Annual General Meeting April 24, 2013

SAFE HARBOR STATEMENT

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including , but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of

words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in

our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our

business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated

orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for

semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,

loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of

terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and

protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,

political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;

potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those

additional risk factors set forth in Besi's annual report for the year ended December 31, 2012 and other key factors that

could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory

consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our

forward-looking statements whether as a result of new information, future events or otherwise.

2

TABLE OF CONTENTS

I. Introduction

II. Market

III. Strategy

IV. Financial Review

V. Conclusion

3

I. INTRODUCTION

KEY FINANCIAL HIGHLIGHTS 2012

• € 273.7 million:

• -16.3% vs. 2011

Revenue

• € 276.1 million:

• -8.3% vs. 2011

Orders

• € 15.8 million vs. € 26.4 million in 2011

• Adjusted net of € 18.2 million vs. € 27.1 million

• Includes restructuring charges of € 2.4 million in 2012 vs. € 0.7 million in 2011

Net Income

• Cash +€ 18.9 million to € 106.4 million

• Net cash +€ 16.8 million

Liquidity

5

STOCK PRICE TRENDS

70.0

80.0

90.0

100.0

110.0

120.0

130.0

140.0

150.0

D-1

0

J-1

1

F-1

1

M-1

1

A-1

1

M-1

1

J-1

1

J-1

1

A-1

1

S-1

1

O-1

1

N-1

1

D-1

1

J-1

2

F-1

2

M-1

2

A-1

2

M-1

2

J-1

2

J-1

2

A-1

2

S-1

2

O-1

2

N-1

2

D-1

2

J-1

3

F-1

3

M-1

3

BESI SOX

SOX -6.7%

Besi +14.9%

6

1/2011- 12/2012

Q1 2013 Besi +15.7%

SOX +13.7%

DIVIDEND TRENDS

0.20 0.22 0.22

0.08

4.0% 4.3%

3.8%

5.2%

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

2009 2010 2011 2012 (b)

Div

iden

d y

ield

Div

iden

d (€)

Base Dividend Special Dividend

Base Dividend Yield (a) Total Dividend Yield (a)

a) Based on year end stock price of € 5.79

b) Proposed for approval at April 2013 AGM 7

CASH AS % OF MARKET VALUE

69.3

87.5

106.4

171.1 187.8

217.9

40.5%

46.6% 48.8%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

0

50

100

150

200

250

2010 2011 2012

Cash

/Mark

et

Valu

e

(€ m

illi

on

)

Cash Market Value Cash/Market Value

As of Dec 31,

8

II. MARKET

ELECTRONIC DEVICE TRENDS

Source: ASE GROUP 10

Computing and Communications Evolution Continues

ASSEMBLY EQUIPMENT MARKET FORECAST

• Since 2010 rebound, assembly market has been trending lower

• Significant market growth anticipated in 2014 (+17.7%) and 2015 (7.3%)

2.1

4.5

4.2 4.2 4.0

4.8

5.1

4.64.8

-28.2%

120.5%

-7.8%-0.8% -2.7%

17.7%

7.3%

-9.3%

3.4%

0

1

2

3

4

5

6

2009 2010 2011 2012 2013E 2014E 2015E 2016E 2017E

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

160%

Assembly Equipment Market Size (Apr 2013 VLSI) YoY Growth Rate (Apr 2013 VLSI)

CAGR ‘12-’17: 2.9%

Source: VLSI April 2013

11

27% 24% 27%

0%

20%

40%

2009 2010 2011

Addressable Market Share

13% 10%

12%

0%

20%

40%

2009 2010 2011

Packaging Market Share

29% 29% 32%

0%

20%

40%

2009 2010 2011

Die Attach Market Share

11% 14% 14%

0%

20%

40%

2009 2010 2011

Assembly Market Share

BESI COMPETITIVE POSITION

Mkt Size: $1,015MM Mkt Size: $668MM

*Source: VLSI Jan 2012

Mkt Size: $1,700MM Mkt Size: $4,192MM

Competition: ASM-PT, K/S, Shinkawa, Tokyo Semitsu, Disco

Company Position: #3

• #3 leading assembly supplier

• #2 in addressable market with 27% share • Leader in die attach

• Gained market share in 2011: • Die attach (die bonding and

sorting) • Packaging (molding)

• Leader in growth areas: • Multi module die attach • Flip Chip • Ultra thin molding

• Accuracy, precision and speed distinguishes Besi vs. competition, particularly for mainstream market

Competition: ASM-PT, Shinkawa, Panasonic, Muhlbauer

Company Position: #1 Die Bonding, #1 Multi Module, #1 Flip Chip, #2 Die Sorting

Competition: Towa, ASM-PT, Yamada, Dai Ichi Seiko, Gallant, Hanmi, Rocco

Company Position: #2 Molding, #2 T&F #3 Singulation

Competition: ASM-PT, Disco, Shinkawa, Towa, Hanmi, Hitachi

Company Position: #2

12

IC PRICING AND ASSEMBLY MARKET TRENDS

Assembly Capacity Utilization & IC Pricing

Book to Bill Ratio

• High degree of industry volatility over past 3 years due to customer uncertainty

• Assembly equipment market has been more volatile than semi equipment market

• Book/bill and pricing have improved since Q4-12. Appears to be recent industry trough

Source: VLSI April 2013 Source: Semi April 2013

1.23

1.12 1.10

1.51

1.40

1.01

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

1.60

Jan 1

0

Feb 1

0

Mar

10

Apr 10

May

10

Jun 1

0

Jul 1

0

Aug 1

0

Sep

t 10

Oc

t 10

Nov

10

Dec 1

0

Jan 1

1

Feb 1

1

Mar

11

Apr 11

May

11

Jun 1

1

Jul 1

1

Aug 1

1

Sep

t 11

Oc

t 11

Nov

11

Dec 1

1

Jan 1

2

Feb 1

2

Mar

12

Apr 12

May

12

Jun 1

2

Jul 1

2

Aug 1

2

Sep

t 12

Oc

t 12

Nov

12

Dec 1

2

Jan 1

3

Feb 1

3

Semiconductor Equipment Book to Bill Trends(3 month moving average)

Assembly Equipment

Total Semi Equipment

1.14

1.16

1.18

1.20

1.22

1.24

1.26

1.28

1.30

1.32

1.34

1.36

1.38

1.40

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

2010 JAN

MAY SEP 2011 JAN

MAY SEP 2012 JAN

MAY SEP 2013 JAN

3 M

on

th A

vg

Pri

cin

g (

$)

% C

ap

acit

y U

tili

zati

on

Assembly Utilization IC ASP

13

Market Environment Cautiously Improving

VLSI initially assumed 6.1%

assembly market downturn in 2013.

Now forecasts 2.7% decline

Mixed industry picture. Renewed

strength in advanced

packaging (tablets, smart phones and

automotive)

Memory and leadframe

suffering due to PC slowdown

Strong growth expected for Besi

in Q2

2013 INDUSTRY OUTLOOK

14

Customers End Products End Use

CUSTOMER ECO SYSTEM

• Blue chip customer base, top 10 customers represent 48% of 2012 revenue

• Leading Asian Subcontractors and IDMs. 57/43% split in 2012

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years 15

Computer, PCs50%

Mobile Internet Devices

22%

Auto13%

Industrial10%

LED3%

Service2%

2008

PRODUCT SHIFT TO ADVANCED

PACKAGING END USER APPLICATIONS

Computer, PCs21%

Mobile Internet Devices

35%

Auto17%

Industrial10%

LED5%

Service12%

2012

Source: 2012 Company Estimates

• Mobile internet

devices now equal

35% of end user

revenue

• Automotive has also

increased in recent

years

• Service/spare parts

have grown to 12%.

Less cyclical revenue

stream

16

Source: Prismark

1,050 900 850 600

400 650 850 1,500

0

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 2015 2016

mill

ion

ph

on

es

Smart Phones 2011-2016

Basic Phones Smart Phones

62.5%

30.8%

76.4%

Tablets 2011 - 2014

MOBILE INTERNET DEVICE MARKET TRENDS

• Rapid unit growth in smart

phones and tablets forecast

over next 5 years

• Estimated unit growth rates:

• Smart phones:

• 2012: 62.5%

• 2016: 3.5x

• Tablets:

• 2012: 120%

• 2014: 4x

• Significant potential revenue

growth driver

17

Wire Bonding

$1,010 75%

Flip Chip

$,334 25%

2017E

FLIP CHIP/WIRE BOND OPPORTUNITY

• Move to <40 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 20% currently of total potential market of $1.2 billion

• Expected to gain share rapidly over next 5 years vs. wire bonding (5.5% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates of key IDMs/subcons

Wire

Bonding

$,938 80%

Flip Chip

$,238

20%

2012

CAGR 2012 – 17

Flip Chip 7.0%

Wire Bond 1.5%

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI April 2013 18

SEMI EQUIPMENT CONSOLIDATION TRENDS

Top 20 Semiconductor Equipment Suppliers

(based on 2011 revenues, after all acquisitions consolidated)

Source: VLSI

19

Besi Acquisition Criteria:

• Technology led mainstream companies which increase IP and can be

incorporated into One Besi platform. Value creation through integration

• Upstream/downstream companies: further advanced packaging position

• Most acquisition candidates lack scale and Asian footprint

Front-end Back-end

III. STRATEGY

2012 PRODUCT DEVELOPMENT HIGHLIGHTS

Advanced packaging is key focus: tablets, smart phones and intelligent automotive electronics principal end use applications currently

• Shipped 100+ evo multi module systems for die attachment of 8 mega pixel lens cap camera modules

• Gained market share in molding systems for ultra thin packaging

Penetration of largest smart phone and tablet ecosystems in 2012

• New assembly challenges such as TCB, TSV, copper pillar and wafer level packaging

• Received first orders for TCB die bonding equipment for next generation 20 nano device geometries

• Began development on 300-450 mm wafer handling for chip sorting and die attach applications

• Ongoing common platform activities

Current development activities

21

2012 OPERATIONAL HIGHLIGHTS

Business Model Enhanced In Light of Volatile Semi Environment

• 35% YOY increase in Asian system production. 274 systems produced in Q2-12

• Record 90% of total systems produced in Asia

• Direct shipments increased to 85% of total Asian shipments

• Capacity expansion completed

Asian production transfer nearly completed

• European headcount down 11%, primarily production personnel

• Average cost per production employee down 7%

• SG&A expenses down € 8.3 million or 12%

• Dutch plating operation rationalized to improve ROI

Break even revenue levels reduced by 13%

• Managed 65% H1-12 order ramp and ensuing 47% H2-12 order decline while maintaining profitability in Q1 and Q4-12, industry trough quarters

• Progress in Asian supply chain expansion

Scalability and flexibility significantly improved

22

BREAK EVEN REVENUE TRENDS

270

235

200 212

-

50

100

150

200

250

300

2011 2012 2013E

(€ m

illi

on

s)

(13.0%)

(10.0% - 15.0%)

23

ASIAN SHIPMENT TRENDS

396

487

658

170

331

553

42.9%

68.0%

84.0%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

100

200

300

400

500

600

700

2010 2011 2012

% D

irect

Sh

ipm

en

ts

Sh

ipm

en

ts

Total Asian Shipments Direct Asian Shipments % Direct

24

HEADCOUNT TRENDS

770 56%

738 49%

741 48%

680 46%

645 44%

614 44%

772 51%

802 52% 799

54% 820 56%

1,384

1,510 1,543 1,479 1,465

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2009 2010 2011 2012 Q12013

Head

co

un

t

Europe/NA Fixed HC Asia Fixed HC

• Headcount trends continue to favorably

influence break even revenue levels

• Fixed European headcount gradually

reducing as shift to Asian manufacturing

progresses:

• Down by 6% sequentially in Q1-13

• Down by 11% year over year

• Declined from 56% of total in 2009 to

44% at end of Q1-13

• Aggregate of 1,524 at Q1-13 quarter end:

• Down 1.0% vs. Q4-12

• Down 5.8% vs. Q1-12

25

STRATEGY TIMELINE

2012 2013 2014

Operational Objectives

Soft Solder DB production transfer to Malaysia

50% Malaysia/100% China capacity expansion

European Die Attach integration activities

Expansion of Asian supply chain. System module outsourcing

Development Objectives

TCB flip chip die bonding development

300-450 mm wafer handling

Common platform activities

26

IV. FINANCIAL REVIEW

SUMMARY FINANCIAL HIGHLIGHTS

• Financial transformation since 2008

• Scale and market presence have changed:

• Esec acquisition expanded mainstream

presence and leveraged revenue potential

• Strategic positioning in advanced

packaging has yielded benefits:

• Enhanced top line growth

• Increased gross margins

• Restructuring efforts have aided gross

margins and profits in face of 2011/2012

industry downturns due to:

• Advanced packaging presence

• Ongoing Asian production transfer

• Reduction of European based costs

• Die Attach integration

• Product line restructurings

• Scalability of business model increased in

response to increased order volatility

• Solid liquidity base. Expanding net cash

Year Ended December 31,

(€ millions, except share data) 2010 2011 2012

Revenue

351.1 326.9 273.7

Orders 376.5 301.1 276.1

Gross margin 39% 40% 40%

EBITDA 60.5 45.6 32.4

Pretax income 47.4 34.4 19.5

Net income 47.3 26.4 15.8

EPS (diluted) 1.25 0.73 0.42

Net margin 13% 8% 6%

Adj. net income (loss) 41.6 27.1 18.2

Adj. EPS (diluted) 1.11 0.74 0.49

Net Cash 22.9 62.7 79.5

28

LIQUIDITY TRENDS

• Solid liquidity position

• € 106.4 million cash at 12/31/12

• € 2.83 per share relative to share price of

€ 5.79 at year end

• Net cash has grown to € 79.5 million

from € 19.6 million at year end 2009

•Significant increase in profitability

•Redemption and share conversion of 5.5%

convertible notes in Q2-2011

• Improved working capital management

• Shareholder value enhanced

• € 26 million spent on share repurchases

and cash dividends in 2011/2012

• 1.5 million share buyback program initiated

in October 2012

• Strong balance sheet supports future

organic growth and acquisition strategy

73.1 69.3

87.5

106.4

(53.5) (46.4)

(24.8) (26.9)

19.6 22.9

62.7

79.5

(80.0)

(60.0)

(40.0)

(20.0)

-

20.0

40.0

60.0

80.0

100.0

120.0

2009 2010 2011 2012

(€ m

illi

on

s)

Cash Total Debt Net Cash

29

KEY FINANCIAL HIGHLIGHTS Q1-13

•€ 64.0 million:

•+13.7% vs. Q4-12

•+14.8% vs. Q1-12

•Above guidance (+5%)

Revenue

•€ 63.9 million:

•+22.8% vs. Q4-12

•-24.2% vs. Q1-12

Orders

•+€ 7.5 million vs. Q4-12 and € 3.4 million vs. Q1-12

Pre-tax Income

•€ 3.8 million in Q1-13 vs. € 1.2 million in Q4-12 and € 0.2 million in Q1-12

•Includes restructuring charges of € 0.2 million

Net Income

•Sequential cash -€ 14.5 million to € 91.9 million

•Net cash -€ 15.3 million to € 64.2 million

Liquidity

Q1-13 Results Exceed Expectations. Q2-13 Results Expected to Increase vs. Q1-13

30

Q2-2013 GUIDANCE

Revenue Gross Margin Operating Expenses* Capex

Q1 Q2 Q1 Q2 Q1 Q2 Q1 Q2

€ 64.0 39.6% € 20.9 € 0.4

41%

-

39%

Up

10%

Up

€ 0.6

MM

* Excluding restructuring

Approx.

equal

• 10% sequential revenue growth forecast based on backlog and order trends

• Gross margins will range between 39%-41%

• Opex approximately equal to € 20.9 million (ex restructuring)

• No restructuring charges anticipated in Q2-13

• Capex of € 1.0 million

31

V. CONCLUSION

SUMMARY

Excellent Product Positioning and Market

Acceptance

Near Term Industry Outlook Has Improved

Strategic Initiatives Offer Increased

Scalability, Revenue and Higher Profit

Potential

Development Efforts Underway for Next

Generation Advanced Packaging

Dividend and Stock Repurchases Enhance

Shareholder Value

33