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APPLICATION REVISIONS APPROVALS NEXT ASSY PROJECT NO. ECN NO. REV DESCRIPTION DATE APPROVED

10829 --- A PRODUCTION RELEASE 03/24/04 J. WARREN 1018088 B INACTIVATE -001,-002;REL -003 -004 07/15/05 C. MOORE 1021169 C REACTIVATE -001, -002 08/24/05 C. MOORE 1043884 D RELEASE –M01 07/24/06 C. MOORE

1054334 E RELEASE -005 & -006 12/19/06 C. MOORE

APPROVALS DATE

DRAWN R. HUPFAUER 03/23/04

CHECKED J. WARREN 03/23/04

DSGN ENGR R. HUPFAUER 03/24/04

ENG W. GIBBS 03/24/04

HP RESTRICTED

THIS DOCUMENT AND ANY ASSOCIATED DATA CONTAIN RESTRICTED INFORMATION THAT IS HEWLETT-PACKARD (HP) PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY HP.

MFG

PCA, 1394 3 PORT, LOW PROFILE

QA

LEGAL DRAWING NO. REV

UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES [MILLIMETERS]. TOLERANCES ARE:

FRACTIONS DECIMALS ANGLES AGENCY N. BOTELLO 03/24/04

SIZE

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± 1/32 .XX ± .02 [0.5] ±1°

.XXX ± .010 [0.25] DO NOT SCALE DRAWING SUPPLEMENTS: EF,PDF SHEET 1 OF 28

SIZE DRAWING NO. REV

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DRAWN SCALE 1/1 SHEET 2 OF 28

TABLE OF CONTENTS

1. SCOPE............................................................................................................................................................ 4

2. SPARES PART NUMBER.............................................................................................................................. 4

3. REFERENCE DOCUMENTS.......................................................................................................................... 4

3.1 APPLICABLE DOCUMENTS....................................................................................................................... 4 3.2 ORDER OF PRECEDENCE......................................................................................................................... 7

4. FUNCTIONAL SPECIFICATION OVERVIEW................................................................................................ 7

4.1 FEATURES................................................................................................................................................... 7 4.1.1 Link 7 4.1.2 Physical Layer Controller (PHY) ................................................................................................................ 8 4.1.3 Connectors................................................................................................................................................. 8 4.1.4 Board.......................................................................................................................................................... 8

4.2 BLOCK DIAGRAM ....................................................................................................................................... 9 4.2.1 IEEE-1394 Connector .............................................................................................................................. 10 4.2.2 Internal Connector.................................................................................................................................... 11 4.2.3 Power Connector ..................................................................................................................................... 11

5. ELECTRICAL REQUIREMENTS ................................................................................................................. 12

5.1 PCI CONNECTOR...................................................................................................................................... 12 5.2 IEEE-1394 CONNECTORS........................................................................................................................ 13 5.3 CRITICAL MEASUREMENTS ................................................................................................................... 13 5.4 POWER CONSUMPTION .......................................................................................................................... 13

6. MECHANICAL SPECIFICATIONS............................................................................................................... 13

7. PRODUCT SAFETY AND EMC REQUIREMENTS AND APPROVALS..................................................... 16

7.1 EMC REGULATORY REQUIREMENTS AND APPROVALS ................................................................... 17 7.2 CE MARK REQUIREMENTS ..................................................................................................................... 18 7.3 AGENCY ACCEPTANCE TESTING.......................................................................................................... 19 7.4 APPLICABLE COMPONENT APPROVALS............................................................................................. 19

7.4.1 Printed Wiring Boards .............................................................................................................................. 19 7.4.2 Connectors............................................................................................................................................... 19 7.4.3 Plastic Parts ............................................................................................................................................. 19

7.5 ENGINEERING CHANGE CONTROL ....................................................................................................... 19

8. ENVIRONMENTAL REQUIREMENTS......................................................................................................... 20

8.1 OPERATIONAL ENVIRONMENTAL EXTREMES AND VOLTAGE MARGIN ......................................... 20 8.2 STORAGE ENVIRONMENTAL EXTREMES............................................................................................. 20 8.3 SHOCK ....................................................................................................................................................... 21

8.3.1 Operating ................................................................................................................................................. 21 8.3.2 Non-operating .......................................................................................................................................... 21

8.4 VIBRATION ................................................................................................................................................ 21 8.4.1 Operating ................................................................................................................................................. 21 8.4.2 Non-operating .......................................................................................................................................... 22

8.5 ALTITUDE .................................................................................................................................................. 22 8.6 ELECTROSTATIC DISCHARGE (ESD) .................................................................................................... 22

9. WORKMANSHIP STANDARDS................................................................................................................... 22

10. QUALITY AND RELIABILITY ...................................................................................................................... 23

10.1 RESPONSIBILITY FOR QUALITY ............................................................................................................ 23


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10.2 RESPONSIBILITY FOR PRODUCT WARRANTY .................................................................................... 23 10.3 QUALITY ASSURANCE ............................................................................................................................ 23 10.4 CHANGE NOTIFICATION.......................................................................................................................... 23 10.5 SUPPLIER PROCESS CHANGE REQUEST ............................................................................................ 23 10.6 CRITICAL COMPONENTS ........................................................................................................................ 23 10.7 SUSTAINING RELIABILITY PLAN............................................................................................................ 24 10.8 INTERCONNECT ....................................................................................................................................... 24

11. LABELING REQUIREMENTS...................................................................................................................... 24

11.1 UNDERWRITERS LABORATORIES......................................................................................................... 24 11.2 FCC APPROVAL........................................................................................................................................ 24 11.3 CANADIAN EMISSIONS............................................................................................................................ 24 11.4 AUSTRALIA ............................................................................................................................................... 24 11.5 CE MARKING REQUIREMENTS............................................................................................................... 24 11.6 JAPAN........................................................................................................................................................ 24 11.7 KOREA ....................................................................................................................................................... 24 11.8 TAIWAN...................................................................................................................................................... 24 11.9 ROHS (-003, -004, -005 AND -006 ONLY) ................................................................................................ 25 11.10 CHINESE ROHS (-005 AND -006 ONLY) ............................................................................................ 25 11.11 HEWLETT-PACKARD TRACKING NUMBERS .................................................................................. 25 11.12 I/O BRACKET LABELS........................................................................................................................ 25

12. SHIPPING AND PACKAGING ..................................................................................................................... 26

APPENDIX A CRITICAL COMPONENTS FOR -005 AND -006.......................................................................... 27 APPENDIX B EEPROM CONTENTS FOR -005 AND -006................................................................................. 28

LIST OF FIGURES

FIGURE 1 BLOCK DIAGRAM................................................................................................................................ 9 FIGURE 2 IEEE-1394 CONNECTOR ................................................................................................................... 10 FIGURE 3 INTERNAL CONNECTOR .................................................................................................................. 11 FIGURE 4 POWER CONNECTOR....................................................................................................................... 12 FIGURE 5 FRONT ASSEMBLY DRAWING (LOW PROFILE SHOWN) ............................................................. 14 FIGURE 6 BACK ASSEMBLY DRAWING (LOW PROFILE SHOWN) ............................................................... 14 FIGURE 7 FULL PROFILE BRACKET DRAWING.............................................................................................. 15 FIGURE 8 LOW PROFILE BRACKET OUTLINE ................................................................................................ 16 FIGURE 9 BARCODE LABEL.............................................................................................................................. 25

LIST OF TABLES

TABLE 1 REFERENCE TABLE ............................................................................................................................. 4 TABLE 2 3.3V PCI CONNECTOR DEFINITION .................................................................................................... 9 TABLE 3 INTERNAL CONNECTOR PINOUT ..................................................................................................... 11 TABLE 4 POWER CONNECTOR PINOUT.......................................................................................................... 12 TABLE 5 MAXIMUM POWER CONSUMPTION.................................................................................................. 13 TABLE 6 TYPICAL 3.3V POWER CONSUMPTION............................................................................................ 13


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1. SCOPE

This document defines the HP requirements for an IEEE-1394 PRINTED CIRCUIT BOARD (PCB) ASSEMBLY with three ports, which conform to the 1394.a and OHCI 1.0 standards. Two of the ports are external and one is an internal port.

TABLE 1

REFERENCE TABLE

PART NUMBER DESCRIPTION

354614-001 LV23 LLC, LV03A PHY, 2 external ports, 1 internal connector for a front port, low profile PCA with low profile bracket

354614-002 LV23 LLC, LV03A PHY, 2 external ports, 1 internal connector for a front port, low profile PCA with standard height bracket

354614-003 Agere FW323-006, RoHS compliant, 2 external ports, 1 internal connector for a front port, low profile PCA with standard height bracket, Adaptec supplier

354614-004 Agere FW323-006, RoHS compliant, 2 external ports, 1 internal connector for a front port, low profile PCA with low profile bracket, Adaptec supplier

354614-005 Agere FW323-006, RoHS compliant, 2 external ports, 1 internal connector for a front port, low profile PCA with low profile bracket, Belkin Supplier

354614-006 Agere FW323-006, RoHS compliant, 2 external ports, 1 internal connector for a front port, low profile PCA with standard height bracket, Belkin Supplier

354614-M01 PCA, 1394 STNRD PROFILE CARD RoHS-GEHC Stocking part number for GEHC

2. SPARES PART NUMBER

All dash numbers will use the same replacement kit. The spares number for all dashes should be 441448-001.

3. REFERENCE DOCUMENTS

3.1 APPLICABLE DOCUMENTS

The following documents form a part of this specification to the extent specified herein. Unless otherwise indicated, the document is of the issue in effect on the date of invitation to bid or request for proposal. “China RoHS Requirements (HP)”

101484 “Procedure for PCB Assemblies.”

106163 “Specification, Cosmetic Requirements, Labels/Logos.”

106166 “Manual, Workmanship & Quality Standards - Electronic Form.”

106584 “Procedure, Printing, Label Thermal.”

109291 “Test Specification Packaging of HP Named Products.”

109893 “Specification, Raw Material Supplier Packaging/Handling.”

131296 “Specification, Packaging, Finished Goods Distribution.”


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137063 “Specification, Raw Material Supplier, Shipment Bar Codes

137114 “Procedure, Unitized Load Package Test.”

1394 PnP “Plug and Play Design Specification for IEEE 1394, Version 1.0c. March 3, 1999.” Microsoft Corporation. http://www.microsoft.com/whdc/hwdev/resources/specs/1394pnp.mspx

184908 “Label, Retail Carton, CE-text

185411 “Standard, Label, Commodity Tracking, OEM Assembly, New.”

240320 “SPS-BD 1394 3PORT LP W/LP BRKT.”

240321 “SPS-BD 1394 3PORT LP W/BRKT.”

296563 “Cable Assembly, Y-Adapter, HD.”

HX-00011-00 “General Specification for the Environment.”

ACPI “Advanced Configuration and Power Interface Specification, Revision 1.0b. February 2, 1999.” Intel Corporation, Microsoft Corporation, Toshiba Corporation.

ANSI C63.4 - 2003

“American National Standard for Methods of Measurement of Radio. Noise Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz.” American National Standards Institute (ANSI), 2003.

Australian Communications and Media Authority

“Electromagnetic Compatibility Framework - Information for Suppliers – Residential, Commercial and Light Industry”(and amendments), July 1995, URL: http://www.aca.gov.au/standards/emc/emc.htm

VCCI: V-3/2006.04

"Agreement of Voluntary Control Council for Interference by Information Technology Equipment: Normative Annex - Technical Requirements", URL: http://www.vcci.or.jp/ .

Taiwan EMC Law

"Commodity EMC Regulation" (Taiwan EMC Law), Bureau of Standards, Metrology, and Inspection under auspices of the Ministry of Economic Affairs, URL:http://www.bsmi.gov.tw .

Korea MIC Approval

"EMC Registration Regulation", URL: http://www.rrl.go.kr/ .

AV/C “AV/C Digital Interface Command Set General Specification, Version 3.0. April 15, 1999.” 1394 Trade Association.

AV/C Enhancements

“Enhancements to the AV/C General Specification 3.0, Version 1.0. January 26, 1999.” 1394 Trade Association.

C.I.S.P.R. Pub. 22

“Limits and Methods of Measurement or Radio Interference Characteristics of Information Technology Equipment.” International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, 1997.

CFR 47, Part 15

“Unintentional Radiators.” Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Radio Frequency Devices, Subpart B.

EN 55022 “Limits and Methods of Measurement of Radio Interference Characteristics of Information Technology Equipment.” European Committee for Electrotechnical Standardization (CENELEC), 1998.


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EN 55024 “Information technology equipment - Immunity characteristics - Limits and methods of measurement.” European Committee for Electrotechnical Standardization (CENELEC), 1998.

EN60 950 “Safety of Information Technology Equipment Including Electrical Business Equipment.” European Committee for Electrotechnical Standardization (CENELEC), 1993, (IEC 950, Second Edition, including Amendments 1, 2, 3, and 4.)

ICES-003 “Interference-Causing Equipment Standard: Digital Apparatus.” Industry Canada – Issue 4, 2004.

IEC 61000-4 Sections 2 – 6, 11

"Electromagnetic Compatibility (EMC) – Part 4: Testing and measurement techniques." International Electrotechnical Commission (IEC).

IEC 61883 “EC 61883-1, Consumer audio/video equipment – Digital Interface – Part 1: General. February, 1998.” International Electrotechnical Committee (IEC).

IEC 730-1 “Automatic Electrical Controls for Household and Similar Use – Part 1: General Requirements. International Electrotechnical Committee (IEC).

IEC 801 Parts 2-4

“Electromagnetic Compatibility for Industrial Process Measurement and Control Equipment.” International Electrotechnical Committee (IEC).

IEEE P1212r “IEEE Preliminary Standard P1212r-1999.” Institute of Electrical and Electronics Engineers (IEEE), Inc

IEEE-1394 “IEEE Standard 1394-1995, IEEE Standard for a High Performance Serial Bus.” Institute of Electrical and Electronics Engineers (IEEE), Inc.

IEEE-1394.a “IEEE Preliminary Standard P1394-2000, IEEE Standard for a High Performance Serial Bus.” Institute of Electrical and Electronics Engineers (IEEE), Inc.

ISO 13213 “ISO/IEC 13213: 1994 [ANSI/IEEE Std 1212, 1994 Edition], Information technology – Microprocessor systems – Control and Status Registers (CSR) Architecture for microcomputer buses.” International Standards Organization (ISO).

OHCI “1394 Open Host Controller Interface Specification, Revision 1.1. January 6, 2000.” 1394 Open HCI Promoters. http://www.intel.com/technology/1394/download/ohci_11.htm

PCI “PCI Local Bus Specification, Revision 2.1.” June 1, 1995. PCI

PMI “PCI Bus Power Management Interface Specification, Revision 1.1. December 18, 1998.” PCI Special Interest Group (SIG).

Power Part 1 “Power Specification Part 1: Cable Power Distribution, Version 1.0. October 5, 1999.” Energy Conservation Working Group, 1394 Trade Association.

Power Part 2 “Power Specification Part 2: Suspend/Resume Implementation Guidelines, Version 1.0. October 5, 1999.” Energy Conservation Working Group, 1394 Trade Association.

Power Part 3 “Power Specification, Part 3: Power State Management, Version 0.78.” Energy Conservation Working Group, 1394 Trade Association.

RBC “Reduced Block Commands (RBC).” National Committee for Information Technology Standards (NCITS).


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SBP2 “ANSI/NCITS 325-1998, SCSI-3 Serial Bus Protocol 2 (SBP-2). November 20, 1998.” National Committee for Information Technology Standards (NCITS).

SFF 8090 “SCSI Multi-Media Commands - 2 (MMC-2), Version 3.” National Committee for Information Technology Standards (NCITS).

UL 796 “Electrical Metallic Tubing.” Underwriters Laboratories, Inc.

UL 94 “Tests for Flammability of Plastic Materials for Parts in Devices & Appliances.” Underwriters Laboratories, Inc.

FOR -003, -004, -005, AND -006 1394 CARDS ONLY

HX-00011-00 “General Specification for the Environment.”

"RESTRICTIONS ON HAZARDOUS SUBSTANCES DIRECTIVE (ROHS)" Compliance to the latest revision of Hewlett-Packard General Specification for the Environment (GSE) Document number HX-00011-00), including the RoHS Compliance Specification in the GSE, is required. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf FOR -003, -004, -005, AND -006 1394 CARDS ONLY All materials contained within the product (part) must comply with HP's Chinese RoHS Compliance (HP) document.

3.2 ORDER OF PRECEDENCE

In the event of a conflict between this specification and references cited herein, this specification shall take precedence.

NOTE:

Compliance to the latest revision of Hewlett-Packard General Specification for the Environment (GSE) Document number HX-00011-00), including the RoHS Compliance Specification in the GSE, is required. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf

4. FUNCTIONAL SPECIFICATION OVERVIEW

4.1 FEATURES

4.1.1 Link

• OHCI 1.0 and 1.1, IEEE-1394.a, PCI 2.2 compliant link layer controller (LLC)

• Physical write posting of up to three outstanding actions

• PCI burst transfers utilizing 9 KB FIFOs for maximum size asynchronous transfers and tolerance of large host latency

• Isochronous data transfer

• PCI power management compliant

• 3.3V supply


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4.1.2 Physical Layer Controller (PHY)

• 1394.a compliant physical layer controller (PHY) with 3 ports

• 400, 200, and 100 Mbps data rates

• Arbitrated short reset

• Multi-speed concatenation

• Asynchronous arbitration acceleration

• Programmable port disable

• PHY IDs do not increment past 63

• Inactive ports disabled to save power

• PHY does not repeat packets when PCI power is removed (i.e., PC is off)

• Suspend/resume

• Node power class information signaling for system power management

• Cable power presence monitoring

• Separate cable bias and driver termination supply for each port

• Cable connection debounce

• Register bits give software control of contender bit, power class bits, link active bit, and IEEE-1394.a features

• 3.3V supply

4.1.3 Connectors

• Two external 6-pin, powered, IEEE-1394 connectors

• Floppy disk style 4-pin external power connector to provide additional power for port powered devices

• Power to external devices is individually current limited to 1.5 A per port

4.1.4 Board

• 2 KB I2C serial configuration ROM

• Alternate power provider with power class set to 4

• Support for D0 and D3 power modes

• Support for D3 wake-up events

• Low profile PCI card

• Windows Logo with WHQL certification


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4.2 BLOCK DIAGRAM

FIGURE 1 BLOCK DIAGRAM

TABLE 2 3.3V PCI CONNECTOR DEFINITION

Pin Description Pin Description Pin Description Pin Description

A1 TRST# A43 PAR B1 -12V B43 +3.3V A2 +12V A44 AD [15] B2 TCK B44 C/BE [1]# A3 TMS A45 +3.3V B3 Ground B45 AD [14] A4 TDI A46 AD [13] B4 TDO B46 Ground A5 +5V A47 AD [11] B5 +5V B47 AD [12] A6 INTA# A48 Ground B6 +5V B48 AD [10] A7 INTC# A49 AD [09] B7 INTB# B49 M66EN A8 +5V A50 Ground B8 INTD# B50 Ground A9 Reserved A51 Ground B9 PRSNT1# B51 Ground A10 +3.3V (I/O) A52 C/BE [0]# B10 Reserved B52 AD [08] A11 Reserved A53 +3.3V B11 PRSNT2# B53 AD [07] A12 3.3V Key A54 AD [06] B12 3.3V Key B54 +3.3V A13 3.3V Key A55 AD [04] B13 3.3V Key B55 AD [05] A14 3.3V aux A56 Ground B14 Reserved B56 AD [03] A15 RST# A57 AD [02] B15 Ground B57 Ground A16 +3.3V (I/O) A58 AD [00] B16 CLK B58 AD [01] A17 GNT# A59 +3.3V (I/O) B17 Ground B59 +3.3V (I/O)


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TABLE 2 3.3V PCI CONNECTOR DEFINITION

Pin Description Pin Description Pin Description Pin Description

A18 Ground A60 REQ64# B18 REQ# B60 ACK64# A19 PME# A61 +5V B19 +3.3V (I/O) B61 +5V A20 AD [30] A62 +5V B20 AD [31] B62 +5V A21 +3.3V - Key B21 AD [29] - Key A22 AD [28] - Key B22 Ground - Key A23 AD [26] A63 Ground B23 AD [27] B63 Reserved A24 Ground A64 C/BE [7]# B24 AD [25] B64 Ground A25 AD [24] A65 C/BE [5]# B25 +3.3V B65 C/BE [6]# A26 IDSEL A66 +3.3V (I/O) B26 C/BE [3]# B66 C/BE [4]# A27 +3.3V A67 PAR64 B27 AD [23] B67 Ground A28 AD [22] A68 AD [62] B28 Ground B68 AD [63] A29 AD [20] A69 Ground B29 AD [21] B69 AD [61] A30 Ground A70 AD [60] B30 AD [19] B70 +3.3V (I/O) A31 AD [18] A71 AD [58] B31 +3.3V B71 AD [59] A32 AD [16] A72 Ground B32 AD [17] B72 AD [57] A33 +3.3V A73 AD [56] B33 C/BE [2]# B73 Ground A34 FRAME# A74 AD [64] B34 Ground B74 AD [55] A35 Ground A75 +3.3V (I/O) B35 IRDY# B75 AD [53] A36 TRDY# A76 AD [62] B36 +3.3V B76 Ground A37 Ground A77 AD [50] B37 DEVSEL# B77 AD [51] A38 STOP# A78 Ground B38 Ground B78 AD [49] A39 +3.3V A79 AD [48] B39 LOCK# B79 +3.3V (I/O) A40 Reserved A80 AD [46] B40 PERR# B80 AD [47] A41 Reserved A81 Ground B41 +3.3V B81 AD [45] A42 Ground A82 AD [44] B42 SERR# B82 Ground

4.2.1 IEEE-1394 Connector

The IEEE-1394 connectors will be an IEEE-1394 shielded I/O PCB socket which is right angle and upright, with six circuits.

FIGURE 2 IEEE-1394 CONNECTOR


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4.2.2 Internal Connector

The internal connector shall be a right-angle shrouded 2x5 connector equivalent to LPHS-10R-020-3.2-V0001 from Plastron-JAS or 3675P10HUA9 from Leoco. It shall mate with the JWT connector A2542H02-2X5P or the equivalent connector as specified for -002 in the 1394 Cable Document 163607.

FIGURE 3 INTERNAL CONNECTOR

TABLE 3

INTERNAL CONNECTOR PINOUT

PIN SIGNAL NAME DESCRIPTION

1 TPA+

2 TPA-

Twisted pair A - differential data on receive and differential strobe on transmit

3 GND

4 GND Signal ground

5 TPB+

6 TPB-

Twisted pair B - differential data on transmit and differential strobe on receive

7 Power

8 Power Bus power (connected to +12V)

9 Key Key to prevent incorrect connector installation

10 GND (Shield) Cable (shield) ground

4.2.3 Power Connector

The power connector shall be a right-angle four pin “floppy-disk style” keyed header equivalent to WMA-04LG from Leoco or CH254-04R-020 from Plastron-JAS. It shall mate with the connector specified for -003 in the power cable document (Document 296563). The +12V line shall be limited to less than or equal to 4.5 A of current using a method which allows current to flow again, after an over-current event, without user intervention (e.g., a fuse-link).


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FIGURE 4

POWER CONNECTOR

TABLE 4 POWER CONNECTOR PINOUT

PIN SIGNAL NAME DESCRIPTION

1 +5V 5V power supply (not used)

2 GND

3 GND Ground

4 +12V 12V power supply

5. ELECTRICAL REQUIREMENTS

This specification details the electrical requirements for signals entering and exiting the PCB though a connector and accessible to other devices in the host system. All interior signals (i.e., those not accessible to external devices) must meet both the timing and electrical specifications of the components listed in the BOM and AVL. Signal conditioning, through the use of termination resistors, bypass capacitors, filtering, etc., must be applied where needed to insure compliance with these requirements. Hewlett-Packard shall be provided with an electronic copy of the vendor's report which documents that the design is compliant with the timing and electrical specifications of the components listed in the BOM and AVL. Specifically, this report should contain measurements and plots made on boards during the hardware qualification cycle. For all on-board clocks, the report will include plots of the waveforms and at least the following measurements: jitter, duty cycle, rise and fall times, and voltage levels. For all important signals (e.g., control, status, and data lines), the report will include plots of the waveforms and at least the following measurements: rise and fall times, setup and hold margins, and voltage levels. Other important signals will include relevant measurements and plots as needed to verify the design is correct (e.g., jitter on IEEE-1394 outputs). 5.1 PCI CONNECTOR

The PCI interface shall be compliant with the electrical and timing requirements in the PCI specification and all applicable Engineering Change Requests (ECRs). Hewlett-Packard shall be provided with an electronic copy of the vendor's report which documents that the design is compliant with the above specifications in each of the target systems running at the target bus speed. Gold plating on the pins shall be 30 micro inches.


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5.2 IEEE-1394 CONNECTORS

The IEEE-1394 connectors shall be compliant with the electrical and timing requirements in the IEEE-1394.a specification and all applicable Engineering Change Requests (ECRs). The shielding shall be full metal shielding. The contacts shall withstand at least 1500 connector mating cycles. The power contacts must be ably to supply 1.5 A. Hewlett-Packard shall be provided with an electronic copy of the vendor's report which documents that the design is compliant with the above specifications in each of the target systems running at the target bus speeds of 100, 200, and 400 Mb/s.

5.3 CRITICAL MEASUREMENTS

The PHY’s SCLK frequency must be verified to ensure that it is within the ± 100 pmm tolerance specified by the IEEE-1394.a specification. Additionally, time domain reflectometry (TDR) measurements must be made to verify that the board, in conjunction with the specified cables, meets the requirements specified in the IEEE-1394.a specification.

5.4 POWER CONSUMPTION

TABLE 5 MAXIMUM POWER CONSUMPTION

COMPONENT VOLTAGE CURRENT POWER

PCI Adapter 3.3 V 70 mA 231 mW

3 Ports (1.5 A each) 12 V 4.5 A 54 W (18 W per port)

Total 54.231 W

TABLE 6 TYPICAL 3.3V POWER CONSUMPTION

STATE CURRENT POWER

Idle (no devices connected) 40 mA 132 mW

TI digital camera 62 mA 204.6 mW

Sony digital camcorder (DCR-TRV310E) 67 mA 221.1 mW

External 3.5" hard drive 60 mA 198 mW

6. MECHANICAL SPECIFICATIONS

The assembly (circuit board and installed bracket) shall comply with the requirements of the PCI specification and all ECRs. The assembly shall conform to the specifications shown in the following board outline and bracket drawings. Figures 5 and 6 are for reference only.


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FIGURE 5

FRONT ASSEMBLY DRAWING (LOW PROFILE SHOWN)

FIGURE 6 BACK ASSEMBLY DRAWING (LOW PROFILE SHOWN)


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FIGURE 7 FULL PROFILE BRACKET DRAWING


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FIGURE 8

LOW PROFILE BRACKET OUTLINE

7. PRODUCT SAFETY AND EMC REQUIREMENTS AND APPROVALS

The assembly shall be compliant with all safety and EMC standards noted in this Section. The assembly shall comply with all applicable requirements of EN 60 950, IEC 950, 2nd Edition (1991) including Amendments 1 (1992), 2 (1993), 3 (1995), and 4 (1996). The IEEE-1394 connector circuit shall comply with the limits for power-limited circuits in clause 2.11. If a PTC is used to comply with these limits, it must be a UL Recognized Component (XGPU2) and comply with the drift test in IEC 730-1.


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7.1 EMC REGULATORY REQUIREMENTS AND APPROVALS

The information contained in this section was the criteria and approvals anticipated at the time of release of this document. This information may not be current. It is recommended that for current information, the Hewlett-Packard EMC Services group be contacted. Note: This product shall be designed to comply with the below requirements without a ferrite bead on the external cable. All supported data rates shall be used in testing. Based upon the intended marketing and use of the product, the product shall comply with: FCC APPROVAL: All administrative and performance requirements for CFR 47, Part 15 class B using the C.I.S.P.R. Publication 22 limits and the ANSI C63.4 procedures. Radiated emission testing shall be performed at 10 meters. Conducted emission testing shall be performed at the rated line voltages. This device, when tested as part of a system defined by Hewlett Packard, shall not increase the emissive level of that system to a level greater than 3 dB below the C.I.S.P.R. Publication 22 limits. Testing shall be performed using Hewlett Packard labeled/manufactured peripherals. The manufacturer shall obtain a Grant of Equipment Authorization from the FCC. The manufacturer shall supply the appropriate information to the user in the user’s manual. The product label shall contain the FCCID and the appropriate statement. As an alternative, the manufacturer shall perform the Declaration of Conformity authorization [e.g., using NVLAP/A2LA accredited laboratories, etc.]. The manufacturer shall supply the appropriate information to the user in the user’s manual. The manufacturer shall supply the Declaration of Conformity to Hewlett Packard. The product label shall contain the FCC logo. C.I.S.P.R. REQUIREMENTS: All administrative and performance requirements for C.I.S.P.R. Publication 22 Class B. Radiated emission testing shall be performed at 10 meters. Conducted emission testing shall be performed at the rated line voltages. This device, when tested as part of a system defined by Hewlett-Packard, shall not increase the emission level of that system to a level greater than 3 dB below the class B limits. Testing shall be performed using Hewlett-Packard labeled/manufactured peripherals. CANADIAN REQUIREMENTS: All administrative and performance requirements for ICES-003 class B. Radiated emission testing shall be performed at 10 meters. Conducted emission testing shall be performed at the rate line voltages. This device, when tested as part of a system defined by Hewlett-Packard, shall not increase the emission level of that system to a level greater than 3 dB below the C.I.S.P.R. Publication 22 class B limits. Testing shall be performed using Hewlett-Packard labeled/manufactured peripherals. The product label shall contain the Canadian compliance statement [French/English] or alternately an abbreviated statement stating that the assembly complies with Canadian ICES-003, class B. VCCI APPROVAL: All administrative and performance requirements for VCCI class B. Radiated emission testing shall be performed at 10 meters. Conducted emission testing shall be performed at the rate line voltages. This device, when tested as part of a system defined by Hewlett-Packard Corporation, shall not increase the emissive level of that system to a level greater than 3 dB below the VCCI class B limits. Testing shall be performed using Hewlett-Packard Corporation labeled/manufactured peripherals. The manufacturer shall obtain an approved class B Conformity Verification Report from the VCCI, using the appropriate Hewlett-Packard Corporation series designator. The manufacturer shall supply the appropriate information to the user in the user’s manual. The product label shall contain the VCCI logo.


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AUSTRALIAN/NEW ZEALAND REQUIREMENTS: All administrative and performance requirements for the AS/NZS CISPR 22, class B in accordance with the Electromagnetic Compatibility Framework Information for Suppliers document,and URL: http://www.acma.gov.au/. The product label shall contain the C-Tick logo and the manufacturer’s Supplier Code. Use of an agent is required All EMC testing/submissions shall be performed using the most recent operating systems software appropriate for the product (e.g., Windows XP), Hewlett-Packard labeled/manufactured peripherals, the defined test systems (contact EMC Services), and a continuous scrolling 'H' pattern. TAIWAN BSMI APPROVAL: All administrative and performance requirements for the BSMI Taiwan "Commodity EMC Regulation" in accordance with Chinese National Standard (CNS) 13438 (CISPR 22), class B and URL: http://www.bsmi.gov.tw/english/emc/e_emc_.htm. The product label shall contain the BSMI ID number. The BSMI certificate must include both the Hewlett-Packard series number and the marketing name. KOREA MIC APPROVAL: All administrative and performance requirements for the MIC Korea "EMC Registration Regulation" Class B and URL: http://www.rrl.go.kr/ . The product label shall contain the MIC registration number, the MIC certificate applicant name, and, if different, the MIC certificate manufacturer name. All EMC testing/submissions shall be performed using the most recent operating systems software appropriate for the product (e.g., Windows XP), Hewlett-Packard Corporation labeled/manufactured peripherals, the defined test systems (contact EMC Services), and a continuous scrolling 'H' pattern.

7.2 CE MARK REQUIREMENTS

The product shall comply with all of the performance requirements for placing the CE Marking on the product in accordance with the CE Marking Directive (93/68/EEC), the EMC Directive [89/336/EEC] with its amendments, and the Low Voltage Directive [73/23/EEC] with its amendments. Specifically, the product shall comply with the following requirements and associated test parameters:

• Electrical Product Safety requirements ........................................................................ EN 60950

• EMC emissions compliance requirements ..EN 55022:1998 (CISPR 22 - Class B at 10 meters)

• Immunity compliance requirements .......................................................EN 55024 consisting of:

% IEC 61000-4-2: 1995 Electrostatic Discharge ............... [8kV contact, 15kV air discharge]

% IEC 61000-4-3: 1995 RF Fields ............................[3V/m; 80 - 1000 MHz; 80% modulated ....................................................................................................... at distance of 3 meters]

% IEC 61000-4-4: 1995 Elec. Fast Transients ...........[± 2kV on AC power port for 1 minute;

................................................................................................ ±1kV on signal/control lines]

% IEC 61000-4-5: 1995 Surge ............................[± 1kV line to line/±2kV line to earth on AC

.................................................................................power port; ±0.5kV for outdoor cables]

% IEC 61000-4-6:1996 Conducted RF ............................[3V; 0.15-80MHz; 80% modulated]

% IEC 61000-4-11:1994 Voltage variations ....... [>95% dip,0.5 period; 30% dip, 25 periods; ..............................................................................................>95% reduction, 250 periods]


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For the purposes of compliance with EN 55024, the product when tested with the intended Hewlett-Packard system, shall not cause a halt of the operation of software applications operating on the Hewlett-Packard system. Voltages and currents shall remain within the specified parameters contained elsewhere in this document. Test setups shall be in accordance with EN 55022, namely complete systems with all ports appropriately terminated into a peripheral.

• The manufacturer shall place the “CE" marking on the product.

• Manufacturer’s Declaration of Conformity - A DofC accompanied by a complete Technical Data file containing all associated Test Reports shall be provided to the Hewlett-Packard EMC Services and Product Safety groups prior to first revenueable product shipment.

7.3 AGENCY ACCEPTANCE TESTING

Acceptance testing will be performed by Hewlett-Packard. Test samples for acceptance testing will be retained by Hewlett-Packard. Copies of all submissions documents and resulting approvals will be supplied to Hewlett-Packard’s Product Safety and EMC Services representatives prior to first revenue-able product shipment.

7.4 APPLICABLE COMPONENT APPROVALS

Components used in manufacture of the PCA shall comply with the following component requirements.

7.4.1 Printed Wiring Boards

The printed wiring boards shall be an Underwriters Laboratories Inc. “Recognized Component” (ZPMV2) under the category for Printed Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board temperature rating shall be 105°C minimum.

7.4.2 Connectors

The connectors shall be Underwriters Laboratories, Inc. “Recognized” (RTRT2/ECBT2). Any polymeric connector housing shall be molded of plastics rated UL 94V2 or less flammable when tested to UL 94.

7.4.3 Plastic Parts

Plastic parts used in the construction shall be Underwriters Laboratories, Inc. “Recognized” (QMFZ2) rated a minimum of 94V-2 in accordance with the requirements in the UL Standard for Safety, UL 94.

7.5 ENGINEERING CHANGE CONTROL

Revisions to the Approved Vendor List, Bill of Materials, and Engineering Change Orders shall be approved by Hewlett-Packard and the Agency Compliance Group prior to implementation.


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8. ENVIRONMENTAL REQUIREMENTS

The following specifications pertain to the PCA. 8.1 OPERATIONAL ENVIRONMENTAL EXTREMES AND VOLTAGE MARGIN

Purpose: To verify proper operation over specified operating environments and voltage.

Description: Units are operated across environment and voltage ranges while proper operation is verified.

Test Parameters/Conditions:

Power applied to unit operating on system ±5% nominal supply voltage.

Temperature: 10 to 55°C. Temperature change rate at 10°C/min in dry air. Slower change rate is required to maintain non-condensing mode for humidity testing

Humidity: 20 to 80% relative humidity (non-condensing) across the temperature operating range.

8.2 STORAGE ENVIRONMENTAL EXTREMES

Purpose: To verify the PCA’s ability to withstand adverse storage conditions to identify potential environmental failure mechanisms.

Description: PCA’s are exposed to extreme environmental conditions for limited periods of time.


Power not applied to unit.

Temperature: -30 to 60°C. Temperature change rate at 5°C/min in dry air. Slower change rate is required to maintain non-condensing mode for humidity testing.

Humidity: 5 to 90% relative humidity, 38.7°C maximum wet bulb temperature, no condensation allowed.


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8.3 SHOCK

Purpose: To verify the PCA’s ability to withstand shock encountered during use and shipment.

Description: PCA’s are subjected to specified shock pulses. Hewlett-Packard will conduct unit testing with the PCA installed.


The PCA shall be attached by its normal mounting means to a rigid fixture capable of transmitting the shock conditions specified below. The fixture shall not inhibit any elastic or permanent deformation of the PCA that may occur during the shock tests.

8.3.1 Operating

Half Sine Wave Shock: 40 G, 2 ms duration, half sine wave shock in each direction of three mutually perpendicular axes. The number of shock inputs in each direction shall be sufficient so that the device can be operationally exercised. No hard failures are allowed.

8.3.2 Non-operating

8.3.2.1 Half Sine Wave Shock

140 G, 2 ms duration, half sine wave shock in each direction of three mutually perpendicular axes. There shall be one shock input in each direction of three mutually perpendicular axes for a total of six shock inputs.

8.3.2.2 Square Wave Shock

60 G, 180 in/sec velocity change, square wave shock in each direction of three mutually perpendicular axes. There shall be one shock input in each direction of three mutually perpendicular axes for a total of six shock inputs.

8.4 VIBRATION

Purpose: To verify the PCA’s ability to withstand vibrations encountered during use and shipment.

Description: PCA’s are subjected to specified vibration sweeps.


The PCA shall be attached by its normal mounting means to a rigid fixture capable of transmitting the vibration conditions specified below. The fixture shall not inhibit any elastic or permanent deformation of the PCA that many occur during the vibration tests.

8.4.1 Operating

8.4.1.1 Sinusoidal Vibration

0.25 G zero-to-peak, 10 to 500 Hz, 0.25 oct/min in each of three mutually perpendicular axes. The number of sweeps from 10 to 500 to 10 Hz in each axis shall be sufficient so that operation of the board can be fully assessed and dynamic behavior of the board can be understood.


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8.4.1.2 Random Vibration

0.002 G2/Hz, 10 to 500 Hz, nominal 1.0 Grms in each of three mutually perpendicular

axes. The test duration in each axis shall be a minimum of 15 minutes. A longer duration can be used if required to fully assess the operation of the board.

8.4.2 Non-operating

8.4.2.1 Sinusoidal Vibration

0.75 G zero-to-peak, 10 to 500 Hz, 0.5 oct/min. The test duration shall be one sweep from 10 to 500 to 10 Hz in each of three mutually perpendicular axes, such that dynamic behavior of the board can be understood.

8.4.2.2 Random Vibration

0.008 G2/Hz, 10 to 500 Hz, nominal 2.0 Grms in each of three mutually perpendicular

axes. The test duration shall be one hour/axis for a total test duration of three hours.

8.5 ALTITUDE

Purpose: To verify the PCA’s ability to operate at high and low elevations and survive shipping altitudes.

Description: Verify operation over altitude range. Visually monitored while depressurized and functionally tested when finished.


Operating: 0 feet to 10,000 feet (14.7 to 10.1 psia) across the operating temperature range. Altitude change rate is 2000 ft /min.

Non-operating: 0 feet to 30,000 feet (14.7 to 4.4 psia) across the operating temperature range. Altitude change rate is 2000 ft /min.

8.6 ELECTROSTATIC DISCHARGE (ESD)

The specified shielding and grounding will not impair the system operation. The discharge to the product will have no significant effect on the system operation or the operator at up to ± 15KV (air discharge), ± 8KV (direct contact discharge), and ± 8 kV (indirect horizontal and vertical coupling) as per IEC 61000-4-2. Refer to Document 131296.

9. WORKMANSHIP STANDARDS

Electrical Criteria: Electrical assemblies and components shall meet the requirements of Document 106166 or IPC-A-610 Rev. B.


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10. QUALITY AND RELIABILITY

The supplier shall be responsible to assure the PCAs supplied meet all requirements specified herein. Unless otherwise specified in this specification or the applicable purchase order, the supplier shall be responsible for maintaining a statistical process program or performing inspections that are sufficient to assure that the parts supplied meet the requirements specified herein. A review of a supplier’s Quality Systems will be conducted by personnel from Hewlett-Packard in accordance with the guidelines set forth in the Hewlett-Packard Supplier Development Process. If assistance is required in developing or enhancing these methods, Hewlett-Packard may offer assistance at their discretion. Please refer to the ASQC and Document 101484. 10.1 RESPONSIBILITY FOR QUALITY

Unless otherwise specified in the contract or purchase order, the supplier shall be responsible for the quality of the PCA, as it is delivered to Hewlett-Packard. The supplier shall be responsible for having controlled processes to insure product is in compliance with this specification.

10.2 RESPONSIBILITY FOR PRODUCT WARRANTY

The manufacturer of the PCA shall be responsible for the product’s warranty for a period of three (3) years.

10.3 QUALITY ASSURANCE

Hewlett-Packard utilizes the Hewlett-Packard Supplier Development Process as a tool for assessment, continuous material improvement, and supplier development. As needed, suppliers are expected to support activities such as surveys, process and machine capability studies, control plans, and correlation studies as described in the Hewlett-Packard Supplier Development Process Handbook.

10.4 CHANGE NOTIFICATION

Deviations from this specification are not permitted without specific written authorization from Hewlett-Packard. The PCA shall meet all conditions of the specification when subjected to any combination of environmental or electrical extremes unless otherwise specified. Design changes to any portion of the PCA are not permitted without prior written approval of supplier’s Engineering Change Order from Hewlett-Packard Procurement.

10.5 SUPPLIER PROCESS CHANGE REQUEST

Hewlett-Packard shall be notified of all process changes in accordance with FMI007 in the Hewlett-Packard Supplier Development Process Handbook.

10.6 CRITICAL COMPONENTS

If applicable, the supplier and the Hewlett-Packard shall develop a list of the product critical components (See Appendix A). The supplier’s qualification data for these components shall be submitted to Hewlett-Packard Reliability Engineering for approval. No changes in the Approved Vendor List (AVL) or manufacturer’s data sheets shall be permitted without prior written approval from Hewlett-Packard after production release.


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10.7 SUSTAINING RELIABILITY PLAN

The supplier shall perform an Ongoing Reliability Test (ORT) throughout the life of the product. The ORT plan and calculation format shall be reviewed and approved by Hewlett-Packard Reliability Engineering prior to first shipment of production level product. Data and results of this test shall be provided to Hewlett-Packard at regular agreed upon intervals. Hewlett-Packard Reliability Engineering reserves the right, at their discretion, to conduct tests it deems necessary to verify the reliability of the product it receives.

10.8 INTERCONNECT

Connectors must withstand a minimum of 10 insertion cycles and maintain an average insertion force of 8 oz./pin and withdrawal force of 6 oz./pin with all approved sources.

11. LABELING REQUIREMENTS

The following is a summary/restatement of the labeling and marking requirements of the assembly. 11.1 UNDERWRITERS LABORATORIES

The PCB shall contain the PCB supplier's markings in accordance with UL 796 including flammability rating (94 V-0). The supplier's UL file number is available on request.

11.2 FCC APPROVAL

The product label shall contain the FCC ID or, alternatively, FCC logo and the appropriate statement.

11.3 CANADIAN EMISSIONS

The product label shall contain the Canadian compliance statement [French/English] for radiated and conducted emissions or, alternately, an abbreviated statement stating that the assembly complies with Canadian ICES-003, class B.

11.4 AUSTRALIA

The product label shall contain the C-Tick marking and manufacturer’s Supplier Code.

11.5 CE MARKING REQUIREMENTS

The manufacturer shall place the “CE Mark” on the assembly.

11.6 JAPAN

The manufacture shall place the “VCCI Mark” on the assembly.

11.7 KOREA

The manufacture shall place the “MIC Mark” on the assembly as well as the MIC registration number, the MIC certificate applicant name, and, if different, the MIC certificate manufacturer name.

11.8 TAIWAN

The manufacturer shall place the “BSMI Mark” on the assembly as well as the BSMI ID number.


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11.9 ROHS (-003, -004, -005 AND -006 ONLY)

The product label shall contain the RoHS mark.

11.10 CHINESE ROHS (-005 AND -006 ONLY)

The product label shall contain the EPUP logo. The EPUP number should be 10.

11.11 HEWLETT-PACKARD TRACKING NUMBERS

The manufacturer shall label the assembly with the Hewlett-Packard part number, and spares part number in addition to the requirements of Document 185411.

FIGURE 9 BARCODE LABEL

The figure above is meant as an example only to explain the numbering on the CT label.

DESCRIPTION OF BARCODE LABEL NUMBERS

LABEL ID DESCRIPTION

C Hewlett-Packard commodity code (P for PCBA)

AAAA Assembly code (4597)

RR Revision level (2 alphanumeric digits, base 36, between 01 and ZZ)

SS Supplier/site of manufacture code

WW Week/year of manufacture

XXX Unique sequence identifier (3 alphanumeric digits, base 36, between 001 and ZZZ, which is reset to 0 each week)

11.12 I/O BRACKET LABELS

The I/O bracket will not have labels or icons stamped into the metal to identify the function of each I/O connector.


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12. SHIPPING AND PACKAGING

Packaging shall be sufficient to protect the product against loss or damage during shipment from the manufacturer to the destination. The shipping, packaging, (refer to Documents 109291 and 137114) and labeling shall meet the requirements of Document 109893. Documents 106163, 106584, 137063, and 185411 define the preferred shipping label requirements. The method of shipment shall be agreed upon between sender and recipient. The product shall be clearly identified and packed according to prevailing regulations. It is the responsibility of the shipper to take all reasonable precautions to ensure the product arrives undamaged and on time. Each card is to be packed completely in an ESD bag and closed with adhesive tape. Boards are to be shipped in a bulk pack of 50 (-005 and -006) or 60 (-001 to -004) cards. The bulk pack box is 605 mm by 578 mm by 182 mm. Bulk pack boxes are to be placed on EURO-Palette 0.8 m by 1.2 m and should not be stacked higher than 2 m.


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APPENDIX A CRITICAL COMPONENTS FOR -005 AND -006

Component Reference Designator(s) Approved Parts

1394a chip U1 Agere FW323 chip revision 06

Crystal Y1 MEC 1YCS-24M5760B04900

Kingstate 1YCS-24M5760B04900

Chenmoun 1YCS-24M5760B04900

PCB Liger 1PCB-FWA2010HPX110

eeProm code Must contain the contents as indicated in Appendix B

500mA fuse F4 Kingwell 1FUS-1812X0A501600

Wayon(Obitte) 1FUS-1812X0A501600

1.5A fuse F1, F2, F3 Kingwell 1FPS-R18121A501200

Arlitech 1FPS-R18121A501200

1A diode D1 Kinmen 1DSK-IN5819SXXPD00

5A diode D2 Kinmen 1DSK-B540CXXXXXX00

Brackets Kuangying 12PB-WFA6016PC00B0

Kuangying 12PB-WFA6017PC00B0


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APPENDIX B EEPROM CONTENTS FOR -005 AND -006

The eeProm contents should be as follows. The X indicates a bit that may differ, either due to being part of the unique ID for the card, or as part of the checksum. 0000. 99171505 0c180100 73700000 73701c00 0010. 20000000 02a00000 05bd3000 XXXXXXXX 0020. 00000000 00000000 0000027e 00000000 0030. 00000000 0000XXff ffffffff ffffffff 0040. ffffffff ffffffff ffffffff ffffffff 0050. ffffffff ffffffff ffffffff ffffffff 0060. ffffffff