asus m530w level 3 & level 4 service manualasusmobile.ru/files/service manual/repair/asus...

TSD ■ Lv3Lv4 Repair Manual

華華碩碩電電腦腦

ASUS M530w Level 3 & Level 4 Service Manual

ASUS Proprietary 1



Index

1. APPEARANCE ............................................................................... 6

1.1 BOX APPEARANCE.................................................................................. 6

1.2 MAIN COMPONENT NAME & LOCATION........................................ 7

2. BLOCK DIAGRAM........................................................................ 10

3. HARDWARE EQUIPMENT........................................................... 11

3.1 Digital multimeter ................................................................................... 11

3.2 Oscilloscope............................................................................................. 11

3.3 USB Download Cable ............................................................................. 11

3.4 Earpiece ................................................................................................... 11

3.5 PC ............................................................................................................ 11

4. DOWNLOAD PROCEDURE ............................................................ 12

4.1 Introduction ............................................................................................. 12

4.2 Operation procedure ................................................................................ 12

4.3 Repair method ......................................................................................... 13

5. LCM DISPLAY ................................................................................. 14

5.1 Introduction ............................................................................................. 14

5.2 Measure method ...................................................................................... 15

5.3 Repair method ......................................................................................... 15

6. USB/CHARGING.............................................................................. 16

6.1 Introduction ............................................................................................. 16

6.2 Repair method ......................................................................................... 16

7. KEYPAD........................................................................................... 17

7.1 Introduction ............................................................................................. 17

7.2 Measure method ...................................................................................... 20

7.3 Repair method ......................................................................................... 20

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8. KEYPAD LED .................................................................................. 22

8.1 Introduction ............................................................................................. 22

8.2 Measure method ...................................................................................... 22

8.3 Measure method ...................................................................................... 23

9. VIBRATOR....................................................................................... 24

9.1 Introduction ............................................................................................. 24

9.2 Measure method ...................................................................................... 24

9.3 Repair method ......................................................................................... 25

10. ACOUSTICS .................................................................................. 26

10.1 HANDSET................................................................................................ 26

10.1.1 Introduction ........................................................................................ 26

10.1.2 Measure method ................................................................................. 28

10.1.3 Repair method .................................................................................... 28

10.2 EARPIECE............................................................................................... 30

10.2.1 Introduction ........................................................................................ 30

10.2.2 Measure method ................................................................................. 30

10.2.3 Repair method .................................................................................... 31

11. CAMERA.................................................................................. 32

Introduction ................................................................................................... 32

11.1 2M camera............................................................................................. 32

11.1.1 Measure method .............................................................................. 32

11.1.2 Repair method ................................................................................. 33

11.2 VGA camera............................................................................................. 33

11.2.1 Measure method ................................................................................. 34

11.2.2 Repair method .................................................................................... 34

12. SIM INTERFACE............................................................................ 35

12.1 Introduction ............................................................................................. 35

ASUS Proprietary 3



12.2 Measure method ...................................................................................... 35

12.3 Repair method ......................................................................................... 35

13. MICRO-SD CARD .......................................................................... 36

13.1 Introduction ............................................................................................. 36

13.2 Measure method ...................................................................................... 36

13.3 Repair method ......................................................................................... 36

14. FLASH LIGHT LED........................................................................ 37

14.1 Introduction ............................................................................................. 37

14.2 Measure method ...................................................................................... 37

14.3 Repair method ......................................................................................... 38

15. RF REPAIR EQUIPMENT REQUIREMENTS ............................. 39

15.1 Software requirements............................................................................ 39

15.2 Hardware requirements.......................................................................... 39

15.3 Instrument requirements........................................................................ 39

15.4 Test Environments Setup........................................................................ 41

15.4.1 Instrument linking ........................................................................... 41

15.4.2 Fixture.............................................................................................. 42

16. RF BLOCK DIAGRAM................................................................... 43

16.1 GSM block diagram ............................................................................. 43

16.2 WCDMA block diagram...................................................................... 44

17. RF TX/RX PATH AND TEST POINTS ........................................... 45

ASUS Proprietary 4



17.1 GSM Tx/Rx path and test points ........................................................ 45

17.2 WCDMA Tx/Rx path and test points ................................................. 48

18. PROCEDURES OF REPAIR ....................................................... 50

18.1 RF repair’s procedure.......................................................................... 50

18.2 Calibration and pretest error codes for debug.................................. 52

19. GENERAL RF DEBUG .................................................................. 61

19.1 General GSM Tx debug ....................................................................... 61

19.2 General GSM Rx debug....................................................................... 70

19.3 General WCDMA Tx debug................................................................ 77

19.4 General WCDMA Rx debug ............................................................... 84

20. APPENDIX................................................................................... 88

20.1 GSM/WCDMA wireless test................................................................ 88

20.2 Bluetooth test ........................................................................................ 90

20.3 WiFi test................................................................................................. 92

ASUS Proprietary 5



1. APPEARANCE

1.1 BOX APPEARANCE

ASUS Proprietary 6



1.2 MAIN COMPONENT NAME & LOCATION

Main Board TOP LAYER

(3)(4)

(1) (2)

(5) (6) (7) (8)

(1) Application CPU ( Bulverde PXA270)-U1

ASUS Proprietary 7



(2)Communication CPU ( Hermon PXA900 )-U17 (3) PSRAM (MT45W1MW16PDGA-70WT)-U18 (4)Cedar Creak-U19 (5) (6)SDRAM-U2、U3 (7)NAND FLASH( M-Systems H3)-U4 (8)PMIC( DA9030 )-U20

ASUS Proprietary 8



Main Board BOTTOM LAYER

TP83 TP82 TP36

TP75TP50 TP74TP40TP7 TP90 TP92TP89TP46 TP35TP47 TP91 TP34

TP88 TP87 TP84 TP86 TP85

TP33

ASUS Proprietary 9



2. BLOCK DIAGRAM

USB SW.

Charger

BulverdePXA270

Hermon

PWR I2C

RGB IF

7x8QwertyKeypad

2.46" QVGA

(Samsung/Infineon)

64MB SDRAM

256MB NAND Flash

Dual Camera (2M+VGA)FPC type

Battery

Bulverde power

(CSR BC-04)

BT

(Discrete TPBGA)

Micro-SD(push type)

USB + Headset Jack

VCHG

HMNUSB

(Micron)PSRAM

Hermon Power

speaker

(M-Systems H3)

320X240LandscapeLCD

UART

USB

AudioMIC + Speaker + Receiver

Cedar Creek

Codec+AFE

PMIC (Arava)

RF Circuit

SIM

PCMBT_UART

MSL

SSPSSP

I2C CIF

HeadsetAmp.

BVDUSB

ASUS Proprietary 10



3. HARDWARE EQUIPMENT

3.1 Digital multimeter Check if the components are soldered well.

Check if the voltage levels are correct.

Check if the circuit is open or short.

3.2 Oscilloscope Check the signals waveforms and voltage levels.

3.3 USB Download Cable The software bin file can be downloaded into the handset by the M530w

USB download cable. The PC also can connect to the handset by it.

USB Download Cable

3.4 Earpiece The earpiece can be used for the audio loop test.

3.5 PC

Install the download tool first and execute the download tool.

ASUS Proprietary 11



4. DOWNLOAD PROCEDURE

4.1 Introduction When the handset updates the software, we need to download the

software and data into the NAND flash. The download path is built

up by the USB to Serial port download cable.

4.2 Operation procedure 1. Set up the power supply voltage and current at 4V and 1A. Connect to

the battery connector positive and negative of the handset.

2. Press the POWER ON Key and Down button. The handset would

power up and enter the download mode.

Power on key

Down button

ASUS Proprietary 12



3. The handset is connected the PC by the USB Download Cable.

4. Execute the ASUS 3G Download Tool.exe program, and press

“Browse” to select image.

5. Press Start button to burn image。

4.3 Repair method 1. Check if the USB Connector is soldered poorly or short.

2. Check if the fuse (F5) blew.

3. Check if the U2、U3 and U4（Flash & SDRAM）chips are placed

inversely, soldered poorly or short.

4. Check if the voltages VCC_SDRAM＝1.8V and VCC_NFIO

=1.8V are fed the SDRAM and NAND flash. If the VCC_SDRAM

and VCC_NFIO are abnormal, try to change a new DA9030

Power IC.

ASUS Proprietary 13



ASUS Proprietary 14

5. LCM DISPLAY

5.1 Introduction The M530w LCM pixel resolution is 320 * 240. The backlight is white

LED, and the driver IC is MAX8595ZETA (U12).

Backlight Driver

LCM connector circuit (2)

BL_VBAT_IN BL_LX21L201

10UHVBAT[5,10,11,14..16]

Backlight DriverBL_DIODE_CA

BL_CA

BL_COMP

BL_AN

1 2D206

ZHCS400

12R223 0Ohm

BL_AN12R224 0Ohm

1

2

C2103300P/50V

OUT1

IN2

CTRL3

CS4 COMP 5GND1 6PGND7LX8

GND2

9U12

MAX8595ZETA

1

2R2151MOhm

1

2C208

10UF/6.3V 1

2

C211

0.47U/25V

1

2

C2120.1U/10V

1

2

R21416.5Ohm/1%

LCD_BL_PWM[2]

12R226 $0Ohm

GND

12R227$0Ohm

LCD_nRST/DE[2]

12R2290Ohm

12

R2280Ohm

LCD_nRESETnRESET_OUT[2,5,10]

LCD_nRST/DE[2]

LCD_DE

1OE1

1A2

2Y3

GND4

VCC8

2OE7

1Y6

2A5

U27

SN74AUC2G126DCUR

VDD_LCD_2V8

LCD_SSPTX_BUFLCD_SSPCLK_BUF

SA_LCDD4][2

SA_LCDD15 [2]

1

2

R2250Ohm

BL_CABL_AN

GND

GND

LCD_GND_1

2

1

L202600Ohm/100Mhz

LCD_SSPCLK_BUF

21L203

600Ohm/100Mhz

LCD_GND_2

1

234

5

6P

N

Q13

FDG6331L_NLLCD_B5

LCD_R2LCD_R0

LCD_G1LCD_G4LCD_G2

LCD_G3LCD_G5

LCD_G0

1

2

R10

235KOhm

BVD_G0

BVD_B4

BVD_B3BVD_B1

LCD_R3 LCD_R4LCD_R1

LCD_R5

BVD_G5

BVD_B2BVD_B4

BVD_R4

BVD_R3BVD_R1

BVD_G4BVD_G2

1 2R234220KOhm

BVD_B0

BVD_R2

BVD_G1BVD_G3

BVD_R0

BVD_R4

LCD_B1LCD_B0

LCD_B4LCD_B3LCD_B2

VLCD_2V8

1 2

C2201000PF/50V

SS_RC_3

GND

SS_N_3

GND

GND

LCD_PWR_EN[2]

GND

GND

1

2

C21$27PF

7/50V

LCD_SSPTX_BUF

1

2

C2092.2UF/6.3V

AUD_WLAN_LCD_SSPCLK[2,5,9]

AUD_WLAN_LCD_SSPTX [2,5,9]

VDD_LCD_2V8

VLDO18_2V8VDD_LCD_2V8

GND

SA_LCDD13[2]SA_LCDD15[2]

SA_LCDD0[2] SA_LCDD1 [2]

SA_LCDD6[2]

SA_LCDD14 [2]

SA_LCDD10[2]

SA_LCDD2[2]

SA_LCDD8[2]

SA_LCDD4 [2]

SA_LCDD9 [2]

SA_LCDD3 [2]

SA_LCDD12 [2]

LCD_PWR_EN[2]

SA_LCDD5 [2]SA_LCDD7 [2]

SA_LCDD11[2]

LCD_SPI_nCS [2]

SA_LCD_FCLK_IN[2] SA_LCD_LCLK_IN [2]SA_LCD_PCLK_IN[2]

VLCD_2V8

11

33

55

77

99

1111

1313

1515

1717

1919

2121

2323

2525

2727

2929

3131

3333

3535

3737

3939

22

44

66

88

1010

1212

14 14

1616

1818

2020

2222

2424

2626

28 28

3030

3232

34 34

3636

3838

SIDE1

40

SIDE2

41

CON3

FPC_CON_39P



5.2 Measure method 1. Set up the power supply voltage and current at 4V and 1A.

Connect to the battery connector positive and negative of the

handset.

2. Press the POWER ON Key to power on the handset.

3. After entering the MMI Test Mode, select the “Main LCD”

test item. press the Down or up Button to display Red、Green、

Blue、White、gray and Black, and watch the color.

5.3 Repair method 1. When it does Black Screen, check if the LCM connector

soldered poorly or short.

2. When it does White or Black Screen, check if the LCM FPC

oblique or LCM connector no mounted properly.

3. When it does White Screen please check if the U27 is soldered

poorly or short.

4. When the backlight is no function, please check if the

MAX8595ZETA (U12)、C208、C210、C211、C212、L201、

D206、R214、R215、R223 and R224 are placed inversely,

soldered poorly or short.

5. If the above cases are not found, try to change a new LCM.

ASUS Proprietary 15



6. USB/CHARGING

6.1 Introduction The M530w power is supplied by the Lithium Ion battery. Therefore,

it has the charging function. The M530w can be charged from the

USB.

CON_USBC_D-

CON_USBC_D+

CON_VCHG_VBUS

1 2F5

1.5A/32V

CON_VCHG_VBUSOVP_VCHG_VBUS

USBConnector

1TP35tpc60t_np_72

1

2

C2020.1UF/16V

1TP33tpc60t_np_72

1

2R207

750KOhm

1

2

C20433PF/50V

1

2

C206

$33PF/50V

1

2

D203

$V9MLA0402LWH

1

2

C207

$33PF/50V

1

2

D202

$V9MLA0402LWH

1

2

C2031UF/25V

1

2

C205

33PF/50V

11

22

33

44

55

NP_NC16NP_NC27SIDE18SIDE29SIDE310SIDE411

USB1

USB_1X5P

1

2

D204

$V9MLA0402LWH 1

2

D205

$V9MLA0402LWH

12

R205470KOhm

1TP34tpc60t_np_72

GNDGNDGND GND GND GND

GNDCON_USBC_D-

OTG_ID[2]CON_USBC_D+

OVP_VCHG_VBUS[10]

CARKIT_DET[2]

GND

GND

6.2 Repair method 1. USB/Charger cannot recognized when they were plugged into the

USB CON，Check the contact between USB CON pins and the

pads on the main PCB.

2. USB/Charger cannot recognized when they were plugged into the

USB CON，Check if the fuse(F5) blew.

ASUS Proprietary 16



7. KEYPAD

7.1 Introduction The M530W has 54 keys，some of them are function key.

Keypad Matrix Circuit

1 2

KEY7

U

1 2

KEY8

I

1 2

KEY9

O

1 2

KEY10

P

1 2

KEY11

A

1 2

KEY12

S

1 2

KEY13

D

1 2

KEY14

F

1 2

KEY15

G

1 2

KEY16

H

1 2

KEY17

J

1 2

KEY18

K

1 2

KEY19

L

1 2

KEY20

ENTER

1 2

KEY21

Z

KP_MKOUT0

KP_MKOUT2

KP_MKOUT1

KP_MKOUT5

KP_MKOUT4

KP_MKOUT3

1 2

KEY22

X

1 2

KEY23

C

1 2

KEY24

V

1 2

KEY25

B

1 2

KEY26

N

1 2

KEY27

M

1 2

KEY28

,

1 2

KEY29

Dot

1 2

KEY30

Message

1 2

KEY6

Y

1 2

KEY5

T

1 2

KEY1

Q

1 2

KEY32

Fn

1 2

KEY31

L-shift

1 2

KEY33

Space

KP_MKIN7

1 2

KEY35

R-shift_CAP

1 2

KEY34

?

1 2

KEY36

Send

1 2

KEY37

Soft-L

1 2

KEY38

Home

1 2

KEY39

Soft-R

1 2

KEY40

Back

1 2

KEY41

End

1 2

KEY42

OK

1 2

KEY43

Up

1 2

KEY44

Down

KP_MKIN1KP_MKIN6 KP_MKIN4 KP_MKIN3 KP_MKIN2KP_MKIN5

1 2

KEY45

Left

1 2

KEY46

Right

KP_MKIN0

Side keyCamera

Side keyVol. up

Side keyVol.down

Jog Dialpush

Jog Dialdown

Jog Dialup

1 2

KEY47

ZERO

1 2

KEY48

Brightness

KP_MKOUT6

1 2

KEY2

W

1 2

KEY3

E

1

KEY4

R

2

ASUS Proprietary 17



1

2

C6560.01UF/50V

1

2

C657$0.01UF/50V

1

2

C660$0.01UF/50V

1

2

C658$0.01UF/50V

12R664

0Ohm

12R666

0Ohm

12R665

0Ohm

12R667

0Ohm

GND

GND

GND

GND

Volume Up

Volume Down

Power_ON/OFF

PWR_nON_OFF_1 KP_MKIN1_SK

1

2

3

45

6

7

SW2

TACT_SWITCH_4P61

2

3

45

SW1

TACT_SWITCH_4P

7

1

2

3

45

6

7

SW3

TACT_SWITCH_4P

GND

GND

GND

KP_MKOUT3[2]

KP_MKOUT2[2]

PWR_nON_OFF[10] KP_MKIN1[2]

Camera

GND

KP_MKOUT5[2]KP_MKOUT5_SK12

R668

0Ohm

1

2

3

45

6

7

SW5

TACT_SWITCH_4P

KP_MKOUT3_SK

KP_MKOUT2_SK

GND

1

2

C659$0.01UF/50V

Function Key Circuit

ASUS Proprietary 18



12R658 0Ohm

KP_MKIN5_1

KP_MKIN3_1

KP_MKIN0_1

KP_MKIN6_1

KP_MKIN4_1

KP_MKIN1_1KP_MKIN2_1

KP_MKIN7_1

1

2

RN9A

100KOhm

7

8

RN9D

100KOhm

12R654 0Ohm

12R652 0Ohm

5

6

RN9C

100KOhm

12R651 0Ohm

12R657 0Ohm

3

4

RN9B

100KOhm

1

2

C651

1UF/6.3V/10%/0402

11

22

33

55

77

99

1111

1313

1515

1717

1919

2121

2323

44

66

88

1010

1212

1414

1616

1818

2020

2222

2424

CON9

BtoB_CON_24P

12R655 0Ohm

12R653 0Ohm

12R656 0Ohm

GND

GND

VLDO4_3V2

GND

KP_MKOUT0[2]

KP_MKOUT4[2]KP_MKOUT5[2]

KP_MKOUT3[2]

KP_MKOUT1[2]KP_MKOUT2[2]

KP_MKOUT6[2]

LED_DRV2[10]LED_DRV1[10]

KP_MKIN7[3]

KP_MKIN4[2]

KP_MKIN1[2]

KP_MKIN5[2]

KP_MKIN2[2]

KP_MKIN6[2]

KP_MKIN0[2]

KP_MKIN3[2]

KP_MKIN0_1




5

6

RN10C

100KOhm

3

4

RN10B

100KOhm

7

8

RN10D

100KOhm

1

2

RN10A

100KOhm

KP_MKIN7_1

Keypad Connector Circuit

KP_MKOUT3

KP_MKOUT2

KP_MKOUT6

KP_MKIN0KP_MKIN0_JOG

KP_MKOUT2_JOG

KP_MKOUT3JOG

1

2

C652

$0.01UF/50V

1

2

C653

$0.01UF/50V

1

2

C654

$0.01UF/50V

1

2

C655

$0.01UF/50V

KP_MKOUT6_JOG

1 2R661 0Ohm

1 2R660 0Ohm

1 2R659 0Ohm

1 2R663 0Ohm

11

22C

CT

T

GND17

GND28

GND39

GND410

NP_NC111

NP_NC212

55

66

P_GND113

P_GND214

PUSHSW4

SW_6P_8HOLD

GNDGNDGND

JOG DIAL Circuit

ASUS Proprietary 19





handset.

2. Press the POWER ON Key to power on the handset

3. After entering the MMI Test Mode, select the Keypad/Button test

item.

4. Press every key to verify if each key is OK.

5. Press Soft1 key will leave “Keypad/Button test”, therefore Soft1

key need press last.

7.3 Repair method 1. When the Keypad are no function, check if

a. Keypad connector (CON9) are soldered poorly, open or

short.

b. Serial Resistors ( R651~R658 ) are soldered poorly, open or

ASUS Proprietary 20



short.

c. Keypad connector mounted properly

2. When the function key and JOG DIAL are no function, check if

the sw1、sw2、sw3、sw4、sw5 and Keypad connector(CON9) are

soldered poorly, damage or short.

3. If the above cases are not found, try to change the Keypad or

Function Key (SW1~SW5).

ASUS Proprietary 21



8. KEYPAD LED

8.1 Introduction When any key is pressed or the handset is slid, the Keypad LED would

be turned on. If the handset is idle, the LED would be turned off for

saving power.



handset.


3. After entering the MMI Test Mode, select the “Led test” item.

ASUS Proprietary 22



1 2R13

150Ohm

AN_LED131 2+

LED13

WHITE

1 2R15

150Ohm

AN_LED151 2+

LED15

WHITE

1 2R17

150Ohm

AN_LED171 2+

LED17

WHITE

1 2R19

150Ohm

AN_LED191 2+

LED19

WHITE

1 2R21

150Ohm

AN_LED211 2+

LED21

WHITE

1 2R23

150Ohm

1 2+

LED23

WHITEAN_LED23

1 2R18

150Ohm

1 2R8

150Ohm

AN_LED16

1 2+

LED12

WHITE

1 2+

LED14

WHITE

AN_LED8

1 2+

LED24

WHITE

1 2+

LED20

WHITE

1 2R2

150Ohm

1 2R24

150Ohm

1 2+

LED16

WHITE

AN_LED14

1 2+

LED22

WHITE

AN_LED20

1 2+

LED18

WHITEAN_LED18

AN_LED22

1 2R20

150Ohm

1 2+

LED2

WHITE

1 2R12

150Ohm

1 2R14

150Ohm

AN_LED12

1 2R16

150Ohm

AN_LED24

AN_LED2

1 2+

LED8

WHITE

1 2R22

150Ohm

1 2R1

150Ohm

VLDO4_3V2

LED_DRV2

AN_LED1

LED_DRV1

1 2+

LED1

WHITE

1 2R25

0Ohm

1 2+

LED4

WHITEAN_LED41 2R4

150Ohm

1 2+

LED3

WHITEAN_LED31 2R3

150Ohm

1 2R7

150Ohm

AN_LED7 1 2+

LED7

WHITE

1 2R11

150Ohm

AN_LED111 2+

LED11

WHITE

KEYPAD LED circuit

8.3 Measure method 1. When the Keypad all LEDs can not turn on, check if the

KEYPAD connector (CON1 and CON2)、R25 are soldered

poorly, damage, open or short.

2. When the Keypad not all LEDs can not turn on, change the

new Keypad.

3. If the above cases are not found, change the new Keypad.

ASUS Proprietary 23



9. VIBRATOR

9.1 Introduction The Handset controls the vibrator by the PMIC- DA9030(U20).



handset.


3. After entering the MMI Test Mode, select the “set

Vibrator“ test item. Press ”on”，the vibrator should vibrate.

umt3_rohm ==>sot_416

VIB_OUT

VIB_MOS_D

VIB_D_AN

1

VBAT

2R220

5.1Ohm

VIB_IN

1

2

D2071SS400

12 R2160Ohm

2

21

2

C2130.1UF/10V

GS

D 3

2

1

Q3SI1012R

1

1

U13

$VIBRATOR_2P

12R2180Ohm

VIBRATOR_EN [10]

1

R222100KOhm

2GND GND

Vibrator circuit

ASUS Proprietary 24



9.3 Repair method 1. Check if the R216、R218、R220、R222、D207、Q3、C213are

placed inversely, soldered poorly, damage, open or short.

2. If the voltage of each pin is normal, change a new vibrator.

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10. ACOUSTICS

10.1 HANDSET

10.1.1 Introduction The purpose of this test is mainly verifying the handset microphone、

speaker and receiver function.

M530w has three kinds of the audio output and input

Type Comment

Handset Utilize the handset microphone and receiver.

Hand free Utilize the handset microphone and speaker.

Headset Utilize the handset earpiece.

Microphone circuit

12R326

0Ohm

Microphone

MICOB_IP

1

2

R317100KOhm/1%

1

2C321

100PF/50V

1

2

C319100PF/50V

1

2R319

0Ohm

1

2

C32210UF/10V

1

2C324

1UF/10V

OUTPUT1

GAIN CONTROL2

GND3POWER4

U16

SPM0208HE5-SB

1 2

R31830KOhm/1%

VSS_MIC

VLDO13_MICBIAS

VSS_CCA

VSS_MIC

VSS_MIC

VSS_MIC

MIC2_IN[9]

MICAMP_O[9]

MIC2_IP[9]

12C320

1UF/6.3V

12C323

1UF/6.3V

MICOB_VD

MICOB_IN MICOB_0

MICOB_GC2

1

2

C325100PF/50V

1

2

R321100KOhm/1%

1 2R320

30KOhm/1%

1

2C334

100PF/50V

MICOB_GC1

VSS_MIC

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1

2

D308331K

1

2

D307331K

1

2C333

$33PF/50V

1

2C328$100PF/50V

11

22

CON5

$RECEIVER_2P1

2C332

$33PF/50V

GND

GND GND

GND

RE_P[9]

RE_N[9]

1

2C338

$33PF/50V

2 1L307 1400Ohm/1Ghz

RE_N_OUT

RE_P_OUT

2 1L306 1400Ohm/1Ghz

Receiver

1

2C339

$33PF/50VGNDGND

Receiver circuit

1

2

C331

27PF/50V

1

2

C326

27PF/50V

1

2

C327

27PF/50V

GND

GND

SP_OUT2 [10]

SP_OUT1 [10]

1 2 3

456

GND

D309PACDN045YB6

11

22

CON4

POGO_2PIN

GND

21L308

330Ohm/100Mhz

21L309

330Ohm/100Mhz

Speaker_IN_P

Speaker_IN_N

Speaker_CONNECTOR

Speaker circuit

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10.1.2 Measure method 1. Set up the power supply voltage and current at 4V and 1A.


handset.


3. After entering the MMI Test Mode, select the “Audio” test

item. Press ”play”, The melody can be heard from the speaker.

4. Enter the MMI Test Mode, and select the “Audio” test item.

Press ”recode”, blow the handset microphone hole slightly.

The blowing voice can be heard form the receiver.

5. Enter the MMI Test Mode; select the “Receiver” test item.

The single tone voice can be heard from the receiver.

10.1.3 Repair method 1. When the microphone can’t work

a. check if the microphone circuit are soldered poorly,

damage or short.

b. Check rubber set properly.

c. If the above cases are not found, change the new

microphone.

2. When the speaker can’t work

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a. check if the speaker circuit are soldered poorly, damage or

short.

b. Check the contact between the speaker pins and the

stand-off on the main PCB (Is the pin/stand-off oblique?)

c. If the above cases are not found, change the new speaker.

3. When the receiver can’t work

a. check if the receiver circuit are soldered poorly, damage or

short.

b. Check the contact between the receiver pins and the pads on

the main PCB (Is the pin oblique/sunk?)

c. If the above cases are not found, change the new receiver.

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10.2 EARPIECE

10.2.1 Introduction This test item mainly verifies the function of the earpiece in the

handset.



handset.


3. After entering the MMI Test Mode, plug the earpiece into the

handset. Select the “Audio” test item. Press ”play”, The

melody can be heard from the earpiece.

4. Press “recode”. Blow the microphone hole of the earpiece, the

sound can be heard from the earpiece.

AJACK_EAR_R_SW AJACK_EAR_R

Earpiece circuit

1

2

R31630KOhm

1

2C317

$100PF/50V

1

2

R3150Ohm

1

2C318

$100PF/50V

1

2

R314200KOhm/1%

78

135

26

4

NP_NC1NP_NC2

J1

MINI_JACK_6P

1

2

D302

$331K

1

2

D305

$331K

2 1L3041400Ohm/1Ghz

2 1L3051400Ohm/1Ghz

1

2C337

$33PF/50V

1

2C336

$33PF/50VGND

VSS_AUD

AJACK_EAR_L_SW

VCC_MEM_BVD

AJACK_EAR_L

GND

GND GND GND

HS_DETECT[2]

GND GND

AJACK_MIC_IN[6]

1 2R328 0Ohm

AJACK_GND

1

R32730KOhm

2

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10.2.3 Repair method

1. Check if the J1、L304、L305、R314、R315 and U14 are placed

inversely, soldered poorly, damage or short.

2. If the above cases are not found, change the new Phone Jack.

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11. CAMERA

Introduction The M530w has 2M camera and VGA camera.

11.1 2M camera

GND

1 2

R618100KOhm

VDD_CAM_2V8

12R602 0Ohm

1 2

R608100KOhm

I2C_SCL 1 2R606 0Ohm

VAA_CAM_2V8

GND

VDD_2M_1V8VDD_CAM_2V8

GND

VDD_CAM_2V8

2M_nRESET[2]

2M_MCLK_STBY [2]

1 13 355779 911 111313151517 1719 192121232325 25

22 44 66 88 1010 12

12 1414 1616 1818 2020 2222 2424

SIDE1

26

SIDE2

27CON8

FPC_CON_25P

Check this valueduring systemreset.

VSS_CCA

1

2

C613$0.1UF/10V

GND

CAM_LVCAM_PCLK

2M_SCL

2M_MCLK

I2C_SDA

CAM_FV

2M_SDA

CIF_DD7 [2]

CIF_DD5 [2]CIF_DD6 [2]

CIF_DD4 [2]


CIF_DD1 [2]

GND

CIF_DD0 [2]VACT_2V8

GND

2M CAMERA circuit (1)

VDD_CAM_2V8

2

VGA_MCLK_EN#

2M_MCLK_EN# 12 R610330Ohm

1

2C608

0.01UF/10V

1

2

3

4

8

7

6

5

NC1

COM1

IN2

GND

V+

IN1

COM2

NC2

U23

TS5A23167DCUR

VGA_MCLK

CIF_MCLK[2]1

C6041UF/6.3V

1

2

R614100KOhm

12R611

100KOhm GNDGND

GNDGND

GND GND

CIF_MCLK [2]

2M_MCLK_STBY [2]

VGA_MCLK_STBY[2]

2M_MCLK

1

2C606

0.33UF/10V

12R612 1KOhm

2M CAMERA circuit (2)


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handset.


3. Press camera function key to enter the 2M camera preview

mode.


1. Check if the U23 and 2M camera connector (CON8) are

placed inversely, soldered poorly, damage or short.

2. Measure if the voltage VDD_2M_1V8=1.8V,

VAA_CAM_2V8=2.8V, VDD_CAM_2V8=2.8V and

VACT_2V8=2.8V are normal.

3. Check if the 2M camera FPC and the keypad FPC are

impaired.

4. If the above cases are not found, change the 2M camera.

11.2 VGA camera

GND

VGA CAMERA circuit (1)

VGA_SCL

1 2

R619100KOhm

GND1

22

GND2

23

1 13355779 911 111313151517 1719 192121

22 44 66 88 1010 1212 14

14 1616 1818 2020

CON7FPC_CON_21P

12R603 0Ohm 12R605 0Ohm

1 2R607100KOhm

CAM_FV

VDD_CAM_2V8VAA_CAM_2V8

VDD_CAM_2V8

I2C_SCL[2]I2C_SDA[2]

CIF_DD1[2]CIF_DD0 [2]CIF_DD2 [2]


CIF_DD7 [2]CIF_DD6 [2]CIF_DD5 [2]

VGA_nRESET[2]VGA_MCLK_STBY [2]

CAM_LVCAM_PCLK

Check this valueduring systemreset.

VGA_SDA

1

2

C614$0.1UF/10V

GND VSS_CCA GND

VDD_CAM_2V8VGA_MCLK

GND

1

2

C619

27P/50V

1 C620

27P/50V2

GND GND

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VDD_CAM_2V8

2

VGA_MCLK_EN#

2M_MCLK_EN# 12 R610330Ohm

1

2C608

0.01UF/10V

1

2

3

4

8

7

6

5

NC1

COM1

IN2

GND

V+

IN1

COM2

NC2

U23

TS5A23167DCUR

VGA_MCLK

CIF_MCLK[2]1

C6041UF/6.3V

1

2

R614100KOhm

12R611

100KOhm GNDGND

GNDGND

GND GND

CIF_MCLK [2]

2M_MCLK_STBY [2]

VGA_MCLK_STBY[2]

2M_MCLK

1

2C606

0.33UF/10V

12R612 1KOhm

VGA CAMERA circuit (2)



handset.


3. After entering the MMI Test Mode, select the ”VGA

Camera” test item to enter the preview mode.


1. Check if the U23 and VGA camera connector (CON7) are

placed inversely, soldered poorly, damage or short.

2. Measure if the voltage VAA_CAM_2V8=2.8V,

VDD_CAM_2V8=2.8V are normal.

3. Check if the VGA camera FPC and the keypad FPC are

impaired.

4. If the above cases are not found, change the VGA camera.

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12. SIM INTERFACE

12.1 Introduction

The M530w supports the 2G and 3G.

12.2 Measure method

1. Plug the SIM card into the handset.

2. Set up the power supply voltage and current at 4V and 1A.


handset.

3. Press the POWER ON Key to power on the handset.After entering

the MMI Test Mode, MMI would auto run test item ”SIM test”.

SIM interface

1

2

C107$2.2PF/50V

SIM_CLK1 2R105

0Ohm

1

2R1010Ohm

C1C1 C2C2 C3C3

C5C5C6C6C7C7

GND1

1

GND2

2

GND3

3

GND4

4CON103

SIM_CON_6P

SIM_VPP

GND

SIM_CLK_IN

SIM_CLK_IN

SIM_RST

HMN_DVDDF

R1067.5KOHM2

1

2

C106

22PF

SIM_DIO

1

2

C111

22PF

1

2

C108

0.1UF

HMN_DVDDFGND

1

1

2

C110

22PF

21

2

C109

22PFR10710KOhm

1

GND

12.3 Repair method

1. Check if the CON103 are placed soldered poorly, damage or

short.

2. Check the Board to Board connector (mounted properly?

short?).

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13. Micro-SD CARD

13.1 Introduction

The M530w supports the micro-SD card function.

GND

1

2 C101

0.1UF

MMC_DAT0MMC_DAT1

MMC_CLK

MMC_CMD

GND

MMC_DAT2

VCC_SD

12345678

9_19_2

10_110_2

CON102

SD_CARD_10P

uSD_EXIST_CON

MMC_DAT3

1

2

C102

2.2UF/6.3V

GND

12 R14810KOhm

uSD_EXIST

1

2

C145

2.2UF/10V

GND

MICRO-SD CARD circuit

13.2 Measure method

1. Plug the micro SD card into the handset.



handset.


4. After entering the MMI Test Mode, MMI would auto run test

item ”SD/MMC”.

13.3 Repair method

3. Check if the CON102 and CON1 are placed soldered poorly,

damage or short.

4. Check the VCC_SD = 2.8V.

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14. FLASH LIGHT LED

14.1 Introduction

The M530w has the flash light LED function. It compensates the light

when taking a picture in the low-light environment.

2

13

4

LED101

WHITE

1

2

C11410UF/16V

1 2R109 0Ohm

nCAMFLASH_SHDN

nCAMFLASH_SHDN

1

2

R1106.04KOhm/1%

21L102

10UH/0.77A/20%

GND1

1

IN2

MOV3

STB4

POK5

EN16

EN27

OUT8

LED9

LX10

GND2

11

U107

MAX1583ZETB1

2

R108

100KOhm

Camera Flash LED Driver

1 2C113

0.1UF

Flash LED

1

2

C11210UF

1

2

R1113.24KOhm/1%

GND

VBAT

GNDGND

CAMFLASH_V+

CAMFLASH_V-

1 2D101

ZHCS400

CAMF_L0

CAMFLASH_STRB_1

CAMFLASH_V+

CAMFLASH_V-

ImovIstb

TP109TPC60B_NP_681

Flash light LED circuit

14.2 Measure method



handset.


3. After entering the MMI Test Mode, select the “Led Test” test

item, and the flash light LED would turn on.

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14.3 Repair method

1. Check if the U107、LED101、C113、C114 and R109 are placed

inversely, soldered poorly, damage or short.

2. Check LED101 Polarity is properly, as indicated in figure.

2 1

4 3

3. Check Board to Board connector (mounted properly? short?)

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15. RF Repair Equipment Requirements

15.1 Software requirements

XML

Hermon database

RFSender

IFL V1.2.1

GSM/WCDMA performance test tool

GSM/WCDMA debug tool

15.2 Hardware requirements

PCB fixture

RF adapter

RF cable

USB cable

15.3 Instrument requirements

PC

Wireless communication test set (Agilent 8960, R&S CMU9020, Anritsu 8820)

Spectrum analyzer (Span > 3.0 GHz)

RF signal generator (up to 3.0 GHz)

High impedance RF probe with DC block

Digital multimeter

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Power supply

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15.4 Test Environments Setup

15.4.1 Instrument linking

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15.4.2 Fixture

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16. RF Block Diagram

16.1 GSM block diagram

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16.2 WCDMA block diagram

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17. RF Tx/Rx Path and Test Points

How RF signal is transmitted and received between components on Halley PCB is explained in this section. It is important to realize RF transmission path (Tx) and receiving path (Rx) before starting out to repair NG PCB, because engineers need to choose proper test points which assist us to distinguish where the problem is. The following paragraphs describe both Tx and Rx path in GSM and WCDMA bands. The related test points are listed in the following figures.

17.1 GSM Tx/Rx path and test points

GSM Tx path

Transceiver, RF6001 (U900), receives IQ signals coming from baseband, and output signals of RF6001 Pin22 and Pin23 are transmitted into the buffer of receiver, RF2722. Then RF2722 Pin12 and Pin13 emit the low band signal (GSM900) and high band signals (DCS1800 or PCS1900) separately.

In the low band, output signal from RF2722 Pin12 passes through C917, attenuator (U903) and RF3166 (U904) Pin7, power amplifier, sequentially. Transmission and receiving switch (U902), also named T/R switch, gets the amplified signal from RF3166 Pin23 via matching circuits. RF signal coming from T/R switch Pin15 is transmitted to connector (Con6) and radiated via the GSM antenna of Halley.

In the high band, output signal from RF2722 Pin13 passes through C243, attenuator (U905) and RF3166 (U904) Pin1, power amplifier, sequentially. Transmission and receiving switch (U902), also named T/R switch, gets the amplified signal from RF3166 Pin30 via matching circuits. RF signal coming from T/R switch Pin15 is transmitted to connector (Con6) and radiated via the GSM antenna of Halley.

GSM Rx path

RF signals, receiving from base stations via the GSM antenna, pass

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through connector (Con6) and T/R switch Pin15 (U902) sequentially. There are three output pins of T/R switch, including Pin2, Pin4, and Pin5. The output path which RF signal is transmitted depends on band selection of T/R switch.

In GSM900 band, the output signal which is transmitted from T/R switch Pin2 passes through SAW filter (BPF1) and matching circuits sequentially. Upon RF2722 (U901) receiving the signal, it is amplified in the Low Noise Amplifier (LNA) of the receiver, down converted the signal’s frequency and transformed into IQ signals. The IQ signals from RF2722 Pin20, Pin21, Pin22, and Pin23 travel to the transceiver RF6001 (U900). The transceiver RF6001 transfers the signals to the baseband signals.

In DCS1800 band, the output signal which is transmitted from T/R switch Pin5 passes through SAW filter (BPF4) and matching circuits sequentially. Upon RF2722 (U901) receiving the signal, it is amplified in the Low Noise Amplifier (LNA) of the receiver, down converted the signal’s frequency and transformed into IQ signals. The IQ signals from RF2722 Pin20, Pin21, Pin22, and Pin23 travel to the transceiver RF6001 (U900). The transceiver RF6001 transfers the signals to the baseband signals.

In PCS1900 band, the output signal which is transmitted from T/R switch Pin4 passes through SAW filter (BPF1) and matching circuits sequentially. Upon RF2722 (U901) receiving the signal, it is amplified in the Low Noise Amplifier (LNA) of the receiver, down converted the signal’s frequency and transformed into IQ signals. The IQ signals from RF2722 Pin20, Pin21, Pin22, and Pin23 travel to the transceiver RF6001 (U900). The transceiver RF6001 transfers the signals to the baseband signals.

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GSM Tx/Rx test points

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17.2 WCDMA Tx/Rx path and test points

WCDMA Tx path

The output signal from transmitter MAX2390 Pin2 travels to SAW filter (BPF5), and RMPA2259 Pin2 sequentially. The boosted power coming from RMPA2259 Pin8 passes through isolator (U954), duplexer Pin1 (U956), and connector (Con7). At last, the RF signal is radiated via WCDMA antenna of Halley.

WCDMA Rx path

RF signal in WCDMA, receiving from base stations via the WCDMA antenna, passes through connector (Con7) and duplexer Pin3 sequentially. MAX2391 Pin1 (U958), built-in LNA, receives the signal from duplexer. Then the signal is transmitted to SAW filter (BPF6) and returns to receiver MAX2391 again. After down converting the signal’s frequency and transforming into IQ signals, the IQ signals from MAX2391 Pin20, Pin21, Pin22, and Pin23 travel to baseband.

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WCDMA Tx/Rx test points

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18. Procedures of Repair

18.1 RF repair’s procedure

The following flow chart shows repair’s procedures that comprise of calibration, pretest, and general repair processes. In order to guarantee existence of RF parameters in FDI, calibration files should be done first. After conductive pretest, engineers can check whether Halley operates properly or not.

Error codes may occur when calibrating or pretest Haley due to poor RF performance. From categorized error codes in the following section, engineers can infer the cause of problem by corresponding error codes, and find out the defect component by using debug tool. There are four kinds of general RF debug, including GSM Tx debug, GSM Rx debug, WCDMA Tx debug and WCDMA Rx debug. Each debug method is described specifically in following sections.

ASUS Proprietary 50



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18.2 Calibration and pretest error codes for debug

GSM calibration

Error code

Description Recommendatory Steps

3110 GSM AFC calibration 1. Check voltage of OSC1 Pin1 & 4

2. Check frequency of OCS1 Pin3

4106

4108

4109

4110

4111

GSM900 APC calibration

1. Refer to “General GSM Tx debug”

2. Check voltage of U902 Pin11



5. Check voltage of U900 Pin24 & 47

4206

4208

4209

4210

4211

DCS1800 APC calibration






4306

4308

4309

4310

4311

PCS1900 APC calibration






5104 GSM900 AGC 1. Refer to “General GSM Rx

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5109

5110

5111

5112

5113

5114

calibration debug”




5204

5209

5210

5211

5212

5213

5214

DCS1800 AGC calibration

1. Refer to “General GSM Rx debug”




5304

5309

5310

5311

5312

5313

5314

PCS1900 AGC calibration





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WCDMA calibration

Error code


6014 WCDMA AFC calibration

1. Check voltage of OSC1 Pin1 & 4


3. Rework digital baseband

7006

7010 WCDMA APC calibration

1. Refer to “General WCDMA Tx debug”

2. Check voltage of U953 Pin1, 5 & 10

3. Check voltage of L21

8005

8009

8013

WCDMA AGC calibration

1. Refer to “General WCDMA Rx debug”

2. Check voltage of U958 all VCC Pins

10040

10050 WCDMA PD calibration


2. Check voltage of U955 Pin B2

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GSM pretest


GSM900 output power

1. Check all RLC on Tx path






7. Rework U902

8. Rework U904

DCS1800 output power







7. Rework U902

8. Rework U904

PCS1900 output power







7. Rework U902

8. Rework U904

GSM900 sensitivity

1. Check all RLC on Rx path




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6. Rework U902

7. Rework BPF1

8. Rework U901

DCS1800 sensitivity






6. Rework U902

7. Rework BPF4

8. Rework U901

PCS1900 sensitivity






6. Rework U902

7. Rework BPF3

8. Rework U901


GSM900 ORFS

1. Check RLC of low band Tx path






7. Rework U902

8. Rework U904

DCS1800 ORFS 1. Check RLC of high band Tx path

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7. Rework U902

8. Rework U904

PCS1900 ORFS

1. Check RLC of high band Tx path






7. Rework U902

8. Rework U904

GSM900 RSSI






6. Rework U902

7. Rework BPF1

8. Rework U901

DCS1800 RSSI






6. Rework U902

7. Rework BPF4

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8. Rework U901

PCS1900 RSSI






6. Rework U902

7. Rework BPF3

8. Rework U901


GSM900 peak phase error 1. Check voltage of OSC1 Pin1 & 4


DCS1800 peak phase error 1. Check voltage of OSC1 Pin1 & 4


PCS1900 peak phase error 1. Check voltage of OSC1 Pin1 & 4


GSM900 PVT 1. Format FDI and re-calibration

2. Check RLC of low band Tx path






8. Rework U902

9. Rework U904

DCS1800 PVT 1. Format FDI and re-calibration



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8. Rework U902

9. Rework U904

PCS1900 PVT 1. Format FDI and re-calibration







8. Rework U902

9. Rework U904

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WCDMA pretest


WCDMA maximum power


2. Check voltage of U953 Pin1, 5 & 10

3. Check voltage of L21

WCDMA sensitivity 1. Refer to “General WCDMA Rx debug”

2. Check voltage of U958 all VCC Pins

WCDMA SEM


2. Check RLC of high band Tx matching

3. Format FDI and re-calibration

WCDMA ACLR


2. Check RLC of high band Tx matching

3. Format FDI and re-calibration

WCDMA frequency error

1. Check voltage of OSC1 Pin1 & 4


3. Rework digital baseband

WCDMA EVM 1. Refer to “General WCDMA Tx debug”

2. Check IQ signal of U957 Pin10~13

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19. General RF Debug

19.1 General GSM Tx debug

The flow chart of GSM Tx debug is shown below.

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The purpose of this debug is to find out where the problem is on GSM Tx path. In other words, engineers can judge the defect component on RF path by using “Debug tool”. Debug tool makes Halley into test mode so that PA can transmit power continuously.

The usage of debug tool can be referred to “Debug tool user guide” provided by Halley ATS engineers. Related parameters of debug tool are prescribed in the following table.

Channel PCL Tx Frequency PAG_Valu

e DAC1V

GSM 900 62 5 902.4 MHz 555 5200

DCS 1800 700 0 1747.8 MHz 560 5200

PCS 1900 661 0 1880.0 MHz 525 5200

The detail steps of debug are listed as follows.

GSM 900 Tx debug

a. Spectrum analyzer connects with a high impedance probe. Execute GSM debug tool and set parameters in the above table.

b. Use the high impedance probe to sequentially measure RF power of test points on GSM Tx path, including antenna pad, L59, C228, and C917. Corresponding locations are shown in “4. RF Tx/Rx Path and Test Points.” Furthermore, measurement error of RF power on each test point is unavoidable due to measurement skills and methods of using high impedance probe. After probing sequential test points, the probable defect component should be checked that DC power is supplied for this component at proper voltage level.

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c. Antenna pad: all components on Tx path are good if power is measured from antenna pad within 25dBm~32dBm. In this case, engineers shall go to next debug process, general GSM Rx debug.

d. L59: Check whether GSM RF connector (CON6) is good or not. CON6 needs to be reworked if power is measured within 25dBm~ 32dBm on L59, and no signal is measured from antenna pad. The following figure is an example of L59 signal measurement on the spectrum analyzer.

e. C228: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if power is measured within 25dBm~ 32dBm on C228, and no signal is measured on L59. The following figure is an example of C228 signal measurement on the spectrum analyzer.

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f. C917: Check whether PA (U904) is good or not. PA needs to be reworked if power is measured within -6dBm~ 0dBm on C236, and no signal is measured on C228. Besides, if no output power is measured on C917, transceiver (U900) needs to be reworked. The following figure is an example of C917 signal measurement on the spectrum analyzer.

g. The next process returns to calibration and pretest after the defect component is found out and reworked.

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DCS 1800 Tx debug





e. C234: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if power is measured within 25dBm~ 32dBm on C228,

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and no signal is measured on L59. The following figure is an example of C234 signal measurement on the spectrum analyzer.


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f. The next process returns to calibration and pretest after the defect component is found out and reworked.

PCS 1900 Tx debug




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e. C234: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if power is measured within 25dBm~ 32dBm on C228, and no signal is measured on L59. The following figure is an example of C234 signal measurement on the spectrum analyzer.

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19.2 General GSM Rx debug

The flow chart of GSM Rx debug is shown below.

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The purpose of this debug process is to find out where the problem is on GSM Rx path. In other words, engineers can judge the defect component on RF path by using “Debug tool” and RF signal generator. Debug tool makes Halley into test mode and keeps Rx path receiving CW (continuous wave) from the generator.

The usage of debug tool can be referred to “Debug tool user guide” provided by Halley ATS engineers. Related parameters of debug tool and recommended output power from the generator are prescribed in the following table.

Channel Rx Frequency Generator power

GSM 900 62 947.4 MHz -20 dBm

DCS 1800 700 1842.8 MHz -20 dBm

PCS 1900 661 1960.0 MHz -20 dBm


GSM 900 Rx debug

a. Set RF signal generator to emit CW with corresponding frequency and transmit power into Halley GSM connector via RF cable and a RF adapter (MS-162). Spectrum analyzer connects with a high impedance probe. Execute GSM debug tool and set parameters in the above table.

b. Use the high impedance probe to sequentially measure RF power of test points on GSM Rx path, including L59, C869, and C868. Corresponding locations are shown in “4. RF Tx/Rx Path and Test Points.” Furthermore, measurement error of RF power on each test point is unavoidable due to measurement skills and methods of using high impedance probe. After probing sequential test points, the probable defect component should be checked that DC power is supplied for this component at proper voltage level.

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c. L59: Check whether GSM RF connector (CON6) is good or not. CON6 needs to be reworked if no RF signal is measured on L59.

d. C869: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if RF signal emitted by the signal generator is measured on L59, and no power is detected on C869. The following figure is an example of C869 signal measurement on the spectrum analyzer.

e. C868: Check whether SAW filter (BPF1) is good or not. BPF1 needs to be reworked if RF signal emitted by the signal generator is measured on C869, and no power is detected on C868. The following figure is an example of C868 signal measurement on the spectrum analyzer.

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DCS 1800 Rx debug

a. Set RF signal generator to emit CW with corresponding frequency and transmit power into Halley GSM connector via a RF cable and a RF adapter (MS-162). Spectrum analyzer connects with a high impedance probe. Execute GSM debug tool and set parameters in the above table.



d. C903: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if RF signal emitted by the signal generator is measured

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on L59, and no power is detected on C903. The following figure is an example of C903 signal measurement on the spectrum analyzer.

e. C895: Check whether SAW filter (BPF4) is good or not. BPF4 needs to be reworked if RF signal emitted by the signal generator is measured on C903,

and no power is detected on C895. The following figure is an example of C895 signal measurement on the spectrum analyzer.


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PCS 1900 Rx debug

a. Set RF signal generator to emit CW with corresponding frequency and transmit power into Halley GSM connector via a RF cable and a RF adapter (MS-162). Spectrum analyzer connects with a high impedance probe. Execute GSM debug tool and set parameters in the above table.



d. C889: Check whether T/R switch (U902) is good or not. T/R switch needs to be reworked if RF signal emitted by the signal generator is measured on L59, and no power is detected on C889. The following figure is an example of C889 signal measurement on the spectrum analyzer.

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e. C887: Check whether SAW filter (BPF3) is good or not. BPF3 needs to be reworked if RF signal emitted by the signal generator is measured on C889, and no power is detected on C887. The following figure is an example of C887 signal measurement on the spectrum analyzer.

f. The next process returns to calibration and pretest after the defect component is found out and reworked. In a special case, receiver (U901) needs to be reworked if no problem is found on all Rx paths and pretest is still failed.

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19.3 General WCDMA Tx debug

The flow chart of WCDMA Tx debug is shown below.

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The purpose of this debug process is to find out where the problem is on WCDMA Tx path. In other words, engineers can judge the defect component on RF path by using “Debug tool”. Debug tool makes Halley into test mode so that PA can transmit power continuously.

The usage of debug tool can be referred to “Debug tool user guide” provided by Halley ATS engineers. Related parameters of debug tool are prescribed in the following table.

UL Channel Tx Frequency Vgc DAC

WCDMA 9750 1950.0 MHz 1024

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b. Use the high impedance probe to sequentially measure RF power of test points on GSM Tx path, including antenna pad, C972, duplexer (U956) Pin1, C947, C969 Pin1, C955, L851 Pin1, and L864. Furthermore, the signals of C969 Pin1 and L851 Pin1 are both DC signals instead. Corresponding locations are shown in “4. RF Tx/Rx Path and Test Points.” Moreover, measurement error of RF power on each test point is unavoidable due to measurement skills and methods of using high impedance probe. After probing sequential test points, the probable defect component should be checked that DC power is supplied for this component at proper voltage level.

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c. Antenna pad : all components on WCDMA Tx path are good if power is measured from antenna pad within -46dBm~-37dBm. In this case, engineers shall go to next debug process, general WCDMA Rx debug.

d. C972: Check whether WCDMA RF connector (CON7) is good or not. CON7 needs to be reworked if power is measured within -46dBm~-37dBm on C972, and no signal is measured from antenna pad. The following figure is an example of C972 signal measurement on the spectrum analyzer.

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e. U956 Pin1: Check whether duplexer (U956) is good or not. Duplexer needs to be reworked if power is measured within -46dBm~ -37dBm on U956 Pin1, and no signal is measured on C972. The following figure is an example of U956 Pin1 signal measurement on the spectrum analyzer.

f. C947: Check whether isolator (U954) is good or not. CON7 needs to be reworked if power is measured within -46dBm~-37dBm on C972, and no signal is measured on U956 Pin1. The following figure is an example of C947 signal measurement on the spectrum analyzer.

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g. C969 Pin1(DC): Check whether power detector (U956) is good or not. The main function of power detector is to sense RF signal by means of converting RF to DC voltage. The voltage level on C969 Pin1 shall be 1.3V ~ 1.5V as maximum output power, approximate 23.5 dBm, is emitted. Power detector needs to be reworked if no voltage level is measured in the situation of maximum output power.

h. C955: Check whether PA (U953) operates normally or not. PA needs to be reworked if DC-DC converter supplies DC voltage to PA and power is measured within -63dBm~-55dBm on C955. The following figure is an example of C955 signal measurement on the spectrum analyzer.

i. L851 Pin1(DC): Check whether DC-DC converter (U951) is good or not. The voltage level on L851 Pin1 shall be 2.7V ~ 2.9V as RF power is emitted. DC-DC converter needs to be reworked if no DC voltage is measured on L851 Pin1.

j. The next process returns to calibration and pretest after the defect component is found out and reworked.

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19.4 General WCDMA Rx debug

The flow chart of WCDMA Rx debug is shown below.

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The purpose of this debug process is to find out where the problem is on WCDMA Rx path. In other words, engineers can judge the defect component on RF path by using “Debug tool” and RF signal generator. Debug tool makes Halley into test mode and keeps Rx path receiving CW (continuous wave) from the generator.

The usage of debug tool can be referred to “Debug tool user guide” provided by Halley ATS engineers. Related parameters of debug tool and recommended output power from the generator are prescribed in the following table.

DL Channel Rx Frequency Generator

Power

WCDMA 10700 2140.0 MHz -30 dBm


a. Set RF signal generator to emit CW with corresponding frequency and transmit power into Halley WCDMA connector via a RF cable and a RF adapter (MS-162). Spectrum analyzer connects with a high impedance probe. Execute WCDMA debug tool and set parameters in the above table.

b. Use the high impedance probe to sequentially measure RF power of test points on WCDMA Rx path, including C972, C990, C980 and L867. Corresponding locations are shown in “4. RF Tx/Rx Path and Test Points.” Furthermore, measurement error of RF power on each test point is unavoidable due to measurement skills and methods of using high impedance probe. After probing sequential test points, the probable defect component should be checked that DC power is supplied for this component at proper voltage level.

c. C972: Check whether WCDMA RF connector (CON7) is good or not. CON7 needs to be reworked if no RF signal is measured on C972. The following figure is an example of C972 signal measurement on the spectrum analyzer.

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d. C990: Check whether duplexer (U956) is good or not. Duplexer needs to be reworked if no power is measured on C990. The following figure is an example of C990 signal measurement on the spectrum analyzer.

e. C980: Check whether receiver (U958) is good or not. Receiver needs to be reworked if no power is measured on C980. The following figure is an example

of C980 signal measurement on the spectrum analyzer.

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f. L867: Check whether BPF6 is good or not. BPF6 needs to be reworked if no power is measured on L867. The following figure is an example of L867 signal measurement on the spectrum analyzer.


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20. Appendix

20.1 GSM/WCDMA wireless test

The flow chart of wireless test is shown below.

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The purpose of this process is to distinguish problems between antenna and RF circuit that cause weak RF performance. Besides, wireless test is a previous analysis of all RF tests. Moreover, engineers utilize wireless test to confirm that antenna performance is not affected after re-assembling.

The detail steps of process are listed as follows.

a. Put a golden sample of Halley into a shielding box and link to a tester (Agilent 8960 or R&S CMU9020). Then, record its location and path loss.

b. At the same position that the golden sample was located, put problematic Halley into the shielding box. After that, wait for Halley registering at the tester.

c. After attaching to the network, make a phone call.

d. Measure maximum output power and sensitivity. The test requirements of maximum output power and sensitivity shall not exceed the range listed in the following table.

e. If any of previous steps (b. ~ d.) is failed, consequently enter next process, pretest test.

f. If all previous steps (b. ~ d.) are passed, it means that nothing happens. Therefore, need to clarify customer’s complaints and try to understand user’s behaviors.

Channel Power Level

Power Requirements

Sensitivity Requirements

GSM 900 62 5 29.3~35.3 dBm Refer to

golden sample

DCS 1800 700 0 26.0~32.0 dBm Refer to

golden sample

PCS 1900 661 0 26.0~32.0 dBm Refer to

golden sample

WCDMA 10700 All up

(24 dBm) 20.8~25.5 dBm

Refer to

golden sample

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20.2 Bluetooth test

1. Open 2577_Bluetooth file

2. Execute “autorun”

3. Choose TXSTART 24XX which you want

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4. Done LCD show Bluetooth Test Mode test mode OK

5. Measure Tx output power with Spectrum analyzer

6. Press” ok” to leave

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20.3 WiFi test

1. Enter Wireless Manager turn on Wi-Fi

2. Open Fcctest file

3. Execute FCC Test TX

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4. Choose a channel which you want to measure.

5. And select “Cw TX on” test mode OK

6. Measure Tx output power with Spectrum analyzer.

7. Select “Quit” to leave.

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