CHILISIN ELECTRONICS CORP.

Company Presentation 2013

Corporate Overview

Product Introduction

Product Roadmap

2

Outline

Leading Brand in China

3

Company MilestonesA Local Ferrite Producer

Business Expansion

Major Domestic Player

World-class Company

1972 1977 1990 1998 1999

Year

40,000

80,000

120,000

2002

Established

Developed Mn-Zn and Iron Core

Developed SMD Power Inductor

Public listingon TWSE

20012000

60,000

1997 2003

Rev

enue

K $USD

20072005 20112009 2013

100,000

Established second plant

Developed Wire-Wound and Multilayer

Developed High-Frequency Chip Inductor

Expanded ChinaDongGuan plant

EstablishedChinaSuZhouoffice

Constructed Hukou new HQ and plant

Established China Henan plant

Company established

EstablishedU.S. office

Established China DongGuan plant

EstablishedKorea office

Acquired Belkin Int’l

Formed strategic alliance with Yageo

Developed Moldingand Thin-Film Technology

$3,158

$2,580

$2,216

$2,479

$2,218 $2,408

$0

$500

$1,000

$1,500

$2,000

$2,500

$3,000

$3,500

2008 2009 2010 2011 2012 2013F

Global Value

Chilisin Growth vs. Global Market($USD ’000) ($USD Million)

Source: Paumanok Publications, Inc .

2009~2012 Global

Revenue Growth 94.2% -14.0%

CAGR 24.8% -4.9%

4

Sales Breakdown 2012 – By Region

Sales Breakdown 2012 – By Market Segment

Major Customers

AutomotivesAutomotives

PC / SystemsPC / Systems Consumer ElectronicsConsumer ElectronicsTelecommunicationTelecommunication

OEMs / EMSsOEMs / EMSs

*Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos

Global Network & Support

8

Chilisin HQ and Factory

Hukou, Taiwan

Powder FactoryTouliu, TaiwanFactory

Dongguan, China

FactorySuzhou, China

FactoryHenan, China

Distributors and agents Sales offices

Branch OfficeAanyang, Korea

Branch OfficeSan Jose, USA

Manufacturing sites with sales offices

FactoryDongguan, China

Est. 1997Employee: 1,199

FactoryHenan, China

Est. 2010Employee: 518

FactorySuzhou, China

Est. 2001Employee: 96

HeadquarterHukou, Taiwan

Est. 1972Employee: 751

9

Factory Overview

Molding

Wire-Winding

Multi-layering

Thin-film

Through-hole

Manufacture Site Finished Products Inventory

-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------

LED Home AppliancesComputing / Mobile

Display DSC

Diversified Applications

Graphic CardAlternative EnergySet Top Box

Game Console

Automotive

Server

Mother Board

Corporate Overview

Product Introduction

Product Roadmap

11

Outline

Leading Brand in China

Appendix

12

MoldingWire-winding Multi-layering Thin-film Process

Power Inductor• Wide range• for power solution

Magnetic-resin Power Inductor• 2016~3030 size

for mobile phone• 4040~5050 size

for tablet PC• 6060~8080 size

for TV/audio

Chip Inductor• Ferrite core for power line• Ceramic core for signal line

& RF matching

Common Mode Choke• for USB2.0/3.0/HDMI

Power Inductor• DIP type• for motherboard

Power Inductor

• SMD type• for notebook & tablet PC

Power Inductor• SMD (miniature) type• for handset & ultrabook

Bead Chip Inductor• High frequency• Downsize from 0402 to 0201

Chip Inductor• for handset

New ProductsPower InductorCommon Mode Choke

New ProductsCommon Mode Choke

Product Line and Technology

In-house Powder Mixing

Technology

Core Formation

Powder Formula

13

Comprehensive Product PortfolioMultilayer Power InductorMultilayer Chip InductorMultilayer Chip BeadMultilayer 0805 USB2.0 CMMThin Film RF Inductor

SMD Series

Ni-Zn SeriesEMI FilterSoft Ferrite

Core SeriesIron/Ferrite Toroid

Power Line EMI FilterData Line EMI FilterCoil Series

Comparable with Murata, TDK, Taiyo Yuden, Sumida, Vishay, Coilcraft, Pulse, Wurth….

0805 USB3.0 CMM0805 USB2.0 CMM0805 HDMI CMMChip Wire-wound Inductor

SMD Power InductorSMD Power BeadSMD Molding Choke

Toroidal CoilRF Choke

Leaded Power Inductor Leaded Molding Choke

In-house Ferrite Core

13

Production Capacity

14

Molding Wire-windingMulti-layering

Thin-film Through-hole

Total: 40 Total: 100

Total: 2,600 Total: 85 Chip Inductor Total: 120

(Million Pcs/month)

Common Mode Total: 30

Power Inductor Total: 160

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Miniaturization

High Current

Low ProfileLow Rdc

Green Compliance

RoHsREACH

40A

20A

60A

1.5mm

1.0mm

0.5mm

04020201

01005

< 2m

<5m

<10m

Product Development Trend

HF

15

Corporate Overview

Product Introduction

Product Roadmap

16

Outline

Leading Brand in China

Appendix

17

SBJ0603(BLM03BD)

~600Ω

PBY1005(BLM15AX)

~1000Ω

UPB0603(BLM03PX)

~22Ω UPB0603(BLM03PX)

80Ω UPB0603(BLM03PX) 120Ω

UPB1005(BLM15PX)

33~80Ω UPB1005(BLM15PX)

180~220Ω UPB1005(BLM15PX)

~600Ω

UPB160805 26~120Ω(BLM18SG_TN)

UPB160805(BLM18SG_TN)

120~330ΩPBY0603 (BLM03AX) 600Ω/1000ΩHFY0603 (BLM03HG) 600Ω/1000ΩHFJ0603 (BLM03HD) 600Ω/1000Ω

MPx252010(LQM2HPN_G)

1.0uH/48mΩ2.5A/2.9A

MPx201610(MPx201610)

1.0uH/150mΩ1.4A/1.6A

CMF1210(CMM0504)

90Ω/120Ω

CMF1210+ESD (CMM0504+ESD)

2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1

Chip bead

TraditionalPhotoTech

Power Inductor

Traditional

CMM

Photo Tech

Multilayer Type

Product Roadmap90Ω/120Ω

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2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1

MHCC – Amorphous powder for core material to enhance electrical characteristics

MHCD2520≦1.5uH

MHCD25202.2~4.7uH

MHCD2016

AME201610(DFE201610)1.0uH 80mΩ 2.7A/2.3A

AME201612(DFE201612)4.7uH 200mΩ 1.9A/1/5A

AME252010(DFE252010)4.7uH 250mΩ 1.6A/1.2A

AME252012(DFE252012)

10uH 400mΩ1.3A/1.0A

AME201610 (DFE201610)2.2uH 170mΩ 1.9A/1.4A

Molding Type

Product Roadmap

19

2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1

Wire-wound Type

Product Roadmap

CS0201 0.6x0.5x0.45

CM0302 0.9x0.5x0.45

PM0402High Irms 1.1x0.5x0.45

PM0603High Irms

1.8x1.15x1.0

HP0603High Irms

1.8x1.15x1.0

SCID3015 3.0x3.0x1.5Shielded, Coupled Inductor

SCID3010 3.0x3.0x1.0Shielded, Coupled Inductor

LVF121010 1.2x1.0x1.0Shielded

MDSC/MRSC25201x 2.5x2.0x1.0/1.2Shielded, Metal

LVF161010 1.6x1.0x1.0Shielded

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2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1

Thin-film

InductorThin-filmCom

mon-

mode choke

Thin-film + Molding

Power Inductor

TFL0603(TFL0201)

~22nH

CMF0806(CMM0302) 90Ω

TFP201610(TFM201610) 1.0uH

60mΩ2.9A/2.2A

TFP201210(TFM201210) 1.0uH

140mΩ2.2A/1.3A

Thin-film Type

Product Roadmap

Corporate Overview

Product Introduction

Product Roadmap

21

Outline

Leading Brand in China

Appendix

Best Partner Award from Coolpad (2012) Best “Cooperate To Win” Award from Lenovo (2011) Outstanding Supplier Award from SerNet (2011) Best Supplier Award from New Kinpo (2010) Best Supplier Award from Asus (2005)(2007) Best Supplier Award from Solectron (2007) Best Supplier Award from Zyxel (2006)(2007) TS16949 Certification (Since 2005) Samsung Eco-Partner Certificate (Since 2005) ISO 14001 Certification (Since 2004) Sony Green Partner Certificate (Since 2003)

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Certificates and Awards

23

Customer Design-in

Circuit Simulation

Material Research & Developmet

Technical Seminar

Product Development

Teams:EE & Material

R/L/C Know-how

Value-added ServiceWork Frame for Engineering Support

2424

Trustworthy Supplier Competitive Products

Full Range of Magnetics Series Sufficient Capacity Support World-class Quality Cost Competitiveness Quick Delivery Flexible Logistic Support

Value-added Service

Professional Engineering Support Concurrent Product Innovation Design-in Capability Total Solution Provider

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