buk7675-55a - nexperia n-channel trenchmos standard level fet 25 august 2014 product data sheet 1....

BUK7675-55AN-channel TrenchMOS standard level FET25 August 2014 Product data sheet

1. General descriptionStandard level N-channel enhancement mode Field-Effect Transistor (FET) in a plasticpackage using TrenchMOS technology. This product has been designed and qualified tothe appropriate AEC standard for use in automotive critical applications.

2. Features and benefits• AEC Q101 compliant• Low conduction losses due to low on-state resistance• Suitable for standard level gate drive sources• Suitable for thermally demanding environments due to 175 °C rating

3. Applications• 12 V and 24 V loads• Automotive and general purpose power switching• Motors, lamps and solenoids

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 55 V

ID drain current VGS = 10 V; Tmb = 25 °C; Fig. 2; Fig. 3 - - 20.3 A

Ptot total power dissipation Tmb = 25 °C; Fig. 1 - - 62 W

Static characteristics

VGS = 10 V; ID = 10 A; Tj = 175 °C;Fig. 11; Fig. 12

- - 150 mΩRDSon drain-source on-stateresistance


- 64 75 mΩ

Avalanche ruggedness

EDS(AL)S non-repetitive drain-source avalancheenergy

ID = 11 A; Vsup ≤ 55 V; RGS = 50 Ω;VGS = 10 V; Tj(init) = 25 °C; unclamped

- - 30.3 mJ

© Nexperia B.V. 2017. All rights reserved

Nexperia BUK7675-55AN-channel TrenchMOS standard level FET

BUK7675-55A All information provided in this document is subject to legal disclaimers.

Product data sheet 25 August 2014 2 / 12

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 G gate

2 D drain

3 S source

mb D mounting base; connected todrain

mb

1 3

2

D2PAK (SOT404)

S

D

G

mbb076

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

BUK7675-55A D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads(one lead cropped)

SOT404

7. MarkingTable 4. Marking codesType number Marking code

BUK7675-55A BUK7675-55A

8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 55 V

VDGR drain-gate voltage RGS = 20 kΩ - 55 V

VGS gate-source voltage -20 20 V

Ptot total power dissipation Tmb = 25 °C; Fig. 1 - 62 W

Tmb = 25 °C; VGS = 10 V; Fig. 2; Fig. 3 - 20.3 AID drain current

Tmb = 100 °C; VGS = 10 V; Fig. 2 - 14.3 A

IDM peak drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs; Fig. 3 - 81 A

Tstg storage temperature -55 175 °C

Tj junction temperature -55 175 °C





Symbol Parameter Conditions Min Max Unit

Source-drain diode

IS source current Tmb = 25 °C - 20.3 A

ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 81 A

Avalanche ruggedness

EDS(AL)S non-repetitive drain-sourceavalanche energy

ID = 11 A; Vsup ≤ 55 V; RGS = 50 Ω;VGS = 10 V; Tj(init) = 25 °C; unclamped

- 30.3 mJ

Tmb (°C)0 20015050 100

03na19

40

80

120

Pder(%)

0

Fig. 1. Normalized total power dissipation as afunction of mounting base temperature

Tmb (°C)0 20015050 100

03aa24

40

80

120

Ider(%)

0

Fig. 2. Normalized continuous drain current as afunction of mounting base temperature

03nc12

10

1

102

103

ID(A)

10- 1

VDS (V)1 10210

RDSon = VDS / ID

D.C.

tp = 10 µs

100 µs

1 ms

10 ms100 ms

tp

tp

T

P

t

Tδ =

Fig. 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage





9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

Rth(j-mb) thermal resistancefrom junction tomounting base

Fig. 4 - - 2.4 K/W

Rth(j-a) thermal resistancefrom junction toambient

mounted on printed-circuit board;minimum footprint

- 50 - K/W

03nc13

tp (s)10- 6 10- 1 110- 210- 310- 5 10- 4

1

10- 1

10

Zth(j-mb)(K/W)

10- 2

tp

tp

T

P

t

Tδ =

single shot

0.2

δ = 0.5

0.02

0.050.1

Fig. 4. Transient thermal impedance from junction to mounting base as a function of pulse duration

10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

Static characteristics

ID = 0.25 mA; VGS = 0 V; Tj = 25 °C 55 - - VV(BR)DSS drain-sourcebreakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = -55 °C 50 - - V

ID = 1 mA; VDS = VGS; Tj = 175 °C;Fig. 10

1 - - V

ID = 1 mA; VDS = VGS; Tj = 25 °C;Fig. 10

2 3 4 V

VGS(th) gate-source thresholdvoltage

ID = 1 mA; VDS = VGS; Tj = -55 °C;Fig. 10

- - 4.4 V

VDS = 55 V; VGS = 0 V; Tj = 175 °C - - 500 µAIDSS drain leakage current

VDS = 55 V; VGS = 0 V; Tj = 25 °C - 0.05 10 µA





Symbol Parameter Conditions Min Typ Max Unit

VGS = 20 V; VDS = 0 V; Tj = 25 °C - 2 100 nAIGSS gate leakage current

VGS = -20 V; VDS = 0 V; Tj = 25 °C - 2 100 nA


- - 150 mΩRDSon drain-source on-stateresistance


- 64 75 mΩ

Dynamic characteristics

Ciss input capacitance - 320 483 pF

Coss output capacitance - 92 113 pF

Crss reverse transfercapacitance

VGS = 0 V; VDS = 25 V; f = 1 MHz;Tj = 25 °C; Fig. 13

- 64 90 pF

td(on) turn-on delay time - 10 - ns

tr rise time - 50 - ns

td(off) turn-off delay time - 70 - ns

tf fall time

VDS = 30 V; RL = 1.2 Ω; VGS = 10 V;RG(ext) = 10 Ω; Tj = 25 °C

- 40 - ns

from upper edge of drain mountingbase to centre of die; Tj = 25 °C

- 2.5 - nHLD internal draininductance

from drain lead 6 mm from package tocentre of die; Tj = 25 °C

- 4.5 - nH

LS internal sourceinductance

from source lead to source bond pad;Tj = 25 °C

- 7.5 - nH

Source-drain diode

VSD source-drain voltage IS = 15 A; VGS = 0 V; Tj = 25 °C; Fig. 14 - 0.85 1.2 V

trr reverse recovery time - 32 - ns

Qr recovered charge

IS = 20 A; dIS/dt = -100 A/µs;VGS = -10 V; VDS = 30 V; Tj = 25 °C - 120 - nC





03nc09

0

10

20

30

40

50

60

0 2 4 6 8 10VDS (V)

ID(A)

4.5

5.5

6.5

7.5

8.5

2014

9.5

12

10.5

VGS (V) = 16

Fig. 5. Output characteristics; drain current as afunction of drain-source voltage; typical values

03nc08

40

60

80

100

120

140

160

5 10 15 20VGS (V)

RDSon(mΩ)

Fig. 6. Drain-source on-state risistance as a functionof gate-source voltage; typical values

03aa35

VGS (V)0 642

10- 4

10- 5

10- 2

10- 3

10- 1

ID(A)

10- 6

min typ max

Fig. 7. Sub-threshold drain current as a function ofgate-source voltage

03nc07

0

5

10

15

20

25

0 2 4 6 8 10VGS (V)

ID(A)

Tj = 175 °C

Tj = 25 °C

Fig. 8. Transfer characteristics: drain current as afunction of gate-source voltage; typical values





03nc05

0

2

4

6

8

10

0 5 10 15QG (nC)

VGS(V) VDD = 44 V

VDD = 14 V

Fig. 9. Gate-source voltage as a function of gatecharge; typical values

Tj (°C)- 60 1801200 60

03aa32

2

3

1

4

5VGS(th)

(V)

0

max

typ

min

Fig. 10. Gate-source threshold voltage as a function ofjunction temperature

03nc10

40

60

80

100

120

140

160

180

0 10 20 30 40 50ID (A)

RDSon(mΩ) 5.5 6 6.5 8 VGS (V) = 107

Fig. 11. Drain-source on-state resistance as a functionof drain current; typical values

Tj (°C)- 60 1801200 60

03aa28

1.2

0.6

1.8

2.4

a

0

Fig. 12. Normalized drain-source on-state resistancefactor as a function of junction temperature





03nc11

0

100

200

300

400

500

600

10- 2 10- 1 1 10 102VDS (V)

C(pF)

Ciss

Coss

Crss

Fig. 13. Input, output and reverse capicitances as afunction of drain-source voltage; typical values

03nc04

0

20

40

60

80

100

120

0 0.5 1.0 1.5 2.0VSD (V)

IS(A)

Tj = 175 °C

Tj = 25 °C

Fig. 14. Reverse diode current as a function of reversedioode voltage; typical values





11. Package outline

ReferencesOutlineversion

Europeanprojection Issue date

IEC JEDEC JEITA

SOT404

sot404_po

06-03-1613-02-25

Unit

mmmaxnommin

4.5

4.1

1.40

1.27

1.45

1.05

0.64

0.46

11 1.6

1.2

A

Dimensions (mm are the original dimensions)

Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404

A1 b

0.85

0.60

b2 c D D1 E e HD Lp Q

2.5415.8

14.8

2.6

2.2

10.3

9.7

2.9

2.1

0 5 mm

scale

e e

E

b

D1

HD

D

b2

Q

Lp

c

A1

A

1 3

2

mountingbase

Fig. 15. Package outline D2PAK (SOT404)





12. Legal information

12.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

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Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use in automotive applications — This Nexperiaproduct has been qualified for use in automotiveapplications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

12.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





13. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................29 Thermal characteristics .........................................410 Characteristics .......................................................411 Package outline ..................................................... 912 Legal information .................................................1012.1 Data sheet status ............................................... 1012.2 Definitions ...........................................................1012.3 Disclaimers .........................................................1012.4 Trademarks ........................................................ 11

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 25 August 2014