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Excellence in Engineering Simulation VOLUME VIII | ISSUE 3 | 2014ADVANTAGEADVANTAGE

SPOTLIGHT ON

HIGH TECH

6Engineering the Internetof Things

11Sparking a Revolution

24Making Waves


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3/60 2014 ANSYS, INC. ANSYS ADVANTAGE Volume VIII | Issue 3 | 2014 1

TKEDITORIAL

Not only can ANSYS solutions identify obvious aws, such

as structural weakness in a tablet casing, but they can also ag

the more subtle performance issues that are created when many

disparate systems come together for example, the eect of a

variety of casing materials on thermal management, chip perfor-

mance and electronic signal quality.

With a strong foundation in structural analysis, uid dynam-

ics and electronics, ANSYS provides high-delity simulation solu-

tions that scale from integrated circuits, discrete components

and embedded systems to fully functional products containingmillions of lines of safety-critical embedded software.

While high-tech engineering teams face more pressures

than ever, they also compete in one of the strongest and fast-

est-growing consumer markets today, creating incredible

nancial opportunities. According to industry analyst Gartner,

in 2013 consumers bought 1.8 billion smartphones and 195

million tablet computers. Many of these devices were devel-

oped using ANSYS software.

As electronic devices continue to proliferate, engineering

simulation will continue to help manufacturers not only make

incremental improvements to key performance aspects such as

speed and connectivity but also deliver the game-changingproduct innovations that will have consumers lined up around

the block.

DRIVING THE HIGH-TECH

REVOLUTION

Fast-paced and hyper-competitive, the global high-tech industry is characterized by groundbreaking

product innovations and rapid-re market launches.Simulation provides an essential means for marketleaders to quickly introduce revolutionary newfeatures and functionality while still honoringtheir foundational product promise.

By Sin Min Yap, Vice President Industry Strategy and Marketing, ANSYS

Whats the hottest new high-tech product

today? By the time this issue of ANSYS

Advantage is published, that answer will

have changed multiple times. Such is the

nature of todays ultra-competitive global

high-tech marketplace, in which every com-

pany seeks to introduce the next big innovation. More than ever,

todays high-tech product development teams are pressured to

quickly assess thousands of possible designs and identify the sin-

gle, optimal solution that will have consumers marking the new

product launch date on their calendars.

In their rush to innovate, high-tech companies cannot aord to

make a single mistake. As they develop groundbreaking new prod-

ucts, they must actively seek out and address every potential cause

of failure. In todays hyper-connected world, it doesnt take a prod-

uct recall to ruin a brands reputation. Even poor user reviews and

ratings, shared via social media, can undo years of sound brand

management. Fail early and fail fast is the new mantra, as engi-

neering teams seek to eliminate faulty designs and potential weak-

nesses at the earliest possible development stage.

Given the combination of innovation, speed and quality

demanded in this industry, its no surprise that high-tech compa-

nies rely on simulation-driven product development. By design-ing and testing products in a risk-free, low-cost virtual environ-

ment, high-tech engineering teams can assess and discard dozens

of ideas quickly, signicantly compressing their design cycle. They

can develop a complex product consisting of many systems, such as

chippackageboard, in parallel, instead of optimizing one compo-

nent at a time. They can consider multiple physics simultaneously,

instead of conducting a series of single-physics studies.

In addition, engineering simulation helps high-tech product

development teams manage design complexity, solving advanced

problems such as reducing power consumption, delivering unwav-

ering signal integrity, and improving bandwidth. With its multi-

physics leadership, systems-level perspective and collaborationplatform, ANSYS is uniquely qualied to help assess the many

facets of high-tech product performance.

Engineering simulation

will deliver game-changing

product innovations.

ROBUST ELECTRONICS

ansys.com/83hightech
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11 20 28

TABLE OF CONTENTS

FEATURES

6BEST PRACTICES

Engineering the Internet

of ThingsOur world is more connected than ever,

thanks to the growing web of visible

and unseen electronics that surroundus every day. ANSYS provides the

comprehensive suite of simulation

software to reliably and cost-eectively

engineer high-performance electronic

devices and systems.

11THOUGHT LEADER

Sparking a RevolutionOver a 30-year career, Ed Godshalk

has pioneered some of the high-

tech industrys most important

product development and testing

techniques. He has a long history of

using simulation for microwave and

electronics design. Here, Godshalk

discusses the historic role of

engineering simulation and looks

toward a future in which simulation

will make even greater contributions.

14TEST AND MEASUREMENT

Hot BoxSimulation helps to cool the

calibration head for the worlds fastest

real-time oscilloscope.

17CONSUMER ELECTRONICS

Refresh Your MemoryOoma saved 50 cents on each of hundreds

of thousands of devices by using ANSYS

tools to design a DDR3 subsystem that

does not require a termination voltage

regulator.

20RF AND MICROWAVE

Hot WireMultiphysics simulation helps to achieve

robust electronics design for high-power

antennas and microwave components.

24WIRELESS TECHNOLOGY

Making WavesANSYS HFSS helps to deliver innovative

communications and networking solutions.

28WIRELESS TECHNOLOGY

More Gain, Less PainUsing simulation, Vortis can design a

more ecient cell phone antenna in up to

90 percent less time.

32IC DESIGN

Managing IP RisksIP-aware SoC power noise and

reliability analysis workow is required

in the FinFET era.

35NETWORKING

Overcoming Uncertainties

in High-Speed

Communication ChannelsANSYS HFSS helps verify the ability

of cost-eective laminates to support

communications speeds of 10 gigabits

per second or greater.

38PCB DESIGN

Maintaining Power and

Signal IntegrityThe ever-changing hardware that

supports big data and the Internet

of Things must be fast, reliable and

quickly developed.
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42FLUIDTHERMAL SYSTEM DESIGN

Above the CloudCloud computing reduces by 80 percent

the time required for a coupled CFD and

structural simulation.

45AEROSPACE AND DEFENSE

Eye in the SkyA small engineering team designed,

veried, generated and integrated

125,000 lines of code to control an

unmanned aerial system using ANSYS

SCADE in one-third the time required

had the code been written in C.

42 48

SIMULATION@WORK DEPARTMENTS

48ACADEMIC

On the WingButtery wings generate far more lift

than can be accounted for by steady-

state, non-transitory aerodynamics.

51ANALYSIS TOOLS

Blending Design and

SimulationSpaceClaim and ANSYS bring innovative

design and analysis closer together.

54ANALYSIS TOOLS

GPUs Speed theSolution of Complex

Electromagnetic

SimulationThe ANSYS HFSS transient solver

leverages NVIDIAs leadership in GPU

computing to enable quick solutions for

transient electromagnetic simulation.

Visit ansys.com/magazine.

ACADEMIC

Ice BreakerResearchers have successfully tested

a compact radar system integrated on

a small lightweight unmanned aircraftsystem (UAS) to measure ice thickness

and map underlying glaciers. The use

of a UAS eliminates pilot risk and

consumes only a fraction of the fuel

necessary for a manned aircraft. ANSYS

HFSS electromagnetic simulation

software played a key role by helping

to integrate the antennas onto the

aircraft in much less time and at a

much lower cost than would have been

required with physical tests alone.

ACADEMIC

Bringing Down

the VolumeThe University of Pittsburgh and

Carnegie Mellon University have

teamed up with the Advanced Research

Projects AgencyEnergy and others

to develop novel high-frequency,

magnetic nanocomposite materials

for power applications that can save

materials and costs.

CONSTRUCTION

Safety in NumbersParsons Brinckerho used ANSYS

Autodyn to perform three-dimensional

coupled EulerLagrange (uid

structure interaction) nonlinear nite

element blast analysis to simulate

explosions in a generic transit tunnel

and predict the potential damage.

Engineers were able to analyze

the eectiveness of conventional

protective measures, such as

increasing the thickness of concretelining or the amount of reinforcement

steel, versus alternate protection

measures to reduce damage to the

lining and determine costs.

WEB EXCLUSIVES

ABOUT

THE COVER

High-tech market leaders rely on

simulation-driven product develop-

ment to launch their devices quickly,cost-eectively and with a high degree

of condence that they will perform as

expected in the real world.
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MODELING AND SIMULATION

LIFT AEROSPACE CONTROL

SYSTEMS

E&T Magazine

eandt.theiet.org,July 2014

Diversity in the aerospace industry israpidly increasing, including every-thing from helicopters to airplanes todrones. Design requirements for dier-ent structures and materials drive engi-neers to rapidly model and simulate theaerodynamic performance of the air-frame and evaluate the materials usedin construction. Simulation is also usedin the design of ight control systems

that integrate the structure and con-

trol components. These componentsinclude most if not all of the elec-tronics used on an airplane, from theaircrafts aileron and other control sur-faces to the black box ight recorder.

Engineers employ ANSYS software toensure structural integrity as well asto find electromagnetic solutions toenhance safety and comfort for passen-gers and crew.

YC-BACKED RIGETTI COMPUTING RAISES $2.5M TO CREATE

COMMERCIAL QUANTUM SYSTEMS

TechCrunch

techcrunch.com,August 2014

Many companies are attempting to incorporate quantum computing into commer-cial hardware. Rigetti Computing wants to be a leader in this eort, providing consis-tent performance improvements through an ANSYS-powered prototyping process. Themajor issues with quantum computing include unpredictable performance and highcosts. ANSYS solutions help Rigetti rapidly test changes without having to build newcircuitry with each iteration. This advancement could allow computers to performcertain kinds of operations immeasurably faster than traditional processors.

Aeroelastic wing simulation example

ORIGAMI UNFOLDS A NEW WORLD OF SHAPE-SHIFTING ELECTRONICS

CNET

cnet.com,May 2014

Electrical engineering is taking a large step forward using the mathematical properties of origami. Electronic devices that com-

press and change shape are possible if designed correctly. Companies could put tiny devices into compact spaces by morphingforms to optimize space usage. A leading electromagnetics specialist and his team from Florida International University andGeorgia Tech University are leading the development of origami-inuenced antennas. ANSYS HFSS allows the team to conceptual-ize new antenna models with only one limit: imagination. The software permits designers to work through many dierent designs

without expensive physical prototyping.

RAISING THE ABSTRACTION OF POWER: TRENDS

Semiconductor Engineering

semiengineering.com,July 2014

Design requirements for todays system-on-chip (SoC) devices need a comprehen-sive power analysis methodology from system to register-transfer-language (RTL) togate for successful system design for power management. System designers histori-cally used complex spreadsheets to calculate power consumption, which led to prob-lems like limited reuse, cumbersome sharing, error-prone formulas and no dynamicsystem results. A reliable alternative is performing simulation at many points in thedesign to achieve systems-level power savings.

4MOMS LEVERAGES ANSYS

TO DEVELOP INNOVATIVE

PRODUCTS

Wall Street Journal

wsj.com,July 2014

4moms is revolutionizing the $8.9 bil-lion baby gear market with some helpfrom ANSYS. Engineering simulationtools allow engineers at 4moms to cre-ate virtual prototypes to reduce timeand money, while maintaining productquality. Using simulation from ANSYS,

4moms engineers validated certaindesign decisions before crash testing andsupplemented the crash-testing results,enabling the company to operate moreeectively and eciently.
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Today we live in a world based on connectivity and com-munication, in which a burgeoning network of electronicsystems and devices helps us navigate our days.

Smartphones, tablets and GPS systems are the most obviousexamples, but consider the increasingly sophisticated electron-ics in cars, homes, hotels and oces that keep us secure and

comfortable, or the medical implants and prosthetics on whichmany people rely for everyday health. When we visit themeparks or attend concerts, we are likely to scan a wristband orsmartphone for admittance. Wearable wristbands and activitytrackers can monitor our physical movements, vital signs and

sleep patterns. Today, high-tech devices are inescapable.The high-tech industry has coined the term Internet of

Things (IoT) to describe this proliferation of electronic devicesand systems. There can be no doubt that the Internet of Thingsis poised to change the way we live, work, interact and seek outentertainment. As consumers, we can look forward to manyconveniences; for businesses, the IoT represents an incredibleopportunity to revolutionize the product development valuechain. While 2 billion smart devices were sold in 2006, its esti-mated that this gure will grow to 200 billion by 2020. Devices

will outnumber people by a ratio of 26 to one. [1]

BIG GROWTH, BIG CHALLENGES

This rapid growth brings signicant challenges. As devices

proliferate, consumers expectations for connectivity, energyeciency, reliability, ease of use and structural strength will

only increase. Electronics must be not only innovative and

high-performing, but also attractive. And, of course, all thisfunctionality and beauty must be delivered at a low price.

How can high-tech engineering teams manage thesepressures? Since the industrys inception, market leadershave relied on simulation-driven product development tolaunch their devices quickly, cost-eectively and with a high

degree of condence that they will perform as expected in

the real world.For high-tech manufacturers, engineering simulation is the

key. Designing products in a risk-free, low-cost virtual spaceenables engineers to quickly consider thousands of designs,

without investing time and money in physical prototypes. Theycan choose a few promising designs, then subject them to thou-sands of operating parameters again, with no investment inphysical testing. Engineers can perfect product components oroptimize entire systems. They can consider one physics areaor the complete range of forces that will be brought to bear ontheir designs.

ANSYS: A HIGH-TECH RESOURCE

FOR HIGH-TECH TEAMS

When we talked to industry expert Ed Godshalk at MaximIntegrated a world leader in analog semiconductors he said,When you consider the complexity of designing and packagingan electronic system, its really impressive that ANSYS softwarecan support that full development cycle.(Read more insightsfrom Godshalk in the feature on page 11.)

That range of capabilities is the result of focused softwaredevelopment investments, as well as strategic acquisitions, thathave positioned ANSYS to support the complete design cycle forhigh-tech devices, including integrated circuits (ICs) and embed-ded software. Throughout this issue ofANSYS Advantage, youllsee how customers are leveraging ANSYS software every day, and

at every stage of the development cycle.Recently, ANSYS has developed comprehensive solutions for

both robust electronic systems design and advanced materialsystems design for high-tech engineers. These solutions addresskey challenges for high-tech designers: improving speed andbandwidth, maximizing power and energy eciency, optimiz-ing antenna performance, and incorporating advanced materi-als. The sections that follow provide greater insight into thesechallenges as well as relevant ANSYS solutions.

Small form factors of IoT devices require miniaturization of all the components such

as 3D ICs. ANSYS IC tools help validate power noise and reliability of stacked-die chips

using the latest silicon process technology.

Consumers expectations for connectivity, energy eciency,

reliability, light weight and structural strength will only increase.

Functionality and beauty mustbe delivered at a low price.

DESIGNING RF ANTENNAS FOR WEARABLE ELECTRONICS ANDTHE INTERNET OF THINGS

ansys.com/83IOT2

WEARING A WIRE

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RAMPING UP SPEED AND

BANDWIDTH

As mobile devices proliferate, moreand more data is being transmitted andreceived, driving the need for faster wiredand wireless communications networks.Video streaming, interactive gaming andhigh-speed web service are pushing thelimits of not only mobile devices, but alsoservers, routers and switches. Improving

speed and bandwidth is an industryimperative, but design complexity posesa signicant challenge.

For example, designing printed circuitboards (PCBs) for high-speed, double datarate memory buses or serial communi-cation channels requires extreme care.High data rates combined with low oper-ating voltages can cause signal and powerloss. In todays device-crowded world,

electromagnetic interference (EMI) andelectromagnetic compatibility (EMC)issues also aect power integrity (PI) and

signal integrity (SI).The ANSYS Nexxim circuit simula-

tor (part of the ANSYS HFSS SI option

and ANSYS SIwave) oers an ecientway to design and test memory chan-nels for servers that power our cloud-computing world. When this simulatoris used in combination with IBIS-AMI,or Nexxims QuickEye and VerifEyemodels, it represents the industrysleading solution for high-speed com-munication channel design.

End-to-end design and optimiza-tion for complex high-speed electronicdevices is faster, easier and more accu-

rate thanks to new functionality in theANSYS SIwave electromagnetic simula-tion suite for the design of high-speedPCB and IC packages. This functional-ity is available via three targeted prod-ucts: SIwave-DC, SIwave-PI and SIwave.Engineers can quickly identify poten-tial power and signal integrity problemswith increased exibility, and more eas-ily access a complete set of analysis capa-bilities that they can leverage throughoutthe design cycle.

High-techindustry product devel-opment teams routinely use coupledmultiphysics software from ANSYS toanalyze the trade-os among speed, band-width, signal integrity, power integrity,thermal performance and EMI/EMC. Forexample, a smartphone manufacturerrecently leveraged a suite of ANSYS soft-ware including ANSYS HFSS, ANSYSIcepak, ANSYS Mechanical and ANSYS

High-tech-industry product development teams routinely use coupled multiphysics software from ANSYS to analyze the

trade-os among speed, bandwidth, signal integrity, power integrity, thermal performance and EMI/EMC.

As the sophistication of electronics increases, engineers must consider the

comprehensive characteristics of the environment in which the equipment will operate

for example a cell phone within a car.

BEST PRACTICES
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material aected the electrical perfor-mance of a printed circuit board, relyingon ANSYS SIwave to model the new boardversus a conventional PCB. [2]

At the University of Pittsburgh andCarnegie Mellon University, engineers are

using ANSYS PExprt and ANSYS RMxprtto assess the performance of new nano-composites that have the potential to revo-lutionize power transformer technology.(Learn more in our Web Exclusive.)

INVESTING IN THE FUTURE

Since the earliest days of the high-tech revolution, simulation-drivenproduct development has been a criti-cal strategy for satisfying consumers

increasing demand for device function-ality, speed, bandwidth, aesthetics andother product characteristics whilestill meeting revenue and margin goals.ANSYS has helped hundreds of high-techcompanies launch their game-changingdesigns quickly, cost-eectively and con-dently, creating market leadership and

building some of the industrys stron-gest brand reputations.

Historical trends enable us to con-dently predict that high-tech manufac-turers will continue to deliver incredi-bly innovative products that we cannoteven imagine today. We can also be con-dent that with a commitment to stra-tegic acquisitions as well as developmentof new software features and functional-ity ANSYS will continue to invest in ourhigh-tech customers success.

References

[1] A Guide to the Internet of Things

intel.com/content/www/us/en/internet-of-things/infographics/guide-to-iot.html

[2] Simulation and Design of Printed Circuit Boards

Utilizing Novel Embedded Capacitance Material

multimedia.3m.com/mws/mediawebserver?mws

Id=66666UgxGCuNyXTtnxM2NxT_EVtQEcuZgV-

s6EVs6E666666--&fn=Huawei%20White%20

Paper.pdf

Engineers are also challenged todevelop new antenna technologies thatrequire multiple frequency bands andgreater eciency, all within a smaller

physical prole.

ANSYS is the industry leader in sim-ulating the performance of antenna,microwave, wireless and radio frequency(RF) systems. With new solver capabili-ties in ANSYS HFSS such as nite ele-ment method (FEM) domain decomposi-tion, 3-D method of moment (MoM) andhybrid FEMMoM antenna engineerscan rapidly solve electrically large, full-wave electromagnetic models. Thesemodels can accommodate regions of com-plex materials, as well as geometries withouter regions that are electrically large. Inaddition, transient solutions allow engi-neers to examine the behavior and scat-tering of radiation across time and space.

While antenna models are very large,

high-performance computing (HPC) capa-bilities from ANSYS allow engineers toincrease problem size and complexity whileminimizing time-to-solution. Engineers atSynapse a leader in wearable electronics have used ANSYS HFSS in an HPC envi-ronment to increase antenna range by afactor of ve, while reducing their overall

design cycle by 25 percent.At Vortis, engineers are applying

ANSYS software to solve the problem ofwasted RF energy in cell phones, which

not only reduces battery life but also cre-ates acoustic noise. The companys inno-vative new phased-array antenna systemis just one example of how simulation-driven product development is impactingthe future of the IoT. (See page 28.)

INCORPORATING ADVANCED

MATERIALS

At ANSYS, today there is a cross-indus-try strategic initiative aimed at supportingthe incorporation of advanced compositematerials into the product developmentprocess and with good reason. Compositematerials are no longer used only by auto-makers and aerospace manufacturers.

Today, high-tech companies turn toadvanced lightweight, yet strong, mate-rials to create exible mobile and wear-able electronics. However, a range ofcomplex issues must be considered whenevaluating new materials includingelectrical conduction properties, struc-tural strength, dimensional stability overtime and resistance to thermal build-up.Design for manufacturability is also animportant consideration.

High-tech engineers simulate theassembly of composite layers and con-

duct nite element analysis via ANSYSComposite PrepPost and other special-ized modeling tools, subjecting thesemodels to a range of real-world condi-tions. Electrical performance is veried

using ANSYS HFSS and ANSYS SIwave,while ANSYS Icepak analyzes the ther-mal performance of electronic systemsand devices.

ANSYS oers the industrys most com-prehensive solution for evaluating thepotential of advanced materials to reduce

weight, while also optimizing conduc-tivity, signal integrity, dimensional sta-bility and thermal management withindevices. For example, 3M recently pub-lished a groundbreaking study on how anovel embedded-capacitance composite

Every electronic device contains one or more integrated circuits that need to deliver power, performance and

reliability. ANSYS IC tools provide comprehensive analysis coverage, including power integrity, electromigration

and thermal reliability within the context of the entire system.

THE RACE TO 6G FASTER NETWORKSAND DEVICES PROMISE A WORLD OFNEW POSSIBILITIES

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HIGH-PERFORMANCE ELECTRONICDESIGN PREDICTINGELECTROMAGNETIC INTERFERENCE

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SPARKING A

REVOLUTION

ByANSYS Advantagestaf

Over a 30-year career, Ed Godshalk has pioneered some of thehigh-tech industrys most important product development andtesting techniques. He has a long history of using simulationfor microwave and electronics design. Here, Godshalkdiscusses the historic role of engineering simulation andlooks toward a future in which simulation will make evengreater contributions.

THOUGHT LEADER

Since his career began in the early 1980s, Ed Godshalkhas always had a dual focus: designing higher-per-forming electronics components and systems, while

also developing the underlying test and measurement toolsand processes that enable true product innovation. He has pio-neered a number of measurement methods and systems forproduct development that have helped shape the modern high-tech industry. For example, while at Cascade Microtech in 1990,Godshalk designed the worlds rst waveguide input wafer probe,

which covered V-band (50 GHz to 75 GHz), and later W-band (75GHz to 110 GHz). This enabled development of early millimeter-wave integrated circuits.

Today, Godshalk is a distinguished member of the tech-nical staff and director of the Electromagnetics Group atMaxim Integrated, one of the largest analog semiconduc-tor manufacturers in the world. He manages an expert staffcharged with developing advanced models and measure-ments necessary for Maxim to introduce advanced products.



These products are used by leaders in mobility and consumerproducts such as Samsung; major automakers in Asia, NorthAmerica and Europe; medical device manufacturers; andlarge search engine and social media companies.

Recently, Godshalk shared his perspective on simulation, aswell as his view from the front lines of the high-tech industrysongoing battle to combine high product quality with low costand speed to market. While virtual product development prac-tices rst revolutionized the high-tech industry 30 years ago,

Godshalk believes that the future holds even greater potentialfor high-tech engineering teams to leverage value from simula-tion-driven product development.

You have a long history of using simulation in the high-tech

industry. How did it change your work as an electrical engineer?

Its impossible to overstate the value that engineering sim-ulation brought to the table 30 years ago. In the early 1980s,the standard way to design microwave circuits was via graphs,equations and a lot of complex math. This was the situationwhen I was a student and young engineer. Often the only wayto test those systems was to physically construct large-scalephysical models, which were expensive, unwieldy and heavy.One example, made in aluminum, weighed more than 300pounds! When I began using microwave circuit simulation inthe mid-1980s and HFSS 1.0 to simulate full-wave electromag-netic elds in the 1990s, it was a true game-changer. Suddenly,

there was software that could not only automate and accelerateall the complicated math involved in systems design, but also

support rapid virtual prototyping and testing. Simulation soft-ware was such a powerful tool that it increased the productiv-ity of development sta involved in electromagnetic simulation

problems by something like 10 times. Engineering simulationreally created the foundation for the incredible gains we haverealized in electronics performance. It laid the groundwork forthe impressive degree of innovation we have witnessed in thehigh-tech industry. Simulation removed the obstacles to fast,

condent, cost-eective product innovation. It eliminated the

time and money wasted on tedious, trial-and-error circuit test-ing. It changed everything.

How does engineering simulation add value for your team at

Maxim Integrated today?

There is strong consumer demand for increased function-ality of electronic devices and connectivity. At Maxim, wehelp our customers ooad some of their engineering costs byreducing part counts. That means placing more and more func-tionality into each of our systems, while maintaining or evenreducing their physical prole and cost. But this raises complex

issues. How will signal integrity be aected when functions

reside so close together? Will thermal build-up be a problem?A suite of ANSYS software includingHFSS,SIwave,MaxwellandQ3D Extractor helps to understand the trade-os and

maximize system performance. Today, engineering simulationis an even more vital capability than it was 30 years ago. ANSYShelps with understanding and solving todays advanced devel-opment challenges.

What changes have you seen in simulation software and prac-

tices over the years?

As our design challenges have become more complex, fortu-nately both software and hardware have evolved to help meetthese new challenges. In terms of software, ANSYS solutions

Engineering simulation created the foundation for the incredible gains

we have realized in electronics performance and the impressive degree

of innovation we have witnessed in the high-tech industry.

SYSTEMS ENGINEERING FOR SMART PRODUCTS

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Engineers at Maxim Integrated must place more and more functionality into each

system, while maintaining or even reducing their physical prole and cost. The company

uses the suite of ANSYS electronics software to understand the trade-os and maximize

system performance.

ANSYS helps with understanding

and solving todays advanceddevelopment challenges.

THOUGHT LEADER
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other technologies to be as small as possible without losingany functionality. Our customers also are trying to increasedata transfer speed and bandwidth again, to meet consumerneeds for uninterrupted content. Connectivity and signalintegrity are related consumer concerns that our customersfocus on.

While these are daunting challenges, the good news is thatANSYS software and simulation-driven product developmentcan help us overcome them. Simulation allows us to study allthese problems in depth and arrive at optimized solutions.

How would you describe your relationship with ANSYS over the

past three decades?

I was an early customer of Ansoft (the company that

developed HFSS and is now part of ANSYS), and today MaximIntegrated leverages a wide range of ANSYS solutions. I thinkthat gives me a unique perspective. ANSYS solutions have alwaysbeen very intuitive and easy to use, and the graphical user inter-face just keeps improving. Its very easy for new users to get upand running. The company also has great customer support. Myteam and I have had a strong, collaborative relationship withboth ANSYS customer service sta and software developers over

the years.I have observed that ANSYS has done a great job at keep-

ing up with trends in the high-tech industry. When we neededto model larger systems or work in an HPC environment, ANSYS

had the software tools ready. As the job of electrical engineershas evolved, the software company has been right there with usin terms of technology development.

In the future, our industry is going to produce all kinds ofhigh-tech electronic innovations. I rmly believe that ANSYS

software will signicantly contribute to their development.

are much more integrated today, making it easier to bring mul-tiple tools to bear on a single design problem. ANSYS softwareis also more comprehensive. When you consider the com-plexity of designing and packaging an electronic system, itsreally impressive that ANSYS software can support that fulldevelopment cycle.

In the area of best practices, a great impact resulted from theintroduction of high-performance computing (HPC) resources and the simultaneous launch of simulation software thatscustomized for HPC environments. At Maxim, were focused onhigh-complexity, numerically large design projects.ANSYS HPCPacks and multi-core processors help improve time to market.We run quite a few eight-core processors and even a 32-core proc-essor. Engineering simulation has enabled the developmentof faster computers, which in turn have enabled larger, faster

simulations. Its really a closed-loop process that keeps makingour electronics simulation capabilities better and better.

You mentioned cost control as a priority for your customers.

What other challenges do they face?

Some of the biggest challenges in the high-tech industry cen-ter on power harvesting it, converting it, storing it and using

it more eectively. To make futuristic product ideas like wear-able electronics practical, the development of radically newpower technologies that maximize eciency, while minimizing

impacts on the environment, will be important.Product miniaturization is also a huge focus for our cus-

tomers because consumers want their phones, tablets and

S-parameter model for IC die in package on PCB

PRODUCT INTEGRITY IN A NEW WORLD OF SMART PRODUCTS

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TK

HOT BOX

By Matt Richter, Expert R&D Engineer, Keysight Technologies, Santa Rosa, U.S.A.

Simulation helps cool the calibration head forthe worlds fastest real-time oscilloscope.

Oscilloscopes are digital instruments that display andmeasure the wave shape of an electrical signal. High-performance oscilloscopes, which are capable of mea-

suring signals at very high frequencies, are used primarily inhigh-speed serial communications, radio frequency/radar/aero-space and high-speed physics applications.

Keysight Technologies (formerly Agilent Technologies), whichbills itself as the worlds premier test and measurement company,develops equipment with breakthrough capabilities that helpsolve tough measurement challenges. For example, the Inniium

90000 Q-Series oscilloscope is the rst to reach the 60 GHz bar-

rier, enabling engineers to make measurements on a new genera-tion of ber-optic transponders and systems that provide higher

levels of data communications speeds than previously possible.As part of the design of the worlds highest-bandwidth real-

time oscilloscope, Keysight Technologies determined that itneeded to develop a new electrical calibration source to ensure

TEST AND MEASUREMENT

36 mm

Flow

Typical fan/heat exchanger conguration



that the oscilloscope could set a newstandard for measurement accuracy.

This design of the calibration source(Agilent N2806A) involved challeng-ing electrical, mechanical and thermalrequirements. Keysight utilized ANSYSCFX computational uid dynamics (CFD)

software to model the environment andproduce a design that could exceed all ofthe requirements. Keysight delivered arst-pass success on the design and is

now shipping the worlds highest-band-width real-time oscilloscope based onthis calibration technology.

The major challenge in designing thepackage for the calibration head was cool-ing. The head contains two integrated cir-cuits (ICs) that dissipate a total of 3.2watts within a 35-mm-wide by 42-mm-long by 15-mm-high box with 5,250 mm2

surface area. Because of the limited sizeof this box, the energy released by thecircuits produces a considerable tem-perature increase, which can adverselyaect handling comfort. The packaging is

built around a machined-aluminum baseincorporating the heat sink and cavitiesfor mounting the ICs. To address this cool-ing challenge, the engineers decided totry a cross-ow heat exchanger approach

even though they had no experience withthis conguration. Building physical pro-totypes would normally take up to eightweeks and require rst-pass success with

the prototypes to ensure on-time projectcompletion. Instead, Keysight engineersturned to ANSYS CFX computational

uid dynamics (CFD) software to modeland simulate the cross-flow configura-tion. They rst performed an airow-only

analysis to determine pressure drop, thenfollowed up with a heat-transfer anal-ysis to determine temperature rise. The

design created with the aid of simulationworked perfectly when production parts

were built.

EVALUATING ALTERNATIVE

COOLING DESIGNS

Before employing simulation,Keysight engineers made a quick calcu-lation to determine if the unit could becooled with free convection using a for-mula to determine temperature rise in apackage. In this case, the rise was pre-dicted to be 86 C, much higher than thedesign specication of 15 C the limit

at which the device can be comfortablyhandled. Forced air was needed to coolthe head, but what type of forced-aircooling would provide the best results?The fan/exchanger conguration that

Keysight normally uses positions thefan on top of the head blowing airdownward onto the heat sink and exit-ing around the sides of the unit. Thisapproach requires a relatively large

package height, and the connectorsneed to be positioned toward the edgeof the unit, which was not compatiblewith the connector placement on thefront of the instrument that the headwas used to calibrate.

Keysight engineers then looked at thealternative of a blower/cross-flow heatexchanger design in which the airflowis perpendicular to the face of the heatsink. In this application, the inner wallsof the case form a curved channel that

directs the air around the top of the heatsink. This approach offered the advan-tage of reduced height requirements andenabled the connectors to be centered onone side of the calibration head. Since thewrapped ow conguration was previously

unproven, access to simulation was crit-ical in optimizing the design. It would

have taken six to eight weeks to build thephysical prototype parts, and the cost ofcomputer numerical control (CNC) pro-gramming for manufacturing would havebeen about 20 percent of the overall rst-

run cost. Consequently, a failed initialprototype design would have led to bud-get and schedule overruns.

Keysight engineers used simula-tion to evaluate design alternatives andprove out the cross-ow conguration.

The team had been using ANSYS struc-tural and thermal tools, and decidedto use this project to evaluate ANSYSCFX software. CFX works within theANSYS Workbench environment, so itshares the same interface as the struc-tural and thermal tools that Keysightuses. Workbench also integrates wellwith PTC Creo Elements/Direct CADsoftware, which is part of the Keysighttoolkit. The CFD technology also oers

sophisticated meshing tools, a exible

solver and a variety of physical models,so it handles all of Keysights uid-ow

simulation requirements.

SIMULATING AIRFLOW AND

HEAT TRANSFER

The primary concern of the cross-

flow design was that the flow rate ofthe blower would be reduced due to thepressure drop associated with redirect-ing the airow over the heat sink. The

blower manufacturer provided a fancurve showing the ow generated at any

Final head design using cross ow. Image on left is without a cover; image on right shows transparent cover.

Hybrid microcircuit

Flow (redirectedby cover)

Heat sink

Blower

ANSYS COMPUTATIONAL FLUID

DYNAMICS SOFTWARE

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TEST AND MEASUREMENT

particular pressure drop, but the pres-sure drop through the calibration head

was initially unknown. The team cre-ated a proposed design and used CFDto predict the pressure drop at variousow rates. They reasoned that the pres-sure drop could be reduced by increas-ing the heat exchanger channel area, sothey created a second simulation model.

Simulation results showed that the sec-ond conguration did indeed create less

pressure drop, resulting in a higher ow

rate sucient to cool the calibration head.

To ensure that this cooling airow

would be sucient, engineers then built

a heat transfer model with 1.5 milliontetrahedral elements. The ICs were con-gured as heat generators, and the con-ductivity of the housing was based onaluminum. The airow predicted by the

rst simulation was used as a mass-ow

input. The heat transfer simulation tookabout 15 minutes to solve on a personalcomputer; it showed that the case tem-perature rise was well within the 15 Cdesign specication.

SIMULATION RESULTS MATCH

EXPERIMENT

Keysight engineers went one step fur-ther by constructing a cross-ow proto-type using on-hand parts. Included were

a similar heat sink from another project,a blower and a plastic duct. The proto-type was constructed to match the latestdesign conguration as closely as possi-ble. Physical measurements showed thatthe heat sink rose in temperature by 9.5 C.Keysight engineers modeled the prototype

in CFX and ran a simulation to validatethe simulation method. The simulationpredicted a temperature rise of 9.5 C,a perfect match with the physical mea-surements. Minor dierences in pressure

drop and flow between the simulationand physical measurements were withinthe margin of error of the measurements.These results helped to build condence

in the simulation methodology.The simulation results helped

Keysight engineers to convince manage-ment that the cross-ow design would

deliver the desired results. Brad Doerr,R&D project manager for Keysights high-performance oscilloscopes, summa-rizes Keysights experience using ANSYSCFX: Keysight oscilloscope custom-ers demand world-class measurementaccuracy to enable emerging technolo-gies. In producing the 90000Q family ofoscilloscopes, the Keysight design teamneeded to develop a superior calibration

source to ensure that the product coulddeliver the industrys highest real-timebandwidth, lowest noise and best jitterperformance. In designing the N2806Acalibration source, the Keysight R&Dteam utilized ANSYS CFX software tosimulate the environment and optimizethe design. As a result, the team suc-cessfully produced a highly robust solu-tion that exceeded the requirementsfor thermal stability, signal integrityand usability. Success was achieved

on the rst prototype, and this helpedKeysight become the rst oscilloscope

manufacturer to break the 60 GHz real-time bandwidth barrier and enable anew class of ultra-accurate high-band-width measurements.

Airow-only model results

Airow-only model

Heat transfer model

Heat transfer results

The team successfully produced a

highly robust solution that exceeded

requirements for thermal stability,

signal integrity and usability.



Ooma oers consumer and business products that provide

free and low-cost U.S. and Canadian telephone calling as wellas advanced cloud-based telephony services to its global base ofcustomers. One of the greatest challenges on a recent new prod-

uct was designing the DDR3 subsystem at the lowest possible costwhile getting the design right the rst time. The DDR3 subsystem

resides on a system-on-chip (SoC) with an ARM microprocessorcore. The DDR runs at 533 MHz, and data is clocked on both risingand falling edges for a total bandwidth of 1,066 Mbit per second.The initial concept design was created using Cadence OrCAD

REFRESH

YOURMEMORY

Ooma saved 50 cents on each of hundreds of thousands ofdevices by using ANSYS tools to design a DDR3 subsystemthat does not require a termination voltage regulator.

C

onsumer electronics manufacturing is all about beingrst to market with a reliable product at a lower cost

than the competitors. These days, nearly every con-sumer product contains embedded memory to support the logiccore that delivers device functionality. Using low-cost standardcommodity memory requires that devices comply with doubledata rate (DDR) standards issued by the Joint Electronic DevicesEngineering Council (JEDEC). The DDR interface consists of sig-nals for control, address, clock strobe and data that are transmit-ted between the memory controller and DDR dynamic randomaccess memory (DRAM).

Ooma, which is working to re-invent home telephone service,supports a DDR3 standard on its latest-generation devices thatdelivers higher performance, but with this performance comes

tighter signal integrity requirements for the memory control-ler. The companys engineers met this challenge by using ANSYSelectronic simulation software and tools to simulate performanceof the DDR interface in the early stages of the design process,then iterate to an economical solution that avoids the need for atermination voltage regulator.

CONSUMER ELECTRONICS

Consumer electronics

manufacturing is all aboutbeing rst to market at a lower

cost than competitors.

By Michal Smulski, Hardware Engineer, Ooma, Palo Alto, U.S.A.
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Capture and Allegro layout tools. Oomaengineers connected the components,generated the net list, routed traces andgenerated the Gerber les used to fabri-cate the printed circuit board (PCB).

On slower-running buses, the engi-neering team sometimes performs sig-nal integrity calculations by hand. Butthe speed of this bus generated concerns,particularly about timing the abilityof the design to produce a valid signal atthe DRAM within the time frame allowedby the specication. Signal integrity was

another concern, specically that parasit-ics created by the PCB traces might dis-tort the signal. The normal starting pointto meet these specications is to use design

rules that specify the geometry of the traces,such as their maximum length and spacing.But with this signal speed, rules of thumbare not sucient to ensure that the design

will work. Allegro oers a signal integrity

tool, but Ooma engineers felt it was insu-

cient for this problem because it lacks 3-Dsimulation capabilities. Engineers instead

Engineers analyzed the simulationresults with the ANSYS DDR ComplianceToolkit to provide a quick verdict on theability of the design to meet the DDR3specification. The simulation providedan eye diagram that combined the shapeof every possible waveform that couldbe generated by the design; the diagramis used to visualize and diagnose perfor-mance. With this design ow, engineers

quickly updated the design for exam-ple, by inputting a dierent design rule

and rerouting the traces and deter-mined whether or not the new design

would meet the DDR3 specication.The high-speed switching signals

used in DDR3 memory generate reflec-tions that cause the signals to overshootand undershoot the voltage specication,

making it challenging to meet design tar-gets. The data signals are terminated inthe memory controller, which eliminatesreections on these wires. But there is no

internal termination on the control andaddress signals. Simulation of an earlyversion of the design showed that these

reections would make it impossible tomeet the DDR3 specications. A relatively

simple solution is to add a termination

used ANSYS electronics tools, which providea complete timing and signal integrity solu-tion that includes a full 3-D model. Anotheradvantage of ANSYS tools is that the engi-neering team has the ability to simulateantennas, which are used in an increasingnumber of Ooma products.

The SoC and memory vendors pro-vided buer IBIS models and parasitic

package models of their products. Theinterconnect model was directly exportedfrom Allegro to ANSYS DesignerSI viaANSYS ALinks, which streamlines thetransfer of design databases from pop-ular third-party EDA tools into ANSYSsimulation products. Models for thedata, address and control buses wereextracted withANSYS HFSS,an electro-

magnetic eld solver package. The fullDDR3 design was created in Designer-SIand simulated with ANSYS Nexxim, acircuit engine for high-speed channeldesign. The 3-D HFSS model of the inter-connects between the controller andmemory accounts for capacitance, induc-tance, coupling, resistance to ground,resistance to power and inductance topower. The design consisted of 40 data,address and controls signals. Ooma engi-neers generated 3-D models of these sig-

nals by grouping them based on tracelocation and function to limit memoryrequirements to reasonable levels.

Engineers needed

to design the DDR3

subsystem for a new

product at the lowest

possible cost while

getting the designright the rst time.

Extracted subset of Allegro layout including memory

chip, controller and traces, and assigned ports used to

model data byte 0 in Designer-SI.

Schematic page for simulation (top). All extracted trace models are placed here and connected to package and buer

models. Each box is an HFSS model of DDR3 traces.

DDR VIRTUAL COMPLIANCE USINGANSYS DESIGNERSI

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CONSUMER ELECTRONICS
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voltage regulator to terminate these wires,at a cost of about $.50. But this is a signi-cant cost when multiplied by hundreds ofthousands of units.

To avoid this expense, Ooma engi-neers tried terminating the control andaddress lines with an inexpensive seriesresistor between the controller and mem-ory. The resistor is not as good at control-ling reections as a termination voltage

regulator, so signal integrity simulation atvarious corner cases becomes much morecritical. The higher the value of the resis-tor, the better the job the resistor does indamping the reections. However, larger

resistors tend to round o the leading and

trailing edges of the signal, which makesit tougher to meet the timing specication.

In this case, Ooma engineers sweptthe value of the resistor from 0 ohms to100 ohms, while using the simulation todetermine the impact on timing and sig-nal integrity. They also made furtheradjustments in the PCB traces. In the end,the iterated design meets signal integrityand timing requirements without a termi-nation voltage regulator. This entire proj-ect was completed in a few weeks by asingle design hardware engineer withoutinvolving expensive signal integrity con-

sultants. The validated design was thenmanufactured, tested and FCC certied; it

is currently in mass production.

This entire project

was completed in a

few weeks without

involving expensivesignal integrity

consultants.

Singled-ended clock eye diagram

Eye diagram of data signal with 60 ohm internal termination

Single-ended DDR3 address and control signals with 68 ohm resistor termination. With this value, the design passed

AC overshoot and undershoot specications.

Dierential clock eye diagram without series termination


22/60



HFSS integrated into the broader ANSYSsimulation portfolio (for example, ANSYSMechanical and ANSYS Fluent), it was easyand intuitive to perform multiphysics sim-ulations within ANSYS Workbench.

encouraged investigation into the poten-tial for coupled simulation capabilities.This led to the selection of ANSYS HFSS toenable coupling between electromagnet-ics and thermal analysis. Raytheon engi-neers began using the tools extensivelyto design microwave systems with excel-lent results. In 2007, the group needed toadd vibration and uid dynamics capabil-ities to the coupled analysis toolkit. With

with their own separate requirementsand analysis tools and with only lim-ited cross-group interaction. This com-mon failure to more fully account fordesign dependencies has, in some docu-mented cases, resulted in serious productmalfunctions.

For example, the heat generated bymicrowave components can increase thedielectric loss tangent of some materi-als; the consequence is more heat pro-duction and the potential for a runawayreaction. In extreme cases, product fail-ure could prevent a mission from beingaccomplished or even cause loss of life.Combining electrical, thermal and struc-tural simulations often provides unprece-dented insight toward preventing failuresand improving product performance.

Raytheon Corporation a technology andinnovation leader specializing in defense,security and civil markets throughout theworld uses comprehensive robust elec-tronic design solutions to improve thereliability of its products, reduce timeto market, and control engineering andmanufacturing costs.

MULTIPHYSICS SIMULATION

A BRIEF HISTORY

Engineers have long been interestedin combining high-frequency electromag-netic simulation with thermal analysis,but before the turn of the millennium,there was no efficient way of doing so.About 2002, Raytheon management

Photos (normal left, magnied right) show damage to the microwave junction.

ROBUST ELECTRONIC SYSTEM DESIGN

PRACTICES FOR AEROSPACE ANDDEFENSE PRODUCTS

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ANSYS HFSS model of microwave junction
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VOLTAGE BREAKDOWN AT

MICROWAVE JUNCTION

In an example from a recent proj-ect, a high-power signal is received bythe antenna plane. The eective received

radiation signal flows to a microwavefeed circuit. Although both the electri-

cal and thermal groups signed o on thedesign, a voltage breakdown occurred ata microwave junction, where a co-axialpin connects to a microstrip trace at thefrequency of interest. Shortly after powerwas turned on, excessive heat destroyed

the connector. To address this, Raytheonengineers modeled the components inHFSS. This software accurately modelsmicrowave components, such as tuningscrews and probes, to a ne level of detail.

HFSS employs the nite element method,

using small unstructured mesh elements

when needed, along with large elementswhen small elements are not needed, toreduce processing time without sacricing

accuracy. Adaptive meshing refines themesh automatically in regions in whicheld accuracy needs to be improved.

Raytheon engineers imported ini-tial design geometry from a computer-aided design (CAD) file. They definedthe electrical properties of the materi-als, such as permittivity, dielectric losstangent and bulk electrical conductiv-

ity for the Kovar housing, alumina sub-strate, Teon insulator, and beryllium,

copper and Kovar pins. Engineers thendened boundary conditions that specify

eld behavior on the surfaces of the solu-tion domain and object interfaces. Theydened ports at which energy enters and

exits the model. HFSS computed the fullelectromagnetic field pattern inside thestructure, calculating all modes and portssimultaneously for the 3-D eld solution.

(The dielectric properties of the materials

are temperature dependent.) The HFSSelectrical field analysis at 25 C showedthat the electrical field in the area inwhich the failure occurred does notexceed 1.5x106volts per meter (V/m), ascompared to the 2.952x106V/m value forvoltage breakdown in air.

COUPLING ELECTRICAL AND

THERMAL SIMULATION

The real-life situation is more com-plex because ambient temperature aects

the dielectric properties of the materials,and the dielectric properties of the mate-rials aect the heat that is generated by

microwave components. Raytheon engi-neers tookadvantage of the integrationbuilt into ANSYS Workbench betweenHFSS and ANSYS Mechanical to cap-ture these interdependencies. The HFSSmodel was coupled toANSYS Mechanicalto perform a transient thermal simula-

tion. Boundary conditions for naturalconvection cooling were added on thebottom face. The temperature distribu-tion was used to perform a static struc-tural analysis.

Engineers employed ANSYS Workbenchcoupling to apply temperature elds (deter-mined by physical measurements) toANSYS Mechanical to calculate the ther-mal stresses associated with these tem-peratures. The structural simulationshowed high stresses and deformation

up to 22 m in the inner connector.Thermal analysis indicated that temper-atures actually reached 86 C on the bondribbon and the pin near the point wherethey connect, which translated into alower breakdown voltage. Raytheon

Raytheon engineers took advantage of

integration capabilities in ANSYS Workbench

to capture electromagnetic and thermal

interdependencies.

Electrical eld analysis at 25 C

Electrical eld analysis at 86 C

RF AND MICROWAVE
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engineers re-analyzed the componentsat 86 C using the dielectric propertiesat the higher temperature and discov-ered that the electrical elds in the area

where the failure occurred exceeded the2.45x106value for voltage breakdown

in air at this temperature.The simulation results helped

Raytheon engineers understand how thefailure occurred, and they corrected thedesign to eliminate future failures. Theteam solved the electromagnetic model atthe initial temperature, sent the electro-magnetic loss to the thermal simulationto determine the impact of the losses ontemperature, sent the temperatures backto the electromagnetic model to calculatelosses on the new temperatures, and con-

tinued to iterate until steady-state tem-perature changes were reached. After afew more changes to the materials used inthe product, the simulation showed thatthe design worked perfectly, and this wasconrmed by physical testing.

The simulation showed that the design

worked perfectly; this was conrmed

by physical testing.

Multiphysics analysis accurately predicts voltage breakdown damage. Physical damage on left and simulation on right.

Fields are plotted on the right.

Housing

AirGap
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By Kate Moore, Technology Centre Manager (Electromagnetics and RFICs),

Robin Granger,Senior Consultant Engineer, and Michael Jessup,Consultant

Engineer, Chemring Technology Solutions, Romsey, U.K.

ANSYS HFSS helps to deliver innovativecommunications and networking solutions.

A

s industry nds more and wider uses for electronics,electrical engineers must take into account a broad range

of factors when designing these smart products fromthe environment in which they operate to interference with otherelectronics to highly original usage of consumer and commer-cial devices. In ensuring that operation meets and even exceedsexpectations, Chemring Technology Solutions engineers fre-quently face the challenge of understanding, diagnosing and pre-

dicting the behavior of electromagnetic waves as they propagatebetween antennas, printed circuit board (PCB) traces, packagesand other parts of the system. Chemring leverages ANSYS HFSSto simulate the electromagnetic behavior of components and

WIRELESS TECHNOLOGY

MAKINGWAVES

MODELING TOUCH SCREENS

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systems, making it possible to evaluatemany more design alternatives comparedto the build-and-test method. The endresult is that the team is able to developmore innovative, robust designs in less

time than would be possible using tradi-tional procedures.

HEARING AID CONTROLLER

At Chemring Technology Solutions,400 engineers apply their technicalknowledge to solve dicult problems in

radar and wireless technologies, electron-ics and mobile communications, and soft-ware engineering across diverse markets,ranging from nance and transport to tele-

communications and security. Chemringengineers recently assisted in the designof the SurfLink Mobile wireless hear-ing aid controller from Starkey HearingTechnologies. The controller enablestwo-way stereo audio streaming between

a Bluetooth device, such as a smart-phone, and a wireless hearing aid. Thegreatest challenge was achieving a targetof 50 percent radiation eciency for the

devices Bluetooth and 900 MHz radios,the result being that at least half the radiosignal power produced by the device istransmitted into the airwaves. Engineersbuilt a rough physical prototype using a

3-D printer, FR4 circuit board materialand copper tape; they also simulated thedesign with ANSYS HFSS. The rough pro-totype measurements and simulationcorresponded well, and predicted radia-tion eciency of 80 percent at 900 MHz.

But when engineers built a true prototypeusing actual components, measurementsshowed eciency of less than 25 percent.

The poor radiation efficiency wasquickly traced to the touch screen sensor,which was absorbing approximately 4.5dB. Engineers noticed that the indium tinoxide (ITO) coating on the touch screenphysically extended to the top and bot-

tom edges of the screen, rather thanjust on the active surface a parame-ter that had been assumed in the HFSSmodel. Engineers made this change to thesimulation model, and it showed a dropin eciency to 25 percent (matching the

SurfLink Mobile wireless hearing aid controller from

Starkey Hearing Technologies

Engineers must

ensure that device

operation meets

and even exceedsexpectations.

ANSYS HFFS simulation of controller with ITO coating covering full screen (top) predicts 24 percent to 29 percent

eciency. HFSS simulation of controller with upper 8.5 mm of ITO removed (bottom) predicts 66 percent to 70 percent.



experimental value and verifying the accu-racy of HFSS for this type of simulation).Engineers negotiated partial removal ofthe coating with the touch screen man-ufacturer to ensure reliable operationand product integrity. The prototype

and updated simulation model showedeciency of between 66 percent and 70

percent. The SurfLink Mobile wirelesshearing aid controller went on sale infall 2012 and has won numerous awards,including the CES (Consumer ElectronicsShow) Innovations 2013 Design andEngineering Award.

BODY NETWORK

Chemring Technology Solutions

Gekko surface-wave technology is analternative wireless solution enablingcommunication between devices over asurface. The signal doesnt travel througha wire; instead, it moves wirelessly overthe surface of a fabric that incorporatesa dielectric-coated conducting materialthat creates surface waves that deliverthe wireless data. Surface-wave technol-ogy combines the reliability, security andperformance of a wired system with theflexibility of a wireless system. Gekkoovercomes one of the main issues withconventional body networking solutions:the signals inability to propagate fromthe front of the body to the back, or arounda limb, without the use of repeaters orreliance on reections. Electromagnetic

surface waves follow the propagation sur-face and provide a channel for secure androbust communications.

Building an eective solution required

a solid understanding of surface-wave

propagation. In particular, propagationaround curved surfaces was not wellunderstood. ANSYS HFSS was used tomodel surface-wave propagation aroundcurved surfaces and to understand howsurface impedance and wavelength canbe varied to control the radiation from aparticular bend. For example, the teamevaluated around-torso propagation bycreating a half-cylinder HFSS modelwith a diameter of 260 mm to approxi-mate a female adults torso. Wave ports

were placed on the opposite sides ofthe cylinder and used as transmit andreceive transducers.

The simulation results showed thatthe surface wave propagates around thecylinder at 23 GHz and 60 GHz, while a

conventional radio signal cannot prop-agate around the body without use ofrepeaters. These simulations were used toconstruct a controlled environment to testthe eect of and optimize design parameters

before going to the expense of building aprototype. The results also provided a veryvisual way to inform people of how surfacewaves work, which is much more eective

than a prototype demonstration.

Simulation of complex magnitude of electromagnetic eld over a cylinder representing (a) torso covered with surface-wave

garment, and (b) bare skin torso. Losses are much higher in the bare skin torso.

Track shaping makes a signicant dierence in high-frequency performance.

WIRELESS TECHNOLOGY


29/60



MORE GAIN,LESS PAIN

By James R. Johnson, Founder/Chairman, Vortis Technology, Inc., San Carlos, U.S.A.

Using simulation, Vortis can design a more efficientcell phone antenna in up to 90 percent less time.

Todays cell phone antennas waste about 50 percent oftheir power transmitting RF energy into users headsand bodies. This reduces battery life and produces anannoying buzzing sound in lower-cost hearing aids used around

the world. Vortiss new end-re phased-array cell phone antennadesign reshapes the signal pattern so that much less energy goesinto the users head and body. This helps to improve battery lifeand eliminates the buzzing for hearing aid users.

An antenna that provides the desired gure-eight signal pat-tern in free space was developed using phased-array theory, but

WIRELESS TECHNOLOGY

Vortis engineers reduced the

time required to customize the

design of an antenna by up to90 percent using simulation.
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this design must be customized for everyphone on which it is used to take intoaccount the eects of the packaging, the

cell phone itself and the users head andhand. Vortis engineers reduced the timerequired to customize the antenna designfor a specic phone by up to 90 percent

using ANSYS HFSS. ANSYS Optimetricsevaluated the design space and identied

the optimal value for design parameters.

LIMITATIONS OF CURRENT CELL

PHONE ANTENNASSimple omnidirectional wire anten-

nas that consist of a wire, plated traceor PCB structure sitting on the top, sideor bottom of the handset provide ade-quate performance for most mobilephone applications; they are almostuniversally used because of their lowcost and simplicity. But there are manyapplications for which these designsare not sucient or, at the least, higher

antenna performance can oer major

advantages: industrial and recre-ational use in fringe areas, devices forthe hard of hearing (about 10 percentof the population), and applicationsin which longer battery life is moreimportant than size.

When cell phones operate, there is ahandshake mechanism between the cellu-lar site and the handset. When the signalis strong, the handset reduces energy out-put to save the battery, and, when the sig-nal is weak, the handset increases powerto maintain the connection. As much as35 percent of the energy radiated by con-ventional omnidirectional antennas canbe absorbed by the head, and as much as15 percent is absorbed by the hand. Thisenergy must be replaced by increasing the

energy output of the phone, which con-tributes to draining the battery.

Wearers of hearing aids often experi-ence electromagnetic interference (EMI)problems with conventional omnidirec-tional cell phone antennas. These antennasradiate a digital pulse that generates cur-rents in the wires in the hearing aid. Thesecurrents are amplied by the hearing aid

and broadcast by the speaker with a volumeto the user of 45 decibels to 85 decibels. Theresulting buzz often makes it dicult to use

the cell phone and hearing aid at the sametime. Most advanced and expensive hear-ing aids have resolved this under industrialcollaborative programs some with the useof ANSYS HFSS software. However, lower-cost units still suer from this problem.

NEW ANTENNA DESIGN

ADDRESSES THESE PROBLEMS

The Vortis antenna overcomes theseproblems. The end-re phased-array cell

phone antenna radiates a signal in theshape of an eight with deep nulls lateral tothe elements and high-gain longitudinalto the elements. The antenna is orientedso that the nulls coincide with the usershead and hand, and the high gain areasenhance the signal forward and rearwardof the head to improve the overall uplink.

The eciency of the Vortis antennahas been tested in free space at 60 percent,which is a 50 percent improvement overthe average omnidirectional cell phoneantenna. When this number is expandedto incorporate the 40 percent DC to RFenergy conversion efficiency typical tohandsets, the savings in battery consump-tion is an estimated 125 percent improve-ment. This provides 2.25 times more talktime than the traditional antenna. WhenVortis is tested against an experimental

phantom head, the improvement in e-ciency is even greater due to the reducedloss from head absorption. Since theVortis antenna radiates much less energyaround the users head, the interference tohearing aids is substantially reduced.

Vortis engineers have further compressed the

design process by using HFSS Optimetrics.2-D radiation pattern of Vortis antenna calculated byHFSS . Reduced amount of red at the head indicates a better-

distributed signal.

2-D radiation pattern of conventional omnidirectional

cell phone antenna calculated by ANSYS HFSS

3-D radiation pattern of Vortis antenna
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WIRELESS TECHNOLOGY

Step-by-step process for using ANSYS HFSS simulation to customize antenna design for specic cell ph

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