avnet ip&e technology guide: interconnect, passive and electromechanical products
DESCRIPTION
This guide simplifies application design and accelerates time-to-market by defining basic, system-level Interconnect, Passive and Electromechanical (IP&E)building blocks. In addition, the guide provides a “who’s who” of IP&E technology manufacturers and demonstrates how Avnet can meet a full breadth of product requirements and, in the process, add exceptional value to our customers.TRANSCRIPT
IP&E Technology Guide InTErconnEcT, PassIvE and ElEcTromEchanIcal ProducTs
QuIck rEfErEncE vErsIon 6.0
IP&E Technology Guide InTErconnEcT, PassIvE and ElEcTromEchanIcal ProducTs
IP&E Information at Your Fingertips @ www.em.avnet.com/ipezone
1 IP&E Technology Guide 6.0
2 The Avnet IP&E Story
3 Connectivity Block Diagram
4 System Blocks: IP&E Support
6 Capacitors
7 Circuit Protection
8 Filters
9 High-Reliability and Military
11 Inductors
12 Commercial Interconnect
13 Magnetics
14 Power Supplies
15 Relays
16 Resistors
17 RF and Wireless
18 Switches and Sensors
19 Thermal Management
20 Timing Solutions
21 IP&E Physical Value-Add Services
TablE of conTEnTsThis guide simplifies application design and accelerates
time-to-market by defining basic, system-level Interconnect,
Passive and Electromechanical (IP&E) building blocks.
In addition, the guide provides a “who’s who” of IP&E
technology manufacturers and demonstrates how Avnet
can meet a full breadth of product requirements and, in the
process, add exceptional value to our customers.
In ThIs GuIdE>> Connectivity, product, commodity and
vertical market information
>> Functional connectivity block diagrams, along with
common system blocks, to facilitate association
of IP&E and semiconductor products
>> Product-specific sections that spotlight suppliers and
technologies and provide valuable information that can
be used throughout the product development lifecycle
ThE avnET IP&E sTorY
IP&E Technology Guide 6.0 2
Avnet Electronics Marketing is committed to successfully supporting our customers’ Interconnect, Passive and Electromechanical (IP&E) requirements with best-in-class people, products and services. We achieve this goal by leveraging the manufacturing and technology expertise of our industry-leading supplier partners, investing in dedicated IP&E resources and tools, and creating value for our customers by providing support throughout the product development lifecycle. Avnet’s unparalleled strength and scale allow us to deliver specialized IP&E solutions that integrate differentiated product and service offerings, supported by world-class design chain and supply chain expertise.
INVENTORY
eCOMMERCE
VALUE-ADD SERVICES
LINE CARD
DEDICATED RESOURCES
lInE card/TEchnoloGY covEraGE » 68 manufacturers supply products across 15 different technologies » The top manufacturer in every category is on the Avnet EMA line card
commErcIal, hIGh-rElIabIlITY and mIlITarY IP&E InvEnTorY PosITIon » $150 to $200 million on-hand and an additional $150 to $200 million in the pipeline » Appropriate inventory mix across commodities: interconnect (50%), passive (30%) and electromechanical (20%)
dEdIcaTEd cusTomEr rEsourcEs » 350+ Sales and Marketing Representatives and Managers » 350+ Field-deployed Account Managers » 150+ Field Applications Engineers » 125+ employees dedicated to providing IP&E materials, pricing, marketing and technical support
sErvIcEsAvnet offers a wide range of IP&E services from any point in the design cycle from concept to architectural design, to new product introductions and on through next generation modification or end-of-life. With offerings that run the gamut from Web seminars to connector assembly, Avnet offers it all.
EcommErcE − ThE PoWEr of avnET avaIlablE onlInEThe power of Avnet is conveniently online at AvnetExpress.com. At AvnetExpress.com, you can do a parametric search, cross reference parts and check pricing and availability as well as delivery status. You can also access Web content, which includes publications, featured products, product news and special offers that support new product releases from our supplier partners.
design » Parametric search » Technical support » Development tools & kits » New product introduction
Products » Over 5 million parts online » Over 1.5 million parts in quantities of 1 » Cut reel program
search/sort/compare » Top sellers » Alternate parts » Prototype quantities » In stock only
order and delivery » No minimum orders » No handling charges » Global and same day shipping » Bill of Material upload
IP&E EcosYsTEm
3 IP&E Technology Guide 6.0
connEcTIvITY block dIaGram
“on board” Interconnect, Passive & Electromechanical Products
“off the board” Products
MONSTER CHIP:MCU, MPU, FPGA,
ASIC, ETC.
DC POWER
MOST OF THESE PRODUCTS HAVE RF & WIRELESSAND/OR HIGH-RELIABILITY & MILITARY PRODUCT VERSIONS
IOCO
NNEC
TORS
DISCRETE POWER
CIRC
UIT
PROT
ECTI
ON
FILT
ERIN
G/M
AGNE
TICS
MEM
ORY
OROT
HER
HIGH
VALU
E CH
IPS
SOCK
ETS
&HE
AT S
INKS
BACK
PLAN
E
MEZ
ZANI
NE
PCB
HEAD
ER
CARD
EDG
E
CAPA
CITO
RS,
INDU
CTOR
S &
RESI
STOR
S
HEAT
SIN
KS
RELA
YS
SWIT
CHES
&SE
NSOR
S
BEADS, CHOKES,CAPACITORS, EMI FILTERS
& TRANSFORMERS
BOARD TO BOARD INTERCONNECT
APPLICATION SPECIFIC/WIDE USAGE
CABLE ASSEMBLIESFILTERS, POWER ENTRY MODULES
FANS & BLOWERS RELAYS & CIRCUITBREAKERS
CONNECTORS
SWITCHES &SENSORS
AC/DC POWER SUPPLY
WIRE TO BOARD CONNECTORS
CLOCKDRIVERS
TIMINGOSCILLATORS/
CRYSTALS
IP&E Technology Guide 6.0 4
sYsTEm blocks: IP&E suPPorT
SENSOR OP-AMP GAIN AMP
TIMINGDEVICES
ADC
DAC
TIMINGDEVICES
uP/FPGA/ASIC
TIMINGDEVICES
FILTER FILTER
FILTEROPTIONAL BIAS
analog signal chain
Filters sensors timing devices
CapacitorsInductorsResistors
FlowPositionPressureProximity
Temperature
Clock DriversCrystals
OscillatorsResonators
battery/Power management
PWMCONTROLLER
MOSFETDRIVER
OPTO ISOLATION
AC LINE
VDC1+ VDC2+
PLUG
VDC3+
VREF ANDSECONDARY
PWM
AC/DCMODULE
DC/DCMODULE
PFC
circuit Protection
discrete Power
Circuit BreakersFusesMOVs
ThyristorsVaristors
BeadsCapacitors
ChokesInductors
RelaysResistors
Transformers
Filters Power modules
Power Entry Modules
AC/DCDC/DC
5 IP&E Technology Guide 6.0
sYsTEm blocks: IP&E suPPorT
Wired and rf connectivity
Processing/user Interface
TIMINGDEVICES
MAGNETICS
I/O DEVICES
MEMORY CONNECTORS
ETH PHY
THERMALMANAGEMENT
SOCKETS
CIRCUITPROTECTION
PROCESSORSYSTEM IO CONNECTORS
USB PORT HDMI DISPLAY PORT FIREWIRE
KEYPAD
PUSH BUTTON
MICRO SD CARD
SMART CARD
SIM CARD
SERIAL PLUG RJ-11 RJ-45
magnetics/ Filters
system io connectors io devices data io
connectorsmemory
connectors
ChokesFerrite Beads
Integrated Modular Jacks
RF/IF FiltersTransformers
BackplanesBoard to Board InterconnectsCard EdgesMezzaninesPCB Headers
KeypadsPotentiometersSerial/RJ-11/
RJ-45Switches and
Sensors
DialsDisplayPortsDVI/HDMI/
FireWire/USB
microSD CardsSD CardsSIM Cards
SMART Cards
timing devices
circuit Protection sockets thermal
management
Clock DriversCrystals
OscillatorsResonators
ESD DiodesFuses
ThyristorsVaristors
Memory Sockets
Processor Sockets
FansHeatsinks
off the board
SYSTEM PCB OR CHASSIS
CONNECTORS
POWER SUPPLIES
IDENTIFICATION
THERMAL MANAGEMENT
RELAYS
ANTENNA
CABLE ASSEMBLIES
FILTERS
cable assemblies
cable/wire identiFication
circuit Protection connectors Filters
Board to BoardUser InterfaceWire to Board
Labels Circuit Breakers Board to BoardWire to Board
EMI/EFIPower Entry
ModulesRF/IF
antennas Power suPPlies relays thermal
management
ChipPuck
Stand-AloneSurface-Mount
TabWhip
AC/DCDC/DCUPS
Electro-mechanicalSolid-State
AC FansDC FansFan Trays
LNAVGA
RF ANTENNA
CONNECTOR/CABLEFILTERFILTER MODULE
PROCESSOR
RF/IF AMP
PA
DAC
ADC
TIMINGDEVICE
TIMINGDEVICES
RF/IF AMP
TIMINGDEVICE
TIMINGDEVICE
CONNECTOR/CABLE
RF ANTENNA
FILTERFILTERFILTER
MODULES
MODULES
MODULE
interconnect Passive
AntennasCoax Cable AssembliesRF Adapters
RF Connectors
CouplersPhase Trimmers
RF Chip CapacitorsRF Chip Inductors
RF Frequency ControlRF Trimmer Capacitors
Splitters/CombinersTerminations
IP&E Technology Guide 6.0 6
caPacITors
TechnologyCapacitors are passive components commonly used in analog and digital
electronic systems to separate AC and DC electrical currents. The devices
store energy between two conducting plates separated by an insulator
or dialectric. When capacitors store an electrical charge up to a certain
level, they then releases them. Capacitance, or the amount of current that
is stored, is measured in farads. Capacitors permit AC signals to pass
through them with little opposition but block the passage of DC signals.
» Capacitors of various types and sizes are used in every electronic circuit. Anytime a semiconductor is used, a capacitor will also be used. The type of capacitor used is dependent upon application requirements.
» Typically, any application that requires a capacitor will also need additional passive devices such as inductors, resistors and magnetics.
» Ceramic capacitors feature ceramic dialectrics commonly referred to as COG/NPO, X7R, Z5U and are targeted at low capacitance applications.
» Tantalum capacitors are mainly used on voltage lines that feed ICs and other devices with clean DC power.
» Aluminum capacitors are often found in low-cost applications. These devices hold a large amount of energy, making them ideal for use in high-capacitance applications.
» Film capacitors are found in high-frequency applications that typically require stability and wide temperature ranges.
» On board power applications will typically require both ceramic and aluminum capacitors.
component sourcing considerations » Device type or application
» Termination style/package (surface mount, axial leaded, radial leaded, disk, screw terminal and snap-in)
» Case size (surface mount)
» Lead spacing (leaded)
» Material (ceramic, tantalum, aluminum electrolytic, film and glass)
» Voltage
» Tolerance
» Dialectric (ceramics; NPO/COG, X7R, X5R, Z5U and Y5V)
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aluminum leaded • • • • • •aluminum Polymer • • • • • •aluminum screw Terminals • • • •aluminum snap In • • • • • •aluminum surface mount • • • • • •ceramic chip • • • • • • • • • • •ceramic disk • • • • • • • •ceramic leaded • • • • • •film chip • • • • • • •film leaded • • • • • •Glass •super capacitors • • • • • •Tantalum axial • • • •Tantalum chip • • • • • •Tantalum conformal coated •Tantalum Polymer • • • •Tantalum radial • • • •Tantalum Wet • •
7 IP&E Technology Guide 6.0
TechnologyOver current and over voltage protection devices provide protection
against current in excess of what the circuit and surrounding components
are designed to withstand. Common over current causes are AC power
fluctuations, wire or trace shortages, faulty wiring, and lighting and
system surges at start up. Common over voltage causes include lightning
strikes, electrostatic discharge (ESD) and external disruptions.
» Most boards require some type of circuit protection.
» Applications that require ESD protection always need some type of circuit protection.
» Target applications include telecom and networking.
» Circuit breakers are categorized in two groups: agnetically actuated and thermally actuated devices.
component sourcing considerations ovEr currEnT cIrcuIT ProTEcTIon
» Type (standard or resettable)
» Operating current
» Voltage rating
» Ambient temperature
» Accessories (fuse holders, clips, etc.)
» Tolerance
ovEr volTaGE cIrcuIT ProTEcTIon
» Type
» AC/DC operating voltage
» Peak current
» Temperate range
cIrcuIT ProTEcTIon
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Esd Protection devices • • • • • •Gas discharge Tubes • • •Thyristors • • • Tvs diodes • • • •varistors • • • • •
CIRCuIT PROTeCTIOn OVeR CuRRenT PROduCT/TyPe av
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circuit breakers • • • line Potection modules • • •resettable fuses • • • • • • •one-Time use • • • • • •Telecom fuses • • • • •
IP&E Technology Guide 6.0 8
fIlTErs
TechnologyFilter products are used to regulate or suppress line voltage imperfections
from other devices within a system.
Electromagnetic interference (EMI) is often used interchangeably with
radio frequency interference (RFI). Technically, EMI refers to the type of
energy (electromagnetic), while RFI refers to the frequency range of
the unwanted noise. Both EMI and RFI filters eliminate disturbances to
ensure effective circuit performance.
RF/IF and microwave filters are devices that pass or reject signals by
frequency. The filter design determines the amount of insertion loss and
phase shift for signals that pass through the filter. There are several basic
types of RF and microwave filters.
» Often used with power supplies, power entry modules, power cords, electromechanical devices and fans.
» Typically used in applications that require EMI/RFI protection.
» Target applications include networking and medical equipment.
» Important approvals for EMI and RFI filters include CSA mark, UL listing mark, UL recognized component mark, VDE component mark and Mil Spec.
component sourcing considerations » Type
» Application and agency approval requirements
» Rated input/output voltage
» Amount of filtering (in amps)
» Leakage
» Package
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chokes • • • • •EmI filters • • • • • • • • • • • ferrite beads • • • • • •ferrite cores • • • • •Power Entry modules • •
RF/IF FILTeR PROduCT/TyPe abra
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balun Transformers • • • • •If band Pass filters • • • •rf band Pass filters • • • • • • •rf duplexers • • • • • •rf low Pass filters • • • • • • •saW resonators • • • •
9 IP&E Technology Guide 6.0
hIGh-rElIabIlITY and mIlITarY
TechnologyMilitary and aerospace products are built to specifications based on
product drawings and testing criteria established by the United States
Government. High-reliability components are either COTS (Commercial
off the Shelf) products, which are equivalent to Mil-Spec parts but
without the testing certifications, or simply ruggedized components
specifically engineered to survive in industrial applications/environments.
Avnet has a full team of dedicated Hi-Rel/Mil-Aero/industrial product and
inventory experts, a comprehensive bill of material and drawing database
and the industry’s largest value-add ISO-9002, MIL-I-45208, UL and CSA
certified assembly operation. Avnet also offers a comprehensive portfolio
of space and RadHard products.
component sourcing considerations » Avnet can meet Mil-Spec and commodity-specific sourcing requirements.
» In many cases, environmental or industry-specific guidelines or product certification is required.
» These products can be called out by MIL and/or commercial part numbers.
» Many products can be sourced with accessories such as end bells, back shells and covers.
InTeRCOnneCT PROduCT/TyPe aE
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arinc 404/600 • • • •d-sub & Io • • • • •hi-rel circular • • • • • •mIl-c-21097 •mIl-c-22292 • •mIl-c-26482 • • • • •mIl-c-26500 • • •mIl-c-28840 • •mIl-c-39012 • • • • • •mIl-c-39029 • • • • • mIl-c-5015 • • • •mIl-c-55074 •mIl-c-55302 • • •mIl-c-81511 • •mIl-c-81659 • • •mIl-c-83723 • • • • •mIl-c-85049 • • •mIl-dTl-24308 • • •mIl-dTl-38999 • • • • •mIl-dTl-83733 • •mIl-Prf-83513 • • •mIl-T-81714 •Power/Industrial • • • • • • • •Tubing/molded shapes • •
IP&E Technology Guide 6.0 10
hIGh-rElIabIlITY and mIlITarY
differentiated Product options commercial GradeAvnet has strategic global relationships with best-in-class component
manufacturers, which allow us to support entire bills of materials from
resistors to FPGAs. Our online parametric search tool provide easy access
to complete portfolios of semiconductor, interconnect, passive and
electromechanical products. Users can build part numbers from descriptions
and technical attributes and perform side-by-side comparisons of similar
components.
mil-specAvnet offers the broadest selection of mil-spec products and custom value-
add services available today. These products and services, such as military
connector assembly, can be accessed via our Web site, which is powered
by the industry’s largest online component database. Behind the scenes,
this database is maintained and grown by defense-aerospace product and
inventory experts. This expertise is also evident in the “build your own bill
of materials” functionality embedded in our Web site. Avnet also offers
a comprehensive portfolio of space and RadHard products enhanced by
exclusive space inventory programs with top component manufacturers.
Special programs include data pack management. Avnet can also provide
advice and technical insight into ruggedized products as well as test data to
support specific customer requirements.
coTsAvnet is one of the largest distributors of COTS components and embedded
products. The key to successfully supporting COTS requirements is a
proper ecosystem — from product and program management to strategic
relationships with manufacturers to the ability to support new product
introductions and provide end-to-end supply chain management. eLeCTROMeChAnICAL PROduCT/TyPe ebm
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circuit breakers • • •fans & blowers • •Industrial/coTs relays • • •mIl-Prf-28750 •mIl-Prf-28776 • •mIl-Prf-39016 • • •mIl-Prf-6106 • •mIl-Prf-83536 • •mIl-Prf-83726 • •mIl-r-5757 •
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ceramics: mIl-Prf-11015 • •ceramics: mIl-Prf-123 • •ceramics: mIl-Prf-20 • •ceramics: mIl-Prf-39014 • •ceramics: mIl-Prf-55681 • • •Inductors: mIl-Prf-15305, 39010, 83446 •magnetics: mIl-Prf-21038/27 •metal film resistors: mIl-r-122, 10509, 39017, 55182, 55342 & 22684 •
network Trimmers: mIl-r-22097, 27208, 39015 & 39035 •
network Trimmers: mIl-r-83401 •Tantalums: dscc10004 •Tantalums: mIl-Prf-26655 •Tantalums: mIl-Prf-39003 • •Tantalums: mIl-Prf-39006 • •Tantalums: mIl-Prf-3965 •Tantalums: mIl-Prf-49137 • •Tantalums: mIl-Prf-55365 • • •Tantalums: mIl-Prf-93026 • •Wire Wound resistors: mIl-r-26, 93, 18546, 39005/7/9 •
11 IP&E Technology Guide 6.0
InducTors
TechnologyAn inductor is a coil of wire wrapped around a core of air, iron, or ferrite
(a compound made of iron particles mixed in a non-conducting epoxy
cement material). Inductors are not commonly found in digital systems,
but they may be used in volume in certain types of analog systems,
including RF and network interface applications.
Inductors function as filtering or choke components and are mainly used
in tuned circuits to block high-frequency AC signals. They pass DC easily,
but block AC signals. This action is the opposite of what a capacitor does.
Inductors are used to suppress or limit the flow of alternating current
without affecting the flow of direct current.
» Inductors of various types and sizes are often used in electronic circuits.
» Typically, any application that requires an inductor will also require additional passive devices such as capacitors, resistors and magnetics.
» Inductors have broad application potential. Target markets include automotive, cellular, computer, consumer, industrial, power and telecommunications.
component sourcing considerations » Package
» Inductance range
» Q factor
» Current
» DC Resistance
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chip Inductors • • • • • • • • • • • • • • • •leaded Inductors • • • • • • • •Power Inductors • • • • •rf Inductors • • • • • • • • • • •
IP&E Technology Guide 6.0 12
commErcIal InTErconnEcTs
TechnologyConnectors are used to connect two or more electrical circuits and typically
feature a plastic or metal housing and metal contacts/terminals, with the
exception of fiber optics, which use fiber to transmit signals. For general
reference, interconnect products can be divided into six levels of packaging.
» Many interconnect products conform to industry standards developed by committees comprised of, among others, representatives from a number of Avnet’s connector suppliers. Avnet routinely aggregates information on products that are specifically designed to meet these standards.
» Look for the connectivity points based on the level of packaging (i.e., socketing a high value IC, connecting two boards, etc.).
» In most systems, the main PCB (motherboard, backplane, etc.) will need to connect to smaller boards, system IO, etc.
» Avnet also stocks and distributes custom and off-the-shelf cable assemblies from most of the connector suppliers listed on our line card.
six levels of Interconnect Packaging » Primary connection (IC chip to package)
» Components to circuits (device to board)
» Circuit to circuit (board to board)
» Sub-assembly to sub-assembly (wire to board)
» Sub-assembly to IO (panel mount)
» System to system (box to box, cable assemblies)
component sourcing considerations » Type (backplane, card edge, IO, PCB, power, etc.)
» Configuration (board to board, wire to board (cable to board), wire to wire (cable to cable), panel mount (IO) and box to box (cable assemblies))
» Contact count and spacing
» Gender
» Contact plating
» Termination style (crimp, IDC, through hole, surface mount, wire wrap and press fit)
» Design options (keying, shielding and accessories)
» Industry standards (IEEE1394, USB 2.0)
» Control input and output requirements
COMMeRCIAL InTeRCOnneCT PROduCT/TyPe 3m al
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backplane • • • • • • • • • cable • • • • • • • card Edge • • • • • • • • circular • • • • • • d-sub • • • • • • • • Electrical Products • • • • • •
fiber optic • • • • • • • Io • • • • • • • • • • • •Pcb • • • • • • • • • • •Power • • • • • • • • rack & Panel • • • • • • rectangular Power • • • • •
sockets • • • • • • •Terminal blocks • • • • • •
13 IP&E Technology Guide 6.0
maGnETIcs
TechnologyMagnetic-based components are an integral part of electronic circuitry in
LAN, telecom and power applications. In LAN and telecom applications,
magnetic products are used to isolate circuits, match impedances (step up
or down signal levels), suppress unwanted signals, filter noise emissions
and convert voltage. In power applications, magnetics such as inductors,
common mode chokes and transformers are used to convert power.
» Ideal for applications that transmit voice, data and/or video.
» Some applications that use RJ-11 and RJ-45 connectors may also benefit from integrating magnetics products.
» There is a one-to-one correlation between communication ICs and magnetic transformers; the LAN or telecom transformer must be matched to an IC.
» Designs requiring fast clock rates and multi-line IO interfaces will often need magnetics.
component sourcing considerations » Type (LAN modules, telecom modules, common mode chokes, filtered RJ jacks, broadband modules and power modules)
» Application (T1/E1, 10Base-T, 100Base-T, 1GBase-T, 10GBase-T)
» Matching IC
» Ports supported (single, dual, quad and octal)
» Packaging
» DC resistance, isolation voltage (chokes)
MAGneTIC PROduCT/TyPe abra
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broadband modules • • • chokes • • • • • • • Integrated rJ Jacks • • • • • lan modules • • • • • Power magnetics • • • • • •Telecom modules • • • • •Transformers • • • • • • • • • • •
IP&E Technology Guide 6.0 14
PoWEr suPPlIEs
TechnologyPower supplies convert an available power source into voltage and current
characteristics that are acceptable for distribution or consumption by a
load. For example, they can convert current from one form to another (i.e.,
AC to DC) and can also change voltage level values (i.e., 5 to 3.3 V).
» A large variety of form factors, features and operating specifications are available to address the unique power requirements of differing applications.
» Complete power solutions often require several conversion stages including AC-DC and DC-DC. The architecture used can significantly influence the performance characteristics of the solution.
» Power solutions are available as modular solutions or as discrete component designs. Choosing the best solution for a given application involves a make versus buy analysis.
» Multi-source agreements exist for some DC-DC power supply modules. The most popular being the Distributed-power Open Standards Alliance (DOSA) and the Point-Of-Load Alliance (POLA).
» Most electronic components, from analog to programmable logic to everything in between, require power supplies.
component sourcing considerations » Input voltage, output voltage and output current (Power = V x I)
» Power architecture and budget (be sure to share this information with your Avnet support team early on in the design process)
» Feature requirements (tracking, load sharing, sequencing, IO interface, remote ON/OFF, remote sensing, I2C, etc.)
» Options (PFC, remote sensing, inhibit, enable, voltage adjustability, current share, hot swap and redundant (N+1))
» Thermal Environment (Operating temperature, start-up temperature, airflow and heat sinking)
» Efficiency (Energy Star, 80 PLUS, etc.)
» Agency approvals (UL, CSA, TUV, CE and IEC)
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board mount • • • •compact PcI • • dIn rail • • •Externals (ac adapters) • • •front Ends & rectifiers • • • •linear • • •modular-configurable Power • • •open, u-channel, Enclosed • • • • • •Power factor correction (Pfc) modules • • •specialty - medical rated • • • • • •specialty - PoE • • • specialty - lEd lighting • • •specialty - military •
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solar-rigid crystalline Panels/modules •
solar-custom Panels/modules •
vibration-Piezoelectric Energy harvesters •
vibration+solar-Energy harvesters •
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Isolated bricks • • • • •Isolated Industrial • • • • • •Point-of-load (Pol), non-Isolated • • • • • • specialty - aTca • • specialty - PoE •specialty - vrm • • specialty - rf • • • • •specialty - lEd • • •specialty - military • dosa multi-source member • • •Pola multi-source member •
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custom battery Pack design •
standard batteries (aa,c,d,sla, etc.) •
15 IP&E Technology Guide 6.0
rElaYs
TechnologyRelays are electrically controlled devices that use a control signal to open
or close electrical contacts. These devices serve the same basic function
as a switch, except they are powered either electrically (solid-state relay)
or mechanically (electromechanical relay). Solid-state relay growth
continues to outpace the overall relay market. This is occurring because
today’s circuit designs require high-reliability, IO isolation, high-speed
switching, logic IC compatibility and noise filtering, all of which can not
be sustained by electromechanical relays. Electromechanical relays,
however, still lead in applications that must switch between AC and DC
and that need very high-voltage and/or high-current ratings with low, off-
state leakage, all at the lowest cost.
» Ideal for applications with power switching and signal isolation requirements.
» It’s important to remember that relay types are often application-specific (i.e., high-frequency, low-power signal, military, power, general purpose, etc.).
component sourcing considerations » Type
» Contact switch rating
» Coil voltage
» Contact configuration (how many poles and throws?)
» Mounting style
» Dimensions
» Military specification (where applicable)
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circuit breakers • •coTs Industrial • • •General Purpose • • • •Io modules • • •military • • •Power • • •reed •rf • • •signal • •solid-state • • • •
*TE Connectivity relay brands: Agastat, Axicom, CII, Kilovac, OEG, P&B and Schrack.
IP&E Technology Guide 6.0 16
rEsIsTors
TechnologyResistance is opposition to electrical flow and is specified in units called
ohms. Resistors, which are one of the most commonly used passive
components, contain a specific amount of electrical resistance. All
resistors are made by using materials that have known characteristics
of resistivity. The materials are processed and shaped into packages with
metal leads or pads connected to the ends of the material. Some form of
marking identifies the resistance and tolerance of the resistor and is then
printed on the package.
» Resistors of various types and sizes are used in every electronic circuit so every application will need these devices.
» It’s important to determine application-specific requirements. Anytime a semiconductor is used, a resistor will also be used so information is needed to narrow product selection.
» Typically, any application that requires a resistor will also require additional passive devices such as capacitors, resistors and magnetics.
component sourcing considerations » Termination style (surface mount or leaded)
» Case size/package
» Material (carbon film, carbon composition, cermet, metal film, wirewound, etc.)
» Wattage (1/4, 1/2, 3/4, 1, 2, etc.)
» Resistance (ohms)
» Tolerance
» Type (concave, convex - chip arrays)
» Circuit type (bussed, isolated - chip arrays and networks)
» Number of terminals/pins (chip arrays and networks)
» Number of turns (trim pots)
» Sealed or unsealed (trim pots)
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carbon film • • •chip resistor arrays • • • • • • •current sense resistors • • •film resistors leaded • • • •mElf resistors •Thick film chip resistors • • • • • •Thick film networks leaded • • • •Thick film networks smd • • • • •Thin film chip resistors • • • • •Trimmer Pots leaded • • • • • • • •Trimmer Pots smd • • • • • • •Wirewound leaded • •Wirewound surface mount • •
17 IP&E Technology Guide 6.0
rf and WIrElEss
TechnologyAvnet’s RF and wireless solutions combine complementary technologies to
create leading-edge standard and custom products for the RF, microwave
and millimeter wave markets. Avnet’s solutions range from under 1 MHz to
over 18 GHz, and from 1 mW to over 80 W. Discrete diodes, transistors,
FETs, RF ICs, MMICs, ASICs, modules, RF interconnect and passive
products and other highly integrated designs comprise our RF and
wireless solutions.
component sourcing considerations » Product and commodity specifics
» Application type
» Power output requirement
» System voltage and current requirements
» Special issues
» Technology preferences (bipolar, MOSFET, LDMOS, GaAs, etc.)
» Device packaging (surface mount, through hole, ceramic, plastic, etc.)
» Temperature rating
» Special testing or selection
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couplers • •Phase Trimmers •rf chip capacitors • • • • • • • •rf chip Inductors • • • • • • • •rf frequency control • • • •rf Trimmer capacitors • • •splitters/combiners • • •Terminations • •
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antennas • • • • •
coax cable assemblies • • • • • • • • •
rf adapters • • • •
rf connectors • • • • • • • • •
sensOR PROduCT/TyPe alPs
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audio Indicators and alerts • • • • flow sensors • magnetoresistive sensors • microphones • • • Pressure sensors • • Proximity sensors • • speakers • Temperature sensors • • •Thermistors • • • • • • •
Note: These are IP&E sensor products. There are additional types and numerous semiconductor options for sensor products. A complete listing can be found on AvnetExpress.com under Sensors & Transducers.
IP&E Technology Guide 6.0 18
sWITchEs and sEnsors
TechnologySwitches are devices that make, break or change the connections in an
electric device. There are literally thousands of different switch configurations.
The majority of products being sold are electromechanical devices.
These devices mechanically bring together or separate the surfaces of two
or more metal contacts to make or break circuits. This technology is
an extremely cost-effective and simple means of performing switching
functions. Generally, the switch actuator differentiates the product type.
» Ideal for any application that needs to be turned on or off.
» Switches can be board or panel/box-mounted depending on the application.
» Generally, board mount switches, especially DIP and tactile, are high volume items with low ASPs.
» Panel mount switches, especially in industrial applications, have higher resales.
component sourcing considerations » Type (dip, push-button, rocker, rotary, slide, snap-action, tactile, thumb-wheel, toggle, trigger, keylock, Hall effect, keypads, keyswitch, keyboard, etc.)
» Contact switch rating (in amps)
» Coil voltage
» Contact configuration (SPST, SPDT, DPST, DPDT, 3PST, 4PST, etc.)
» Packaging (size and mounting style)
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dip • • • • • • • •keypad & keyswitch • • •keylock • • • •rocker • • • •rotary • • • • • • •slide • • • • •snap-action • •Tactile/Push-button • • • • • • • • • •Thumb-wheel • • •Toggle • • • •
19 IP&E Technology Guide 6.0
ThErmal manaGEmEnT
TechnologyThermal management solutions include products and services that
solve problems associated with the dissipation of unwanted heat in
electronic and electrical components and systems. Forced convection
cooling and heat transfer are two of the more popular methods of thermal
management. Avnet offers several products that use these methods for
heat dissipation:
» Fans (convection cooling) move and displace air and are categorized by the amount of air they can produce.
» Blowers (convection cooling) move and displace air in a controlled stream focusing air movement to a defined area of the system.
» Heat sinks (heat transfer) provide heat transfer through heat-conducting interface materials and molded, stamped or extruded metal sinks that pull heat away from its sources and into the ambient air. Heat sinks can be passive or active (includes a fan).
» Just about any application that calls for a monster chip (i.e., microprocessor, microcontroller, FPGA, DSP, etc.) will require thermal management products.
» In addition, many larger watt power supplies will also require some type of device to dissipate heat.
» There are a wide range of applications that require a fan or fan tray (i.e., servers, routers, telecom equipment). These are all good candidates for a factory-assembled fan tray or a custom fan tray sold and assembled by Avnet.
component sourcing considerationsfans
» Type (AC, DC, fan or blower)
» Square size (inches or mm)
» Width size (inches or mm)
» Supply voltage
» CFM required
hEaT sInks
» Natural or forced air
» Flow velocity
» Available sink volume
» Maximum allowable case temperature
» Device area in contact with sink
» Number of devices to be cooled
» Power to be dissipated per device
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ac fans • •active/Passive heat sinks • • • •blowers • •dc fans • • •fan Trays • •fanless coolerGuards/hardware •microscale Thermal managementmIl/Industrial fans •
Note: These are IP&E Timing Solutions. There are additional types and numerous semiconductor options for timing devices. A complete listing can be found on AvnetExpress.com under Logic & Timing.
IP&E Technology Guide 6.0 20
TImInG soluTIons
TechnologyCrystals are naturally occurring pieces of quartz that vibrate (oscillate)
at a specific frequency when voltage is applied. This vibration is used to
regulate the timing or system speed (clock rate) of a circuit. Oscillators are
a combination of a quartz crystal and other electronic components enclosed
in a single package. Oscillators provide greater stability and tighter
tolerance than crystals, without additional electronics. Oscillators are
frequently used in devices that require greater reliability or in high-end
applications. Typically constructed from ceramic materials, resonators are
a low-cost alternative to crystals and are used in applications that do not
require tight control of tolerance and stability.
» It is important to determine if the timing device will be used to control a microprocessor or a microcontroller.
» Be sure to tie crystals and oscillators to chipsets.
» Remember that fast clock devices may require magnetics for signal filtering.
» Target applications include LAN and data communications as well as
RF and wireless applications, to name a few.
component sourcing considerations » Oscillators (frequency, stability (PPM), CMOS or TTL, package size, voltage, filtering)
» Crystals (frequency, load, capacitance, package size, tolerance, temperature range)
» Resonators (frequency, tolerance, package)
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crystals • • • • •oscillators • • • • • •resonators • • • •
21 IP&E Technology Guide 6.0
IP&E PhYsIcal valuE-add sErvIcEs
commercial InterconnectCommercial interconnect value-add products are built and inventoried based on manufacturer listed part numbers and part specifications. Avnet has invested in robotic automation for part identification, adhesive application, contact insertion and insulator insertion, which is deployed to minimize human error, increase productivity and maintain cost efficiencies. As a result, Avnet maintains an industry-leading low defect rate.
custom cable assemblyAvnet has a dedicated production cell that provides first article cable assemblies of varying sophistication levels based on customer specifications. Once the first article is approved, Avnet documents and electronically stores the manufacturing process, which includes detailed step-by-step assembly instructions that can be recalled for future use.
high-reliability/military InterconnectThe Avnet LSC is MIL-I-45208 certified to assemble close to 60 different military specification products in accordance with the Qualified Parts List (QPL) and is fully authorized to stock and assemble products to manufacturer drawings and specifications. Avnet currently offers 24-hour delivery on over 250 of the most popular high-reliability and military-aerospace products. In addition, Avnet has achieved delivery cycle times of less than three days on normal-sized orders for many other high-reliability and military-aerospace connectors.
All of Avnet’s core value-add services are performed in the Avnet Logistics Solution Center (LSC) in Nogales, Mexico. The LSC is sustained by a diverse group of employees with varied skill sets and work experiences cultivated through employment at Avnet and other globally-recognized companies.
abouT ThE avnET loGIsTIcs soluTIon cEnTEr cErTIfIcaTIon and comPlIancE crEdEnTIals
» Located in Nogales, Mexico
» 125,000 square foot assembly center
» Staffed by more than 300 employees
» ISO-9001-2000
» ISO-14001 (Green)
» AS9100C
» MIL-I-45208
» International Traffic in Arms Regulations (ITAR)
» C-TPAT
» IPC J-STD-001 and IPC/WHMA-A-620
» UL and CSA
» British Standards Institute (BSI)
» ISO-13485
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mIl-c-26482 • • • • •mIl-c-24308 • •mIl-c-38999 • • • • •mIl-c-5015 • • • •mIl-c-81659 • •mIl-c-83723 • • • • •mIl-c-83733 •mIl-c-83513 • •mIl-c-26500 • •mIl-c-39029 • • • •d-sub/ Io • • • • •hi-rel circular • • • • •Power/Industrial • • • • •
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discrete & multi- conductor • • • • • •flat flex/flex • • •flat ribbon Idc • • • • •Idc Termination – .100/.156 • • •Idc Termination – high-density • • • • •rf coax • • • •Ties, labels & accessories • • •
IP&E Technology Guide 6.0 22
Thermal managementMany sophisticated silicon components cannot function properly without effective heat dissipation. Avnet offers custom assembly and modification for cooling fans and heat sinks. In fact, Avnet is one of the world’s largest distributors of thermal management products, shipping millions of cooling fans, blowers and heat sinks each year through the Logistics Solution Center.
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connectorized cables • •fan Trays • •hardware Guards • •sheet metal & Enclosures • •
Physical value-add service overview
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cable assembly • • • • • •commercial Interconnect • • • • • • •hi-rel & mil-aero Interconnect • • • • • • • •Power supply modification • • • • • • • •Thermal management • •
Power supply solutionsWorking with a dedicated team of product and material specialists, Avnet’s business development managers, field application engineers (FAEs) and regional power specialists help customers source power supplies quickly and efficiently. Avnet is a certified value-add reseller (VAR) for Emerson Network Power, TDK-Lambda, Power-One and modular power supplies. Using off-the-shelf modules, Avnet can quickly assemble modular power supplies to meet custom output specifications from 200 to 4,920 watts.
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add Electro • • • • • • • •add sheet metal Enclosures • • • • • • • •burn-in load Testing • • • • • • • •cable/harness assembly • • • • • • • •high-current Interconnect • • • • • • • •high level assembly • • • • • • • •modular Power supplies • • • • • • •racks • • • • • • • •Thermal management • • • • • • • •
design chain services®
Avnet Design Chain Services offer engineers a host of services at any point in the design cycle – from concept to architectural design, to new product introduction and on through next-generation modification or end-of-life. With offerings that run the gamut from Web seminars to connector assembly, Avnet offers it all.
component selection
» Online part search engine
» Parametric search tool
» Product obsolescence solutions
Physical value-add services
» custom cable assembly: Flat flex, flat ribbon cable connector and harness assemblies
» commercial and high-reliability/military Interconnect assembly: MIL-I-45208 certified to assemble 57 different Mil-Spec QPLs (Military Qualified Parts Lists); fully authorized to stock and assemble commercial products to manufacturer drawings and specifications
» Power supply solutions: Front end power supply design and sourcing, certified value-add reseller (VAR) for Modular Power Supplies and value added solutions
» Thermal management: Custom assembly or modification for cooling fans and heat sinks including fan trays
avnet ElectroairAn extensive range of logistic and assembly services for the avionics market:
» Integrated Supplier Alliance (ISA) for consumable RFPs
» Source inspection
» Special product testing and certification
supply chain services®
By combining internal competencies of global warehousing and logistics, finance, information technology and asset management with objective industry data, Avnet provides customers with the information and market insight needed to make well-informed business decisions.
component Intelligence/Prómiere
» Bill of material (BOM) analysis
» Inventory optimization services
» Green initiative programs
supply chain assessment
» Discovery and logistical analysis
» Financial analysis
» Project implementation
Inventory management solutions
» Bonded inventory programs
» EDI Point of Use Replenishment Systems (POURS)
» Vendor-managed inventory
» In-plant stores
» New product introduction (NPI) program support
» Pipeline inventory from forecasts
» Inventory ownership programs
1-800-332-8638www.em.avnet.com
Avnet IP&E Solutions IP&E Information at Your Fingertips @ www.em.avnet.com/ipezone
Copyright© 2013, Avnet, Inc. All rights reserved. Avnet, Inc. disclaims any proprietary interest or right in any trademarks, service marks, logos, domain names, company names, brands, product names, or other form of intellectual property other than its own. AVNET and the AV logo are registered trademarks of Avnet, Inc. Lit #: AvnetEM-IP&ETechGuide-v.6.0
IP&E sErvIcEs and suPPorT