apple 3g iphone - techinsights

Apple 3G iPhoneQuad-band GSM/Tri-band W-CDMA with EDGE/HSDPA

Report #11000-080711-BCf

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks,trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Anycost analyses presented in this material are estimates prepared by Portelligent from generally available data. While Portelligent believes that these estimatesreflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore,Portelligent extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

© 2010 by UBM TechInsights - All Rights Reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, orotherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Portelligent, Inc.

Report Contents:

• Detailed external & internal photos• Detailed step-by-step disassembly• Power measurements• Block Diagram• Circuit board & packaging metrics• Complete parts list & component count• Manufacturing cost analysis• Description of most interesting electronic

features & packaging concepts

Product Description:

Weight: 134.8 grams measured(1.8 grams more than spec)

Accompanied by media frenzy, the July 2008 releaseof the Apple 3G iPhone proved to be an event ofworldwide significance. Retaining the sleek glass-faced bar form and touchscreen interface of itspredecessor, the new iPhone builds on anestablished platform by doubling available memoryand adding functionality. Of particular interest is theaddition of W-CDMA/HSDPA capability and AssistedGPS, improvements that propel the 3G iPhone intothe "World Phone" arena. Both the 8GB and 16GBmodels were examined for this report. With theexception of memory capacity, the two areessentially identical. The now-familiar feature set,including orientation-sensitive display, 2.0MPcamera, 802.11b/g WiFi, Bluetooth, music and videoplayer, and games, is again integrated into a highlyintuitive user environment.

© 2010 by UBM TechInsights - All Rights Reserved. Apple 3G iPhone 11000-080711-BCf –

Table of Contents

Page Content Page Content

3 Executive Summary 82 Earpiece/Sensor Board

4 Phone Features 83 Docking Board

5 Product Overview 84 User Interface Board

6 Product Outer Packaging 85 Main Board (IC Identification)

7 Package Contents 92 WiFi/Bluetooth Board (IC Identification)

8 Supporting Materials 93 Earpiece/Sensor Board (IC Identification)

9 AC Adapter 94 Main Board (Die Photos)

12 External Dimensions/Features 115 WiFi/Bluetooth Board (Die Photos)

13 User Interface 117 Main Board (Module Identification)

16 Backlights 118 WiFi/Bluetooth Board (Module Identification)

17 Camera Test Photos 119 Main Board (Module Photos)

28 Battery Removed 121 Main Board (Functional Areas)

29 Battery Module 123 WiFi/Bluetooth Board (Functional Areas)

30 Battery Disassembled (IC Identification) 124 Earpiece/Sensor Board (Functional Areas)

31 Estimated Battery Cost 125 Docking Board (Functional Areas)

32 Power Measurements 126 User Interface Board (Functional Areas)

43 Block Diagram 127 Substrate Data

45 Major Components 132 Main Board Cross-Section

47 Component Weights 133 Integrated Circuit Components

48 Component Arrangement 134 Subsystem IC Components

49 Teardown Photos 135 Modular Components

63 Main Antenna Detail 136 Active Discrete Components

64 GPS/WiFi/BT Antenna Detail 137 Passive Discrete Components

65 Camera Module Details 139 Connectors

66 Camera Module Disassembly (IC Identification) 140 Electronic Assembly Metrics

67 Camera Module Estimated Cost 147 Electronic Costs Breakdown

68 Display Module 148 Vendor IC Cost Distribution

69 Touchscreen/Display Module 149 Non-Electronic Cost Estimate

70 Display Module (IC Identification) 150 Final Assembly Labor Cost Estimate

71 Touchscreen Panel Detail 151 Cost Summary

72 Estimated Display Cost 152 Cost Estimation Process (Overview & Discussion)

73 Main Board 153 Metrics (Overview & Discussion)

79 WiFi/Bluetooth Board

rmckenzie

Cross-Out

© 2010 by UBM TechInsights - All Rights Reserved. Apple 3G iPhone 11000-080711-BCf –

Executive SummaryThe July 11th, 2008 release of Apple's 3G iPhone was greeted worldwide by lines of motivated customers

and the predictable news coverage. By the end of that day, a detailed report of the 8GB 3G iPhone‟sstructure and supply chain was published (see Portelligent “Apple 3G iPhone: Quick Turn Teardown071108”) and the similarities and differences between the new and previous-generation models becameclear. The three major differentiators are the addition of W-CDMA/HSDPA cellular protocols, standaloneGPS, and up to twice the NAND Flash memory of the original design. The flat back metal/plastic shell of the2G design has also been replaced with a plastic-only rear casing which is more contoured, perhaps toimprove RF performance for the device‟s more complex array of radio functions. Another welcome change isthe elimination of the docking cradle, along with a new, highly compact AC adapter. Major similaritiesremain, including the touchscreen user interface, sleek form factor, orientation-sensitive display, and highlyintuitive operating system. For this report, three units were examined: two 8GB units and one 16GB,confirming the use of multiple vendors for the Main PCB, Battery, and Display Module.

Outside the communications platform, semiconductor content of the 3G iPhone is fairly similar to that ofits predecessor, with a central Samsung ARM Processor (Samsung #S5L8900B02) supported by a Package-on-Package (PoP) Samsung 128MB Mobile DDR SDRAM Memory (#K4X1G163PC). For the units weanalyzed, the 8GB model used Toshiba NAND Flash Memory (#TH58NVG6D1D, 8GB), while the 16GB modelcontained a two-TSSOP stacked-package Samsung MLC NAND Flash (#K9MDG08U5M, 16GB total). With theaddition of W-CDMA functionality, the RF section becomes heavily reliant on Infineon. The Digital BasebandProcessor is a two-chip affair (assumed to be the #PMB8878) which combines a legacy #PMB8877 2Gprocessor and a new device for WCDMA functionality. Similarly, the Infineon RF transceiver - assumed tobe the #PMB6952 - combines a 2G and 3G radio chip (#PMB6272/#PMB5701 - both seen previously inPortelligent teardowns) into a single package, Other Infineon silicon in the cellular radio includes the Tri-band HSDPA LNA (#BGA736L16), and Power Management Unit (#PMB6820). TriQuint makes their iPhonedebut with a trio of W-CDMA power amplifiers (#TQM676031, #TQM666032, and #TQM616035), whileSkyworks returns with the Quad-band GSM Power Amplifier (#SKY77340). Infineon is also behind theiPhone's newly added GPS capability, supplying both the A-GPS Baseband Processor (#PMB2525) and theGPS LNA (#BGA615L7). Also of note are upgraded repeat-vendor components in familiar iPhone sockets,such as the Wolfson Audio CODEC (strongly suspected as the #WM8991 based on die mark and uniquepackage) and the 3-axis Accelerometer from STMicroelectronics (#LIS331DL). The touchscreen capability isagain enabled by Broadcom, using the #BCM5974 which first appeared in the iPod Touch and a line driverfrom TI (#CD3239), shrunk in size compared to the similar device found in the 2G iPhone and iPod Touch.National Semiconductor‟s serial Mobile Panel link part remains as the LCD interface. Aptina‟s 2MP CMOSimager and an identical NXP Power Management Unit (#PCF50633?) remain. An upgraded BlueCore6Bluetooth chip and the same Marvell #88W8686 single-chip WiFi solution are co-located on a dense modulemanufactured by Murata, one of the few components found on the back of the Main PCB.

With substantial build quality and use of several new-on-the-market components, estimated hardwarecost-of-goods-sold (COGS) for the 16GB 3G iPhone is $182.89 with $4.55 in supporting materials for the16GB unit bringing total COGS to $187.43. Assuming $15 for 8GB of MLC NAND, a total COGS for the 8GBsister-product of $172.43 is implied with supporting materials. Note that all cost estimates are sensitive toour assumption for NAND flash and to a similar extent, our estimate for the Touchscreen Glass assembly($13.50). This touchscreen is now separate from the LCD panel, an approach first used in the iPod Touch.

With a $199 (8GB) or $299.00 (16GB) price from AT&T (exclusive U.S. agent at the time of thiswriting), cost-of-goods-sold represents about 87% to 63% of the retail price, with higher profits stemmingfrom the 16GB variant. It is widely speculated that the margin here – and then some - belongs to Apple,with AT&T benefiting from the sale of service plans (with an increased data plan fee) but subsidizing theiPhone cost to the consumer. Assuming brisk first-day and early follow-on sales continue withoutinterruption, Apple seems to have (another) potential winner on its hands. Of course one does not have towait for the expected competitors to launch a response - they have already begun to arrive.

Comments about costing?Email us at [email protected]© 2010 by UBM TechInsights - All Rights Reserved. Apple 3G iPhone 11000-080711-BCf –

Phone Features

Cellular Protocols GSM 850/900/1800/1900, WCDMA 850/1900/2100

GeneralBar Format, Internal Antennae, Touchscreen, Display Reorientation, 2.0MPixel Camera, Multiple Languages,

Vibrator Alert

Audio Built-in Speaker, Included Stereo Headset

Data Communications EDGE, HSDPA, Bluetooth 2.0, WiFi 802.11b/g

Email & Messaging Email Client, Attachments, POP and IMAP Support

Entertainment iTunes Interface, Video Player, Music Player, Games

Image Mgmt Photo Geotagging, Picture and Video Index

Internet Access Over WiFi and Cellular Data Protocols

OS & Applications Support Proprietary OS, Downloadable Applications

Personal Info Mgmt Alarm, Calculator,Calendar, Clock, Address Book, Dictionary, PC Sync (Wired)

Security Phone Lock

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AC Adapter

28.01mm

25.64mm

26.20mm


AC Adapter (Internal Components)

Top, Bottom, and Isometric views show two PCBs, each populated on both sides.

Top View

Bottom View

Isometric View


Camera Test Photos (3200 Lux)


Battery Removed

For details of Battery location, see Teardown Photos

Battery found inphone as shown.

Battery found in a second 3G iPhone:Multiple battery vendors were used.

Unlike the soldered-terminal battery of the original 2G iPhone, the 3G modeluses a flex pigtail mated to pressure contacts to affect battery connection.The battery assembly is held to the case floor with an adhesive-backed die-cut plastic frame.


Estimated Battery Cost

Grid = 1cm

ATL

616-0346

3.7

Lithium Polymer

1150

68.63 x 40.72 x 3.72

409.3

21.9

194.3

Cell(s) $3.40

Electronics $0.34

Non-electronics $0.10

Assembly $0.09

Test $0.04

Margin $0.40

$4.37

Pack Size (mm)

Vol. Energy Density (mWHrs/cc)

Battery Pack

Brand

Part Number

Voltage

Pack Weight (grams)

Wt. Energy Density (mWHrs/g)

Est'd

Costs

Estimated Pack Price

Type

Rating (mAHrs)


Game – “Tap Tap” (Flight Mode On)

Power Measurements(Page 6 of 11)

Test Parameters• Display Backlight Setting: ~50%• Audio Setting: ~50%, through built-in speaker• Mobile Network: off• Bluetooth: off• WLAN: off

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 30 60 90 120 150

Time (Seconds)

Pow

er

(Watt

s) 1

2

34

5

6

7

8

1. Navigation from Main Menu toGames menu.

2. Setup of options within game.

3. Game is played and includesbackground music along with sporadic vibrator signals.

4. Game is paused.

5. Play is resumed.

6. Game is paused.

7. Game is ended, followed by navigation to Main Menu.

8. Unit is idle at Main Menu.


Data Connection

Power Measurements(Page 9 of 11)

Test Parameters• Display Backlight Setting: ~50%• Audio Setting: ~50%• Mobile Network: on• Bluetooth: off• WLAN: off

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

0 30 60 90 120 150 180 210

Time (Seconds)

Pow

er

(Watt

s)

1

2

3

4

5

7

68

9

1. Unit idling at Main Menu.

2. Safari is selected; application opens and reloads Google.

3. User enters search criteria, usingtouchscreen keypad.

4. User selects “Go”; search is active.

5. Search results are displayed.

6. A search result is selected; a webpage with graphics, photos, text, and embedded music player loads.

7. Page appears partially loaded; userscrolls displayed content.

8. User selects link to another page;that page loads.

9. Page appears fully loaded.

Source of power drop in the middle of the data loading is notclear. Perhaps a step-down in Power Amplifier level setting?


Estimated block diagram based on observation of this specific product implementation, manufacturer‟sdata sheets where available, and best engineering judgment. Certain details of the interface circuitryare not reflected in this block diagram. Partitioning and connectivity are speculative.

Block Diagram (1 of 2)

29 - Infineon#PMB8878 ?

Digital Baseband ProcessorDie#29.1- Infineon, GSM/EDGE Baseband ProcessorDie#29.2- Infineon, W-CDMA Baseband Processor

33 - Numonyx#PF38F3050M0Y0CE

Multichip MemoryDie#33.1- Intel, NOR Flash Memory - 16MBDie#33.2- Micron, p-SRAM Memory - 8MB

61 - CSR#BC63B239A

Single-Chip Bluetooth

48 - Infineon#PMB2525

A-GPS Baseband Processor + RF Front End

42 - Skyworks#SKY77340

Quad-band GSM/EDGE RF Power AmplifierDie#42.1- Skyworks, Power Amplifier Controller

Die#42.2- Skyworks, Power AmplifierDie#42.3- Skyworks, Power Amplifier

Cellular Antenna

55 - NEC#uPG2158

GaAs SPDT Switch

56 - Murata#Unknown

WiFi Power Amplifier

47 - TriQuint#TQM676031

Band I W-CDMA Power Amplifier w/ Duplexer

Die#47.1- TriQuint, Power AmplifierDie#47.2- TriQuint, Bias Control

Die#47.3- TriQuint, Power Detector


Band II W-CDMA Power Amplifier w/ Duplexer


Die#46.3- TriQuint, Power DetectorDie#46.4- Infineon, BAW FilterDie#46.5- Infineon, BAW Filter


Band V&VI W-CDMA Power Amplifier w/ Duplexer


Die#45.3- TriQuint, Power Detector

Shared Antenna

49 - Infineon#BGA615L7

GPS LNA

To Next Page

3 - Infineon#PMB6820

Power Management Unit


RF TransceiverDie#44.1- Infineon, W-CDMA RF Transceiver

Die#44.2- Infineon, GSM/EDGE RF Transceiver

Murata#6475 ?

Front-End Module

WiFi/Bluetooth Board

57 - Murata#ST2

GaAs SPDT Switch

54 – Unknown#24LJ

2.4GHz LNA ?

6 - Maxim#MAX8836

DC/DC Converter ?

60 - Marvell#88W8686

Single-Chip WiFi


Tri-band HSDPA LNA


Teardown Photos (1 of 14)

Opening the case requires removal of two screws locatedadjacent to the docking connector. Once removed theUpper Enclosure can be pried away from Enclosure Frame,a significant simplification versus the original iPhone.



Touch Panel Connector

LCD Connector

Earpiece/Sensor Assembly Connector

The two halves of the 3G iPhone can beseparated after disconnecting the LCDConnector, Touch Panel Connector, andEarpiece/Sensor Assembly Connector.



Lower assembly shown alone. A single Main Board with two-piece shield spans much of the length of the 3GiPhone. The Power On/Off switch, Ringer On/Off switch, and Headphone Jack are to the right; the SpeakerAssembly, Microphone, and Docking Connector are to the left. The cylindrical vibrator is seen mid-lengthalong the lower edge.

SIM Slot

On/Off Button

Headphone Jack

Vibrator

Speaker Connections

Microphone

Docking Connector

Acoustic Chamber

Ringer On/Off

Main Board

Microphone Connections



A total of 12 small machine screws (!) must be removed to separate Main Board from Lower Enclosure.


Main Board (Side 1 IC Identification)

6 - Maxim#MAX8836

DC/DC Converter ?

7 - Linear Technology#LT3460

Step-up DC/DC Converter

10 - NXP Semiconductor#74AUP2G126

Dual Buffer/Line Driver

12 - NXP Semiconductor#74LVC1G99

Multiple Function Gate

8 - Toko#TK68414AB1

200mA / 1.8V LDO Regulator

9 - NXP Semiconductor#74LVC2G08

Dual 2-input AND Gate

5 - STMicroelectronics#LIS331DL

3-axis Accelerometer & MEMs SensorDie#5.1- STMicro, Accelerometer Signal ProcessorDie#5.2- STMicro, MEMs Sensor - LowerDie#5.3- STMicro, MEMs Sensor - Upper


Tri-band HSDPA LNA

Grid = 1cm

13 - National Semiconductor#LP3986

150mA / 3V:2.8V Dual LDO Voltage Regulator

4 - Linear Technology#LTC4088-2

Battery Charger/USB Controller


Main Board (Side 1 Die Photos)

5 - STMicro#LIS331DL

3-axis Accelerometer & MEMs SensorPkg. Size: 3.01 x 3.01 mm

Note: These die werealso present next toeach other in the#LIS302DL package(shown at right).However, now the dieare stacked in the#LIS331DL.

5.1

5.3

5.2

Grid = 1cm



5.2 - STMicro#CSL10B

MEMs Sensor - LowerDie Size: 2.14 x 1.84 mm

5.3 - STMicro#Unknown

MEMs Sensor - UpperDie Size: 2.12 x 1.81 mm

Grid = 1cm



Digital Baseband ProcessorPkg. Size: 13.00 x 10.00 mm


29.1

29.2

Grid = 1cm


Main BoardArea: 42.17cm²

Substrate Data

93.67mm

53

.69

mm

Grid = 1cm

Assembly

NameManufacturer Core Material Mfg. Technology Layers

Area

(cm²)

Min.

Trace

Pitch

(mm)

Min.

Trace

Width

(mm)

ThruVia

Land Dia

(mm)

ThruVia

Hole Dia

(mm)

BlindVia

Land Dia

(mm)

BlindVia

Hole Dia

(mm)

Thickness

(mm)

Routing

Density

Estimated

Costs

Main Board Compeq FR4 BuildUp 10 42.2 0.20 0.10 0.50 0.25 0.30 0.10 0.6 60.5 3.88$

Substrates


Integrated Circuit Components

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. #Pkg

QtyBrand Name Part Number Pkg Description Form Pin Count

Pitch

(mm)

Length

(mm)

Width

(mm)

Height

(mm)Die Ref # Die Qty Brand Name Part Number Description

Length

(mm)

Width

(mm)Each Total

1 1 Wolfson Microelectronics WM8991 ? Mobile Multimedia CODEC BGA (UF) 65 0.50 5.00 4.99 0.97 1.1 1 Wolfson Microelectronics WM8991 ? Mobile Multimedia CODEC 3.45 3.22 $ 0.970 $ 0.970

2 1 NXP Semiconductor PCF50633 Power Management BGA 89 0.50 6.00 5.99 0.59 2.1 1 NXP Semiconductor PCF50633 Power Management 3.45 3.36 $ 1.520 $ 1.520

3 1 Infineon PMB6820 Cellular Power Management BGA (UF) 81 0.50 5.02 5.00 0.93 3.1 1 Infineon PMB6820 Cellular Power Management 3.71 3.68 $ 1.520 $ 1.520

4 1 Linear Technology LTC4088-2 Battery Charger/USB Controller DFN 14 0.50 3.98 2.98 0.89 4.1 1 Linear Technology LTC4088-2 Battery Charger/USB Controller 1.83 1.47 $ 0.290 $ 0.290

5.1 1 STMicroelectronics V507A Accelerometer Signal Processor 2.14 1.43 $ 0.390 $ 0.390

5.2 1 STMicroelectronics CSL10B MEMs Sensor - Lower 2.14 1.84 $ 0.510 $ 0.510

5.3 1 STMicroelectronics Unknown MEMs Sensor - Upper 2.12 1.81 $ 0.360 $ 0.360

6 1 Maxim MAX8836 DC/DC Converter ? Flip Chip, Solder (UF) 16 0.50 2.08 2.07 0.63 6.1 1 Maxim MAX8836 DC/DC Converter ? 2.07 2.07 $ 0.340 $ 0.340

7 1 Linear Technology LT3460 Step-up DC/DC Converter DFN 6 0.50 1.98 1.98 0.77 7.1 1 Linear Technology LT3460 Step-up DC/DC Converter 0.84 0.77 $ 0.110 $ 0.110

8 1 Toko TK68414AB1 200mA / 1.8V LDO Regulator Flip Chip, Solder (UF) 4 0.50 0.98 0.96 0.60 8.1 1 Toko TK68414AB1 200mA / 1.8V LDO Regulator 0.97 0.96 $ 0.120 $ 0.120

9 2 NXP Semiconductor 74LVC2G08 Dual 2-input AND Gate DFN 8 0.50 1.98 1.05 0.45 9.1 1 NXP Semiconductor 74LVC2G08 Dual 2-input AND Gate 0.62 0.47 $ 0.070 $ 0.140

10 1 NXP Semiconductor 74AUP2G126 Dual Buffer/Line Driver DFN 8 0.50 1.97 1.03 0.47 10.1 1 NXP Semiconductor 74AUP2G126 Dual Buffer/Line Driver 0.55 0.47 $ 0.070 $ 0.070

12 1 NXP Semiconductor 74LVC1G99 Multiple Function Gate DFN 8 0.50 1.98 1.04 0.48 12.1 1 NXP Semiconductor 74LVC1G99 Multiple Function Gate 0.61 0.35 $ 0.060 $ 0.060

13 1 National Semiconductor LP3986 150mA / 3V:2.8V Dual LDO Voltage Regulator Flip Chip, Solder (UF) 8 0.50 1.58 1.57 0.56 13.1 1 National Semiconductor LP3986 150mA / 3V:2.8V Dual LDO Voltage Regulator 1.57 1.57 $ 0.160 $ 0.160

15 1 National Semiconductor LM34902A ? LDO Regulator ? Flip Chip, Solder (UF) 6 0.40 1.22 0.82 0.43 15.1 1 National Semiconductor LM34902A ? LDO Regulator ? 1.22 0.82 $ 0.110 $ 0.110

16 2 ON Semiconductor NUF2441FC Passive Filter w/ ESD Flip Chip, Solder (UF) 6 0.50 1.74 1.25 0.55 16.1 1 ON Semiconductor NUF2441FC Passive Filter w/ ESD 1.73 1.25 $ 0.080 $ 0.160

17 1 Ricoh R1183Z ? 150mA LDO Regulator Flip Chip, Solder 4 0.50 0.78 0.78 0.49 17.1 1 Ricoh R1183Z ? 150mA LDO Regulator 0.78 0.78 $ 0.070 $ 0.070

18 1 NXP Semiconductor 74AUP2G125 Dual Buffer/Line Driver DFN 8 0.50 1.97 1.03 0.47 18.1 1 NXP Semiconductor 74AUP2G125 Dual Buffer/Line Driver 0.55 0.47 $ 0.070 $ 0.070

19 1 Intersil ISL59121 Video Line Driver Flip Chip, Solder (UF) 9 0.50 1.46 1.46 0.39 19.1 1 Intersil ISL59121 Video Line Driver 1.46 1.46 $ 0.160 $ 0.160

21 2 NXP Semiconductor 74LVC1G08 Single 2-input AND Gate DFN (UF) 6 0.35 1.00 1.00 0.43 21.1 1 NXP Semiconductor 74LVC1G08 Single 2-input AND Gate 0.46 0.31 $ 0.050 $ 0.100

22 5 NXP Semiconductor 74LVC2G34 Dual Buffer Gate DFN (UF) 6 0.35 1.00 1.00 0.43 22.1 1 NXP Semiconductor 74LVC2G34 Dual Buffer Gate 0.55 0.45 $ 0.060 $ 0.300

25 1 NXP Semiconductor 74LVC1G79 Single D-type Flip-Flop DFN 6 0.35 1.00 1.00 0.43 25.1 1 NXP Semiconductor 74LVC1G79 Single D-type Flip-Flop 0.47 0.32 $ 0.060 $ 0.060

26 2 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator DFN 6 0.35 1.00 1.00 0.43 26.1 1 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator 0.55 0.41 $ 0.050 $ 0.100

27 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer DFN 6 0.35 1.00 1.00 0.43 27.1 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer 0.46 0.37 $ 0.060 $ 0.060

28 1 NXP Semiconductor 74LVC1G10 Single 3-input NAND Gate DFN 6 0.35 1.00 1.00 0.43 28.1 1 NXP Semiconductor 74LVC1G10 Single 3-input NAND Gate 0.38 0.34 $ 0.050 $ 0.050

29.1 1 Infineon PMB8877 GSM/EDGE Baseband Processor 6.62 6.61 $ 9.350 $ 9.350

29.2 1 Infineon PMB8802 ? W-CDMA Baseband Processor 5.29 5.07 $ 7.550 $ 7.550

30 1 Samsung S5L8900B02 ARM Application Processor BGA (UF) 416 0.50 13.00 12.98 0.50 30.1 1 Samsung S5L8900B02 ARM Application Processor 8.48 8.48 $ 12.850 $ 12.850

31 1 NXP Semiconductor 74LVC1G332 Single 3-input OR Gate DFN 6 0.35 1.00 1.00 0.43 31.1 1 NXP Semiconductor 74LVC1G332 Single 3-input OR Gate 0.38 0.34 $ 0.050 $ 0.050

32 1 TI SN74LVC2G66 Dual Bilateral Analog Switch Flip Chip, Solder (UF) 8 0.50 1.90 0.93 0.43 32.1 1 TI SN74LVC2G66 Dual Bilateral Analog Switch 1.90 0.89 $ 0.120 $ 0.120

33.1 1 Numonyx 28F128FM NOR Flash Memory - 16MB 4.03 3.99 $ 0.900 $ 0.900

33.2 1 Micron P25Z p-SRAM Memory - 8MB 4.97 4.96 $ 1.490 $ 1.490

34 1 Samsung K4X1G163PC Mobile DDR SDRAM Memory - 128MB BGA (UF) 72 0.70 13.00 12.98 0.41 34.1 1 Samsung K4X1G163PC Mobile DDR SDRAM Memory - 128MB 10.36 9.92 $ 3.350 $ 3.350

35 1 Silicon Storage Technology (SST) SST25VF080B Serial Flash Memory - 1MB DFN (UF) 8 1.30 5.99 4.99 0.79 35.1 1 Silicon Storage Technology (SST) SST25VF080B Serial Flash Memory - 1MB 2.95 2.63 $ 0.420 $ 0.420

36 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer DFN (UF) 6 0.35 1.00 1.00 0.43 36.1 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer 0.46 0.37 $ 0.060 $ 0.060

37 1 NXP Semiconductor 74LVC2G04 Dual Inverter DFN (UF) 6 0.35 1.00 1.00 0.43 37.1 1 NXP Semiconductor 74LVC2G04 Dual Inverter 0.54 0.46 $ 0.050 $ 0.050

38 3 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator DFN 6 0.35 1.00 1.00 0.43 38.1 1 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator 0.55 0.41 $ 0.050 $ 0.150

39 1 Broadcom BCM5974 Touchscreen Controller BGA (UF) 57 0.40 4.17 3.95 0.46 39.1 1 Broadcom BCM5974 Touchscreen Controller 3.25 3.16 $ 1.730 $ 1.730

40 1 TI CD3239 Touchscreen Line Driver Flip Chip, Solder (UF) 25 0.40 1.96 1.96 0.29 40.1 1 TI CD3239 Touchscreen Line Driver 1.96 1.96 $ 0.340 $ 0.340

41 1 National Semiconductor LM2512 Mobile Pixel Link Display Interface BGA (UF) 49 0.50 4.03 4.03 0.99 41.1 1 National Semiconductor LM2512 Mobile Pixel Link Display Interface 1.71 1.65 $ 0.640 $ 0.640

42.1 1 Skyworks 31050 Power Amplifier Controller 2.16 1.89 $ 0.320 $ 0.320

42.2 1 Skyworks 63627 Power Amplifier 1.18 0.98 $ 0.330 $ 0.330

42.3 1 Skyworks 63626 Power Amplifier 1.20 0.77 $ 0.290 $ 0.290

RF - Receive 43 1 Infineon BGA736L16 Tri-band HSDPA LNA QFN 16 0.50 2.30 2.30 0.46 43.1 1 Infineon BGA736L16 Tri-band HSDPA LNA 1.13 1.13 $ 0.260 $ 0.260

44.1 1 Infineon PMB5701 W-CDMA RF Transceiver 2.96 2.96 $ 1.880 $ 1.880

44.2 1 Infineon PMB6272 GSM/EDGE RF Transceiver 3.56 2.37 $ 1.500 $ 1.500

45.1 1 TriQuint W1583B Power Amplifier 1.19 1.10 $ 0.620 $ 0.620

45.2 1 TriQuint W1582A Bias Control 0.94 0.55 $ 0.260 $ 0.260

45.3 1 TriQuint W1581A Power Detector 0.67 0.66 $ 0.230 $ 0.230

46.1 1 TriQuint TQM666032 Power Amplifier 1.06 0.93 $ 0.420 $ 0.420


46.3 1 TriQuint W1562A Power Detector 0.69 0.58 $ 0.170 $ 0.170

46.4 1 Infineon N0022 320350 BAW Filter 1.46 0.91 $ 0.170 $ 0.170

46.5 1 Infineon N0023 300340 BAW Filter 1.30 0.73 $ 0.170 $ 0.170

47.1 1 TriQuint W1577A Power Amplifier 1.11 0.96 $ 0.570 $ 0.570


47.3 1 TriQuint W1575B Power Detector 0.69 0.59 $ 0.260 $ 0.260

48 1 Infineon PMB2525 A-GPS Baseband Processor + RF Front End Flip Chip, Solder (UF) 49 0.50 3.75 3.60 0.59 48.1 1 Infineon PMB2525 A-GPS Baseband Processor + RF Front End 3.75 3.60 $ 1.920 $ 1.920

49 1 Infineon BGA615L7 GPS LNA DFN 6 0.50 2.00 1.29 0.48 49.1 1 Infineon BGA615L7 GPS LNA 0.71 0.61 $ 0.120 $ 0.120

50 1 Linear Technology LTC3459 Synchronous Boost Converter DFN 6 0.50 2.98 2.01 0.76 50.1 1 Linear Technology LTC3459 Synchronous Boost Converter 1.44 0.83 $ 0.160 $ 0.160

51 1 NXP Semiconductor 74LVC2G04 Dual Inverter DFN 6 0.35 1.00 1.00 0.43 51.1 1 NXP Semiconductor 74LVC2G04 Dual Inverter 0.54 0.46 $ 0.050 $ 0.050

52 1 Maxim MAX4826 50mA Current-Limit Switch w/ No-Load Flag DFN 6 0.50 1.51 1.03 0.59 52.1 1 Maxim MAX4826 50mA Current-Limit Switch w/ No-Load Flag 0.75 0.73 $ 0.120 $ 0.120

Memory 53 1 Samsung K9MDG08U5M Multichip Memory - 16GB MLC NAND Flash (8GB * 2) TSOP Stacked 2 (UF) 48 0.50 19.98 12.25 1.09 53.1 8 Samsung K9GAG08U0M MLC NAND Flash Memory - 2GB 15.84 10.26 $ 3.860 $ 30.880

54 1 Unknown 24LJ 2.4GHz LNA ? Flip Chip, Solder (UF) 5 0.50 0.67 0.67 0.36 54.1 1 Unknown 24LJ 2.4GHz LNA ? 0.64 0.65 $ 0.080 $ 0.080

55 1 NEC uPG2158 GaAs SPDT Switch DFN (UF) 6 0.35 1.00 1.00 0.37 55.1 1 NEC uPG2158 GaAs SPDT Switch 0.44 0.31 $ 0.120 $ 0.120

56 1 Murata Unknown WiFi Power Amplifier COB (UF) 8 0.50 1.92 1.92 0.43 56.1 1 Murata Unknown WiFi Power Amplifier 0.74 0.73 $ 0.190 $ 0.190

57 1 Murata ST2 SPDT GaAs Switch Flip Chip, Solder (UF) 5 0.50 0.67 0.67 0.36 57.1 1 Murata ST2 SPDT GaAs Switch 0.66 0.65 $ 0.130 $ 0.130

58 1 TI SN74LVC1G02 Single 2-input Positive-NOR Gate Flip Chip, Solder (UF) 5 0.50 1.40 0.90 0.46 58.1 1 TI SN74LVC1G02 Single 2-input Positive-NOR Gate 1.38 0.88 $ 0.050 $ 0.050

59 1 TI SN74AUP1T97 Voltage-Level Translator Flip Chip, Solder (UF) 6 0.50 1.40 0.90 0.46 59.1 1 TI SN74AUP1T97 Voltage-Level Translator 1.39 0.88 $ 0.060 $ 0.060

WiFi 60 1 Marvell Semiconductor 88W8686 Single-Chip 802.11g WLAN Flip Chip, Solder (UF) 67 0.50 4.62 4.08 0.48 60.1 1 Marvell Semiconductor 88W8686 Single-Chip 802.11g WLAN 4.61 4.08 $ 3.220 $ 3.220

BlueTooth 61 1 Cambridge Silicon Radio (CSR) BC63B239A Single-Chip Bluetooth Flip Chip, Solder (UF) 51 0.40 3.46 3.19 0.56 61.1 1 Cambridge Silicon Radio (CSR) BC63B239A Single-Chip Bluetooth 3.46 3.17 $ 2.020 $ 2.020

62 1 Intersil ISL2900x Ambient Light Detector COB (UF) 6 0.65 2.06 1.97 0.75 62.1 1 Intersil ISL2900x Ambient Light Detector 1.26 0.77 $ 0.160 $ 0.160

63 1 Maxim MAX4788 100mA Current-Limit Switch DFN (UF) 6 0.50 1.55 1.00 0.56 63.1 1 Maxim MAX4788 100mA Current-Limit Switch 0.80 0.77 $ 0.120 $ 0.120

68 2084 90 $94.18

LocationFunctional Area

Estimated CostsDie InfoPackage Info

BGA Stacked 2+1 16

Totals

Main Board, Side 2

WiFi/Bluetooth Board, Side 1

LIS331DL 3-axis Accelerometer & MEMs Sensor

Earpiece/Sensor Board, Side 1

5 1 STMicroelectronics

29 1 Infineon

Main Board, Side 1

0.50 3.01 3.01 1.01

PMB8878 ? W-CDMA / GSM Digital Baseband Processor BGA Stacked 2 (UF) 389 0.50 13.00 10.00 1.20

33 1 Numonyx PF38F3050M0Y0CE Multichip Memory - 16MB NOR Flash Memory, 8MB p-SRAM Memory BGA Stacked 2 (UF) 95 0.80 10.02 8.02 1.09

42 1 Skyworks SKY77340 Quad-band GSM/EDGE RF Power Amplifier MCP - 3 Chips 16 1.00 8.00 6.00 1.05

44 1 Infineon PMB6952 ? W-CDMA / GSM RF Transceiver BGA Stacked 2 (UF) 121 0.50 1.10

45 1 TriQuint TQM616035 Band III W-CDMA Power Amplifier MCP - 3 Chips 1.00 7.03 4.01

6.00 6.00

46 1 TriQuint TQM666032

Band I W-CDMA Power Amplifier MCP - 3 Chips

1.15

Band II W-CDMA Power Amplifier MCP - 5 Chips 16 1.00

16

47 1 TriQuint TQM676031 4.01

7.03 4.01 1.15

1.15

Analog

Logic

Memory

Display

RF - Transmit

RF - Shared

16 1.00 7.03

A-GPS

Analog

RF - Shared

Analog


NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Electronic Assembly Metrics

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System: Docking Board 5.6 4 22.3 31.5 31 138 5.6 24.7 4.5 5.1

System: Earpiece/Sensor Board 3.0 2 5.9 19.7 23 54 7.8 18.3 2.3 0.7

System: Main Board 42.2 10 421.7 60.5 843 3801 20.0 90.1 4.5 44.05

System: User Interface Board 6.6 2 13.2 14.4 19 54 2.9 8.2 2.8 0.8

System: WiFi/Bluetooth Board 1.0 6 5.9 104.3 65 279 65.7 281.8 4.3 0.3

Battery Pack: Battery PCB 1.3 2 2.6 31.4 10 38 7.6 28.8 3.8 0.4

Camera Module: Camera Flex 1.6 2 3.3 89.5 2 54 1.2 32.9 27.0 0

Display Module: Display Flex 4.3 2 8.6 209.5 23 695 5.3 161.3 30.2 0.5

System Totals 65.58 30 483.64 1016 5113 15.5 78.0 5.0 51.85

Electronic Assembly Metrics

by Assembly ( Includes Subsystem Assemblies)


Cost Summary

NOTE:An Additional

Cost of$4.55for the

SupportingMaterials(Page 8)

Total Cost Notes:

• Estimated final assembly cost includes labor only.

• Total cost does not include: Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution.

• Assumes fully scaled production.

16GB vs. 8GB Total Cost Notes:

• About $15 estimated cost would come out of the BOM to adjust for the elimination of 8GB of NAND Flash (as of August 2008).

• All other system elements remain constant between the two models.

• About $168 total hardware COGS(exclusive of supporting materials) is implied for the 8GB 3G iPhone version.

$136.53

$23.80

$6.08

$10.21

$4.37

$1.90

182.89$

Total CostElectronic Assemblies

Total

Display(s)

Mechanical (Non-Electronic)

Battery Pack

Final Assembly & Test

Camera(s)

Electronic Assemblies74.7%

MechanicalNon-Electronic

5.6%

Display13.0%

Final Assembly1.0%

Battery Pack2.4%

Camera3.3%

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