chapter 9 : overall equipment efficiency oee - unibw · pdf fileicm, 9 - 1 integrated circuit...

ICM, 9 - 1

Prof.Dr.W.Hansch, Dipl.-Ing.E.Schober Integrated Circuit Manufacturing Modul 1278

Chapter 9 : Overall Equipment Efficiency OEE

OEE = Theoretical time for effective tools

Total Time

Non Scheduled Time

(Nichtbetriebszeit)

* holidays

* Installation/rebuild/

shutdowns

* training

Operations Time (Betriebszeit)

Down Time (nicht bereit)

Unscheduled

Down Time

(ungeplante

Nichtbereitschaft)

* run out

op.material

* out of specs

* Repair

Scheduled

Down Time

(geplante

Nichtbereitschaft

)

* maintenance

* maintanence delay

* Material refill

* set-ups

Up Time (bereit)

Engineering Time

(...)

* process tests

* software tests

* experiments

Manufacturing Time

(Produktionszeit)

Productive Time

(Produktive Zeit)

* regular production

* work for 3rd party

* rework

* engineering runs

Standby Time

(Wartezeit)

* no operator

* no product

* no support

others

5%cleanroom

7%

building

8%

capital

costs

10%

equipment

70%

ICM, 9 - 2


9.1 Introduction

9.2 Equipment Manufacturers and Organisations

9.3 Semi-Standards

9.4 SEMI-E10

9.5 SEMI-E79, Overall Equipment Efficiency OEE

9.6 From OEE to Overall Factory Efficiency OFE

9 Overall Equipment Efficiency OEE

ICM, 9 - 3


May 2004: http://www.xbitlabs.com/news/other/display/20040517085938.html,

AMD broke ground on its 300mm manufacturing facility on November 20, 2003. The new facility, named AMD Fab 36, is part of AMD Fab 36 LLC & Co. KG

and is being built in Dresden, Germany, adjacent to AMD Fab 30.

The Fab36 will cost about $2.4 billion in total. AMD gets $1.5 billion as help, which is $500 million as subsidies, grants, etc, $700 million is a loan and remaining

$300 as an equity from 2 partners - Saxony and some European investors. The rest $900 million are expected to come from AMD itself.

AMD projects the building to be completed in late 2004. The company will start the installation of equipment just before the end of 2004 and plans to start qualifications

of the factory in the late 1H 2005. AMD Fab 36 is expected to be in volume production in 2006. The new facility will employ roughly 1000 people.

The Fab 36, as expected, will manufacture chips in 300mm wafers using 65nm technology process. This will allow AMD to cost-effectively make its MPUs and this

seems to be the company’s primary goal for the new foundry. Even though there is 20% to 30% gap between the costs of manufacturing using 200mm wafers and

300mm wafers as well as shrink of fabrication technology to 65nm process also provides some cost benefits, CPUs also get more and more complex, as a result,

there are no breakthroughs in margins or costs expected by the company’s management.

The initial capacity of the fab is 13 000 300mm wafers per month, but the building itself allows AMD to expand the foundry to produce up to 20 000 wafers per month.

Some News and Data about Semiconductor Fabs 2004-2007

Oct 2006: Siltronic, Samsung Team Up to Build Wafer Fab, http://techon.nikkeibp.co.jp/article/HONSHI/20061110/123391/

Siltronic AG and Korean semiconductor company Samsung Electronics have announced a joint venture to construct a 300mm wafer fab in Singapore.

Siltronic is a division of Wacker Chemie AG of Germany, a silicone and polymer chemistry company specializing in fine chemistry, polysilicon production and

semiconductor technologies. Construction of the new wafer fab, which will adjoin Siltronic's existing complex, commenced in August this year.

Both companies expect production to start mid-2008; their aim is to reach 300,000 wafers per month in capacity by 2010, by which time about 800 new employees

should be working at the fab. The fab will be jointly operated by both Samsung and Siltronic; Siltronic will put in place the new CEO and the CTO, while Samsung

will select the new CFO and the COO. The fab is likely to be used solely for production; no major R&D activities are expected to be conducted at the fab.

The venture is expected to benefit both companies. "Samsung has a clear-cut expansion strategy and intends to invest US$33 billion in developing the

semiconductor industry up to 2012," said Park Sung-Hae, public relations manager at Samsung Electronics. "This joint venture is an important part of our plan

to ensure a stable source of supplies for the rapidly growing 300mm market." Locating the new fab near Siltronic's existing 200mm wafer plant in Singapore

is a logical technical and business move. "Geographical proximity of the new 300mm fab should substantially facilitate the transfer of know-how, implementation

of production processes and leveraging of synergies regarding the joint use of existing infrastructures," explained Christof Bachmair, spokesperson for

Wacker and Siltronic. According to Bachmair, benefits of the venture to Siltronic include a significant boost in innovation, time to market and quality.

Secured delivery of the fab's output to Samsung translates into a stable utilization rate, which is critical for profitability. Samsung, meanwhile, will have access to

a constant supply of 300mm wafers of the highest quality specifications.

The following news are from the www and only examples to get some data, also showing historical developments:

April 2007: http://www.fabtech.org/content/view/2760/

Intel Corp. has invested $3 billion in a new 1,000-employee semiconductor fabrication plant, or "fab," that opens Thursday in Chandler.

Fab 32 is the only full-scale semiconductor-production facility in the world to employ the latest 300 millimeter/45 nanometer technology.

Die gesamte Fläche der Anlage beträgt gut 92.000 m², die Reinraumfläche beläuft sich hingegen auf 17.000 m².

Während der Planungs- und Bauzeit wird Intel allein knapp 3.000 Leute beschäftigen; in der Fab 32 werden später gut 1.000 hochqualifizierte Menschen arbeiten.

9. OEE

9.1 Intro

ICM, 9 - 4


March 2007: Intel announces new China 300mm wafer fab, http://www.pcpro.co.uk/news/108728/intel-announces-new-china-300mm-wafer-fab.html

Intel is strengthening its ties with China with the announcement of a new 300mm wafer fab in the city of Dalian, in the north-east province of Liaoning.

While Intel has a number of such chip factories around the world - in Israel and Ireland, as well as the US - this is its first in Asia.

In what is described as a $2.5 billion investment, Fab 68 is Intel's first new wafer fab at a new site in 15 years.

'China is our fastest-growing major market and we believe it's critical that we invest in markets that will provide for future growth to better serve our customers,'

said Intel President and CEO Paul Otellini. 'Intel has been involved in China for more than 22 years and over that time we've invested in excess of $1.3 billion

in assembly test facilities and research and development. This new investment will bring our total to just under $4 billion, making Intel one of the largest foreign

investors in China.' 'This is one of the major cooperative projects between China and the United States in the area of integrated circuits manufacturing in recent

years,' said Zhang Xiaoqiang, vice chairman of the National Development and Reform Commission. 'The project will further strengthen Intel's leadership position

in the semiconductor manufacturing in the world.'

Work will start on the new fab later this year and production is scheduled to begin in the first half of 2010.

At that point there will be eight such 300mm plants in Intel's manufacturing network.

The advantage of the larger 300mm wafers - as opposed to previous 200mm sizes - is the manufacturing efficiency that can be achieved by cutting more chips

from a single wafer. Intel states that 300mm manufacturing technology consumes 40 per cent less energy and water per chip than a 200mm wafer factory.

Some News and Data about Semiconductor Fabs

Sep. 2007: Toshiba and SanDisk Inaugurate New 300mm Wafer Fab 4 for NAND Flash Memory at Yokkaichi Operations

Toshiba Corporation and SanDisk® Corporation today celebrated with a traditional ceremony and reception the opening of Fab 4, the latest 300mm wafer fabrication

facility at Toshiba’s Yokkaichi Operations, in Mie Prefecture, Japan.

Responding to continuous rising demand for NAND flash memory used in a wide range of digital applications, including digital media players, mobile phones, PCs

and memory cards, Toshiba started construction of Fab 4 in August 2006. Fab 4 is expected to start mass production in December 2007 and reach a production

capacity of 80,000 wafers a month in the second half of CY2008. The fab has space to expand capacity and further investment could take output to 210,000 wafers

per month, in response to the projected increase in future market demand. Fab 4 will employ cutting-edge 56-nanometer (nm) process technology at start-up,

and plans call for a gradual transition to 43 nm technology, starting from March 2008.

“Toshiba and our partner SanDisk are delighted to celebrate the construction of this new facility,” said Mr. Shozo Saito, Corporate Senior Vice President of Toshiba

Corporation and President & CEO of Toshiba’s Semiconductor Company. “Fab 4 will feature world-class manufacturing capabilities, both in scale and productivity.

It will support us in reinforcing our leadership in the fast growing global market for higher density NAND flash memories, and provide a powerful engine of growth

for both companies.” Dr. Eli Harari, Chief Executive Officer and Chairman of SanDisk Corporation, said, “Fab 4 is testimony to the success of the great partnership

and long-term commitment between Toshiba and SanDisk. The enormous size and technology scope of Fab 4 reflect our confidence and optimism for the future,

and we believe will enable us to competitively meet the growing demand for flash storage from our global customers in the years ahead.”

Outline of Fab 4 at Yokkaichi Operations

- Structure of Building: Steel frame concrete, five stories (two clean room stories)

- Building Area: approx. 35,500m2 (approx. 382,000 in square feet)

- Floor Area: approx. 181,000m2 (approx. 1,948,000 in square feet)

- Start Construction: August 2006

- Completion of Building: July 2007

- Start Mass Production: December 2007(plan)

9. OEE

9.1 Intro

ICM, 9 - 5


GlobalFoundries held a groundbreaking ceremony for Fab 2 in Malta, N.Y.

The foundry's goal is to have the first tool move in by October 2011, with commercial production by the second half of 2012.

By David Lammers, News Editor -- Semiconductor International, July 24, 2009

As an Albany, N.Y., taxi driver ferried a visitor to the GlobalFoundries Fab 2 groundbreaking ceremony near the village of Malta, he said,

"For three years they've been talking about this, but I never thought they would actually build it."

Planning began in June 2006, and it was this year on June 19 that GlobalFoundries began clearing portions of its 230-acre site, located ~24 miles from Albany and seven

miles from Saratoga Springs. Fab 2 is expected to be making volume silicon by the second half of 2012, employing 1400 directly and an estimated 5000 indirect workers.

The spinoff of Advanced Micro Devices (AMD, Sunnyvale, Calif.) has room for two additional modules at the site.

That shift was supported by a $6B investment in GlobalFoundries by the Abu Dhabi Investment Co. (ATIC). The money will be spent to build Fab 2 at Malta,

expected to cost $4.2B, as well as to expand and upgrade the GlobalFoundries Module 2 in Dresden, Germany.

The state of New York is providing an estimated $1.2B in subsidies for Fab 2, and is investing additional funding to expand the University at Albany's nearby College

of Nanoscale Science and Engineering (CNSE). AMD contributed its existing manufacturing complex in Dresden as well as other assets, but no cash, providing AMD

with access to a new fab without capital outlays.

Because the site is not space-constrained, Fab 2 will be a two-level building rather than three-level. All of the wafer production will be on one floor, eliminating the need

to move wafers-in-progress (WIP) up and down floors. A "zero footprint storage" approach will put some wafer stockers above the tools, he added.

Implant will be located off of the main waffle slab, reducing construction costs, and maintenance shops will be on the upper production floor to further improve efficiencies.

Though its labor costs in both Dresden and Malta will be higher than at many Asian fabs,

manufacturing innovations will make GlobalFoundries cost-competitive with Taiwan

Semiconductor Manufacturing Co. Ltd. (TSMC, Hsinchu, Taiwan). GlobalFoundries is investing

in the midst of a severe downturn, which also will reduce costs compared with the more

expensive 24/7 construction schedules used when fabs are built in a hurry. Armour said it may

take 18 months to build Fab 2, which is expected to have a 220,000 sq. ft. cleanroom with an

option to expand cleanroom space to 300,000 sq. ft. The goal is to have the first tool move in

by October 2011, with qualification coming in early 2012 and commercial production by the

second half of 2012, a schedule that could be accelerated somewhat "depending on market

conditions," Armour said.

Sonderman said construction begins at a time "of a lot of pent-up demand for advanced foundry

capacity."

Fab 2 will start at 28 nm technology, and then bring up a 22 nm SOI process for CPU

production. GlobalFoundries will support AMD's manufacturing needs with the current 45 nm

production, moving to 32 and 22 nm production. For foundry customers, however, most of the

interest is at the half nodes, including 40 nm bulk technology immediately at Dresden and 28 nm

high-k/metal gate technology late next year when 28 nm customer designs start to be accepted.

Sonderman said GlobalFoundries is accelerating its effort to support 40 nm bulk production,

which he said comes as customers express concerns about yields at TSMC.

"We definitely want to be a counterbalance to TSMC," Sonderman said, outlining plans to offer, by 2013, 600,000 wspy at Dresden and 400,000 wspy at Fab 2.

Some News and Data about Semiconductor Fabs 2009 9. OEE

9.1 Intro

ICM, 9 - 6


Intel: Neue Chipsatzfabrik Fab 42

Intel: Neue Chipsatzfabrik Fab 42 für 14 Nanometer Fertigung

Bereits ab 2013 möchte Intel die neue Fab 42 für die Fertigung von 14 Nanometer Transistoren in Betrieb nehmen.

Damit vergrößert sich der Campus in Arizona um ein 5 Milliarden US-Dollar Komplex.

von Felix Sold, Sonntag 20.02.2011

Im Zuge des Zusammenkommens von US-Präsident Barak Obama und den Größen der amerikanischen IT-Branche

am 18. Februar 2011 hat Intel CEO Paul Otellini den Bau einer neuen Chipsatz-Fabrik angekündigt.

Die Fab 42 soll ab Mitte 2011 auf Intels Campus in Chandler, Arizona, entstehen.

Ab 2013 soll die Produktion von modernen 14 Nanometer Transistoren anlaufen.

Die späteren Chipsätze sollen auf großen 300 Millimetern Wafern Platz finden.

Nach Otellini wird die neue Fab 42 nach Fertigstellung die modernste Halbleiterfabrik der Welt sein.

Das gesamte Projekt wird Intel nach eigenen Angaben zirka 5 Milliarden US-Dollar kosten,

aber zugleich Tausende Arbeitsplätze in den Vereinigten Staaten schaffen, was unteranderem ein Anliegen von Obama war.

Die Zeitung Arizona Republic steht diesem Vorhaben kritisch gegenüber, da unter Berufung auf das

Greater Phoenix Economic Chouncil (GPEC) nur rund 1000 feste Mitarbeiter eingestellt werden sollen.

Für die geplante dreijährige Bauzeit der Fab 42 werden hingegen 14.000 Mitarbeiter benötigt, die demnach

keine feste Zukunft im Unternehmen haben sollen.

Toshiba und SanDisk eröffnen in Japan gemeinsame Fab 5-Produktionsstätte für 300-mm-NAND-Flash-Speicher

(PresseBox) Yokkaichi, Mie, Japan, 12.07.2011, Toshiba Corporation (TOKYO: 6502) und SanDisk Corporation (NASDAQ: SNDK)

feierten heute die Eröffnung von Fab 5, der dritten 300-mm-Wafer-NAND-Produktionsstätte auf dem Gelände von Toshiba Yokkaichi

Operations in der japanischen Präfektur Mie.

Die Nachfrage nach Smartphones, Tablet-PCs und anderen elektronischen Geräten und der damit verbundene weltweite Bedarf an

NAND-Flash-Speichern steigt rasant an. Der Grundstein für den Bau von Fab 5 wurde im Juli 2010 durch Toshiba gelegt. Der

Herstellungsprozess in dieser neuen Produktionsstätte, die von Toshiba und SanDisk technisch ausgestattet wurde, startet im Juli

2011. Die Produktion in Fab 5 basiert derzeit auf der 24-nm*-Technologie, die ersten Speicher-Chips werden das Werk im August

verlassen. Nach und nach wird in Fab 5 zudem auf noch fortschrittlichere Prozesse umgestellt. So wurde bereits vor kurzem die

Umstellung auf eine 19-nm*-Technologie angekündigt; hierbei handelt es sich um die weltweit kleinste und leistungsstärkste

Fertigungstechnik.

Some News and Data about Semiconductor Fabs (2011) 9. OEE

9.1 Intro

http://www.notebookcheck.com/typo3temp/pics/e92db1d19d.jpg



ICM, 9 - 7


The investment cost for a semiconductor fab are increasing exponential (~ factor 10 in 15 years)

Equipment must be profitable !

building 8%

capital costs 10%

equipment 70%

cleanroom 7%

others 5%

Investment costs of a ready-to-start semiconductor fab

Split-up of costs:

Equipment costs are about 2/3 of investment costs

Fab Investment Costs

Situation:

9. OEE

9.1 Intro

1965 1970 1975 1980 1985 1990 1995 2000 2005 2010 2015 2020

10

100

1000

10000

AMD, FAB36, Dresden, 300mm, 65nm

INTEL, FAB28, 3. 45nm FA

Toshiba, Japan, 300mm, NAND

GlobalFoundries, 28nm

2012 TSMC, FAB14, 20nm

Intel, Fab42, 450mm, 14nm

Samsung, China, Flash, 10nm

~ Factor 10 in 15 years

=> Factor 1.6 in 3 years

announced in www

Fa

b C

osts

[M

ill. U

S$

]

Year

various

sources

ICM, 9 - 8


Fab Equipment Costs 9. OEE

9.1 Intro

About every 2 years a new generation ( = smaller dimensions)

of equipment is needed (see change to new color in figure)

Total equipment spending is the sum of node-specific tools and node-independent tools

ICM, 9 - 9


CAPEX = capital expenditure = money for invest

Gartner: Semiconductor equipment spending to boost by 15

percent »

Wednesday 9th July 2014

http://www.siliconsemiconductor.net/

Fab Equipment Costs 9. OEE

9.1 Intro

Some numbers to see where the money goes:

ICM, 9 - 10


Cost Breakdown for a Semiconductor Fab

Due to huge invest and operating costs for tools, minimal improvements result in high cost reduction

Typical Invest for a 200mm Fab ( ~ year 2002 ):

-> Equipment 70% 1´400 Mill.

-> Hook-up 10% 700 Mill.

-> Building 8% 160 Mill.

-> Cleanroom 7% 140 Mill.

-> Utilities 5% 100 Mill.

----------------------------------------------------------------------

~ 2´500 Mill. €

Typical Operational Costs (27k waferstarts per month WSPM):

-> Equipment Depreciation 36% 9,72 million / week

-> Facility Depreciation 6% 1,62 million / week

-> Silicon 15% 4,05 million / week

-> Personnel 6% 1,62 million / week

-> Utilities 10% 2,70 million / week

-> Process chemicals & gases 8% 2,16 million / week

-> Maintenance 7% 1,89 million / week

-> Others 10% 2,70 million / week

--------------------------------------------------------------------------------

27 million € / week = 4 mill.€/day

Semiconductor fabs are not ! personnel

cost intensive !

Equipment must be profitable ! again:

see previous pages

from various company reports

9. OEE

9.1 Intro

ICM, 9 - 11


4-Partner Model

Single partner availability

and synchronization

OEE deals with

the increase of productivity

of equipment

The Goal of Overall Equipment Efficiency OEE

Operator, 90%

Tool, 80%

WIP, 85%

Process, 85%

Analysis of the synchronization degree

Increase of availablity of the single partners

Increase of synchronization

Increase of availability of the worst partner

new loop

Optimization strategy:

9. OEE

9.1 Intro

ICM, 9 - 12



9.1 Introduction


9.3 Semi-Standards

9.4 SEMI-E10



ICM, 9 - 13


Leading Equipment Manufacturer

During the years not many changes in the top 10 equipment suppliers

9. OEE

9.2 Tool Manufacturers

ICM, 9 - 14


Company Value [Mill.€]

(total assets *)

Employees Revenue 2007

[Mill. $US]

EU / US /Asien % Growth %

(1998-2001)

Applied Materials, USA

http://www.appliedmaterials.co

m/investors/fundamentals.html

9´700 14´000 8´400 34 %

All tools (with exception of lithography, cleaning), metrology tools, consulting

Tokyo-Electron, Japan

www.tel.co.jp

4´400 9´500 5´100

coater/developers, furnaces, dry etchers, CVD and PVD systems, wet cleaning systems, and test systems

ASML, NL

www.asml.com

7´100 6´200 4´500 44 %

Equipment for lithography, CVD, oxidation

KLA-Tencor, USA

www.kla-tencor.com

3´600 6´000 2´700 %

Global over 50% of all metrology tools, CMP, etch, lithography

LAM Research, 1´700 2´400 1´600 59 %

Etching Systems

Advantest, Japan

www.advantest.co.jp/

2´800 3´700 1´900

Electron beam lithography, IC-Test systems

Novellus, USA

www.novellus.com

1´800 3´700 1´700 26 %

CVD, PVD,

Most companies values can be found with: http://finance.google.com/

* Assets: counting the value of all existing things (money, area, buildings, cars, inventory, ..)

But because the company is creating money and the development is taken into account and the number of existing stocks

the companies´ market values usually is a factor 2-3 higher than total assets (see numbers on next page)


2007

9. OEE


ICM, 9 - 15


Company Value [Mill.€] Employees Revenue 2001

[Mill.€]

EU / US /Asien % Growth %

(1998-2001)

Applied Materials, USA

www.appliedmaterials.com

47´000 17´000 7´340 15 / 29 / 56 22 %

All tools (with exception of lithography, cleaning), metrology tools, consulting

KLA-Tencor, USA

www.kla-tencor.com

14´000 6´400 2´100 19 / 34 / 47 22 %

Global over 50% of all metrology tools, CMP, etch, lithography

ASML, NL

www.asml.com

13´000 7´000 1´800 15 / 28 / 48 33 %

Equipment for lithography, CVD, oxidation

Novellus, USA

www.novellus.com

8´500 3´000 1´300 1 / 79 / 21 37 %

CVD, PVD,

Aixtron, D

www.aixtron.com

1´300 500 240 41 / 16 / 43 63 %

MOCVD (for compound semiconductors)

SEZ, A

www.sez.com

700 450 130 20 / 19 / 61 60 %

wet-chemical cleaning, spin-coater

Semitool, USA

www.semitool.com

340 1´100 250 26 / 36 / 16 12 %

wet-chemical cleaning, Electroplating

Emcore, USA

www.emcore.com

360 870 180 6 / 52 / 42 62 %

tools for compound semiconductors, manufacturer of compound semiconductor devices

source: various company reports 2001


2001 Historic values to compare:

9. OEE


ICM, 9 - 16


International SEMATECH, (SEmiconductor MAnufacturing TECHnology), headquartered in Austin, Texas, USA

is a global consortium of leading semiconductor manufacturers that represent about 50% of the world’s semiconductor production.

(e.g. AMD, Hewlett-Packard, Infineon, IBM, Intel, Motorola, Philips, TSMC, and Texas Instruments).

SEMATECH was founded in 1986 as a cooperation of 14 US semiconductor manufacturers, supported by the U.S. government, to

strengthen the position of U.S. semiconductor industry (Japan, Taiwan, Korea gained market leadership). By cooperation resources and risks

should be shared, industry infrastructure should be improved, and particularly a support of domestic equipment suppliers should be forced.

In 1994 the support of the U.S. government ended, SEMATECH had to look for global funding.

In 1995 SEMATECH founded the so-called "International 300mm-Initiative I300I" together with 6 US companies and 7 non-US companies to

develop tools, standards and specifications.

In 1998 SEMATECH renamed itself in International SEMATECH.

The goal of SEMATECH still remains the same: to coordinate semiconductor manufacturers and equipment suppliers to solve common

challenges and to guaranty the existence and prosperity of semiconductor industry. www.sematech.org/public/index.htm

SEMI (Semiconductor Equipment and Materials International)

represents about 2´500 equipment manufacturers and material suppliers of semiconductor and flat-panel industry.

SEMI was founded in 1970 to strengthen the members by corporate appearance (e.g. at exhibitions like SEMICON)

and concerted action.

The members occupy an annual market volume of about 20´000 Mill.€

(semiconductor manufacturers about 200´000 Mill.€).

Two Leading Organisations

introducing many equipment standards

http://www.semi.org/

http://www.sematech.org/

9. OEE


ICM, 9 - 17



9.1 Introduction


9.3 Semi-Standards

9.4 SEMI-E10



ICM, 9 - 18


Around 1995 the semiconductor industry recognized, that further growth could only be achieved by increasing wafer size from

200mm to 300 mm. For this task new process tools had to be developed. At the same time the investment costs of a semi-

conductor fab (mainly due to equipment costs) touched the financial limit of single companies.

To avoid this danger co-operations and consortia (like SEMATECH, SEMI) were founded or boosted,

in addition possibilities to improve productivity (more working chips for less costs) were investigated.

During the investigations for productivity it was found, that a lot of the very expensive fabrication tools of a semiconductor fab

were only used less than 50% of time for production of sellable chips. For the improvement of this low productive time

a measurement standard had to be developed, which defines the status of each tool and also could be controlled automatically.

Initiated by SEMI these standards and specifications were developed and defined in so-called E(quipment)-Standards.

1997 1998 1999 2000

Definition of tool status to calculate

availability and reliability

Definition of data interface tool and computer (RS-232, TCP/IP)

1995

Definition of control commands between tool and computers

E35 Cost of Ownership

Definitions and calculations for tool productivity

E10 E58

E4, E5

E30

Tool status

management

SEMI-Standards for Measurement of Tool Productivity

year

2001 2002

E116

Automated Equipment Performance Tracking

(= data exchange with computer and software) E79

Tool productivity and

cost management

Tool communication

management

9. OEE

9.3 SEMI-Standards

ICM, 9 - 19


operator

(assist)

material (waiting)

load locks

Example for Equipment Status

Typical process flow:

1 wafer input

2 wafer loading on stage

3 process (implantation)

4 wafer unload from stage

5 wafer output

Typical semiconductor equipment: implantation tool

process control

for these basic processes several status commands must be controlled

tool

signals:

red/white = tool breakdown

yellow = tool stand-by

green = tool working

9. OEE

9.3 SEMI-Standards

ICM, 9 - 20


Standby:

Waiting for operation

Example for the definition of technical conditions within a tool:

For the calculation of productivity first must be done:

1. within the tool all possible statuses must be defined

2. these statuses must be reported to external user (data interface, operator, computer)

Because standards were defined in 2000 still tools exist without these requirements

operator loads

wafer by hand

stand-by

ready for loading

wafers loaded in load lock

wafers on transport disk load

implant implant in hold

disk stop waiting for unload

disk unload

disk unloaded wafers in load lock

assist in

disk loaded

Example for Equipment Status

beam adjust

assist out

9. OEE

9.3 SEMI-Standards

ICM, 9 - 21


Source: Sematech, I300Iand J300 E Global Joint Guidance Document, 1997

Need for Standards in a 300 mm Fab

Due to wafer transport automation a lot of new standards had to be defined for new 300 mm fabs

9. OEE

9.3 SEMI-Standards

ICM, 9 - 22



9.1 Introduction


9.3 Semi-Standards

9.4 SEMI-E10



ICM, 9 - 23


The task of the SEMI-E10 Standard is the definition of the various operating statuses as a time model

Non Scheduled Time

(Nichtbetriebszeit)

* holidays


shutdowns

* training



Unscheduled

Down Time

(ungeplante

Nichtbereitschaft)

* run out

op.material

* out of specs

* Repair

Scheduled

Down Time

(geplante

Nichtbereitschaft)

* maintenance

* maintanence delay

* Material refill

* set-ups

Up Time (bereit)

Engineering Time

(...)

* process tests

* software tests

* experiments

Manufacturing Time

(Produktionszeit)

Productive Time

(Produktive Zeit)



* rework

* engineering runs

Standby Time

(Wartezeit)

* no operator

* no product

* no support

Machine works

(=productive time)

Family in holidays

(non scheduled time)

Machine empty

(=stand-by)

New washing powder

(=engineering)

Refill salt

(maintenance)

Switch defect

(unscheduled)

The SEMI-E10 Standard 9. OEE

9.4 SEMI-E10

ICM, 9 - 24


Manufacturing Execution

System (MES)

(knows a lot:

where is which lot,

what is about the support,...)

Using the known informations in E10 status will be defined,

which describe the production status of the tool

-> 6 main statuses with sub-states

with this informations calculations of productivity can be performed (E79)

the tool informs about its status

the computer system adds additional informations

From SEMI-E10 to SEMI-E79 (OEE)

Non Scheduled Time

(Nichtbetriebszeit)

* holidays


shutdowns

* training



Unscheduled

Down Time

(ungeplante

Nichtbereitschaft)

* run out

op.material

* out of specs

* Repair

Scheduled

Down Time

(geplante

Nichtbereitschaft)

* maintenance

* maintanence delay

* Material refill

* set-ups

Up Time (bereit)

Engineering Time

(...)

* process tests

* software tests

* experiments

Manufacturing Time

(Produktionszeit)

Productive Time

(Produktive Zeit)



* rework

* engineering runs

Standby Time

(Wartezeit)

* no operator

* no product

* no support

9. OEE

9.4 SEMI-E10

ICM, 9 - 25



9.1 Introduction


9.3 Semi-Standards

9.4 SEMI-E10



ICM, 9 - 26


Using the E10-states the productive time as a parameter of productivity or efficiency can be determined.

But for an absolute calculation the time value efficiency is not sufficient, because it may be possible, that the tool is working

for production, but much too slow. For this reason with an additional E79-standard efficiency losses are defined.

SEMI E79 :

* uses E10 as a base for time recording

* defines efficiency losses on a time base

* defines with this efficiency losses an Overall Equipment Efficiency (OEE)

* is applicable also for complexe equipment (Cluster-tools)

Productive Time

Standby

Engineering

Unscheduled Down Time

Scheduled Down Time

Non Scheduled Down Time Availability Efficiency Losses

(Verfügbarkeitsverluste)

Operational Efficiency Losses

(Betriebsverluste)

Rate Efficiency Losses

(Durchsatzverluste)

Quality Efficiency Losses

(Qualitätsverluste)

Theoretical productive time

for effective tools

Performance

Efficiency

Losses

(Leistungs-

verluste)

E10 time states E79 efficiency losses

To

tal T

ime

up

tim

e

Overall Equipment

Efficiency, OEE

*time based

(zeitbasierend)

Overall Equipment

Efficiency, OEE

* loss based

(verlustbasierend)

The SEMI-E79 Standard (Overall Equipment Efficiency OEE) 9. OEE

9.5 SEMI-E79

ICM, 9 - 27


timetotal

uptimeAEEfficiencytyAvailabili

timeproductionactual

unitsactualfortimeproductionltheoreticaREEfficiencyRate

unitsactualfortimeproductionltheoretica

unitseffectivefortimeproductionltheoreticaRQQualityofRate

Salt must be refilled

-> E10: scheduled down

but no salt available -> maintenace delay

-> E79: availability loss

cleaning time too long,

because temperature

sensor defect

-> E10: productive

-> E79: throughput loss

Machine filled, but forgotten

to start

-> E10: standby

-> E79: operational loss

Machine worked,

but dishes not clean,

cannot be used

-> E10: productive

-> E79: quality loss

Definitions for Equipment Efficiency 9. OEE

9.5 SEMI-E79

timeup

timeproductionOEefficiencylOperationa

ICM, 9 - 28


Overall Equipment Efficiency

Definition following SEMI - E 79

OEE = Availability

Efficiency

Operational

Efficiency

Rate

Efficiency

Rate of

Quality x x x

OEE = Availability

Efficiency

Performance

Efficiency

Rate

Efficiency x x

OEE = Theoretical time for effective tools

Total Time

Definitions of Overall Equipment Efficiency OEE 9. OEE

9.5 SEMI-E79

ICM, 9 - 29


Example:

In a cluster-tool for metal deposition two processes A,B are performed.

For calculation of OEE using E10 the following times (and processed wafers) are recorded:

Load

lock

A

B

Non Scheduled Time

(Nichtbetriebszeit)

* holidays


shutdowns

* training



Unscheduled

Down Time

(ungeplante

Nichtbereitschaft)

* run out

op.material

* out of specs

* Repair

Scheduled

Down Time

(geplante

Nichtbereitschaft)

* maintenance

* maintenance delay

* Material refill

* Setups

Up Time (bereit)

Total Time 1 week = 7 days = 168 h

0 h

10h

4h

2h

12h

8h

Engineering Time

(...)

* process tests

* software tests

* experiments

Manufacturing Time

(Produktionszeit)

Productive Time

(Produktive Zeit)


* rework

* engineering runs

Standby Time

(Wartezeit)

* no operator

* no product

* no support

5h

24,6h

20,4h 427 w A

68,7h 1033 w B

3h 47 w A

5,6h 65+3w B

4,7h 97+2w A

0h 0w B

The theoretical process times are due to the equipment supplier: A: 2.5min/wafer und B: 3.3 min/wafer

68 wafer processed,

but 3 are scrap

99 wafer processed,

but 2 are scrap

Example for Calculation of OEE

cluster tool

of all wafers = 1´674

h: hours

w: wafers

9. OEE

9.5 SEMI-E79

ICM, 9 - 30


timetotal

uptimetyAvailabili %,

h

h

h

h,h,h

timetotal

uptimetyAvailabili 678

168

132

168

62441025

%,,min

min

hmin/hh,h,h,hh,

waferwafermin/.waferwafermin/.REEfficiencyRate 4828240

6144

5065

60065768743420

068103333994742752

n

processesall

n

n

processesall

nn

timeproduction

wafersofnumberRCT

timeproductionactual

timeproductionltheoreticaREEfficiencyRate

processesall

n

processesall

n

timeproductiondbytanstime.eng

timeproduction

timeup

timeproductionOEefficiencylOperationa

%,,

h,h,h,h

h,h,OEEfficiencylOperationa 6777760

3741286245

374128

ocessedPrWafersTotal

scrapreworkedocessedPrWafersTotalQualityofRate

%,.QualityofRate 89292801674

3652471674

OEE = Availability

Efficiency

Operational

Efficiency

Rate

Efficiency

Rate of

Quality x x x

OEE = 0,78 * 0,82 * 0.77 *0.93 = 0.46 = 46% !!

Example for Calculation of OEE 9. OEE

9.5 SEMI-E79

ICM, 9 - 31


Computer Assisted Manufacturing CAM for OEE

From the reported tool states and the information from the computer system (MES) the productivity

can be calculated for single tools and for complete tool groups by software.

9. OEE

9.5 SEMI-E79

ICM, 9 - 32



9.1 Introduction


9.3 Semi-Standards

9.4 SEMI-E10



ICM, 9 - 33


E124

FAB productivity and

cost management

From SEMI-E79 (OEE) to SEMI-E?? OFE

With SEMI-E79 the productivity of the equipment can be calculated.

But in a semiconductor fab the tools are not working isolated, they must be supported (infrastructure = electricity, clean water,

clean air, computer system, ...).

Disposals are created, which must be handled, and also additional equipment (support = transport system, metrology and

analysis instruments) exists.

All these supporting systems consume money, can break down and reduce productivity of the fabrication tools.

It suggests itself using the Overall Equipment Efficiency OEE to develop an Overall Factory Efficiency OFE.

1997 1998 1999 2000

Definition of tool status to calculate

availability and reliability

Definition of data interface tool and computer (RS-232, TCP/IP)

1995

Definition of control commands between tool and computers

E35 Cost of Ownership

Definitions and calculations for tool productivity

E10 E58

E4, E5

E30

Tool status

management

year

2001 2002

E79

Tool productivity and

cost management

Tool communication

management

Provisional Guide 2003

9. OEE

9.6 OEE to OFE

ICM, 9 - 34


Bottom Up Approach - Facilities and Production Model:

Equipment

States idle

prod

down

Process

Equipment

Process

Area

Diffusion

Wet Etch CMP

Ion Implant

Production Supply Disposal

Fab

Method for Overall Factory Efficiency Development

T. Vonderstrass, E. Mueller ( M+W Zander)

9. OEE

9.6 OEE to OFE

ICM, 9 - 35


EP-400-3P

UPW supplyPCW supply

IPA

cleanroom air

CDA

HP-N2acid exhaust

wafer out

wafer in

UHP-O2

H2O2

HCl

HF

NH4OH

city water

EP-208-3P

cleanroom air

general exhaust

solvent exhaust

UPW return

PCW return

service

cleanroom air

CDA

UHP-O2

HP-N2

H2O2

HCl

HF

IPA

NH4OH

PCW supply

UPW supply

city water

EP-208-3P

EP-400-3P

cleanroom air

acid exhaust

general exhaust

solvent exhaust

PCW return

service

0.00 $

0.00 $

0.00 $ 0.12 $

48.44 $

0.00 $

212.24 $

0.00 $

411.09 $

97.46 $

0.00 $

2116.20 $

403.72 $

515.16 $

438.79 $

0.70 $

13.67 $

10.72 $

0.00 $

0.00 $

0.00 $

19.64 $

0.00 $

0.00 $

23.00 $

21.81 $

46.67 $

57.82 $

0.00 $

0.00 $

0.00 $

0.00 $

18.36 $

191.30 $

8.19 $

41.47 $

49.77 $

8.80 $

1.87 $

22.24 $

0.28 $

16.13 $

0.00 $

Standby

Production

E4 Technologies

disposal chemicals IPA


PWW-HF-SO4

0.00 $

48.97 $

853.42 $

PWW-HF-SO4491.01 $

UPW hot supply 163.82 $

Wet Bench W 3.1 - W 3.9

UPW hot supply 211.22 $

Cost input for one special tool:

Different costs

for stand-by and production



9. OEE

9.6 OEE to OFE

ICM, 9 - 36


PCW supply

cleanroom air

IPA

EG

HF

UPW supply

EKC

H2O2

NH4OH-2

UPW hot supply

EP-400-3P

H2SO4

wafer in

CDA

HP-N2

disposal chemicals H2SO4

UPW hot return

acid exhaust

caustic exhaust

solvent exhaust

PWW-HF-SO4 free

PCW return

UPW return

PWW-UPW-recycling

disposal chemicals EKC


disposal chemicals EG

wafer out

cleanroom air

PWW-As-acid

general exhaust

UHP-O2

HCl

city water

CO2

0.00 $

205.79 $

198.01 $

141.42 $

10813.08 $

1664.69 $

2708.16 $

296.01 $

557.35 $

1210.92 $

66.21 $

1740.00 $

505.50 $

260.86 $

0.00 $

377.83 $

5.13 $

0.28 $

309.51 $

301.57 $

51.39 $

79.30 $

0.00 $

787.82 $

1524.33 $

0.00 $

0.00 $ 494.56 $

260.57 $

40.02 $

0.02 $

79.16 $

52.08 $

499.06 $

model parameter

EP-220-1P

EP-208-3P

disposal chemicals HF-NH4F

1.12 $

8.89 $

127.55 $

6.58 $

0.00 $

0.00 $

BHF

BOE

328.57 $

328.57 $

UHP-N238.97 $

H3PO4

disposal chemicals H3PO4

400.52 $

10.82 $

process waste water- final rinse0.00 $

PWW-HF-SO4

Wet Processes

Cost input for several tools in a process modul:



9. OEE

9.6 OEE to OFE

ICM, 9 - 37


Die Attach and Wire Bonding

PCW supply

cleanroom air

IPA

EG

HF

UPW supply

EKC

H2O2

NH4OH-2

UPW hot supply

EP-400-3P

H2SO4

wafer in

CDA

HP-N2


UPW hot return

acid exhaust

caustic exhaust

solvent exhaust

PWW-HF-SO4 free

PCW return

UPW return

PWW-UPW-recycling




wafer out

cleanroom air

CDA

EP-208-3P

wafer in

wafer out

cleanroom air

cleanroom air

general exhaust

cleanroom air

wafer out

wafer in

PCW return

CDA

cleanroom air

SF6

HP-N2

P-N2

UHP-Ar

PCW supply

EP-400-3P

EP-208-3P

wafer in

wafer out

CDA

cleanroom air

UPW supply

PCW supply

EP-208-3P

general exhaust

PWW-UPW-recycling

PCW return

wafer in

wafer out

cleanroom air

PWW-As-acid

HCl (gas)

EP-220-1P

C2F6

general exhaust

UHP-O2

HCl

UHP-N2

cleanroom air

HP-N2

city water

cleanroom air

CDA

slurry B

slurry A

UPW supply

PCW supply

EP-208-3P

NH4OH-1

EP-400-3P

wafer in

caustic exhaust

PWW/CMP inorg

PWW/CMP org

UPW return

PCW return

cleanroom air

wafer out EP-220-1P

cleanroom air

HP-N2

UHP-N2

UHP-O2

UHP-Ar

UHP-H2

AsH3-H2

HCl (gas)

NH3

SiH2Cl2

PCW supply

EP-208-3P

acid exhaust

general exhaust

cleanroom air

PCW return

wafer in

wafer out

PCW return

general exhaust

cleanroom air

wafer in

wafer out PCW supply

CDA

UHP-N2

HP-N2

P-N2

UHP-O2

UHP-Ar

UHP-H2

BCl3

C4F8

CH4

CHF3

Cl2

CO

CO2

HBr

HCl (gas)

He/O2

N2O

N2O

NF3

NH3 SF6

EP-208-3P

cleanroom air

UHP-He

EP-220-1P

HP-N2

F2-Kr-Ne

Kr-Ne

PGMEA

TMAH-2

TMAH-1

UHP-He

disposal chemicals PR

cleanroom air

PWW TMAH

0.00 $

205.79 $

198.01 $

141.42 $

10813.08 $

1664.69 $

2708.16 $

296.01 $

557.35 $

1210.92 $

66.21 $

1740.00 $

505.50 $

260.86 $

0.00 $

377.83 $

5.13 $

0.28 $

309.51 $

301.57 $

51.39 $

79.30 $

0.00 $

787.82 $

1524.33 $

0.00 $

0.00 $

0.00 $ 13.90 $

138.49 $

1.55 $ 0.00 $

46.33 $

0.00 $

0.00 $

2.48 $

19.62 $

2.44 $

494.56 $

260.57 $

0.00 $

0.00 $

64.93 $

124.10 $

68.95 $

217.59 $

32.77 $

478.58 $

119.06 $

0.00 $

158.21 $

0.00 $

0.00 $

40.02 $

0.02 $

79.16 $

52.08 $

499.06 $

20.25 $

31.00 $

12.00 $

9.25 $

236.22 $

49.75 $

29.48 $

1017.02 $

7.16 $

91.80 $

8.34 $

0.00 $ 9.54 $

30.61 $

0.00 $

12.95 $

56.09 $

193.96 $

0.00 $

0.00 $

273.11 $

1953.80 $

44.03 $

46.36 $

2.65 $

10.38 $

4.13 $

0.82 $

54.05 $

17.11 $

460.32 $

415.46 $

809.35 $

144.31 $

0.00 $

0.00 $

0.60 $

286.46 $

143.68 $

399.47 $

53.98 $

4.64 $

0.00 $

0.00 $

36.63 $

9.28 $

76.93 $

107.90 $

6.78 $

516.91 $

484.23 $

8588.40 $

34.24 $

508.78 $

815.14 $

54.04 $

29.15 $

24.91 $

1.90 $

25.30 $

192.13 $

15.58 $

49.34 $

PWW-HF-SO4

general exhaust

CF4

cleanroom air

H2-N2

P-N2

CDA

UHP-N2

UHP-O2

PCW supply

EP-208-3P

cleanroom air

general exhaust

PCW return

wafer in

wafer out

IPA

UPS-240-1P

EP-220-1P

PCW return

UHP-Ar

UHP-N2

CDA

HP-N2

PCW supply

EP-208-3P

model parameter

model parameter

model parameter

model parameter

HP-N2

P-N2

UHP-Ar

UHP-He

PCW supply

EP-400-3P

PCW return

general exhaust

model parameter

SiH2Cl2

WF6

B2H6-N2

PH3-H2 SiH4

SiH4

model parameter

model parameter

model parameter

UHP-He

UHP-O2

CF4

UPW supply

NF3

CH3F

SiF4

model parameter

EP-220-1P

EP-208-3P

disposal chemicals HF-NH4F

solvent exhaust

UPW return

81.60 $

18.13 $

3.67 $

3.05 $

316.97 $

0.08 $

7.25 $

2.41 $

1.54 $

92.01 $

127.68 $

0.00 $

0.00 $

12.31 $

3.70 $

50.21 $

5936.27 $

0.58 $

4.43 $

56.68 $

1.92 $

1.10 $

0.01 $

0.42 $

155.02 $

203.47 $

80.01 $

0.00 $

0.00 $

0.00 $

0.00 $

0.04 $

14.37 $

29.83 $

0.00 $

0.00 $

387.08 $

478.78 $

138.93 $

169.78 $

0.00 $

759.66 $

531.36 $

57.70 $

3.04 $

306.45 $

1712.17 $

252.12 $

50.07 $

0.00 $

78.62 $

0.00 $

48.06 $

5.69 $

0.30 $

1.13 $

4.81 $

10.37 $

62.91 $

29.70 $

306.19 $

68.86 $

257.49 $

0.25 $

51.71 $

23.49 $

3.65 $

39.56 $

0.67 $

0.16 $

156.34 $

4012.38 $

23.67 $

1.38 $

391.45 $

0.07 $

202.22 $

3.87 $

3.84 $

1.12 $

8.89 $

127.55 $

6.58 $

0.00 $

0.00 $

125.35 $

4986.70 $

2066.12 $

7.15 $

28.52 $

0.00 $

0.00 $

BHF

BOE

disposal chemicals poly

EP-220-1P

PCW supply

cleanroom air

PCW return

model parameter

cleanroom air

general exhaust

model parameter

cleanroom air

CDA

EP-208-3P

EP-400-3P

328.57 $

328.57 $

0.00 $

2.91 $

6.06 $

65.49 $

30.40 $

2.99 $

0.00 $

1288.66 $

toxic exhaust

TEOS

TEAS

toxic exhaust

2.63 $

135.88 $

2207.79 $

56.95 $

poly

QZ

UHP-N2

PR-1

PR-2

PR-3

PR-4

PR-5

PR-DUV-1

PGMEA (DUV)

PR-DUV-2

PR-DUV-3

AsH3

BF3

PH3

C6H15BO3

TEPO

TEOS

toxic exhaust

2929.08 $

25026.28 $

38.97 $

1586.42 $

1155.33 $

355.07 $

1666.29 $

918.59 $

6660.87 $

953.58 $

347.43 $

6025.12 $

20.21 $

1420.24 $

869.19 $

395.13 $

300.94 $

27.49 $

1985.99 $

H3PO4


Al-Cu targets

Ti-targets solid waste Ti targets

toxic exhaust

400.52 $

10.82 $

2262.88 $

3269.39 $ 0.00 $

1409.28 $

general exhaust

UPW return

48.04 $

0.00 $

process waste water- final rinse 0.00 $

PCW return

PCW supply

UPW supply

P-N2

P-N2

PWW grinding

PWW dicing

2.75 $

1.79 $

31.96 $

15.01 $

22.12 $

22.02 $

L-N2

PCW supply

EP-208-3P

EP-400-3P

cleanroom air

PCW return

model parameter

CDA

EP-208-3P

cleanroom air

model parameter

EP-400-3P

PCW supply

cleanroom air

PCW return

model parameter

UPW supply

UPW hot supply

PWW-UPW-recycling

PWW-HF-SO4

PWW-HF-SO4

81.84 $

274.49 $

103.85 $

191.23 $

580.61 $

238.73 $

223.33 $

0.00 $

25.00 $

590.42 $ 0.00 $

49.33 $

13.04 $

14.36 $

32.60 $

1.57 $

13.68 $

31.58 $

0.00 $

0.00 $

PCW return PCW supply 182.61 $

170.84 $

209.97 $

Production Support

Backend

slurry C 1278.40 $

Diffusion Implant PECVD

Wet Processes Lithography

CMP Dry Etch

Asher Sputter

Transport System

Parts Cleaning

Final testing

Wafer Test

Die Separation (Dicer/Grinder)

Packaging

cleanroom air

CDA

EP-400-3P

leadframe

cleanroom air

bonding wire

chip

model parameter

cleanroom air

EP-400-3P

cleanroom air

chip

model parameter

CDA

molding press paste

general exhaust

solid waste molding press paste

grinding disc solid waste grinding disc

solid waste sawing blades sawing blades

EP-220-1P

cleanroom air cleanroom air

model parameter

405.53 $

2.67 $

0.00 $

6.91 $

6.66 $

107.52 $

0.00 $

0.00 $

0.85 $

2.25 $

2048.20 $

16.36 $

2.04 $

0.88 $

0.00 $

0.00 $

0.00 $

319.14 $ 0.00 $

33.99 $ 0.00 $

73.73 $

0.00 $ 99.55 $

0.00 $

EP-208-3P 29.49 $

solid waste Al-Cul targets

0.84 $

0.00 $

Metrology

1.36 $

74.37 $

68.86 $

1.31 $

0.00 $

CDA

wafer in

wafer out

0.00 $

0.00 $

wafer in

wafer out

0.00 $

0.00 $

wafer in

wafer out

0.00 $

0.00 $

die in

die out

0.00 $

0.00 $

die in

die out

die in

die out

0.00 $

0.00 $

0.00 $

0.00 $

Cost input for all process modules in a FAB



9. OEE

9.6 OEE to OFE

ICM, 9 - 38


0.00 $ 0.00 $

0.00 $

1.30 $ 1.30 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

supply air

Process Cooling Water System

(PCW)

Process Vacuum System

Compressed Dry Air System

(CDA)

Make-up Air System Recirculation Air System

UHP-O2 and P-O2

HP-N2 and P-N2 UHP-N2

UHP-Ar

UHP-He

UHP-H2

Pretreatment

UPW hot

Heating System

UPS

Polishing City Water

Ultrapure Water System

(UPW)

Electrical Supply

Air Handling

Bulk Gas Supply System

electricity 20kV

electricity 20kV

city water

natural gas

outside air

L-H2

He

L-Ar

L-O2

L-N2

raw water

P-O2 (facilities)

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

PCW supply

PCW supply

heating 55°C - supply system 55/25

heating 25°C -

return system 55/25

heat recovery N2 generation

supply air

PCW return

PCW return

HP-N2

HP-N2

PCW supply

PCW return

supply air

heating 55°C -

supply system 55/25 heating 25°C -

return system 55/25

UPW to UPW hot

P-N2

P-N2


heating 25°C - return system 55/25

EF-400V

P-N2

exhaust

exhaust

exhaust

exhaust

exhaust

exhaust

exhaust

exhaust

exhaust

PCW return

exhaust

exhaust

heat recovery PCW to make-up air system

heat recovery PCW of make up air system

heat recovery PCW

to make-up air system heat recovery PCW

of make up air system

exhaust

UPW to UPW polishing

EF-220V

EF-220V

EF-6.6kV

EF-6.6kV

exhaust

Chiller System and

Cooling Towers

cold water 18°C return system 12/18

cold water 11°C - return 5/11

recooling 31°C return system 31/25

CW return system (heat recovery)

cold water 12°C supply system 12/18


recooling 25° C - supply 31/25




cold water 12°C

supply system 12/18 cold water 18°C

return system 12/18 cold water 18°C

return system 12/18

cold water 12°C

supply system 12/18

CW return system (heat recovery)




cold water 5°C

supply system 5/11 cold water 11°C -

return 5/11

process vacuum to general exhaust

Process Waste Water Treatment

(PWW)

exhaust

PWW/HF-SO4

waste water

PWW/HF-SO4 free

UPW recycling

UPW recycling

UPW recycling

DI water supply

General Exhaust

Acid Exhaust (EXA)

Caustic Exhaust (EXC)

Solvent Exhaust (EXS)

Toxic Exhaust (EXT)

P-O2 (facilities)

natural gas

DI water supply PWW/HF-SO4

waste water

general exhaust (heat)


general exhaust (mass)

DI water supply

DI water supply



exhaust

process vacuum

to general exhaust


recooling 25° C -

supply 31/25


recooling 25° C -

supply 31/25


heat recovery - CDA

heat recovery N2 generation

heat recovery - CDA

heat recovery CDA (heat difference)

heat recovery

N2 generation

(heat difference)

heat recovery

N2 generation

(heat difference)

heat recovery CDA (heat difference)

waste water



heating 55°C - return system 80/55

heating 55°C -

return system 80/55

PWW/HF-SO4 free

PWW/HF-SO4 free

Light and Transport

CDA

cleanroom air

to production

P-N2 to production

HP-N2 to production

UHP-N2 to production

UHP-O2 to production

UHP-Ar

UHP-He to production

UHP-H2 to production

EP-208V-3P

EP-220V-1P

EP-400V-3P

UPS-220V-1P

PCW supply to production

UPW supply

UPW hot supply

city water

gases

in cleanroom air

EXA

EXC

general exhaust

EXS

EXT

PCW return from production

UPW return

UPW hot return

PWW/As

PWW /TMAH

PWW/HF-SO4 free

PWW/HF-SO4

PWW/UPW recycling

PWW/CMP org

PWW/CMP inorg

process waste water final rinse

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

EF-400V

PCW return

PCW supply

PCW supply

DI water supply

PWW/HF-SO4

PWW/HF-SO4

waste water to cooling towers

waste water to cooling towers

divergency

waste water


heating 25°C -

return system 55/25

heat

heat and water

difference

in outside air

heat difference raw water

excess heat and

water in outside air

Support

UPS-400V

UPS-400V

city water

city water UHP-O2 (facilities)

UHP-O2 (facilities)

H2 (facilities)

H2 (facilities)

EXA (heat)

EXS facilities

EXA (mass)

EXA (mass)

PWW/dicing

PWW/grinding

DI water supply

22919.30 $

21640.18 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

472.76 $

0.00 $

0.00 $ 0.00 $

0.00 $

4734.58 $

842.32 $

842.32 $

0.00 $

0.00 $

39.82 $

4815.04 $

0.00 $

1287.97 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

109.33 $

0.00 $

19.64 $

89.68 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.14 $

0.00 $

0.00 $

0.00 $

380.39 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

9280.53 $

0.00 $

0.00 $

0.00 $

0.00 $

69.35 $

0.00 $

0.00 $

0.00 $

0.00 $

1.73 $

1194.17 $

0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

1329.73 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

3883.67 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

28.82 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

3858.43 $

1349.13 $

5005.80 $

904.31 $

15336.64 $

1803.86 $

548.98 $

303.38 $

11451.67 $

12380.49 $

1013.79 $

0.00 $

0.00 $

0.00 $

1329.73 $

576.19 $

3883.67 $

6789.08 $

1454.08 $

9149.14 $

0.08 $

76.54 $

6708.71 $

4000.91 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

380.25 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 4537.25 $

0.00 $

29526.69 $

0.00 $ 0.00 $

3184.12 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

3430.31 $

0.00 $

0.00 $ 0.00 $

0.00 $ 0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $ 730.25 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

1803.22 $

0.00 $

109.74 $

108.73 $

0.00 $

0.00 $ 0.00 $

45.35 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

waste heat (waste water)

0.00 $

0.00 $

waste water

exhaust

125.29 $

0.00 $

cleanroom air

to vacuum

cleanroom air to vacuum

967.36 $

1.30 $

1.30 $ 1.30 $

exhaust

exhaust

exhaust

Air Handling Facilities

exhaust

cold water 12°C

supply system 12/18

heating 55°C -

supply system 55/25

excess heat and

water in outside air

heat and water

difference

in outside air

outside air

EF-400V

EF-400V

heating 25°C -

return system 55/25


0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

exhaust 0.00 $

0.00 $

circulation air

to support

circulation air return

from support

cleanroom air

to support

202.50 $

0.00 $

waste heat

waste heat

0.00 $ 0.00 $

0.00 $

Air Handling Support

circulation air

to production

circulation air

to production


EXA (mass)

EXC (mass)

EXT (mass)

EXS facilities circulation air to support

cleanroom air to support

104.24 $

0.00 $

0.00 $

0.00 $

617.97 $

0.00 $

1803.22 $

202.50 $

0.00 $

0.00 $

waste water 2443.80 $

N2 0.00 $

0.00 $

0.00 $

Exhaust

0.00 $

0.00 $

0.00 $

Electricity

Production (EP)

Electricity

Facilities (EF)


Facilities



from support


from production


from production

0.00 $

0.00 $

Cost input for all facilities



9. OEE

9.6 OEE to OFE

ICM, 9 - 39


PCW supply

PCW return

acid exhaust

caustic exhaust

general exhaust

solvent exhaust

PWW/As

PWW/TMAH

PWW/UPW recycling

PWW/HF-SO4 free

PWW/HF-SO4

PWW/CMP org

PWW/CMP inorg

BHF

EKC EG

H2O2

H2SO4

HCl HF IPA

NH4OH-2 NH4OH-1

PGMEA

slurry B

slurry A

BOE

TMAH-2

TMAH-1






UPW cold supply

UPW return

UPW hot supply

UPW hot return

compressed dry air

UHP-N2

HP-N2

P-N2

UHP-O2

UHP-Ar

UHP-He

UHP-H2

city water

AsH3/H2

BCl3

C2F6

C4H2F8

CF4 CH4

CHF3

Cl

CO

CO2

F2/Kr/Ne

HBr HCl

He/O2 Kr/Ne

H2/N2

NO

NF3

NH3

PH3/H2 SF6

SiH2Cl2 SiH4

C6H15BO3

TEPO

WF6

cleanroom air

cleanroom air

wafer in wafer out

Specialty Gases

Gases/Air Return

Chemicals

Chemicals and Solid Waste

Water

Water Return

Energy

Production BF3

AsH3

PH3

Al-Cu targets

Ti targets

solid waste Ti targets

PR-DUV-3

448.25 $

125.99 $

2166.57 $

205.82 $

210.51 $

10.87 $

709.88 $

68.07 $

4.13 $

29.70 $

306.19 $

68.86 $

574.45 $ 0.25 $

51.71 $

23.49 $

3.65 $

1.12 $

378.43 $

18.08 $

753.86 $

7.43 $

1022.98 $

309.51 $

301.57 $

51.39 $

260.57 $

1.90 $

39.56 $

532.85 $

0.16 $ 25.30 $

7.25 $

501.33 $

8744.74 $

88.29 $

3.04 $ 4012.38 $

766.77 $

2127.63 $

50.07 $

895.38 $

28.52 $

1736.00 $

0.02 $

15.58 $

0.00 $

787.82 $

1637.50 $

56.09 $

193.96 $

0.00 $

0.00 $

10813.08 $

1664.69 $

2708.16 $ 296.01 $

499.06 $ 557.35 $

1211.50 $

494.56 $ 8.34 $

125.35 $

5936.27 $

1017.02 $

4986.70 $

2066.12 $

3138.72 $

2090.35 $

518.55 $

8.89 $

2984.29 $

244.38 $

2760.42 $

model parameter

B2H6/N2

CH3F

SiF4

disposal chemicals HF/NH4F

759.66 $

23.67 $

1.38 $

0.00 $

0.00 $


4.43 $

328.57 $

328.57 $

0.00 $

toxic exhaust

TEOS

TEAS

3454.85 $

531.02 $

2207.79 $

poly

QZ

PR-1 PR-2 PR-3 PR-4 PR-5

PR-DUV-1

PR-DUV-2

PGMEA-DUV

H3PO4


25026.28 $

2929.08 $

1586.42 $ 1155.33 $

355.07 $

1666.29 $

918.59 $

6660.87 $

347.43 $

953.58 $

6025.12 $

1420.24 $

20.21 $

869.19 $

300.94 $

27.49 $

400.52 $

10.82 $

2262.88 $

3269.39 $

0.00 $

Facilities

PWW/final rinse

electricity 20kV

city water

raw water

L-N2

L-O2

L-Ar

He

H2

outside air

natural gas

waste water

exhaust

Gases/Air

heat difference in raw water

heat and water difference in outside air

heat and water

excess (air)

PWW/dicing

PWW/grinding

L-HP-N2

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

22.12 $

22.02 $

103.85 $

waste heat in waste water 0.00 $

UPS-240V-1P

EP-400V-3P

EP-220V-1P

EP-208V-3P

N2 (air) 0.00 $

additional transition

Exhaust and Waste Water

Disposal

Supply

Basic Supply Facilities

Other Material

0.00 $

slurry C 1278.40 $

leadframe

bonding wire

chip

molding press


grinding disc solid waste grinding disc

sawing blades

solid waste sawing blades

solid waste Al-Cu targets

Disposal Facilities

Supply Production

Disposal Production

>

<

Bulk Gases

Water

Energy

405.53 $

107.52 $

2048.20 $

0.00 $

319.14 $ 0.00 $

0.00 $

33.99 $

0.00 $ 0.00 $ 0.00 $

Facilities and Production

Cost input for the complete production and support



9. OEE

9.6 OEE to OFE

ICM, 9 - 40


outside air

heat and water difference (air)

heat and water excess

in outside air

L-N2

L-O2

L-Ar

He

H2

city water

raw water

heat difference in raw water

natural gas

E-20kV

AsH3/H2

BCl3

C2F6

C4F8

CF4

CH4

CHF3

Cl2

CO

CO2

F2-Kr-Ne

HBr

HCl

He-O2

Kr-Ne

H2-N2

NO

NF3

NH3

PH3-H2

SF6

SiH2Cl2

SiH4

WF6

B2H6/N2

CH3F

SiF4

BF3

AsH3

PH3

C6H15BO3

TEOS

TEPO

TEAS

EKC

EG

H2O2

H3PO4

H2SO4

HCl

HF

PR-DUV-1

PR-DUV-2

PGMEA-DUV

PR-DUV-3

PR-1

PR-2

PR-3

PR-4

PR-5

IPA

NH4OH-2

NH4OH-1

Al-Cu targets

Ti targets

PGMEA

slurry A

slurry B

slurry C

TMAH-2

TMAH-1

BHF

BOE

poly

QZ3501

L-HP-N2

exhaust

waste water

waste heat (waste water)

disposal chemical EKC







disposal chemicals HF/NH4F

solid waste Ti targets

model parameter

wafer in

wafer out

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

4.13 $

29.70 $ 306.19 $ 68.86 $

103.85 $

574.45 $

0.25 $ 51.71 $ 23.49 $ 3.65 $ 1.12 $ 1.90 $

39.56 $ 499.06 $ 0.16 $ 25.30 $

7.25 $

501.33 $ 8744.74 $ 88.29 $

3.04 $ 4012.38 $

766.77 $ 2127.63 $

50.07 $

759.66 $

23.67 $

1.38 $

20.21 $

1420.24 $

869.19 $

300.94 $

531.02 $

27.49 $

2207.79 $

10813.08 $ 1664.69 $

2708.16 $

400.52 $

296.01 $

532.85 $

557.35 $

6660.87 $ 953.58 $

347.43 $

6025.12 $

1586.42 $ 1155.33 $ 355.07 $ 1666.29 $ 918.59 $

1211.50 $

494.56 $ 8.34 $

2262.88 $

3269.39 $

125.35 $

1017.02 $ 5936.27 $

4986.70 $

2066.12 $

328.57 $ 328.57 $

25026.28 $

2929.08 $

0.00 $

0.00 $

0.00 $

309.51 $ 301.57 $

51.39 $

10.82 $

260.57 $

28.52 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

0.00 $

N2 (air) 0.00 $

E4 Technologies

Specialty Gases

Chemicals

Chemicals and Solid Waste

Basic Supply Facilities

Exhaust and Waste Water

Other Material

1278.40 $

leadframe

bonding wire

molding press paste


grinding disc

solid waste grinding disc

sawing blades

solid waste sawing blades

Bulk Gases

Water

Energy

Supply Production Disposal Facilities

Disposal Production

solid waste Al-Cu targets

General View

0.00 $

0.00 $

405.53 $

107.52 $

2048.20 $

319.14 $

0.00 $

33.99 $

0.00 $

Cost input for the complete production and support



9. OEE

9.6 OEE to OFE

ICM, 9 - 41


COO – cost of ownership

Output (standby)

Output (production)

Input (standby)

Input (production)

Yield costs

Whole Wafers

Defect Dies

Fixed costs

Equipment

Depreciation

Transport

Custom

Installation

Training

Floor Space

Interest

Lifetime Throughput Composite yield Utilization

COO = F$ + O$ + Y$

L x T x Y x U Cost per good wafer

Operational costs

Input Output Gases/Air

Chemicals

Water

Energy

Wafer

Energy, Heat

Exhaust (air, gases)

Wastewater

Solid waste

Wafer

Process

Module

Maintenance

Personnel

Testwafer

Material

Method for Overall Factory Efficiency Development 9. OEE

9.6 OEE to OFE

ICM, 9 - 42


Chapter 9 : Overall Equipment Efficiency OEE

chapter 9 : overall equipment efficiency oee - unibw · pdf fileicm, 9 - 1 integrated circuit...

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