sbc corporate office & integrated technologies division - chandler, az

SBC Corporate Office & IntegratedTechnologies Division - Chandler, AZ.

Presentation Menu

• Contacting South Bay Circuits • Integrated Technologies Division• Process Capabilities• PCB Manufacturing Division• Design Guidelines for Manufacturability and Assembl

y

Click on a Link to view a specific area of interest, Click on a Link to view a specific area of interest, otherwise the presentation will continue in the order otherwise the presentation will continue in the order above shortly.above shortly.

How To Contact SBC• South Bay Circuits – Chandler, Arizona

Phone (480) 940-3125 Fax (480) 940-

4270 • South Bay Circuits – San Jose, California Phone (408) 978-8992 Fax (408) 723-

0916

• FTP (file transfer protocol) Call: John Lundin - 480-940-3125 ext: 150

• Web page: www.sbcinc.com

People To Know At South Bay CircuitsChandler, Arizona FacilityRoland Satterlee – President/CEO 480-940-3125 ext.

124Randy Langston – Director of Sales 480-940-3125 ext.

191Dan Farrell – VP of Manufacturing 480-940-3125 ext.

176Mike Malles – Director of Operations 480-940-3125

ext. 107Amy Kryzak – Customer Service 480-940-3125 ext. 106Kristi Wiley – Western Regional Sales Mgr. 408-579-

8225Eddie Rocha – Director of Technology 408-579-8282

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South Bay Circuits, Inc.Established 1981

• Multiple Manufacturing Facilities - 220,000 Total Square Feet

• All facilities ISO-9002 Registered by Underwriters Laboratories since 1996

• PCB’s, Assemblies & Backplanes• Time Critical Requirements in 24

Hours• Pre-Production & Production Volumes

in 72 Hours

Integrated Technology Division

Assembly Pre-Production Engineering• Design Rules Check and Capabilities

Review• Process Route Generation• Machine Programming• Assembly Tooling Design• Stencil Design• New Process Development

Integrated Technology Division

Assembly Materials Storage• Secured Material Storage• Separate Consigned Materials Area• Full ESD and Moisture Sensitivity

Precautions

Integrated Technology Division

Assembly Test Capabilities• Level II, III and IV Available• ICT or Flying Probe• Burn-in and Environmental Stress

Screening

Integrate Technology Capabilities

• SMT• Wave Soldering• IPC Certified Hand Soldering• Custom Component Installation• Hardware Installation• Card Cage and Chassis Assembly• Electro Mechanical Assembly• Cable and Harness Assembly• Backpanel Press-Fit Assembly• ICT, Functional, ESS Testing

Integrated Technologies Division

Integrated Technologies Division

MPM AP-36 Screen Printer*Fully Automatic with Vision

*28 x 28 Printable Area*Fine Pitch Capable

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Integrated Technologies Division

Fuji SMT Line

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Integrated Technologies DivisionFuji SMT Line

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Integrated Technologies Division

MyData MY12 SMT Placement*Prototype and/or Large Board Capability

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Integrated Technologies Division Conceptronic Convection Oven

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Integrated Technologies Division* Box Build Assembly and Staging Area

Integrated Technologies Division* Back Panel Assembly

* Press Fit Connectors & Component Assembly

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Integrated Technologies Division * Bare Board Assembly

* Complete Box Build Integration

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Integrated Technologies Division*Soltec-Wave Solder *3 Zone bottom heat*Pulse top heat *Lambda and Chip Wave

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Integrated Technologies Division*GPD Aqueous Wash

*Complete DI Water System - Closed Loop

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Integrated Technologies Division*Teradyne Z1860VP ICT Tester

*Multi-Scan Package*2048 Points

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Integrated Technologies Division

*Press Fit Assembly

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Integrated Technologies Division* QC / Inspection

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PCB Manufacturing Capabilities

• High Temperature FR4 > 170 Tg• Getek / FR408 / Polyimide• Rogers 3000 & 4000 Series• Copper Foil - HTE 1/8 oz. - 4 oz.• Multilayers Down to 0.015” thick• 0.230” thick PCB’s• 18x24, 19x25, 21x24 Panel Sizes• Buried / Blind Vias• Electroless Nickel Immersion Gold• Hard Gold• Soft Bondable Gold• Entek 106A• Hot Air Solder Leveling (SMOBC)• Solder Reflow

PCB Manufacturing Capabilities• White Tin Immersion• Resistive Inks• Electrical Testing• Edge Plating• 10:1 Aspect Ratio• Soldermask Registration to 0.002”• Soldermask Dams between SMT features with 0.007”

space• Soldermask Colors - Green, Blue, Red, Black and

Clear• Impedance - Single-Ended & Differential +/- 10%• Thru holes with pad 0.008” over drill• Prototype Line Capability - Internal (0.003”) -

External (0.004”)• 0.010” Pitch SMT (TAB) / BGA’s• 0.010” Thru Hole Drill / 0.008” Blind Via Drill• Micro-ViasReturn to menu Next Section

Cam / Programming* Valor ODB++ Software

* Sun Sparc Ultra 7 & 10 Workstations* Customer Data Reviewed & Prepared for Fab

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Inner Layer Material Prep/Clean Line

*ISS Mechanical Pumice Scrubber

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Inner Layer Dryfilm Coat* Dupont Automated Cut Sheet Laminator

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Inner Layer Imaging* Colight Exposure Units

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Conveyorized D.E.S. Line* Develop ---> Etch ---> Strip ---> Durabond

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White Oxide Line for I/L’s

*Durabond

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Post Etch Tooling Punch* Automatic Optical Alignment to Post-Etch

Targets

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Inner Layer Optical Inspection

* New Camtech AOI Machines Capable of Comparing Scanned Image to Supplied

Gerber(AOI – Automated Optical Inspection)

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Inner Layer Lamination*Internal Layers are Stacked and Dielectric

Material(Pre-Preg) Added Between Layers for Bonding

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TMP Hydraulic / Vacuum Assist

Lamination Presses* Computer Controlled / Pre-Set Lamination

Cycles

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Primary Drilling - Excellon Century 2001

*Six Spindles with Auto Bit Exchange *Capable of Drilling Oversized Panels

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Pluritec Inspecta X-ray Vision System

*Confirms Internal Registration Prior to Drilling

*Drills “New” Tooling Holes as Required

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PENC Electroless Copper Plating Line

* Computer Controlled - Increased Productivity* Agitation - Vibrator for High Aspect Ratio PCB’s

* Bumper - for Copper Process Only

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In Process Cross Section Lab * X-section’s are Reviewed for Process

Controls*400x Micro-scope for Viewing X-Section’s

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Outer Layer Imaging * Colight Exposure Units

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Automated PAL Plating Line*11 Acid Copper Plating Stations*Twin Rectifier Units Per Station

* Automated Twin Hoist / High Repeatability

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Strip - Etch - Strip Line - Outer Layers

* Fully Conveyorized Three Station Line* Strip Plating Resist ---> Etch Copper ---> Strip

Tin

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Solder Mask * DP-10 & DP-100 Auto-Screeners * Tack Dry

* UV Expose

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Micro - Plate Line* Hard Gold & Nickel Plating of Edge

Connectors

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Fabrication* Routing of Individual PCB’s - Single up or Array

Format * Edge Beveling & Scoring*Secondary Drilling as Required

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Electrical Test Programming & Fixture Assembly

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Electrical Test Department* All orders are 100% Netlist tested

* Everett Charles 9090 - Dual Access Tester

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A Winning Combination

•Commitment to On-Time Deliveries

•Technical Expertise and Support

•Vertical Integration•Team Selling and

Engineering•Commitment to Quality

Document Links• Please click on document

link to access the following documents

• SBC Design Guidelines for Manufacturability

• SBC Design Guidelines for PCB Assembly

ManufacturabilityManufacturabilityGuidelinesGuidelines

Printed Circuit BoardsPrinted Circuit Boards

FOR

South Bay Circuits, Inc.210 Hillsdale Av.San Jose, CA. 95136(408) 978-8992 By: Edward Rocha

GL-0700

South Bay Circuits

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Printable VersionManufacturability Guidelines for PCB’s