novel method of surface activation for electroless metal plating

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Novel Method of Surface Activation for Electroless Metal Plating. Jon Englert 1 , Amy Ng 2 , and Anthony Muscat 3 1 Department of Chemistry and Biochemistry, 2 Department of Materials Science and Engineering, 3 Department of Chemical and Environmental Engineering, University of Arizona - PowerPoint PPT Presentation

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Novel Method of Surface Activation for Electroless Metal Plating

Jon Englert1, Amy Ng2, and Anthony Muscat3

1Department of Chemistry and Biochemistry, 2Department of Materials Science and Engineering,

3Department of Chemical and Environmental Engineering, University of Arizona

Arizona Space Grant Consortium, Tucson, Arizona

April 17, 2010

1

Metal Plating

• Corrosion and Wear Resistance

• Physical Properties

• Conductivity Characteristics– Lam Research: Wire Production

2

Electroless Metal Plating

Process:Deposit a thin chemical layer on an object that can catalyze the nucleation of metal on its surface

– No electrical power required

– Plating on nonconductive surfaces

– Uniform plating on complex substrates

3

Surface Activation for Electroless Metal Plating

Challenge:

Saturated monolayer required for uniform plating

Approach:Aminosilane self assembled monolayer (SAM) on SiO2 substrate to form a reactive amino-terminated surface

4

SiO

O

O

NH2

SiO

O

O

NH2

SiO

O

O

NH2

SiO

O

O

NH2

SiO

O

O

NH2

SiO

O

O

NH2

OH

OH

OH

3-aminopropyltrimethoxysilane APTMS

Si

O

OO

NH2

Tri-functional aminosilane

SiO2

Common Surface Activation Methods

5

Liquid: Exposure to aminosilane solution and extraction with solvents

Dilute Liquid: Exposure to highly diluted aminosilane in solvents

Atmospheric Vapor: Exposure to aminosilane at atmospheric vapor and extraction with solvents

[1] Petri D.F.; Wenz G.; Shunk P.; Schimmel T. Langmuir 1999, 15, 4520-4523.

Common Surface Activation Methods

6

Vacuum Vapor MethodSamples are placed in the vacuum vapor reactor and pumped down

Pump valve is closed and samples are exposed to precursor vapor

System is purged of precursor vapor and the sample is removed

7

•Fast deposition with less thickness variation

•No precursor dilution required

•Can be combined with vacuum controlled etching and plating processes

APTMS Vacuum Vapor Exposure

8

Comparison of Activation Methods

9

APTMS Surface Characterization

10

Water contact angle on an amino-terminated surface is approximately 50 -70 ⁰ ⁰ 1

[1] Petri D.F.; Wenz G.; Shunk P.; Schimmel T. Langmuir 1999, 15, 4520-4523.

APTMS Exposure and ExtractionOther Solvents Used:•Acetone•Isopropyl Alcohol•Chloroform

11

One cycle is one exposure and one extraction

SiO

O

O

NH

SiO

O

O

NH

SiO

O

O

NH2

SiO

O

O

NH2

APTMS Surface Characterization

Amino-terminated surface present throughout process suggesting polymerization

12

APTMS Surface CharacterizationS1 = 6 cycles of 10min APTMS Exposure / 10min Toluene Extraction

S3 = 10min APTMS Exposure

X-Ray Photoelectron Spectroscopy (XPS) Analysis

13

Current Work• Atomic Force Microscopy (AFM) and

Fourier Transform Infrared Spectroscopy (FTIR) of activated surfaces.

• Cobalt plating on activated surfaces

• Surface activation using APDES precursor

14

Si

O

NH2

3-aminopropyldimethylethoxysilaneAPDES

Mono-functionalized aminosilane

Thank You!

15

16

Vacuum Vapor Reactor Schematic

APDES Vacuum Vapor Exposure

17

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