罗小兵个人简历tpl.energy.hust.edu.cn/__local/1/e3/10/5fd487b263f... · 罗小兵个人简历...
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罗小兵个人简历
__________________________________________________________________________
武汉市洪山区珞瑜路 1037 号, Tel: 86-27-87542418 (Office)
华中科技大学能源与动力工程学院,430074 86-13871300778 (Assistant)
Email: [email protected] Fax: 86-27-87540724
Http://TPL.energy.hust.edu.cn
__________________________________________________________________________
1. 教育
09/98 07/02:清华大学工程力学系 ,工程热物理,工学博士学位
09/95 07/98:华中理工大学动力工程系 ,工程热物理,工学硕士学位
09/91 07/95:华中理工大学动力工程系 ,工程热物理,工学学士学位
2. 研究兴趣
LED 及量子点封装,极端热管理设计及器件,微尺度传热
2. 工作经历
03/2016---目前 华中科技大学中欧能源学院 中方联席院长,能源与动力工程
学院副院长兼工程热物理系系主任
05/2011---目前 华中科技大学能源与动力工程学院 副院长兼工程热物理系
系主任 12/2007---目前 正教授,博士导师,华中科技大学能源与动力工程学院,武
汉光电国家实验室微光机电系统研究部 09/2005--11/2007 副教授 ,华中科技大学能源与动力工程学院,武汉光电国家
实验室微光机电系统研究部
08/2002--08/2005 高级研究员, 韩国三星综合技术研究院(韩国总部)
4. 职业主要荣誉和奖励
IEEE ICEPT Outstanding Paper Award, 通讯作者,2017
国家杰出青年基金获得者, 2016
IEEE CPMT Exceptional Technical Achievement Award, 2016
国家技术发明奖二等奖,排名第二,2016
2015 IEEE CPMT Best Paper Award,2016
湖北省自然科学奖一等奖,排名第一,2015
教育部技术发明奖一等奖,排名第二,2015
华中科技大学研究生知心导师奖,2015
华中科技大学三育人奖,2014
华中科技大学《工程传热学》课程责任教授,2014
第七届国家大学生节能减排大赛特等奖指导老师,2014
国家精品资源共享课程《工程传热学》负责人,2013
华中科技大学研究生就业指导良师,2013
华中科技大学十佳青年教工,2012
第二届华中科技大学师表奖,2011
IEEE Cisco Best Student Paper Award, 2011
2010 年南海杯国家半导体照明创新大赛学生创意奖指导老师,2010
IEEE Outstanding Paper Award, 2010
中国物流协会科技发明一等奖,排名第二,2009
中国电子协会科技奖励二等奖,排名第二,2009
第二届国家大学生节能减排大赛特等奖指导老师,2009
IEEE ICEPT NXP Best Paper Award,第一作者,2008
IEEE ICEPT Philips Best Paper Award,第一作者, 2006
Best Researcher Award, Samsung Advanced Institute of Technology, Korea, 2003
5. 学术活动
1) Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing
Technology
2) Associate Editor,ASME Journal of Electronics Packaging
3) Panel chair of Itherm 2016, USA
4) Associate editor of JEP special issue for Interpack papers in 2015
5) Associate Editor, 15th International Conference of Heat Transfer, Japan, 2014
6) 技术委员会成员-光电分会, 2th, 3th, 4th, 5th Electronics System-Integration Technology
Conference in Europe, 2008-2014 (欧洲)
7) 技术委员会成员 -LED 分会 , 1th, 2th, International Conference on Advanced
Electromaterials in Korea, 2011-2013(韩国)
8) 本地组委会主席, 11th International Conference on Power Engineering, Wuhan, China,
2013
9) 国际杂志文章评阅人:Advanced Functional Material, IEEE CPMT, IEEE TDMR,
IEEE PTL, International Journal of Heat and Mass Transfer, International Journal of
Thermal Sciences, Applied Thermal Engineering, Heat Transfer Engineering, ASME
Journal of Electronics Packaging, Scientific Reports, Experimental Heat and Fluid
Science, Energy Conversion and Management, Applied Energy, Microelectronics
Reliability, Journal of Applied Physics, Optics Express, JSOA, Optics Letters, Sensors
and Actuators A, Applied Optics, etc.
10) 项目和基金评阅人:美国能源部项目,荷兰科技转化基金,中国国家自然科学基
金,广东,浙江,江苏,北京等地基金或者科技项目和奖励
11) 公司咨询:美国艾默生公司,中国欧普照明,香港应用科学研究院等
6. 授权发明专利及其他
[1] X.B.Luo, H. J. Cho, Micro accelerometer,美国专利: US 7,080,553, 韩国专利:
KR 552480
[2] X. B. Luo, H.J. Cho, J.Y. Lee, S.K.Kang, Apparatus for measuring methanol
concentration, 美国专利: US 7,353,696, 韩国专利: KR 601977, 中国发明专
利: ZL 200510128862.3,日本专利:JP4563303
[3] X. B. Luo, S.K.Kang, D.Y.Seung. Liquid-gas separator for direct liquid feed fuel
cell, 韩国专利: KR 696526, 美国专利: US 7700213, 中国发明专利: ZL
200610077192.1
[4] H.J. Cho, X. B. Luo, Fuel supply device for direct methanol fuel cells, 韩国专利:
KR 0528337, 欧洲专利: EP1513210 , 美国专利: US 7121308 B2,日本专
利: JP 4060298
[5] H.J. Cho, X. B. Luo, Z.Y. Zhou, X.Yang, X.Y.Ye, Diaphragm Air-Pump, 韩国
专利: KR 594802, 欧洲专利: EP1515043 ,日本专利: JP 4057001, 美国专
利: US 7,553,135,中国发明专利: ZL 03157069.0
[6] H.J. Cho, X. B. Luo, H. Chang, Fuel supply device for direct methanol fuel cells,
美国专利: US 7,695,842,韩国专利: KR 0519773, 日本专利: JP 4060296,欧
洲专利:EP1513211
[7] H. J. Cho, X.B.Luo, Valveless Micro Air Delivery Device,韩国专利: KR
519970,日本专利: JP4118859,美国专利:7,841,843
[8] S.K.Kang, X. B. Luo, H.K.Kim, D.K.Sohn. Liquid-gas separator for direct liquid
feed fuel cell, 美国专利: US 7,621,982,韩国专利: KR 670348
[9] H.J. Cho, D.K.Song, X. B. Luo, Liquid fuel mixing apparatus and direct liquid
feed fuel cell system having the same, 美国专利:US 7,622,213, 韩国专利: KR
626089,中国发明专利: ZL 200510128493.8
[10] 罗小兵, 陈剑楠,胡润,刘胜, 用于电子封装器件的微通道热沉系统,中国
发明专利号, ZL 2010.1.0146723.4
[11] 罗小兵,姚家伟,桂许龙,刘胜,一种混合型垂直轴风力发电机,中国发明
专利号:ZL 2010.1.0176426.4
[12] 罗小兵,郑怀,余珊,刘胜,一种反光杯及其在 LED 封装中控制荧光粉层
几何形状的方法,中国发明专利号:ZL 2011.1.0123454.4
[13] 罗小兵,郑怀,付星,刘胜,利用表面改性实现无透镜封装的 LED 封装器
件及其方法,中国发明专利号:ZL 2011.1.0396568.6
[14] 罗小兵,胡润,王凯,刘胜,一种光型可控的双自由曲面透镜设计方法,中
国发明专利:ZL 2012.1.0013686.9
[15] 罗小兵, 付星,胡锦炎,刘胜,利用潜热型功能流体的散热装置及其散热方
法,中国发明专利,ZL 2011.1.0432260.2
[16] 罗小兵,郭庭辉,段斌,一种高可靠性的微型机械泵,中国发明专利:ZL
2012.1.0245632.5
[17] 罗小兵,郑怀,付星,一种基板结构及其用于二极管封装中荧光粉涂覆的方
法,中国发明专利号:ZL 2012.1.0253752.X
[18] 罗小兵,胡润,吴步龙,刘胜,一种自由曲面透镜及其实现保形涂覆的方法,
中国发明专利号:ZL 2012.1.0013674.6
[19] 罗小兵,郑怀,一种用于板上芯片 LED 封装结构及其荧光粉涂覆方法,中
国发明专利号:ZL 2013.1.0244275.5
[20] 罗小兵,郑怀,王依蔓,李岚,一种 LED 封装基板及用于保形涂覆的方法,
中国发明专利号:ZL 2013.1.0139576.1
[21] 罗小兵,郑怀,张可,王立慧,一种 LED 封装基板及用于保形涂覆的方法,
中国发明专利号:ZL 201310136095.5
[22] 罗小兵,李春峰,郑怀,孙连根,许岩,一种实现高空间光色均匀的 LED
涂覆装置及方法,中国发明专利号:ZL 201410090055.6
[23] 罗小兵,胡锦炎,一种基于包芯结构复合相变储热层的动力电池冷却系统,
中国发明专利号:ZL 201510003649.3
[24] 罗小兵,朱永明,郑怀,一种用于汽车前照灯的 LED 的模块的封装方法,
中国发明专利号:ZL 201410275518.6
[25] 罗小兵,郑怀,雷翔,一种荧光粉复合颗粒、其制备方法及应用,中国发明
专利号:ZL 201410477765.4
[26] 罗小兵,袁超,段斌,一种高分子复合散热材料制备方法,中国发明专利号:
ZL 201510547164.0
[27] 罗小兵, 李志信, 过增元, 易明,胡桅林, 合成喷射流角速度计,中国发明专
利,ZL 01 1 29216.4
[28] 罗小兵, 李志信, 杨拥军, 双向合成喷射流陀螺仪, 中国发明专利, ZL 01 1
29222.9
[29] 罗小兵,吴晗,TPL 离心泵设计软件 1.0, 中华人民共和国软件著作权,
2017SR158597
[30] 罗小兵,刘发龙,段斌,一种微型水力悬浮机械泵,中国发明专利号:ZL
201611139270.6,PCT 国际专利申请号:PCT/CN2017/071675
[31] 罗小兵,刘发龙,段斌,一种新型机械泵液冷散热系统,中国发明专利号:
ZL 201710208116.8,PCT 国际专利申请号:PCT/CN2017/081642
7. 申请发明专利
[32] 罗小兵,余兴建,郑怀,一种用于荧光粉涂覆的方法,中国发明专利申请号:
201410655196.8
[33] 罗小兵,余兴建,一种荧光粉涂覆方法及其应用,中国发明专利申请号:
201510036205.X
[34] 罗小兵,段斌,罗明清,一种微型旋转机械泵的叶轮固定方法,中国发明专
利申请号:201510162929.9
[35] 罗小兵,余兴建,郑怀,一种沾取转移式荧光粉胶涂覆方法,中国发明专利
申请号:201510313825.3
[36] 罗小兵,余兴建,马预谱,一种远离荧光粉涂覆方法及产品,中国发明专利
申请号:201510698771.7
[37] 罗小兵,余兴建,谢斌,一种用于荧光粉涂覆的装置及其涂覆方法,中国发
明专利申请号:201510884145.7
[38] 罗小兵,谢斌,余兴建,一种白光 LED 及其制备方法,中国发明专利申请
号:201510974567.3
[39] 罗小兵,余兴建,刘发龙,一种 LED 荧光粉涂覆的方法,中国发明专利申
请号:201610015901.7
[40] 罗小兵,余兴建,胡润,一种溶液法荧光粉薄膜涂覆方法、产品及其应用,
中国发明专利申请号:201610375075.7
[41] 罗小兵,黄梦宇,袁超,一种拥有亲、疏水两种润湿特性的铜基板制备方法,
中国发明专利申请号:201610552485.4
[42] 罗小兵,刘发龙,段斌,一种智能液冷服,中国发明专利申请号:
201610596147.0
[43] 罗小兵,余兴建,舒伟程,一种溶液式荧光粉涂覆方法及应用,中国发明专
利申请号:201710148097.4
[44] 罗小兵,谢斌,程焱华,一种低工作温度的量子点白光 LED 及其制备方法,
中国发明专利申请号:201710339524.7
[45] 罗小兵,谢斌,程焱华,一种高发光效率的量子点白光 LED 及其制备方法,
中国发明专利申请号:201710338296.1
[46] 罗小兵,刘发龙,段斌,一种液体动压悬浮机械泵,中国发明专利申请号:
201710228549.X
[47] 罗小兵,吴睿康,段斌,一种刻槽轴承动压悬浮机械泵,中国发明专利申请
号:201710339001.2
[48] 罗小兵,段斌,刘发龙,一种自循环水冷微型泵,中国发明专利申请号:
201710339480.8
8. 专著和章节
[1] Sheng Liu, Xiaobing Luo, LED Packaging for Lighting Applications-Design,
Manufacturing and Testing, John Wiley & Sons, USA, 2011
[2] Xiaobing Luo, Run Hu, Chip Packaging: Encapsulation of nitride LEDs, Chapter
15, Woodhead Publishing, UK, 2014
[3] Xiaobing Luo, Run Hu, Thermal management on LED packaging and
applications, Chapter 9, Annual Review of Heat Transfer: 371-414, USA, 2015
[4] Xiaobing Luo, Qi Chen, Online Testing Method and System for LED Reliability
and Their Applications, Chapter 13, Solid State Lighting Reliability Part 2:
353-380, Springer, Switzerland, 2017
9. 特邀报告和课程讲授
[1] Xiaobing Luo, A micro pump for microfluidics applications, International Fair
of Environment Professional Microtechnology, Invited Speech , Swiss, 2011 (瑞
士)
[2] Xiaobing Luo, Phosphor Geometry Analysis and Control for White LEDs Based
on Microfluidics Theory, Invited Speech, International Conference on
Advanced Electromaterials, Jeju, Korea, 2011 (韩国)
[3] Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo*, A Method to
Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight
with High Distance-Height Ratio, Invited Talk, 13th International Conference on
Electronic Packaging Technology & High Density Packaging, Guilin, China,
PP:1474-1478, 2012 (中国桂林)
[4] Xiaobing Luo, Experimental investigation on the Minichannel cold plate for high
temperature uniformity based on a compact thermal model, Keynote Speaker,
ASME 2013 11th International Conference on Nanochannels, Microchannels, and
Minichannels, Sapporo, Japan, 2013 (日本)
[5] Xiaobing Luo, LED lighting technology and its energy saving, Invited Lecture,
2013 AC 21 International Summer School, Bangkok, Thailand, 31.May to 4.June,
2013 (泰国课程讲授)
[6] Xiaobing Luo, Phosphor coating control Based on Microfluidics Theory for
Phosphor converted white LED. Plenary Speaker, International Workshop on
Solid State Lighting Technologies and Research: LEDs and OLEDs, Istanbul,
Turkey, 19.Aug. to 21.Aug. 2013(土耳其)
[7] Xiaobing Luo, LED lighting and its packaging technology, Invited Lecture,
2013 International Summer School, Shanghai, China, 28.July to 5.Aug. , 2013 (上海课程讲授)
[8] Xiaobing Luo, Heat and Mass Transfer and Its applications on LED Packaging,
Keynote Speaker, 2013 International Workshop on Heat Transfer Advances for
Energy Conversion and Pollution Control, Xi’an, China, 18.Oct. to 21.Oct., 2013
(中国西安)
[9] Xiaobing Luo, An Engineering method to estimate junction temperature of light
emitting diodes in multiple LEDs applications, Keynote Speaker, The 2nd
International Conference on Advanced Electromaterials (ICAE), Jeju, Korea,
Nov. 12-15, 2013. (韩国)
[10] Xiaobing Luo, Thermal packaging of LED, Invited Speaker, The 9th
International Microsystems, Packaging, Assembly, Circuits Technology
Conference and the 16th International Conference on Electronics Materials and
Packaging, Oct. 22-24, Taiwan, China, 2014.(中国台湾)
[11] Xiaobing Luo, Thermal management in LED/IC packaging, Invited Lecture,
Taiwan Thermal Management Association, Taiwan University, Oct. 24, 2014.
(中国台湾)
[12] Xiaobing Luo, Thermal and Optical Performances of Quantum Dot-Based LEDs,
Plenary Speaker, International Lighting and Display Workshop, Tianjin, China,
Sep. 2015. (中国)
[13] Xiaobing Luo, LED packaging: Thermal and Mechanical Challenges and Future
Direction, Panel Moderators, 15th The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA,
May 31-June 3, 2016(美国)
[14] Xiaobing Luo, Thermal management based on solid-liquid phase change
materials, Keynote Speaker, The 9th International Symposium on Heat Transfer,
Beijing, China, Aug.15-19, 2016 (中国北京)
[15] Xiaobing Luo, Key problems in high performance LEDs packaging, Invited
Speaker, The 16th International Meeting on Information Display, Jeju, Korea,
Aug.23-26, 2016 (韩国)
[16] Xiaobing Luo, LED Phosphor Heating, Modeling and Experimental Test,
Invited Speech, The 13th China International Forum on Solid State Lighting,
Beijing, China, Nov.15-17, 2016 (中国北京)
[17] Xiaobing Luo, Heat and Fluid Flow in LED Packaging and Applications,
Keynote Speaker, 2nd Thermal and Fluids Engineering Conference and 4th
International Workshop on Heat Transfer, Las Vegas, NV, USA, Apr. 2-5, 2017
(美国)
[18] 罗小兵,大功率 LED 封装与应用中流动传热问题及其对工艺的指导,中国
工程热物理学会传热传质年会,分会特邀报告,西安,2011 年 (中国)
[19] 罗小兵,大功率 LED 封装中的关键流动传热问题,中国工程热物理学会传
热传质年会,分会特邀报告,大连,2015 年 (中国)
[20] 罗小兵,源于工程,馈予工程,第二届传热与多相流青年学术论坛,大会特
邀报告,天津,2017 年 3 月 17-18 日 (中国)
[21] 罗小兵,界面热管理,高等学校工程热物理第二十三届全国学术会议手册,
大会特邀报告,四川成都,2017 年 5 月 13-16 日 (中国)
10.发表文章
国际杂志文章(*通讯作者)
[1] Xingjian Yu, Bin Xie, Bofeng Shang, Weicheng Shu and Xiaobing Luo*, A
facile approach to fabricate patterned surfaces for enhancing light efficiency of
COB-LEDs, IEEE Transactions on Electron Devices, 2018(In Press)
[2] Bin Xie, Jingjing Zhang, Wei Chen, Junjie Hao, Yanhua Cheng, Run Hu, Dan
Wu, Kai Wang* and Xiaobing Luo*, Realization of wide circadian Variability
by quantum dots-luminescent mesoporous silica-based white light-emitting
diodes, Nanotechnology, 2017(In press)
[3] Jingjing Zhang, Bin Xie, Xingjian Yu, Xiaobing Luo*, Tao Zhang, Shishen Liu,
Zhihua Yu, Li Liu, and Xing Jin, Blue light hazard performance comparison of
phosphor-converted LED sources with red quantum dots and red phosphor,
Journal of Applied Physics 122, 043103, 2017
[4] Jingjing Zhang, Weihong Guo, Bin Xie, Xingjian Yu, Xiaobing Luo*, Tao
Zhang, Zhihua Yu, Hong Wang, Xing Jin, Blue light hazard optimization for
white LED sources with high luminous efficacy of radiation and high color
rendering index, Optics and Laser Technology, Vol.94:193-198, Sep.1, 2017
[5] Xingjian Yu, Weicheng Shu, Run Hu*, Bin Xie, Yupu Ma, Xiaobing Luo*,
Dynamic phosphor sedimentation effect on the optical performance of white
LEDs, IEEE Photonics Technology Letters, Vol.29(14):1195-1198, Jul.15, 2017
[6] Bofeng Shang, Yupu Ma, Run Hu*, Chao Yuan, Jinyan Hu, Xiaobing Luo*,
Passive thermal management system for downhole electronics in harsh thermal
environments, Applied Thermal Engineering, Vol.118:593-599, May 25, 2017
[7] Qi Chen, Run Hu, Xiaobing Luo*, A statistical study to identify the effects of
packaging structures on lumen reliability of LEDs, Microelectronics Reliability,
Vol.71:51-55, Apr., 2017
[8] Jingjing Zhang, Run Hu, Bin Xie, Xingjian Yu, Xiaobing Luo*, Zhihua Yu,
Lijun Zhang, Hong Wang, and Xing Jin, Energy-saving light source spectrum
optimization by considering object’s reflectance, IEEE Photonics Journal,
Vol.9(2):8200311, Apr. 2017
[9] Chao Yuan, Mengyu Huang, Yanhua Cheng and Xiaobing Luo*,
Bonding-induced thermal transport enhancement across hard/soft materials
interface using molecular monolayers, Physical Chemistry Chemical Physics,
Vol.19, 7352-7358, Mar.14, 2017
[10] Yupu Ma, Run Hu, Xingjian Yu, Weicheng Shu, Xiaobing Luo*, A modified
bidirectional thermal resistance model for junction and phosphor temperature
estimation in phosphor-converted LEDs, International Journal of Heat and Mass
Transfer, Vol.106:1-6, Mar. 2017
[11] Qi Chen, Yupu Ma, Xingjian Yu, Run Hu, Xiaobing Luo*, Phosphor
temperature over-estimation in high power LED by thermocouple, IEEE
Transactions on Electron Device, Vol.64(2): 463-466, Feb. 2017
[12] J.J.Zhang, R.Hu, X.J.Yu, B.Xie, X.B.Luo*, Spectral optimization based
simultaneously on color-rendering index and color quality scale for white LED
illumination, Optics & Laser Technology, Vol. 88:161-165, Feb. 2017
[13] Bin Xie, Wei Chen, Junjie Hao, Dan Wu, Xingjian Yu, Yanhua Chen, Run Hu,
Kai Wang, Xiaobing Luo*, Structural optimization for remote white
light-emitting diodes with quantum dots and phosphor: packaging sequence
matters, Optics Express, Vol. 24(26), A1560-A1570, Dec.26, 2016
[14] Run Hu, Shuling Zhou, Weicheng Shu, Bin Xie, Yupu Ma, and Xiaobing
Luo*,Directional heat transport through thermal reflection meta-device, AIP
Advances, 6, 125111, Dec. 2016
[15] Lan Li, Huai Zheng, Chao Yuan, Run Hu & Xiaobing Luo, Study on effective
thermal conductivitiy of silicon/phosphor composite and its size effect by Lattice
Boltzmann method, Heat and Mass Transfer, Vol. 52:2813-2821, Dec. 2016
[16] Chao Yuan, Mengyu Huang, Xingjian Yu, Yupu Ma, Xiaobing Luo*, A simple
approach to fabricate the rose petal-like hierarchical surfaces for droplet
transportation, Applied Surface Science, Vol.385:562-568, Nov.1, 2016
[17] Run Hu, Shuling Zhou, Xinjian Yu and Xiaobing Luo*, Exploring the proper
experimental conditions in 2D thermal cloaking demonstration, Journal of
Physics D:Applied Physics, 49, 415302, Oct.19 2016
[18] Yongming Zhu, Wei Chen, Jinyan Hu, Bin Xie, Junjie Hao, Dan Wu, Xiaobing
Luo* and Kai Wang, Light conversion efficiency enhancement of modified
quantum dot films integrated with micro SiO2 particles, Journal of Display
Technology, Vol.12(10), 1152-1156, Oct. 2016
[19] Xiaobing Luo*, Run Hu, Sheng Liu, Kai Wang, Heat and fluid flow in
high-power LED packaging and applications, Progress in Energy and
Combustion Science, 56, 1-32, Sep.2016
[20] Jinyan Hu, Run Hu, Chao Yuan, Bin Duan, Mengyu Huang, Xiaobing Luo*,
Fabrication and thermal characterization of the modularized thermal storage unit,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 6(8):1198-1207, Aug.2016
[21] Ting Cheng, Xingjian Yu, Yupu Ma, Bin Xie, Qi Chen, Run Hu, and Xiaobing
Luo*, Angular color uniformity enhancement of white LEDs by lens wetting
phosphor coating, IEEE Photonics Technology Letters, Vol.
28(4):1589-1592,July, 15, 2016
[22] Xingjian Yu, Bin Xie, Bofeng Shang, Qi Chen, Xiaobing Luo*, A cylindrical
Tuber Encapsulant geometry for enhancing optical performance of Chip-on
Board Packaging LEDs, IEEE Photonics Journal, Vol.8(3):1600709, Jun 2016
[23] Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Xiaobing Luo*. Numerical
and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer
Coating Process of Light-Emitting Diodes Packaging, Journal of Electronic
Packaging, Vol. 138(2): 021002, Jun. 2016.
[24] Bin Xie, Run Hu, Xiaobing Luo*. Quantum Dots-Converted Light-Emitting
Diodes Packaging for Lighting and Display: Status and Perspectives, Journal of
Electronic Packaging, Vol. 138(2): 020803, Jun. 2016.
[25] Bin Xie, Run Hu, Xingjian Yu, Bofeng Shang, Yupu Ma, Xiaobing Luo*, Effect
of packaging method on performance of light-emitting diodes with quantum dot
phosphor, IEEE Photonics Technology Letters, Vol.28(10):1115-1118, May.15,
2016
[26] Ruikang Wu, Run Hu*, Xiaobing Luo*, First-Principle-based full-dispersion
Monte Carlo simulation of the anistropic phonon transport in the wurtzite GaN
thin film, Journal of Applied Physics, 119,145706, Apr.14, 2016
[27] Run Hu, Jinyan Hu, Ruikang Wu, Bin Xie, Xingjian Yu, Xiaobing Luo*,
Examination of the thermal cloaking effectiveness with layered engineering
materials, Chinese Physics Letters, Vol 33(4), 044401, Apr. 2016
[28] Chao Yuan, Lan Li, Bin Duan, Bin Xie, Yongming Zhu, Xiaobing
Luo*, Locally reinforced polymer-based composites for efficient heat dissipation
of local heat source, International Journal of Thermal Sciences , Vol:102,202-209,
Apr., 2016
[29] Jinlong Ma, Wu Li, Xiaobing Luo*,Intrinsic thermal conductivities and size
effect of alloys of wurtzite AlN, GaN, and InN from first principles, Journal of
Applied Physics, Vol:119(12),125702, Mar. 28, 2016
[30] Jinyan Hu, Run Hu, Yongming Zhu, Xiaobing Luo*, Experimental investigation
on composite phase change material (CPCM) based substrate, Heat Transfer
Engineering, Vol.37(3-4):351-358, Mar. 3, 2016.
[31] Chao Yuan, Bin Xie, Mengyu Huang, Ruikang Wu, Xiaobing Luo*, Thermal
conductivity enhancement of platelets aligned composites with volume fraction
from 10% to 20%, International Journal of Heat and Mass Transfer, Vol.94,
pp:20-28, Mar.1, 2016.
[32] Jinlong Ma, Wu Li, Xiaobing Luo*, Ballistic thermal transport in monolayer
transition-metal dichalcogenides:Role of atomic mass, Applied Physics Letters,
Vol.18(8),082102, Feb.22, 2016
[33] Run Hu, Zhongzhou Du, Ting Cheng, Zhixing Huang, Wenzhong Liu, Xiaobing
Luo*, Noninvasively probing the light-emitting diode temperature by magnetic
nanoparticles, Journal of Applied Physics, 118, 124501,Sep.28. 2015.
[34] Run Hu, Bin Xie, Jinyan Hu, Qi Chen, Xiaobing Luo*, Carpet thermal cloak
realization based on the refraction law of heat flux, EuroPhysics Letter, 111,
54003,Sep. 2015.
[35] XingjianYu, Bin Xie, Qi Chen, Yupu Ma, Ruikang Wu, Xiaobing Luo*, Therma
l remote phosphor coating for phosphor-converted white light-emitting diodes,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 5(9): 1253-1257, Sep. 2015
[36] Bin Duan, Minqing Luo, Chao Yuan, Xiaobing Luo*,Multi-objective hydraulic
optimization and analysis in a minipump, Chinese Science Bulletin,
60(17):1517-1526, Sep. 2015
[37] ChaoYuan, Bin Duan,Lan Li, Bin Xie, Mengyu Huang, Xiaobing Luo*, Thermal
Conductivity of Polymer-Based Composites with Magnetic Aligned Hexagonal
Boron Nitride Platelets , ACS Applied Materials & Interfaces, Vol.7(23),
13000-13006, Jun.17, 2015.
[38] Qi Chen, Run Hu, Bin Xie, Xiaobing Luo*, Effect study of chip offset on the
optical performance of light-emitting diode packaging, IEEE Photonics
Technology Letters, Vol.27(12), 1337-1340, Jun.15,2015.
[39] Bin Xie, Run Hu, Qi Chen, Xingjian Yu, Dan Wu, Kai Wang*, Xiaobing
Luo*, Design of a brightness-enhancement-film-adaptive freeform lens to
enhance overall performance in direct-lit light-emitting diode backlighting,
Applied Optics, Vol:54(17), 5542-5548, Jun.10, 2015.
[40] Xiang Lei, Huai Zheng, Sheng Liu, Xiaobing Luo*, Performance enhancement
of white LEDs through phosphor/silicone composite particles, IEEE Photonics
Technology Letters, Vol.27(10), 1060-1063, May. 15, 2015.
[41] Tinghui Guo, Bofeng Shang, Bin Duan, Xiaobing Luo*, Design and testing of a
liquid cooled garment for hot environments, Journal of Thermal Biology,
Vol.49-50, pp.47-54, Apr.-May, 2015
[42] Chao Yuan, Bin Duan, Lan Li, Bofeng Shang, Xiaobing Luo*, An improved
model for predicting thermal contact resistance at liquid-solid
interface, International Journal of Heat and Mass Transfer, vol. 80, pp. 398-406,
Jan. 2015
[43] Huai Zheng, Lan Li, Xiang Lei, Xingjian Yu, Sheng Liu, and Xiaobing Luo*, Op
tical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding T
iO2/Silicone Encapsulation Layer, IEEE Electron Device Letters, Vol. 35 (10),
pp:1046-1048, Oct. 2014
[44] Run Hu, Xiaobing Luo*, Phosphor distribution optimization to decrease the
junction temperature in white pc-LEDs by genetic algorithm,
International Journal of Heat and Mass Transfer, vol. 77, pp. 891-896, Oct. 2014.
[45] Qi Chen, Quan Chen, and Xiaobing Luo*, Note: An online testing method for
lifetime projection of high power light-emitting diode under accelerated
reliability test, Review of Scientific Instruments, 85, 096111, Sep. 2014
[46] Jinlong Ma, Wu Li, and Xiaobing Luo*, Intrinsic thermal conductivity and its
anisotropy of wurtzite Inn, Appl. Phys. Lett. 105, 082103, Aug.25, 2014
[47] Xiaobing Luo*, and Run Hu, Calculation of phosphor heat generation in phosph
or-converted light-emitting diodes, International Journal of Heat and Mass Transf
er, vol. 75, pp. 213-217, Aug. 2014
[48] Jinlong Ma, Wu Li, and Xiaobing Luo*, Examining the callaway model for
lattice thermal conductivity, Physical Review B, 90, 035203, Jul.14, 2014
[49] Xing Fu, Run Hu and Xiaobing Luo*, An Engineering method to estimate the
junction temperatures of LEDs in Multiple LED application, Journal of the
Korean Physical Society, Vol.65 (2), 176-184, Jul. 2014
[50] Quan Chen, Qi Chen, Sheng Liu, Xiaobing Luo*, A design for in-situ
measurement of optical degradation of high power light-emitting diodes under
accelerated life test, IEEE Transactions on Device and Material Reliability,
Vol.14 (2): 645-650, Jun. 2014.
[51] Run Hu, Xuli Wei, Jinyan Hu, Xiaobing Luo*, Local heating realization by
reverse thermal cloak, Scientific Reports, vol. 4: 3600, Jan. 8, 2014
[52] Bimrew Tamrat Admasu, Xiaobing Luo*, Jiawei Yao, Effects of temperature
non-uniformity over the heat spreader on the outputs of thermoelectric power
generation system, Energy Conversion and Management, vol. 76: 533-540, Dec.
2013.
[53] Huai Zheng, Yiman Wang, Lan Li, Xing Fu, Yong Zou, Xiaobing Luo*,
Dip-transfer phosphor coating on designed substrate structure for high angular
color uniformity of white light emitting diodes with conventional chips, Optics
Express, vol. 21(106): A933-A941, Nov. 4, 2013.
[54] Xing Fu, Xiaobing Luo*, Can thermocouple measure surface temperature of
light emitting diode module accurately? , International Journal of Heat and Mass
Transfer, vol. 65: 199-202, Oct. 2013.
[55] Jinlong Ma, Xinjiang Wang, Baoling Huang, Xiaobing Luo*, Effects of point
defects and dislocations on spectral phonon transport properties of wurtzite GaN,
Journal of Applied Physics, vol. 114(7): 074311, Aug.21, 2013.
[56] Run Hu, Bin Cao, Yong Zou, Yongming Zhu, Sheng Liu, Xiaobing Luo*,
Modeling the Light Extraction Efficiency of Bi-Layer Phosphors in White LEDs,
IEEE Photonics Technology Letters, vol. 25(12): 1141, Jun.15, 2013.
[57] Huai Zheng, Sheng Liu, Xiaobing Luo*, Enhancing Angular Color Uniformity
of Phosphor-Converted White Light-Emitting Diodes by Phosphor Dip-Transfer
Coating, Journal of Lightwave Technology, vol. 31(12): 1987-1993, Jun.15,
2013.
[58] Run Hu, Huai Zheng, Jinyan Hu, Xiaobing Luo*, Comprehensive study on the
transmitted and reflected light through the phosphor layer in light-emitting diode
packages, Journal of Display Technology, vol. 9(6): 447-452, Jun., 2013.
[59] Huai Zheng, Xiaobing Luo*, Color consistency enhancement of white
light-emitting diodes through substrate design, IEEE Photonics Technology
Letters, vol.25 (5): 484-487, Mar.1, 2013.
[60] Huai Zheng, Jinlong Ma, Xiaobing Luo*, Conformal Phosphor Distribution for
White Lighting Emitting Diode Packaging by Conventional Dispensing Coating
Method With Structure Control, IEEE Transactions on Components, Packaging
and Manufacturing Technology, vol. 3 (3) : 417-421, Mar., 2013.
[61] Xiaobing Luo*, Xing Fu, Fei Chen, Huai Zheng, Phosphor self-heating in
phosphor converted light emitting diode packaging, International Journal of Heat
and Mass Transfer, vol. 58(1): 276-281, Mar., 2013.
[62] Run Hu, Yiman Wang, Yong Zou, Xing Chen, Sheng Liu, Xiaobing Luo*, Study
on phosphor sedimentation effect in white light-emitting diode packages by
modeling multi-layer phosphors with the modified Kubelka-Munk theory, Journal
of Applied Physics, vol. 113: 063108, Feb.14, 2013.
[63] Run Hu, Shan Yu, Yong Zou, Huai Zheng, Fei Wang, Sheng Liu, Xiaobing
Luo*, Near-/mid-field effect of color mixing for single phosphor-converted
light-emitting diode package, IEEE Photonics Technology Letters, vol. 25(3):
246-249, Feb.1, 2013.
[64] Run Hu, Zhiqiang Gan, Xiaobing Luo*, Huai Zheng, Sheng Liu, Design of
double freeform-surface lens for LED uniform illumination with minimum
Fresnel losses, Optik-International Journal for Light and Electron Optics, vol.
124(19): 3895-3897, 2013.
[65] Chao Yuan, Xiaobing Luo*, A unit cell approach to compute thermal
conductivity of uncured silicone/phosphor composites, International Journal of
Heat and Mass Transfer, vol. 56(1-2): 206-211, Jan.1, 2013.
[66] Run Hu, Xing Fu, Yong Zou, Xiaobing Luo*, A complementary study to
‘Toward scatter-free phosphors in white phosphor-converted light-emitting
diodes’: Comment, Optics express, vol. 21(4): 5071-5073, 2013.
[67] Bulong Wu, Huai Zheng, Xing Fu, Xiaobing Luo*, Effect of gold wire bonding
on optical performance of high power light-emitting diode packaging, Journal of
Ceramic Processing Research, vol. 13: 354, Nov. 2012.
[68] Run Hu, Xiaobing Luo*, A model for calculating the bidirectional scattering
properties of phosphor layer in white light-emitting diodes, Journal of Lightwave
Technology, vol. 30(21): 3376-3380, Nov.1, 2012.
[69] Xiaobing Luo*, Zhangming Mao, Janghui Yang, Sheng Liu, Engineering
method for predicting junction temperatures of high-power light-emitting diodes,
IET Optoelectronics, vol. 6(5): 230-236, Oct. 2012.
[70] Run Hu, Xiaobing Luo*, Huai Zheng, Hotspot location shift in the high-power
phosphor-converted white light-emitting diode packages, Japanese Journal of
Applied Physics, vol. 51(9), Sep., 2012.
[71] Xiaobing Luo*, Zhangming Mao, Thermal modeling and design for
microchannel cold plate with high temperature uniformity subjected to multiple
heat sources, International Communications in Heat and Mass Transfer, vol.
39(6): 781-785, Jul., 2012.
[72] Run Hu, Xiaobing Luo*, Huai Zheng, Zong Qin, Zhiqiang Gan, Bulong Wu,
Sheng Liu, Design of a novel freeform lens for LED uniform illumination and
conformal phosphor coating, Optics Express, vol. 20(13): 13727-13737, Jun.18,
2012.
[73] Run Hu, Xiaobing Luo*, Han Feng, Sheng Liu, Effect of phosphor settling on
the optical performance of phosphor-converted white light-emitting diode,
Journal of Luminescence, vol. 132(5): 1252-1256, May.2012.
[74] Huai Zheng, Xiaobing Luo*, Run Hu, Bin Cao, Xing Fu, Ym Wang, Sheng Liu,
Conformal phosphor coating using capillary microchannel for controlling color
deviation of phosphor-converted white light-emitting diodes, Optics Express, vol.
20(5): 5092-5098, Feb.27, 2012.
[75] Bulong Wu, Xiaobing Luo*, Huai Zheng, Sheng Liu, Effect of gold wire
bonding process on angular correlated color temperature uniformity of white
light-emitting diode, Optics Express, vol. 19(24): 24115-24121, Nov.21, 2011.
[76] Run Hu, Xiaobing Luo*, Sheng Liu, Study on the optical properties of
conformal coating light-emitting diode by Monte Carlo simulation, IEEE
Photonics Technology Letters, vol. 23(22): 1673-1675, Nov.15, 2011.
[77] Xiaobing Luo*, Zhangming Mao, Sheng Liu, Analytical thermal resistances
model for eccentric heat source on rectangular plate with convective cooling at
upper and lower surfaces, International Journal of Thermal Sciences, vol. 50(11):
2198-2204, Nov., 2011.
[78] Yonglu Liu, Xiaobing Luo*, Wei Liu, Experimental research on a honeycomb
microchannel cooling system, IEEE Transactions on Components, Packaging and
Manufacturing Technology, vol. 1(9): 1378-1386, Sep. 2011.
[79] Quan Chen, Xiaobing Luo*, Shengjun Zhou, Sheng Liu, Dynamic junction
temperature measurement for high power light emitting diodes, Review of
Scientific Instruments, vol. 82(8): 084904-084907, Aug.2011.
[80] Xiaobing Luo*, Huai Zheng, Minglu Liu, Sheng Liu, Experimental study on
substrate with hierarchical nested channels for thermal interface resistance control,
Journal of Applied Physics, vol. 109: 103503, May.15, 2011.
[81] Xiaobing Luo*, Zhangming Mao, Jv Liu, Sheng Liu, An analytical thermal
resistance model for calculating mean die temperature of a typical BGA
packaging, Thermochimica Acta, vol. 512(1): 208-216, Jan.10, 2011.
[82] Xiaobing Luo*, Yonglu Liu, Wei Liu, A honeycomb microchannel cooling
system for microelectronics cooling, Heat Transfer Engineering, vol. 32(7-8):
616-623, 2011.
[83] Xiaobing Luo*, Bulong Wu, Sheng Liu, Effects of moist environments on LED
module reliability, IEEE Transactions on Device and Materials Reliability, vol.
10(2): 182-186, Jun. 2010.
[84] Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobing Luo*, A
micro-machined Pirani gauge for vacuum measurement of ultra-small sized
vacuum packaging, Sensors and Actuators A: Physical, vol. 161(1): 108-113, Jun.
2010.
[85] Yanyan Xi, Xiaobing Luo*, Wenming Liu, Mingxiang Chen, Sheng Liu, Study
on localized induction heating for wafer level packaging, Science China
Technological Sciences, vol. 53(3): 800-806, Mar., 2010.
[86] Ting Cheng, Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis and
optimization of multiple LED packaging based on a general analytical solution,
International Journal of Thermal Sciences, vol. 49(1): 196-201, Jan. 2010.
[87] Xiaobing Luo*, Wei Xiong, Ting Cheng, Sheng Liu, Temperature estimation of
high-power light emitting diode street lamp by a multi-chip analytical solution,
IET Optoelectronics, vol. 3(5): 225-232, Oct. 2009.
[88] Sheng Liu, Jianghui Yang, Zhiyin Gan, Xiaobing Luo*, Structural optimization
of a microjet based cooling system for high power LEDs, International Journal of
Thermal Sciences, vol. 47(8): 1086-1095, Aug., 2008.
[89] Xiaobing Luo, Wei Chen, Renxia Sun, Sheng Liu, Experimental and numerical
investigation of a microjet-based cooling system for high power LEDs, Heat
Transfer Engineering, vol. 29(9): 774-781, 2008.
[90] Xiaobing Luo*, Ting Cheng, Wei Xiong, Zhiyin Gan, Sheng Liu, Thermal
analysis of an 80 W light-emitting diode street lamp, IET Optoelectronics, vol.
1(5): 191-196, Oct.2007.
[91] Xiaobing Luo, Sheng Liu, A microjet array cooling system for thermal
management of high-brightness LEDs, IEEE Transactions on Advanced
Packaging, vol. 30(3): 475-484, Aug., 2007.
[92] Xiaobing Luo, Sheng Liu, Xiaoping Jiang, Ting Cheng, Experimental and
numerical study on a micro jet cooling solution for high power LEDs, Science in
China Series E: Technological Sciences, vol. 50(4): 478-489, Aug., 2007.
[93] Xiaobing Luo*, Hyejung Cho, Valveless small gas pump, Nanoscale and
Microscale Thermophysical Engineering, vol. 10(2): 83-94, Apr.-Jun., 2006.
[94] Xiaobing Luo, Zhixin Li, Zengyuan Guo, Yongjun Yang, Study on linearity of a
micromachined convective accelerometer, Microelectronic Engineering, vol.
65(1): 87-101, Jan. 2003.
[95] Xiaobing Luo, Zhixin Li, Zengyuan Guo, Yongjun Yang, Thermal optimization
on micromachined convective accelerometer, Heat and Mass Transfer, vol.
38(7-8): 705-712, Aug. 2002.
[96] Xiaobing Luo, Yongjun Yang, Feng Zheng, Zhixin Li, Zengyuan Guo, An
optimized micromachined convective accelerometer with no proof mass, Journal
of Micromechanics and Microengineering, vol. 11(5): 504, Sep., 2001.
国内杂志文章(*通讯作者)
[97] 余兴建,舒伟程,胡润,谢斌,罗小兵*,高出光品质 LED 封装:现状及进
展,中国科学:科学技术,2017,47 (综述)
[98] 朱永明,谢斌,罗小兵*,量子点 LED 封装的进展和展望,科学通报,62(7):
659-673,2017(综述)
[99] 陈奇,陈全,罗小兵*,高温下荧光粉层的位置对 LED 光效衰减的影响,科
学通报,vol. 62(12):1302-1306, 2017
[100] 马预谱,胡锦炎,陈奇,罗小兵*,金属材料增强的石蜡储热性能研究,工程热
物理学报,vol.37(10):2196-2201, 2016.
[101] 陈程,朱永明,谢斌,罗小兵*,紧凑型液冷散热器的实验研究,工程热
物理学报,vol.37(9):1956-1960, 2016.
[102] 袁超, 段斌, 李岚,罗小兵*. 热界面材料热导率和接触热阻的测试,化工
学报, Vol. 66(S1), pp:349-353, 2015.
[103] 商博锋, 郭庭辉, 罗小兵*. 液冷服性能参数的数值模拟研究,工程热物理
学报, Vol.36(8), pp:1760-1763, 2015.
[104] 余兴建,郑怀,李岚,罗小兵*,高功率 LED 荧光粉胶涂覆流动铺展的
实验研究,工程热物理学报,Vol.36(5), pp:1096-1100, 2015.
[105] 陈奇,陈全,罗小兵*,加速可靠性试验中 LED 寿命的快速评估,工程
热物理学报,Vol.35(3), pp:554-556, 2014
[106] 李岚,郑怀,罗小兵*,大功率 LED 荧光粉硅胶点涂工艺的三维 LBM 模
拟,应用数学和力学学报,Vol.35(3), pp:264-271, 2014
[107] 郭庭辉,段斌,罗小兵*,微型泵的三维数值模拟与实验研究,工程热物
理学报,Vol.34 (12), pp:2355-2358, 2013
[108] 胡锦炎,付星,罗小兵*,石蜡/膨胀石墨储热基板的实验研究,工程热
物理学报,Vol.34(8), pp:1511-1514, 2013
[109] 袁超, 付星, 罗小兵*. 含有热界面材料的界面热阻模型, 工程热物理学
报, Vol.34(4), pp: 746-750, 2013
[110] 陈剑楠,邹颙,罗小兵*,基于 CMY 模型改进的界面热阻模型及其应用,
工程热物理学报,Vol.33,No.3,509-512, 2012
[111] 刘川,汪学方,罗小兵*,基于热学理论的微型真空检测器件的研究,工
程热物理学报,Vol.32 (9):1553-1556, 2011
[112] 胡润,朱晓磊,郭庭辉,罗小兵*,小型平板蒸汽腔的实验研究,工程热
物理学报,Vol.32 (4):637-640, 2011
[113] 毛章明, 罗小兵*, 刘菊, 刘胜. 一种用于计算典型塑料 DIP 芯片平均温
度的热阻网络模型. 工程热物理学报,Vol. 32(2):303-307,2011
[114] 罗小兵*,杨江辉,刘胜,温度和湿度对 LED 可靠性的影响及其机制分
析,半导体光电,Vol. 30 (3): 366-370,2009
[115] 罗小兵*,杨江辉,甘志银,刘胜,高功率 LED 用微喷冷却系统的分析
和优化,工程热物理学报,Vol. 29 (11): 1909-1914,2008
[116] 陈伟,罗小兵*,程婷,黄素逸,刘胜, 用于大功率 LED 散热的封闭微
喷射流冷却系统的实验研究, 半导体光电 , vol. 28 (4): 478-481, 2007
[117] 程婷,罗小兵*, 黄素逸, 刘胜,基于一种微通道散热器的散热实验研
究,半导体光电,vol.28 (6): 822-824,2007
国际会议文章(*通讯作者)
[118] Y.P. Ma, B.F. Shang, R. Hu and X.B. Luo*, Thermal management of
downhole electronics cooling in oil & gas well logging at high temperature, The
17th International Conference on Electronic Packaging Technology (2016), pp:
623-627
[119] X.J. Yu, F.L. Liu, Y.P. Ma, M.Y. Huang and X.B. Luo*, A remote phosphor
coating by lens wetting for phosphor-converted white light-emitting diodes, The
17th International Conference on Electronic Packaging Technology (2016), pp:
628-631
[120] M.Y. Huang, C. Yuan, X.J. Yu, R.K. Wu and X.B. Luo*, Simulation of
droplet spreading process on heterogeneous striped surface by lattice Boltzmann
method, The 17th International Conference on Electronic Packaging Technology
(2016), pp: 632-635
[121] Q. Chen, R. Hu, J.Y. Hu, B. Xie, X.J. Yu and X.B. Luo*, Experimental study
of measuring LED's temperatures via thermocouple, The 17th International
Conference on Electronic Packaging Technology (2016), pp: 880-883
[122] Chao Yuan, Mengyu Huang, Yupu Ma, Xiaobing Luo*, Locally reinforced
polymer-based composites for efficient heat dissipation of multiple heat sources,
2016 China Semiconductor Technology International Conference (CSTIC), 2016:
1-3, DOI:10.1109/CSTIC.2016.7463964
[123] Qi Chen, Run Hu, Bin Xie, Xingjian Yu, Jingjing Cheng and Xiaobing Luo*,
Effect study of silicone amount on the lumen maintenance of high power LED
under accelerated stress test, 15th IEEE ITHERM Conference, Las Vegas, USA,
pp:836-840, 2016
[124] Run Hu, Bin Xie, Qi Chen, Jingjing Cheng and Xiaobing Luo*, Carpet
Thermal Cloak Realization with layered thermal metamaterials: Theory and
Experiment, 15th IEEE ITHERM Conference, Las Vegas, USA,
pp:1122-1125,2016
[125] Cheng Chen, Run Hu, Xiaobing Luo*, Experimental and numerical study of
a water-stirring radiator, 15th IEEE ITHERM Conference, Las Vegas, USA,
pp:610-613,2016
[126] Bin Duan, Tinghui Guo,Mingqing Luo, Xiaobing Luo*, Design, fabrication
and Characterization of a Mechanical Micropump,InterPACKICNMM 2015, San
Francisco, InterPACKICNMM2015-48017,2015
[127] Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo*, Intrinsic Thermal
Conductivity of Wurtzite AlxGa1-xN, InxGa1-xN and InxAl1-xN from
first-principles calculation, InterPACKICNMM2015, San Francisco,
InterPACKICNMM2015-48032,2015
[128] Qi Chen, Run Hu, Yiman Wang, Huai Zheng, Xiaobing Luo*, A Method to
Eliminate the Effect of Phosphor Sedimentation on LED's Angular Color Unifor
mity, InterPACKICNMM2015, San Francisco, InterPACKICNMM2015-48023,
2015
[129] M.Y. Huang, L. Li, C. Yuan, B. Xie, X.J. Yu and X.B. Luo*, "Simulation of
Stamp-printed Coating Process in Light-emitting Diodes Packaging by Lattice
Boltzmann Method", The 16th International Conference on Electronic Packaging
Technology (2015),pp:1066-1069
[130] B.F. Shang, B. Xie, X.J. Yu, Q. Chen and X.B. Luo*, "An Improved
Substrate Structure for High Angular Color Uniformity of White Light-emitting
diodes with Conventional Chips", The 16th International Conference on
Electronic Packaging Technology (2015), pp:1094-1097
[131] Y.M. Zhu, J.Y. Hu, R. Hu, B. Duan and X.B. Luo*, "Thermal Model of
Phosphor Self-Heating in Phosphor-Converted Light-Emitting Diodes", The 16th
International Conference on Electronic Packaging Technology (2015), pp:
1090-1093
[132] X.J. Yu, B.F. Shang, B. Xie, M.Y. Huang and X.B. Luo*, "Spreading
Behaviors of Silicone Droplet Impact on Flat Solid Surface: Experiments and
VOF Simulations", The 16th International Conference on Electronic Packaging
Technology, pp:1058-1061, 2015
[133] B. Xie, Q. Chen, X.J. Yu, B.F. Shang, M.Y. Huang and X.B. Luo*,
"Experimental Study of Chip Offset on the Packaging Consistency of High Power
Light-Emitting Diodes", The 16th International Conference on Electronic
Packaging Technology, pp:1062-1065, 2015
[134] Lan Li, Huai Zheng, Chao Yuan, Xingjian Yu, Xiaobing Luo*, Three
dimensional simulation of phosphor dispensing process in light emitting diode
packaging by lattice Boltzmann method, the 15th International Heat Transfer
Conference, Kyoto, Japan, August 10-15, 2014.
[135] Chao Yuan, Lan Li, Xiaobing Luo*, Heat conduction optimization of
anisotropic composite material using simulated annealing algorithm, the 15th
International Heat Transfer Conference, Kyoto, Japan, August 10-15, 2014.
[136] Xiang Lei, Huai Zheng, Xiaobing Luo, ShengLiu, Inhibition of phosphor
sedimentation for white light-emitting diodes with a facilely realizable and
economical method, 15th International Proceedings of the Electronic Packaging
Technology Conference, p 1468-1471, October 13, 2014
[137] Yongming Zhu, Run Hu, Jinyan Hu, Xiaobing Luo*, Compact thermal
model of double-layer microchannel heat sink with high temperature uniformity
for multiple LEDs, 15th International Proceedings of the Electronic Packaging
Technology Conference, p 1456-1463, October 13, 2014
[138] Qi Chen, Quan Chen, Run Hu, Xiaobing Luo*, Is thermal management
outside the package enough for higher LED reliability?, 15th International
Proceedings of the Electronic Packaging Technology Conference, p 1068-1070,
October 13, 2014
[139] Lan Li, Chao Yuan, Run Hu, Huai Zheng, Xiaobing Luo*, Study on the
effect of the phosphor distribution on the phosphor layer temperature in light
emitting diodes by lattice Boltzmann method, 15th International Proceedings of
the Electronic Packaging Technology Conference, p 671-675, October 13, 2014
[140] Jinyan Hu, Tinghui Guo, Yongming Zhu, Run Hu, Xiaobing Luo*, Effect of
melting temperature and amount of the phase change material (PCM) on thermal
performance of hybrid heat sinks, Ting Cheng, 15th International Proceedings of
the Electronic Packaging Technology Conference, p 48-52, October 13, 2014
[141] Run Hu, Chao Yuan, Xiaobing Luo*, Ting Cheng, Sheng Liu, Calculation
of effective thermal conductivity of silicone matrix embedded with particulate
phosphors in white led packages by 2D/3D unit cell method, 15th International
Proceedings of the Electronic Packaging Technology Conference, p 324-328,
October 13, 2014
[142] Huai Zheng, Zhili Zhao, Yiman Wang, Lang Li, Sheng Liu, Xiaobing Luo*,
Effect of patterned substrate on light extraction efficiency of chip-on-board
packaging LEDs, the 64th Electronic Components and Technology
Conference(ECTC), p1876-1879, September 11, 2014
[143] Qi Chen, Quan Chen, Xiaobing Luo*, Fast estimation of LED’s accelerated
lifetime by online test method, the 64th Electronic Components and Technology
Conference(ECTC), p1992-1995, September 11, 2014
[144] Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo*, A mechanical
micropump for electronic cooling, 14th Proceedings of the Intersociety
Conference on Thermomechanical Phenomena in Electronic Systems, p
1038-1042, September 4, 2014
[145] Jinyan Hu, Run Hu, Xiaobing Luo*, Phase change material based heat sinks
and its geometry optimization for heat transfer enhancement, 14th Proceedings of
the Intersociety Conference on Thermomechanical Phenomena in Electronic
Systems, p 876-881, September 4, 2014
[146] Huai Zheng, Yiman Wang, Lan Li, Xiaobing Luo*, Mechanism investigation
on die tilt in die attach process based on minimal free energy theory,
Proceedings of the Intersociety Conference on Thermomechanical Phenomena in
Electronic Systems, p 1251-1255, September 4, 2014
[147] Run Hu, Jinyan Hu, Xiaobing Luo*, Phosphor temperature reduction by
optimizing the phosphor configuration in white light-emitting diode package,
Proceedings of the Intersociety Conference on Thermomechanical Phenomena in
Electronic Systems, p 182-185, September 4, 2014
[148] Xiaobing Luo*, Zhangming Mao, Experimental investigation on the
minichannel cold plate for high temperature uniformity based on a compact
thermal model, ASME 2013 11th International Conference on Nanochannels,
Microchannels and Minichannels, ICNMM 2013
[149] Run Hu, Tinghui Guo, Xiaolei Zhu, Sheng Liu, Xiaobing Luo*, A small
flat-plate vapor chamber fabricated by copper powder sintering and diffusion
bonding for cooling electronic packages, the 63th Electronic Components and
Technology Conference(ECTC), p 2280-2285, 2013
[150] Bimrew Tamrat, Xiaobing Luo*, Jiawei Yao, Tingzhen Ming, Effects of
non-uniform hot junction temperature distribution on the outputs of
thermoelectric power generation system, Applied Mechanics and Materials, v 283,
p 87-97, 2013
[151] Huai Zheng, Yiman Wang, Xing Fu, Xiaobing Luo*, Sheng Liu,
Conformal phosphor coating for phosphor-converted white LEDs on basis of
dispensing process, 14th International Proceedings of the Electronic Packaging
Technology Conference, p 1138-1141, 2013
[152] Xing Fu, Xiaobing Luo*, Junction temperature estimation for multiple light
emitting diodes based on surface point measurement, 14th International
Proceedings of the Electronic Packaging Technology Conference, p 1142-1145,
2013
[153] Huai Zheng, Yiman Wang, Xiaobing Luo*, Ling Xu, Sheng Liu, Effect of
die shape on die tilt in die attach process, Proceedings - 2013 14th International
Conference on Electronic Packaging Technology, ICEPT 2013, p 651-655, 2013,
Proceedings - 2013 14th International Conference on Electronic Packaging
Technology, ICEPT 2013
[154] Bimrew Tamrat, Xiaobing Luo*, Effects of thermal contact resistance and
thomson heating on the outputs of solar thermoelectric power generation system,
Proceedings - 2013 14th International Conference on Electronic Packaging
Technology, p 1260-1263, 2013
[155] Run Hu, Yiman Wang, Xiaobing Luo*, Xuebin Zhang, Liang Yang, Light
extraction efficiency enhancement of white LEDs by bi-layer phosphor
configuration, 14th International Proceedings of the Electronic Packaging
Technology Conference, p 214-216, 2013
[156] Run Hu, Zhiqiang Gan, Xiaobing Luo*, Design of double freeform-surface
lens by distributing the deviation angle for light-emitting diode uniform
illumination, 14th International Proceedings of the Electronic Packaging
Technology Conference, p 1150-1153, 2013
[157] Xing Fu, Zhangming Mao, Xiaobing Luo*, System packaging of thousands
watt high power LEDs with heat pipe-fin air cooling system: Design and
manufacturing, 14th International Proceedings of the Electronic Packaging
Technology Conference, p 1146-1149, 2013
[158] Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo*, A method
to design freeform lens for uniform illumination in direct-lit led backlight with
high distance-height ratio, 13th International Proceedings of the Electronic
Packaging Technology Conference, p 1474-1478, 2012
[159] Huai Zheng, Xing Fu, Run Hu, Sheng Liu, Xiaobing Luo*, Angular color
uniformity improvement for phosphor-converted white light-emitting diodes by
optimizing remote coating phosphor geometry, 13th International Proceedings of
the Electronic Packaging Technology Conference, p 1483-1486, 2012
[160] Run Hu, Zhili Zhao, Sheng Liu, Xiaobing Luo*, Robustness of point light
source approximation in lens design for light-emitting diode packages, 13th
International Proceedings of the Electronic Packaging Technology Conference, p
1455-1458, 2012
[161] Xing Fu, Huai Zheng, Sheng Liu, Xiaobing Luo*, Optical study of phosphor
converted light emitting diodes with given correlated color temperatures, 13th
International Proceedings of the Electronic Packaging Technology Conference, p
1479-1482, 2012
[162] Fu’An Li, Xingguo Cheng, Sheng Liu, Xiaobing Luo*, Air gap design of
current sensor based on closed loop Hall Effect, 14th International Conference on
Electronic Materials and Packaging, 2012
[163] Huai Zheng, Xing Fu, Bulong Wu, Sheng Liu, Xiaobing Luo*, A method for
geometry control of phosphor layer in high-power white LEDs by package
structure, 14th International Conference on Electronic Materials and Packaging,
2012
[164] Fuan Li, Xiaobing Luo*, Xingguo Cheng, Sheng Liu, Impact of the
winding area of enameled wire on packaging performance of a closed loop Hall
effect current sensor, the 62th Electronic Components and Technology
Conference(ECTC), p 1631-1635, 2012
[165] Run Hu, Zhangming Mao, Huai Zheng, Quan Chen, Sheng Liu, Xiaobing
Luo*, A compact thermal model to predict the junction temperature of high
power light emitting diode package, the 62th Electronic Components and
Technology Conference(ECTC), p 1781-1785, 2012
[166] Huai Zheng, Jinlong Ma, Xiaobing Luo*, Sheng Liu, Precise model of
phosphor geometry formed in dispensing process of LED packaging, 12th
International Proceedings of the Electronic Packaging Technology Conference, p
1077-1080, 2011
[167] Zhimin Wan, Ling Xu, Yang Zhang, Xiaobing Luo*, Mingxiang Chen,
Junjie Chen, Sheng Liu, Thermal analysis and improvement of high power
electronic packages, 12th International Proceedings of the Electronic Packaging
Technology Conference, p 27-31, 2011
[168] Run Hu, Xiaobing Luo*, Sheng Liu, Effect of the amount of phosphor
silicone gel on optical property of white light-emitting diodes packaging, 12th
International Proceedings of the Electronic Packaging Technology Conference, p
1081-1084, 2011
[169] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Thermal stress analysis of PBGA
under natural convection using a fluid-solid coupling method, 12th International
Proceedings of the Electronic Packaging Technology Conference, p 589-595,
2011
[170] Bulong Wu, Xiaobing Luo*, Zhili Zhao, Sheng Liu, Effect investigation of
delamination on optical output of high power LEDs, 12th International
Proceedings of the Electronic Packaging Technology Conference, p 1072-1076,
2011
[171] Xiaobing Luo*, Han Feng, Jv Liu, Ming Lu Liu, Sheng Liu, An
experimental investigation on thermal contact resistance across metal contact
interfaces, 12th International Proceedings of the Electronic Packaging Technology
Conference, p 733-738, 2011
[172] Quan Chen, Xiaobing Luo*, Run Chen, Sang Wang, Zhaohui Chen, Sheng
Liu, Junction temperature study during degradation process of high power
light-emitting diodes, 12th International Proceedings of the Electronic Packaging
Technology Conference, p 924-927, 2011
[173] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Effect of blind hole depth and
shape of solder joint on the reliability of through silicon via (TSV), the 61th
Electronic Components and Technology Conference(ECTC), p 1657-1661, 2011
[174] Zhangming Mao, Xiaobing Luo*, Sheng Liu, Compact thermal model for
microchannel substrate with high temperature uniformity subjected to multiple
heat sources, the 61th Electronic Components and Technology
Conference(ECTC), p 1662-1672, 2011
[175] Bulong Wu, Xiaobing Luo*, Sheng Liu, Effect mechanism of moisture
diffusion on LED reliability, Electronics System Integration Technology
Conference, ESTC 2010
[176] Chuan Liu, Xiaobing Luo*, Zhuo Zhang, Xuefang Wang, Sheng Liu, A hot
platinum thin film anemometer, 11th International Proceedings of the Electronic
Packaging Technology Conference, p 1297-1301, 2010
[177] Zhangming Mao, Xiaobing Luo*, Janghui Yang, Sheng Liu, Moisture
diffusivity analysis of polycarbonate for LED lens, 11th International Proceedings
of the Electronic Packaging Technology Conference, p1080-1087, 2010
[178] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Thermal stress analysis of PBGA
using a fluid-solid coupling method under steady convective heat transfer, 11th
International Proceedings of the Electronic Packaging Technology Conference, p
525-529, 2010
[179] Ju Liu, Han Feng, Xiaobing Luo*, Run Hu, Sheng Liu, A simple setup to
test thermal contact resistance between interfaces of two contacted solid materials,
11th International Proceedings of the Electronic Packaging Technology
Conference, p 116-120, 2010
[180] Xiaobing Luo*, Zhangming Mao, Sheng Liu, Thermal design of a 16W LED
bulb based on thermal analysis of a 4W LED bulb, the 60th Electronic
Components and Technology Conference(ECTC), p1906-1911, 2010
[181] Kai Wang, Zhangming Mao, Zongyuan Liu, Fei Chen, Hao Chen, Xiaobing
Luo, Sheng Liu, An application specific LED packaging module integrated with
optical, cooling and powering functions, the 60th Electronic Components and
Technology Conference(ECTC), p686-692, 2010
[182] Xiaobing Luo*, Run Hu, Tinghui Guo, Xiaolei Zhu, Wen Chen, Zhangming
Mao, Sheng Liu, Low thermal resistance LED light source with vapor chamber
coupled fin heat sink, the 60th Electronic Components and Technology
Conference(ECTC), p 1347-1352, 2010
[183] Yonglu Liu, Xiaobing Luo*, Wei Liu, Cooling behavior in a novel heat sink
based on multilayer staggered honeycomb structure, Proceedings of the ASME
Micro/Nanoscale Heat and Mass Transfer International Conference 2009, v 3, p
131-135, 2010
[184] Yonglu Liu, Xiaobing Luo*, Wei Liu, Experimental study on a honeycomb
micro channel cooling system, Proceedings of the 7th International Conference
on Nanochannels, Microchannels, and Minichannels, nPART A, p 267-272, 2009
[185] Yonglu Liu, Xiaobing Luo*, Wei Liu, Zhifeng Huang, Thermal
performance of the multilayered honeycomb microchannel heat sink, 2009
International Conference on Energy and Environment Technology, v 1, p 487-490,
2009
[186] Xiaobing Luo*, Yonglu Liu, Wei Liu, A honeycomb micro channel cooling
system for electronics cooling, Proceedings of the 7th International Conference
on Nanochannels, Microchannels, and Minichannels, n PART A, p 261-265, 2009
[187] Xiaobing Luo*, Zhangming Mao, Sheng Liu, A thermal model for
calculating thermal resistance of eccentric heat source on rectangular plate with
convective cooling existing at upper and lower surfaces, 10th International
Proceedings of the Electronic Packaging Technology Conference, p 294-298,
2009
[188] Xiaobing Luo*, Wei Xiong, Ting Cheng, Sheng Liu, Design and
optimization of horizontally-located plate fin heat sink for high power LED street
lamps, the 59th Electronic Components and Technology Conference(ECTC), p
854-859, 2009
[189] Ting Cheng, Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis
and optimization of multiple LED packaging based on a general analytical
solution, the 59th Electronic Components and Technology Conference(ECTC), p
1988-1993, 2009
[190] Ting Cheng, Wei Xiong, Xiaobing Luo*, Suyi Huang, Zhiyin Gan, Sheng
Liu, Thermal management of a multi-core master processing unit (MPU) for an
ultrascalable computing platform, 9th International Proceedings of the Electronic
Packaging Technology Conference,2008
[191] Ting Cheng, Xiaobing Luo*, Suyi Huang, Zhiyin Gan, Sheng Liu,
Simulation on thermal characteristics of LED chips for design optimization, 9th
International Proceedings of the Electronic Packaging Technology Conference,
2008
[192] Xiaobing Luo*, Wei Xiong, Sheng Liu, A simplified thermal resistance
network model for high power LED street lamp, 9th International Proceedings of
the Electronic Packaging Technology Conference, 2008
[193] Xiaobing Luo*, Sheng Liu, A closed micro jet cooling system for high
power LEDs, 7th International Proceedings of the Electronic Packaging
Technology Conference, 2006