atmel corporation - 3d perspectives...4 © 2014 atmel corporation.lifestyle automotive healthcare...

1 © 2014 Atmel Corporation.

Atmel Corporation Enabling Unlimited Possibilities® PLM ENOVIA Implementation Nov 2015 Sankhajit Chakraborty

2 © 2014 Atmel Corporation. 2 © 2014 Atmel Corporation.

Agenda

• Atmel Corporation Overview

• Business Objectives - Atmel PLM Implementation

• Why ENOVIA PLM

• ENOVIA-based PLM Design Constructs

• Key Learnings

• Benefits

• Q&A


• Nasdaq: ATML

• Founded in 1984

• 2014 Net Revenue: $1.41B

• Two Decades of Microcontroller Innovation and Leadership

• ~5,000 Employees

Corporate Snapshot

September 20, 2015: Dialog Semiconductor has agreed to

acquire Atmel Corporation, creating a global leader in both

Power Management and Embedded Processing Solutions,

supporting Mobile Power, IoT and Automotive customers.


Lifestyle Automotive Healthcare Residential Energy Industrial

“By 2020, there will be 40 billion connected devices” -Source: ABI Research, Aug. 2014

“Atmel tops the list primarily because of its strong community presence

and specialized MCU offering.” Source: Gartner, Sept. 2014

The Internet of Things Driving Smart Connected Devices


Touch Automotive Security Wireless MCU/MPU

Atmel - Offering a Broad Product Portfolio

Memory, Smart Energy, LEDs, etc….


Objectives - Atmel PLM Implementation

Define a Single System of Record for Product Master Data

• Platform for setting up clean BOMs – Engineering, Manufacturing, ERP, Planning and Product Costing

• Democratize product data management

• Reduce cycle time for product release to manufacturing

• Generate unambiguous, simple and uniform build instruction for manufacturing suppliers

• Reduce production errors by maintaining a clean Product Master Record

• Reduce operating cost and user frustration with current multiple antiquated technologies and systems

• Real-time availability for downstream systems

• Improve employee productivity


Why ENOVIA PLM

ENOVIA is an Industry-standard PLM Solution

Ease of Use

• Usability is appealing to end-users

• Easy to configure and prototype for design validation

• ENOVIA allows convergence of mapping Atmel’s varied tool and process solutions

• Easy to import data into ENOVIA using Spinner tools

• ENOVIA’s object-oriented design provides inherent data integrity

Flexibility

• The D2M template has pre-built configurations specific to semiconductor implementation – both from engineering and manufacturing standpoint

• ENOVIA’s Variant Configuration Central app provides flexibility to model features and hierarchy of a saleable part allowing reuse across Atmel business units


Mask Family Mask Set

Unsorted Wafer Sorted Wafer

Sorting Fabrication

Technology/Tapeout/Wafer Processing

Semiconductor Manufacturing Process

Features

Sales Item

Product

Portfolio

Projects Requirements

Specifications

Singulated Die

Assembly Kit Assembled

Part

Singulation

Assembly

ASSEMBLY

Tested Part Binned Part Finished Part

Binning Finishing Final Test

TESTING and BINNING

9 © 2014 Atmel Corporation. 9

System Landscape

DFM

Foundry

FAB

Internal

BUMP SORT Specs

Subcon1

Assembly Specs

Subcon2

Test Specs

Subcon3

Finish Specs

Manufacturing Specs and Starts Signal

SAP ERP ENOVIA PLM

Atmel Staging DB

Atmel

Legacy

PDM(s)

FT & CP Sort

Summary

Test Results

Frontend &

Backend

Specification Data

PSF

ACE/YE WEB

SAP

ACABIS

GBI/GTE

LTS/WS

IMS

Probervision

Build Up Inst

XMLRT

Integration XMLRT

Integration Planning

BOM Yields

Responsibilities

PLM/DS DFM Atmel Legacy


ENOVIA

Unsorted Wafer

19552U16P: Sorted Wafer

Assembled Part

Tested Part

Finished Goods

AT898S252-24AU: CPN

Package Kit (Site Specific)

Marked Part

Binned Part

19552U:Die

Pkg Material Set

(Site Specific) Leadframe

Bonding Diagram

Tube/Tray/Tape

Raw Wafer

“S” Phase Part

G Phase Wafer

Assembly Kit (Site Specific)

SAP ERP

19552U11W: Unsorted Wafer


19552U16-AIXU11A: Assembled Part?

19552U16-AIXU11T: Tested Part

19552U16-AIXU11F: Finished Goods

AT898S252-24AU: CPN

Raw Wafer

IMS/Build Up

Package

19552:Die XYZ:Leadfr

ame

Package

Materials

PSF

19552U11W:

Unsorted Wafer


Raw Wafer

19552:Die 19552:

Mask Set

16.5K:Process

Technology

Current Part/BOM Management

•Multiple fragmented tools and systems

•Atmel has over 9 systems to manage controlled documents only

•Different applications manage pieces of product definition

SAP ERP

19552U11W: Unsorted Wafer


19552U16-AIXU11A: Assembled Part

19552U16-AIXU11T: Tested Part

19552U16-AIXU11F: Finished Goods

AT898S252-24AU: CPN

Raw Wafer

IMS/Build Up/ACABIS

Package

19552:Die XYZ:Leadfr

ame

Package

Materials

PSF

19552U11W:

Unsorted Wafer


Raw Wafer

19552:Die 19552:

Mask Set

16.5K:Process

Technology


Product Definition Structure

Speed

Options

24

Package Options

TQFP

-44A-

44

PLCC

44J

44 PDIP

40P6

40

Temperature

Grade Options

Industrial

Grade

Commercial

Grade

Product Line

Package Options

Product Configuration

Product

Atmel Product Structure Typical Semiconductor Product Structure

Microcontrollers:

Product Line

8051 Architecture:

Product Line

Flash ISP:

Product Line

AT89S8252:

Product

AT89S8252-24AC: Orderable Part 1

AT89S8252-24JC: Orderable Part 2

AT89S8252-24PI: Orderable Part 3

Options

Speed Options

Device Grade Options

Power Consumption

Model

Sub-Product Line

Features and Options


Rel 1.0 Dec14

Rel 1.5 Jun15

Rel Aug19

Atmel PLM Roadmap

PLM Roadmap for Product Data Management and Design for Manufacturing

2014 2015 2016

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2

PDM R1 - Document

PDM R1.5 – Final PDM Configurations – 6/23/15

DocPortal 8/19/15

PDM R2 – Serial/Crypto 12/19/15

PDM R3 – RFA – Automotive

PDM R4 – MCU, Max-touch, Wireless

DFM R1 (Mfg Spec, ABI, Lot selection) – Q4/Q1 2015/2016

Doc Function

Rollout by PL

Foundation

Marketing Function


Key Learnings

• Perform an AS-IS study of process and systems. Define clearly existing pain points

• Avoid analysis/paralysis and keep the design simple; allow a scalable design

• Secure C-Level Executive sponsorship and accountability

• Define RACI matrix for all levels of stakeholders including time commitment

• Define corporate evangelists for the program

• Define a solid business, technical and solution design team to support the program

• Define reporting needs early

• Right-size change management

• For every object and attribute – define source and proper use cases and ownership


Key Expected Benefits on Full Rollout

• Reduced cycle time for product release to manufacturing - average of 1-3 weeks

• Multiple asynchronous databases and multiple approval loops

• Combining work packages with master data reduces cycle time

• Cycle time to send orders to subcons – reduce by 2 days

• Manual process to create build and starts instruction will be automated

• Employee Productivity – Approximately 20% improvement

• Product Engineering/Planning Feedback: Improved engineering /planning

productivity by 20%

• AS-IS: correct master data in different source systems, finding the right

information, navigating through multiple systems and processes vs

To-BE: convergence into one system and process

• Reduce operating cost – Potential ~$22M/Year savings

• Operations Feedback: Reduce Manufacturing Related Errors:

Potential savings of $22M/Year - Errors in Lot due to inconsistent master data


© 2015 Atmel Corporation.

Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.

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