bkvzbp52aw37fccpz6 · 1 copyright © 2007-2014 brightek (europe) limited. all rights reserved. the...

1 Copyright © 2007-2014 Brightek (Europe) Limited. All rights reserved. The information in this document is subject to change without notice.

www.brightekeurope.com

A C 1 0 2 5 9 S e r i e s

AC 10259 Series

FEATURES: Package: PLCC2 AC LED White SMT Package

Forward Current: 40mArms

Forward Voltage (typ.): 95-110Vrms

Luminous Flux (typ.): 235lm

Colour: Cool White

Colour Temperature (CCT): 5000K

Viewing angle: 115°

Materials:

Die: 8ea HV-LED in 2S4P with 4 HV Si-rectifier chips

Resin: Silicon (Yellow Diffused)

L/T Finish: Ag plated

Operating Temperature: -40~+85°C

Storage Temperature: -40~+100°C

Grouping parameters:

Forward Voltage

Luminous Flux

CIE Chromaticity

Soldering methods: Reflow

Preconditioning: MSL 3 according to JEDEC

Packing: 24mm tape with 1500/reel, ø180mm (7’’)

N0W10S17

APPLICATIONS: G9 Lamp

General Lighting

Indoor Lighting

Partner with:

Release D

ate: 24

July 2

01

4 V

ersion

: A1

.0

PRODUCT DATASHEET

► PLCC2 SMD

► AC 10259 Series

► Cool White (5000K)

Copyright © 2007-2014 Brightek (Europe) Limited. All rights reserved. The information in this document is subject to change without notice.

2


CHARACTERISTICS:

Absolute Maximum Characteristics (Ta=25°C)

Parameter Symbol Ratings Unit

AC Forward Current IF 60 mArms

Power Dissipation PD 4.8 W

Junction Temperature Tj 125 °C

Operating Temperature TOPR -40~+85 °C

Storage Temperature TSTG -40~+100 °C

Soldering Temperature TSOL 250 °C

Colour Rendering Index CRI 75 ---

Electrical & Optical Characteristics (Ta=25°C)

Parameter Symbol Values

Unit Test

Condition Min. Typ. Max.

Forward Voltage VF 95 --- 110 Vrms IF=40mArms

Luminous Flux ΦV 210 235 295 lm IF=40mArms

Chromaticity Coordinates

X 0.3408 --- 0.3601

--- IF=40mArms

Y 0.3509 --- 0.3859

Colour Temperature CCT --- 5000 --- K IF=40mArms

Viewing Angle 2θ1/2 --- 115 --- deg IF=40mArms

1. Luminous flux (ΦV) ±5%, Forward Voltage (VF) ±0.05V, Viewing angle(2θ1/2) ±10° 2. IS standard testing



OUTLINE DIMENSION:

Package Dimension:

1. All dimensions are in millimetre (mm).

2. Tolerance ±0.2mm, unless otherwise noted.

Recommended Soldering Pad Dimension:

Recommended PCB Solder Pad

1. Dimensions are in millimetre (mm).

2. Tolerance ±0.05mm with angle tolerance ±0.5°.


4


BINNING GROUPS:

Forward Voltage Classifications (IF = 40mArms):

Code Min. Max. Unit

L5 95 100

Vrms L6 100 105

L7 105 110

Luminous Flux (IF = 40mArms):

Code Min. Max. Unit

F42 210 235

lm F43 235 265

F44 265 295



CIE CHROMATICITY DIAGRAM:

Y

X

Cold State (sorting reference):

1 2 3 4

X Y X Y X Y X Y

EI3 0.3421 0.3709 0.3415 0.3609 0.3501 0.3679 0.3511 0.3784

EI4 0.3415 0.3609 0.3408 0.3509 0.3490 0.3574 0.3501 0.3679

EI5 0.3511 0.3784 0.3501 0.3679 0.3587 0.3749 0.3601 0.3859

EI6 0.3501 0.3679 0.3490 0.3574 0.3572 0.3639 0.3587 0.3749

Hot State (LED in use @Tj 85°C):

1 2 3 4

X Y X Y X Y X Y

EI3 0.3380 0.3620 0.3374 0.3520 0.3460 0.3590 0.3470 0.3695

EI4 0.3374 0.3520 0.3367 0.3420 0.3449 0.3485 0.3460 0.3590

EI5 0.3470 0.3695 0.3460 0.3590 0.3546 0.3660 0.3560 0.3770

EI6 0.3460 0.3590 0.3449 0.3485 0.3531 0.3550 0.3546 0.3660


6


ELECTRO-OPTICAL CHARACTERISTICS:

Relative Radiant Power v.s. Forward Current Forward Current v.s. Forward Voltage

Rel

ativ

e R

adia

nt

Po

wer

%

Forw

ard

Cu

rren

t (m

Arm

s)

Forward Current (mArms) Forward Voltage (Vrms)

Relative Radiant Power v.s. Junction Temp. Directive Radiation

Rel

ativ

e R

adia

nt

Po

wer

%

Junction Temperature Tj (°C)

Luminous Spectrum

Rel

ativ

e Lu

min

ou

s Fl

ux

%

Wavelength (nm)



RECOMMENDED SOLDERING PROFILE:

Reflow Lead-free Solder:

Average ramp-up rate 3°C/second max.

Preheat: - Temperature min (Tsmin) - Temperature max (Tsmax) - Time (Tsmin to Tsmax) (ts)

150°C

200°C 60-120 seconds

Time maintained above: - Temperature (TL) - Time (tL)

217°C

60-150 seconds

Peak Temperature (TP) 250°C

Time within 5°C of actual peak temperature (tp) 10 seconds max.

Ramp-down rate 6°C/second max.

Time 25°C to peak temperature 8 minutes max.

Note:

1. Maximum reflow soldering: 1 time.

2. Before, during, and after soldering, should not apply stress on the components and PCB

board.


8


RECOMMENDED INSTALLATION PROFILE:

G9/G4 Bulb:

Suggested Circuit Design:



PACKING SPECIFICATION:

Reel Dimension:

1500pcs/reel


10


PRECAUTIONS OF USE:

Storage:

It is recommended to store the products in the following conditions:

Humidity: 60% R.H. Max.

Temperature: 5°C~30°C (41°F ~86°F). Shelf life in sealed bag: 12 month at 5°C~30°C and <60% R.H. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp-proof box with descanting agent and apply baking at 60°C±5°C for 15hrs before use.

Baking:

It is recommended to bake the LED before soldering if the pack has been unsealed for longer than 24hrs. The suggested baking conditions are as followings:

70±3°C x 24hrs and <5%RH, taped / reel package.

100±3°C x 2hrs, bulk (loose) package.

130±3°C x 30min, bulk (loose) package.

It’s normal to see slight color fading of carrier (light yellow) after baking in process.

Testing Circuit:

Must apply resistor(s) for protection (over current proof).

Cleaning:

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED carrier / package. Avoid putting any stress force directly on to the LED lens.

ESD (Electrostatic Discharge):

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic

glove is recommended when handing the LED all time. All devices, equipment, machinery, work tables,

and storage racks must be properly grounded.

In the events of manual working in process, make sure the devices are well protected from ESD at any

time.



REVISION RECORD:

Version Date Summary of Revision

A1.0 24/07/2014 Datasheet set-up.

bkvzbp52aw37fccpz6 · 1 copyright © 2007-2014 brightek (europe) limited. all rights reserved. the...

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