atp industrial grade flash products & dram modules endurance and lower the usable life. atp...

Memory Cards Embedded Modules 2.5” SSDs DRAM Modules

ATP Electronics, Inc.

Targeted Product Portfolio, Engineered Speci�cally for Your Mission Critical Applications

ATP Industrial GradeFlash Products & DRAM Modules

www.atpinc.com

1 ATP

ATP GLOBAL SUPPORT OFFICES

ATP USASAN JOSE, CA, USA

ATP EUROPEMUNICH, GERMANY

ATP CHINASHANGHAI, CHINA ATP HEADQUARTERS

TAIPEI, TAIWAN

Manufacturing, Testing and Validation Facility

ATP JAPANTOKYO, JAPAN

KAOHSIUNG, TAIWAN

ATP TAIWANHeadquartersTEL: +886-2-2659-6368FAX: [email protected], No. 185, Tiding Blvd. Sec. 2, Neihu, Taipei, Taiwan 11493

ATP JAPANTEL: +81-3-6206-8097FAX: [email protected]#1007, 10F 1-8-4 Kandasakuma-cho, Chiyoda-ku, Tokyo,Japan

ATP USATEL: +1-408-732-5000FAX: [email protected] North First Street, Suite #150 , San Jose, CA 95131,USA

ATP CHINATEL: +86-21-5080-2220FAX: [email protected] 2F, Building 15, No. 115, Lane 572, Bibo Road, Zhangjiang High-Tech Park Pudong, Shanghai, China 201203

ATP EUROPETEL: +49-89-374-9999-0FAX: [email protected]. 3, D-85716 Unterschleißheim,Germany

PRODUCT GUIDEATP ELECTRONICS, INC.

2ATP

Table of Contents

ATP GLOBAL SUPPORT OFFICES..................

About ATP..........................................................

ATP MARKET FOCUS & APPLICATIONS......

ATP TECHNOLOGY...........................................

1

3

5

7

DRAM SOLUTIONS..........................................

FLASH SOLUTIONS.......................................... Memory Cards SD/microSD................................................... CF/CFast........................................................ 2.5” SATA SSDs SII Pro........................................................... XE............................................................... M V............................................................. Embedded Modules M.2..................................................................... mSATA................................................................ SlimSATA............................................................ eUSB SSD...........................................................

USB Drives...................................................

8

13

1921

222324

2526272829

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3 ATP

ATP Electronics is a leading solutions provider of high performance, high quality and durable NAND flash and DRAM memory modules. With over twenty years of experience in service based memory products, ATP continues to focus on mission-critical applications such as industrial/automation, telecom, medical, automotive, and enterprise computing where high levels of technical expertise, product validations and manufacturing quality are required. A certified Eco/ Green partner of tier 1 OEMs, all ATP products are fully RoHS and China RoHS compliant. A true manufacturer, ATP offers in-house design, testing, and product tuning at both system and component levels. In addition, ATP supply chain support includes controlled/fixed BOMs and long-term product life cycle management.

Industry Association and Compliance

About ATP


4ATP

Product Longevity and Stability

Testing Capabilities

Advanced Technologies & Engineering Support

Long-term relationships with supply chain commitments Micron’s PLP (Product Longevity Program) offers the stability necessary for ATP’s DRAM/Flash module solutions to meet industrial challenges and help customers reduce the frequency of painful redesign and requalification Supply chain disaster recovery planning with a dual sourcing strategy on ATP products

Controlled BOM Quality and engineering documentation provided Long product life cycle with buffer inventory support and advance PCN/EOL

Compliance with Industry certificates and requirements

ATP Unique Features Power Failure Protection (ATP patented technology) ensures consistent flash operation and data integrity during unstable power conditions AutoRefresh (Read-centric operation) for read disturbance aversion ATP SecureErase eliminates trace of the original data and offers a rigid/diverse variety of military and industrial protocols, including USA-AF AFSSI 5020, USA-Army 380-19, NAVSO P-5239-26, etc.

Industry Leading Engineering Support Capabilities Product customization Responsive QA/FA support during the Mass Production stage OEM joint validation programs available: “Our lab is your lab”

ATP CORE COMPETENCIES

IC level validation & storage device/module level test Tailored testing criteria for specific applications/industry standards or usage models (joint validation) Mass production level test

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5 ATP

ATP is recognized by worldwide major tier 1 auto infotainment suppliers and tier 2 telematics system developers/service providers due to its product quality and strong capabilities which include engineering, manufacturing, and supply chain management.

In order to provide robust and reliable assurance, ATP flash products are developed based on the strict validation processes such as ATP NAND Flash IC Level test, usage model test/specific industry standard test (AEC-Q100, MIL-STD, JEDEC…etc) and power cycling test in product development phase. In mass production, ATP conducts 100 % production level burn-in test to sort out manufacturing/component defects before shipping to customers.

Moreover, ATP SiP (System-in-Package) technology allows great reliability as well as extreme tolerance to shock/ vibration, temperature, dust and humidity in harsh conditions. ATP products with the above mentioned technological advancements fully adhere to automotive applications’ rigorous quality standards.

Networking/telecommunication applications typically have the greatest demands in terms of performance, reliability, and capacity. ATP provides industry leading production level TDBI (Test During Burn In) capability and utilizes specific in-house testing solution to ensure long-term reliability and quality of ATP industrial grade DRAM products which can operate under extreme temperature conditions.

Furthermore, networking/telecommunication environments usu-ally have high traffic with multiple concurrent transactions. ATP industrial Grade SSDs and embedded modules offer a wide range of capacities and increase the performance in IOPS with full power failure protection technologies.

ATP sat i sf ies customers not only with i t s technolog ica l advancements, but also its broad processor/chipset compatibility (for DRAM products), supply chain longevity, logistic flexibility and strong engineering supports.

ATP is a leader in enterprise mobility, providing storage and memory products that are robust enough for harsh conditions and extreme environments. ATP Industrial Grade memory cards built with SIP (System-in-Package technology) offer considerable protection from harsh environmental conditions and provide water, dust, and ESD proof durability.

Enterprise mobility devices require more than just brute physical durability but also demand reliable memory storage for unreliable power sources and frequent rewriting. ATP has developed a total solution of the “Data Integrity” technologies to secure dependable data storage in an enterprise mobility environment.

ATP Industrial Grade memory cards have been previously tested and qualified by major enterprise mobility companies.

NETWORKING/TELECOMApplications

WAN Optimization Appliances VPN/ Firewall Appliances/

Next-Gen Firewalls Advanced TCA System Small Cell Routers/Gateways/Servers

Applications In Vehicle Infotainment/Rear Seat

Entertainment System Navigation System Fleet Surveillance/Management In Vehicle Computer Automotive Telematics Drive Recorders

ENTERPRISE MOBILITY

AUTOMOTIVE

Applications Mobility ERP Barcode Scanning and Data Collection Mobile Payment Rugged and Field Handheld-Computing Mobile Healthcare

ATP Market Focus and Applications


6ATP

Applications Life support/Data Logging Bedside Infotainment Terminal Point-of-Care Mobile Device Patient Monitoring Device ECG /EEG/EMG* Monitor Sonogram/Ultra Sound Endoscopy System Diagnostic Imaging System

*ECG- Electrocardiogram EEG - Electroencephalography EMG- Electromyography

Applications HMI Robotics Industrial Control System Home/ Building Automation Industrial Instrument

Applications Gateways Surveillance & Security Smart Industrial Application Cloud Computing Connected Devices/ IPCs/

Embedded Systems

In high-performance Industrial PC and Embedded applications, demand for faster data transfer rates and higher bandwidth is increasing. At the same time, constraints on space, endurance, reliability and power are rising. Industrial/Embedded computing storage and memory implementations require a level of technical support and product tunability that only a true designer/manufacturer can offer.

ATP products provide the optimal solution for industrial control systems, which must withstand constant vibration, high humidity, and wide temperature ranges.

ATP designs, builds, and supports all of its own DRAM and flash products. With full control of the BOM, testing, and QA procedures, ATP can customize, build, and tune a storage/memory solution for the most demanding or unique Embedded application.

ATP understands that “Data Integrity, Reliabil ity, and Performance” are essential requirements for critical operations in the healthcare industry.

A variety of form factors and densities of ATP DRAM and NAND Flash memor y have been utilized in hospital, clinical and diagnostic applications, such as booting up, image capturing and data logging.

Customer satisfaction is guaranteed with high quality and performance, long product life,low TCO (Total Cost of Ownership) of ATP PowerProtector (ATP patented technology), System-In-Package technology, customized DRAM module testing service, strong Quality Assurance (QA), and BOM supporting capabilities.

Automation industry 4.0, which represents the integration of Cyber and Physical systems concept, challenges the solutions for storage devices.

The automation network is associated with a wide range of objects, from factory-level instruments to enterprise-level control systems. In this perspective, power failure protection, data consistency/retention and operating temperature are key factors.

ATP storage devices possess the required features such as endurance, reliability and optimized intensive read/write operations for automation. ATP’s extensive platform/device validation combined with 100% burn-in testing ensure reliability on automation applications.

As a member of the Intel IoT Solution Alliance, ATP is qualified with numerous leading IoT hardware platforms and manufacturers. The IoT gateway application with Linux OS frequently writes small log files from sensors/recorders, resulting in high writing amplification (WAI), which will affect the endurance and lower the usable life.

ATP Advanced Wear Leveling and block management algorithms optimize writing files to prevent both excessive wear to NAND flash and memory endurance reduction. ATP SD Life Monitor/ S.M.A.R.T Tool provides real time health conditions by monitoring “Spare Utilization Rate”, an early warning mechanism that helps to avoid wearing out and spare block exhaustion before device end of life.

ATP SD/microSD cards are compact footprint ruggedized System-in-Package (SiP) devices, which are IEC/EN 60529 IP67/IP57 compliant. With 100% production level burn-in test, ATP ensures product quality and long-term reliability.

Applications Industrial Control System Industrial PC/Embedded System Industrial Automation Robotics Factory Machinery Data Logging HMI

HEALTHCARE

AUTOMATION

The Internet of Things ( IoT )

INDUSTRIAL PC/EMBEDDED

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7 ATP

ATP Technology

Industrial Temperature

Conformal Coating

Gold Finger

PowerProtectorSMART/ SD Life Monitor

AutoRefresh

Secure Erase

SiP

ATP provides a wide temperature range of -40°C to 85°C in order to cope with harsh environments.

To ensure the finest quality, ATP applies a Conformal Coating which is a protective layer of Parylene applied on electronic circuits to protect it from dust, chemi-cals, extreme temperatures, moisture, and corrosion.

ATP utilizes 30µ”thickness gold finger plating to optimize the signal transmis-sion quality between the connector and ATP DRAM modules.

ATP Patented technology- PowerProtector is an advanced protection used to secure data integrity during unexpected power failure.

ATP SMART/ SD Life Monitor technology detects flash health status and provides life expectancy to the host.

AutoRefresh mitigates read disturb errors and reduces the risk of data loss in read-only areas.

It ensures the systematical-elimination of information from original data.

ATP SiP manufacturing process fully en-capsulates all exposed components to protect them from robust environments.

Gold Finger

Conformal Coating

Life Monitor PowerProtector

AutoRefresh

System in Package

Secure Erase

8DRAM Solutions


DRAM SolutionsATP DRAM Modules for Networking & Embedded Applications.Tested by Next Generation TDBI and ATE with Increased Flexibility, Efficiency and Scalability.

The Ultimate 16GB DDR3 Solution for Intel Atom Servers/AMD PlatformsHigh Capacity ● Power Efficiency ● Cost Effective ● High Performance & Reliability

ATP’s new 16GB DDR3 with low power 1.35V, speedy 1600 MHz solution is perfectly suited for Intel Atom Avoton/Rangeley processers/C2000 series and AMD DDR3 platforms. It is also ideal for high performance computing (HPC) applications, such as telecommunication infrastructure, networking storage systems, NAS (Network Attached Storage), micro/cloud servers, and embedded systems/Industrial PCs, which usually re-quire high density, low power, great scalability and efficiency.

High DensityBuilt-in enterprise-level density supports growing memory demands and large scale/intensive workloadsAddresses specifications with rank/space limitations

Cost EffectiveImplements 8Gbit mono IC in DDR3Low-cost alternative for the expanding memory requirements of hyperscale scale data center environments

Power Efficient 1.35V low power design for optimal power savingsSupports large-scale operations without placing a heavy burden on power bills

High Performance & ReliabilityPerforms up to 1600MHz100% tested through ATP rigid testing methods (ATE/TDBI) to ensure long-term product reliability

Type Speed Voltage IC Qty Rank PCB Height Gold Finger Density

DDR3 Register Solution

RDIMM 1600 MHz 1.35V 18 2STD 30mm

30u 16GBVLP 18.75mm

DDR3 Un-buffered Solution

SODIMM

1600 MHz 1.35V

16

2 STD 30mm 30u 16GB

UDIMM 16

ECC UDIMM 18

ECC SODIMM 18

ECC Mini-DIMM 18

Benefits

9 DRAM Solutions

Legacy (SDR/DDR) DRAM ModuleMicron endorses ATP as a partner to support selected SDR/DDR DRAM Modules

ATP has instituted an agreement with Micron to continue to manufacture Legacy(SDR/ DDR) DRAM modules specifically for the existing customer base that cannot migrate. ATP will offer these modules in selected SODIMM, UDIMM and RDIMM form factors/densities, and continue to provide support and related product roadmaps for the long-term.

Each module will be manufactured to the equivalent specifications and test processes of the corresponding Micron part number License agreement with Micron 100% follow Micron’s design 100% follow Micron’s BOM selection, including key/passive components selection. 100% follow Micron’s firmware setting Equivalent specification & test processes

Together with ATP extended support to minimize customers’ effort on (re)qualification!

“Micron is committed to supporting legacy application requirements. By partnering with ATP we’re able to provide stability for our customers who are unable to transition their existing platforms,” said Bruce Franklin, Product Marketing Director of the Embedded Business Unit for Micron.“Embedded applications require a long life cycle, which is why AMD is pleased to collaborate with ATP and Micron to support the extended life of AMD’s Geode platform,” said Colin Cureton, Product Marketing Manager, AMD Embedded Solu-tion. “ATP’s legacy SDR/DDR SODIMM module solutions utilizing Micron memory are a critical component to industrial con-trol and automation, industrial PCs, HMI panels, point of sales and communication applications.”

Standard Solution

Module Type DDR SO-DIMM DDR SO-DIMM (Industrial Grade)

Capacity 128MB/256MB/512MB/1GB 256MB/512MB/1GB

Function Unbuffered Non-ECC Unbuffered Non-ECC

Frequency 400Mhz 400Mhz

Pin Number 200pin 200pin

PCB Height 1.25" 1.25"

Build To Order (BTO)

Module Type DDR DIMM DDR DIMM DDR SO-DIMM SDRAM SODIMM

Capacity 1GB/2GB 256MB/512MB 256MB/512MB/1GB 64MB

Function Registered ECC Unbuffered ECC/Unbuffered Non ECC Unbuffered ECC Unbuffered Non ECC

Frequency 400Mhz 400Mhz 400Mhz PC100

Pin Number 184pin 184pin 200pin 144pin

PCB Height 1.125"/1.2" 1.25" 1.25" 1.0"

Guarantee :

Endorsement

10DRAM Solutions


ATP Unique Features and Testing Systems

ATP has successfully integrated the DRAM ATE and TDBI tests and the SCADA system into one mass-production-scale burn-in system. ATP focuses on maximizing the ATE testing coverage and accelerating the TDBI testing cycle. A traceable record from IC level testing (from DRAM module level ATE production data to field product usage) has been built, collected, and analyzed via the SCADA system. The entire system is designed to (1) build a system for quality data acquisition, and (2) implement a system for improving the process, based on quality and reliability driven industrial and server environments. The new system provides a wide testing temperature, ranging from -40°to 85°C, which few other TDBI systems can provide. The combined tests have proven to effectively lower the field return rates from major ATP OEM customers. The system has demonstrated ATP’s value added and its commitments to industrial grade quality and reliability.

The Next Generation Test During Burn In – ATP TDBI System

The ATP New Automatic Test Equipment Test-ATE Test

The ATP TDBI system features a unique chamber design allowing for flexibility in customer specific temperature profiles and also features a flexible monitoring/control system.The elevated temperature burn in process reduces field failures due to fringe manufacturing defects and IC infant mortality. The design of the thermal chamber allows for a higher level of production level efficiency, scalability, and flexibility.

ATE provides electrical testing patterns with various parameters, such as marginal voltage, signal frequency, clock, command timing and data timing under continuous thermal cycles. For specific weaknesses of some ICs, ATE can provide specific test-ing patterns to stress the screening of the potential defects during the testing. Also, based on customers’ requests, tailor-made electrical testing patterns can be programmed and implemented into the ATE testing process. The ATE testing system is also able to pinpoint individual defective ICs and defective DRAM PCB boards, providing a much more efficient failure analysis method for both new product development and mass production stages.

The SCADA (Supervisory Control and Data Acquisition)The SCADA (Supervisory Control and Data Acquisition) feature of the TDBI system allows for true flexibility in application/customer specific temperature profiles and data patterns (customer specific software/ scripts). SCADA also offers real-time monitoring and production lot logging for QA traceability.

Remote monitoring and control over thermal burn-in testing array Real-time monitoring of testing cycle status on all systems Database containing all profiles, test cycles, and production logs for QA traceability

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11 DRAM Solutions

Industrial Temperature Conformal Coating

A cost-effective solution, with a wide temperature range from -40°C to 85°C, ideally suited for telecom, industrial and military/ aerospace applications.ATP offers two testing Technologies for the Wide Temperature DRAM Solution: 1. Advanced IC Level Testing and 2. The Enhanced Module Level TDBI and ATE Testing. Compared to other competitors’ WT DRAM solutions, the ATP-exclusive IC level and system level testing on DRAM ICs has made ATP WT DRAM modules more reliable in the long run, based on user data in the field. ATP WT DRAM solution has also provided a superior overall system-wide stability over typical commercial temperature DRAM mod-ules.

Conformal Coating is a process in which a protective layer of Parylene is applied to electronic circuits and modules to protect against dust, chemicals, extreme temperatures, moisture, and corrosion. Uncoated surfaces are prone to damage and malfunction, hence the added protection be-comes necessary for harsh environments.In contrast to dipping and spraying techniques, the chemi-cal vapor deposition (CVD) provides a vacuum-like environ-ment in which the Parylene particles coat all components and points of failure.

In order to ensure the quality of the signal transmission between the connector and ATP DRAM module, ATP uti-lizes gold finger plating with 30μ” thickness, compared to competitors’ DRAM modules thickness typically at less than 10 μ”.

6 ~ 10 Layer PCB Provides Improved High-Speed Signal Quality.

Increased Thickness, Increased Strength

30μ”

ATP Unique Features and Testing Systems

Gold Finger

Conformal Coating

12DRAM Solutions


Product Category Speed(MT/s) Form Factor Features

DDR4

RDIMM RDIMM VLPUDIMM/UDIMM ECC SO-DIMM/SO-DIMM ECC

21332400

• Low profile• Very Low Profile (VLP) options (VLP: 0.74" height)

• Density: 4GB to 64GB • Increased performance and bandwidth (up to 3200 MT/s)• Decreased voltage for better power consumption• Provides better reliability, availability and serviceability

(RAS) and improves data integrity.

DDR3

LRDIMM RDIMM UDIMM/UDIMM ECCSO-RDIMMSO-DIMM/SO-DIMM ECCmini-RDIMMmini-UDIMM ECC

1866160013331066

• Low profile• Very Low Profile (VLP) options (VLP: 0.74" height)• Ultra Low Profile (ULP) options (ULP: 0.7"~0.72” height)

• Density: 1GB to 32GB 32GB to 64GB(LRDIMM)• Chipkill support• Fly-by command/address/control bus with on-DIMM termination.• Higher bandwidth performance, effectively up to 1866 MT/s• Better performance at low power; 1.5V (Normal) and 1.35V(Low Voltage)

DDR2

RDIMMUDIMM/UDIMM ECCSO-RDIMMSO-CDIMMSO-DIMMmini-RDIMMFB-UDIMM*

800667533400

• Low Profile• Very Low Profile (VLP) options (VLP:0.72"~0.74" height)

• Density: 1GB to 8GB• Chipkill support

FB-DIMM• Low power and low voltage options• Apple FB-DIMM

DDR*

UDIMM/UDIMM ECC SO-CDIMM SO-DIMM

400333266


• Chipkill support

SDRAM*

RDIMMUDIMM/UDIMM ECCSO-UDIMM

PC 133PC 100


• Chipkill support• Legacy system support

Complete DRAM Product Line

Product Portfolio Category Product Features

Industrial Grade Family

SO-DIMMUDIMMRDIMM

DDR3DDR2DDR*SDRAM*

• Extended temperature: -40°C ~ +85°C• Controlled BOM and SPD• For mission critical industrial applications• conformal coating

* Available on a project basis.

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13 Flash Solutions

ATP Testing Capabilities

Note*: ATP testing support may vary on different products. Please contact ATP for any specific inquiries.

FLASH Solutions

Prod

uct D

evel

opm

ent

NAND Flash IC Level & Storage Device Level Test

Application & Industry Specific Validation Testing

Joint/Supplemental Validation

Mass Production Level Test

● Enhanced IC level validation and IC level reliability report/notes ● Data reliability & raw bit error rate impact under various data patterns

● Embedded/Industrial segments have a high variance in application/usage models

● Industry standards: IPC/JEDEC, AEC-Q100*, MIL-STD..etc. ● Additional tests: Power cycling test, Product life time simulation…etc.Note*: Adjusted test conditions approved by customers

● Compatibility/function tests with customers’ host devices, systems, and platforms.

● Customized test criteria with specific software/test script ● In-depth ATP knowledge regarding specific usage models & behaviors

● Sorting out manufacturing/components defects for quality/reliability assurance● Efficient & scalable ATP developed testing equipment and testing script with

lot tracking/recording● ATP offers Mass Production Level RDT (Reliability Demonstration Test) which

tests based on NAND characteristics- Support wide temperature- 100% tests in whole drive (Firmware, user, spare area)- Classify various grades by pre-set ECC level…

14Flash Solutions


ATP Prominent Technologies

ATP S.M.A.R.T./SD Life Monitor, a flash storage device health status monitoring tool, reliably detects the remaining life of the device and is available to be integrated into host systems. It is seen as an early warn-ing command tool to prevent wear out and spare block exhaustion and furthermore allows users sufficient time for safe storage retirement and replacement.

One practical example is frequent write operation required in automation applications; ATP S.M.A.R.T./SD Life Monitor is the optimal solution for sustaining endurance and service life of memory possibly impacted by high write amplification while frequently writing small-file data.

To mitigate the potential problems caused by compatibility issues, ATP S.M.A.R.T./SD Life Monitor supports a wide array of Operating Systems including Windows and Linux . (Note: For updates on OS support of ATP S.M.A.R.T tool, please contact your ATP local sales representative.)

ATP SMART tool is designed for real-time health checks of the storage device, such as device temperature, firmware version, capacity and so on.

ATP SD Life Monitor with Spare Remaining Rate (%), TotalErase Count, and so on.Note : The compatibility and support of Life Monitor may vary on different platforms/operating systems.

S.M.A.R.T./SD Life Monitor S.M.A.R.T: 2.5” SATA SSDs/Memory Cards - CFast /Embedded Modules - M.2,mSATA,SlimSATASD Life Monitor: Memory Cards - SD, microSD

OS Support:

New SMART tool for SATA III serial product

New Features: Enhanced SD Life Monitor

Life Monitor

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15 Flash Solutions

ATP Prominent Technologies

ATP AutoRefresh can drastically reduce the risk of data loss in the read-only area, as the feature automatically checks the ECC in every read opera-tion before uncorrectable failure occurs. It can also move data to good blocks before any failure occurs. ATP AutoRefresh is best suited for read intensive applications such as boot-up and IVI (In-vehicle infotainment).

ATP Secure Erase initiates a block-by-block data pattern write operation to systematically eliminate any trace of the original data. ATP Secure Erase ensures all data is completely removed, so it can’t be recovered. Therefore, it’s best suited for Corpo-rate Business (assets management), Government Agency and Military applications.

ATP System-in-Package (SiP) fully encapsulates all exposed components and points of failure to protect against water(IPX7)/humidity, dust(IP5X/IP6X), electrostatic discharge, shock/vibration, and extreme temperatures.

ATP PowerProtector, an advanced power protection mechanism integrating hardware designs and firmware algorithm, is designed for supplying sufficient power and sustaining data integrity during power failure in mission-critical applications.ATP PowerProtector stops receiving commands from host device after detecting the power failure and leverages the protection from DRAM cache to NAND flash to finish the last operation.

Data Protection Under Power Glitch

Automatically checks ECC before uncorrectable failure occurs in every read operation

New Secure Erase Tool for all ATP Products

ATP SiP vs Other Brands

PowerProtector

AutoRefresh

Secure Erase

System-in-Package (SiP)

ATP PowerProtector is available for all ATP Memory Cards-CFast/CF, 2.5’’ SATA SSD-SII Pro/M V, and Embedded Modules

ATP AutoRefresh is available for all ATP Memory Cards

ATP Secure Erase is available for all ATP Memory Cards - SD,2.5’’ SATA SSDs, Embedded Modules and USB Drives

ATP SiP is available for all ATP Memory Cards - SD/microSD and USB Drives

10ms

Pow

er (V

)

Time (ms) Without PowerProtector

PowerProtector

Pow

er (V

)

Time (ms) With PowerProtector

Data Structure of Flash Device

Access Frequency

Map Zone 1Frequent

Read

Map Zone 2Seldom

Read

Spare Block

High

Low

PowerProtector

AutoRefresh

System in Package

Secure Erase

16Flash Solutions


Endurance/Price Comparisons of MLC/eMLC/aMLC

ATP aMLC with an advanced firmware algorithm manipulates 2 bits of MLC flash into 1 bit and is considered an evolution in MLC memory cards. With the advantage of being cost-effective, ATP aMLC solution does not compromise on endurance, reliability, and performance to meet industrial operating requirements.

Write-Intensive: Data logging for surveillance, medical imaging, transportation ticketing systems, and drive recorders which requires high P/E cycles for frequent data writing.

Read-Intensive: Boot-up for OS/application drive in the system for POS, ATM, Kiosk, and automation Applications.

aMLC NAND Flash Product List

aMLC Target Applications

• Advanced Wear Leveling Algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data integrity during read operation• Enhanced F/W algorithm to minimize the risk of a sudden power-off• Waterproof, Dustproof and ESD resistant• Highly reliable and passes environmental testing (Bend/Torque/Salt Spray/Solar radiation)• Life Monitor (Note: The compatibility and support of Life Monitor may vary on different Platforms /operating systems)

Endurance

(2.7K P/E cycles @ 55C)

Performance

MLC

Y

eMLC

3Y

MLC

X

eMLC

0.8X

ATP aMLC

3X ~ 5X

ATP aMLC

13Y ~ 15Y

MLC

Z

eMLC

0.25Z

ATP aMLC

5Z

Key Features

aMLC (advancedMLC) Targeted Product Portfolio with Comprehensive Testing and Competitive Pricing

Product 2.5”SSD Velocity XE mSATAMO-300A

SlimSATA MO-297 SDHC microSDHC

Density 8GB ~64GB 8GB ~64GB 8GB ~64GB 4GB ~8GB 4GB ~16GB

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17 Flash Solutions

Complete Flash Product Line

Product Dimensions(L x W x H mm)

FlashType Densities Operating

Temp.

Data Transfer Rate

(MB/s)(max.)

TBW**(max.)

PowerProtector(H/W)

Secure Erase

(S/W)***

LifeMonitor(S/W)***

SATA

2.5" SSD

Velocity SII Pro

100.0 x 69.9 x 9.2 SLC 32GB~256GB -40�C~+85�C Read: 520 MB/sWrite: 420 MB/s

10,240 TB

Velocity XE

100.0 x 69.9x 9.2 aMLC 8GB~64GB 0�C~+70�C Read: 250 MB/sWrite: 180 MB/s 1,024 TB -

Velocity M V

100.0 x 69.9 x 9.2 MLC 64GB~512GB 0�C~+70�C Read: 520 MB/sWrite: 440 MB/s 614.4 TB

M.2

2260D2-B-M 60.0 x 22.0 x 3.5

SLC 32GB~128GB -40�C~+85�C Read: 530 MB/s Write: 390 MB/s 5,120 TB

MLC 64GB~256GB 0�C~+70�C Read: 485 MB/s Write: 300 MB/s 307.2 TB

2242D2-B-M 42.0 x 22.0 x 3.5



mSATAMO-300A 50.8 x 29.85 x 3.4


aMLC 8GB~64GB 0�C~+70�C Read: 250 MB/s Write: 190 MB/s 512 TB


SlimSATAMO-297 54.0 x 39.0 x 4.0

SLC 8GB~128GB -40�C~+85�C Read: 530MB/sWrite: 430 MB/s 5,120 TB

aMLC 8GB~64GB 0�C~+70�C Read: 250 MB/sWrite: 190 MB/s 512 TB

MLC 8GB~512GB 0�C~+70�C Read: 530 MB/sWrite: 440 MB/s 614.2 TB

CFast 42.8 x 36.4 x 3.6

SLC 8GB~32GB -40�C~+85�C Read: 500 MB/sWrite: 300 MB/s 1,280 TB

MLC* 16GB~128GB 0�C~+70�C Read: 445 MB/sWrite: 160 MB/s 153 TB

PATA/IDE

Compact Flash 42.8 x 36.4 x 3.3

SLC 512MB~32GB -40�C~+85�C Read: 61 MB/sWrite: 55 MB/s 1,280 TB

MLC* 8GB~32GB 0�C~+70�C Read: 110 MB/sWrite: 46 MB/s 38.4 TB -

USB Drive

eUSB

2.54mm36.9 x 26.6 x 11.52.00mm36.9 x 26.6 x 8.4

SLC 1GB~32GB -40�C~+85�C Read: 30 MB/s Write: 27 MB/s 640 TB -

MLC* 8GB~32GB 0�C~+70�C Read: 22 MB/s Write: 15 MB/s 19.2 TB -

NANODURA 34 x 12.2 x 4.5

SLC 512MB~8GB -40�C~+85�C Read: 21 MB/sWrite: 16 MB/s 96 TB - -

USB Module 26.6 x 12.0 x 4.5

18Flash Solutions


Product Dimensions(L x W x H mm)

FlashType Densities Operating

Temp.

Data Transfer Rate

(MB/s)(max.)

TBW**(max.)

Power Protector

(H/W)

Secure Erase

(S/W)***

LifeMonitor(S/W)***

SD

SD/SDHC/SDXC 32.0 x 24.0 x 2.1

SLC 512MB~32GB -40�C~+85�C Read: 20 MB/s Write: 18 MB/s 768 TB

-aMLC 4GB~8GB -25�C~+85�C Read: 74.4 MB/s Write: 27.3 MB/s 128 TB

MLC 8GB~128GB -25�C~+85�C Read: 91.1 MB/s Write: 58.9 MB/s 153 TB

microSD/ microSDHC

8

15.0 x 11.0 x 1.0

SLC 512MB~8GB -40�C~+85�C Read: 20 MB/s Write: 18 MB/s 192 TB

-aMLC 4GB~16GB -25�C~+85�C Read: 74.4 MB/s Write: 36.2 MB/s 256 TB

MLC 8GB~32GB -25�C~+85�C Read: 68.3 MB/s Write: 24.4 MB/s 38.4 TB

* Available on a project basis. ** All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.*** ATP software support for demo use only.

Product Dimension (Size) Comparision

2.5” SATA SSD mSATAM.2 2260 M.2 2242 SlimSATA

microSD/microSDHCSD/SDHC/SDXCCFastCFeUSB

100.0 mm

69.9 mm

60.0 mm

22.0 mm

50.8 mm

29.85 mm

42.0 mm

22.0 mm

39.0 mm

54.0 mm

36.4 mm

42.8 mm

36.4 mm

42.8 mm

36.9 mm

26.6 mm

32.0 mm

24.0 mm

11.0 mm

15.0 mm

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19 Memory Cards

• SLC (Single-Level-Cell) NAND flash and MLC (Multi-Level Cell / 2-bit per Cell) NAND Flash

• Advanced Wear Leveling Algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data integrity during

read operation• IP57/IP67 waterproof/Dustproof test (IEC 60529)• Highly reliable and passes environmental testing (Bend/Torque/Salt Spray/Solar radiation)• ESD resistance• Life Monitor (Note : The compatibility and support of Life Monitor may vary on different platforms/operating systems)

ATP flash products are designed to perform consistently under conditions of extreme temperature, shock, vibration, and humidity. ATP Industrial Grade SD/microSD cards are optimized for demanding industrial applications such as automation, internet of things (IoT), healthcare, handheld devices, military, and aviation, where critical data requires the highest levels of reliability, durability, and data integrity. Meanwhile, ATP provides a wide range of Industrial Grade SD card series with built-in SLC (Single Level Cell) type NAND flash and advanced wear leveling algorithms which maximize flash component utilization. ATP implements AutoRefresh technology, which activates data integrity protection in read intensive applications and SD Life Monitor tool, which allows users to identify the health status of SD series cards.

Furthermore, given the consistent performance, durability and compatibility of ATP UHS-I SD/microSDHC memory cards, they are recommended for intensive read operation such as, automotive IVI and navigations systems. ATP SD card series are developed based on the strict validation processes, from its in-house NAND flash IC level test, specific industry standard test (AEC-Q100, MIL-STD, JEDEC…etc), power cycling test to 100% mass production burn in test. Moreover, ATP automotive IVI testing and SiP (System-in-Package) technology allow the great reliability together with extreme tolerance to temperature, vibration, dust, humidity in harsh operation conditions.

SD/SDHC/SDXCmicroSD/microSDHC

Key Features

Memory Cards

20Memory Cards


• Industrial PC• Medical devices• Automation• Automotive IVI systems• Test and Measurement• Surveillance systems

• Drive recorders• Navigation systems• Network cameras• Mobile/Handheld computers

Applications

Product Name SD/SDHC/SDXC

Flash Type SLC aMLC MLC

Density 512MB to 32GB 4GB to 8GB 8GB to 128GB

PerformanceSequential Read up to 20 MB/s Sequential Read up to 74.4 MB/s Sequential Read up to 91.1 MB/s

Sequential Write up to 18 MB/s Sequential Write up to 27.3 MB/s Sequential Write up to 58.9 MB/s

Interface SD 2.0 SD 3.0 UHS Mode SD 3.0 UHS Mode

Operating Temperature -40°C to +85°C -25°C to +85°C -25°C to +85°C

Storage Temperature -55°C to +90°C

Reliability

Advanced Static/Dynamic Wear-Leveling

TBW** (max.) : 768 TB TBW** (max.) : 128 TB TBW** (max.) : 153 TB

MTBF @25°C: >5,000,000 hours MTBF @25°C: >3,000,000 hours MTBF @25°C: >2,000,000 hours

Number of Insertions: 10,000 minimum

Dimensions: LxWxH (mm) 32.0 x 24.0 x 2.1

Product Name microSD/microSDHC


Density 512MB to 8GB 4GB to 16GB 8GB to 32GB

PerformanceSequential Read up to 20 MB/s Sequential Read up to 74.4 MB/s Sequential Read up to 68.3 MB/s

Sequential Write up to 18 MB/s Sequential Write up to 36.2 MB/s Sequential Write up to 24.4 MB/s

Interface SD 2.0 SD 3.0 UHS Mode SD 3.0 UHS Mode

Operating Temperature -40°C to +85°C -25°C to +85°C -25°C to +85°C

Storage Temperature -55°C to +90°C

Reliability

Advanced Static/Dynamic Wear-Leveling

TBW** (max.) : 192 TB TBW** (max.) : 256 TB TBW** (max.) : 38.4 TB

MTBF @25°C: >5,000,000 hours MTBF @25°C: >3,000,000 hours MTBF @25°C: >2,000,000 hours



Specifications

*Available on a project basis.**All TBW data listed are under highest sequential write value in each product line. The TBW data are subject to change by density, configuration and customers’ applications.

Life Monitor Secure Erase AutoRefresh System in Package Shock Resistance ESD ResistanceWaterproof Dustproof

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21 Memory Cards

Memory Cards

With the more advanced SATA interface, the ATP Industrial Grade CFast is the ideal replacement for CompactFlash. The CFast is fully compliant with CFA's CFast specification version 2.0 with a SATA 6 Gb/s interface. The ATP CFast with PowerProtector guarantees a reliable controller and lasting NAND flash operations with a backup power circuit during a power failure. By utilizing SLC NAND flash memory and Advanced Wear Leveling technology, the ATP Industrial Grade CFast has a higher program/write endurance and a longer product lifespan.

The ATP Industrial Grade CompactFlash Card has enhanced endurance levels for an extended product life cycle by utilizing select SLC NAND flash and the Advanced Wear Leveling technology. Moreover, AutoRefresh technology monitors the error bit levels during each read operation to ensure better data integrity.

Product Name CompactFlash Card CFast Card

Flash Type SLC MLC* SLC MLC*

Density 512MB to 32GB 8GB to 32GB 8GB to 32GB 16GB~128GB

Performance

Sequential Read up to 61 MB/s




Sequential Write up to 55 MB/s


Sequential write up to 300 MB/s

Sequential write up to 160 MB/s

Interface UDMA 0~6 SATA III 6 Gb/s

Operation Temperature -40°C to 85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C

Reliability

Advanced Wear Leveling & Bad Block Management

TBW** (max.) : 1,280 TB TBW** (max.) : 38.4 TB TBW** (max.) : 1,280 TB TBW** (max.) : 153 TB

MTBF @25°C: >5,000,000 hours

MTBF @25°C: >2,000,000 hours

MTBF @25°C: >2,000,000 hours

MTBF @25°C: >2,000,000 hours


Dimensions: LxWxH (mm) 36.4 x 42.8 x 3.3 36.4 x 42.8 x 3.6

CompactFlash Card - Industrial Grade

CFast Card - Industrial Grade

• SLC (Single-Level-Cell) NAND Flash with a longer lifespan• Enhanced endurance with Advanced Wear Leveling algorithm• Bad Block Management• Read Disturb Protector - AutoRefresh to ensure data integrity during read operation• Built-in hardware-based data protection technology during power failure – PowerProtector• Supports S.M.A.R.T. ATA feature set


Specifications

Key Features

Life Monitor Secure Erase AutoRefresh PowerProtector Shock Resistance

22SSDs


PowerProtector Shock Resistance

The ATP Velocity SII Pro 2.5” SSD with SATA III interface is a best-in-class wide-temp industrial grade SLC SSD solution with enterprise-class features. SII Pro SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements (ATP PowerProtector technology), suited for POS, industrial computers, data center and industrial applications in mission-critical, high shock and vibration environments.

Product Name Velocity SII Pro SSD 2.5”

Flash Type SLC

Density 32GB to 256GB

Performance



Random Read IOPS up to 78,000

Interface SATA III 6 Gb/s

Operating Temperature -40°C to +85°C

Reliability

Advanced Wear Leveling

TBW** (max.) : 10,240 TB

MTBF @ 25°C : >2,000,000 hours


Velocity SII Pro

Specifications

Key Features• Ideal for heavy program/erase applications• High Performance with SATAIII interface• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure – PowerProtector• NSA Compliant SecureErase• Supports S.M.A.R.T. ATA feature set• MIL-STD-810G compliant


Life Monitor Secure Erase

2.5” SATA SSDs

23 SSDs

Product Name Velocity XE 2.5” SSD

Flash Type aMLC

Density 8GB to 64GB

Performance




Interface SATA II 3 Gb/s

Operating Temperature 0°C to +70°C

Reliability


TBW** (max.) : 1,024 TB

MTBF @ 25°C : >2,000,000 hours


Velocity XE

The ATP Velocity XE SATA SSD provides outstanding performance and proven reliability for product operation, which is perfect for networking and thin clients, and is also suitable for enterprise storage systems with outstanding sequential read and write performance requirements to relieve performance bottlenecks associated with traditional rotating media storage (HDD).

• Designed for enterprise applications requiring high endurance on aMLC (Advanced Multi-Level Cell) technology• Enhanced endurance by Advanced Wear Leveling algorithm• Supports Static Data Refresh technology• NSA Compliant SecureErase• Supports S.M.A.R.T. ATA feature set

Specifications

Key Features

2.5” SATA SSDs


Life Monitor Secure Erase

24SSDs


Velocity M V

Utilizing MLC (Multi Level Cell) NAND flash components, the ATP Velocity M V Enterprise Grade SSD is a best-in-class MLC SSD solution with enterprise-class features for cost-sensitive clients. M V SSD offers outstanding performance and proven reliability, ideal for extreme performance, and consistent data integrity requirements, suitable for POS, industrial computers, data center and industrial applications exposed to high shock and vibration environments.

• Designed for enterprise applications requiring high endurance on MLC technology• High performance with SATA III Interface• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure – PowerProtector• NSA Compliant SecureErase• Supports S.M.A.R.T. ATA feature set• MIL-STD-810G Shock/Vibration compliant

Product Name Velocity M V 2.5” SSD

Flash Type MLC

Density 64GB to 512GB

Performance





Operating Temperature 0°C to +70°C

Reliability


TBW** (max.) : 614.4 TB

MTBF @ 25°C : >2,000,000 hours


Specifications

Key Features


PowerProtector Shock ResistanceLife Monitor Secure Erase

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Embedded Modules25

Embedded Modules

Product NameM.2

2260 D2-B-M 2242 D2-B-M

Flash Type SLC MLC SLC MLC

Density 32GB to 128GB 64GB to 256GB 8GB to 64GB 32GB to 128GB

Performance














Operating Temperature -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C

Reliability

Advanced Wear Leveling , AutoRefresh

TBW** (max.) : 5,120 TB TBW** (max.) : 307.2 TB TBW** (max.) : 2,560 TB TBW** (max.) : 153.6 TB

MTBF @ 25°C: >2,000,000 hours

Dimensions: LxWxH (mm) 60.0 X 22.0 X 3.5 42.0 X 22.0 X 3.5

The ATP M.2 2242/2260 Embedded SSD is the Next Generation Form Factor (NGFF) storage solution. It provides outstanding performance and proven reliability for product operation, which is perfect for networking and thin clients, also suitable for enterprise storage systems consistent data integrity requirement such as POS, industrial computers, and data center applications.

M.2

Specifications

Key Features


• Adheres to M.2 specification v1.0 defined by PCI-SIG• Built-in hardware-based data protection technology during power failure - PowerProtector• Ultra high performance solution for small form factor embedded and industrial applications• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

PowerProtectorLife Monitor Secure Erase

Embedded Modules 26



Specifications

Product Name mSATA


Density 8GB to 128GB 8GB to 64GB 16GB to 512GB

Performance










Interface SATA III 6 Gb/s SATA II 3 Gb/s SATA III 6 Gb/s

Operating Temperature -45°C to +85°C 0°C to +70°C

Reliability

Advanced Wear Leveling , AutoRefresh, PowerProtector

TBW**(max.) : 5,120 TB TBW** (max.) : 512 TB TBW* (max.) : 614.4 TB

MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >3,000,000 hours MTBF @ 25°C: >2,000,000 hours

Dimensions : LxWxH (mm) 50.8 x 29.85 x 3.4

• Adheres to the JEDEC mechanical specification MO-300A• Built-in hardware-based data protection technology during power failure - PowerProtector• Ultra high performance solution for small form factor in embedded and industrial applications• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

The mSATA Industrial Grade Embedded Module is designed for small form factor embedded and networking applications with space constraints and high performance requirements. To further ensure data integrity, the ATP PowerProtector technology allows the ATP mSATA to intelligently manage the read and write process under a sudden power failure, thus surpassing the technical and space limitations offered by existing power failure protection solutions. PowerProtector’s leaner requirements for board footprint allows for support in smaller form factors such as mSATA.

mSATA

Key Features


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Embedded Modules27

Embedded Modules

• JEDEC standard: MO-297(SlimSATA) compliant• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure - PowerProtector• Supports S.M.A.R.T. ATA feature set• RoHS compliant and CE/FCC certification

Product Name SlimSATA


Density 8GB to 128GB 8GB to 64GB 16GB to 512GB

Performance



Sequential Read up to 530MB/s



Sequential Write up to 440MB/s




Interface SATA III 6 Gb/s SATA II 3 Gb/s SATA III 6 Gb/s


Reliability

Advanced Wear Leveling, AutoRefresh, PowerProtector

TBW** (max.) : 5,120 TB TBW** (max.) : 512 TB TBW** (max.) : 614.2 TB

MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >3,000,000 hours MTBF @ 25°C: >2,000,000 hours


With its small size and JEDEC MO-297 standard compliant, the ATP SlimSATA with PowerProtector is an ideal solution for business-critical embedded and networking applications. Featuring a standard SATA interface and premium grade NAND flash components, ATP SlimSATA offers ultra-fast read performance of up to 530 MB/s and write performance of up to 440 MB/s. The ATP SlimSATA offers an alternative solution for embedded applications such as IPC, AdvancedTCA, single board computers, surveillance & security and networking, which have space constraints and require high performance and reliability.

SlimSATA

Specifications

Key Features



Embedded Modules 28


eUSB SSDPin-Pin Replacement for Intel ® Z-U130 Value SSD

• Product flexibility as a boot drive• Enhanced endurance with Advanced Wear Leveling algorithm• Built-in hardware-based data protection technology during power failure - PowerProtector• RoHS compliant and CE/FCC certification

Product Name eUSB SSD

Flash Type SLC MLC*

Density 1GB to 32GB 8GB to 32GB

PerformanceSequential Read up to 30 MB/s Sequential Read up to 22 MB/s

Sequential Write up to 27 MB/s Sequential Write up to 15 MB/s

Connector Pin 9 Pins Internal USB (USB 2.0 & 1.1 compliant)


Reliability


TBW** (max.) : 640 TB TBW** (max.) : 19.2 TB

MTBF @ 25°C: >5,000,000 hours MTBF @ 25°C: >2,000,000 hours

Profile Standard Profile Low Profile

Dimensions : LxWxH (mm) 36.9 x 26.6 x 11.5 36.9 x 26.6 x 8.4

Connector Pin Pitch 2.54 mm 2.00 mm

The ATP e U SB SSD is specifically designed to support applications that previously used Intel's Z-U130 Value SSD such as networking, embedded, and medical applications. In addition, utilizing PowerProtector technology ensures a reliable controller and lasting NAND flash operation with a backup power circuit during a sudden power failure.

Specifications

Key Features


PowerProtectorSecure Erase

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29 USB Drives

ATP Industrial Grade USB Drives are designed for mission-critical embedded applications with space constraints, high performance and high data retention requirements. The drives have the extraordinary endurance of 60,000 program/erase cycles, while most MLC-based USB drives on the market have less than 3,000 program/erase cycles. The Industrial Grade USB Drive is ideal for industrial applications such as medical, IPC and automation.

• Enhanced endurance with Advanced Wear Leveling algorithm• 10 years data retention for SLC-based ATP Industrial Grade USB Drive vs. 6 months for MLC-based USB drives• System in Package (SIP) Technology: extreme operating temperature: -40°C to 85°C; water/moisture, vibration, shock and electrostatic discharge resistant• NSA Compliant SecureErase

NANODURA / USB Module

Product Name USB Drive - NANODURA USB Drive - USB Module

Flash Type SLC

Density 512MB to 8GB

PerformanceSequential Read up to 21MB/s

Sequential Write up to 16MB/s

Interface Compatible with USB 2.0(480Mbps)

Operating Temperature -40°C to +85°C

Reliability


TBW** (max.) : 96 TB

MTBF @ 25°C: >5,000,000 hours


Dimensions: LxWxH (mm) 34.0 x 12.2 x 4.5 26.6 x 12.0 x 4.5

Specifications

Key Features


Secure Erase System in Package Shock Resistance ESD Resistance

USB Drives

Waterproof Dustproof


30ATP

ATP Reliability Protector saves your TCO

Endurance Protector: ¼ TCORead Protector: >2M times read (ATP) VS.100K times readRetention Protector: 2X more data retention

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ATP CHINATEL: +86-21-5080-2220FAX: [email protected]

ATP EUROPETEL: +49-89-374-9999-0FAX: [email protected]

ATP TAIWAN(HQ)TEL: +886-2-2659-6368FAX: [email protected]

ATP JAPANTEL: +81-3-6206-8097FAX: [email protected]

ATP USATEL: +1-408-732-5000FAX: [email protected]

© Copyright 2016 ATP Electronics, Inc. All rights reserved.Specifications or details may change without notice.All trademarks and registered trademarks are the property of their respective owners.

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