Reducing Time-to-Market with i.MX6-based Qseven Modules

congatec Facts

■ The preferred global vendor for innovative embedded solutions to enable competitive advantages for our customers. ■ Founded December - 2004 ■ Revenue $73M (2013) ■ Employees 159 ■ Headquarter Deggendorf, Germany ■ Subsidiaries San Diego (USA), Taipei (TW), Plzen,

Brno (CZ), Tokyo (JP), West Burleigh (AU) ■ Sales Offices London, Paris, Stockholm, Tel Aviv ■ Sales Partners Worldwide Network ■ Products Computer-On-Modules

COM Express, Qseven, ETX, XTX

■ #2 in the worldwide COM market *

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* Source: IMSresearch The World Market for Embedded Computer Boards and Modules - 2012 Edition

Computer-On-Module Concept

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Module Concept

■ Concept ■ CPU module with standard

computing core functions ■ Carrier board with customer

specific functions and size

■ Benefits ■ Reduced development costs ■ Faster time to market ■ Fast reaction to market trends ■ Scalable product range ■ Investment security via technology upgrade ■ Engineering resources can be focused on system functions ■ Second source philosophy

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Module Advantages

■ Create your own product family

■ Example ■ 3 Panel versions

■ 2 housing variants

■ 3 COMs

■ 1 Carrier board

■ 18 catalog variants

2x Box

3x CPU Modules 1x Carrier Board!

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3x Panel

Module Concept

■ Volumes ■ Suitable for highly specialized designs in low volume (1 piece) ■ Highly cost efficient from 1k .. 100k units project size

Standard

Board

Full custom

design

-Time to market

-Scalability

-Longevity

-Customization

Volume

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Computer-On-Module

Project Size for Customized Solutions

SBC

$

pcs

Full Custom COM

~100k ~1k Lowest Cost for COMs

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Make versus Buy

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Challenges Full Custom Module Based

Time to market Longest design cycle Flexible for upgrades by changing modules

Lowering design cost Keeping up with full & complex processor technology evolution driving higher cost

of resources

Outsourcing of the complex processor part Less design and investment risk

IP ownership Most of the IP is not necessarily valued by customers

Limit the customer investment to better concentrate on their own IP

(software and system)

Long life cycles Customer responsibility for the complete design

Customer can rely on module vendor Quick module upgrade to extend life cycles

Unit Cost Lowest for project size >100k units

Low cost due to multiple customers per module

Qseven Evolution

■ Qseven consortium founded in Feb. 2008 ■ First specification released in July 2008 ■ Fastest market introduction ■ 60 member companies

■ Open Standard ■ Qseven Specification 2.0 ■ Qseven supports x86 & ARM

■ Moved to SGeT in 2012 ■ Standardization Group for Embedded Technology ■ congatec is Founding Member and the

editor of the Qseven Specification and Design Guide

■ www.sget.org

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■ Optimized Connector ■ MXM edge connector (230-pin) ■ Low cost and high speed

■ Latest Technology ■ Low power processors ■ x86 and ARM

■ Modern Set of Interfaces ■ PCI Express, SATA, USB 3.0,

GB Ethernet, SDIO, LVDS, HDMI/DisplayPort, …

■ Further Benefits ■ Onboard RAM and Flash for rugged applications ■ 5V Power for easy battery operation ■ Small Size: 70x70 mm or 70x40 mm ■ Thermal cooling interface ■ Full market acceptance

Qseven Key Points

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Qseven Mechanics

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Qseven µQseven

70

70

Cooling Area

70

40

ARM Technology for Qseven

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ARM Evolution

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Micro Controller

Motor Control

Sensor Application

Small Handheld

Camera Application

Consumer Control Application

Digital Signage

Tablet Computers

HMI Computers

Infotainment

Vending

Home Automation

Industrial Automation

ARM Cortex

M0 / M3 / M4

General Embedded

Processors

ARM Cortex

A8 / A9 / A15

Application

Processors

Gaming & high-end Graphics

Multi Core

High-End Graphics

Rich Standard Feature Set

Scalability

Low Performance

Low Price

Proprietary Feature set

Limited Scalability

Standardization with ARM

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COM Standards

Qseven, COM Express

ULPCOM, Future SGET Standards

ARM Feature Set for Application Processors

Multicore High-Performance, High-End 3D Graphics, Encoding / Decoding,

PCI Express, GB Ethernet, HDMI / LVDS /DisplayPort,

DDR3 Memory, SATA, USB

ARM Vendor

Freescale

Computer-On-Module

Not covered

ARM Product Positioning

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Price

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X86 Architecture Intel® Core™ i7 AMD® R-Series

Intel® Atom™ AMD® G-Series

ARM Architecture

Freescale® i.MX6

congatec Qseven with ARM

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Product Introduction conga-QMX6

■ congatec extends it's Qseven product range

■ conga-QMX6 based on Freescale i.MX6

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x86 Intel® Atom™ Z500

ARM Freescale® i.MX6

x86 Intel® Atom™ E600

x86 AMD® Fusion

Why Freescale?

■ Full scalability of ARM performance ■ Highest Cortex A9 Single Core to Quad Core processors performance ■ High-end 3D Graphics with H.264 support ■ Rich I/O interface set ■ Lowest power consumption ■ Industrial grade temperature range

■ Strong ecosystem ■ Outstanding design-in support from Freescale ■ Software integration partners

■ Experienced and strong software partners (e.g. Adeneo Embedded)

■ Software support for Linux®, Windows® Compact 7, ...

■ Longevity ■ Product life time up to 10 years

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■ Freescale i.MX6 Processor Complex ■ Single Core up to Quad Core ARM® Cortex™ A9 ■ 800 MHz industrial / 1.0 GHz commercial per core ■ up to 1 MB L2 cache

■ Processor Variants ■ Extended Consumer up to 1.0 GHz ■ Industrial up to 800 MHz

■ Memory ■ LV-DDR3 up to 2 GByte ■ eMMC 4.4 up to 4 GByte, 40-bit ECC

■ Connectivity ■ 5x USB2.0 Host ■ 1x USB2.0 OTG ■ Gigabit Ethernet + IEEE®1588 ■ 1x CAN Bus ■ Expansion Ports

■ 1x microSD Socket on module, 1x SDIO ■ 1x SPI, 2x UART, 2x I²C ■ 1x SATA 2.0 ■ 1 Lane PCIe 2.0

■ Multimedia ■ GPU 3D Vivante GC2000

■ 200Mtri/s 1000Mpxl/s, OpenGL 2.0

■ GPU 2D Vector Graphics, Vivante GC355 ■ 300Mpxl/s, OpenVG 1.1

■ GPU 2D (Composition), Vivante GC320 ■ 600Mpxl/s, BLIT

■ Video Decode 1080p60 H.264 ■ Video Encode 1080p30 H.264 ■ Camera Interface MIPI-CSI2

■ Display ■ Dual Channel 24 Bit LVDS ■ HDMI 1.4 ■ 2 x QXGA or 2 x 1080p

■ Security ■ Advanced security supporting High Assurance Boot ■ Cryptographic cipher engines ■ Random number generator ■ Tamper detection

■ Others ■ High Precision Real Time Clock

conga-QMX6 Overview

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■ Commercial Module ■ 0 to +60°C ambient operating ■ 5 year operation @ 50% duty cycle ■ Longevity 5 years

■ CPUs ■ Extended Commercial Versions

(-20..105°C ambient operating) ■ i.MX6 Solo 1.0 GHz ■ i.MX6 Dual Lite 1.0 GHz ■ i.MX6 Dual 1.0 GHz ■ i.MX6 Quad 1.0 GHz

■ Standard packaging

■ Memory ■ 4 GByte eMMC/MLC ■ 1 or 2 GByte DDR3L RAM

■ Industrial Module ■ -40 to 85°C ambient operating ■ 10 year operation @ 100% duty cycle ■ Longevity 10 years

■ CPUs ■ Industrial Grade Versions

(-40..125°C ambient operating) ■ i.MX6 Solo 800 MHz ■ i.MX6 Dual Lite 800 MHz ■ i.MX6 Dual 800 MHz ■ i.MX6 Quad 800 MHz

■ Lidded packaging

■ Memory ■ 2 GByte eMMC/iMLC ■ 1 GByte DDR3L RAM

conga-QMX6 Variants

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i.MX6 Processor Variants

i.MX6 Solo Dual Lite Dual Quad

Cores 1 Core 2 Cores 4 Cores

Clock speed 1 GHz commercial 800 MHz industrial

L2 cache 512 KB 1 MB

3D Graphics 1 shader 4 shaders

2D Graphics 1 engine 2 engines

RAM DDR3L 400MHz DDR3L 533MHz

SATA - SATA II

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conga-QMX6 boot option

■ Possible OS boot devices

■ eMMC (on module), supported by default

■ microSD card (on module)

■ SATA device for Dual and Quad Core

■ USB boot

■ MMC/SD/SDIO (off module)

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Block Diagram conga-QMX6

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conga-QMX6 Summary

■ Freescale i.MX6 up to Quad Core 1.0 GHz ■ Commercial and Industrial Versions ■ Up to 2 GByte DDR3 on Module RAM ■ Up to 16 GByte eMMC on Module Flash ■ Interfaces

■ 1x PCI Express Gen. 2 ■ 1x SATA Gen. 2 ■ Gbit Ethernet ■ MicroSD card connector on Module ■ CAN Bus

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Designing with Qseven Modules

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Engineering Tools

■ Quick start with conga-QKIT/ARM ■ For evaluation

and rapid prototyping ■ Content

■ conga-QMX6 quad core Qseven module ■ conga-QEVAL ■ I2S sound card ■ HDMI video converter ■ Power supply ■ Cable kit ■ Ready to go Ubuntu Linux image including BSP

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Debugging Tools

■ JTAG interface for boot loader development

■ Supports JTAG debugger

■ Lauterbach

■ARM Dstream

■ ...

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■ Tablet Demonstrator for tradeshows

■ Based on standard components ■ Qseven Module

■ Mini Carrier Board

■ Smart Battery Manager

■ Smart Battery

■ Multi touch display

Mobile Application Demo

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Qseven Deliverables

■ congatec website has everything you need to get started with your design. ■ Qseven Specification ■ Qseven Carrier Board Design Guide ■ Qseven Carrier Board Reference Schematics ■ Application Notes ■ Tech Videos ■ Dedicated Design-In Support

www.congatec.com/en/products/technologies/qseven.html

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Software Ecosystem conga-QMX6

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conga-QMX6 Software Support

■ Software Support

■ Standard BSPs are supported by congatec

■ Customized BSP implementations are done by our partner Adeneo, embedded source code provided

■Windows Embedded Compact 7.0

■ Linux (Ubuntu)

■Android

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■ Ubuntu LINUX ■ Source code for Linux BSP

available at congatec.com ■ Free for customers ■ Login required

■ BSP for the reference kit conga-QKit/ARM ■ conga-QMX6 ■ conga-QEval

■ Mainline ■ Standard kernel supports

congatec hardware ■ Planned for standard LINUX and

Yocto kernel (Q3/2013)

■ Windows Embedded Compact 7 ■ Binaries available for free at

Adeneo and congatec.com

■ Source code available from Adeneo

■ License fee $5000

■ Additional services can be provided by Adeneo based on a service contract

www.adeneo-embedded.com/Products/Packaged-Services/Technical-Support-Contracts

Software Support

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Partnerships

■ High Level Partnerships

■ Hard- and Software Technology

■ Worldwide

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■ ARM opens new applications for Qseven ■ Lowest power consumption ■ Price sensitive applications ■ Extended environmental

specifications

■ Scalability with Qseven ■ Up to future quad core x86

Qseven designs ■ Open migration path for

upcoming ARM and x86 platforms

Summary

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