apple a11 application processor€¢ equipment and materials for fan-out packaging 2017 patent...

©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Apple A11 Application ProcessorSecond generation of TSMC’s inFO packagingPACKAGING report by Stéphane ELISABETHFebruary 2018 – version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Apple

o Apple APE Portfolio

o Fan-Out Packaging

o TSMC inFO Technology

o Apple iPhone 8 & X Teardown

o Fan-Out Market

Physical Analysis 22

o Summary of the Physical Analysis 23

o Packaging 25

Package Views, Marking & Dimensions

Package X-Ray

Package RDL Deprocessing

Package Memory: X-Ray view & Opening

Package Opening

Board Cross-Section: Via Frame, PCB, Dimensions

Package Cross-Section: TiV, Adhesive, RDLs

Package Process

Summary of Physical Data

o Land-Side Capacitor 65

Die Views & Dimensions

Die Deprocessing & Delayering

Die Process

Die Cross-Section

Die Process Characteristics

o Application Processor 87

Die Views, Marking & Dimensions

Die Cross-Section

Die Process Characteristics

Physical Comparison 94

o Apple’s APE Series: A9, A10, A11

o APE’s PoP Technology: Standard PoP, MCeP, inFO

Manufacturing Process 98

o APE Die Front-End Process & Fabrication Unit

o Deep Trench Capacitor Die Front-End Process Flow

& Fabrication Unit

o inFO Packaging Process Flow & Fabrication unit

Cost Analysis 117

o Summary of the cost analysis 118

o Yields Explanation & Hypotheses 119

o APE die 122

Wafer & Die Front-End Cost

Preparation Wafer Cost

o LSC die 126

Wafer & Die Front-End Cost

Frond-End cost per Process Steps

o inFO Packaging 131

inFO Wafer Cost

inFO Front-End Cost per Process Steps

Component Cost

Company services 136


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price ofthe Apple A11.

• Comparing the Apple iPhone X and the Apple iPhone 8, the two flagship has different way to integrate the main board. On theiPhone X, the main board is using special PCB technology from AT&S to reduce about 53 % of the main board footprint. AT&S hasmanaged to use two side mounted PCB and a via frame to compact the main board. The APE is located inside the structure underthe DRAM package using PoP technology. This new version comes along with a new land-side decoupling capacitors (LSC)technology.

• The Apple A11 is a wafer-level package using new generation of TSMC’s packaging technology with copper pillar as Through inFOVia (TiV) to replace the well-known Through Molded Via (TMV) technology. Compared to standard PoP technology, Apple still havea head start with the inFO packaging and its innovations: Copper Pillars, Redistribution layer, silicon high density capacitorintegration, …

• In this report, the complete packaging is analyzed from the DRAM memory to the LSC developed by TSMC. The report includes acomplete cost analysis and price estimation of the device based on a detailed description of the packaging. It also features acomplete technology comparison with standard PoP and Shinko’s MCeP PoP packaging used in the market.


Overview / Introduction

Company Profile & Supply Chain o Appleo Apple APE PortFolioo TSMC inFOo Apple 8 & X Teardowno Fan-Out Market

Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Apple iPhone 8 & X Teardown




Physical Analysis o Packagingo Board Cross-Sectiono Package Cross-Sectiono Land-side Capacitoro Application Processor

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Summary of the Physical Analysis





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Package Views & Dimensions





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Package X-Ray View





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Package Overview – RDL #3





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

A11 & Samsung – Package X-Ray





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Board Cross-Section – Via Frame





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Package Cross-Section





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Package Cross-Section – RDLs





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Land-Side Decoupling Capacitor – Die View & Dimensions





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Land-Side Decoupling Capacitor – Die Process





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Land-Side Decoupling Capacitor – Die Cross-Section





Physical Comparison


Cost Analysis

Feedbacks

About System Plus

APE Die Dimensions




Physical Analysis

Physical Comparison o Apple APE’s Serieso APE’s PoP Technology


Cost Analysis

Feedbacks

About System Plus

Package Comparison – Apple‘s APE




Physical Analysis

Physical Comparison

Manufacturing Process Flowo APE Die Front-End Processo Deep Trench Capacitor FE

Processo inFO Packaging Process

Cost Analysis

Feedbacks

About System Plus

Deep Trench Capacitor Front-End Process




Physical Analysis

Physical Comparison

Manufacturing Process Flowo APE Die Front-End Processo Deep Trench Capacitor FE

Processo inFO Packaging Process

Cost Analysis

Feedbacks

About System Plus

Packaging Process




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chain o Yield hypothesiso APE Wafer & Die Costo LSC Wafer & Die Costo inFO Packaging Cost

Feedbacks

About System Plus

inFO Packaging Cost




Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

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Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks


Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks


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apple a11 application processor€¢ equipment and materials for fan-out packaging 2017 patent...

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