Electrostatic Coating with Ligandless Copper Nanoparticles

Metallic Nanoparticles (NPs): Low Temperature Metallization

Applications Low Temp. Metals

Why Work with Copper

Nanoparticle Formation

Conductive Copper Nanoparticles

Ligands and Charge Compensators

Nanoparticle Ion Cloud

Synthesis and Characterization

Positive Charges: Substrate-Film Formation

Approach to Deposit Blanket Films

Metal-Nanoparticle Thin Films, Features

TEM Bath Coated Cu Films

Films → Properties

Surface Plasmon Resonance

Light Absorbance vs. Ionic Liquid Conc.

Photoluminescence vs. IL Conc.

X-Section High Angle SEM: Void vs. IL Conc.

Ellipsometry Model: Oscillators

Ellipsometry: Polydisperse NPs and Increased Particle Interactions

Properties → 3D Deposition

Polymer Removal

Cu NP Thin Film after 1 min Dep.

Cu NP Multilayer Film, 2 min Dep.

50 nm Discontinuous Film, 1 min Dep.

150 nm Thick Films, 2 min Dep.

Metallized Flexible-Bendable Substrates

Conclusions

Back up

EMA Fractions and Depolarization: Interparticle interactions

Sintering vs. IL

Reaction Mechanism

Cu NP Thin Film after 1 min Dep.

Metal Plating

X-TEM: ≤3 nm Dia. Nanoparticles

Cross Section SEM and Ellipsometry

Other Ellipsometry Parameters

Ellipsometry Parameters

UV-Vis vs. IL Conc.: Max Abs. at 2.1-2.4 mM IL Conc.

Glass and Amine Termination is Influenced by Initial pH of

Substrate

SEM Bath Coated Cu Films

SEM of Bath Coated Cu Films

Copper Nanoparticles: Oxidation

Solution Cycle Coating of Cu NPs

Reaction Coating: Alternate Substrates

Nanoparticle Ion Cloud