An EMS Perspective on Advanced Surface Mount Assembly

Gary A. Tanel

Libra Industries Dallas TX & Mentor OH

Gary Tanel - Biography

Gary Tanel Regional Sales Manager Dallas Texas 214-960-9426 GTanel@Libraind.com www.Libraind.com

More than 30 years of design and manufacturing operations Founder of the Electronics Alliance which is a strategic consortium (The EMS Corner) for SMT Magazine since 2005 Served as the president of the Dallas chapter of the SMTA (10 years) SMTA board of directors for that organization from 1996 to 2002. Winner of the “Excellence in Leadership” award for SMTA 2006 “Service Excellence” award from Circuits Assembly magazine “Quality Award for Excellence” from Texas Instruments Business Development & Operations for Circuitronics Sr. Vice President of the Associate Equity Group working EMS M & A Founder (New Product Resource Center) in Dallas Texas Director start-up high-technology operation called Micro-ASI. Began his professional career with Texas Instruments a 1979 – 1999 Mechanical Engineer to Technology Development Manager Bachelor of Science degree in mechanical engineering - Marquette University

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Libra Industries is a privately held electronics contract manufacturing company that has been in business for over 30 years.

We provide customized manufacturing solutions that make our customers more competitive and improve their profitability.

We believe in the importance of taking the time to listen to our

customers and to understand their specific needs. We view their challenges as our opportunity to provide a complete manufacturing

solution with exceptional customer service.

Medical Industrial Military

Abstract

Packaging technology continues to advance in

the design of electronic devices as they get

smaller and more functional. The equipment is

improving to accept these new package styles

and methods. This a presentation will focus on

the needs of the EMS provider in addressing

these new packages, processes, and equipment

in a business setting.

( Less technical, more business perspective)

Goal of this Presentation

1. Come away with at least 1 new idea

2. Give EMS things to think about

3. Give OEM an appreciation of EMS

Key Issue

Its not the technology, it’s the process

Role of the EMS

•Provide the manufacturing industry’s best

practices for the build of the OEM’s products

Not just build to print

•Allow OEM to focus on product function and

marketing

What EMS looks for in a New Customer

•Are they experienced in the design process?

•Is the BOM organized?

•Do they have a good internal design staff?

•Do they have logical assembly drawings?

•Have they designed for production - DFM?

•Do they pay their bills - on time?

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What EMS looks for in a Product RFQ

•Full Set of Gerbers

•CCA, Box Build Drawings, Metal, etc

•BOM in EXCEL with Manufacturers – AVL

•SPECS IPC 610 class , J-STD, ITAR, 113485, …

•Traceability requirements for components

•Solder RoHS / Tin-Lead

•Conformal Coatings

•Testing : Flying Probe , ICT, Functional

•Is it producable with the on-hand equipment

Electronics packaging requiring extra thought

System Level Sheet Metal Cast Metal Machined Metal Molded Plastic Potting Porosity Sealing Liquid Filling Conformal Coating Hermetic metal/glass cases Hermetic ceramic packages

Chip Carrier BCC: Bump Chip Carrier CLCC: Ceramic Leadless Chip Carrier Leadless chip carrier (LCC): Leadless Chip LCC: Leaded Chip Carrier LCCC: Leaded Ceramic Chip Carrier DLCC: Dual Lead-Less Chip Carrier (Ceramic) PLCC: Plastic Leaded Chip Carrier BGA Micro-BGA Chip Scale Customized leadframe-based CSP Flexible substrate-based CSP Flip-chip CSP (FCCSP) Rigid substrate-based CSP Wafer-Level redistribution

Discrete Package 0201 01005

WHY DFM?

• DFM is a proven, cost-effective strategic methodology.

• Early effective cross functional involvement: – Reduces overall product development time (less changes, spins, problem

solving)

– Results in a smoother production launch.

– Speeds time to market.

– Reduces overall costs.

• Designed right the first time.

• Optimizes # of parts

• Optimizes # of process steps and use of correct, efficient steps

• Reduces labor costs to repair and resolve issues

• Improves overall production efficiency.

• Build right the first time = less rework, scrap, and warranty costs.

– Improved quality and reliability results in:

• Higher customer satisfaction.

• Reduced warranty costs.

Basic DFM Checklist - Help your OEM

• Baseline – Their design matches our

capabilities

• Bare Board – Trace width and spacings

– Laminate material

– Symmetry of stackup

– Complexity of via connections

– Incorporation of new materials (embedded passives)

– Single-sided vs. double-sided

• System – Blind connections

– Z dimension limitations in box

• Assembly – Elimination of hand soldering or

wave soldering when possible

– Proximity of components to flex points

– Component spacing

– Size of components and complexity of packaging

– Orientation of components to wave solder

– Shadowing during wave solder

– Appropriate dimensions and spacings for PTHs and bond pads

– Attachment methods

– Moisture sensitivity level (MSL)

– Cleanliness

Add Capability ?

If the components (or other issues) are NOT within the current capability……. •It should have been caught in the quote process and included in pricing and cycle time.

• If not ooops, time to scramble •One time use or needed for other customers?

•Cap-Ex or Overhead expense if general •Customer paid if specific

•Execute •Gather the right team members •Schedule the plan of action •Include verification plan

Some Interesting Statistics

• 60% of overall product cost is determined by decisions made early in the design process

• 75% of manufacturing cost is determined by design drawings and specifications

• 70 – 80% of all products’ defects are directly related to design issues

Source: DfR Solution – IPC Webinar 8-2011

Root Cause Methodology

It is critical that your organization has a formal root cause problem solving methodology used both internally and externally with suppliers.

This is the best way to incorporate relevant material into your customized Design for Manufacturing and Sourcing guidelines.

CCA Type - Conversation with your OEM

Cost structure lowest to highest for assembly: $ to $$$

Single sided SMT

Double Sided SMT

Single sided SMT with THT on same side as SMT

Double sided SMT with THT on Top side (Selective solder)

Double sided SMT with THT on Top and Bottom side

Determine the required cleanliness for the assembly

A no-clean flux is the least expensive solution but may not be

acceptable for an impedance sensitive assembly.

PCB Conversation with you OEM

Choose standard hole (via) sizes

Specify the appropriate surface finish

Make accommodations for In-Circuit-Test connectivity ICT

Tent via’s where possible

Pay for point-to-point testing

Request solder resist between all high pitch component leads

Be sure all silkscreen polarity indicators are visible and easily readable

Components

• Components on assemblies and listed on BOM’s should be in a “Growth” or “Mature” lifecycle stage.

• Components that are in the “Preliminary”, “Decline”, “Phase-out” and “Obsolete/Discontinued” lifecycle stage should be avoided to insure component availability and reliability for long term production life. Components in the “Preliminary” lifecycle stage should be avoided because usually the product line is not in full production and can present availability issues just as much as parts being discontinued or obsolete.

• Components on Assemblies’ Bill of Materials should exhibit the following characteristics:

Active Phase of Production Multiple Sources Machine Cleanable Standard Machine loadable format Tape and Reel preferred Matrix Tray SMT parts in tubes should be avoided

Functional Test Considerations

Write code to accommodate a full featured test factory test vs. field test with additional setup and calibration parameters. Bed-of-nails test fixtures are more resilient and faster to use than cable to connector test setups. Design in diagnostics Design in factory test to prevent production from having to run a lengthy final verification

NPI Strategy

All New Products require a careful review of all the aspects of the design and production plan before the job can be released to the floor. Processes to be demonstrated on the NPI line.

NPI Checklist – Pre-Launch Checklist

•Set-up launch team •Review Purchase Order to Proposal •Validate quoted BOM to final BOM •Post delivery needs and lead times •Post quality requirements •ID advanced/special components •ID advanced /special process •ID verification system for new processes •Call-out serialization and traceability •C of C Certificate of Conformance

NPI Checklist – Testing

•TRD - Test Requirements Document •PCB fab testing confirmed •Flying probe, ICT, or Functional •Fixtures, Software, Procedures •Golden Board provided? •Equipment acceptance procedure •Verify test times - compare to quote •Testing validation •Spares requirements for test •Troubleshooting procedure

Customer Involvement - Interface

•Kick-off launch meeting •Weekly readiness reviews •Document review / approval •Quarterly reviews •First Article verification (on-site or remote)

NPI Checklist – Tooling

•Stencils •Wave solder pallets •Test fixtures •Helpful tool to improve production •Carriers for transport in shop •Component programming sockets •Press fit connector

Compare to what was actually quoted

NPI Checklist – Internal Documents

•Process flow – traveler •Work Instructions – Process sheets •Labeling solutions •Testing procedures •Incoming material special instructions •De-panelization plan •Packing and shipping instructions

NPI Checklist – Packing and Shipping

•CCA or finished product •Company boxes or custom? •Box packing instructions & layout •Units per box & boxes per pallet • Shipping instructions

•customer or end user

Low or no standoff parts are particularly vulnerable to cleanliness / residual flux problems

•Difficult to clean under

•Short paths from lead to lead or lead to via

•Can result in leakage resistance, shorts, corrosion, electromigration, dendritic growth

QFN, CSP & Low Profile Cleanliness Issues

EMS Specialization

Not all EMS companies are the same Some EMS companies specialize is advance packaging and the latest in component capabilities. These tend to be lower volume and more expense suppliers. They have higher end engineering staff to work the new platforms. Most EMS companies select the standard component set used by 80% of the application that do not focus on the state-of-the art packaging. They tend to be lower cost due to lower cost of capital and high end engineering support required. Equipment is the same way. Offering advanced packaging like FLIP CHIP requiring underfil, acoustic imaging, dip fluxing, and bare die handling. Not all EMS companies have the adv pkg niche equipment

•Understand the Customer –Needs & Limitations •Understand the Product – Intended Use •Plan the non-standard processes through NPI •Use the NPI Checklist & Process •Get involved early in the design – Provide DFM •Verify & test new processes •Communicate with customer regularly

Summary – EMS Perspective

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