When First-Pass-Yield counts most

For high UPH @ 7mm accurracy

© Assembléon 2015. All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and maybe changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Date of release: January 2015. 9498.389.0092.1

ASIA-PACIFICAssembléon Asia Ltd.T: + 852 2167 1000

EUROPEAssembléon Netherlands B.V.T: +31 40 272 3000

THE AMERICASAssembléon America Inc.T: +1 770 751 4420

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About Assembléon

Assembléon is a global provider of smart solutions for the electronics assembly industry. Founded by Royal Philips Electronics in the mid eighties, the company has more than 30 years of experience in component placement. Assembléon uniquely uses parallel placement technology for industry leading results in quality and accuracy. Its products are highly acclaimed by critical industries like the automotive, telecom, computing, aerospace, memory modules and embedded module manufacturing. Assembléon now brings the benefits of parallel placement into the world of semiconductor.

Reduce your ECP, SiP, WLP and flip chip production costs

Setup assistantZero defect and fast online and offline setups

• Setup guidance

• Component second sourcing

• Error proof setup validation

• Feeder replenishment monitoring

• Fast change-overs

• Reel expiration date monitoring

Material traceabilityTrace data storage and reporting

• Work order traceability + reporting - Component trace data linked to work order number

• PCB traceability + reporting - Extends trace data linkage from work order to reference designator

• Component level traceability

Performance monitoringManage and control line efficiency

• Real-time monitoring

• Machine status and PPM levels

• Reporting

Manufacturing Execution System (MES) Factory Solutions

Material verificationCentral material management

• Incoming material registration

• Unique reel ID support

• RoHs, Approved Vendor List (AVL), Moist Sensitive Device (MSD) and component blocking

• Material consumption registering

Feeder maintenance monitoringGet the best performance out of your feeders- Schedule feeder maintenance- Maintenance warnings- Maintenance history

Connect to feeder service shop

Material managementJust-in-time logistics materials flow to production

• Reduce shop floor WIP

• Reduce material inventory

• • •

Hybrid Embedded & Module manufacturing solutions

Die attach at passives speed

Assembléon’s Hybrid : a single machine solution

Accuracy 7 micronat 3 sigma

• Thin PCB support from 0.1 mm

• Small fiducial shapes > 0.1 mm

• Board pattern recognition > 0.1 mm

Where different equipment were used to place chips and known good dies for manufacturing of SiP, WLP and high performance flip chip modules, this can now be done on one single machine.

Unique single pick/single place concept

Optimized motion profile

• Continuous monitoring of component

• Device specific accelleration and decelleration profile

Controlled dip fluxing

• No impact force during dipping

• Controlled dip process and die extraction from dip station

• Even flux distribution on all bumps

Closed loop controlled programmable placement force

• Advanced board collision detection

• No impact force = no damaged devices

• Static forces as low as 0.3 N

• Passives and flip chip with one placement head

01005 components without cracking

Die feeding

• Up to 12” wafers

• Tape feeder

• Waffle packs

• Scaleable flip chip bonding speed from 4,500 cph to 25,000 cph

Flip chip bonding robots

This machine consumes only 80 Nl/min compressed air

Save energy

• Line performance monitoring Inventory control

• Traceability on part and board level

MES solutions

The Hybrid, with its unique parallel placement process capabilities and high accuracy robots, combines the requirements of reliable high speed chipshooting and accurate known good die placement into a one single machine solution.

• Standard and compact robots

• Scaleable from 30,000 cph to 121,000 cph (IPC 9850)

Chip shooting robots

Dip fluxing

20 mm thin dies

Modules

2

7mm!

50

280 260

620

1070

0 0 40

210

450

W8P2 Paper W4P1 Plastic

• Improves 01005 process realiability

W4P1 tape and reel

• Dust and static free

• High pick rates

• For 01005 and 0201 passive devices

Controlled pick of component

• Closed loop controlled pick - No impact force during pick of known good dies - No damaged devices

• Eliminate tape tolerances for first time right pick

• Dust free feeding with W4P1 4 mm tapes

* 03015M under development

Accuracy 7 micron@ 3 sigma

• Thin substrates from 0.05 mm

• Vacuum transport

• Large substrates: 800 x 457 mm

W4P1 tape and reel

• Dust and static free

• High pick rates

• For 01005 and 0201 passive devices

Waffle pack and wafer

• Known good die feeding

Tape and reel

• Passive and active device feeding

• Feeding type for highest output

This machine consumes only 100 Nl/min compressed air

Save energy

• Scaleable passive device output from 30 kcph to 121 kcph

EPD robots

Embedded component solutions: Flexible single machine solutions

Placing over 30,000 ultra thin embedded devices at high speed into tiny cavities on a vacuum supported substrate has become a new industry challenge. Only the correct pick and place process overcomes this challenge, guaranteeing very high First Pass Yields for your embedded application.

Controlled pick and place process for best in class first pass yield

Optimized motion profile

• Continuous monitoring of component

• Device specific accelleration and decelleration profile

Closed loop controlled programmable placement force

• Advanced board collision detection

• No impact force = no damaged devices

• Static forces as low as 0.3 N

The Hybrid embedded solution has unique parallel placement process capabilities and high accuracy robots, combining the requirements of high speed passive placement and accurate known good die placement into one single machine solution, without any component damage.

Accuracies and speed make the Hybrid Embedded an excellent single sided, single machine Embedded Component Packaging (ECP) Solution.

Controlled pick of component

• Closed loop controlled pick - No impact force during pick of known good dies - No damaged devices

• Eliminate tape tolerances for first time right pick

• Dust free feeding with W4P1 4 mm tapes

7mm!Single machine solution for combined Embedded Passive Device (EPD) and Embedded Active Device (EAD) placements.

Embedded

4

• Scaleable active device output from 4,500 cph to 25,000 cph

EPD/EAD robots

01005 components without cracking

Active devices down to 20 mm thickness

Standard Low profile

0,3

mm

0,15

mm

Highest first-pass-yield on low profile components

50

280 260

620

1070

0 0 40

210

450

W8P2 Paper W4P1 Plastic

• Improves 01005 process realiability

* 03015M under development

Technical specificationsMaximum IPC 9850 output

Laser 121 kcph 79 kcph

Flux/paste dipping (with or without) Without With Without With

18 micron mode - camera 25 kcph 18 kcph 25 kcph 18 kcph

10 micron mode - camera 15 kcph 12 kcph 15 kcph 12 kcph

Maximum output per hour for 13.5 - 27 kcph without dipping 13.5 - 27 kcph without dipping

flip chip bonding (IPC 9850) 10.5 - 16 kcph with dipping 10.5 - 16 kcph with dipping

Placement quality < 1 dpm < 1 dpm

Placement accuracy @ 3 sigma 1 25 mm for passives 25 mm for passives

18 mm for QFP/BGA/FC 18 mm for flip chips

- Optional 10 mm for flip chips 10 mm for flip chips

- Under lab conditions 7 mm for flip chips 7 mm for flip chips

Minimum component size 0.4 x 0.2 mm 2 0.4 x 0.2 mm 2

Maximum component size 45 x 45 mm (1.77 x 1.77”) 45 x 45 mm (1.77 x 1.77”)

Maximum component height 10.5 mm (0.41”) 10.5 mm (0.41”)

Programmable placement force 1.5 to 8 N 1.5 to 8 N

- Optional 0.3 to 1.5 N 0.3 to 1.5 N

Maximum board size:

- Standard 515 x 390 mm (20.28 x 15.35”) 475 x 390 mm (18.7 x 15.35”)

- Optional 800 x 457 mm (31.5 x 18”) 800 x 457 mm (31.5 x 18”)

Minimum board size:

- Standard 50 x 50 mm (2 x 2”) 50 x 50 mm (2 x 2”)

- Optional 50 x 25 mm (2 x 1”) 50 x 25 mm (2 x 1”)

Transport direction Left to right Left to right

- Optional Right to left Right to left

Board thickness:

- Standard ≥ 0.3 mm ≥ 0.3 mm

- Optional ≥ 0.05 mm ≥ 0.05 mm

Transport options substrate, lead-frame, sheet to sheet substrate, lead-frame, sheet to sheet

(carriers), reel to reel, carrier, flex-foil, (carriers), reel to reel, carrier, flex-foil,

ceramic, vacuum, top clamping ceramic, vacuum, top clamping

Average power consumption 3 kVA 2.5 kVA

Average air consumption per head 10 Nl/min 10 Nl/min

Max. tape feeding positions:

Single lane feeders 130 76

Twin tape feeders 260 156

Feeding options Tape, waffle pack, tray, direct die, others Tape, waffle pack, tray, direct die, others

Dip station With coplanarity adjustment With coplanarity adjustment

Data interfaces CAMX, Secs/Gem CAMX, Secs/Gem

Footprint excl. feeders (LxW) 3,720 x 1,705 mm (146.46 x 67.13”) 2,760 x 1,705 mm (108.66 x 67.13”)

Hybrid 5

1 Based on Assembléon Metrology2 0201m/03015m capability under development

Hybrid 3

Maintain your qualityKnowing your service requirements are unique, Assembléon tailors a service solution to meet your changing needs. Assembléon is recognized as the industry’s premier service provider.

Machine accuracy verification service is one of our services that guarantees the quality of your equipment as long as you have it.

Start-up and Transition support

• Training by certified trainers

• Professional, fast installation

• Customized project management and transition

Assessment ServicesRecommendations for guaranteed efficiency and yield improvements follow an on-site assessment by Assembléon.

Related Services

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