casis national design challenge phase ii kickoff meeting

ELECTRONIC SYSTEMS ENGINEERING TECHNOLOGYT E X A S A & M U N I V E R S I T Y

Innovating tomorrow’s products and systems today

CASISNATIONAL DESIGN

CHALLENGEPHASE II

KICKOFF MEETINGESET/MISL/PIC

OVERVIEW

Dr. Joseph A. Morgan, P.E.

Professor, Texas A&M University

May 8-9, 2014

GOVER

NM

ENT IN

DUSTRY

ACADEMIA



Focus on electronic products and systems

Experiential learning basedCurriculum consists of three

technical tracks with integrated systems level courses

Culminating in real-world experienceCapstone Design ProjectTwo semester sequence

ESET Program

Analog/Digital Electronics

Embedded Systems

Communications

Products and Systems

Instrumentation and Controls

Testing

Quality

Product Development

Experiential Capstone



Support and Encourage InnovationMultidisciplinary

ActivitiesEntrepreneurshipCommercialization

Facility 3400 ft2 facilityOpened – Feb 20135 functional areas3 support areas

Unique Features24/7 operationStudent operated

Mobile Integrated Solutions Laboratory/Product Innovation Cellar

PRODUCT INNOVATION

CELLAR



Development AreaDesign SuiteMechanical FabElectronics FabCollaboration RoomSTEM PROJECTS

Krisys RoboticsNESI

Extreme ScienceNDC

Zero Robotics100kFt Rocket Payload

MISL/PIC



Embedded systems development expertiseElectronics SoftwareTest & Validation Documentation

STEM interestOutreach RecruitingMotivation Education

NDC experienceResources

Physical PersonnelIndustry Partnerships

What MISL/PIC brings to the table



Educate using the real stuffVideo tutorials

Record screenRecord voiceWatch how to do it – not read how to do it

Share knowledgeMentors with teamsTeams with teams

Recommend student leadersHardware EngineerSoftware Engineer

Educational Approach



Dates – July 2x – 2y Format

3 days Hands on Interaction

Introduction Enclosure NESI Board and peripherals Example project

Process Hardware development Sensors and Actuators Interfacing -- Sparkfun Software development Integration Testing

Teacher Workshop -- NESI



NESI Board in NanoRacks Endcap

3.75”

Features:• Space Qualified by

NanoRacks• Designed specifically

for 1U and 1.5U enclosures

• Common elements on board

Upgrades for Phase II:• New interfaces (I2C)• Common connectors• More control



NESI Board Functionality



Example - Camera

61 4

Camera Enable

5/6

2

3

JP15

1

2

3

JP7

1

4

2

3

JP13

1

4

6

5

• On Board Camera Mount • Secondary Header

TX

RX

IC1

3

LowSide

PowerDriver

3.3V

• Camera Power Control Header

PIC24

RP19

RP26

PIC24

DO E1



Schematic



On the Board

Internal camera interface -- Grd selectable

External camera interface - ON

Grd Select



Recipe For SuccessA step-by-step guide for the

successful Integration of

NESI Board

into

NDC Experiment



Electronic Hardware Students take ownership of NESI Board

Configure Solder components

Design Conceptual Functional

Software Storyboard C Programming Language Modify/integrate code modules

Test and ValidateProven process that works

Pantry (wiki) – all resources available Recipe – step-by-step approach to effective

communications and success

Embedded Systems



Functional Diagram



Main• The main method of the

microcontroller will water the plants, store the values, and take the pictures.



Systems Check• The system

checks all sensors to make sure that sufficient power is reaching all of the sensors that we need.



Check-off ListHardware Engineer Software Engineer All Team Members

Hardware Overview - -

Soldering Videos - -

Soldering NESI Board - -

- Download MPLAB X -

- Software Environment Test -

- Download/Unzip Code -

- NESI Software -

- - Hardware Integration

- - Create Storyboard

- - Determine Peripherals

- - Create FBD

- - Start Experiment



HARDWARE



Watch Hardware OverviewThe first step for the hardware engineer is to

watch the NESI Hardware Overview videoThe NESI Hardware Overview video can be

accessed using the following link: https://www.youtube.com/watch?v=ydAVm43RE8g

The NESI Board Schematic can be found at: http://nesiwiki.tamu.edu/images/5/54/NESI_Schematic1.3.pdf

https://www.youtube.com/watch?v=ydAVm43RE8g

https://www.youtube.com/watch?v=ydAVm43RE8g

http://nesiwiki.tamu.edu/images/5/54/NESI_Schematic1.3.pdf





SOFTWARE



Download MPLAB XThe first step of the software engineer is to

download MPLAB X and the XC16 compiler from microchip.com

Video that details process can be found at : https://www.youtube.com/watch?v=vo1ejavY84o

Microchip website for download: https://www.microchip.com/pagehandler/en-us/family/mplabx/

Notes: Make sure to download latest versions

https://www.youtube.com/watch?v=vo1ejavY84o

https://www.youtube.com/watch?v=vo1ejavY84o

https://www.microchip.com/pagehandler/en-us/family/mplabx/





ALL



Watch Hardware IntegrationWatch the Example Project: Hardware

Integration videoThe video walks step-by-step from a problem

statement to a completed hardware setThe Hardware Integration video can be

accessed using the following link: https://www.youtube.com/watch?v=rJpJuohw0ss

Note: This step is to be completed by all members of the team

https://www.youtube.com/watch?v=rJpJuohw0ss

https://www.youtube.com/watch?v=rJpJuohw0ss



NDC Project Development Timeline

Project Timeline

Hardware Activities

Software Activities

Management Activities



Mentor Team J. Morgan, D. Karrer, C. ShumankOne undergrad student per team

NDCwiki.tamu.eduOn-line supportRestricted development community

Zoom Video ConferencesBrainstormingProblem solving Scheduled (mentor and team)

Industry PartnershipsSparkfunMicrochipNanoRacksOthers

Support

http://ndcwiki.tamu.edu/index.php?title=Main_Page



Soldering ironDevelopment computerHigh speed internet accessZoom audio/video capability

SensorsActuatorsData Card(s)Experiment materials

Required Resources



GOVER

NM

ENT IN

DUSTRY

ACADEMIA

casis national design challenge phase ii kickoff meeting

Documents

systems instrumentation

systems todayeducate

systems todaysupport

systems todayfocus

systems todaydates

systems todayexample

electronic products

board upgrades