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A&R Template 4.4
Procedural Review Voting Sheet
2010 Cycle 7
REGION: Japan
COMMITTEE: Silicon Wafer Committee
EVENT: SEMICON Japan 2010
DATE OF MEETING: 2010/12/02
PLACE OF MEETING: Makuhari Messe, Chiba, Japan
COMMITTEE CO-CHAIRS: Naoyuki Kawai/University of Tokyo, Tetsuya Nakai/SUMCO
SEMI STAFF: Akiko Yamamoto
A&R Voter: Name/Company
Date: 200X/MM/DD
I. Document Number & Title
Document 4760A
New Standard: Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers
II. Tally (Staff to fill in)
Voting Tally: As-cast tally after close of voting period
A minimum of 60% of the voting interests that have voting members within the technical committee must return votes. (Regulations 9.6.1)
Return
Distribution
Return Rate
Yellow
51
85
=
60.0%
>=60%
Lilac & Others
16
----------------------------------------------------------------------------------
Total Vote
67
Reject
6
Accept
17
A&R
Not approved
Reason:
III. Rejects
Reject 1 (Akira Kashimoto/ Shin-Etsu Polymer)
Negative 1 of Reject 1
Negative
Referenced Section
Table 1
z21
z21
Z21
Reason
Negative
Wafer Plane Tolerance needs to be 0.75mm instead of 0.5mm.
Rationale
1) SEMI Standard has to lead the industry feasible.
2) Most experienced plural number of 300mm FOSB manufacturers insist on0.75mm. In addition, ISB TF and Si Wafer Committee regarded the contention is technically persuasive in July this year.
3) Plural number of Robot manufacturers
indicate that they can transfer wafers
from 0.75mm Wafer Plane Tolerance
450FOSB to 0.5mm wafer Plane
Tolerance FOUP as shown in page 3 or
5 of the attached file.
C:\@KASHIMOTO\
@300mm Prime & 450mm\100830ITG-J(Pitch Budget)\20100830_ITG-J Report r0.3.ppt
It means the 0.75mm does not prevent
the feasibility of 450mm industry.
4) No carrier manufacturer has proved that 0.5mm Wafer Plane Tolerance 450mm FOSBs with required purity are manufacturable. Carrier manufacturers who agree with 0.5mm Wafer Plane Tolerance should prove or provide technically persuasive explanation.
5) Once 450FOSB Standard is published with 0.5mm of wafer plane tolerance, robot manufactures will develop on it. However, 450mm FOSB for prime or test wafers shipment will probably not be available and thus the robot development on 0.5mm of wafer plane tolerance will come to nothing. This is sad.
Withdrawal
No withdrawal made
GO TO Related section
X
Withdrawal document received by staff on November 25, 2010.
GO TO Final ( (A)
Related
Motion and Reason
Related is mutually agreed upon.
*This motion can be appended to the motion for Persuasive (See Persuasive Section)
Negative is related (needs over 1/3 votes to pass)
Negative is not related (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related] > 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3= 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3= 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3= 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3= 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
XXXX
Motion by/2nd by
Name (Company)/Name (Company)
Discussion
Result of Vote (check ONE)
XX-XX
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3= 1/3
GO TO Persuasive
[Negative is not related] < 2/3
2/3=< [Negative is not related]
GO TO Final ( (B)
Persuasive
Motion and Reason
Negative is related and persuasive (needs over 1/3 votes to pass)
X
Negative is related and not persuasive (needs 2/3 or more votes to pass)
Reason
Doc. 4982 NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 mm FOSB LOAD PORT has already been approved by NA PI&C Committee considering different door closure force, so that it is not a technical reason.
Motion by/2nd by
Yasuhiro Shimizu (Consultant)/ Sadao Kumai (Consultant)
Discussion
None.
Result of Vote (check ONE)
11-0-4
[Negative is related and persuasive] > 1/3
GO TO Final ( (E)
[Negative is related and not persuasive] < 2/3
2/3==60%>=90%
Lilac & Others16
----------------------------------------------------------------------------------
Total Vote67
Reject6
Accept17
Sheet2
Sheet3
_1352817172.xlsSheet4
Sheet1
Accepts(Accepts + Valid Rejects)
Approval Rate=17/17=100.0%>=90%
Sheet2
Sheet3
_1349527858.ppt
ITG Japan Report R0.3
Pitch Budget for FOSB
Aug 30th, 2010
ITG Japan
FOUP Wafer Pitch Table
*
ITG-J report
(test data of vibration)
2.5 mm OK
1.94mm NG
Varies
(W Robot suppliers estimates)
Min. 3.5mm
Max. 4mm
Wafer related Budget
4.75mm
Grand Total
Min. 11.95 mm
Max. 12.45mm
Budget for Wafer Robot
Carrier related Budget
1.2mm
Backside Contact
Vacuum E/E
Shipping Box Wafer Pitch Table
Budget for Wafer Robot
Wafer related Budget
1.9mm
Carrier related Budget
1.7mm
Varies
(W Robot suppliers estimates)
Min. 7.50mm
Max. 8.70mm
Perimeter Support
Edge Grip E/E
Deflection Under Gravity : 0.85mm
Tolerance of Wafer Planes : 1.5mm
Grand TotalPitch Budget
Min. 11.10 mm
Max. 12.30mm
Back up
Latest Pitch Table
Deflection Under Gravity : 0.85mm
SUMCO Input
Entegris Input
Maximum Wafer Sag
0.0301=0.765mm
ITG-JInputby ISMI Single Crystal/Sintered Wafer
Item
Description
Pitch
Budget
Lift
Budget
Pitch
Budget
Lift
Budget
Pitch
Budget
Lift
Budget
2
Thickness
of Wafer
0.95
0.95
0.95
0.95
0.95
0.95
3
Deflection
under Gravity
0.85
0.00
0.85
0.00
0.85
0.00
4
Process
Induced Warp
0.00
0.00
0.00
0.00
0.00
0.00
5
Initial
Warp
0.10
0.10
0.10
0.10
0.10
0.10
6
Tolerance
of wafer planes
1.50
1.50
1.50
1.50
1.50
1.50
7
Carrier
Placement Error
0.20
0.20
0.20
0.20
0.20
0.20
8
EE
Structure
2.00
3.50
0.00
3.00
0.00
9
EE
Wafer Contact Pads
2.50
2.50
0.00
2.50
0.00
10
EE
Curve w/o wafer
1.00
0.24
0.00
0.20
0.00
11
EE
Curve w/ wafer
0.00
1.00
0.00
1.12
0.70
12
Inclination
of Robot Motion
2.00
2.00
2.00
2.00
3.00
3.00
13
Vibration
of EE (P-P)
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
14
Teaching
and alignment
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
15
EE
Roll Error
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
Incl.
in #12
16
Desired
Safety Margin
0.00
0.00
0.00
0.00
0.00
0.00
17
Thickness
of Wafer Support
0.00
4.00
0.00
4.00
0.00
4.00
18
TOTAL
11.10
9.75
11.84
9.87
12.30
10.45
D
A
B
Line Description
Pitch
Budget
"A"
Lift
Budget
"A"
Pitch
Budget
"B"
Lift
Budget
"B"
Pitch
Budget
"C"
Lift
Budget
"C"
Pitch
Budget
"D"
Lift
Budget
"D"
Pitch
Budget
"E"
Lift
Budget
"E"
Pitch
Budget
"F"
Lift
Budget
"F"
2 Thickness
of Wafer
0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95
3 Deflection
under
Gravity
0.50 0.00 0.50 0.00 0.40 0.00 0.16 0.00 0.30 0.00 0.20 0.00
4 Process
Induced
Warp
3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60
5 Initial Warp 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.00 0.20 0.10 0.10 0.00
6 Tolerance
of wafer
planes
1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00
7 Carrier
Placement
Error
0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20
8 EE
Structure
3.50 0.00 3.00 0.00 3.00 0.00 2.86 0.00 3.00 0.00 3.11 0.00
9 EE Wafer
Contact
Pads
0.20 0.00 0.50 0.00 0.50 0.00 0.75 0.00 1.00 0.00 0.47 0.00
10 EE Curve
w/o wafer
0.00 0.00 0.20 0.00 0.00 0.00 0.00 0.00 0.20 0.00 0.00 0.00
11 EE Curve
w/ wafer
0.00 1.00 0.00 1.00 0.00 0.80 0.00 0.80 0.00 0.00 0.00 0.80
12 Inclination
of Robot
Motion
1.50 1.50 1.20 1.20 0.00 0.00 Incl.
in #13
Incl.
in #13
0.30 0.00 Incl.
in #13
Incl.
in #13
13 Vibration
of EE (P-
P)
0.00 0.00 0.20 0.20 0.75 0.75 0.52 0.69 0.20 0.00 0.91 1.29
14 Teaching
and
alignment
1.00 1.00 1.10 1.10 0.80 0.80 1.00 1.00 0.40 1.00 0.00 0.00
15 EE Roll
Error
0.50 0.50 0.50 0.50 0.10 0.10 0.07 0.07 0.20 0.00 0.00 0.00
16 Desired
Safety
Margin
0.50 0.50 0.50 0.50 0.30 0.30 0.00 0.00 1.00 0.00 0.00 0.00
17 Thickness
of Wafer
Support
0.00 4.00 0.00 4.00 0.00 4.00 4.00 0.00 4.00 0.00 4.00
18 TOTAL
13.15 12.35 13.15 12.35 11.30 11.10 10.80 10.31 12.15 TBD 10.14 9.84
Rorze
Hirata
Daihen
Rorze
Hirata
Daihen
Rorze
Hirata
Daihen
Rorze
Hirata
Daihen
Empty
12.0
10.60
11.34
11.80
9.10
8.67
8.90
10.60
11.34
11.80
12.30
11.87
12.10
Wafer
12.0
9.25
9.37
9.95
9.25
8.80
8.85
9.25
9.37
9.95
10.85
10.40
10.45
12.0
10.10
10.84
11.30
8.60
8.17
8.40
10.10
10.84
11.30
10.20
9.77
10.00
Empty
12.0
11.10
11.84
12.30
9.60
9.17
9.40
11.10
11.84
12.30
12.80
12.37
12.60
Wafer
12.0
9.75
9.87
10.45
9.75
9.30
9.35
9.75
9.87
10.45
11.35
10.90
10.95
12.0
10.35
11.09
11.55
8.85
8.42
8.65
10.35
11.09
11.55
10.45
10.02
10.25
MAC
No Warp
No Warp
No Warp
Warped
Edge Grip EE
Vacuum
}
0.5
}
0.75
Edge Grip EE
Vacuum
Wafer
Plane
Tolerance
Wafer
Pitch
Wafer
Pitch
First Wafer Height
First Wafer Height
FOSB
Target
Value
Carrier Type
Handling Type
Wafer
Robot Supplier