HeterogeneousIntegration:ARoadmapforFutureDataGeneration,TransmissionandProcessing

PresentedbyW.R.Bottoms,Chairman3MTS

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TheITRSPublishedItsFinalEditionLastMonth

• ITRSfocusedonsemiconductordeviceswhichhaveenjoyeda50+yearperiodofunprecedentedprogress.CMOSscalingwasthekeyenabler.

• Thedrivingforcehasalwaysbeeneconomicsandtechnologytheenabler.CMOSscalingtechnologycannotenablethefuture.

• Theworldismorecomplextodaybuteconomicsremainsthedriverandtechnologieswillbetheenablers.

ThequestioniswhichTechnologiesandRoadmapscanfindtheanswers

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Densityhasmaintainedtherateofimprovement

• Otherkeyparametershavenotand,insomecases,theyareheadinginwrongdirection

– Cost

– Powerefficiency

– Performance

Moore’sLawScalingcannotmaintainthepaceofProgressfortheElectronicsIndustry

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TheEndOfMoore’sLawIsComingButThatIsOnlyOneOfTheDrivingForces

Thereare4significantissuesdrivingchange:• TheapproachingendofMoore’sLawscalingofCMOS

• MigrationofData,logicandapplicationstotheCloud

• Theriseoftheinternetofthings

• Consumerizationofdataanddataaccess

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MigrationToTheCloud

Data,logicandapplicationsmigrationtotheCloudposesdifficultchallenges– Powerrequirements– Latency– Physicaldensityofbandwidth

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TheInternetOfEverything

Theriseoftheinternetofthingsalsoposesdifficultchallenges– Billionsortrillionsofdevices;butwillanybehighvolume?

– Newsecurityrisks– Arangefromlowcost,highlatencytohighcostlowlatency

– Environmentsfromdesertsandglacierstoin-bodyandunderthehood

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ConsumerizationOfData

Consumerizationofdataanddataaccessposesdifficultchallenges– Bigdata– Highperformance– Batterylife– Latency– Reliability– Theultimateinternethub(itiscominginAutos)

0

500

1000

1500

Shipmentsin

Millions

SmartPhoneShipmentHistory

2009

2010

2011

725.3

2013

70exabytes ofmemoryshippedinsmartphonesfor2015alone

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EverythingMustChangeIncludingRoadmaps

Source:Ansys “Engineering the internetofThings”

Consumer

These 4 driving forces present requirements we cannot satisfy through scaling CMOS

Lower Power, Lower latency, Lower Cost with Higher Performance

We must bring all electronics closer together and interconnect with photonics

This can only be accomplished by Heterogeneous Integration in a 3D-Complex SiP

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TheEnablingTechnologyWillBeInformationTechnology

ITincludesallsystemsandcomponentsfor:• physicaldevicestocreate,store,secureand

exchangeallformsofdata• Networkingforallformsofdatamovement

andsharing• Physicaldevicesandsoftwaretotransform

dataintoinformationandmakeitavailableworldwideinrealtime.

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ChangingRoadmapsTheITRSDominatedButMultipleSuccessorsWill

ContributeInTheFutureInternationalElectronicsManufacturingInitiative(INEMI)Roadmap

– 10yearhorizon– Availablefreetomembersandforpurchasetonon-members– Focusonmarketsegments andmanufacturingtechnologies“Animportanttoolfordefiningthe“stateoftheart”intheelectronics industryas

wellasidentifyingemerginganddisruptivetechnologies”

InternationalRoadmapforDevicesandSystems(IRDS)– 15yearhorizonforsomeparts– SponsoredbyIEEEStandardsAssociation– AvailableFreetoall“Theneweffortaimstotakeabroadviewoftheneedsofcomputinggenerally.Itwilladdressroadmapissuesthatincludecomputersystems,architecturesand

software aswellasthechipsandothercomponentsusedinthem”

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TheITRSDominatedAndMultipleSuccessorsWillContributeInTheFuture

PhotonicSystemsManufacturingRoadmap(PSMR)– 15yearhorizon– Availablefreetoall– FocusedonmanufacturingofPhotonicSystems– SponsoredbyNISTandAIMPhotonics,ManagedjointlybyMITMicrophotonics

CenterandINEMI“AstrategicRoadmapthati)identifiescriticaltechnicalrequirementsfornext-

generationsystemsintegrationandpackaging,ii)details potentialsolutionstomeetthoserequirementseconomically,andiii)identifies thetechnologysupplychain

limitations”HeterogeneousIntegrationTechnologyRoadmapforSemiconductors(HITRS)

– 15yearhorizonformosttopics;25yearhorizonforemergingresearchareas– Availablefreetoall– SponsoredbyIEEECPMTSociety,SEMIwithparticipationbyIEEEEDS

HeterogeneousIntegrationTechnologyRoadmapForSemiconductors

(HITRS)

The IEEE CPMT Society, The IEEE Electron Devices Society andSEMI sponsored a new Roadmap focused on the onlytechnologies that can maintain the pace of progress, at leastuntil a replacement for the CMOS switch is found.

http://cpmt.ieee.org/technology/heterogeneous-integration-roadmap.htmlhttp://www.semi.org/en/heterogeneous-integration-roadmap

TheHITRSiscommittedtocollaborationwithotherRoadmapswhereeverpossible

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HITRSPurpose• TheRoadmapservesasaguidelinefortheglobalelectronicsindustryof

projectedtechnologyneeds andopportunities forinnovation.• TheRoadmapisdevisedandintendedfortechnologyassessmentonlyandis

without regardtoanycommercialconsiderationspertaining toindividual productsorequipment.

• ServingtheProfession,Industry,AcademiaandResearchInstitutes,theRoadmapprovides:

• Aforecastofindustryrequirementstomaintainthepaceofprogressfortheindustryandusercommunity overthenext15years,andthenext25yearsfortheheterogeneous integrationofemergingdevicesandmaterialswhichrequirealongerresearchdevelopmenthorizon.

• Identificationofdifficultchallengesthatmustbeaddressedtomeettheseindustry requirements.

• Wherepossible theRoadmapwillidentifyresearchrequirementsandpotentialtechnicalsolutions.

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HITRSTechnicalWorkingGroupsHeterogeneousIntegrationComponents• Single-Chip&Multi-ChipPackaging(includingsubstrates)• IntegratedPhotonics• IntegratedPowerDevices• MEMS• RF&AnalogMixedSignal• Plasmonics

Allthesecomponentsexisttodaybuttheywillchangedramaticallyoverthe15yearlifeoftheHITRSRoadmap

MechanicalAssy-Laserwelding-Flexbending

Antenna-Packageintegrationfor2.4G/5G/60GHz

Passives/IPD-IntegratedPassive

Devices

Die/Pkg Stacking-Diethinning

-Dieinterconnect

EmbeddedTechnology-Passivecomponent

-Activedevice

Molding-MUF

-Exposeddie

WaferBumping/WLP-Leadfree /CuPillar-Barediepackage

InterconnectionFlipChip&WireBond

SMT-Passives-Components-Connectors

ASEConfidential

Shielding-Boardorpackagelevel

-Compartmental

Electronic/PhotonicSiPthroughHeterogeneousIntegration

Photonics

PhotonicsLayerPICChip- opticalbus

Source:ASEwithadditions

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BuildingBlocksForIntegratingPhotonicsintoSiPExist

16

B

Opticalbus

ActiveWavelengthLocking

Beamsplitters

Source:ECTC2014SiPhotonics-StephaneBERNABEwithadditions

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HITRSTechnicalWorkingGroupsCrossCuttingTopics• EmergingResearchMaterials• EmergingResearchDevices• IntegratedPowerDevices• Interconnect(system,subsystem,packageandchiplevel)

• Test

Newmaterialsanddeviceswillberequiredforintegratedpowerdevicesandhighperformanceinterconnect.

TestapproachesmustchangedramaticallytosupporttestaccessandtransistorwearoutwithComplex3DSiP.

NewDeviceTypesAreComingTheseDevicesAndTheirPackagingWillUseNewMaterials

Spin torque devices(2 magnetic junction pillars)

MEMS Photonic switchVertical coupler

Plasmomic emission Source(quantum dots and plasmons)

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HITRSTechnicalWorkingGroups

IntegrationProcesses• SysteminPackage• 2.5Dand3D• IntegratedPowerDevices• WaferLevelPackaging(Fan-in,fan-outandpanelprocessing)

Theseprocessesexisttodaybuthavebeenslowtomovetovolumeproduction

Costisthelimitingfactortoday.Costreductionatsystemlevelwillbethedrivingforceforwidespreadadoption

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HITRSTechnicalWorkingGroups

PackagingforSpecializedFunctions• Mobile• IoTandWearables• Medical• Automotive

Eachofthesefunctionshaveuniquerequirementsthatwilldrivespecializedpackagingtechnology.

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HITRSCalendarOf2016ActivityAsOfToday

FacetoFaceWorkshops1. ECTC+ITHERM LasVegas,NVUSA05/31- 06/04

2. PaloAltoWorkshopbeforeSEMICONWEST(3101AlexisDrive,PaloAlto.CA)07/10

3. SEMICONWEST SanFrancisco,CAUSA07/11

4. Taiwan(atITRI- 08/12)

5. China(associatedwithICEPTinWuhan,China08/16-19)http://www.icept.org/en/

6. JapanAugust2016(workshopschedulenotyetconfirmed)

ESTC Grenoble,France 09/13-16

7. ELECTRONICSPACKAGINGSYMPOSIUM Binghamton,NYUSA10/5-8

8. IMPACT Taipei,Taiwan 10/26-28

9. ICSJ Kyoto,Japan11/7-9

10. EPTC Singapore11/30– 12/03

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Thank You for your Attention