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C O N F I D E N T I A L
Randy BaneManaging Director
Corporate MarketingApplied Materials
CSIS/US-Taiwan Business Council Conference
May 27, 2004
China and Global Semiconductor Industry Update and Outlook
C O N F I D E N T I A L
1
23456789101112131415
4,789.4
3,290.81,757.01,346.01,269.11,174.91,124.2
966.6925.1810.1748.4733.1681.3604.4471.9
Applied Materials
Tokyo Electron Ltd.ASMLNikon CorporationKLA-TencorCanon Inc.AdvantestDainippon ScreenNovellus SystemsHitachi High-TechnologiesLam ResearchTeradyneAgilent TechnologiesASM InternationalYokogawa Electric Corporation
CY2003Sales ($M)*
2003 RankCompany
(Sorted by 2003 Revenues)
Top 15 Worldwide Semiconductor Equipment Manufacturers
* Includes service and sparesSource: VLSI Research 2/04
C O N F I D E N T I A LSources: Applied Materials China
Applied Materials Success in ChinaExplosive Revenue Growth: 75% CAGR (’98-’03); 6% of TotalAMAT Revenues in FY2003
0
50
100
150
200
250
300
350
400
450
500
'84 '85 '86 '87 '88 '89 '90 '91 '92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 '03 '04F
AM
C T
otal
Rev
enue
Nor
mal
ized
to 1
985
= 1 ?
Tipping Point-Market Upturn-20 yrs of ‘extended‘ partnership
C O N F I D E N T I A L
2010F2003
Semiconductor Production$331.3 Billion
22.5% of Electronics
Production Equip.$50.4 Billion
15.2% of Semiconductor
Electronics Production$1,475.5 Billion
3.5% of Worldwide GDP
Semiconductor Production$169.8 Billion
14.6% of Electronics
Production Equip.$22.1 Billion
13.5% of Semiconductor
Materials$25.6Billion
Electronics Production$1,026.0 Billion
3.0% of Worldwide GDP
The Worldwide Semiconductor Industry
Sources: Dataquest, Applied Materials CorporateMarketing estimates 3/04, WSTS, SEMI.
1.4x
2.0x
2.3x
2.2xGrowthMaterials
$57.0Billion
C O N F I D E N T I A L
15
17
19
21
23
25
27
Q1'
00Q
2'00
Q3'
00Q
4'00
Q1'
01Q
2'01
Q3'
01Q
4'01
Q1'
02Q
2'02
Q3'
02Q
4'02
Q1'
03Q
2'03
Q3'
03Q
4'03
Q1'
04
IC U
nit
s S
hip
ped (
B)
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
IC R
even
ues
$B
Sources: SICAS, WSTS, IC Insights
New Era of Unit Shipments
Prior Unit Peak
>30% Revenue Growth in Q1’04 over Q1’03
Units
Revenues
C O N F I D E N T I A LSource: IDC
Mainframes
DesktopComputing
Mill
ions
of U
sers
1970 1980 1990 2000 2010
10
100
1,000
Convergence of Computing, Communications and Consumer
Shifting Markets for Semiconductors
Digital Consumer Appliances
C O N F I D E N T I A LSource: EMC Wireless, IDC
Expanding Global MarketsSignificant Opportunities Ahead
0
20
40
60
80
100
0 20 40 60Internet Usage Penetration (%)
Mob
ile P
enet
ratio
n (%
)
Wired Societies~625 M
Sweden Norway
Denmark
Finland
Best ofBoth Worlds
~25 M
Emerging Markets~4.5 BPoland
Latin AmericaSerbia
ChinaIndia Russia
Spain
Portugal
. Republic
Hong Kong
Greece
TaiwanItaly
Cz
WirelessSocieties
~1 B
US
Germany
UKBelgium
France
Japan
Singapore
S. Korea
World
World 1995
C O N F I D E N T I A L
2010F2003
Production Equip.$8.2 Billion
35.1% of SemiProduction
Electronics Production$242.6 Billion10.3% of GDP
Semiconductor Consumption$14.6 Billion, 13.5% of Electronics
Production Equip.$1.4 Billion
55.0% of Semi Production
Materials$1.5
Billion
Electronics Production$108.0 Billion7.9% of GDP
Materials$9.8
Billion
China Semiconductor Industry
Semiconductor Production$2.5Billion
Semiconductor Production$23.4 Billion
Semiconductor Consumption$53.6Billion, 22.1% of Electronics**
** Assuming China is in par with the world at 22.1% of semiconductor content in electronics
Sources: Dataquest, Applied Materials CorporateMarketing estimates, WSTS, SEMI
2.2x
3.7x
5.9x
6.5x
9.4x
Growth
C O N F I D E N T I A L
China’s Grows its Dominance of Asia Pacific’s Electronic Equipment Production
2003E
Taiwan14%
South Korea19%
Malaysia11%
Rest of A/P11%
China39%
Singapore6%
2010F
Taiwan14%
South Korea20%
Malaysia7%
Rest of A/P8%
Singapore5%
China46%
Source: Gartner Dataquest, Applied MaterialsCorp. Marketing estimates
$361B $636B
C O N F I D E N T I A LSources: WSTS, Applied Materials
North America
37%
Japan31%
Europe14%
Asia-Pacific
17%
1985 2000 2010F
$28B $209B $327B
Asia-Pacific
23%
Europe15% Japan
20%
North America
35%North America
49%Japan38%
Europe12%
Asia-Pacific
1%
China0.5%
China7%
Semiconductor SalesBy Region of Production
C O N F I D E N T I A L
MotorolaUS
A New Customer LandscapeShifting Centers of Influence
Asia-Pacific
PSC
IBMUS
NanYa
Europe
Note: () indicates 2001~2003 CAPEX*: Circle indicates major member companies
Infineon
Philips
STM
Elpida
NEC
Toshiba
Japan
90nm Alliance
SMIC
TIUS
TSMC
Renesas
Chartered
AMDUS
Sony
($12B, 13%)
Samsung($8B, 8%)
Intel ($16B, 17%)
Fujitsu
($14B, 15%)
($4B, 4%)
($2B, 2%)
MatsushitaInoter
a($4B, 4%)
ASPLA*($15B, 15%)
C O N F I D E N T I A L
2004 Top 10 Semiconductor Capital Spending
45%14,707 21,391 Total8%1,300 1,400IBM10
37%1,0551,450 Micron9156%5861,500AMD8131%6701,551 SMIC7
56%1,0001,563 Infineon633%1,2001,600ST585%1,0822,000 TSMC4
187%7392,120UMC33%3,700 3,800 Intel2
31%3,375 4,407Samsung1
2004/2003 % Change
2003 Capex($M)
2004E Capex ($M)Company
2004Rank
Sources: IC Insights, Equity Analyst Reports, Company Reports, Applied Materials estimates
C O N F I D E N T I A L
2004 Black2004 Black--Book Capital SpendingBook Capital Spending
Sources: SEMI Fab Database, Company Announcements, Applied Materials estimates
North America Europe Japan Taiwan Korea China SEA
$8.8B22%
$4.7B12%
$9.2B23%
$5.4B13%
$40B
$3.2B8%
$5.4B14%
$3.3B8%
C O N F I D E N T I A L
China Semiconductor Consumption Outpaces Domestic Production: Can Supply only 22% of Demand by 2005
Source: Gartner Dataquest, Applied Materials Corporate Marketing Estimates, CCID (China Center for Information Industry Development)
22%
6%
0
5
10
15
20
25
30
35
2002 2005
Bill
ions
of U
S$
0%
10%
20%
30%
40%
50%
60%
Perc
ent D
eman
d Sa
tisfie
d by
Dom
estic
Pro
duct
ion
Consumption
Production
Percent Demand Satisfied byDomestic Production
C O N F I D E N T I A L
China Fabs and Location
JSMCPJMC
SGNEC
SMIC,GSMCTSMC, HeJianHHNEC, ASMC
CSMCHua JingPrima
ShengzhenPotentialCustomer
ChengduPotentialCustomer
SINOCNMC
Fab 1
Fab 2
Shanghai
SMIC
C O N F I D E N T I A L
Source: Company Reports, Analyst Reports, Corporate Marketing Estimates
*China foundry’s capacity includes DRAM capacity that do not compete with existing Taiwan foundry’s capacity
** Taiwan’s Foundries’ Capacity consists of only TSMC and UMC
0
100
200
300
400
500
600
700
800
900
2003 2004 2005
Waf
er S
tart
s (8
" E
quiv
.)
10%
15%
20%
25%
30%
35%
40%
45%
50%
55%
Chin
a Ca
paci
ty a
s a
% o
f Ta
iwan
Fou
ndry
's C
apac
ity**
China’s Capacity to Become an Important Foundry Alternative in the Next 2 Years
Taiwan
China
18%
33%
48%
Note: 8” and Above Fabs Only
C O N F I D E N T I A L
Establishing a Complementary Industrial Strategy
Maximizing the Semiconductor
Food Chain
China
Silicon Valley
Taiwan
Three Regional Centers, together, growingthe overall size of the pie
Advanced IC manufacturingVibrant Entrepreneurial and Capital Markets
Technology InnovationEntrepreneurial with strong linkages to Capital Markets
Vast Markets Abundant ResourcesRegional DistributionLow Cost Manufacturing
C O N F I D E N T I A L
Summary Integration
End markets shift to lower cost consumer products
Global partnerships drive future of technology and shifting manufacturing base
Foundry proven model stimulates further stratification of markets
Regions segmenting around core capabilities, infrastructure/cluster success, cost and incentives