cooling electronics using an air flow thru design cfd
TRANSCRIPT
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CFD Cooling Study
D. Blanchet3B Associates05/04/07
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Use a module that we know something aboutCooling design scenario “what-if” Air Flow thru core design – prompted by a recent customer inquiry
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6U FPGA design 105 watts total 25 W, FPGA’s , 2 nodes 12CFM @ 40C – 10K ft , commercial
Change the design to keep (dirty) cooling air from touching the components
Possible scenario for platforms that would normally have conduction cooled modules?
Assume standard VME , 0.8 “ pitch
Model a sealed air core sink
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FPGA
XBAR
QDRSRAM(back)
RLDRAM(front)
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6U - VME , 0.8” pitch
0.25” finned core(aluminum)
12 CFM
pwb
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FPGA
XBAR
QDRSRAM(back)
RLDRAM(front)
314,000 cells
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FPGA
XBAR
QDRSRAM(back)
RLDRAM(front)
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SequentialSolution
FlowThen
Heat transfer
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Device Power(w) Tjmax Tj simulated
FPGA 25 85 (comm)100 (ind)
88
QDRSRAM(backside)
1.5 125 136
RLDRAM 1.8 110 86
XBAR 1 125 76
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Air flow thru design provides adequate cooling for primary side industrial components – similar to the standard air cooled design at low air flow rates (12 CFM ).
Back side components exceed recommended operating temperatures – the heat conduction path through the pwb is inadequate with the current board design restrictions
Module to chassis air sealing interfaces become a design challenge
Matching of component heights to air core cold plate without requiring excessive thickness of TIM materials….?