application requirements and developments for cte · pdf fileapplication requirements and...

© Copyright 2014 DS&A LLC

Application Requirements and Developments for CTE-Matched Thermal Core Printed Circuit Boards

David L. Saums, Principal DS&A LLC, Amesbury MA USA

[email protected]

Robert A. Hay, VP Business Development MMCC LLCC, Waltham MA USA

Subsidiary of Parker Hannifin Corporation [email protected]

CIPS Conference 2014 Nürnberg, Germany 25-27 February 2014

Purpose

The purpose of this presentation is to present:

• A brief summary of manufacturing process and product development data prepared to date for new thermal core materials for high-reliability CTE-matched PCBs.

• Present initial thermal conductivity test data for completed thermal core PCBs.

• Indicate current and future cost targets.

• Describe potential applications for high-reliability CTE-matched thermal core PCBs.

CIPS Conference 25-27 February 2014 Nürnberg, Germany

Development for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability RF Systems


Introduction

All finished PCBs shown in this presentation were fabricated by TTM Technologies (Stafford Springs CT USA):

TTM is the lead PCB fabrication partner for thermal core materials evaluation described in this presentation.

Lockheed Martin has been the development lead OEM for the PCB designs shown.

All PCBs shown were manufactured per IPC 6012 and related industry standard processes.

NSWC (Navy Surface Weapons Center Crane) has also evaluated PCB fabrication and processes utilizing these copper-graphite thermal core materials, to assist in commercialization.

Contact MMCC LLC or DS&A LLC for information regarding the copper-graphite composite core materials described in this presentation.

Thermal composite core PCB material concepts discussed in this presentation are currently manufactured by TTM Technologies (Stafford Springs CT USA) and Cirexx Inc. (Santa Clara CA USA).

Manufacturers who may be interested in developing PCB designs utilizing CTE-matched, high-performance thermal core materials are encouraged to inquire.




Goals – Thermal Core PCB Development for Thermal Management and Reliability

• Power semiconductor electronics packaging improvements needed



Module Packaging Improvements and Needed Development Materials and Components

Packaging and thermal materials capable of higher temperature operation

Low-temperature joining techniques

Transition to improved wirebonding techniques (e.g., wedgebonding)

Transition to monolithic module metals (e.g., copper)

Transition from aluminum wire to aluminum ribbon bonding

Higher thermal conductivity CTE-matched baseplate and PCB materials

Double-sided liquid cooling package developments



• Power semiconductor electronics packaging improvements needed



Module Packaging Improvements and Needed Development Materials and Components

Packaging and thermal materials capable of higher temperature operation

Low-temperature joining techniques

Transition to improved wirebonding techniques (e.g., wedgebonding)

Transition to monolithic module metals (e.g., copper)

Transition from aluminum wire to aluminum ribbon bonding

Baseplate and PCB materials with higher thermal conductivity and CTE-matching

Double-sided liquid cooling package developments



Goals for development programs for PCBs – What is needed for thermal control within PCBs?

• Mixed-mode PCBs capable of handling multiple types of semiconductor device types:

RF power amplifiers (Si, GaAs, GaN, SiC), to handle higher heat fluxes, higher frequency operation, and sensitivity to peak operating temperatures

Power components (Si, SiC)

Logic and mixed digital/analog/RF devices on common substrate

• Reduce weight for advanced mulitilayer PCBs requiring thermal cores by eliminating copper.

• Improve CTE matching capabilities for:

Semiconductor materials with differing CTE values (Si, SiC, GaAs, GaN) for direct die attach;

Improved high heat flux packaging materials, such as copper-graphite device baseplates

• Improve thermal performance for RF, power, and IC devices at elevated temperatures:

Prevent increased gate leakage

Prevent RF performance degradation.

Allow use of state-of-the-art device technologies with increased density packaging

For RF devices, meet signal integrity requirements

• Identify suitable soldering and direct die attach joining materials and processes to maximize the value of exposed CTE-matched high thermal-conductivity thermal core PCBs.





Goals for development programs for thermal control within PCBs:

1. Evaluate alternative materials which could replace heavy copper core layers for PCBs.

2. Develop manufacturing process to yield “drop-in-place” thermal core formats for PCB fabrication, per IPC 6012(C) and related standards:

Dimensional requirements (X-Y)*

Thickness requirements – interim and final – are critical to successful development

3. Fabricate prototype thermal core PCBs for performance testing and analysis:

Feature capabilities (through-holes, blinds, compatibility with PCB dielectrics)

Flatness

Metallization

Potential for warpage control (due to moisture absorption) in handling and storage of core materials and subsequent PCB fabrication processing.

Potential for actual PCB weight reduction versus current copper core PCBs.

4. Develop PCB thermal performance comparative models and test data to examine:

Calculated Effective Thermal Conductivity values

Empirical Effective Thermal Conductivity values



Notes: *Industry requirements determined by existing PCB fabrication process equipment. IPC 6012(C) ) and associated standards are published by IPC, Bannockburn IL USA. Website: www.ipc.org



Goals for development programs for thermal control within multilayer PCBs:

5. Test and evaluate electrical and thermal performance:

Thermal and CTE matching characteristics

RF performance for attached RF devices

Solder attach and low-ignition voltage solder alternatives (such as Nanofoil®) as joining materials and processes for high heat flux device attachment.

6. Evaluate cost:

Matching existing standardized PCB fabrication processes is a major cost driver.*

Identify potential cost reduction targets and methods to achieve this.



Notes: *Industry requirements determined by existing standards for PCB fabrication equipment and processes. Nanofoil is a registered mark of Indium Corporation of America.


CTE-Matched Thermal Core PCB Development Materials

Previous industry presentations describe the need for various thermal core materials for PCBs, for existing types of core materials then available. Example:

• “Printed Circuit Board Technologies for Thermal Management” (3 February 2010) -- O. Belnoue, Technical Manager, BREE Industries and P.E. Goutorbe, Technical Manager, CIRE IMAPS France 5th European Thermal and Micropackaging Workshop (La Rochelle, France).





How can we improve on what has already been available?

• New materials must offer:

Reduced weight – critical for aerospace applications

Higher thermal conductivity – X-Y orientation for thermal conduction to card edges

Higher thermal conductivity – Z axis, to create near-isotropic material

Improved CTE matching to selected semiconductor and packaging materials

Reduced thickness

Adapt directly to existing printed circuit board manufacturing processes*

Minimized or eliminated warpage.



Note: *Industry requirements determined by existing standards for PCB fabrication equipment and processes.



How can we improve on what has previously been available?

• MMCC is now producing copper-graphite composite thermal core materials in sheet form:

Available panel thicknesses (thickness to be specified by customer):

Meets standard PCB processes for electrolytic copper plating and drilling

Meets industry requirements for multilayer PCB manufacturing, for complex PCBs

Production thermal core PCB products have been qualified by a major defense electronics manufacturer.

• Manufacturing development process was first described by MMCC LLC at the IMAPS Advanced Technology Workshop on Thermal Management 2011 (Palo Alto CA USA, Nov. 7-9, 2011).



Note: *Industry requirements determined by existing standards for PCB fabrication equipment and processes.

Material Standard Panel Dimensions (X-Y) Panel Thickness (Z)

Cu-MetGraf™ 7-300 Copper-graphite composite sheet

30.5cm x 45.7cm (12.0” x 18.0”)*

0.25mm (0.010”)

0.50mm (0.020”)

1.02mm (0.040”)



Development of new manufacturing processes enabling new thermal core materials:

• See reference 3 (A. Pergande et al., Lockheed Martin) for original source material for initial material selections.



Sources: Lockheed Martin (Orlando FL USA); MMCC LLC (Waltham MA USA)

Material Thermal Conductivity

(W/mK) CTE

(ppm/°C)

MMCC Cu-MetGraf™ 7-300 X-Y: 285-300

Z: 210 X-Y: 7.0 Z: 16.0

Epoxy ~0.5 ~55

Graphite/Epoxy (+0.5 oz. Cu each side) XY: 175

Z: ~1 XY: 4.0 – 6.5

Z: ~55

OFHC Copper 390 17


CTE-Matched Thermal Core PCB Development Materials: Balanced PCB Stack


• Described by MMCC LLC (Waltham MA) in IMAPS ATW Thermal 2011

• Example of a balanced thermal core PCB materials stack:

• Overall PCB thickness: 2.31mm (0.091”)



1 Top 1 oz

.0 10 C ore ( N elco - 2 9 )

2 1 oz

Prepreg 3 - 10 8 0 ( N elco - 2 9 )

M et graf M at erial

Prepreg 3 - 10 8 0 ( N elco - 2 9 )

3 1 oz

.0 10 C ore ( N elco - 2 9 )

4 B ot t om 1 oz

Cu-MetGraf 7-300 copper-graphite composite layer

Note: *Industry requirements determined by existing PCB fabrication process equipment. Nelco® is a registered mark of Park Electrochemical Corporation (Melviille NY USA). MetGraf™ and Cu-MetGraf™ are trademarks of MMCC LLC (Waltham MA USA). Source: Courtesy of TTM Technologies (Stafford Springs CT USA)

0.25mm (0.010”)

0.25mm (0.010”)


CTE-Matched Thermal Core PCB Development Materials: Balanced PCB Stack


• Development PCB fabrication and analysis by TTM included drilling, plasma etch, other processes to prove out PCB industry standard production process methods.

Process step and analysis: Drill 0.90mm (0.0354”) and 0.25mm (0.0098”) diameter holes

• Balanced PCB stack

• PCB development core materials must meet process requirements of MIL-P-55110 (IPC-6012).



Source: Courtesy of TTM Technologies (Stafford Springs CT USA)

Cu-MetGraf 7-300 (0.51mm/0.0200”) copper-graphite composite layer


CTE-Matched Thermal Core PCB Development Materials – Unbalanced PCB Stack


• Example of an unbalanced 10-layer thermal core PCB materials stack:

• Overall thickness: 3.56mm (0.140”). (Other dimensions shown are in inches.)



Note: *Industry requirements determined by existing PCB fabrication process equipment. Source: Courtesy of TTM Technologies (Stafford Springs CT USA)

1 T o p 1 oz

. 0 1 0 C o r e ( N e l c o - 2 9 )

2 1 oz

P r e p r e g 3 - 1 0 8 0 ( N e l c o - 2 9 )

M e t g r a f M a t e r i a l

P r e p r e g 3 - 1 0 8 0 ( N e l c o - 2 9 )

3 1 oz

. 0 1 0 C o r e ( N e l c o - 2 9 )

4 1 oz

P r e p r e g 2 - 1 0 8 0 ( N e l c o - 2 9 )

5 1 oz

. 0 1 0 C o r e ( N e l c o - 2 9 )

6 1 oz

P r e p r e g 2 - 1 0 8 0 ( N e l c o - 2 9 )

7 1 oz

. 0 1 0 C o r e ( N e l c o - 2 9 )

8 1 oz

P r e p r e g 2 - 1 0 8 0 ( N e l c o - 2 9 )

9 1 oz

. 0 1 0 C o r e ( N e l c o - 2 9 )

10 B o t t o m 1 oz

Cu-MetGraf 7-300 copper-graphite composite layer


CTE-Matched Thermal Core PCB Development Materials – Unbalanced PCB Stack


• Fabrication example of this unbalanced 10-layer thermal core PCB materials stack:

• Overall PCB thickness: 3.56mm (0.140”)

• In this test board developed for process evaluation, excessive warpage from the unbalanced stack prevented drilling

• This is exactly as expected with a heavily unbalanced materials stack, as is also true with a copper thermal control layer.



Source: Courtesy of TTM Technologies (Stafford Springs CT USA)

Cu-MetGraf 7-300 (0.51mm/0.0200”) copper-graphite composite layer


Source: TTM Technologies, October 2012

Modeled Data – Effective Thermal Conductivity



Cu-MetGraf™ 7-300 (0.51mm/0.020”)

Stablcor™ ST325-EP387 (2.05mm/0.0800”)


Source: DS&A LLC, October 2012

Modeled Data – Effective Thermal Conductivity

Data model:

• Model constructed per conductivity and thickness values for material stack through entire thermal core PCB.

• Modeled results for overall PCB effective thermal conductivity:

87.5 W/mK

(Identical PCB materials stack to test samples)



Cu- MetGraf™ 7-300 (0.51mm/0.0200”)

Stablcor™ ST325-EP387 (2.03mm/0.0800”)


Thermal conductivity test fixture and sample construction:

Empirical results - effective thermal conductivity:

• Average thermal conductivity test value for fabricated thermal core PCB samples: 89 W/mK;

• Calculated effective thermal conductivity for Layer 2 (Cu-MetGraf 7-300): ~290 W/mK.



Note: Error Bars: + 1 standard deviation. (Inner and outer insulation for test fixture removed for photograph.) Data source: Rockwell Collins Inc., Advanced Technology Center October 29, 2012

Empirical Data – Effective Thermal Conductivity


Note: Error Bars: + 1 standard deviation. Note: *Multilayer PCB; single thermal core layer is MMCC Cu-MetGraf-7 Core (0.51mm/0.020”); one additional layer for warpage control of Stablcor® ST325-EP387 (2.0mm/0.080” thickness). Data source: Rockwell Collins Inc., October 29, 2012

Empirical Data – Effective Thermal Conductivity



OFHC Copper Thermal Core PCB (Cu-MetGraf™7-300 Core*)

Aluminum

Test Material

effe

ctiv

e T

he

rmal

Co

nd

uct

ivit

y (W

/mK

)


Average thermal conductivity results, thermal core PCB structure:

• Modeled effective value (PCB): 87.5W/mK

• Calculated value from empirical data (PCB): 89W/mK

• Close agreement of calculated test value to modeled value for average value.

Calculation of effective thermal conductivity for Cu-MetGraf™-7 thermal core:

• Overall thermal conductivity test value for fabricated thermal core PCB samples: 89 W/mK;

• Calculated effective thermal conductivity for Layer 2 (Cu-MetGraf 7-300): ~290 W/mK.

Calculated as inverse of Layer 2 thickness to overall thickness.

Good agreement with MMCC test data for Cu-MetGraf 7-300 X-Y thermal conductivity:



Data sources: (1) Rockwell Collins Inc., October 29, 2012 (2) MMCC LLC, December 2010 (3) Lockheed Martin, March 6, 2011

Empirical Data vs. Modeled Data – Effective Thermal Conductivity

Effective Thermal Conductivity

Thermal Conductivity (W/mK)

Calculated Data, OEM Test(1) ~290

Vendor Data, MMCC Test (X-Y)(2) 285-300

Test Data, OEM Test(3) 287


Applications




Composite Core Materials Availability

• Cu-MetGraf-7 graphite composite core materials meet European Union legislative requirements.

• Cu-MetGraf-7 materials are not ITAR-restricted.

• Cu-MetGraf-7 production materials can be quoted for pricing and delivery for evaluation purposes.



Note: Cu-MetGraf™ is a trademark of MMCC LLC, Waltham MA USA


Applications – High Heat Fluxes



Development of thermal core PCBs of the types described are intended to provide:

• Specific CTE values for mounting RF and power semiconductor devices

Silicon

Silicon carbide

Gallium arsenide

Gallium nitride

• High in-plane (X-Y) and through-plane (Z) thermal conductivity to mount and dissipate heat loads from these RF and power semiconductor devices

High heat fluxes

Critical reliability requirements for system operation

Increasingly miniaturized component mounting and thermal conduction footprints

• Reductions in PCB weight and volume, critical for airborne, space, and manpack systems.

• Reductions in semiconductor material packaging stackups by eliminating individual materials.

• Higher frequency operation of RF devices requires capability to handle higher heat fluxes.

• Semiconductor materials such as GaN are sensitive to higher temperatures and operating peak temperatures are critical.


Applications – CTE Matching and Weight Reduction: What Has Been Achieved?



Weight reduction can be accomplished by:

• Removing copper layers that are used now as thermal cores in high-reliability PCBs

• Replacing copper layers with CTE-matched, high thermal conductivity Cu-MetGraf-7 composite cores having higher conductivity values than existing alternative PCB materials.

• Alternating copper-graphite composites such as those described with existing low-weight, lower-cost materials such as Stablcor™ ST325, to provide a balanced PCB stackup.

• Eliminating traditional transmit/receive module metal packaging to

Remove metal components (Cu, CuMo, CuW, Kovar™) from these MMIC and other RF devices, to reduce cost and weight.

Eliminate thermal interfaces to minimize the conduction path.

• Testing and implementing newer material joining processes for direct die attach and package attach, such as NanoFoil™ and other low-temperature soldering processes.

Note: Stablcor® is a registered mark of Stablcor Technology Inc.; Nanofoil™ is a trademark of Indium Corporation of America.


Applications – Practicality



Copper-graphite composites described:

• Commercial manufacturing processes are in place at one commercial PCB manufacturer and one US Navy PCB development and evaluation facility (NSWC Crane).

• Cu-MetGraf-7 cores are easily machinable with standard CNC machining and tool heads.

• Metallization of exposed surface is straight-forward with standard processes.

• Thermal core PCB manufacturing process proven out at one major military/aero PCB manufacturing company:

Production “recipe” is in place and seven PCB design programs are underway

Further thinning of composite core materials (to 0.010” sheet thickness) is in development

Cu-graphite composite sheets can be machined, drilled, and processed in any manner that thick copper sheet can be for PCB applications.

• Prototype thermal core PCBs have been designed, manufactured, and built into prototype electronic systems for seven military aerospace programs.

• Test flights of prototype missile systems are underway.

• A cost-reduction program for manufacturing of Cu-MetGraf-7 sheet cores is in progress.



Market Requirements -- Constraining Core Thermal Materials for PCBs



Parameter or Property Goal or Requirement

CTE Selectable, Lower value range appropriate for SiC, GaN

Packaged or bare die

Thermal Conductivity Relatively high versus existing CTE-matched materials

Requirement: > 250 W/mK Isotropic or near-isotropic if possible

Density Reduced versus existing CTE-matched materials

Requirement: 30+% reduction

Young’s Modulus Relatively stiff, with reduced or no warpage in fabricated PCB

Fabrication Demonstrated compatibility with standard PCB fabrication processes (per IPC)

“Drop-in-place” replacement of heavy copper layer Suitable for microdrilling, microvia processes

Manufactured Panel Size Requirement: 30.5cm x 45.7cm (minimum)

Manufactured Panel Thickness Initial requirement: 0.50mm (maximum)

Stretch requirement: 0.25mm

Manufactured Cost Reducible with future manufacturing process cost improvement program

Availability Suitable for IPC-standard PCB fabrication facilities globally

Not subject to legislative restrictions


Solution: Constraining Core Thermal Materials for PCBs



Parameter or Property

Goal or Requirement Cu-MetGraf-7

Value

CTE Lower value range, appropriate for SiC, GaN

Packaged or bare die 7.0 ppm/°C

Yes

Thermal Conductivity

Relatively high versus existing CTE-matched materials Requirement: > 250 W/mK

Isotropic or near-isotropic if possible

X-Y: 287 W/mK Z: 225 W/mK Near-isotropic

Density Reduced versus existing CTE-matched materials

Requirement: 30+% reduction 6.0 g/cc

Young’s Modulus Relatively stiff, with reduced or no warpage in fabricated PCB 75.8 GPa

Fabrication Demonstrated compatibility, standard PCB fabrication processes

“Drop-in-place” replacement of heavy copper layer Suitable for microdrilling, microvia processes

Yes Yes Yes

Manufactured Panel Size

Requirement: 30.5cm x 45.7cm (minimum) Yes, demonstrated

Manufactured Panel Thickness

Initial requirement: 0.50mm (maximum)

Stretch requirement: 0.25mm

Yes, completed Yes, completed

Manufactured Cost Reducible with future manufacturing process cost improvement program Yes, now underway

Availability Suitable for IPC-standard PCB fabrication facilities globally

Not subject to legislative restrictions Yes Yes


Result: A single new material to replace heavy copper layer(s) for high-reliability PCBs.

Solution: Constraining Core Thermal Materials for PCBs



Parameter or Property Molybdenum1 Cu-Mo-Cu1 25Cu/50Mo/

25Cu2 20Cu/60 Invar/

20Cu2 Cu-Graphite

(Cu-MetGraf 7-300) Cu1

CTE (ppm/°C)

5.0 6 7.9 X-Y: 6.0 Z: 7.7

7.0 17

Thermal Conductivity (W/mK)

X: 140 Y: 142

170-182 X-Y: 268 Z: N/A

X-Y: 164 Z: 22

X-Y: 287 Z: 225

385

Density (g/cc)

10.2 9.9 - 10.0 9.6 8.5 6.1 8.9

Young’s Modulus (GPa)

330 280 220 135 75.84 120-130

Notes: Constraining core materials for high-reliability PCBs. Sources: 1. Rockwell Collins Inc., USA; 2. Pecht, M., Agarwal, R., McCluskey, F.P., Dishongh, T.J., Javadpour, S., Mahajan, R., Electronic Packaging Materials and Their Properties, CRC Press, 1998. ISBN 0-8493-9625-5.

Applications

• Phased array radars

• Beamforming technologies

• Seekers

• Electronic countermeasures (ECM) and electronic counter-countermeasures (ECCM) and similar jamming systems

• RF modules for direction finding for guided ordnance

• High bandwidth video streaming mixed RF and logic modules for airborne battlefield communications




Acknowledgments

Assistance for the manufacturing and process development activities described in this presentation is gratefully acknowledged:

• Rob Hay, VP Business Development; Mark Ryals, President; Kevin Fennessy, VP Engineering, MMCC LLC (Waltham MA USA)

• Al Pergande, Staff Engineer, Lockheed Martin (Orlando FL USA)

• Janice Rock, Research Engineer, US Army AMRDEC (Redstone Arsenal, Huntsville AL USA)

• John Vesce, Vice President Engineering, TTM Technologies (Stafford Springs CT USA)

• Rockwell Collins Inc. (Cedar Rapids iA USA)

• Naval Surface Weapons Center (NSWC), Crane IN USA

Other contributors:

• Nick Chandler, Executive Scientist (Retired), Advanced Technology Centre, BAE Systems (Chelmsford, UK)

• Ben Velsher, Manager, Advanced Packaging Development (Retired), TriQuint Semiconductor (Dallas TX USA).




References

Hay, R., “Copper MetGraf Composites for Printed Circuit Board Thermal Control,” IMAPS Advanced Technology Workshop on Thermal Management 2011, Palo Alto CA USA, November 7-9, 2011.

IPC 6012(C) “Qualification and Performance Specification for Rigid Printed Circuit Boards,” ISBN 1-580986-36-6, April 2010. Published by IPC, Bannockburn IL USA, www.ipc.org.

Pergande, ., Rock, J., “Advances in Passive PCB Thermal Control,” Proceedings of the 2011 IEEE Aerospace Conference, Big Sky MT USA, March 2011, Manuscript 978-1-4244-7351-9/11.

Saums, D., “Developments in CTE-Matched Thermal Core Printed Circuit Boards,” Electronics Cooling Magazine, June 2011, pp. 10-11.

Saums, D., “Improvements in Thermal Control for High Reliability Printed Circuit Board Development,” Advancing Microelectronics Magazine, International Microelectronics and Packaging Society, Washington DC USA, September-October 2012, pp. 16-20.

Saums, D., Hay, R., Edward, B., Ruzicka, P., “Application of Conduction-Cooled PCBs and Composite Housing Materials in an Aerospace Electronic System”, IMAPS France ATW Thermal and Micropackaging 2014, La Rochelle, France, 4-6 February 2014

Vasoya, K., Burch, C., Roy, D., “Solving Thermal and CTE Mismatch Issues in Printed Circuit Boards and Substrates,” Proceedings, IMAPS Symposium 2005, Philadelphia PA USA, September 25-29, 2005.




Notes

MetGraf™ and Cu-MetGraf™ are trademarks of MMCC LLC, Waltham MA USA Website: www.mmccinc.com

Stablcor® is a registered mark of Stablcor Technology Inc., Huntington Beach CA USA Website: www.stablcor.com

Nelco® is a registered mark of Park Electrochemical Corporation, Melville NY USA Website: www.parkelectro.com

NanoFoil® is a registered mark of Indium Corporation of America, Clinton NY USA Website: www.indium.com

IPC 6012(C) and associated standards are published by IPC, Bannockburn IL USA. Website: www.ipc.org




Notes

DS&A LLC: Consulting firm founded in 2003. Practical market assessment, business strategy development, and product strategy development for electronics thermal management materials and components.

David L. Saums, Principal Thirty-four years of electronics thermal management business development, strategic planning, market assessment, product development management, and technical marketing. IMAPS Fellow (2010)

MMCC LLC: Manufacturing company founded in 1993. Developer and manufacturer of pressure-infiltration cast metal matrix composite materials offering CTE matching, light weight, excellent thermal conductivity for electronics packaging. Subsidiary of Parker Hannifin Company.

Robert A. Hay, Vice President, Business Development




Contact Information



DS&A LLC Chestnut Innovation Center 11 Chestnut Street Amesbury MA 01913 USA David L. Saums, Principal Email: [email protected] Tel: + 1 978 499 4990 Web: www.dsa-thermal.com

Practical and experienced market assessment, business strategy development, and new product strategy development for electronics thermal management materials and components. MMCC LLC Subsidiary of Parker Hannifin Corporation 101 Clematis Ave Waltham MA 02453-7012 USA

Robert A. Hay, VP Business Development Email: [email protected] Tel: +1 781 893 4449 Web: www.mmccinc.com Practical CTE-matched high thermal conductivity net-shape cast aluminum-graphite, copper-graphite, and copper-diamond

components for commercial electronics, mil/aerospace, and medical and industrial electronics systems. © Copyright 2014 DS&A LLC

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