cost savings and energy efficiency improvements using best ... andreas neuber_neeconf.pdf · cost...
TRANSCRIPT
External use
Cost Savings and Energy Efficiency Improvements Using Best Practices in Semiconductor Fabs
Singapore EENP Conference 2011 Andreas Neuber
Applied Materials
External use
2
Agenda Eco efficiency engineering
Goals and challenges
Solutions
– Synchronization subfab / equipment operation – Exhaust recycling – High temperature process cooling water – Resource reduction
Summary
External use
3
Energy use in a fab
APPLIED GLOBAL SERVICES
Power
Equipment
Subfab
Process utilities UPW, CDA, N2, PCW, Exhaust
Infrastructure chiller, boiler, cooling tower, air handling
Cleanroom
Natural gas
Power
Natural gas
Utilities Process utilities
15…20%
25…30%
10…40%
20…25%
Note: The data are calculated based on estimates. The wide range is caused by the impact of the climatic conditions on the overall energy balance
External use
4
Direct power consumption Indirect power consumptionPower Litho
Thin Film
Diffusion
Implant
Epi
Etch
Clean
Metrology
CMPCleanroom
CDA N2 UPW Exhaust PCW Others Process facilities
Recirc air Lighting Boiler
Make-up air Chiller Infrastructure
Cooling tower
External use
5
Equivalent energy consumption of semicondcutor manufacturing based on SEMI S23 – Example
Power 52%
Exhaust 14%
Heat 7%
CDA 5% N2
6%
Hot UPW 4%
PCW 6%
UPW 6%
Note: The values are typical values calculated based on estimates as an average over all tool types (actual values may vary).
Equipment power and relevant utility consumption
Note: Does not include chemical and gas consumption and energy consumption of infrastructure, such as cleanroom
External use
6
ITRS Goals 2010
2009 2010-2012 2013-2015 2016-2024Power Eq/cm2 Si kWh/cm2 Si 0.5 0.43 0.36 0.30...0.25
Power Total site/cm2 Si kWh/cm2 Si 1 0.85 0.7 0.6...0.5
Reduction 25%/5 yr 2009 2012 2015 20200.5 0.43 0.36 0.27
1 0.85 0.72 0.54
Source: ITRS, 2010
Average YoY reduction path (new fab construction) ITRS 5%
Note: ITRS represents organizations, such as SIA, ESIA, KSIA, TSIA, JEITA
External use
7 7
Eco Efficiency Engineering Toolbox
1. Improve primary process
2a. Improve critical cleans
2b. Improve non-critical cleans
3. Reduce idle flows 4. Use resources with lower environmental footprint
5. Recycle, Reclaim, Reuse
6. Increase usefull lifetime
7. Renewable energy and materials
8. Optimize process / facility interface
External use
8
Power consumption reduction opportunities – Examples
General utilities External supply Facility systems - Supply Subfab - Supply Manufacturing
equipment Subfab - Disposal Facility systems - Disposal External disposal
Cleanroom RF Generator Man. Equipment Vacuum pumps Exhaust Ambient airMake-up air Remote plasma Abatement Acid
Recirc air CausticSolvent
Facility chiller Heat (General)(Boiler)
Local chiller Heat Ambient airCogen/Trigen Electrival cabinet Cooling tower
Power HV transformerWater Sewer
Raw water UPW plant UPW heater Neutralization DirectHF treatment Indirect
Air separation CMP treatmentCDA generation Cu treatment
Bulk gases Gas farm Gas blending Special systemsSpecialty gases Gas distribution
Precursors (Central distribution) Distribution Solid waste Waste disposal
Collection DepositionProcess chems Chem distribution Chem blending Incineration
Liquid waste ReuseCollection
Support utilities:House N2Compressed airPowerCity waterProcess cooling waterExhaust
Exhaust recycling and reduction
High temperature PCW
Smart idle mode
Resource consumption reduction
Energy efficient subfab components
Heat recovery hot UPW
1 2
3 4
External use
9
SEMI E37 Generation Tool Platforms Enable Energy Saving
ABATEMENT
PROCESS TOOL MAINFRAMES
CHILLERRF
Energy Saving InterfacePhase 1:Determine state of Process Tool.Control energy state for abatement and pumps.Monitor and Trend SubFab data.
Phase 2:Totalize total Gas flow and CO2 equivalent emission.Provide link to other Host services (MAS, FAS etc.) and ExpertConnect.Utilize E3 services (Predictive maintenance, Fault Detection and Classification).
VACUUM PUMPS
ETHERNET HSMS
RS232 / TCP_IP REQUEST AND
ACKNOWLEDGE
FACTORY MANAGEMENT
External use
10
Disconnected Subfab Equipment Wastes Energy
PROCESS CHAMBER
ABATEMENT ENERGY
Deposition (SiH4)
Clean (NF3)
VACUUM PUMP ENERGY
Subfab equipment operation stays constant no matter what the process chamber is doing
Deposition (SiH4)
Clean (NF3)
External use
11
PROCESS CHAMBER
Deposition (SiH4)
Clean (NF3)
Deposition (SiH4)
Clean (NF3)
Subfab equipment operation synchronized with process to save energy
Synchronizing subfab Matches Energy Need to Operation
Energy Savings
Energy Savings
ABATEMENT ENERGY
VACUUM PUMP ENERGY
External use
12
Solution: Exhaust recycling - Implant exhaust
Implanter
Toxic exhaust
Heat exhaust
Acid exhaust
Exhaust recycling
Implanter
Toxic exhaust
Heat exhaust
Switchover and/or abate potential contaminants
External use
13
Solution: High temperature PCW
CT
Fab
Eq
ualiz
er
tank
F PCW Supply 17 °C
PCW Return: 23°C
Refrigeration chiller
CHW Supply 12 °C
CHW Return 18°C
CT Refrigeration chiller
Dehumidification MAHU
CHW Supply 4°C
CHW Return 11 °C
Site Raw water tank Pre-treatment
UPW make-up
Heat Recovery *1
UPW Polishing
Cooling *1
Heating
Cooling *1
Other users Central Scrubber, etc.
Note: The drinking water system is a separate system
Air washer
5...35°C
40°C
5...35°C
40°C
80...90%
MAHU condensate
RAHU or sensible cooling coils
Note: Closed loop PCW
Air
General (heat) exhaust
*1 Also possible in CHW system, depending on location
Process service water
UF concentrate recycling
Cold and Hot UPW
Hot water
Eq
ualiz
er
tank
F
CT 5...35°C
40°C
PCW Supply 35 °C
PCW Return: 41°C Add separate
loop
External use
14
High temp PCW saving potential: Calculated by JEITA
0
10
20
30
40
50
60
70
80
90
100
Case 1 Case 20
10
20
30
40
50
60
70
80
90
100
Case 1 Case 2
Tons
-CO
2/yea
r
Tons
CO
2 / Y
ear
Source: JEITA, 2007
• We could reduce 20% of CO2 emission from facility • In fab this is 9% reduction of energy consumption
Utility standard could get big benefit
Case 1 Current Case 2 This Case
Cooling water inlet temperature 20°C Chiller cooling 32°C Free cooling
Cooling water difference between in and out T=3K T=5K
100%
80%
-20% -9%
43%
34%
57%
57%
Facilities
Equipment
Facilities
Source: JEITA, Semicon Japan 2007
External use
15
Solution: Reduction of resource consumption
Compare chambers that perform well for resource usage differences
Check for wasteful cleaning and idle set points
Source: Semiconductor International, Dec 2008
External use
16
300 mmPower in kW 2011 2012 2013 2014 2015
Delta in kW
Energy saving measure 2011 2012 2013 2014 2015
Proc. Equipment 47.2% 11,213 10,692 10,396 9,630 8,965 8,965 2,248 Proc. EquipmentDry Pumps 19.1% 4,535 4,308 4,172 3,855 3,628 3,628 907 Dry Pumps Idle mode 25% 40% 75% 100% 100% % of pumps with idle mode
Turbo pumps 4.3% 1,019 1,009 999 978 958 958 61 Turbo pumps 5% 10% 20% 30% 30% Efficiency improvement
Heaters 5.9% 1,391 1,321 1,252 1,113 974 974 417 HeatersEfficiency, idle mode 5% 10% 20% 30% 30% Efficiency improvement
Misc. 5.4% 1,284 1,220 1,156 1,027 899 899 385 Misc. Efficiency 5% 10% 20% 30% 30% Efficiency improvementNon-Process Pumps 4.1% 963 867 867 770 674 674 289 Non-Process Pumps Efficiency 10% 10% 20% 30% 30% Efficiency improvement
RF Generators 2.7% 642 629 629 616 603 603 39 RF Generators Eff improvement 10% 10% 20% 30% 30% Efficiency improvementUPS Control 1.8% 428 419 419 411 402 402 26 UPS Control Eff improvement 10% 10% 20% 30% 30% Efficiency improvement
Remote Plasma Clean 1.4% 321 315 315 308 302 302 19 Remote Plasma Clean Idle mode 10% 10% 20% 30% 30% Efficiency improvementMini Environments 0.5% 107 107 107 107 107 107 0 Mini Environments
Others (Local abatement) 2.2% 523 497 481 445 418 418 105 Others (Local abatement) Idle mode 25% 40% 75% 100% 100% % of abatement with idle mode
Chilled Water 20.0% 4,756 3,490 3,129 2,442 1,820 1,820 2,936 Chilled WaterProcess equipment 13.5% 3,210 1,926 1,605 963 321 321 2,889 Process equipment HTPCW 40% 50% 70% 90% 90%
Others 6.5% 1,546 1,546 1,546 1,546 1,546 1,546 0 Others
Process Exhaust 2.3% 547 520 492 438 383 383 164 Process Exhaust Exhaust recycling Central + local abatement
Scrubbed & general exhaust 1.9% 452 429 407 361 316 316 136 Scrubbed & general exhaust Eco efficiency 10% 20% 30% 40% 40%Exhaust reduction (e.g. by recycling)
VOC abatement 0.4% 95 90 86 76 67 67 29 VOC abatement Eco efficiency 5% 10% 20% 30% 30%
Recirculating Air Handing 4.0% 951 904 904 856 808 808 143 Recirculating Air HandingReduce filer coverage 5% 5% 10% 15% 15%
Lighting 2.2% 523 497 471 445 445 445 78 Lighting Efficiency 5% 10% 15% 15% 15% High efficiency lampsMake Up Air 3.0% 713 713 713 713 713 713 0 Make Up Air See exhaustSteam/Hot Water 0.3% 71 71 71 71 71 71 0 Steam/Hot WaterProcess Cooling Water 2.9% 690 690 690 690 690 690 0 Process Cooling Water See HT PCWDI/UPW 3.1% 737 708 693 663 627 590 147 DI/UPW Eco efficiency 4% 6% 10% 15% 20% Consumption reductionUPW Hot 0.5% 119 114 112 107 101 95 24 UPW Hot Eco efficiency 4% 6% 10% 15% 20% Consumption reductionCompressed Air 4.2% 999 959 939 899 849 799 200 Compressed Air Eco efficiency 4% 6% 10% 15% 20% Consumption reductionBulk Gases 7.9% 1,878 1,803 1,766 1,691 1,597 1,503 376 Bulk Gases Eco efficiency 4% 6% 10% 15% 20% Consumption reductionProcess Vacuum 0.4% 95 91 89 88 88 86 10 Process Vacuum Eco efficiency 4% 6% 8% 8% 10% Consumption reductionIndustrial Waste Collection & Treatment 1.6% 380 365 358 342 323 304 76
Industrial Waste Collection & Treatment Eco efficiency 4% 6% 10% 15% 20% Consumption reduction
Chemical Dispense 0.0% 0 0 0 0 0 0 0 Chemical Dispense Eco efficiency 4% 6% 10% 15% 20% Consumption reductionAutomated Material Handling System AMHS 0.4% 95 91 89 86 81 76 19
Automated Material Handling System AMHS Eco efficiency 4% 6% 10% 15% 20% Consumption reduction
Total 100.0% 23,768 21,708 20,912 19,160 17,560 17,348 6,420Reduction 100% 91.3% 88.0% 80.6% 73.9% 73.0%
1.8 2.5 4.0 5.4 5.6Power cost reduction in Mio US$
Energy Reduction Roadmap – 300 mm (Example)
Note: Does not include EUV Potential savings of 25% in 5 years
Note: The data are calculated based on estimates.
External use
17
Summary Energy saving targets as defined in ITRS roadmap are feasible but require
systems integration to maximize energy savings at the lowest technical risk and identified liability.
Subfab and the process / facility interface represent the largest energy consumption per wafer pass reduction opportunities without compromising environmental, health and safety (EHS) standards and have no impact on production.
Integration and synchronization of discrete subfab components and integration with process tool interfaces demonstrated substantial energy and carbon footprint reduction.
Chamber monitoring benefits in quantifying energy, gas and chemical reduction achievements, allowing dynamic energy & resource management and real-time energy as well as GHG (Green House Gas) accounting.