. 3, pp. 99-108 (SCI, EI).

74. Tseng, A.A. and Watson, W.L., Chen, J.S., and Orth, N. W. (1998), “Melt spinning of a shape memory alloy,” J. Mat. Processing & Manufacturing Science, Vol. 7, pp. 135-144 (SCI, EI).

75. Tseng, A. (1999), “Thermal modeling of roll and strip interface in rolling processes: part 1 - review,” Numerical Heat Transfer, Part A, Vol. 35, No. 2, pp. 115-133 (SCI, EI).

76. Tseng, A.A. (1999), “Thermal modeling of roll and strip interface in rolling processes: part 2 - simulation,” Numerical Heat Transfer, Part A, Vol. 35, pp. 135-154 (SCI, EI).

77. Chen, C. -T., Fordemwalt, J.N., Mou, J.-I., and Tseng, A.A. (1999), “Virtual fabrication of a 0.25 m integrated circuit device using TCAD,” J. Engineering Technology, Vol. 16, No. 2, pp. 16-21 (SCI, EI).

78. Zhao, B, Lee, M. H., Tseng, A.A., and Zhou, J. G. (1999), “Alternative estimation of optimal frequency using the wave speed for metal droplet generation in freeform fabrication,” J. Mat. Processing & Manufacturing Science Vol. 7, No. 3, pp. 251-260 (SCI, EI).

79. He, Z., Zhou, J. G., and Tseng, A.A. (2000), “Feasibility study of chemical liquid deposition based solid freeform fabrication,” Materials and Design, Vol. 21, pp. 83-92 (SCI, EI).

80. Tseng, A.A. (2000), “Maskless submicron fabrication techniques: any future?” J. Mat. Processing & Manufacturing Science, Vol. 8, No. 4, pp. 321-324 (SCI, EI).

81. Yan, J.Q., Fan, X.M., Ma, D.Z., and Tseng, A.A. (2000), “Virtual manufacturing for design of oil pumps,” Int. J. Advanced Manufacturing Systems, Vol. 3, No. 1, pp. 77-88 (EI).

82. Li, G. X. and Tseng, A.A. (2000), “Transient and impact dynamics of a micro-accelerometer,” J. Mat. Processing & Manufacturing Science, Vol. 9, No. 2, pp. 143-155 (SCI, EI).

83. Yan, J.Q., Fan, X.M., Ma, D.Z., Tseng, A.A., and Shen, W. (2000), “System structure for

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virtual manufacturing,” Int. J. Advanced Manufacturing Systems, Vol. 3, No. 1, pp. 49-76 (EI).

84. Tseng, A.A., Tang, W.C., Lee, Y.-C., and Allen, J. (2001), “NSF 2000 workshop on manufacturing of micro-electro-mechanical systems,” J. Mat. Processing & Manufacturing Science, Vol. 8, No. 4, pp. 292-306 (SCI, EI).

85. Tseng, A.A, Horsky, J., Raudensky, M., and Kotrbacek, P. (2001), “Deformation behavior of steels in mushy state,” Materials and Design, Vol. 22, No. 2, pp. 83-92 (SCI, EI).

86. Tseng, A.A., Lee, M. H., and Zhao, B. (2001), “Design and operation of a droplet deposition system for freeform fabrication of metal parts,” ASME J. Eng. Mat. Tech, Vol. 123, No. 1, pp. 74-84 (SCI, EI).

87. Tseng, A.A., and Tanaka, M. (2001), “Advanced deposition techniques for freeform fabrication of metal and ceramic parts,” Rapid Prototyping J., Vol. 7, No. 1, pp. 6-17 (SCI, EI). (Received "2002 High Commended Award" from the journal for its 2001 volume papers).

88. Li, G. X. and Tseng, A.A. (2001), “Low stress packaging of a micromachined accelerometer,” IEEE Trans. Electronics Packaging Manufacturing, Vol. 24, No. 1, pp. 16-25 (SCI, EI).

89. Tseng, A.A., Chen, C. D., Wu, C. S., Diaz, R. E., and Watts, M. E. (2002), “Electron-beam lithography of microbowtie structures for next generation optical probe,” J. Microlithography, Microfabrication, and Microsystems, Vol. 1, No. 2, pp. 123-135 (cover article) (SCI, EI).

90. Tseng, A.A., Tanaka, M., and Leeladharan, B. (2002), “Laser based internal profile measurement system,” Automation in Construction, Vol. 11, No. 6, pp. 667-679 (SCI, EI).

91. Vakanas, G. P, Tseng, A.A., and Winer, P. (2002), “Laser-assisted chemical etching for embedded microchannels and overhanging microstructures on Si/SiO2 substrates,” J. Laser Applications, Vol. 14, No. 3, pp. 185-190 (SCI, EI).

92. Mou, J-I. and Tseng, A.A. (2002), “Integrated solid freeforming of metal parts,” J. Tsinghua University: Science and Technology, Vol. 42, No. S2, pp. 480-489.

93. Tseng, A.A., Diaz, R. E., Chen, C. D., and Wu, C. S. (2003), “Fabrication of microbowtie structures for optical probing of nanoscale objects,” Microsystem Technologies, Vol. 9, No. 5, pp. 335-339 (SCI, EI).

94. Tseng, A.A., Tanaka, M., Leeladharan, B., and Choi, J.G. (2003), "Rotating laser-based system for full profile measurement," Construction Innovation, Vol. 3, No. 2, pp. 97-110.

95. Tseng, A.A., Chen, K., Chen, C. D., and Ma, K. J. (2003), “Electron beam lithography in nanoscale fabrication: recent development," IEEE Trans. Electronics Packaging Manufacturing, Vol. 26, No. 2, pp. 141-149 (SCI, EI).

96. Tseng, A.A., Su, C.-J., Zhou, Z.-Y., Ye, X.-Y., and Wang, X.-H. (2003), "Direct writing techniques in microfabrication using focused ion beams," Micronanoelectronic Technology, Vol. 40, No. 11, pp. 1-8 (Abstract in English).

97. Tseng, A.A., Leeladharan, B., Li, B., Insua, I. A. and Chen, C. D. (2003), “Fabrication and modeling of microchannel milling using focused ion beam,” Int. J. Nanoscience, Vol. 2, Nos. 4 & 5, pp. 375-379 ((SCI, EI).

98. Tseng, A.A., Insua, I. A., Park, J. S., Li, B., and Vakanas, G. P. (2004), "Milling of submicron channels on gold layer using double charged arsenic ion beam," J. Vac. Sci. Technol. B, Vol. 22, No.1, pp. 82-89 (SCI, EI) (also in Virtual J. Nanoscale Science & Tech, Vol. 9, No. 3, 2004)

99. Tseng, A.A. (2004), “Recent developments in micromilling using focused ion beam technology,” J. Micromech. Microeng., Vol. 14, No. 4, pp. R15-R34 (SCI, EI) (most

14

downloaded articles by Institute of Physics, 2004). 100. Zhou, J. G., Kokkengada, M., He, Z., Kim, Y. S., and Tseng, A.A. (2004), "Low

temperature polymer infiltration for rapid tooling," Materials & Design, Vol. 25, No. 2, pp. 145-154 (SCI, EI).

101. Tseng, A.A., Chen, Y. T., and Ma, K. J. (2004), “Fabrication of high-aspect-ratio microstructures using excimer lasers,” Optics & Lasers Eng., Vol. 41, No. 6, pp. 827-847 (SCI, EI).

102. Tseng, A.A., Insua, I. A., Park, J. S., and Chen, C. D. (2005), "Milling yield estimation in focused ion beam milling of two-layer substrates," J. Micromech. Microeng, Vol. 15, No. 1, pp. 20-28 (SCI, EI).

103. Chen, Y. T., Ma, K. J., Zhou. J. G., and Tseng, A.A. (2005), “Excimer laser ablation of glass-based arrayed microstructures for biomedical, mechanical, and optical applications,” J. Laser Applications, Vol. 17, No. 1, pp. 38-46 (SCI, EI).

104. Tseng, A.A. and Notargiacomo, A. (2005), "Nanoscale fabrication by nonconventional approaches," J. Nanoscience & Nanotechnology, Vol. 5, No. 5, pp. 683-702 (SCI, EI).

105. Zhao, Z., Zhang, R., Liu, L. and Tseng, A.A. (2005), “Evolvement of Al-Cu eutectic unidirectionally solidified morphology in high intensity pulsed magnetic field,” Chinese J. Material of Materials Research, Vol. 19, No. 2, pp. 207-212 (EI). (abstract in English, 赵志龙,张蓉, 刘林,曾安培, “强脉冲磁场中 Al-Cu共晶定向凝固组织的演变,” 材料研究学报).

106. Zhao, Z., Zhang, R., Liu, L., and Tseng, A.A. (2005), "Unidirectionally solidified Al-Cu eutectic alloy under high intensity pulsed magnetic field," Materials Science Forum, Vol. 475 - 479, Part. IV, pp. 2619-2622 (SCI, EI).

107. Horsky, J., Raudensky, M., Kotrbacek, P., and Tseng, A.A. (2005), “Indentation and piercing of steels in mushy state,” J. Materials Engineering & Performance, Vol. 14, No. 5, pp. 610-615 (SCI, EI).

108. Tseng, A.A. (2005), “Recent developments in nanofabrication using ion projection lithography,” Small, Vol. 1, No. 6, pp. 594-608 (SCI, EI).

109. Ng, C. Y., Chen, T. P., Tse, M. S., Lim, V. S. W., Fung, S., and Tseng, A.A. (2005), “Influence of silicon-nanocrystal distribution in SiO2 matrix on charge injection and charge decay,” Appl. Phys. Lett., Vol. 86, No. 15, pp. 152110-3 (SCI, EI).

110. Tseng, A.A., Notargiacomo, A., and Chen, T. P. (2005), “Nanofabrication by scanning probe microscope lithography: a review,” J. Vac. Sci. Technol. B, Vol. 23, No. 3, pp. 877-894 (SCI, EI) (also in Virtual J. Nanoscale Science & Tech., Vol. 11, No. 21, 2005).

111. Chen, Y. T., Ma, K. J., Tseng, A.A., and Chen, P. H. (2005), "Projection ablation of glass-based single and arrayed microstructures using excimer laser," Optics & Laser Tech., Vol. 37, No. 4, pp. 271-280 (SCI, EI).

112. O'Riordan, A., Tseng, A.A. and Zhao, Z. (2005), "Self-assembly: a bottom-up approach for nanofabrication, part I," Micronanoelectronic Technology, Vol. 42, No. 5, pp. 209-213 (abstract in English).

113. O'Riordan, A., Tseng, A.A. and Zhao, Z. (2005), "Self-assembly: a bottom-up approach for nanofabrication, part II," Micronanoelectronic Technology, Vol. 42, No. 6, pp. 259-265 (abstract in English).

114. Chen, Y.-T., Naessens, K., Baets, R., Liao, Y. S., and Tseng, A.A. (2005), “Ablation of transparent materials using excimer lasers for photonic applications,” Optical Review, Vol. 12, No. 6, pp. 427-441 (SCI).

115. Halmeenpaa, R. J., Mäntylä, P. T., and Tseng, A.A. (2005), “Quality assessment of rolled strip produced by compact versus conventional rolling,” Arabian J. Science & Engineering

15

C (AJSE), Vol. 30, No. 1C, pp. 39-55 (SCI). 116. Badr, H., Arif, A. F. M., Sheikh, A. K., Shuaib, A. N., Khan, Z., Khan, A. S., Tseng, A.A.,

and Zikry, M. A. (2005), “Theme issue on modeling of metal forming processes – preface,” Arabian J. Science Eng., Vol. 30, No. 1C, pp. III-IV (SCI).

117. Tseng, A.A. (2005), “Recent developments in nanofabrication using focused ion beams,” Small, Vol. 1, No. 10, pp. 924-939 (SCI, EI).

118. Liu, Y., Chen, T. P., Ng, C. Y., Ding, L., Tse, M. S., Fung, S. and Tseng, A.A. (2006), “Influence of Si-nanocrystal distribution in the oxide on the charging behavior of metal-oxide-semiconductor structures,” IEEE Trans. Electron Devices, Vol. 53, pp. 914-917 (SCI, EI).

119. Tseng, A.A. and Park, J. S. (2006), “Mechanical strength and interface characteristics of transmission laser bonding,” IEEE Trans. Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 191-201 (SCI, EI).

120. Ng, C. Y., Chen, T. P., Ding, L., Chen, Q., Liu, Y., Zhao, P., Tseng, A.A., and Fung, S. (2006), “Si ions-induced instability in flatband voltage of Si+-implanted gate oxides,” IEEE Trans. Electron Devices, Vol. 53, No. 5, pp. 1280-1282 (SCI, EI).

121. Ng, C. Y., Chen, T. P., Zhao, P., Ding, L., Liu, Y., Tseng, A.A., and Fung, S. (2006), “Electrical characteristics of Si nanocrystal distributed in a narrow layer in the gate oxide near the gate synthesized with very-low-energy ion beams,” J. Applied Physics, Vol. 99, pp. 106105-3 (SCI, EI).

122. Tseng, A.A. and Park, J. S. (2006), “Effects of surface roughness and contact pressure on wafer bonding strength using transmission laser bonding technique,” J. Microlithography, Microfabrication, & Microsystems, Vol. 5, No. 4, pp. 043013-11 (SCI, EI).

123. Tseng, A.A. and Park, J. S. (2006), “Using transmission laser bonding technique for line bonding in microsystem packaging,” IEEE Trans. Electronics Packaging Manufacturing, Vol. 29, No. 4, pp. 308-318 (SCI, EI).

124. Tseng, A.A. (2007), “Recent developments in nanofabrication using scanning near-field optical microscope lithography,” Optical & Laser Tech, Vol. 39, No. 3, pp. 514-526 (SCI, EI).

125. Tseng, A.A., Park, J. S., Vakanas, G. P., Wu, H., Raudensky, M., and Chen, T. P. (2007), “Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging,” Microsystem Technologies, Vol. 13, No. 1, pp. 49-59 (SCI, EI).

126. Park, J.-S., Zhu, H., Zhao, Z., Tseng, A.A., and Chen, T. P. (2007), “Direct writing of spot and line bonds for microsystem packaging using transmission laser bonding,” Materials & Manufacturing Processes, Vol. 22, pp. 71-80 (SCI, EI).

127. Tseng, A.A. (2007), “Recent developments in micromachining of fused silica and quartz using excimer lasers,” Phys Status Solidi A, Vol. 204, No. 3, pp. 709-929 (Feature article and cover figure) (SCI, EI).

128. Chen, T. P., Liu, Y., Sun, C. Q., Tseng, A.A., and Fung, S. (2007), “Energy shifts of Si oxidation states in the system of Si nanocrystals embedded in SiO2 matrix,” J. Nanoscience & Nanotechnology, Vol. 7, No. 7, pp. 2506-2510 (SCI, EI).

129. Tseng, A.A. and Li, Z. (2007), “Manipulations of atoms and molecules by scanning probe microscopy,” J. Nanoscience & Nanotechnology, Vol. 7, No. 8, pp. 2582-2595 (SCI, EI).

130. Tseng, A.A., Chen, Y. T., Chao, C.-L., Ma, K.-J., and Chen, T. P. (2007), “Recent developments on microablation of glass materials using excimer lasers,” Optics & Lasers Eng, Vol. 45, No. 10, pp. 975-992 (SCI, EI).

131. Jou, S., Yeh, D.-Y., and Tseng, A.A. (2008), “Nickel nanorods produced by annealing composite oxide films,” J. Nanoscience & Nanotechnology, Vol. 8, pp. 390–392 (SCI, EI).

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132. Tseng, A.A., Jou, S., Notargiacomo, A., and Chen, T.P. (2008), “Recent developments in tip-based nanofabrication and its roadmap,” J. Nanoscience & Nanotechnology, Vol. 8, No. 5, pp. 2167–2186 (SCI, EI).

133. Wong, J. I., Chen, T. P., Yang, M., Liu, Y., Ng, C. Y., Ding, L., Chong, C.F., and Tseng, A. A. (2008), “Influence of excess Si distribution in the gate oxide on the memory characteristics of MOSFETs,” Appl. Phys. A, Vol. 91, pp. 411-413 (SCI, EI).

134. Tseng, A. A., Notargiacomo, A., Chen, T. P., Liu, Y., and Shirakashi, J. (2009), “Profile uniformity of overlapped oxide dots induced by atomic force microscopy,” accepted by J. Nanoscience & Nanotechnology.

135. Yang, M., Chen, T. P., Wong, J. I., Liu, Y., Tseng, A. A. and Fung, S. (2009), “Charge storage behaviors of Ge nanocrystals embedded in SiO2 for application in non-volatile memory devices,” accepted by J. Nanoscience & Nanotechnology.

136. Tseng, A. A., Shirakashi, J., Nishimura, S., Miyashita, K. and Li, Z. (2009), “Nanomachining of permalloy for fabricating nanoscale ferromagnetic structures using atomic force microscopy,” accepted by J. Nanoscience & Nanotechnology.

137. Tseng, A. A., Shirakashi, J., Nishimura, S., Miyashita, K. and Notargiacomo, A. (2009), “Scratching properties of nickel-iron thin film and silicon using atomic force microscopy,” accepted by J. Applied Physics.

138. Tseng, A. A., Lee, T., Notargiacomo, A. and Chen, T. P., “Formation of uniform oxide layers assembled by overlapping oxide lines using atomic force microscopy, submitted to J. Vac. Sci. Technol. B.

B. Articles in Monographs or Books 1. Tseng, A.A., Gunderia, A. S., and Ni, D. S. (1992), “Thermal behavior of roll and strip in

steel rolling,” in Thermomechanical Aspects of Manufacturing and Materials Processing, ed. by R. K. Shah, et al., pp. 217-232, Hemisphere, Washington, D.C.

2. Tseng, A.A. and Sun, P. F. (1992), “Modeling of polymer processing and its application to calendering,” in Thermomechanical Aspects of Manufacturing and Materials Processing, ed. by R. K. Shah, et al., pp. 377-387, Hemisphere, Washington, D.C.

3. Tseng, A.A., Tang, W. C., Lee, Y. C., and Allen, J. (2000), Final Report of NSF 2000 Workshop on Manufacturing of Micro-Electro-Mechanical Systems, Arizona State University, Tempe, AZ.

4. Tseng, A.A., Horsky, J., Raudensky, M., and Kotrbacek, P. (2001), “Mechanical characteristics of semisolid steels,” in Interactive Dynamics of Convection and Solidification, ed. by P. Ehrhard, D. S. Riley, and P. H. Steen, pp. 99-112, Kluwer Academic, Dordrecht, Netherlands.

5. Zhu, H., Li, W.-Y., Tseng, A.A., and Phelan, P. (2002), “Measurement of CTE at reduced temperature for stressed specimens,” in Composite Materials: Testing, Design, and Acceptance Criteria, ASTM Special Technical Publication, No. 1416, pp. 212-220, American Society for Testing and Materials, West Conshohocken, PA, USA.

6. Wu, H., Tseng, A.A., and Ji, P. (2005), “Singularity analysis of a six-DOF Stewart parallel manipulator,” in Robotic Manipulators: New Research, ed. by J. X. Liu, Chapter 7, pp. 219-238, Nova Science, Hauppauge, NY.

7. Tseng, A.A., Naessens, K., and Baets, R. (2007), Chapter 1 on “Microablation of transparent materials using excimer lasers for optoelectronic applications,” in New Developments in Lasers and Electro-Optics Research, ed. by W. T. Arkin, pp. 1-40, Nova Science, Hauppauge, NY, USA.

8. Tseng, A.A. (2007), “Fabrication of nanoscale structures using ion beams,” in Focused Ion

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Beam Systems: Basics and Applications, ed. by N. Yao, pp. 187-214, Cambridge University, Cambridge, UK.

9. Tseng, A.A. and Notargiacomo, A. (2007), Chapter 18 on “Nanofabrication” in Microsystems and Nanotechnologies, ed. by Z. Zhou, Z. L. Wang, L. Lin, pp. 565-589, Science, Beijing, China (in Chinese).

10. Ampere A. Tseng, Sartale, S. D., Luo, M. F., and Kuo, C. C. (2008), Chapter 1 on “Atom, molecule, and nanocluster manipulations for nanostructure fabrication using scanning probe microscopy,” in Nanofabrication: Fundamentals and Applications, ed. by A. A. Tseng, pp. 1-32, World Scientific Pub, Singapore.

C. Author or Editor of Monographs 1. Co-editor, Manufacturing Simulation and Processes, PED-Vol. 20, ASME, 1986 (with D.R.

Durham and R. Komanduri). 2. Editor, Modeling of Materials Processing, MD-Vol. 3, ASME, 1987. 3. Co-editor, Interdisciplinary Issues in Materials Processing and Manufacturing, Vol. 1,

ASME, 1987 (with S.K. Samata, R. Komanduri, R. McMeeking, and M.M. Chen). 4. Co-editor, Interdisciplinary Issues in Materials Processing and Manufacturing, Vol. 2,

ASME, 1987 (with S.K. Samata, R. Komanduri, R. McMeeking, and M.M. Chen). 5. Guest co-editor, Special Issue on Performance of Composites in Severe Environments, in J.

Engineering Materials and Technology, No. 2, Vol. 110, 1988 (with M. Taya). 6. Co-editor Advances in Mechanical Behavior and Properties Evaluations, MD-Vol. 7,

ASME, 1988 (with A. Saigal). 7. Co-editor, New Directions in the Nondestructive Evaluation of Advanced Materials, MD-

Vol. 9, ASME, 1988 (with J.L. Rose). 8. Co-editor, Friction and Material Characterizations, MD-Vol. 10, ASME, 1988 (with I.

Haque, J.E. Jackson, and J.L. Rose). 9. Co-editor, Processing of Polymers and Polymeric Composites, MD-Vol. 19, ASME, 1990

(with S. K. Soh). 10. Author, Lectures Notes on Manufacturing Analysis, National Cheng Kung University,

Tainan, Taiwan, 1991 (73 pages). 11. Author, Seminar on Metal Cutting and Metal Forming Analyses, National Cheng Kung

University, Tainan, Taiwan, 1991 (113 pages). 12. Editor, Nanofabrication : Fundamentals and Applications, World Scientific Pub, Singapore,

2008 (ISBN-13:978-981-270-076-6; ISBN-10:981-270-076-5; ISBN-13:978-981-270-542-6, ppk; ISBN-10:981-270-542-2, ppk).

D. Refereed Conference Papers 1. Tseng, A.A., Haagen, C.T., and Berry, J.T. (1978), “A numerical analysis of the double

torsion test and its application to the evaluation of tool materials,” in 6th North American Metalworking Research Conference Proceedings, pp. 258-263, Society of Manufacturing Engineers.

2. Tseng, A.A. and Berry, J.T. (1978), “A three-dimensional finite element analysis of the double torsion test,” Preprint Paper No. 78-PVP-96, 1978 Joint ASME/CSME Pressure Vessel and Piping Conference, American Society of Mechanical Engineers.

3. Verma, D.K., Berry, J.T., and Tseng, A.A. (1979), “A study of the fracture behavior of pearlitic gray iron,” in Cast Metals for Structural and Pressure Containment Applications, MPC-Vol. 11, G.V. Smith (ed.), pp. 1-25, American Society of Mechanical Engineers.

4. Tseng, A.A. (1981), “A numerical analysis of the extrusion process,” in 9th North American

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Manufacturing Research Conference Proceedings, pp. 467-474,Society of Manufacturing Engineers.

5. Tseng, A.A. and Sahai, V. (1982), “Magnetohydrodynamic flow of a suspension in pipes,” in Developments in Theoretical and Applied Mechanics, Vol. XI, pp. 397-406, Univ. of Alabama, Huntsville, AL.

6. Tseng, A.A. (1982), “A finite-difference thermal model of flat rolling,” in Numerical Methods in Industrial Forming Processes, pp. 767-776, Pineridge Press, Swansea, U.K.

7. Tseng, A.A. (1983), “A numerical heat transfer analysis of strip rolling,” in Transport Phenomena in Materials Processing, PED-Vol. 10 and HTD-Vol. 29, pp. 55-62, American Society of Mechanical Engineers.

8. Tseng, A.A., Mills, J.J., and Maslen, S.H. (1984), “A mathematical model of an extrusion reheater,” in Proc. of 3rd Int. Aluminum Extrusion Tech. Sem., Vol. 1, pp. 159-164, Aluminum Association.

9. Tseng, A.A. (1986), “Computer-aided design and operation of induction furnace for taper heating,” in Manufacturing Simulation and Processes, PED-Vol. 20, pp. 105-118, American Society of Mechanical Engineers.

10. Tseng, A.A. (1987), “A thermal analysis of a new IMPATT semiconductor device,” 1987 Winter Annual Meeting, Paper No. 87-WA/EEP-7, American Society of Mechanical Engineers.

11. Tseng, A.A. (1987), “Electroheating modeling in metal processing,” in Modeling of Materials Processing, MD-Vol. 3, pp. 1-24, American Society of Mechanical Engineers.

12. Tseng, A.A., Chen, S.J., and Westgate, C.R. (1987), “Experiments on local heat transfer coefficients for rolling processes,” in Modeling of Materials Processing, MD-Vol. 3, pp. 51-63, American Society of Mechanical Engineers.

13. Tseng, A.A., Kolluri, S.P., and Radhakrishnan, P. (1988), “Design and construction of a CNC machining system for hardware and software development,” in Manufacturing International 88 Proceedings, Vol. 1, Symposium on Product and Process Design, pp. 43-49, American Society of Mechanical Engineers.

14. Tseng, A.A. (1988), “A structural analysis of a dish antenna,” in Proceedings 9th Symposium on Engineering Mechanics, pp. 136-144, University of Western Ontario, Canada.

15. Tseng, A.A. (1988), “A microcomputer thermal analysis of a microstrip gunn diode at steady-state operation,” in Intersociety Conference on Thermal Phenomena in Fabrication and Operation of Electronic Components Proceedings, pp. 21-28, IEEE.

16. Tseng, A.A., Tong, S., Sun, P., and Huang, K. (1988), “Thermal behavior of aluminum rolling,” in ASME Proceedings of 1988 National Heat Transfer Conference, Vol. 3, pp. 55-65, American Society of Mechanical Engineers.

17. Tseng, A.A. (1988), “Assessment of robotic simulation software,” in Computer in Engineering 1988, Vol. 2, pp. 217-226, American Society of Mechanical Engineers.

18. Tseng, A.A., Kolluri, S.P., Sun, P.F., and Dong, C.M. (1988), “Computer-aided modeling of polymer processing,” in Advances in Mechanical Behavior and Properties Evaluations, MD-Vol. 7, pp. 109-120, American Society of Mechanical Engineers.

19. Tseng, A.A., Tong, S., and Lin, F.H. (1988), “Thermal stresses and expansion of a rotating roll in rolling processes,” in Materials in Manufacturing Processes, MD-Vol. 8, pp. 59-72, American Society of Mechanical Engineers.

20. Tseng, A.A. (1988), “Finite element simulation and material characterization for forming miniature metal parts,” in Friction and Material Characterizations, MD-Vol. 10, pp. 63-71, American Society of Mechanical Engineers.

19

21. Tseng, A.A., Sun, P.F., Gunderia, A.S., Lin, F.H., and Ni, D.S. (1989), “Roll cooling and its relationship to roll life,” in Advances in Manufacturing Systems Integration and Processes (15th NSF Grantees Conference), pp. 339-351, Society of Manufacturing Engineers.

22. Kolluri, S.P. and Tseng, A.A. (1989), “CAD/CAM: A microcomputer-based integrated approach,” in CAD/CAM Robotics and Factories of the Future, Vol. 1, Integration of Design, Analysis, and Manufacturing, B. Prasas (ed.), pp. 33-38, Springer-Verlag, Heidelberg.

23. Tseng, A.A., Gunderia, A.S., and Ni, D.S. (1989), “Thermal behavior of roll and strip in steel rolling,” in Energy Optimisation in Manufacturing and Materials Processing, pp. 78-89, Advanced Study Institute, Indian Institute of Technology, Madras, India.

24. Tseng, A.A., Sun, P.F., and Li, J. (1989), “Modeling of polymer processing and its application to calendering,” in Energy Optimisation in Manufacturing and Materials Processing, pp. 99-108, Advanced Study Institute, Indian Institute of Technology, Madras, India.

25. Tseng, A.A., Sun, P.F., and Kolluri, S.P. (1989), “Computer-aided modeling of polymer processing: a review,” in Conference Proceedings of ANTEC '89, pp. 267-270, Society of Plastics Engineers (based on refereed extended abstract).

26. Dong, C.M. and Tseng, A.A. (1989), “A multivariable self-tuning controller for injection molding machines,” in Proceedings of the 1989 American Control Conference, Vol. 1, pp. 54-61, American Automatic Control Council, IEEE Service Center, Piscataway, NJ.

27. Tseng, A.A. and Lin, F.H. (1989), “On-line bending model in gauge control of calendering processes,” in Polymer Processing: Modeling and Validation, MD-Vol. 15, pp. 23-38, American Society of Mechanical Engineers.

28. Tseng, A.A. and Sun, P.F. (1989), “A finite difference study of roll design in calendering processing,” in Polymer Processing: Modeling and Validation, MD-Vol. 15, pp. 49-66, American Society of Mechanical Engineers.

29. Tseng, A.A., Gunderia, A.S., and Sun, P.F. (1990), “Heat transfer of roll and strip in steel rolling,” in Mathematical Modelling of the Hot Rolling of Steel, pp. 177-189, Metallurgical Society of Canadian Institute of Mining and Metallurgy, Montreal, Quebec.

30. Tseng, A.A., Gunderia, A.S., and Wang, S.R. (1990), “On-line modeling of flat rolling of metals,” in Mathematical Modelling of the Hot Rolling of Steel, pp. 360-370, Metallurgical Society of Canadian Institute of Mining and Metallurgy, Montreal, Quebec.

31. Tseng, A.A., Kaplan, J.D., Arinze, O.B., and Zhao, T.J. (1990), “Knowledge-based mold design for injection molding processing,” in Proceedings 5th IEEE International Symposium on Intelligent Control 1990, Vol. II, pp. 1191-1204, IEEE Computer Society Press, Los Alamitos, CA.

32. Tseng, A.A., Kaplan, J.D., and Arinze, O.B. (1990), “Knowledge-based mold design for injection molding of plastic balls,” in Processing of Polymers and Polymeric Composites, MD-Vol. 19, pp. 19-33, American Society of Mechanical Engineers.

33. Tseng, A.A., Zou, J., Wang, H.P., and Hoole, S.R.H. (1990), “Numerical modeling of macro- and micro-behaviors in material processing,” in Processing of Polymers and Polymeric Composites, MD-Vol. 19, pp. 135-159, American Society of Mechanical Engineers.

34. Tseng, A.A. (1990), “Predictability and control of layflatness in calendering,” in Processing of Polymers and Polymeric Composites, MD-Vol. 19, pp. 213-234, American Society of Mechanical Engineers.

35. Tseng, A.A., Wang, S.R., Kim, S.S., and Traynor, J.S. (1991), “On-line modeling in gage control of calendering processes,” in Proceedings of 1991 NSF Design and Manufacturing

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Systems Conference, pp. 375-381, Society of Manufacturing Engineers. 36. Zou, J. and Tseng, A.A. (1991), “Microscopic modeling of fundamental phase

transformation in continuous casting of steels,” in Materials Processing in the Computer Age, pp. 223-237, the Minerals, Metals & Materials Society.

37. Chen, S.J., Tseng, A.A., and Han, F. (1991), “Spray and jet cooling in steel rolling,” in Heat Transfer in Metals and Containerless Processing and Manufacturing (Proceedings of 28th National Heat Transfer Conference), HTD-Vol. 162, pp. 1-11, American Society of Mechanical Engineers.

38. Kolluri, S.P., Wang, Z.S., Li, Z.K., and Tseng, A.A. (1991), “An integrated CAD/CAM system for education,” Computer-Aided Design & Computer Graphics, ed. by J. Staudhammer and Q. Peng, pp. 261-268, International Academic, Beijing, China.

39. Tseng, A.A., Chou, P.C., and Hashemi, J. (1991), “Thermomechanical simulation of adiabatic shear band in high speed forming,” in Proceedings of 12th Army Symposium on Solid Mechanics, ed. by S. C. Chu, pp. 315-330, Army Materials Technology Laboratory, Watertown, MA.

40. Tseng, A.A. and Traynor, J.S. (1992), “Temperature variation in calendering and its relationship to layflatness,” in Proceedings of the 1992 NSF Design and Manufacturing Systems Conference, pp. 211-216, Society of Manufacturing Engineers.

41. Tseng, A.A., Traynor, J.S. and Wang, S.R. (1992), “Thermal behavior of calendering processing,” in Conference Proceedings of ANTEC '92, pp. 528-531, Society of Plastics Engineers.

42. Kaplan, J.D. and Tseng, A.A. (1992), “Computer-aided design for injection molds with automatic degating used to manufacture plastic balls,” in Conference Proceedings of ANTEC '92, pp. 1631-1634, Society of Plastics Engineers.

43. Hashemi, J., Rasty, J., Li, S., and Tseng, A.A. (1992), “Design and manufacturing of single and multi-layered spherical pressure vessels using the integral hydro-bulge forming method,” in Recent Advances in Structural Mechanics, PVP-Vol. 248/NE Vol. 10, pp. 73-79, American Society of Mechanical Engineers.

44. Tseng, A.A., Jen, K.P., Gildersleeve, N.A., and Ochiai, T. (1992), “A formability analysis of beryllium copper strip,” in IICIT Conn-Cept '92 (25th Annual Connector and Interconnection Technology Symposium), pp. 465-480, Int. Institute of Connector and Intercon. Technology.

45. Chen, S.J., Frazier, W.E., and Tseng, A.A. (1993), “Heat transfer in melt spinning of intermetallic materials,” in First Int. Conf. on Transport Phenomena in Processing, pp. 239-248, Technomic, Lancaster, PA.

46. Too, J.J. and Tseng, A.A. (1993), “recent developments in micro- and macro-modeling of hot rolling,” in First Int. Conf. on Transport Phenomena in Processing, pp. 447-478, Technomic, Lancaster, PA.

47. Tseng, A.A., Shih, W.H., Thomas, C.L., and Chen, S.J. (1993), “Intelligent processing of polymer sheets for calendering,” in Proceedings of the 1993 NSF Design and Manufacturing Systems Conference, pp. 353-361, Society of Manufacturing Engineers.

48. Thomas, C.L., Rose, J.L., and Tseng, A.A. (1993), “Ultrasonic techniques to monitor processing conditions,” in Polymer Processing Society IX Annual Meeting, pp. 31-32, Polymer Processing Society, Manchester, England, April 7.

49. Chen, J. S.-J., Ren, R.C., and Tseng, A.A. (1993), “Interface heat transfer in metal casting on a moving substrate,” in Heat and Mass Transfer in Manufacturing Processes and Manufacturing, HTD-Vol. 261, pp. 1-8, American Society of Mechanical Engineers.

50. Hashemi, J., Helm, J., Sheets, C. L., and Tseng, A.A. (1993), “New method in design and

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manufacturing of fluid-filled multi-layered spherical pressure vessels,” in Recent Advances in Structural Mechanics 1993, PVP-Vol. 269 and NE-Vol. 13, pp. 107-112, American Society of Mechanical Engineers.

51. Lin, F.H., Tseng, A.A., and Wang, S.R. (1993), “A finite element analysis of elasto-plastic contact problems in indentation,” in Advanced Technology of Plasticity 1993, Vol. 1, ed. by Z. R. Wang and H. Yuxin, pp. 230-235, International Academic Publishers, Beijing, China.

52. Hashemi, J., Tseng, A.A., and Chou, P.C. (1993), “Finite element modeling of high speed orthogonal cutting process,” in 1st Int. Conf. on Processing Materials for Properties, ed. by H. Henein and T. Oki, pp. 49-52, The Minerals, Metals & Material Society.

53. Thomas, C.L., Tseng, A.A., Bur, A.J., and Rose, J.L. (1993), “Closed loop control of injection molding hold time,” in Conference Proceedings of ANTEC '93, Vol. 1, pp. 143-148, Society of Plastics Engineers.

54. Hashemi, J., Tseng, A.A., and Chou, P.C. (1993), “Finite element modeling of segmental chip formation in high speed machining,” in Proceedings of 13th Army Symposium on Solid Mechanics, ed. by S. C. Chou, F. D. Bartlett, T. W. Wright, and K. Iyer, pp. 419-430, Materials Directorate, Army Research Laboratory, Watertown, MA.

55. Tseng, A.A. and Wang, S.R. (1994), “Macro- and micro-modeling of hot rolling of steel,” in Proceedings of the 1994 NSF Design and Manufacturing Grantees Conference, pp. 653-654, Society of Manufacturing Engineers.

56. Raudensky, M., Horsky, J., Tseng, A.A., and Weng, C.I. (1994), “Heat transfer evaluation of impingement cooling in hot rolling of shaped steels,” in Manufacturing Science and Engineering 1994, Vol. 2, pp. 683-692, American Society of Mechanical Engineers.

57. Tseng, A.A. and Wang, S.R. (1995), “Strain rate in roll bite region during rolling of steels,” in Proceedings of the 1995 NSF Design and Manufacturing Grantees Conference, pp. 501-502, Society of Manufacturing Engineers.

58. Tseng, A.A, Bera, K., Raudensky, M., Horsky, J., and Chang, J.G. (1995), “An inverse finite element evaluation of roll cooling in hot rolling of steels,” in Novel Techniques in Synthesis and Processing of Advanced Materials, ed. by J. Singh and S. T. Copley, pp. 345-364, The Minerals, Metals & Material Society.

59. Tseng, A.A., Chen, T.C., and Yang, S.C. (1995), “Sensing and control of PVC calenders,” in What’s New in PVC, pp. 35-42, Regional Technical Conference, New Brunswick, NJ, Society of Plastics Engineers, 1995.

60. Tseng, A.A., Wang, S.R., Lau, A.C.W., and Adebanjo, R.O. (1995), “Plastic strain rate in roll bite region during rolling of steels,” in Recent Advances in Heat Transfer and Micro-Structure Modeling for Metal Processing, MD-Vol. 67, pp. 131-142, American Society of Mechanical Engineers.

61. Tseng, A.A. and Wang, S.R. (1995), “Effects of interface resistance on heat transfer in steel cold rolling,” in Recent Advances in Heat Transfer and Micro-Structure Modeling for Metal Processing, MD-Vol. 67, pp. 233-243, American Society of Mechanical Engineers.

62. Wang, S.R. and Tseng, A.A. (1995), “Macro- and micro-modeling of hot rolling of steel coupled by a micro constitutive relationship,” in 37th Mechanical Working and Steel Processing Conference Proceedings, pp. 805-818, Iron & Steel Society.

63. Chen, J. S.J., Finkel, M., and Tseng, A.A. (1996), “Transport phenomena in single roll casting,” in Proceedings of the 1996 NSF Design and Manufacturing Grantees Conference, pp. 349-350, Society of Manufacturing Engineers.

64. Tseng, A.A. and Wang, S.R. (1996), “Modeling of grain size evolution in hot rolling of steels using micro-constitutive relationship,” in Proceedings of the 1996 NSF Design and Manufacturing Grantees Conference, pp. 447-448, Society of Manufacturing Engineers.

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65. Finkel, M., Shegay, V.V., Tseng, A.A., and Chen, J.S.J. (1996), “Thermodiffusion separation in alloys during the melt-spinning process,” in Processing and Fabrication of Advanced Materials IV, pp. 575-593, The Minerals, Metals & Materials Society, 1996.

66. Tseng, A.A., Yang, S.C., Lin, C.L., J.S. Chen, and Nathal, M.V., “A progress on melt spinning of a shape memory alloy,” in Melt Spinning, Strip Casting and Slab Casting, pp. 185-194, The Minerals, Metals & Materials Society.

67. Tseng, A.A., Sato, Y., and Chen, J.S. (1996), “Modeling and monitoring of flow behavior of advanced materials in melt spinning: a progress report,” in Melt Spinning, Strip Casting and Slab Casting, pp. 195-204, The Minerals, Metals & Materials Society.

68. Raudensky, M., Horsky, J., Krejsa, J., and Tseng, A.A. (1996), “Experimental study of heat transfer on rotating roll cooled by water nozzles,” in Proceedings of 6th Int. Symposium on Transport Phenomena and Dynamics of Rotating Machinery, Vol. 2, pp. 501-508, Pacific Center of Thermal-Fluid Engineering, Hawaii, USA.

69. Chen, S.J., Finkel, M., and Tseng, A.A. (1997), “Process modeling and optimization in single-roll casting,” in Proceedings of the 1997 NSF Design and Manufacturing Grantees Conference, pp. 359-360, National Science Foundation.

70. Tseng, A.A., Watson, W., and Chen, S.J. (1997), “Melt spinning of a shape memory alloy,” in Proceedings of the 1997 NSF Design and Manufacturing Grantees Conference, pp. 385-386, National Science Foundation.

71. Hashemi, J., Chou, P.C., and Tseng, A.A. (1997), “Thermomechanical behavior of adiabatic shear band in high speed forming and machining,” in International Symposium on Manufacturing and Materials Processing, Vol. 1, ed. by W. Aung, pp. 455-475, Begell House, New York, NY.

72. Shamasunder, S., Tseng, A.A., Aung, W., and Biswas, S.K. (1997), “Numerical and experimental study of thermal behavior of coining and upsetting processes,” in International Symposium on Manufacturing and Materials Processing, Vol. 1, ed. by W. Aung, pp. 493-511, Begell House, New York, NY.

73. Bischel, K., Harvey, E.G., Overman, A., and Tseng, A.A. (1997), “Telemanufacturing and rapid prototyping of engineering components through use of internet,” in 1997 Int. CIRP Design Seminar on Multimedia Technologies for Collaborative Design and Manufacturing, ed. by S. Lu and Y. Jin, pp. 246-255, Uni. Southern California, Los Angeles, CA. (http://www.indirect.com/www/kbischel/Telemanufacturing.html).

74. Chen, J. S.J., Zhang, C.X., and Tseng, A.A. (1998), “Modeling macro and micro behavior of advanced materials in melt spinning and strip casting,” in Proceedings of the 1998 NSF Design and Manufacturing Grantees Conference, pp. 565-566, National Science Foundation.

75. Zhang, K.F., Chen, J. S.J., and Tseng, A.A. (1998), “Finite element analysis of heat transfer and microstructure in melt spinning of Ti-Al,” in Solidification 1998, pp. 255-269, The Minerals, Metals & Materials Society.

76. Lee T.-W. and Tseng, A.A. (1998), “Advanced uniform droplet sprays for aluminum production and processing,” reprint, paper presented at 1998 TMS Annual Meeting Exhibition, San Antonio, TX, The Minerals, Metals & Materials Society.

77. Tseng, A.A., Chaidilokpattanakul, C., Bi, Y. F., Chen, J.S.J., and Zhang, K. (1999), “Modeling single-roll and twin-roll casting processes,” in 1999 NSF Design and Manufacturing Grantees Conference Proceedings, Paper No. MPM-77, National Science Foundation (published in CD form).

78. Zhao, B., Lee, M. H., and Tseng, A.A. (1999), “Alternative estimation of optimal frequency using wave speed for metal droplet generation in freeform fabrication,” in

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Manufacturing Science and Engineering-1999, MED-Vol. 10, pp. 67-72, American Society of Mechanical Engineers.

79. Chen, J. S. J. and Tseng, A.A. (1999), “Modeling and optimization of nozzle design in planar flow melt spinning,” in Manufacturing Science and Engineering-1999, MED-Vol. 10, pp. 79-84, American Society of Mechanical Engineers.

80. Tseng, A.A., Lee, M. H., and Zhao, B. (1999), “Design and operation of a droplet deposition system for freeform fabrication of metal parts,” in Science, Automation, and Control of Material Processes Involving Coupled Transport and Rheology Changes, MD-Vol. 89, pp. 33-47, American Society of Mechanical Engineers.

81. Tseng, A.A., Chaidilokpattanakul, C. and Chen, J. S-J. (1999), “A versatile thermal-mechanical model for twin-roll casting,” in Manufacturing Science and Engineering-1999, MED-Vol. 10, pp. 57-65, American Society of Mechanical Engineers.

82. Tseng, A.A., Zhao, B., Tanaka, M, and Lee, M. H. (2000), “Advanced deposition techniques for freeforming metal and ceramic parts,” in Proceedings of the 2000 NSF Design and Manufacturing Research Conference, Paper No. MME-200, National Science Foundation (published in CD form).

83. Zhu, H., Guo, Y., Li, W. Y., and Tseng, A.A. (2000), “Mechanical characterization of solder mask materials in electronic packaging applications,” in ITherm 2000Proceedings (7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 23-26, 2000, Las Vegas, Nevada), Vol. II, ed. by I. R. Kromann, I. R. Culham, and K. Ramakrishna, pp. 362-365, IEEE.

84. Tseng, A.A., Yan, J.Q., Fan, X.M., Ma, D.Z., and Shen, W. (2000), “System structure for virtual manufacturing,” in Proceedings of 6th International Conference on Automation Technology (May 9-11, 2000, Taipei, Taiwan), Vol. 1, pp. 389-397, Chinese Institute of Automation Engineers.

85. Tseng A.A., Vakanas, G. P., and Watson, W. (2000), “LabVIEW-based automation of a direct-write pulsed-laser micromachining system,” in LabVIEW for Automotive, Telecommunications, Semiconductor, Biomedical and Other Applications, ed. by H. T. Martin and M. L. Martin, pp. 232-242, Prentice-Hall, Upper Saddle River, NJ, 2000.

86. Vakanas, G.P, Tseng A.A. and Winer, P., “Direct-write laser microfabrication for magneto-thermo-fluidic MEMS,” in Proceedings of the Laser Microfabrication Conference (ICALEO 2000, October 2-5, Dearborn, MI), pp. D26-D35, LIA Vol. 90, Laser Institute of America.

87. Tseng, A.A., and Tanaka, M. (2000), “Advanced deposition techniques for freeforming metal and ceramic parts,” in Proceedings of the ASME Manufacturing Engineering Division- 2000, MED-Vol. 11, pp. 305-313, American Society of Mechanical Engineers.

88. Lu, M., He, X, Liu, S., and Tseng, A.A. (2000), “A warpage measurement system with large dynamic range for boards with components, in Proceedings of SAE 2000 World Congress, SAE, Detroit, MI.

89. Vakanas, G.P., Tseng A.A., and Winer, P. (2000), “Magneto-thermo-fluidic (MTF) MEMS by direct-write (DW) laser micro-fabrication (LF),” in Micro-Electro-Mechanical Systems (MEMS)- 2000, MEMS-Vol. 2, pp. 701-708, American Society of Mechanical Engineers.

90. Horsky, J., Raudensky, M., and Kotrbacek, P., and Tseng, A.A. (2000), “Forming of steels in mushy states,” in Proceedings of the ASME Manufacturing Engineering Division- 2000, MED-Vol. 11, pp. 251-257, American Society of Mechanical Engineers.

91. Tseng, A.A., and Mou, J.-I. (2001), “NSF 2000 workshop on manufacturing of micro-

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electro mechanical systems,” in Proceedings of the 2001 NSF Design, Service and Manufacturing Grantees & Research Conference, MPM Paper, National Science Foundation (published in CD form).

92. Tseng A.A. and Vakanas, G.P. (2001), “Development of laser-based tools for MEMS rapid prototyping,” in Proceedings of the 2001 NSF Design, Service and Manufacturing Grantees & Research Conference, MPM Papers, National Science Foundation (published in CD form).

93. Tanaka, M., Leeladharan, B., Wu, H., and Tseng, A.A. (2002), “Internal profile measurement using rotating laser based system,” in Proceedings of 1st International Conference on Construction in the 21st Century, pp. 801-808, Florida International University, Miami, FL.

94. Tseng, A.A., Insua, I. A., and Vakanas, G. P. (2002), “Maskless submicron machining by focused ion beams,” in Proceedings of the 2002 NSF Design, Service and Manufacturing Grantees & Research Conference, MPM Paper, pp. 2043-2044, National Science Foundation (published in CD form).

95. Tseng, A.A., Chen, C. D., Diaz, R. E. and Wu, C. S. (2002), “Fabrication of microbowtie structures using electron-beam lithography for a new optical probe,” in Emerging Lithographic Technologies VI, Proceedings of SPIE Vol. 4688, No. 2, ed. by R L. Engelstad, pp. 850-857, The International Society for Optical Eng.

96. Tseng, A.A., Chen, C. D., and Wu, C. S. (2002), “Electron-beam lithography of nanostructures using lift-off process,” in Proceedings of 2002 Japan-USA Symposium on Flexible Automation, Vol. I, pp. 549-552, Institute of Systems, Control and Information Engineers, Kyoto, Japan.

97. Watts, M., Diaz, R. E., and Tseng, A.A. (2002), “Feasibility study and optimization of a remotely interrogated sensor for metrology of nanostructures,” in Proceedings of 2002 Japan-USA Symposium on Flexible Automation, Vol. I, pp. 573-576, Institute of Systems, Control and Information Engineers, Kyoto, Japan.

98. Mou, J-I. and Tseng, A.A. (2002), “Integrated solid freeforming of metal parts,” in Proceedings of 2nd International Conference on Rapid Prototyping and Manufacturing, pp. 480-489, Tsinghua University, Beijing, China.

99. Tseng, A.A., Leeladharan, B., Park, J. S., Insua, I. A., and Chen, C. D. (2002), “Fabrication and modeling of micro-channel milling using focused ion beam " in Proceedings 1st Taipei Symposium on Nanotechnology, Paper No. P29, Academia Sinica, Taipei, Taiwan.

100. Tseng, A. A, Chen, Y. T., and Ma, K. J. (2002), “Fabrication of high-aspect-ratio microstructures using excimer lasers,” in Proceedings of ICALEO 2002, Laser Institute of America, 2002.

101. Tseng, A.A., Yan, J. Q., Fan, X. M., and Ma, D. Z.(2002), “Virtual manufacturing and its applications to making oil pumps,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition, MED-Vol. 13, pp. 9-13, American Society of Mechanical Engineers.

102. Tseng, A.A., Chen, K., and Chen, C. D. (2002), “Electron beam lithography in nanoscale fabrication: recent development,” in Proceedings of the ASME International Mechanical Engineering Congress and Exposition, Vol. 3, American Society of Mechanical Engineers.

103. Park, J-S. and Tseng, A.A.(2004), “Transmission laser bonding of glass with silicon wafer,” in Proceedings of 2004 Japan-USA Symposium on Flexible Automation, Paper No. UL-073, American Society of Mechanical Engineers.

104. Halmeenpaa, R. J., Mantyla, P. T., and Tseng, A.A. (2004), “Analysis of quality-producing ability of compact strip production technique vs. conventional method," in AISTech 2004,

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Iron and Steel Technology Conference Proceedings, Vol. 2, pp. 107-119 (Paper No. 152), Association of Iron & Steel Technology, Warrendale, PA.

105. Horsky, J. Raudensky, M., and Tseng, A.A. (2004), “Intensification of roll cooling using two-level pressure system," in AISTech 2004, Iron and Steel Technology Conference Proceedings, Vol. 2, pp. 141-148 (Paper No. 155), Association of Iron & Steel Technology, Warrendale, PA.

106. Park, J-S. and Tseng, A.A.(2005), “Development and characterization of transmission laser bonding technique” in Proceedings of IMAPS Int. Conf. & Exhibition of Device Packaging, Paper No. TA15, Int. Microelectronics and Packaging Society.

107. Tseng, A.A. and Park, J-S. (2006), “Effects of surface roughness and oxide layer on wafer bonding strength using transmission laser bonding technique,” in ITherm 2006 Proceedings, pp. 1349-1357, IEEE.

108. Park, J-S. and Tseng, A.A. (2006), “Line bonding using transmission laser bonding for microsystem packaging,” in ITherm 2006 Proceedings, pp. 1358-1364, IEEE.

109. Tseng, A.A., Park, J-S., Zhu, H., Zhao, Z-L., and Chen, T. P. (2006), “Wafer bonding for microsystems using transmission laser bonding technique,” in Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees & Research Conference, MPM Paper No. 0423457, National Science Foundation.

110. Park, J-S. and Tseng, A.A. (2006), “Line bonding using transmission laser bonding formicrosystem packaging,” in ITherm 2006 Proceedings, pp. 1358-1364, IEEE.

111. Tseng, A.A., Jou, S., Notargiacomo, A., and Chen, T. P. (2007), “Development of tip-based nanofabrication and its roadmap,” in Proceedings of ICAM2007on Advanced Manufacture, Paper No. A2-96, Society of Manufacturing Engineers and National Cheng Kung University.

112. Tseng, A.A., Notargiacomo, A., Li, Z. and Chen, T. P., “Tip-based nanofabrication and its roadmap,” in Proceedings of First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

113. Huang, J. C., Tsai, C. L., Tseng, A. A., and Shyankay Jou, S., “The Study of Nanooxidation Pattern on Si Substrate Using Atomic Force Microscopy,” in Proceedings of First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

114. Yang, M., Chen, T. P., Wong, J. I., Liu, Y. and Tseng, A. A., “Charge Storage Behaviors of Ge Nanocrystals for the Applications in Non-Volatile Memory Devices,” in Proceedings of First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

115. Wong, J. I., Chen, T. P., Yang, M., Dao, H. L., and Tseng, A. A., “Characterization of MOSFET with Gate Oxide Distributed with Si Nanocrystals,” in Proceedings of First International Workshop on Tip-Based Nanofabrication, Taipei, Taiwan, October 19-21, 2008.

Patents and Disclosures 1. Tseng, A.A. (2000), “Apparatus for freeform fabrication of a three-dimensional object,” US

Patent No. 6,030,199, February 29. 2. Tseng, A.A. (2000), “Adaptable filament deposition system and method for freeform

fabrication of three-dimensional objects,” US Patent No. 6,113,696, September 5. 3. Tseng, A.A. (2000), “Droplet selection systems and methods for freeform fabrication of

three-dimensional objects,” US Patent No. 6,149,072, November 21.

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4. Tseng, A.A. and Lee, T-L. (2001), “Apparatus and method for manufacturing a three-dimensional object,” US Patent No. 6,216,765, April 17.

5. Tseng, A.A. (2001), “Adaptable filament deposition system and method for freeform fabrication of three-dimensional objects,” US Patent No. 6,251,340, June 26.

6. Tseng, A.A. and Lee, T-L. (2001), “Method for manufacturing a three-dimensional object,” US Patent No. 6,309,711, October 30.

7. Tseng, A.A. (2002), “Method for freeform fabrication of a three-dimensional object,” US Patent No. 6, 372,178, April 16.

8. Tseng, A.A. (2005), “Crucible and spindle for a variable size drop deposition system,” US Patent No. 6,851,587, February 8.

9. Diaz, R. E., Tseng, A.A., Booksh, K. S., Menendez, J., Panchanathan, S. and Wagner, M. (2005), “Coherent evanescent wave imaging,” US Patent No. 6,980,716, December 27.

Presentations A. Conference Presentations 1. “Magnetohydrodynamic poiseuille flow through a porous medium,” Ninth Southeastern

Seminar on Thermal Science, Newport News, VA, July 1973. 2. “Some problems in the simulation of planar freezing from chills,” 1975 Materials Science

Symposium, No. 51, ASM and AIME, Cincinnati, OH, November 1975. 3. “Magnetohydrodynamic poiseuille flow of a suspension,” 1976 IEEE Int. Conf. on Plasma

Science, 1C6, Austin, TX, May 1976. 4. “Finite element simulation of extrusion and drawing processes,” 16th Ann. Meeting of Soc.

of Eng. Sci., Evanston, IL, September 1979. 5. “A three-dimensional finite element analysis for cracked elastic structures,” 16th Ann.

Meeting of Soc. of Eng. Sci., Evanston, IL, September 1979. 6. “An analysis of the double torsion test,” 6th Int. Conf. Stru. Mech. Reactor Tech., G2/4,

Paris, France, Aug. 1981. 7. “Elastic and inelastic assessment of the instability of an imperfect steam generator tube,”

7th Int. Conf. Stru. Mech. Reactor Tech., E3/5, Chicago, IL, August 1983. 8. “An on-line bending model of rolling,” 13th North American Manufacturing Research

Conference and Annual Meeting, Berkeley, CA, May 1985. 9. “Applications of computer-aided design to metal forming,” 23rd Annual Meeting of Soc. of

Eng. Sci., Buffalo, NY, 1986. 10. “Computer-aided design for forming miniature parts,” Symposium on Modeling of

Advanced Fabrication Processes, 1987 TMS Fall Meeting, Cincinnati, OH, October 1987. 11. “Simulation of CNC controller features in graphics-based programming,” Colloquium on

Computer-Aided Design and Manufacturing, American Society of Naval Engineers, Philadelphia, PA, April 1988.

12. “Computer-aided modeling of polymer processing: a review,” SPI/SPE Plastic Show & Conference, Philadelphia, PA, September 1989.

13. “Computer-aided forming for connector parts,” ASM Materials Congress, Indianapolis, IN, October 1989.

14. “Thermomechanical behavior of adiabatic shear band in high speed forming and machining,” XXII ICHMT International Symposium on Manufacturing and Materials Processing, Dubrovnik, Yugoslavia, August 1990.

15. “Numerical and experimental study of thermal behavior of coining and upsetting processes,” XXII ICHMT International Symposium on Manufacturing and Materials

27

Processing, Dubrovnik, Yugoslavia, August 1990. 16. “Heat transfer behavior of aluminum forging process including measurement and analysis,”

Symposium on Mechanics and Physics of Interfaces During Materials Processing: Heat Transfer in Manufacturing, 1990 ASME Winter Annual Meeting, Dallas, TX, November 1990.

17. “Thermal boundary conditions in modeling of metal forming processing,” NSF US/French Workshop on Deformation Processing of Metals, Ithaca, New York, May 1992.

18. “Monitoring polymer crystallization and morphology in injection molding,” Second Annual Research Symposium: NDE for Process Understanding, Sensing, and Control, ASNT 1993 Spring Conference, American Society for Nondestructive Testing, Nashville, TN, April, 1993.

19. “Consolidation of alumina-coated silicon nitride suspensions,” Paper No. SXIII-54-93, 95th Annual Meeting & Exposition, American Ceramic Society, Cincinnati, OH, April 1993.

20. “Application of laser cutting and linking technology for restructuring interconnections in microelectronic devices,” IEE/LEOS 1996 Summer Topical Meetings: Advanced Applications of Lasers in Materials and Processing, Keystone, Colorado, August 7, 1996.

21. “Application of laser microtechnology for cutting and linking of microelectronic circuits,” Micromachining Workshop III, American Vacuum Society, Anaheim, CA, September 26, 1996.

22. “Invar sheets and their springback characteristics,” The Invar Effect: A Centennial Symposium, TMS/ASM Materials Week ‘96, Cincinnati, Ohio, October 9, 1996.

23. “Fast freeform fabrication of metal parts using planar layer deposition technique,” Third Pacific Rim International Conference on Advanced Materials and Processing, Honolulu, HI, July 14 1998.

24. “Rapid prototyping using variable diameter jets,” Symposium V: Solid Freeform and Additive Fabrication, MRS 1998 Fall Meeting, Boston, MA, November 30, 1998.

25. “Signal delay in droplet deposition,” 16th Arizona Fluid Mechanics Conference, Tempe, AZ, February 25, 2000.

26. “Deformation behavior of steels in mushy state,” EUROMECH Colloquium 408: Interactive Dynamics of Convection and Solidification, Chamonix, France, March 2000.

27. “A feasibility study of adjustable filament deposition technique in freeform fabrication,” EUROMECH Colloquium 408: Interactive Dynamics of Convection and Solidification, Chamonix, France, March 2000.

28. “Maskless submicron fabrication techniques: any future?” NSF 2000 Workshop on Manufacturing of Micro-Electro-Mechanical Systems, Orlando, Florida, November 7, 2000.

29. “Laser-Based Internal Profile Measurement System,” Technical Conference of SPIE Opto Southwest, Tucson, Arizona, September 17-18, 2001.

30. “Rapid design, fabrication, and testing of high-price micro- and nano-system products,” Cooperation and Exchange Convention of Overseas Chinese Enterprises in Science and Technology, Hangzhou, China, June 2, 2002.

31. “Manufacturing technology in 21st century,” Taiwan Vision Organization Summer Conference, Scottsdale, AZ, August 15, 2003.

32. "Micro and nanoscale fabrication," Invited Speaker, Workshop on Nano and Micro Manufacturing Technology, sponsored and funded by ROC National Science Council and Chung Yuan Christian University, Taiwan, March 24-28, 2003.

33. "Recent development in nanoscale manufacturing," Invited Speaker, Shenzhen IC Symposium, 2003 China Hi-Tech Fair in Shenzhen, sponsored and funded by Shenzhen

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Municipal Government, China National IC Design (Shenzhen) Industrial Base, and Chinese American Semiconductor Professional Society, Shenzhen, China, October 13-14, 2003.

34. "Recent development in nanoscale manufacturing," Invited Speaker, Shenzhen IC Symposium, 2003 China Hi-Tech Fair in Shenzhen, sponsored and funded by Shenzhen Municipal Government, China National IC Design (Shenzhen) Industrial Base, and Chinese American Semiconductor Professional Society, Shenzhen, China, October 13-14, 2003.

35. “Modeling and Fabrication of Nanostructures Using SPM Induced Oxidation with applications in Optoelectronics,” in Nano and Giga Challenges in Electronics and Photonics, Phoenix, Arizona, March 12-16, 2007 (with Te-Hua Fan and Andrea Notargiacomo).

36. “Manufacturing Microelectromechanical Systems (MEMS)” 2007 Changsha International Conference on Microelectronics Industrial Development, Changsha, China, July 1-3, 2007.

37. “Development of Tip-Based Nanofabrication,” Taiwan-Tohoku Joint International Symposium for Mechanical Science Based on Nanotechnology, National Taiwan University, Taipei, Taiwan, December 7, 2007 (with J. C. Huang, S. Jou, and Z. Li)

B. Invitations 1. “Fracture evaluations using finite element methods,” Scott Paper, Philadelphia, PA,

February 18, 1977. 2. “Three-dimensional finite element analysis of double torsion test,” Pratt & Whitney Aircraft

Group, West Palm, FL, November 20, 1978. 3. “New nuclear energy: liquid metal breeder reactor,” Dept. of Mechanical Engineering,

National Central University, Chungli, Taiwan, December 15, 1978. 4. “Three-dimensional finite element analysis of double torsion test,” General Motors

Technical Center, Warren, MI, May 14, 1979. 5. “Three-dimensional finite element analysis of fracture testing specimens,” Science

Applications, Palo Alto, CA, October 12, 1979. 6. “Metal forming analysis,” Martin Marietta Laboratories, Baltimore, MD, November 18,

1979. 7. “Heat transfer in rolling of metals,” RCA Laboratories, Princeton, NJ, December 18, 1983. 8. “Heat transfer and elastic/plastic aspects of sheet metal forming processes,” Torrington Co.,

Torrington, CT, Feb. 27, 1986. 9. “Thermal behavior of rolling processes,” Alcoa Laboratories, Alcoa Center, PA, August 4,

1986. 10. “Sheet metal forming of miniature parts,” Villanova Uni., Villanova, PA, October 28, 1986. 11. “CAD/CAM in metal forming,” Temple University, Philadelphia, PA, November 12, 1986. 12. “Computer-aided design for forging dies,” Tjing Ling Industrial Research Institute, National

Taiwan University, Taipei, Taiwan, June 8, 1987. 13. “CAD/CAM in metal forming,” Industrial Technology Research Institute, Taiwan, June 10,

1987. 14. “Numerical simulation of sheet metal forming,” China Steel Corp., Kaohsiung, Taiwan,

June 13, 1987. 15. “Modeling of polymer processes and its applications to injection molding,” Chinese

National Federation of Industries, Taipei, Taiwan, June 18, 1987. 16. “Measurements of local heat transfer coefficients for rolling processes,” Alcoa Laboratories,

Alcoa Center, PA, October 15, 1987. 17. “Spin flow forming for beverage cans,” Ball Metal Container, Broomfield, CO, Sept. 12,

1988. 18. “Computer-aided forming for miniature parts,” Clemson Uni., Clemson, SC, Sept. 16, 1988.

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19. “Computer-aided forming for miniature metal parts,” NGK Metals Corp., Reading, PA, April 20, 1989.

20. “Computer-aided forming for electronic metal parts,” Syracuse University, Syracuse, NY, November 8, 1990.

21. “Cooling of roll and strip in steel rolling,” Villanova Uni., Villanova, PA, February 15, 1991. 22. “Numerical and experimental study of coining and upsetting processes,” National Cheng

Kung Uni., Taiwan, March 18, 1991 (sponsored by National Science Council, Rep. of China).

23. “Cooling of roll and strip in steel rolling,” China Steel Corp., Kaohsiung, Taiwan, March 19, 1991 (sponsored by National Science Council, Executive Yuan of Republic of China).

24. “Adiabatic shear band in high speed forming and machining,” Dept. of Mech. Eng., National Taiwan Uni., Taiwan, March 22, 1991 (sponsored by National Science Council, Rep. of China).

25. “Computer-aided forming for electronic parts,” NGK Ins. Ltd., Nagoya, Japan, March 25, 1991.

26. “Computer-aided forming for metal parts,” Plasticity & Forming Division, Mechanical Engineering Laboratory, Ministry of Int. Trade & Industry, Tsukuba, Japan, March 27, 1991.

27. “Adiabatic shear band in high speed forming and machining,” Department of Mechanical Engineering, University of Delaware, Newark, DE, April 19, 1991.

28. “Cooling of roll and strip in steel rolling,” Rutgers University, Piscataway, NJ, October 16, 1991.

29. “Modeling of steel rolling,” Bethlehem Steel Corp., Bethlehem, PA, October 18, 1991. 30. “Thermal behavior of calendering processing,” Dept. of Mechanical Engineering, Stevens

Institute of Technology, Hoboken, NJ, October 30, 1991. 31. “Intelligent processing of polymers by injection molding,” Boeing Helicopters, Philadelphia,

PA, February 21, 1992. 32. “Macro- and micro-modeling of metal forming,” Naval Air Warfare Center, Warminster, PA,

February 27, 1992. 33. “Transport phenomena in processing of steels,” Uni. of Science and Tech., Beijing, China,

August 18, 1992 (sponsored by Beijing Research Institute of Mech. & Elect. Tech., China). 34. “Modeling and monitoring of polymer processing,” Zhejiang University, Hangzhou,

Zhejiang, China, August 25, 1992 (sponsored by Zhejiang Provincial Scientific and Technical Exchange Center with Foreign Countries, China).

35. “Superplastic forming of beryllium copper sheets,” NGK Insulators Ltd, Nagoya, Japan, September 18, 1992.

36. “A thermomechanical analysis of melt spinning,” Nippon Steel Advanced Materials & Technology Research Laboratories, Kawasaki, Japan, October 2, 1992.

37. “Transport phenomena in melt spinning,” Kawasaki Steel Iron & Steel Research Laboratories, Chiba, Japan, October 13, 1992.

38. “Emerging technologies in steel making,” NKK Materials & Processing Research Center, Kawasaki, Japan, October 16, 1992.

39. “Emerging technologies in materials processing,” Kobe Steel Iron & Steel Research Laboratories, Kakogawa, Japan, December 16, 1992.

40. “My experience in steel making,” Nippon Steel Technical Development Bureau, Futtsu, Chiba, Japan, December 21, 1992.

41. “Emerging technologies in materials processing,” Industrial Technology Research Institute, Hsinchu, Taiwan, January 7, 1993.

42. “Transport phenomena in materials processing,” Dept. of Power Mechanical Engineering,

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National Tsing Hua University, Hsinchu, Taiwan, February 17, 1993. 43. “Emerging technologies in materials processing,” Dept. of Mechanical Engineering,

National Cheng Kung University, Tainan, Taiwan, April 13, 1993. 44. “Transport phenomena in steels processing,” Department of Power Mechanical Engineering,

Dr. Sun Yat-Sen University, Kaohsiung, Taiwan, April 15, 1993. 45. “Processing and forming of copper materials,” Jiangxi Copper Corp., Guixi, Jiangxi, China,

May 10, 1993. 46. “Thermo-fluid behavior in rapid solidification by single- and twin-roll casting,” Dept. of

Mechanical Engineering, National Central University, Chungli, Taiwan, May 17, 1993. 47. “Thermo-mechanical behavior in rapid solidification by single- and twin-roll casting,” Dept.

of Materials Science and Engineering, Uni. of Pennsylvania, Philadelphia, PA, February 25, 1994.

48. “Intelligent processing of advanced materials by melt spinning,” Office of Advanced Industrial Concepts, US Department of Energy, Washington, D.C., March 23, 1994.

49. “Thermo-mechanical behavior in rapid solidification by roll casting,” Dept. of Engineering Science and Mechanics, Pennsylvania State Uni., University Park, PA, March 30, 1994.

50. “Review of single and twin roll casting of steels,” Armco Research & Technology, Armco Steels, Middletown, Ohio, June 2, 1994.

51. “Microstructure modeling of hot rolling of steels,” Metals and Ceramics Division, US Air Force Wright Laboratory, Wright-Patterson AFB, Ohio, June 3, 1994.

52. “Application of heat transfer in material processing,” Technical University of Brno, Brno, Czech Rep., November 8, 1994.

53. “Thermo-mechanical behavior in rapid solidification by roll casting,” Dept. of Mechanical Engineering, North Carolina State University, Raleigh, NC, March 30, 1995.

54. “A view of manufacturing in next generation” Dept. of Mechanical and Aerospace Engineering, Arizona State University, Tempe, AZ, April 13, 1995.

55. “Thermomechanical behavior of thin strip in twin-roll casting,” China Steel Corp., Kaohsiung, Taiwan, June 14, 1995.

56. “Quantitative concurrent engineering: an inverse approach,” Hughes Missile Systems Co., Tucson, AZ, September 6, 1996.

57. “Quantitative concurrent engineering: an inverse approach,” McDonnell Douglas Helicopter Systems, Mesa, AZ, September 23, 1996.

58. “Calendering of non-uniform polyethylene-based sheets for battery separator applications,” Daramic Inc., Owensboro, KY, March 3, 1997.

59. “TeleManufacturing of engineering components using rapid prototyping technique,” Honeywell Space Systems Group, Glendale, AZ, April 16, 1997.

60. “High speed freeform fabrication of metal structures using uniform deposition system,” Ford Research Laboratory, Dearborn, MI, June 20, 1997.

61. “Thermomechanical modeling of twin-roll casting,” Fata Hunter Inc., Riverside, CA, August 21, 1997.

62. “High speed machining and forming,” Boeing Commercial Airplane Group Co., Seattle, WA, February 24, 1998.

63. “Rapid prototyping of aluminum parts using planar deposition system,” Boeing Commercial Airplane Group Co., Seattle, WA, February 24, 1998.

64. “High speed freeform fabrication of metal components using planar deposition system,” Raytheon Systems, Tucson, AZ, February 27, 1998.

65. “Education and research initiatives of asu manufacturing institute,” Raytheon Systems, Tucson, AZ, May 13, 1998.

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66. “Materials handling and virtual manufacturing in 300-mm wafer development,” Intel Portland Technology Development Center, Hillsboro, OR, July 7, 1998

67. “Rapid prototyping of mesoscopic electronics using direct-write technology,” Honeywell Technology Center, Phoenix, AZ, July 10, 1998.

68. “Planar layer deposition technique for freeform fabrication,” Theoretical and Applied Mechanics Colloquium, Cornell University, Ithaca, NY, September 23, 1998.

69. “Freeform fabrication research at ASU,” Advanced Manufacturing Technology Center, Sandia National Laboratories, Albuquerque, NM, December 17, 1998.

70. “Advanced deposition techniques for freeforming metal and ceramic parts,” Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, April 29, 1999.

71. “ASU manufacturing institute and its research focuses,” Mechatronic Engineering Institute, Nanjing University of Aeronautics and Aeronautics, Nanjing, China, May 13, 1999.

72. “Rapid prototyping of microdevices and related research at ASU,” Los Alamos National Laboratories, Los Alamos, NM, August 18, 1999.

73. “Advanced deposition techniques for freeforming metal and ceramic parts,” NCMS Fall Workshop Series, Dearborn, MI, September 27, 1999.

74. “Advanced deposition techniques for freeforming metal and ceramic parts,” NASA George C. Marshal Space Flight Ctr., AL, November 16, 1999.

75. “Deposition techniques for manufacturing of electronic components,” Electronic Division, NASA George C. Marshal Space Flight Ctr., AL, November 16, 1999.

76. “Manufacturing institute and its research focus,” College of Engineering, Temple University, Philadelphia, PA, March 17, 2000.

77. “Advanced deposition techniques for freeforming metal and ceramic parts,” School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China, April 25, 2000.

78. “Advanced deposition techniques for rapid prototyping metal parts,” Institute of Mechanical-Electronic Engineering, Tsinghua University, Beijing, China, April 27, 2000.

79. “MEMS manufacturing,” NSC Northern Region MEMS Research Center, National Taiwan University, Taipei, Taiwan, May 16, 2001.

80. “MEMS manufacturing,” Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan, May 24, 2001.

81. “MEMS manufacturing,” Materials and Electro-Optics Research Division, Chung Shan Institute of Science & Technology, Lungtan, Taoyuan, Taiwan, June 27, 2001.

82. “MEMS manufacturing,” Department of Mechanical Engineering, Chung Cheng Institute of Technology, Tahsi, Taoyuan, Taiwan, June 28, 2001.

83. “Manufacturing of MEMS,” Department of Mechanical Engineering, University of Utah, Salt Lake City, Utah, September 20, 2001.

84. “My research and my career,” Department of Mechanical Engineering, National Taipei University of Technology, Taipei, Taiwan, October 23, 2001.

85. “Manufacturing of MEMS,” Department of Precision Instrument & Mechalonogy, Tsinghua University, Beijing, China, May 20, 2002.

86. “MEMS and nanofabrication,” Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Shanghai, China, May 27, 2002.

87. “Manufacturing of MEMS,” Department of Mechanical Engineering, National Chiao Tung University, Hsinchu, Taiwan, July 19, 2002.

88. “Nano-manufacturing technology and its applications,” presented in 2001 精密製造與自動控制技術國際研討會, Southern Taiwan University of Technology, Tainan, Taiwan, December 16,

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2002. 89. “Recent development in nano scale manufacturing,” National Taipei University of

Technology, Taipei, Taiwan, December 17, 2002. 90. “Deposition techniques in rapid prototyping,” National Taipei University of Technology,

Taipei, Taiwan, December 18, 2002. 91. “Recent development in nanoscale manufacturing,” Department of Mechanical and

Aerospace Engineering, University of Missouri, Columbia, MO, February 6, 2003. 92. “Recent development in nanoscale manufacturing,” Institute of Microelectronics, Peking

University, Beijing, China, February 12, 2003. 93. “The world of nano and micro manufacturing,” Department of Precision Instruments &

Mechalonogy, Tsinghua University, Beijing, China, February 13, 2003. 94. “Recent development in nano scale manufacturing,” Department of Microelectronics,

Tsinghua University, Beijing, China, February 18, 2003. 95. “Recent development in nano scale manufacturing,” Hua Chung University of Science and

Technology, Wuhan, China, February 24, 2003. 96. “Rapid Prototyping in USA,” Talian University of Science and Technology, Talian, China,

March, 2, 2003. 97. “Recent development in nanoscale manufacturing,” Talian University of Science and

Technology, Talian, China, March 3, 2003. 98. "Nano and micro manufacturing technology," Chung Yuan Christian University, Taiwan,

March 24-28, 2003. 99. “Nano and micro-scale fabrication,” Institute of Microelectronics, Peking University,

Beijing, China, April 2, 2003. 100. “Recent development in nano- and micro-manufacturing,” Micro and Nano Technology

Center, Hebei Semiconductor Research Institute, Shijiazhuang, China, April 3, 2003. 101. "Nano and micro manufacturing technology," in Shenzhen IC Symposium, Shenzhen,

China, October 13-14, 2003. 102. “Recent development in nano- and micro-scale fabrication,” Department of Precision

Machinery and Instrumentation, University of Science and Technology of China, Hefei, China, October 16, 2003.

103. "Silicon technology and future trend," in 2004 International Integrated Circuit Industrial Development Symposium in Chengdu, Chengdu, China, June 4-5, 2004.

104. “Micro/nano channels fabrication and bonding using transmission laser technique,” Department of Precision Instruments & Mechalonogy, Tsinghua University, Beijing, China, May 29, 2006.

105. “Nanofabrication issues in making nanoscale inspection systems,” School of Materials Science and Engineering, Tsinghua University, Beijing, China, May 29, 2006.

106. “Imprint lithography,” in Workshop on Nanofabrication: Fundamentals and Applications, National Cheng Kung University, Tainan, Taiwan, October 17, 2006.

107. “Micro- and nano-fabrication using excimer lasers,” in Workshop on Nanofabrication: Fundamentals and Applications, National Cheng Kung University, Tainan, Taiwan, October 18, 2006.

108. “Focused ion beam direct writing,” in Workshop on Nanofabrication: Fundamentals and Applications, National Tsing Hua University, Hsinchu, Taiwan, October 19, 2006.

109. “Recent developments in next generation lithography,” in Workshop on Nanofabrication: Fundamentals and Applications, National Taiwan University, Taipei, Taiwan, October 20, 2006.

110. “Wafer bonding for microsystems using transmission laser bonding technique,”

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Manufacturing Seminars Series, University of Michigan, Ann Arbor, MI, November 9, 2006.

111. “Nanoscale fabrication,” Haythornthwaite Distinguished Lecture Series, Temple University, Philadelphia, PA, April 9, 2007.

112. “Recent development in nanofabrication,” College of Science Research, Jiangsu University, Zhenjing, China, June 11, 2007.

113. “Recent development in nanofabrication,” College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China, June 12, 2007.

114. “Recent development in nanofabrication,” Department of Precision Machinery and Instrumentation, University of Science and Technology of China, Hefei, China, June 15, 2007.

115. “Micro- and nano-fabrication using lasers,” Department of Mechanical Engineering, National Taipei University of Technology, Taipei, Taiwan, November 22, 2007.

116. “Development of tip-based nanofabrication and its roadmap,” National Taiwan University of Science and Technology, Taipei, Taiwan, November 23, 2007.

117. “Recent development in micro nano-fabrication using lasers,” National Taiwan University of Science and Technology, Taipei, Taiwan, March 12, 2008.

118. “Applications of tip-based nanofabrication,” National Taiwan University of Science and Technology, Taipei, Taiwan, June 24, 2008.

119. “Nanofabrication using atomic force microscopy,” Department of Precision Instruments & Mechalonogy, Tsinghua University, Beijing, China, June 1, 2009.

120. “Micro- and nano-fabrication for making various devices,” Department of Opto-electronics Engineering, Behang University, Beijing, China, June 3, 2009.

121. “Nanofabrication using atomic force microscopy,” National Center for Nanoscience and Nanotechnology, Chinese Academy of Sciences, Beijing, China, June 4, 2009.

122. “Nanofabrication using atomic force microscopy,” Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun, China, June 9, 2009

123. “Micro- and nano-fabrication for making various devices,” College of Electronic Science and Engineering, Jilin University, Changchun, China, June 10, 2009.