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APPLICATIONS OVERVIEW Dimethylamine Borane (DMAB) Electroless plating of nickel-boron alloys Used as a reducing agent in electroless nickel (EN) pla�ng baths for co-deposi�on of nickel-boron onto a variety of substrates. Nickel-boron (NiB) combines extreme hardness, corrosion resistance, duc�lity and lower coefficient of fric�on. As hexavalent chrome has faced regulatory challenges, NiB has emerged as a high-performance alterna�ve. Considera�ons for DMAB-based EN pla�ng baths can include issues such as: DMAB is also well suited for the electroless deposi�on of cobalt-boron as well as precious metals including gold and palladium. In addi�on, Djokic, Rebelli, Diao, and others have reported the use of electroless depo- si�on using DMAB and other reducing agents for the prepara�on and tuning of bimetallic catalysts like AU/Pd, Pt/Co, Cu/Pd, and Pt/Ru. 1 Mallory, Glenn O & Hajdu, Juan B & American Electroplaters and Surface Finishers Society (1990). Electroless Plang: Fundamentals and Applicaons. Sodium borohydride (NaBH4), also available from Boron Special�es, is also used plate NiB. NaBH4 costs less than DMAB and can achieve as much as 5% boron in the final product alloy, but baths must be run in the pH 12-14 range to avoid forma�on of nickel boride. Organic Synthesis DMAB is a mild reducing agent. Reac�vity with organic func�onali�es: Substrate DMAB in H2O DMAB in THF acid chloride ~ ~ acid salt - ~ aldehyde + + amide - carboxylic acid ~ ~ epoxide + - ester - - imine + ketone + + nitrile - - nitro - - + = reduction = no reduction ~ = other reaction Ref: Lane, C.F. Aldrichim. Acta 1973, 6, 51. Boron Specialties LLC Deposi�on rate of NiB is a func�on of DMAB concentra�on, up to a limit of about 0.06M.¹ Temperature response is similar to other cata- ly�c nickel processes as long as kept below the onset temperature for DMAB hydrolysis. pH for DMAB pla�ng baths is preferably in the 6-7 range.¹ Boron in final product alloy can range from 0.2-4%, with 1-1.5% being a common target. Higher % boron has been reported via the use of zinconyl ions. As many as 65 bath turnovers have been re- ported as a result of soluble byproducts of DMAB reducing agent. Techniques & formula�ons for hypophosphite baths are typically applicable to DMAB also. Selec�on of stabilizers should take into account poten�al effect on the tensile stress of the product alloy and on boron deposi�on. Laboratory & Warehouse 2301 Duss Avenue, Ste. 35 Ambridge, PA 15003 USA MEMBER COMPANY www.boron.com 855-BORON-05 UNITED STATES and CANADA Outside US: 001.724.266.6501 DMAB and sodium borohydride are hazardous materials. For Safety Data Sheet, please contact Boron Special�es.

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  • APPLICATIONS OVERVIEW Dimethylamine Borane (DMAB)

    Electroless plating of nickel-boron alloys Used as a reducing agent in electroless nickel (EN)pla�ng baths for co-deposi�on of nickel-boron ontoa variety of substrates. Nickel-boron (NiB) combinesextreme hardness, corrosion resistance, duc�lity andlower coefficient of fric�on. As hexavalent chromehas faced regulatory challenges, NiB has emerged asa high-performance alterna�ve.

    Considera�ons for DMAB-based EN pla�ng baths caninclude issues such as:

    DMAB is also well suited for the electroless deposi�onof cobalt-boron as well as precious metals includinggold and palladium. In addi�on, Djokic, Rebelli, Diao,and others have reported the use of electroless depo-si�on using DMAB and other reducing agents for theprepara�on and tuning of bimetallic catalysts likeAU/Pd, Pt/Co, Cu/Pd, and Pt/Ru.

    1 Mallory, Glenn O & Hajdu, Juan B & American Electroplatersand Surface Finishers Society (1990). Electroless Plating:Fundamentals and Applications.

    Sodium borohydride (NaBH4), also available fromBoron Special�es, is also used plate NiB. NaBH4 costsless than DMAB and can achieve as much as 5% boronin the final product alloy, but baths must be run in thepH 12-14 range to avoid forma�on of nickel boride.

    Organic Synthesis DMAB is a mild reducing agent. Reac�vity withorganic func�onali�es:

    Substrate DMAB in H2O DMAB in THF

    acid chloride ~ ~ acid salt - ~ aldehyde + + amide - carboxylic acid ~ ~ epoxide + - ester - - imine + ketone + + nitrile - - nitro - -

    + = reduction = no reduction ~ = other reactionRef: Lane, C.F. Aldrichim. Acta 1973, 6, 51.

    BoronSpecialties LLC

    Deposi�on rate of NiB is a func�on of DMABconcentra�on, up to a limit of about 0.06M.¹Temperature response is similar to other cata-ly�c nickel processes as long as kept below theonset temperature for DMAB hydrolysis.pH for DMAB pla�ng baths is preferably in the6-7 range.¹Boron in final product alloy can range from0.2-4%, with 1-1.5% being a common target. Higher % boron has been reported via the useof zinconyl ions.As many as 65 bath turnovers have been re-ported as a result of soluble byproducts of DMABreducing agent.Techniques & formula�ons for hypophosphitebaths are typically applicable to DMAB also.Selec�on of stabilizers should take into accountpoten�al effect on the tensile stress of theproduct alloy and on boron deposi�on.

    Laboratory & Warehouse 2301 Duss Avenue, Ste. 35 Ambridge, PA 15003 USA

    MEMBER COMPANY

    www.boron.com855-BORON-05 U N I T E D S T A T E S a n d C A N A D A

    Outside US: 001.724.266.6501

    DMAB and sodium borohydride are hazardousmaterials. For Safety Data Sheet, please contactBoron Special�es.