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BC857QAS45 V, 100 mA PNP/PNP general-purpose transistor8 July 2015 Product data sheet

1. General descriptionPNP/PNP general-purpose transistor in a leadless ultra small DFN1010B-6 (SOT1216)Surface-Mounted Device (SMD) plastic package.

NPN/NPN complement: BC847QAS.

NPN/PNP complement: BC847QAPN.

2. Features and benefits• Reduces component count• Reduces pick and place costs• AEC-Q101 qualified• Low package height of 0.37 mm

3. Applications• General-purpose switching and amplification• Mobile applications

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

Per transistor

VCEO collector-emittervoltage

open base - - -45 V

IC collector current - - -100 mA

Per transistor

hFE DC current gain VCE = -5 V; IC = -2 mA; Tamb = 25 °C 200 - 450

© Nexperia B.V. 2017. All rights reserved

Nexperia BC857QAS45 V, 100 mA PNP/PNP general-purpose transistor

BC857QAS All information provided in this document is subject to legal disclaimers.

Product data sheet 8 July 2015 2 / 13

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 E1 emitter TR1

2 B1 base TR1

3 C2 collector TR2

4 E2 emitter TR2

5 B2 base TR2

6 C1 collector TR1

7 C1 collector TR1

8 C2 collector TR2

Transparent top view

1 67

8

2

3

5

4

DFN1010B-6 (SOT1216)

sym018

21 3

56

TR1TR2

4

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

BC857QAS DFN1010B-6 DFN1010B-6: plastic thermal enhanced ultra thin small outlinepackage; no leads; 6 terminals

SOT1216

7. MarkingTable 4. Marking codesType number Marking code

BC857QAS 10 01 00

MARKING CODE(EXAMPLE)

PIN 1 INDICATION MARK

YEAR DATECODE

READING DIRECTION

READING EXAMPLE:

110110 aaa-007665

MARK-FREE AREA

Fig. 1. DFN1010B-6 (SOT1216) binary marking code description





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

Per transistor

VCBO collector-base voltage open emitter - -50 V

VCEO collector-emitter voltage open base - -45 V

VEBO emitter-base voltage open collector - -6 V

IC collector current - -100 mA

ICM peak collector current - -200 mA

IBM peak base current

single pulse; tp ≤ 1 ms

- -100 mA

Ptot total power dissipation Tamb ≤ 25 °C [1] - 230 mW

Per device

Ptot total power dissipation Tamb ≤ 25 °C [1] - 350 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standardfootprint.

Tamb (°C)-75 17512525 75-25

aaa-007377

200

100

300

400

Ptot(mW)

0

FR4 PCB, standard footprint

Fig. 2. Per device: Power derating curve





9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

Per transistor

Rth(j-a) thermal resistancefrom junction toambient

in free air [1] - - 543 K/W

Per device

Rth(j-a) thermal resistancefrom junction toambient

in free air [1] - - 357 K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

aaa-007378

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(j-a)(K/W)

1

duty cycle =1

0.750.5

0.330.2

0.1

0.02 0.01

0

0.05

FR4 PCB, standard footprint

Fig. 3. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;typical values





10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

Per transistor

VCB = -30 V; IE = 0 A; Tj = 150 °C - - -5 µAICBO collector-base cut-offcurrent VCB = -30 V; IE = 0 A; Tamb = 25 °C - - -15 nA

IEBO emitter-base cut-offcurrent

VEB = -5 V; IC = 0 A; Tamb = 25 °C - - -100 nA

hFE DC current gain VCE = -5 V; IC = -2 mA; Tamb = 25 °C 200 - 450

IC = -10 mA; IB = -0.5 mA; Tamb = 25 °C - - -100 mVVCEsat collector-emittersaturation voltage IC = -100 mA; IB = -5 mA; pulsed;

tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C- - -300 mV

IC = -10 mA; IB = -0.5 mA; Tamb = 25 °C - -760 - mVVBEsat base-emitter saturationvoltage IC = -100 mA; IB = -5 mA; pulsed;

tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C- -900 - mV

VCE = -5 V; IC = -2 mA; Tamb = 25 °C -600 -660 -725 mVVBE base-emitter voltage

VCE = -5 V; IC = -10 mA; Tamb = 25 °C - -710 -820 mV

CC collector capacitance VCB = -10 V; IE = 0 A; ie = 0 A;f = 1 MHz; Tamb = 25 °C

- - 4 pF

CE emitter capacitance VEB = -0.5 V; IC = 0 A; f = 1 MHz;Tamb = 25 °C

- 10 - pF

fT transition frequency VCE = -5 V; IC = -10 mA; f = 100 MHz;Tamb = 25 °C

100 - - MHz

NF noise figure VCE = -5 V; IC = 0.2 mA; RS = 2 kΩ;f = 1 MHz; B = 200 Hz; Tamb = 25 °C

- - 10 dB





006aab425

IC (mA)- 10- 1 - 103- 102- 1 - 10

200

400

600

hFE

0

(1)

(2)

(3)

VCE = -5 V(1) Tamb = 150 °C(2) Tamb = 25 °C(3) Tamb = −55 °C

Fig. 4. DC current gain as a function of collectorcurrent; typical values

VCE (V)0 - 5- 4- 2 - 3- 1

006aab426

- 0.10

- 0.05

- 0.15

- 0.20

IC(A)

0

IB (mA) = - 3.5

- 0.7

- 3.15- 2.8

- 1.4

- 2.1- 2.45

- 1.75

- 1.05

- 0.35

Tamb = 25 °C

Fig. 5. Collector current as a function of collector-emitter voltage; typical values

- 200

- 1200

- 400

- 600

- 800

- 1000

mle193

- 10- 2 - 10- 1

(1)

- 1IC (mA)

VBE(mV)

- 10 - 102 - 103

(3)

(2)

VCE = -5 V(1) Tamb = -55 °C(2) Tamb = 25 °C(3) Tamb = 150 °C

Fig. 6. Base-emitter voltage as a function of collectorcurrent; typical values

- 200

- 1200

- 400

- 600

- 800

- 1000

mle195

- 1- 10- 1IC (mA)

VBEsat(mV)

- 10 - 102 - 103

(1)

(3)

(2)

IC/IB = 20(1) Tamb = -55 °C(2) Tamb = 25 °C(3) Tamb = 150 °C

Fig. 7. Base-emitter saturation voltage as a function ofcollector current; typical values





- 104

- 103

- 102

- 10

mle194

- 10- 1 - 1 - 10IC (mA)

VCEsat(mV)

- 102 - 103

(2)

(3)

(1)

IC/IB = 20(1) Tamb = 150 °C(2) Tamb = 25 °C(3) Tamb = -55 °C

Fig. 8. Collector-emitter saturation voltage as afunction of collector current; typical values

006aab427

IC (mA)- 10- 1 - 102- 10- 1

108

109

fT(Hz)

107

Tamb = 25 °C;VCE = -5 V;f = 100 MHz

Fig. 9. Transition frequency as a function of collectorcurrent; typical values





11. Test information

11.1 Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.

12. Package outline

5

32

13-03-05Dimensions in mm

0.340.40

0.04max

0.951.05

0.220.30

0.1250.205

1.051.15

0.275 0.275

0.320.40

0.35 0.35

1

6 4

0.150.23

Fig. 10. Package outline DFN1010B-6 (SOT1216)





13. Soldering

SOT1216Footprint information for reflow soldering of DFN1010B-6 package

sot1216_fr

solder land

solder resist

solder land plus solder paste

occupied area

Dimensions in mm

Issue date 13-03-0614-07-28

0.3 (6x)

1.10.6

0.250.35

0.35

0.51.21.3

0.25

1

1.35

0.35

0.15 0.150.2 (6x)

0.35

0.9

Fig. 11. Reflow soldering footprint for DFN1010B-6 (SOT1216)





14. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

BC857QAS v.2 20150708 Product data sheet - BC857QAS v.1

Modification: • Change of binary marking code position.

BC857QAS v.1 20140725 Product data sheet - -





15. Legal information

15.1 Data sheet statusDocumentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

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Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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No offer to sell or license — Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant, conveyance or implication of any license under any copyrights, patentsor other industrial or intellectual property rights.

Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

15.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................39 Thermal characteristics .........................................410 Characteristics .......................................................511 Test information ..................................................... 811.1 Quality information ............................................... 812 Package outline ..................................................... 813 Soldering ................................................................ 914 Revision history ...................................................1015 Legal information .................................................1115.1 Data sheet status ............................................... 1115.2 Definitions ...........................................................1115.3 Disclaimers .........................................................1115.4 Trademarks ........................................................ 12

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 08 July 2015