1

Thomas Kolossa / Balver ZinnHead of Techn. DepartmentCertified IPC-A-610 Trainer (CIT)thomas.kolossa@balverzinn.com

Balver Zinn_CobarJosef Jost GmbH & Co.KG

Blintroper Weg 11

58802 Balve / Germany

www.balverzinn.com / www.cobar.com

SN100C (SnCu0,7Ni0,05Ge0,005)

2

Agenda

93% of wave and selective soldering users do not need the extremly good properties of SN100C (SnCu0,7NiGe) but can enjoy the cost benefits of silver free alloys andreally protect our environment.

Lead Free Alloy Choice

- Company- SN100C- Wave soldering with SN100C- Approvals

3

History1973 Establishment as a private company Josef Jost tin and metal wholesale:

Casting of tin and for the galvanic industry, table-ware tin and soldering technics in Balve.

1976 Building of a production hall and an office building in Balve “Auf demWerenfelde"

1977-84 Upgrading and expansion of the halls in Balve.1983 Rename into Balver Zinn KG Josef Jost.1986-7 Building of the production halls and the office building for the zinc foundry in

Garbeck "Blintroperweg"1990-1 Building of the Ba-Ti-Loy solder wire production in Garbeck.1991 First QM certifying according to DIN 90021992-3 Building of the Balver Zinn II zinc wire production in Garbeck.1994-6 Building of the Balver Zinn III storage hall in Garbeck.

2000 First EMS certifying according to DIN 140012002 Cooperation with Nihon Superior, Japan2003 Cooperation with Nihon Superior, Japan; solder wire production in Malaysia.

1999 Rename into the Balver Zinn Josef Jost GmbH & Co KG

2007 Merger Balver Zinn / Cobar

4

Balver Zinn_CobarJost Zinc FounderCapacity: 2700to./Month(Single Mould Casting)

3350to./Month(Wire, Continius Casting)Alloy: Zn, ZnAl; ZnTi, ZnMn, etc.Market: Automotive , Surface Treatment, Targets, etc.

Balver Zinn Josef Jost (Recycling)Capacity: 950to./Month (Single-Continius Casting)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer;etc.

BaTiLoyCapacity: 450to./Month(Wire; Anodes)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer etc.

CobarCapacity: 10.000l / Day (Flux)

900kg / Day (Paste)Alloy: SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer; etc.

5

Balver Zinn_Cobar!!

- ParkheathUNITED KINGDOM

- Balver Zinn- Sub distributors

GERMANY

- Dial Electrolux- Intertechs

RUSSIA

SLOVAKIA- PBT Rosnov

CZECH REPUBLIC

-PEM TechnologiesSOUTH AFRICA

- Soldering Technologies

SPAIN

- Dilectro- Arnaud

FRANCE

- SiprelITALY

POLAND- CH Erbsloeh Polska

- Candor SwedenSWEDEN

- Cobar BeneluxBENELUX

- SelasTURKEY

- ATT Hungary

HUNGARYROMANIA

- Candor DenmarkDENMARK

- CH Erbsloh BalticBALTIC

- Candor FinlandFINLAND

-MetallexSWITZERLAND

- ATT AustriaAUSTRIA

SLOVENIA

6

SN100C / Statements

It behaves as a eutectic

It is compliant

Low copper erosion

Low dross

Not aggressive toward stainless steel

Cost not inflated by silver content

7

SN100C / Statements

World’s 2nd Most Widely Used Lead-free Wave Solder

Rapidly catching up on SAC305

Most Widely Used Lead-free Wave Solder in Europe

Most Widely Used Lead-free HASL Alloy

Increasing use as reflow solder

Popular flux-cored solder wire

8

Alloy

SN100C ™Legierung: SnCu0,7NiGeSchmelzpunkt: 227 ºCDichte: 7,4 g/cm³

+ Günstiger Preis

+ Krätzebildung

+ Glänzende Lötstelle

+ Duktilität

+ Zuverlässigkeit

- Schmelzpunkt 227 °C

9

Alloy

SAC 305Legierung: SnAg3,0Cu 0,5Schmelzbereich: 217 – 219 ºCDichte: 7,5 g/cm³

+ Schmelzbereich 217 – 219°C

+ Bekannt (IPC)

+ Langjährige Erfahrung

- Hoher Preis

- Hohe Kupferablösung

- Edelstahlkorrosion

- Krätzebildung

- Duktilität

- Oberfläche / Lunker

10

Alloy

LowSACLegierung: SnCu0,7Ag0,3Schmelzpunkt: 217 – 228 ºCDichte: 7,37 g/cm³

+ Günstiger Preis

- Schmelzbereich 217 - 228 °C

- Krätzebildung

- Fließverhalten

- Kupferablösung

- Edelstahlkorrosion

- Oberfläche

11

Alloy

SnCu0,7Legierung: SnCu0,7Schmelzpunkt: 227 ºCDichte: 7,4 g/cm³

+ Günstiger Preis

- Schmelzpunkt 227 °C

- Krätzebildung

- Oberfläche / Lunker

12

Solidification Behaviour

SN100CSn-0.7Cu

Cooling Rate ~ 5°C/sec

13

Solidification Behaviour

Fast Cooling

SAC305

Slow Cooling

The surface is a reflection of what is going on inside the alloy.A grainy cracked surface is telling you that the alloy is not behaving like a eutectic.

…. that is not behaving like “63/37”

14

Nickel (Ni)

Hohe Tolerierbarkeit von Ni-Gehalten bis 0,1%

Nickel wird in SnAgCu und SnCu Loten als Kornfeinungselement eingesetzt (erhöht die Zuverlässigkeit, homogenes Gefüge)

Löst sich von NiAu und NiPdAu Oberflächen ab

Verlangsamt bei SnCu Loten die Cu Ablösung

15

SN100C / Ni

The Ni addition in SN100C concentrates in the Cu6Sn5 intermetallic

16

Property

Property SnPb SAC305 SN100CEutectic yes no yesCompliant yes no yesCopper Erosion low high lowDross medium high lowStainless Steel Erosion no yes noSilver no yes no

17

SN100C / Ni

The addition of Ni to the Sn-0.7Cu alloy significantly improves fluidity

18

Stable Intermetallic Layer

Initial thickness of intermetallic is greater in Sn-0.7Cu containing Ni and structure is more open

During ageing the intermetallic layer in the Ni-stabilised Sn-0.7Cu coating does not increase in thickness and the microstructure consolidates.

This stability of the intermetallic layer ensures a longer service life

19

Silber (Ag)Fließverhalten bei Zugabe von Silber

Erstarrungslunker Gefüge

20

Germanium (Ge)

Germanium ist ein Antioxydant

Verbesserung des Fließverhaltens

Nachlassende Wirkung bei Ge < 20 ppm

Keine Probleme bei Gehalten bis 80 – 100 ppm

21

SN100C / Ge

[Results]1. The Ni addition to the Sn-Cu lead-free increases fluidity of the solder

and eliminates bridging.2. The addition of Ge to the Sn-Cu-Ni alloy to make “SN100C” improves

the drainage properties of the solder to further reduce any tendency to bridging.

Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area)

To study the effect of bridge elimination, the icicle test was carried out and the drainage characteristic of solder wave were confirmed.

22

SN100C / Ge

1. Desk-top mini-wave solder pot

・Solder capacity: 7kg・Bath dimensions: 130mm x 150mm・Nozzle dimensions: 30mm x 30mm・Fall distance from the jet outlet to the surface of the bath: 35-40mm

2. Melting temperature: 255℃

3. Precondition the bath by operating for 30minutes in airat constant pump speed.Remove the dross generated this preconditioning.Start the test with the preconditioned solder bath.

4. Collect the dross every hour for 4hours and weigh.Calculate the quantity of dross per hour for each alloy.

23

SN100C / Ge

The effect of Ge

The dross generation of SN100C is half as much as that of SAC305.

24

SN100C / Ge

ⅠBridge elimination

The beneficial effect of Ge on drainage combined with the beneficial

Ⅱ Faster wetting

The Ni addition accelerates initial wetting and the Ge addition

Ⅲ Reduced dross generation

The thin film that Ge forms on the surface of solder bath reduces the

effect of Ni on fluidity ensures minimum bridges.

accelerates wetting after zero-crossing.

formation of the tin oxide that is the basis of dross.

25

Is there a difference for soldering process with different lead free alloys?

Are there special requirements for SN100C™?

Are there requirements in comparison to SAC – alloys?

How to manage the process with SN100C™?

Process indications for lead free wave soldering

Answer: It’s easier as expected!!

Wave Soldering with SN100C

26

AlloyMelting temp.

° C

Typical solder bath temp. for wave

soldering

°C

Difference between solder bath and melting temp.

Specific Gravity

g/cm3

Sn63Pb37 183 250 67 8.4

SN100C™ (SnCu0.7NiGe) 227 265 38 7.4

LowSAC (SnCu0.7Ag0.3) 217-228 265 38 7.37

SAC305 (SnAg3.0Cu0.5) 217-218 265 47 7.5

Sn63Pb37 SN100C™ LowSAC SAC305

Different Alloys

27

Typical settings and process requirements depends on machine type, PCB, flux, solder and components.

Sn63Pb37 SN100C™ LowSAC SAC305

Transportation speed [m/sec] 70 - 150 50 - 130 50 - 130 50 - 130

Preheating temperature

[°C]80-100 90 - 130 90 - 130 90 - 130

Contact time [sec.] 2 - 3 3 - 5 3 - 5 3 - 5

Typical Nozzle setting Chip + Laminary Turbulet Turbulet Turbulet

Please don’t consider this information as recommendations! This are only typical settings which can be found in most productions.

Requirements

28

Conclusion:Due to melting temperature and the process temperature for leadfree in comparison to SnPbthe process window is much smaller

The higher preheating temperature is required to reduce the thermal shock on components

There are not many differences between the different leadfree alloys in requirement and process conditions!

A higher contact time is required for lead free alloys. This can be achieved by lower transportation speed or nozzle type!

Requirements

29

Fluxes with higher activation temperature are required.For “No Clean” applications will be needed a very low solid contentThe requirements for fluxes are very height. Especially in machines with two waves. Here it’s important to ensure enough activation for the second waveWater based fluxes as BALVER ZINN 2420 has been developed especially for lead free applicationsCobar 390-RX-HT for example is a very suitable solution for alcohol based fluxes!

General Information / Flux

30

Preheating temperature depends on the used flux

Preheating temperature depends on the used PCB (multilayer; single layer)

Preheating temperature depends on the used components

There is no difference in preheating for SAC305, SN100C™ or other lead free alloys

Preheating

31

The preheating temperature will measured on the top of PCB!

Heater

PCB

No distinction in preheating for the different lead free alloys!

Heat

Prehaeting

32

Heat

We recommend to cover the heater of old machines!Advantages: Homogenous heating

Save energySave money

Less component impact

Cover: The evolution

Heater

Preheating

33

Recommendation for new equipment:Heaters from bottom and from top!!

Absolutely free for every processFree for every setup

Free for every problem

Heater on top: The revolution

Preheating

34

Recommendation for alcohol based flux: measured on top of PCB

Flux Cobar 390-RX-HT

Lead free: 90 –120°C

Profile!?

35

Recommendation for water based flux: measured on top of PCB

2420 NC

Lead free: 110 –130°C

Profile!?

36

Typical profile for SN100C™ alcohol based flux

Typical profile for SAC 305 alcohol based flux

Profile!?

37

Typical profile for SN100C™ water based flux

Typical profile for SAC 305 water based flux

Profile!?

38

Preheating temperature does not depends onthe used lead free alloy

There is no difference in preheating for SAC305, SN100C™ or other lead free alloys

Preheating temperature depends on the used components

Preheating temperature depends on the used flux

Conclusion:

Preheating

39

Solder Bath

40

Typical solder bath temperature for SN100C™: 265°C

Typical solder bath temperature for other lead free alloys: 265°C

For SN100C™ it can be found the same settings as for SAC- alloys

No difference for wave height, pressure or wave type

A chip wave is not often required

General Information

41

Chip WaveIn some cases the use of the chip wave is needed, it

depends on PCB, SMD-components on the bottom etc.

Set the pressure at a maximum level, but ensure that the PCB will be not over flown

Contact time should be no much longer than approx. 1 second

Ensure enough flux activation for the second solder wave

Chip waves decrease in some cases the hole filling

Wave Setting

42

1. Turbulent wave (two or more lines of holes)Keep the nozzle always hot by setting of standbyThe solder should stay in the holes of nozzleHeight between nozzle and PCB should be approx. 6–8

mmContact length approx. 35 – 45 mmNot overflow the PCBContact time should be 3 – 5 secondsWave height at approx. 1/3 of PCB thicknessMinimize the wave running times as less as possible

Wave Settings

43

1. Other Wave types (laminar etc.)Keep the nozzle always hot by setting of standbyThe solder should flow only if a PCB touches their surface.

Set careful the wave and back plate height Height between nozzle and PCB should be approx. 6–8 mmContact length approx. 35 – 45 mmNot overflow the PCBContact time should be 3 – 5 secondsWave height at approx. 1/3 of PCB thicknessMinimize the wave running times as less as possible

Wave Settings

44

Conclusion 3:

A wave soldering process is possible with different types of nozzles

the most important thing is a very well balance in setup

Contact time should be approx. 3 – 5 seconds

Contact length should be approx. 35 – 45 mm

Wave Settings

49

Conclusion 4:

SAC 305: height copper erosionSN100C™: less copper erosion, lower than SnPb!

What about electrical conductivity of board??What about thermal conductivity of board??What about alloy in pot composition during working??What about solder bath management??

Answer: Here, it can be found a difference between SAC and SN100C™!!

Copper Erosion

50

Sn-3.0Ag-0.5Cu 250°C, 3.3 seconds

50μm

Solder fillet

Copper laminate

Copper Erosion During Wave Soldering

Copper Erosion

51

Sn 3.0Ag 0.5Cu Sn 3.5Ag 0.7Cu SN100C™

NO COMMENT ON THIS!

Copper Erosion

52

Cu-trend SN100C™ Cu-trend SAC305

Results of over 38.000 solder bath analyses!

Copper Erosion

53

Can we find a difference between SAC305 and SN100C™ in maintenance??Why??

Because of solder bath management as showed!

Answer: Here, it can be found a difference between SAC and SN100C™!!

Maintenance

54

Dross formation (by Ge) in comparison to SAC305

Reduction of Dross by a small amount of Germanium (Ge)!!

Dross

55

Stainless steel erosion

Maintenance

56

Conclusion 5:

30-40 % less dross formation in comparison to SAC 305

Less stainless steel erosion

Costs saving due to less maintenance

Increasing of productivity due to less maintenance

Here, it can be found a difference between SAC and SN100C™ too!!

Maintenance

57

For SAC 305 and SN100C™ there are no differences in Flux application!

For SN100C™ it is not required a special or different preheating profile!

For SN100C™ it is not required a different solder bath temperature as for SAC – alloys!

Typical wave nozzles can be used without modifications!

Summary

58

The copper erosion is more less than with SAC 305!

The solder bath management is with this alloy much easier as with SAC 305!

SN100C™ helps to increase the productivity and reduce the maintenance

And last but not least: It is similar in characteristics and much cheaper!

Summary

59

SN100C / BoingJCAA/JG-PP Lead-free Project

60

SN100C / Boing

Vibration Testing

SN100C

Sn-Pb

Sn-3.9Ag-0.6Cu

61

SN100C / Boing

SN100C

SN100C is the only lead-free wave solder to be carried through to the next stage of this project, the NASA/DoD Lead-free Solder Project.

SN100C is also being included as a reflow solder.

CONCLUSIONSAC305 is a strong but brittle alloy than is not always the most reliable option.

62

Baugruppe B-CPU, Unterseite:

© Siemens AG, Corporate Technology

Siemens

63

Reflowprofilanpassung:

© Siemens AG, Corporate Technology

Siemens

64

Bosch

65

Imaps

66

Try…

Google Search

I’m feeling lucky

..for some independent information on SN100C.

SN100C vs SAC305

67

Thanks for your attentionVielen Dank für Ihre Aufmerksamkeit

Dziekuje za uwage

Grazie per l’attenzione

Gracias por su amabilidad

Tack för din uppmärksamhet

Gohairyo arigatou gozaimasu

Xie xie ni di zhu yi