the effect of process equipment on fine-line uniformity effect of process... · 2014. 4. 12. ·...

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Page 1

The Effect of Process Equipment on

Fine-Line Uniformity

March 25, 2003

Page 2

Preface

Test patternsUniformity issuesPhotoplotter resolutionLaser direct imagingEtching uniformity

Page 3

Conductor/Space Panels

Page 4

Conductor/Space Modules

Design1 inch by 1 inch4 conductors and 3 spacesSelectable conductor and space sizes

AnalysisYields and defect densitiesPredicted product yieldsConductor width and height uniformityProcess capability (Cp, Cpk)

Page 5

Conductor Width and Height

Average conductor width over its lengthAverage conductor height over the module

width

height

Page 6

Uniformity Issues

Types of non-uniformities

Feature orientationPanel surfaceSide-to-sidePanel-to-panelLot-to-lot

Sources of non-uniformities

ArtworkImagingDevelopingEtching

Page 7

Photoplotter Test

18 x 24 inch panels1-oz copperPrint and etch[3] 4 [4] 5 [5] 6 [6] [conductor] spaceConstant process conditions

Page 8

Photo-Plotter Resolution

8,000

8,000

20,000

Resolution (DPI)

0.1561.031.69B

0.0950.661.61A

0.0860.491.76A

Std. Dev. (mils)

Range (mils)

Mean (mils)Plotter

Page 9

Plotter A at 20,000 DPI

Surface Std. Dev. = 0.086 milsSurface Range = 0.41 mils

Page 10

Plotter A at 8,000 DPI

Surface Std. Dev. = 0.091 milsSurface Range = 0.51 mils

Page 11

Plotter B at 8,000 DPI

Surface Std. Dev. = 0.148 milsSurface Range = 0.856 mils

Page 12

Laser Direct Imaging Test

18 x 24 inch panels0.5-oz copperPrint and etch[2] 2 [3] 3 [4] 4 [5] [conductor] spaceSingle-sided exposure

Page 13

LDI Top Side

Page 14

LDI Bottom Side

Page 15

Etching Non-Uniformities

PuddlingStripingDirectional dependenceEdge dependenceCombinations

Page 16

Puddling

Page 17

Striping

Page 18

Directional Dependence

Page 19

Edge Dependence

Page 20

Puddling and Striping

Page 21

Puddling and Directional

Page 22

Directional and Edge

Page 23

Etching Uniformity

Improvements are possibleCooperation between equipment manufacturer and PCB fabricator is critical

Page 24

Top Side - Initial

Surface Std. Dev. = 0.110 milsSurface Range = 0.57 mils

Page 25

Top Side - Final

Surface Std. Dev. = 0.079 milsSurface Range = 0.46 mils

Page 26

Bottom Side - Initial

Surface Std. Dev. = 0.160 milsSurface Range = 0.74 mils

Page 27

Bottom Side - Final

Surface Std. Dev. = 0.071 milsSurface Range = 0.40 mils

Page 28

Final Thoughts

Uniformity improvements are essential forcontrolled impedance productshigh-density products

Etching is not the only source of non-uniformitiesProcess non-uniformities can cause opens and shortswww.cat-test.info

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