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GLOBATRONIC ENGINEERING
PRODUCT & SERVICES. . .
ELECTRONIC INDUSTRY
We are third party service and spare part provider for below system and cover nation wide.
Soldering System Reflow oven system
Globatronic Engineering business is more concentrate on machining Precision parts, Electronic Industry supply and machine services. As a Trading company for Electronic Industry, Globatronic Engineering providing spare parts such as Pneumatic , Electrical, Electronic and Mechanical for wide range of brand Equipment. Beside that, we also provide precision parts and custom made precision parts with various type of material, wiper paper, high temperature oil, solder paste , solder wire and solder bar, component mounting tape with various sizes, dross reduce solution and etc. Provide machine Service and Supply spare part for below equipment. VITRONIC SOLTEC WAVE SOLDERING VITRONIC SOLTEC REFLOW OVEN SOLTEC MIDI WAVE , MAXI WAVE DEK PRINTER ELECTROIVET ELECTRA HELLER REFLOW OVEN BTU REFLOW OVEN STENCIL CLEANER AMERICAN AUSTIN MARTIN KERRY FUJI XP/CP/NXT ELECTROVET PCB WASHING MACHINE
GLOBATRONIC ENGINEERING
Supplying new equipment as below.
Brand DEER MARK Research and Development Taiwan and US Manufacturing China
OUR PROUCT Stencil cleaner , SMT Nozzle Cleaner , BGA Rework Station, Wave Soldering Equipment, Reflow Oven, Feeder Calibration.
REFLOW OVEN
KWA-1225 SUPER EP
CTC Hot Air Convection Heating Method
Infrared Compensation for BGA & CSP (option) Cooling Type Flux Filtration System (option) Low Temperature Cooling Zone for Fine Micro-structure Solder Joints
Intelligent Control System for Less Power Less N2 Consumption (Option)
Reduce hot air inter-influence between two zones Faster change the new model profile requirement and reduce the cost
GLOBATRONIC ENGINEERING
Highlight:Highlight:Highlight:Highlight:
High-velocity turbine hot air blower to enhance heattransmission Special-designed”hot-air+infrared”heating technology for BGA & CSP (optional) "Rapid cooling" technology for ideal flux management Low temperature cooling zone for finer Micro-structure solder joints
Intelligent control system for less power & N² consumption
Reduce hot air inter-influence between two zones by flash
air system provided fast temperature drop faster change the new model profile requirement and reduce the cost
Specifications:Specifications:Specifications:Specifications:
ITEMITEMITEMITEM TECHNICAL DATATECHNICAL DATATECHNICAL DATATECHNICAL DATA
Heating Zones 8/8 10/10 12/12
Power Source AC 380V ±5% 50/60Hz 3 Phase 5 wire
Air Source 3.5-6.0 kg/cm2 ( 50 - 85 psi )
Heating Method Type CTC Forced Air Convection / or IR as required
Application 4830mm 5200mm 5500mm
Conveyer Length 1Kw UPS back-up
Cooling Method Forced Air + cooling Fan (Option Air Chiller)
Oven Temperature Range Room Temperature to 350℃
Temperature Setting Accuracy +/- 0.1 deg C
Temperature Tolerance +/- 1.5 deg C
Temperature Control PID closed loop with sequential start up sequence for the heaters
PCB width PCB PCB effective width 50-450mm (Rail adjustable from 50mm to 500mm)
Conveyor Direction Left to Right or Right to left
Conveyor Type Mesh / Chain / Mesh + Chain
Conveyor Speed 0.3 to 1800mm /min
Conveyor Height Mesh: 860mm +/- 20mm, Rail: 900mm +/- 20mm
Machine Control System Windows Professional for Industrial PC + Logical Software
SPC Database Product amount / Idle Time / Operation Time
Profiling System 3 channel Profiler / ±1℃ / Delta T & Temperature Gradient Display
Safety System High and Low Temperature alarm, Lack of phase power alarm, PCB jam alarm
Steady State Power(approximate)/Start Up Power(approximate)
8.5kW/41kW 10.5kW/45kW 12.5kW/49kW
Overall Dimensions L4830 x W1440 x H1650 L5200 x W1440 x H1650
L5600 x W1440 x H1650
Net Weight (approximate) 2500Kg 2780Kg 3050Kg
GLOBATRONIC ENGINEERING
WAVE SOLDERING SYSTEM
KWA-350/500 SUPER EP
• Chip/Lambda Dual-Wave Nozzles (Patent)
• (Dross Amount ≦ 2.8kg/8hr)
• Solder-saver Device (Option) Dross oxides powder ≦0.5kg/8hr
• Hot Air Convection Pre-heaters for VOC Free Liquid Flux
• Low Temperature Cooling Zone for Fine Micro-structure Solder Joints
• Stability-enhanced Computerized Fluxer System (Optional Stand-alone Fluxer Available)
• User-friendly Intelligent Control Interface
• Design for Low Power
• Less N2 Consumption (Option)
Highlight: Hydrodynamic-designed Chip/Lambda Dual-Wave nozzles
(Dross amount <2.8kg/8hr)
Turbine hot air convection Pre-heater for VOC free liquid flux Low temperature cooling zone for fine
Micro-structure Solder Joints
Motorized fluxer head transverse optional stand-alone fluxer available
Rapid cool flux management system
Design for low power and N² consumption
GLOBATRONIC ENGINEERING
SPECIFICATION
ITEM TECHNICAL DATA
Dimension (L x W x H) KWA-350 SUPER EP KWA-500 SUPER EP
Net Weight 3800(4200) x 1250 x 1900 3800(4200) x 1250 x 1900
Application 2330kg 3150kg
Board Width Lead Free Applicable
Power Supply 50 to 350 mm (Standard) /50 to 500 mm (Option) 500mm)(500)
Power Consumption 3-phase,380VAC,50/60Hz
Pre-Heating Zone Length 18Kw(Start-up)/6.8Kw(Normal)(350) 26.4Kw(Start-up)/8.5Kw(Normal)(500)
Temperature Control 900mm x 2/ Hot Air 600mm x 3(Option)
Temperature Accuracy P.I.D Close-looped Control P.I.D
Temperature Setting Accuracy ±2℃
Heating Zone Temperature Range ±0.1℃
Conveyor Finger Type Room Temperature to 250℃
Conveyor Direction Finger double strengthened 'V' groove or 'L' shape type rail chain
Conveyor Speed Left to Right or Right to Left
Conveyor Height (Unload) Computerized Control by 0.3 to 1800mm/min
Solder Pot Material 750±20mm
Solder Pot Capacity Titanium TA1 purity
Solder Pot Temperature Setting 420kg (350) 600kg (500)
Solder Dross Amount Room Temperature to 350℃
Solder Wave Height ≤2.8kgper8hrs (350)/ ≤ 3.5kg per 8 hrs(500)
Solder Wave Motor Speed Computerized Control by 1 to 10mm
Fluxer Type/Capacity Computerized Control by 1,450 RPM (max.)
Machine Control System Computerized Control Spray Fluxer/8.3Litre
Operation System Industrial PC + Logical Software
SPC Database Windows XP
Profiling System Board Count, Idle Time, Power-on Time and etc
Oxygen analyzer 3 channel Profiler / ±1℃ / Delta T & Temperature Gradient Display
Center Rail Support Option
UPS Option
1KVA
GLOBATRONIC ENGINEERING
SCREEN PRINTER
KWA1020V(K1/K2)
• Accurate print pressure control
• Self-leveling floating squeegee
• Accurate pcb separation process control
• Squeegee protection
• Close loop control system
ADVANTAGES
• Self-leveling Floationg Print Head System
• Squeegee Y Axis Movement • Squeegee Protection System
• Automatic Stencil Cleaning System • Transport&clamping System
• Servo Motor Drive
• Calibration Platform
• Vision System
GLOBATRONIC ENGINEERING
SPECIFICATION
Item K1 K2
Accuracy Accuracy 01005(±0.002mm) 01005(±0.018mm) Repeating Accuracy
±0.008mm
Cycle Time <8S
Stencil Stencil Size 420mm*380mm—737mm*737mm
Stencil Clamping Air &#118alue
Stencil Positioning Automatic
platform Calibration Limit X:±4mm Y:±6mm
Direction Limit ±2℃ ±8℃
PCB Printing Size 50mm*50mm—400mm*340mm
PCB Thickness 0.4—5mm
Transport Transport Direction L-R;R-L;L-L;;R-R
Transport Speed Stepping Motor 100-1500mm/s
Programmable
PCB Weight 0-3Kg
Transport Hight 900±40mm
Transport Width 50-340mm
SMEMA Interface Standard
PCB Separation 3 Stages Programmable Separation
Paste Inspection 2D Inspection(Optional)
Work Condition Power Input AC:220±10%,50/60Hz
Power
Consumption
3KW
Air Pressure 4.5—6Kg /cm
Machine Size 1140mm*1360mm*1500mm
GLOBATRONIC ENGINEERING
STENCIL CLEANER
SCP-1
solvent consumption. Internationally recognized critical components are used to ensure long term quality and reliability. Modular design to ensure easy maintenance
SPC-1
GLOBATRONIC ENGINEERING
STENCIL CLEANER
SC-DP 1
SC- DP 1
Description : Completely pneumatic operation without any fire risk.
Equipment is ergonomically in designed. Cleaning and drying process can be
easily control with one-button operation.
SC-DP1 is designed for cleaning of solder paste, glue and silicone adhesive.
Special nozzle design ensures high cleaning performance. Stencil tension is not affected during the cleaning process.
Auto liquid feeding and draining system.
Triplex filter system with precise exhaust design and control. Liquid can be
recycled which results in lower solvent consumption.
Internationally recognized critical components are used to ensure long term quality and reliability.
Modular design to ensure easy maintenance
SC-DP1 Dimensions 980 X 1100X 1700mm
Weight 480 kg
Stencil Size L736mm X W736mm X H 40mm or standard
Liquid Tank Capacity Max:70L Min:40L
Clean Time 4-6min
Dry Time 4-10min
Triple Filter System Standard
Air Consumption 400-600L/min
Solvent IPA, alcohol and water-based solvent
DISPENSING MACHINE
GLOBATRONIC ENGINEERING
KWA-511-TC/KWA-11-SS
• High Precision Servo Motor for X, Y, and Z Axis
• Programmable motion patterns for dot, line, curve, circle, irregular curve, encapsulating
• User Programmable Dot size, Speed, and Dwell Time by High Capacity Built-in Memory
• CCD Camera and Vision Positioning System
• Excellent Built-in Heating Structure on Worktable
• Ideal for Applications of Chip-on-board, Mobile Phone, DC, Heat-sink, LED, LCD, DVD,
Semiconductor, SMT in-line, and etc. • User-friendly operation system
• High precision servo motor enhance accuracy • Programmable motion for varies pattern
• User programmable dot size, speed and dwell time by high capacity built in memory • CCD camera or vision positioning system for highest process quality
• Excellent built in printing structure on worktable] • Custom design software and mechanical availability
Specifications:
ITEM
TECHNICAL DATA
KWA-511-TC KWA-511-SS
TC-1 TC-2
Dimension (L x W x H) L750 x W780 x H820 L1050 x W1080 x H1400
Weight 60kg 480kg
X,Y, Z distance X250mm / Y320 mm / Z80mm X250mm / Y320 mm / Z80mm
Speed 5-500mm/sec 5-500mm/sec
Repeatability ±0.015mm ±0.015mm
Driving Mechanism X-Y-Z Axis Stepping
Motor Servo Motor option X-Y-Z Axis Servo Motor
Control Touch Screen + PLC
Control
Touch Screen + PLC
Control
Computer Control Windows 2000
or XP
Auto Mark Position None Option Option
Optional Accessories
Needle, Syringe, Glue Gun,
Pressure Glue Container,
Glue Volume Controller
Needle, Syringe, Glue Gun,
Pressure Glue Container, Glue
Volume Controller
Work Table (Pre-heat) Option Option Custom Designed (Pre-heat Available)
Power Requirement Single-phase 220VAC, 50/60Hz, 0.8kw
(Pre-heating)
Single-phase 220VAC, 50/60Hz,
1.2kW (Pre-heating)
Air Consumption 3 to 6 kgf/cm² 3 to 6 kgf/cm²
GLOBATRONIC ENGINEERING
Feeder Calibration Jig
FEEDDER CALIBRATOR
DESIGN for Fuji CP6, Yamaha, Sanyo; Panasonic, Universal, Sony, Juki and Samsung feeders.
A 10 'color LED display, LED ring light illumination, CCD camera 50 x magnification,
the structure is more compact and simple. Effectively in reducing eye fatigue
and improve accuracy
Configuration : 1 set of 50x with cross lines CCD 1 set of CCD adjustable silder 1 x Base plate 1 x pressure control gauge 1 x 6 meter tube 1 x Calibration jig 1 x 10" LCD monitor 1 x Instruction manual
GLOBATRONIC ENGINEERING
SMT NOZZLE CLEANER
SPECIFICATION
CLEANING PROCESS FLOW
FEATURES OF NOZZLE CLEANER
1. The effect of Carbon reduction by using distilled water 2. Possible to clean 12 unit at same time 3. Easy to operate with Touch Screen Panel 4. Reduce the time to charge the nozzle by using the nozzle holder 5. Parts pick up rate improvement 6. Mounting efficiency improvement 7. Quality improvement 8. Labor cost reduce
RESULT WASHING CLEANING
Auto soldering Robot Fully automated soldering robots for precision, repeatability and efficiency soldering
GLOBATRONIC ENGINEERING
BGA REWORK STATION BGA REWORK STATION BH-6808R
Total Power 4850W
Top heater 800W
Bottom heater 2nd heater 1200W,,,,3rd IR heater 2700W
Power AC220V±10%%%% 50/60Hz
Dimensions 850×830×800 mm
Positioning V-groove, PCB support can be adjusted in any direction and with external universal fixture
Temperature control
K-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree
PCB size Max 370×450mm / Min 22×22mm
Electrical
materials
Taiwan touch screen + PLC + heating plate(Germany)+high precision intelligent temperature control module
Camera magnification
3-54X
Optical system CCD color high-definition imaging system, manually
BGA chip 2×2-80×80mm
Touch screen 7.0” Resolution 640X480, Panel Visa touch screen, external USB interface
Ext. temperature sensor
One (optional)
Placement Accuracy
X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
Net weight 75kg
GLOBATRONIC ENGINEERING
Main Features • Adopt linear slide which makes X, Y, Z axis all can do micro adjust or rapid positioning, with high precision, easy operation. • There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature
parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.
• High-precision K-type thermocouple with closed loop control, PID auto-tuning temperature system, combined with highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 2 degree. The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately.
• V-groove PCB support, rapid positioning, convenience, accuracy and can fit for all kinds of PCB board. • Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of
BGA repair. • With different size alloy BGA nozzles, 360 degree rotation, easy to install and replace. Customization is available. Laser
positioning function is optional. • High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus. With automatic color
resolution and brightness adjustment device. It can adjust the definition of the image manually. • Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can
observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15” TFT LCD Monitor.
• CE certification, with emergency switch and automatic power-off protection device when emergency happens. • After finishing de-soldering and soldering with a double over-temperature protection, there is alarming and alarming in
advance. When temperature goes out of control, the circuit will automatically power off. • It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at
any time. • Powerful cross-flow fan to cool the PCB board automatically after de-soldering and soldering, it can prevent the deformation
of PCB board to ensure the welding effect. • Human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function,
can save multiple profiles, instant curve analysis function. • Multifunctional and humanized operation interface, with “set up" and "operation" interface on the touch screen to prevent
wrong operations and setting. With password protection to prevent arbitrary changes.
BGA REWORK STATION BH-680RD
Total Power 5800W
Top heater 1200W
Bottom heater 2nd heater 1200W,,,,3rd IR heater 3300W
Power AC220V±10%%%% 50/60Hz
Dimensions 650×800×790mm (LCD stand not included)
Positioning V-groove, PCB support, external universal fixture
Temperature control K-type thermocouple (Closed Loop), heating independently, temperature precision within ±1 degree
PCB size Max 400×450mm Min 10×
Electrical materials
Servo Drive( Panasonic)++++Touch screen(
Taiwan)++++Panasonic PLC++++Heating
plate(Germany)
Camera magnification 10-100X
Optical system Joystick control, Motor drive, CCD color high-definition imaging system
BGA chip 2×2-80×80mm
Touch screen 7.0〃〃〃〃,Resolution 640X480, Panel Visa touch
screen, external USB interface
Ext. Temperature Sensor 4
Work Mode Power drive
Placement Accuracy X, Y axis and R angle with micrometer adjust, accuracy within ± 0.01MM
Net weight 80kg
GLOBATRONIC ENGINEERING
Main Features • Panasonic servo drives, joystick control, micrometer adjustment, X-shaped infrared laser positioning, 6-8 Rapid heating and
cooling settings. Automatic feeding and feeding systems are optional. • There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature
parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.
• High-precision K-type thermocouple with closed loop control, automatic temperature compensation system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 1 degree. The external 4 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately.
• V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board. • Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of
BGA repair. • The top heater device and mounting head 2 in 1 design and ball screw drive. Z-axis movements are controlled by Panasonic
servo system which can accurately control the site and hotspots; with different size alloy BGA nozzles, 360 degree rotation, easy to install and replace. Customization is available.
• High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus. With automatic color resolution and brightness adjustment device. It can adjust the definition of the image automatically;
• Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15” TFT LCD Monitor.
• CE certification, with emergency switch and automatic power-off protection device when emergency happens. With protective mesh to prevent components falling or human burns happen.
• Mounting, welding and de-welding process are intelligent controlled and work automatically. BGA mounting position is controlled accurately. After finishing de-soldering and soldering, there is alarming. When temperature goes out of control, the circuit w automatically power off.
• It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time. You can print, save and analyze the curve through the USB port without other external devices (such as computer).
• Powerful cross-flow fan to cool the PCB board automatically after de-soldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect.
• Human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can show seven temperature curves and save multiple profiles, instant curve analysis function.
• With Multifunctional and humanized operation interface, there is "set up Interface" and "operation interface" on the touch screen to prevent wrong operations and setting. Temperature parameter has password protection to stop arbitrary changes.
• After finishing de-soldering and soldering with a double over-temperature protection, there is alarming. When temperature goes out of control, the circuit automatically power off;
This machine is equipped with pressure and optical sensors to control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height to ensure not crush BGA chip. It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process
BGA REWORK STATION BH-6821R
Total Power 6800W
Top heater 1200W
Bottom heater 2nd heater 1200W,,,,3rd IR heater 4200W
Power AC220V±±±±10%%%% 50/60Hz
Dimensions 890××××790×××× (LCD stand not included)
Positioning V-groove, PCB support can be adjusted in any direction and with external universal fixture
Temperature control
K-type thermocouple (Closed Loop), heating
independently, temperature precision within ±±±±1 degree
PCB size Max 350×××× Min 10
Electrical materials Servo Drive( Panasonic)++++Touch screen(
Taiwan)++++Panasonic PLC++++Heating plate (Germany)
Camera magnification
10x-100x
Optical system Japanese original high-definition CCD color imaging system, Joystick control,
BGA chip 2××××2-80××××80mm
GLOBATRONIC ENGINEERING
Main Features
• The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid location. After location the electromagnetic lock will lock them, with 6-8
heating and cooling temperature settings, servo drives, joystick control, micrometer adjustment, automatic waste gas extraction system and automatic feeding, feeding system are optional.
• There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.
• High-precision K-type thermocouple with closed loop control, PID auto-tuning system temperature system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 1 degree; The external 4-5 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately.
• V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board. • Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of
BGA repair. • The top heater device and mounting head 2 in 1 design and ball screw drive. Z-axis movements are controlled by Panasonic
servo system which can accurately control the site and hotspots; with different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available.
• High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus; With automatic color resolution and brightness adjustment device; it can adjust the definition of the image automatically.
• Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15” TFT LCD Monitor; High automation, no human operations errors.
• CE certification, with emergency switch and automatic power-off protection device when emergency happens; With protective mesh to prevent components falling or human burns happen.
• Mounting, welding and de-welding process are intelligent controlled and work automatically.BGA mounting position is controlled accurately; after finishing de-soldering and soldering, there is alarming. When temperature goes out of control, the circuit w automatically power off. After finishing de-soldering and soldering with a double over-temperature protection, there is alarming. When temperature goes out of control, the circuit automatically power off.
• It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time. You can print, save and analyze the curve through the USB port without other external devices (such as computer).
• Powerful cross-flow fan to cool the PCB board automatically after de-soldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect.
• Human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can show seven temperature curves and save multiple profiles, instant curve analysis function.
• With Multifunctional and humanized operation interface, there is "set up Interface" and "operation interface" on the touch screen to prevent wrong operations and setting; Temperature parameter has password protection to stop arbitrary changes.
• This machine is equipped with pressure and optical sensors. to control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip; It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.
Touch screen 8.0〃〃〃〃, Resolution 640X480, Panel Visa touch screen,
external USB interface
Ext. temperature sensor
Four(optional)
Work Mode Power drive(Optional gas drive + nitrogen)
Placement Accuracy
X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
Net weight 130kg
TORQUE DRIVER Wide range of Electric Torque Drivers with Accessories. Low cost, ESD safe, low vibration, high accuracy
GLOBATRONIC ENGINEERING
Supplying various CONVEYOR FINGER Type Some of the finger sample
Supplying various size PCB cutting tool ROUTER BIT
GLOBATRONIC ENGINEERING
Pipes and Joints Products Concept and Features With simple concepts, designs and manufacturing processes, pipes and joints can help to improve your work efficiency, making your stockpile, transporting dispatching problems to be your profit centre. Production logistics system of limber hook up which is made from plastic coated pipes, metal joints, metal and plastic attachments, which are light, making the installation adjustment, modification, takedown to be easy, environmentally friendly and convenient. JY 40 SERIES
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