CONFIDENTIAL

Pressure Cure Oven (PCO)

CONFIDENTIAL

System Overview

Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications

PCO pressurizes air into a rigid vessel and heats & cools with forced convection¬Heaters, heat exchangers and blowers are internal to

the pressure vessel

When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools

CONFIDENTIAL

Pressure Cure Applications

Underfill Curing

Die Attach Curing

Wafer Lamination

Film & Tape Bonding

PCO

CONFIDENTIAL

Process Specification• Process time: Generally 120 min or

User’s spec

• Operating temp: 60oC ~ 200oC

• Maximum temp: 220oC

• Operating pressure: 1 bar – 10 bar

• Capacity: 24 Magazines (typical)

• Cooling method: PCW (17oC - 23oC)

• Cooling water pressure: 25 – 40 psi

200℃

60℃

0

Temp.

30min 90min 120min Time

10 bar

0

20min 90min 110min Time

Cooling process

Curing process

Rising process

Pressure.

Representative Pressure/Temp Profiles (User Configurable)

CONFIDENTIAL

PCO System Dimensions

1700mm

1700mm2200mm

CONFIDENTIAL

PCO System Chamber

CONFIDENTIAL

Chamber Dimensions

7

440mm

189mm

199.5mm

608mm

716.5mm

CONFIDENTIAL

Chamber with Shelves Extended

CONFIDENTIAL

System Air Flow

9

Door inside cover

Return air assistance damper

Heater module

radiator

Fan motor & mechanical seal

CONFIDENTIAL

Vacuum Module Option

• Vacuum Module (Optional)

Vacuum pump

GaugeVacuum in/out line