loys and aluminum-containing coatings, the method comprising the step of contacting with a solu- tion consisting of hydrochloric acid, nitric acid, water, and op- tionally nonfoaming and wetting agents, the solution being at a temperature of 130 to 180°F.

SPUlTERING CATHODE ASSEMBLY

U.S. Patent 5,944,967. Aug. 31, 1999 H. Kunz et al., assignors to Balzers und Leybold Deutschland Holding AG, Germany

A dual-target cathode assembly with shielding.

SPUTTERING APPARATUS

U.S. Patent 5,944,968. Aug. 31, 1999 M. Kobayashi et al., assignors to Anelva Corp., Tokyo

A magnet assembly rotation sys-

tem for a sputtering apparatus for depositing a thin film on a sub- strate surface in a vacuum cham- ber comprising means for rotating a magnetic assembly in a cathode; a revolution means for revolving the magnetic assembly around a revolution axis, which corre- sponds to a center axis of a target composing the cathode; and an ec- centric distance varying means for varying an eccentric-distance, which is a distance between the rotation axis of the rotation means and a revolution axis of the revolution means.

VAPOR DEGRBABER

U.S. Patent 5,945,016. Aug. 31, 1999 R.G. Cormack, assignor to D.I.S.

An improved vapor degreaser wherein the improvement com- prises an upper tank zone above the first freeboard area having second means for cooling a second freeboard area above the first freeboard area and any solvent vapor, which has escaped into the second freeboard area from the first freeboard area; a first cover between the first freeboard area and second freeboard area be- tween the first means for cooling the solvent vapor zone and the second means for cooling the sec- ond freeboard area above the sol- vent vapor zone; and a second cover on the tank above the sec- ond freeboard area.

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July 2000 75

U.S. Patent 5,945,170. Aug. 31, 1999 W.G. Kozak et al., assignors to Henkel Corp., Gulph Mills, Pa.

A process for separating multiva- lent metal ions from autodeposi- tion compositions and a process for regenerating ion exchange res- ins useful therewith.

CHROMIUM ALLOY PLATING

U.S. Patent 5,945,226. Aug. 31, 1999 A. Harayama and H. Tanaka, assignors to Teikoku Piston Ring Co. Ltd., Tokyo

A chromium alloy plating film containing iodine in 0.1 to 1.4% by weight and molybdenum in 0.4 to 3.8%.

MULTILAYER PRINTED CIRCUIT BOARDS

U.S. Patent 5,945,258. Aug. 31, 1999

H. Shim& et al., assignors to Hitachi Chemical Co. Ltd., Tokyo

A process for producing a multi- layer printed circuit board, which comprises plating a metal layer or coating an electroconductive paste so as to electrically connect the conductor circuits of the inter- layer plate and an outer layer cop- per foil; forming an etching resist on the outer layer copper foil, fol- lowed by formation of wiring cir- cuits on the copper foil by selec- tive etching; and removing the etching resist.

AGUEOUS TWO-COMPONENT COATING COMPOSITION

U.S. Patent 5,945,476. Aug. 31, 1999 R.R. Roesler et al., assignors to Bayer Corp., and Bayer AG, Leuerkusen, Germany

An aqueous two-component com- position comprising a compound substantially free from isocyanate groups, and a polyhydroxy com- pound containing ester and/or carbonate groups and having a urethane group content of less than 5% by weight, based on the weight of the polyhydroxy com- pound.

HIGH SOLIDS PAINT

U.S. Patent 5,945,483. Aug. 31, 1999 G. Iwamura et al., assignors to Dainippon Ink and Chemicals Inc., Tokyo, and Mazda Motor Corp., Hiroshima, Japan

A high solids content resin compo- sition comprising, as essential components, an acrylic oligomer having a blocked hydroxyl group; a curing agent having a reactivity

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76 Metal Finishing