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1FEATURES APPLICATIONS
DESCRIPTION
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
PowerLAN™ Master Gateway Battery Management ControllerWith PowerPump™ Cell Balancing Technology
• Portable Medical Instruments and Test23• Designed for Managing up to 12 Series CellEquipmentBattery Systems
• Mobility Devices (E-Bike)• SmartSafety Features:• Uninterruptible Power Supplies and Hand-Held– Prevention: Optimal Cell Management
Tools– Diagnosis: Improved Sensing of Cell
Problems– Fail Safe: Detection of Event Precursors
The bq78PL114 master gateway battery controller is• Rate-of-Change Detection of All Important Cell part of a complete Li-Ion control, monitoring, and
Characteristics: safety solution designed for large series cell strings.– Voltage The bq78PL114, along with PowerLAN cell monitors,– Impedance provides complete battery system control,
communications, and safety functions for a structure– Cell Temperatureof three to 12 series cells. This PowerLAN system• PowerPump Technology Transfers Charge provides simultaneous, synchronized voltage andEfficiently From Cell to Cell During All temperature measurements using one-ADC-per-cellOperating Conditions, Resulting in Longer technology. Voltage measurements are also
Run Time and Cell Life synchronized with pack current measurements,eliminating system-induced noise from• High-Resolution 18-Bit Integrating Delta-Sigmameasurements. This allows the precise, continuous,Coulomb Counter for Precise Charge-Flowreal-time calculation of cell impedance under allMeasurements and Gas Gaugingoperating conditions, even during widely fluctuating• Multiple Independent Δ-Σ ADCs: One-per-Cell load conditions.Voltage, Plus Separate Temperature, Current,PowerPump technology transfers charge betweenand Safetycells to balance their voltage and capacity. Balancing• Simultaneous, Synchronous Measurement of is possible during all battery modes: charge,Pack Current and Individual Cell Voltages discharge, and rest. Highly efficient charge-transfer
• Very Low Power Consumption: < 250 µA circuitry nearly eliminates energy loss while providingActive, < 150 µA Standby, < 40 µA Ship, and true real-time balance between cells, resulting in
longer run-time and improved cycle life.< 1-µA Undervoltage Shutdown• Accurate, Advanced Temperature Monitoring Temperature is sensed by up to six external sensors.
of Cells and MOSFETs With up to Six Sensors This permits accurate temperature monitoring of eachcell individually. Firmware is then able to compensate• Fail-Safe Operation of Pack Protectionfor the temperature-induced effects on capacity,Circuits: Up to Three Power MOSFETs and impedance, and OCV on a cell-by-cell basis, resultingOne Secondary Safety Output (Fuse) in superior charge/ discharge and balancing control.
• Fully Programmable Voltage, Current, Balance,External MOSFET control inputs provide user-and Temperature-Protection Featuresdefinable direct hardware control over MOSFET
• External Inputs for Auxiliary MOSFET Control states. Smart control prevents excessive current• Smart Battery System 1.1 Compliant via through MOSFET body diodes. Auxiliary inputs can
be used for enhanced safety and control in largeSMBus or SPI Interface With SHA-1multicell arrays.Authentication Option
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerLAN, PowerPump, bqWizard are trademarks of Texas Instruments.3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
DESCRIPTION (CONTINUED)
FLA
SH
PRE
CHG
EFCID
EFCIC
SMBus
DSG
SMBCLK
SMBDAT
SPROT
SPI-DI
CSBAT
SPI-DO
CSPACK
SPI-CLK
GPIO6
CE
LL
4Voltage
Temp
Balance
SPI
SELECT
V4
PUMP4
XT4
CE
LL
3Voltage
Temp
Balance
V3
PUMP3
XT3
CE
LL
2Voltage
Temp
Balance
V2
PUMP2
XT2
CE
LL
1Voltage
Temp
Balance
2.5 V LDO
V1
PUMP1
VLDO1
XT1
Watchdog
Coulomb Counter CCBAT
CCPACKCurrent A/D
Core / CPU
Measure
I/O
Safety
SR
AM
RSTN
InternalTemperature
RISC
CPU
InternalOscillator
ResetLogic
First-Level Safetyand
FET Control
Second-LevelSafety
LED1–5,LEDEN
B0320-02
PowerLANCommunication
Link
P-LAN
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
The bq78PL114 is completely user-configurable, with parametric tables in flash memory to suit a variety of cellchemistries, operating conditions, safety controls, and data reporting needs. It is easily configured using thesupplied bqWizard™ graphical user interface (GUI). The device is fully programmed and requires no algorithm orfirmware development.
Figure 1. bq78PL114 Internal Block Diagram
2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
bq76PL102 CellMonitor WithPowerPumpBalancing
Pow
erL
AN
Com
munic
ation
Lin
k
PowerLANMaster GatewayBattery Controller
bq78PL114
PackPositive
PackNegative
Example 8-cell configuration shown
– +
SM
Bus
RS
EN
SE
Pack P
rote
ction
Circuits a
nd F
use
B0332-01
bq76PL102 CellMonitor WithPowerPumpBalancing
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
Figure 2. Example PowerLAN Multicell System Implementation
ORDERING INFORMATION (1)
Quantity,Package TemperatureProduct Cell Configuration (2) Package Ordering Number TransportDesignator Range Media250, tape andbq78PL114RGZT reel
bq78PL114 3 to 8 series cells2500, tape andbq78PL114RGZR reel250, tape andbq78PL114S10RGZT (3)reelbq78PL114 QFN-48, 7-mm3 to 10 series cells RGZ –40°C to 85°C(PREVIEW) × 7-mm 2500, tape andbq78PL114S10RGZR (3)reel250, tape andbq78PL114S12RGZT (3)reelbq78PL114 3 to 12 series cells(PREVIEW) 2500, tape andbq78PL114S12RGZR (3)reel
(1) Authentication options are also available; contact TI for additional information.(2) For configurations consisting of more than four series cells, additional bq76PL102 parts must be used.(3) Some historical data storage limits exist for the S10 and S12 versions.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): bq78PL114
AVAILABLE OPTIONS
P0023-16
bq78PL114RGZ Package
(Top View)
CHG
SD
O0
DSG
SD
I1PRE
P1
NEFCIC
P2
SEFCID
P2
NCCBAT
SD
O2
CCPACK
SD
I3VLDO1
P3
SCSBAT
P3
NCSPACK
P4
SOSCI
P4
NOSCO
P-L
AN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
LED5
VS
SLED4
V1
LED3
XT
1LED2
XT
2LED1
V2
LEDEN
VL
DO
2SPROT
V3
SELECT
XT
3SPI-DO
XT
4SPI-DI
V4
SPI-CLK
SM
BD
AT
RSTN
SM
BC
LK
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
Thermal Pad
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
Figure 3. bq78PL114 Pinout
TERMINAL FUNCTIONSNAME NO. TYPE (1) DESCRIPTION
CCBAT 6 IA Coulomb counter input (sense resistor), connect to battery negativeCCPACK 7 IA Coulomb counter input (sense resistor), connect to pack negativeCHG 1 O Charge MOSFET control (active-high, enables current flow)CSBAT 9 IA Current sense input (safety), connect to battery negativeCSPACK 10 IA Current sense input (safety), connect to pack negativeDSG 2 O Discharge MOSFET control (active-high, low opens MOSFET)EFCIC 4 I External charge MOSFET control inputEFCID 5 I External discharge MOSFET control inputLED1 32 IO LED1 – active-lowLED2 33 IO LED2 – active-lowLED3 34 IO LED3 – active-lowLED4 35 IO LED4 – active-lowLED5 36 IO LED5 – active-lowLEDEN 31 IO LEDEN – common-anode drive (active-high)OSCI 11 I External oscillator input (optional)OSCO 12 O External oscillator output (optional)
(1) I – input, IA – analog input, O – output, OA – analog output, P – power
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Product Folder Link(s): bq78PL114
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
TERMINAL FUNCTIONS (continued)NAME NO. TYPE (1) DESCRIPTION
P1N 15 O Charge-balance gate drive, cell 1 northP2S 16 O Charge-balance gate drive, cell 2 southP2N 17 O Charge-balance gate drive, cell 2 northP3N 21 O Charge-balance gate drive, cell 3 northP3S 20 O Charge-balance gate drive, cell 3 southP4N 23 O Charge-balance gate drive, cell 4 northP4S 22 O Charge-balance gate drive, cell 4 southP-LAN 24 IO PowerLAN I/O to external bq76PL10x nodesPRE 3 O Pre-Charge MOSFET control (active-high.)RSTN 25 I Device reset, active-lowSDI1 14 I Connect to SDO0 via a capacitorSDI3 19 I Internal PowerLAN connection – connect to SDO2SDO0 13 O Requires 100-kΩ pullup resistor to VLDO1SDO2 18 O Internal PowerLAN connection – connect to SDI3SELECT 29 O Auxiliary SPI control output (2)
SMBCLK 37 IO SMBus clock signalSMBDAT 38 IO SMBus data signalSPI-CLK 26 IO SPI port clock (2)
SPI-DI 27 I SPI master-out-slave-in (2)
SPI-DO 28 O SPI master-in-slave-out (2)
SPROT 30 O Secondary protection output, active-high (FUSE)V1 47 IA Cell-1 positive inputV2 44 IA Cell-2 positive inputV3 42 IA Cell-3 positive inputV4 39 IA Cell-4 positive inputVLDO1 8 P Internal LDO-1 output, bypass with capacitorVLDO2 43 P Internal LDO-2 output, bypass with capacitorVSS 48 IA Cell-1 negative inputXT1 46 IA External temperature-sensor-1 inputXT2 45 IA External temperature-sensor-2 inputXT3 41 IA External temperature-sensor-3 inputXT4 40 IA External temperature-sensor-4 input– – P Thermal pad. Connect to VSS
(2) SPI functionality requires a firmware option, consult the factory for additional information.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): bq78PL114
ABSOLUTE MAXIMUM RATINGS (1)
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
over operating free-air temperature range (unless otherwise noted)
RANGE UNITSTA Operating free-air temperature (ambient) –40 to 85 °CTstg Storage temperature –65 to 150 °CV4–V3 Maximum cell voltage –0.5 to 5.0 VV3–V2 Maximum cell voltage –0.5 to 5.0 VV2–V1 Maximum cell voltage –0.5 to 5.0 VV1–VSS Maximum cell voltage –0.5 to 5.0 VVoltage on LED1–LED5, CCBAT,
(VSS – 0.5) toCCPACK, CSBAT, CSPACK, XT1, XT2, Maximum voltage on any I/O pin VOSCI, OSCO, SDIx, SDOx, SPROT, (VLDO1 + 0.5)P-LAN
(V2 – 0.5) toVoltage on XT3, XT4, LEDEN Maximum voltage range V(VLDO2 + 0.5)EFCIC, EFCID With respect to VSS –0.5 to 5.5 VVoltage on SMBCLK, SMBDAT With respect to VSS –0.5 to 6 VVoltage on PRE, CHG, DSG With respect to VSS –0.5 to (VLDO1 + 0.5) VCurrent through PRE, CHG, DSG, Maximum current source/sink 20 mALED1–LED5, P-LANVLDO1 maximum current Maximum current draw from VLDO 20 mA
JEDEC, JESD22-A114 human-body model, R = 1500 Ω, C =ESD tolerance 2 kV100 pFLead temperature, soldering Total time < 3 seconds 300 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
ELECTRICAL CHARACTERISTICS
DC Characteristics
Voltage-Measurement Characteristics
Current-Sense Characteristics
Coulomb-Counter Characteristics (1) (2)
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITVCELL
(1) Operating range Cells balanced 2.3 4.5 VIDD Operating-mode current Measure / report state 250 µAISTBY Standby-mode current SMBCLK = SMBDAT = L 100 µAISHIP Ship-mode current 30 µA
Extreme cell under voltage All cells < 2.7 V and any cell < ECUV setIECUV 1 µAshutdown current pointVOL General I/O pins IOL < 4 mA 0 0.5 VVOH
(2) General I/O pins IOH < –4 mA VLDO1 – 0.1 VVIL General I/O pins 0.25 VLDO1 VVIH General I/O pins 0.75 VLDO1 V
(1) Device remains operational to 1.85 V with reduced accuracy and performancce.(2) Does not apply to SMBus pins.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range 2.5 4.5 VResolution <1 mV
25°C ±5Accuracy mV
0°C to 60°C ±10
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range (1) –0.2 0.2 VInput offset TA = 25°C ±50 µVOffset drift TA = 0°C to 60°C 0.5 µV/°CResolution 18 µVFull-scale error (2) TA = 25°C ±0.1%Full-scale error drift TA = 0°C to 60°C 50 PPM/°C
(1) Default range. Corresponds to ±10 A using a 10-mΩ sense resistor. Other gains and ranges are available (eight options).(2) After calibration. Accuracy is dependent on system calibration and temperature coefficient of sense resistor.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITResolution 5 nVhIntergral nonlinearity 0.008%Snap-to-zero (deadband) ±100 (3) µV
(1) Shares common input with Current Sense section(2) After calibration. Accuracy is dependent on system calibration and temperature coefficient of sense resistor.(3) Corresponds to 20 mA using 5-mΩ sense resistor
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): bq78PL114
Current-Sense (Safety) Characteristics (1)
Internal Temperature-Sensor Characteristics (1)
External Temperature-Sensor(s) Typical Characteristics (1)
SMBus Characteristics (1)
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range –0.312 0.312 V
Short-circuit detection 10Resolution mV
Overcurrent detection, charge and discharge 1.25
(1) Post calibration: Dependent on system calibration and temperature coefficient of sense resistor. Uncertainty 1.5 LSB.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range –30 85 °CResolution 0.1 °CAccuracy (1) –30° to 85° ±1 °C
(1) After calibration.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range (2) –40 90 °CResolution 0.2 °C
25° ±1Accuracy (3) °C
0° to 85° ±2
(1) Typical for dual diode (MMBD4148 or equivalent) external sensor using recommended circuit.(2) Range of diode sensors may exceed operational limits of IC and battery cells.(3) Typical behavior after calibration, final result dependent on specific component characteristics.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITVIL Input low voltage 0 0.8 VVIH Input high voltage 2.1 5.5 VVOL Output low voltage 350-µA sink current 0 0.4 VCI Capacitance, each I/O pin 10 pFfSCL SCLK nominal clock frequency TA = 25°C 100 kHz
VBUS 5 V nominal 13.3 45.3RPU
(2) Pullup resistors for SCLK, SDATA kΩVBUS 3 V nominal 2.4 6.8
(1) SMBus timing and signals meet the SMBus 2.0 specification requirements under normal operating conditions. All signals are measuredwith respect to PACK-negative.
(2) Pullups are typically implemented external to battery pack, and are selected to meet SMBus requirements.
8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
bq78PL114PowerLAN
Gateway BatteryManagement
Controller
RPRE
+ PACK+
–
SPI-DI
SMBCLK
SMBDAT
RSENSE
PACK–
XT1–XT4
TemperatureSensor (typ.)
SPROT
LED1–LED5
Typical six-cell configuration shown.Additional cells added via PowerLAN connection.Some components omitted for clarity.
SPI-DO
V2
V3
V4
V1
VLDO2
CRFI
VLDO1
RSTN
SDO2
SDI3
EFCID
EFCIC
One of 4 externalsensors shown
SPI-CLK
P-LAN
5
CELL 6
CELL 5
V2
V1
SDI1
SDO0
SELECT
Level-Shift Circuits
CH
G
DS
G
PR
E
ES
D P
rote
ction
SM
Bus
SP
IA
ux F
ET
Co
ntr
ol
Th
erm
al P
ad
VS
S
CS
BA
T
CC
BA
T
CC
PA
CK
CS
PA
CK
Ce
ll B
ala
ncin
gC
ircu
its
Ce
ll B
ala
ncin
g C
ircu
its
bq
76
PL
102
CELL 4
CELL 3
CELL 2
CELL 1
S0342-02
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
Figure 4. bq78PL114 Simplified Example Circuit Diagram
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): bq78PL114
FEATURE SET
Primary (First-Level) Safety Features
Secondary (Second-Level) Safety Features
Charge Control Features
Gas Gauging
LED Display
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
The bq78PL114 implements a breadth of system protection features which are easily configured by thecustomer. First-level protections work by controlling the MOSFET switches. These include:• Battery cell over/undervoltage protection• Pack over/undervoltage protection• Charge and discharge overcurrent protection• Short-circuit protection• External MOSFET control inputs (EFCIx) with programmable polarity• Up to four external temperature inputs for accurate cell and MOSFET monitoring• Watchdog timer protection• Brownout detection and protection against extreme pack undervoltage
The bq78PL114 can detect more serious system faults and activate the SPROT pin, which can be used to openan in-line chemical fuse to permanently disable the pack. Secondary optional features include• Fully independent of first-level protections• SmartSafety algorithms for early detection of potential faults
– Temperature abnormalities (variances, extremes, rate of change, etc.)– Disconnected cell voltage inputs– Cell imbalance exceeds safety limits– Impedance rise due to cell or weld strap fault
• MOSFET failure or loss of MOSFET control• Safety overvoltage, pack and cell• Safety overtemperature, limits for both charge and discharge• Safety overcurrent, charge and discharge• Failed current measurement, voltage measurement, or temperature measurement
• Meets SMBus 2.0 and Smart Battery System (SBS) Specification 1.1 requirements• Active cell balancing using patented PowerPump technology, which eliminates unrecoverable capacity loss
due to normal cell imbalance• Balancing-current monitoring to detect cell problems• Simultaneous, synchronous measurement of all cell voltages in a pack• Simultaneous, synchronous measurement of pack current with cell voltages• Reports target charging current and/or voltage to an SBS Smart Charger• Reports the chemical state-of-charge for each cell and pack• Supports precharging and zero-volt charging with separate MOSFET control• Programmable, Chemistry-specific parameters• Fault reporting
• The bq78PL114 accurately reports battery cell and pack state-of-charge (SOC). No full charge/dischargecycle is required for accurate reporting.
• State-of-charge is reported via SMBus and optional LED display.• 18-bit integrating delta-sigma ADC coulomb counter, with programmable snap-to-zero value
• The bq78PL114 drives a three- to five-egment LED display in response to a pushbutton (LEDEN) input signal.Each LED pin can sink up to 10 mA.
10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
Lifetime Data Logging (Readable via SMBus or SPI)
Forensic Data Logging (Readable via SMBus or SPI)
Power Modes
OPERATION
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
• Recording of faults, events, anomalies, minimum and maximum values• Maximum/minimum temperature• Maximum/minimum pack voltage• Maximum/minimum cell voltages• Maximum charge and discharge currents
• Last known full capacity of each cell• Cycle count and/or cumulative number of ampere-hours delivered by the battery• Battery pack status: being charged, discharged, or at rest• Balancing effort required by each bank of cells to maintain balance• Information for each cell bank for period leading up to failure• Last 10 failures causing first-level safety action• Forensic data up-loadable to host CPU via SMBus or SPI• Forensic data recording of anomalies and events
• Normal Mode: The bq78PL114 performs measurements and calculations, makes decisions, and updatesinternal data approximately once per second. All safety circuitry is fully functional in this mode.
• Standby Mode: The bq78PL114 performs as in normal mode, but at a dramatically reduced rate to lowerpower consumption at times when the host computer is inactive or the battery system is not being used. Allsafety circuitry remains fully functional in this mode.
• Ship Mode: The bq78PL114 disables (opens) all the protection MOSFETs, and continues to monitortemperature and voltage, but at a reduced measurement rate to dramatically lower power consumption.Environmental data is saved in flash as a part of the historical record. Safety circuitry is disabled in this mode.The device does not enter this power state as a part of normal operation; it is intended for use after factoryprogramming and test. Entry occurs only after a unique SMBus or SPI command is issued. Exit occurs whenthe SMBus or SPI lines return to an active state.
• Extreme Cell Undervoltage (ECUV) Shutdown Mode: In this mode, the bq78PL114 draws minimal currentand the charge and discharge protection MOSFETs are disabled (opened). The precharge MOSFET remainsenabled when a charge voltage is present. Safety circuitry is disabled in this mode. The device does not enterthis mode as a part of normal operation; it enters this state during extreme cell undervoltage conditions(ECUV). The ECUV threshold is fully programmable below 2.7V.
CURRENT OVERCURRENTSTATE ENTRY CONDITION EXIT CONDITIONDRAW (Typ) PROTECTIONNormal operation as determined by Firmware directed to the followingActive < 250 µA Fully active firmware operating modesNo load current flowing forStandby < 150 µA Fully active Load activitypredetermined time
Ship < 40 µA Not active Protected SMBus or SPI command SMBus or SPI becomes activeNot activeExtreme cell Vcell charge above ECUV recovery< 1 µA (precharge Enabled when Vcell < ECUVundervoltage threshold (2.7 V/cell typical)enabled)
The bq78PL114 battery management controller serves as the master controller for a Li-Ion battery systemconsisting of up to 12 cells in series. Any number may be connected in parallel; other system or safety issueslimit the number of parallel cells. The bq78PL114 provides extraordinarily precise state-of-charge gas gaugingalong with first and second level pack safety functions. Voltage and current measurements are performedsynchronously and simultaneously for all cells in the system, allowing a level of precision not previously possible
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): bq78PL114
PowerLAN Communication Link
Safety
Cell Balancing
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
in battery management. Temperature is measured by up to four additional external temperature sensors, for atotal of five independent measurement points. (Additional cell temperature sensors are available in remotebq76PL102 dual-cell battery monitors.) Coulomb counting is captured continuously by a dedicated 18-bitintegrating delta-sigma ADC in the bq78PL114. The CPU in the bq78PL114 is also responsible for system datacalculations, black-box forensic data storage, and communicating parameters via the SMBus or SPI interface.
PowerLAN technology is Texas Instruments’ patented serial network and protocol designed specifically forbattery management in a multicell system environment. The PowerLAN link is used to initiate and reportmeasurements of cell voltage and temperature, and control cell balancing. The bq78PL114 serves as the mastercontroller of the PowerLAN link and can interface to multiple bq76PL102 dual-cell battery monitors, whichmeasure and balance additional cells. The bq78PL114 monitors the first three or four cells, and bq76PL102s canbe added to monitor more series cells.
The PowerLAN link isolates voltages from adjacent bq76PL102 devices to permit high-voltage stack assemblywithout compromising precision and accuracy. The PowerLAN link is expandable to support up to 12 cells inseries. Each bq76PL102 handles voltage and temperature measurements, as well as balancing for two cells. ThePowerLAN link provides high ESD tolerance and high immunity to noise generated by nearby digital circuitry orswitching currents. Each bq76PL102 has both a PowerLAN input and PowerLAN output: Received data isbuffered and retransmitted, permitting high numbers of nodes without loss of signal fidelity. Signals arecapacitor-coupled between nodes, providing dc isolation.
Unique in the battery-management controller market, the bq78PL114 simultaneously measures voltage andcurrent using independent and highly accurate delta-sigma ADCs. This technique removes virtually all systemicnoise from measurements, which are made during all modes of battery operation: charge, discharge, and rest.The bq78PL114 also directs all connected bq76PL102 dual-cell battery monitors to measure each cell voltagesimultaneously with the bq78PL114 measurements. Battery impedance and self-discharge characteristics arethus measured with an unprecedented level of accuracy in real time. The bq78PL114 applies this preciseinformation to SmartSafety algorithms to detect certain anomalies and conditions which may be indicative ofinternal cell faults, before they become serious problems.
The bq78PL114 uses its enhanced measurement system to detect system faults including cell under- andovervoltage, cell under- and overtemperature, system overvoltage, and system overcurrent. First-level safetyalgorithms first attempt to open the MOSFET safety switches. If this fails, second-level safety algorithms activatethe SPROT output, normally used to open a fuse and provide permanent, hard protection for the systems.External MOSFET control inputs with programmable polarity can also be used to operate the safety MOSFETsunder control of user supplied circuitry. The bq78PL114 continuously monitors these inputs. If any MOSFET failsto open when commanded; the 2nd level safety algorithms also activate the SPROT output. All first- andsecond-level safety algorithms have fully programmable time delays to prevent false triggering.
Patented PowerPump cell balancing technology drastically increases the useful life of battery packs byeliminating the cycle life fade of multi-cell packs due to cell imbalance. PowerPump technology efficientlytransfers charge from cell to cell, rather than simply bleeding off charging energy as heat as is typically done withresistive-bleed balancing circuits. Balancing is configurable and may be performed during any battery operationalmodes: charge, discharge, or rest. Compared to resistive bleed balancing, virtually no energy is lost as heat. Theactual balance current is externally scalable and can range from 10 mA to 1 A (100 mA typical) depending oncomponent selection and system or cell requirements.
A variety of techniques, such as simple terminal voltage, terminal voltage corrected for impedance andtemperature effects, or state-of-charge balancing, is easily implemented by the bq78PL114. In some cases,chemistry-specific algorithms are available. By tracking the balancing required by individual cells, overall batterysafety is enhanced, often allowing early detection of soft shorts or other cell failures. Balancing is achievedbetween all cells within the pack as dynamically determined by the bq78PL114.
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Product Folder Link(s): bq78PL114
Outputs
Inputs
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
Charge ControlThe CHG and PRE outputs are ordinarily used to drive MOSFET transistors controlling charge to the cell stack.Charge or precharge mode is selected based on the present cell voltage compared to the user-definable cellprecharge, undervoltage, and temperature thresholds. When below these limits, the PRE signal is active and theCHG signal is inactive. This turns on the precharge MOSFET and is used to charge a depleted system through acurrent-limiting series resistor. When all cell voltages are above the limit and the temperature is above the chargetemperature minimum, then the CHG output also becomes active and enables the charge MOSFET to turn on,providing a high-current path between charger and battery cells.
The CHG and PRE MOSFET control outputs are both disabled (low) when any cell reaches the safety cutoff limitor temperature threshold. During active charging modes (and above cell voltage thresholds), the dischargeMOSFET is also enabled to avoid excessive heating of the body diode. Similarly, the charge MOSFET is activeduring discharge, provided current flow is in the correct direction and no safety violations are present.
The CHG and PRE outputs are intended to drive buffer transistors acting as inverting level shifters.
Discharge ControlThe DSG output operates similarly to control-system discharging. It is enabled (high) by default. If a cell voltagefalls below a programmable threshold, or excessive current or other safety related fault is sensed, the DSGoutput is disabled (low) to prevent damage to the cells.
All facets of safely charging and discharging the cell stack are controlled by user-definable parameters whichprovide precise control over MOSFET states. Both system and cell over- and undervoltage limits are provided, aswell as programmable hysteresis to prevent oscillation. Temperature and current thresholds are also provided,each with independent timers to prevent nuisance activations.
LEDENLEDEN is a dual-function pin. One function is to provide output current to the LED display array. It also serves asan input that monitors for closure of a state-of-charge indicator (SOCi) push-button switch.
LED SOCi OutputsLED1–LED5 are current-sinking outputs designed to drive low-current LEDs. The LEDs can be activated by theLEDEN pin via a pushbutton switch. They can be configured (using SBS parameters) to operate in bar or dotmode and to use three to five LEDs to represent state-of-charge information.
Current MeasurementCurrent is monitored by four separate ADCs. All use the same very low-value sense resistor, typically either 5 or10 milliohms in series with the pack negative connection. CCBAT and CCPACK connections to the senseresistor use an R/C filter for noise reduction. (CSBAT and CSPACK are direct connections used for secondarysafety.) It is possible to use even lower values for the sense resistor in very high-current designs by employingexternal circuitry. Contact Texas Instruments directly for details.
A 14-bit delta-sigma ADC is used to measure current flow accurately in both directions. The measurements aretaken simultaneously and synchronously with all the cell voltage measurements, even those cells measured bybq76PL102 dual-cell battery monitors.
Coulomb CountingA dedicated coulomb counter is used to measure charge flow with 18 bit precision in both directions by acalibrated, integrating delta-sigma ADC. This allows the bq78PL114 to keep very accurate state-of-charge (SOC)information and battery statistics. A small deadband is applied to further reduce noise effects. The coulombcounter is unique in that it continues to accumulate (integrate) current flow in either direction even as the rest ofthe internal microcontroller is placed in a very low power state, further lowering power consumption withoutcompromising system accuracy.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): bq78PL114
COMMUNICATIONS
SMBus
SPI
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
Safety CurrentTwo additional ADCs are used to directly monitor for overcurrent or short-circuit current conditions, independentlyof the internal function. This provides a direct and rapid response to insure pack integrity and safe operation byopening the appropriate MOSFETs. These functions are implemented in hardware, and do not require firmwarefor functionality.
Voltage MeasurementVoltage measurement is performed by four independent delta-sigma ADCs which operate simultaneously andare triggered synchronously so that all voltages are read at precisely the same moment. The bq78PL114coordinates the attached bq76PL102 dual-cell battery monitors so they also perform their cell voltagemeasurements in sync with the bq78PL114 voltage and current measurements. Voltage measurements areconverted with better than 1 mV of resolution, providing superior accuracy. One-ADC-per-cell technology meansthat voltage is also measured simultaneously with current, permitting accurate, real-time cell impedancecalculation during all operating conditions. This technique also provides greatly enhanced noise immunity andfiltering of the input signal without signal loss.
Temperature MeasurementXT1–XT4 are dedicated temperature inputs. Each external sensor consists of a low-cost silicon diode (dual diodein one package is recommended) and capacitor combination. XT1, multiplexed with the LED1 and LED2 inputs,is used to measure cells 1 and 3. XT2, multiplexed with the LED1 and LED2 inputs, is used to measure cells 2and 4. XT3 is a dedicated IC-temperature sensor, which should be placed near the bq78PL114 IC. XT4 isdedicated to protection-MOSFET temperature and governed by safety rules. The sensor attached to XT4 shouldbe placed near the pack-disconnect MOSFETs. Temperatures for cells 5 and above are measured by externalbq76PL102(s), and the temperature data is received by the bq78PL114 over the PowerLAN link for processing.The bq78PL114 can report all of these temperatures individually and as an average. A single internal, integratedsilicon sensor is also supplied in the bq78PL114.
Note that additional external temperature sensors can be added using bq76PL102 dual-cell battery monitorsoperating on the PowerLAN link. Each bq76PL102 contains one internal temperature monitor and two additionalexternal temperature-sensor inputs (in addition to the two cell-voltage measurements and cell balancing).
EFCIxThe external MOSFET control inputs are for user control of MOSFETs based on external circuitry and conditions.The polarity of the input signal is user programmable. Two modes of operation are possible. The first mode isused to implement additional hardware safety inputs, and is used to force the protection MOSFETs to an OFFstate. The polarity of the input signals is programmable. The inputs can also be used to control the MOSFETsdirectly through hardware, with no firmware operation required.
The bq78PL114 uses the industry-standard Smart Battery System’s two-wire System Management Bus (SMBus)communications protocol for all external communication. SMBus version 2.0 is supported by the bq78PL114, andincludes clock stretching, bus fault time-out detection, and optional packet error checking (PEC). For additionalinformation, see the www.smbus.org and www.sbs-forum.org Web sites.
The bq78PL114 provides a standard serial peripheral interface (SPI) port consisting of SELECT, SPI-DI, SPI-DO,and SPI-CLK signals. This port may be operated as a master or slave SPI port. A typical system configurationuses the bq78PL114 as a SPI slave device so that a host controller could access the various battery data usingthe industry-standard Smart Battery Data specification for content.
Alternatively, the SPI port may be operated as a master to allow the bq78PL114 to write selected system data toanother device for use in an autonomous application.
Contact Texas Instruments for additional SPI options and details.
14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
Smart Battery Data (SBData)
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
The data content and formatting of the bq78PL114 information conforms to the Smart Battery System’s (SBS)Smart Battery Data specification, version 1.1. See the SBS/SMBus site at www.sbs-forum.com for furtherinformation regarding these specifications.
This SBS Data (SBData) specification defines read/write commands for accessing data commonly required inlaptop computer applications. The commands are generic enough to be useful in most applications.
Because the bq78PL114 provides a wealth of control and battery information beyond the SBData standard, newcommand codes have been defined by Texas Instruments. In addition, new battery data features, such asstate-of-health, use newly defined extended SBData command codes. Standard SMBus protocols are used,although additional data values beyond those defined by the Smart Battery Data specification are employed. (Forexample, the bq78PL114 typically is used in a multicell battery system and may report individual cell voltages forup to 12 cells. The SBData command set only defines four cell-voltage registers.)
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): bq78PL114
SBS Standard Data Parameter List (Abridged) (1) (2)
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
Command Data Type Descripotion00 R/W word (unsigned) Manufacturer Access01 R/W word (unsigned) Remaining Capacity Alarm Level02 R/W word (unsigned) Remaining Time Alarm Level03 R/W word (unsigned) Battery Mode04 R/W word (unsigned) At Rate value used in AtRate calculations05 Read word (unsigned) At Rate Time to Full06 Read word (unsigned) At Rate Time to Empty07 Read word (Boolean) At Rate OK08 Read word (unsigned) Pack Temperature (maximum of all individual cells)09 Read word (unsigned) Pack Voltage (sum of individual cell readings)0A Read word (unsigned) Pack Current0B Read word (unsigned) Average Pack Current0C Read word (unsigned) Max Error0D Read word (unsigned) Relative State of Charge0E Read word (unsigned) Absolute State of Charge0F Read word (unsigned) Remaining Pack Capacity10 Read word (unsigned) Full Charge Capacity11 Read word (unsigned) Run Time to Empty12 Read word (unsigned) Average Time to Empty13 Read word (unsigned) Average Time to Full14 Read word (unsigned) Charging Current15 Read word (unsigned) Charging Voltage16 Read word (unsigned) Battery Status17 Read word (unsigned) Cycle Count18 Read word (unsigned) Design Capacity19 Read word (unsigned) Design Voltage1A Read word (unsigned) Specification Information1B Read word (unsigned) Manufacture Date1C Read word (unsigned) Serial Number1D–1F Reserved20 Read block (string) Pack Manufacturer Name (31 characters maximum)21 Read block (string) Pack Device Name (31 characters maximum)22 Read block (string) Pack Chemistry23 Read block (string) Manufacturer Data24–2E Reserved2F R/W Block Optional Manufacturer Function 530–3B Reserved3C R/W word (unsigned) Optional Manufacturer Function 4 (Vcell 4)3D R/W word (unsigned) Optional Manufacturer Function 3 (Vcell 3)3E R/W word (unsigned) Optional Manufacturer Function 2 (Vcell 2)3F R/W word (unsigned) Optional Manufacturer Function 1 (Vcell 1)40–45 Unused46–47 Reserved48–4F Unused50–55 Reserved
(1) Parameters 0x00–0x3F are compatible with the SBDATA specification.(2) By default, the bq78PL114 initially responds to the SBData slave address <0001 011R/W> (0x16, 0x17).
16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
Command Data Type Descripotion56–57 Unused58–5A Reserved5B–5F Unused60–62 Reserved63–6F Unused70 Reserved71–FF Unused
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): bq78PL114
REFERENCE SCHEMATIC (3 Series Cells)
equiv
al e
nt
resis
tance
Used for
Safe
ty E
vents U
sed for
Devic
e T
em
p.
T1 =
CELL 1
TEM
P.
T2 =
CELL 2
TEM
P.
T3 =
CELL 3
TEM
P .
TEM
P-F
ETS =
FET T
EM
P. &
USED
FO
R S
AFETY.
TEM
P-P
CB =
TEM
P. O
F U
4
sta
r gro
und p
oin
t l o
cate
d a
t R3
Keep t
his
connection t
o B
ATT-
as s
hort
and L
ow
Z a
s p
ossib
le.
1CHG
2DSG
3PRE
4EFCIC
5EFCID
6
CCBAT
7CCPACK
8VLD
O1
9
CSBAT
10CSPACK
11
OSCI
12
OSCO
13
SD
O0
14
SD
I1
15
P1N
16
P2S
17
P2N
18
SD
O2
19
SD
I3
20
P3S
21
P3N
22
P4S
23
P4N
24
P-L
AN
25
RSTN
26
SPI-
CLK
27
SPI-
DI
28
SPI-
DO
29
SELECT
30SPROT
31
LED
EN
32
LED
1
33
LED
2
34
LED
3
35
LED
4
36
LED
5
37
SM
BCLK
38
SM
BD
AT
39
V4
40
XT4
41
XT3
42
V3
43
VLD
O2
44
V2
45
XT2
46
XT1
47
V1
48
VSS
49TAB
U4 bq78PL114
C5
10uF
R44
10K
C38
0.1
uF
C27
1000pF
C28
10uF
C43
0.1
uF
C7
1.0
uF
R5
100K
C11
1000pF
R28
4.7
K
R27
4.7
K
R49
100R
R50
100R
R54
100R
R55
100R
R43
1.0
M
R51
1.0
M
C40
1.0
uF
C39
1.0
uF
C41
1.0
uF
R10
2K
R30
20K
R29
20K
C12
3300pF
C13
3300pF
Q1-A
FD
C6327C
Q1-B
FD
C6327C
L1
4.7
uH
C30
22uF
D10
MA21D
3800L
D9
MA21D
3800L
1234
SM
BU
S-P
ORT
R3
0.0
05R
R6
1.0
M
Z1
5.6
VD
C
T3
MM
BD
4148SE
C6
1000pF
TEM
P-P
CB
MM
BD
4148SE
C45
1000pF
TEM
P-F
ETS
MM
BD
4148SE
C46
1000pF
R9
2K
R11
20K
R12
20K
C14
3300pF
C15
3300pF
Q2- A
FD
C6327C
Q2-B
FD
C6327C
L2
4.7
uH
D5
MA21D
3800L
D6
MA21D
3800L
PACK+
PACK-
D S
GQ
11
MM
BFJ2
01
Q12
BC846ALT
1G
Vcebr=
65V
R53
560K
R56
200K
ZR2
12.0
VD
C
BZT52C12-7
-F
R58
30K
R59
1.0
M
Q13
D S
GQ
8
MM
BFJ2
01
Q9
BC846ALT
1G
Vcebr=
65V
R40
560K
R41
200K
ZR1
12.0
VD
C
BZT52C12-7
-F
R45
30K
R46
1.0
M
Q10
C60
0.1
uF
C61
0.1
uF
Q15
BC846ALT
1G
Vcebr=
65V
R17
1.0
M
R52
30K
R60
1.0
M
Q16
R18
C1
22uF
C2
22uF
R19
1.0
MR25
1.0
M
D23
D24
D25
D26
D27
S1
C3
1000pF
Q14
BSS138
C4
0.1
uF
Q17
FD
V304P
R1
100K
T1
MM
BD
4148SE
C8
1000pF
T2
MM
BD
4148SE
C16
1000pF
C42
0.1
uF
C50
0.1
uF
-+
CELL1
-+
CELL2
-+
CELL3
VSS
VLD
O1
VSS
VSS
VSS
VSS
VLD
O1
S001
bq78PL114
SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008 .................................................................................................................................... www.ti.com
18 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): bq78PL114
REFERENCE SCHEMATIC (8 Series Cells)
equiv
ale
nt
resis
tance
Used f
or
Safe
ty E
vents U
sed f
or
Devic
e T
em
p.
T1 =
CELL 1
TEM
P.
T2 =
CELL 2
TEM
P.
T3 =
CELL 3
TEM
P.
T4 =
CELL 4
TEM
P.
T5 =
CELL 5
TEM
P.
T6 =
CELL 6
TEM
P.
T7 =
CELL 7
TEM
P.
T8 =
CELL 8
TEM
P.
TEM
P-F
ETS =
FET T
EM
P. &
USED
FO
R S
AFETY .
TEM
P-P
CB =
TEM
P. O
F U
4
sta
r gro
und p
oin
tlo
cate
dat
R3
Keep t
his
connection
to B
ATT-
as s
hort
and L
ow
Z a
s p
ossib
le.
1CHG
2DSG
3PRE
4EFCIC
5EFCID
6
CCBAT
7CCPACK
8VLD
O1
9
CSBAT
10CSPACK
11
OSCI
12
OSCO
13
SD
O0
14
SD
I1
15
P1N
16
P2S
17
P2N
18
SD
O2
19
SD
I3
20
P3S
21
P3N
22
P4S
23
P4N
24
P-L
AN
25
RSTN
26
SPI-
CLK
27
SPI-
DI
28
SPI-
DO
29
SELECT
30SPROT
31
LED
EN
32
LED
1
33
LED
2
34
LED
3
35
LED
4
36
LED
5
37
SM
BCLK
38
SM
BD
AT
39
V4
40
XT4
41
XT3
42
V3
43
VLD
O2
44
V2
45
XT2
46
XT1
47
V1
48
VSS
49TAB
U4 b
q78PL114
C5
10uF
R44
10K
C38
0.1
uF
C27
1000pF
C28
10uF
C43
0.1
uF
C7
1.0
uF
R5
100K
C11
1000pF
R28
4.7
K
R27
4.7
K
R49
100R
R50
100R
C9
10uF
C10
1000pF
R54
100R
R55
100R
R43
1.0
M
R51
1.0
M
15
V1
12
V2
14
T1
13
T2
11TMD
10TCK
3TDI
8P2N
7P2S
6P1N
5P1S
2VLD
O
16
VPP
9SD
O4
SD
I
17TAB
1VSS
U3
BQ
76PL102
C40
1.0
uF
C44
1.0
uF
C39
1.0
uF
C41
1.0
uF
R10
2K
R30
20K
R29
20K
C12
3300pF
C13
3300pF
Q1-A
FD
C6327C
Q1-B
FD
C6327C
L1
4.7
uH
C30
22uF
D10
MA21D
3800L
D9
MA21D
3800L
1234
SM
BU
S-P
ORT
R3
0.0
05R
R6
1.0
M
Z1
5.6
VD
C
T3
MM
BD
4148SE
C6
1000pF
T4
MM
BD
4148SE
C37
1000pF
TEM
P-P
CB
MM
BD
4148SE
C45
1000pF
TEM
P-F
ETS
MM
BD
4148SE
C46
1000pF
R9
2K
R11
20K
R12
20K
C14
3300pF
C15
3300pF
Q2-A
FD
C6327C
Q2-B
FD
C6327C
L2
4.7
uH
D5
MA21D
3800L
D6
MA21D
3800L
R13
2K
R14
20K
R15
20K
C17
3300pF
C18
3300pF
Q3-A
FD
C6327C
Q3-B
FD
C6327C
L3
4.7
uH
C19
22uF
D7
MA21D
3800L
D8
MA21D
3800L
R16
2K
R20
20K
R24
20K
C21
3300pF
C22
3300pF
Q4-A
FD
C6327C
Q4-B
FD
C6327C
L4
4.7
uH
C23
22uF
D11
MA21D
3800L
D12
MA21D
3800L
R31
2K
R32
20K
R33
20K
C20
3300pF
C24
3300pF
Q5- A
FD
C6327C
Q5-B
FD
C6327C
L5
4.7
uH
C25
22uF
D13
MA21D
3800L
D14
MA21D
3800L
R34
2K
R35
20K
R36
20K
C32
3300pF
C33
3300pF
Q6- A
FD
C6327C
Q6-B
FD
C6327C
L6
4.7
uH
C34
22uF
D15
MA21D
3800L
D16
MA21D
3800L
R37
2K
R38
20K
R39
20K
C35
3300pF
C36
3300pF
Q7- A
FD
C6327C
Q7-B
FD
C6327C
L7
4.7
uH
C47
22uF
D17
MA21D
3800L
D18
MA21D
3800L
C29
10uF
C51
10uF
T6
MM
BD
4148SE
C52
1000pF
T5
MM
BD
4148SE
C53
1000pF
C48
1000pF
C49
10uF
15
V1
12
V2
14
T1
13
T2
11TMD
10TCK
3TDI
8P2N
7P2S
6P1N
5P1S
2VLD
O
16
VPP
9SD
O4
SD
I
17TAB
1VSS
U2
BQ
76PL102
C54
10uF
C55
10uF
T8
MM
BD
4148SE
C56
1000pF
T7
MM
BD
4148SE
C57
1000pF
PACK+
PACK-
D S
GQ
11
MM
BFJ2
01
Q12
BC846ALT
1G
Vcebr=
65V
R53
560K
R56
200K
ZR2
12.0
VD
C
BZT52C12-7
-F
R58
30K
R59
1.0
M
Q13
IRF4905PBF
D S
GQ
8
MM
BFJ2
01
Q9
BC846ALT
1G
Vcebr=
65V
R40
560K
R41
200K
ZR1
12.0
VD
C
BZT52C12-7
-F
R45
30K
R46
1.0
M
Q10
IRF4905PBF
C60
0.1
uF
C61
0.1
uF
Q15
BC846ALT
1G
Vcebr=
65VR
17
1.0
MR52
30K
R60
1.0
M
Q16
STB16N
F06LT
4R18
C1
22uF
C2
22uF
R19
1.0
MR25
1.0
M
D23
D24
D25
D26
D27
S1
C3
1000pF
Q14
BSS138
C4
0.1
uF
Q17
FD
V304P
R1
100K
T1
MM
BD
4148SE
C8
1000pF
T2
MM
BD
4148SE
C16
1000pF
C42
0.1
uF
C50
0.1
uF
-+
CELL1
-+
CELL2
-+
CELL3
-+
CELL4
-+
CELL5
-+
CELL6
-+
CELL7
-+
CELL8
VSS
VLD
O1
VSS
VSS
VSS
VSS
VLD
O1
S002
bq78PL114
www.ti.com .................................................................................................................................... SLUS850A–SEPTEMBER 2008–REVISED SEPTEMBER 2008
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): bq78PL114
PACKAGING INFORMATION
Orderable Device Status (1) PackageType
PackageDrawing
Pins PackageQty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
BQ78PL114RGZR ACTIVE QFN RGZ 48 2500 TBD Call TI Call TI
BQ78PL114RGZT ACTIVE QFN RGZ 48 250 TBD Call TI Call TI
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.
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PACKAGE OPTION ADDENDUM
www.ti.com 1-Oct-2008
Addendum-Page 1
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