gtk cooling: status of the micro-channel option
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– GTK Working Group Meeting –
GTK Cooling: Status of the Micro-Channel OptionFeb 2nd 2010
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GTK COOLING:STATUS OF THE MICRO-CHANNEL OPTION
Paolo Petagna (CERN, PH/DT)
On behalf of: Jérôme DAGUINRaphael DUMPSAlessandro MAPELLIJérôme NOËLGeorg NÜßLEPaolo PETAGNA
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GTK Cooling: Status of the Micro-Channel OptionFeb 2nd 2010
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SUMMARY
• Perspectives for µ-channel cooling in HEP
• The proposed approach for the NA62 GTK
• Status of the R&D
• Next steps
MAINLY “WORK IN PROGRESS”
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WHY µ-CHANNEL COOLING NOW?
Example: CMOSAIC project run by EPFL (2 labs), ETHZ (2 labs), University of Madrid, Boston University, IBM Zurich.
CERN Presently discussing scientific partnership
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FUTURE POTENTIAL APPLICATIONS IN HEP
• Very low X0 layers for SHLC pixel detectors;
• “Trigger Layers” (first-level trigger) in SHLC Trackers
• ILC/CLIC detectors
First potential target candidate: NA62 GTK
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WHY TARGETING THE NA62 GTK?
1. Extremely aggressive X0 specifications2. Test case for the integration with electronics
1. Simple “system configuration” (3 independent modules)
2. Allows for concentrating the efforts on local thermal management
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“STEP 0”: CREATE A NETWORK OF COLLABORATIONS
• EPFL – LMIS4 collaborating now on -fabrication
• EPFL – LTCM collaborating now on -fluidics + heat & mass transfer
• UCL – ELEC/DICE (SOI & MEMS) discussing possible collaboration
• VTT let us know their interest through PH/ESE: need to contact them
• IBM Research – Zurich Personal contact with B. Michel + CMOSAIC
• SLAC Developing in this moment a very similar line of R&D
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PROPOSED PROCEDURAL MATRIX
500 m Pyrex
500 m Si
500 m Pyrex
500 m Si
500 m Pyrex
300 m Si
300 m Si
300 m Si
50 m Si (thinned)
100 m Si (thinned)
Fluid distribution / recollectionChannel optimal sizeHeat transfer from chips/sensorTemperature uniformity
Silicon on Silicon bonding
Pressure issuesHandling issues
C6F14 vs. CO2
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CFD SIMULATIONS AT EPFL – 1: CHANNEL GEOMETRY
J. Thome et al. Two-Phase Cooling of Targets and Electronics for Particle Physics Experiments , TWEPP 09, Paris, Sep 21-25 2009
50 x 50 m section
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CFD SIMULATIONS AT EPFL – 2: C6F14 VS. CO2
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µ-CHANNEL PROTOTYPES PRODUCED - 1
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µ-CHANNEL PROTOTYPES PRODUCED - 2
Pyrex 500 µm
Silicon 500 µm
Anodic Bonding
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IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 1:“CLAMP” SYSTEM
• Bulky• Complex integration with electronics
• Holds pressure in the manifolds• Allow immediately for thermo-
fluid studies
Size and mass can be reduced
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IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 2:NANOPORT® CONNECTORS
• Lighter• Easy integration
Preferred choice
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IDEAS FOR FLUID DISTRIBUTION/RECOLLECTION – 3:PRESSURE TESTS OF NANOPORT® CONNECTORS
Requires careful design and test of fluid distribution / collection
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TEST SET-UP FOR C6F14 COOLING: P&I
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TEST SET-UP FOR C6F14 COOLING: PREPARATION
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FIRST TEST SET-UP FOR CO2 COOLING: AVAILABLE
PRESSURE GAUGE
METERING VALVE
OPTIONAL
CAPILLARY TUBE
DETECTOR TUBE WITH ELECTRIC HEATING
MASSFLOW METER
CO2 BOTTLE WITH PLUNGER
CONCENTRIC TUBE HEAT
EXCHANGER
VENT TO ATMOSPHER
E
PROPORTIONAL RELIEF VALVE
WATER BATH
HEATER
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THERMAL CONTACT STUDIES
PRESENT BENCHMARK:ME7159 by AI Technology (USA)
diamond-loaded epoxy glue with thermal conductivity11.4 W/mK
R&D contract in preparation with CNR Italy(Institute for Composite and Biomedical Materials):
Study of thermal conductive adhesives obtained by doping Araldite 2011 and Silicone VRT • Carbon Nano-Tubes• Diamond Nano-Powder• Metal Nano-Wires
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NEXT STEPS
• Tackle integration problems (towards electronics and towards outside)
• Start C6F14 studies – room temperature
• Continue C6F14 studies – low temperature
• Proceed with Silicon on Silicon bonding technique
• Start CO2 studies
• Move towards thinned assembly
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LONG TERM: A POSSIBLE FUTURE EVOLUTION?
?
But a rational approach is to move step by step towards intermediate useful objectives…
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