epoxy binder systems for civil engineeringutsrus.com/documents/seminary_doklady/hexseminar.pdf ·...

1March 9, 2007

Epoxy B inder S ystems for Civil Engineering

C l ic k a b le l in k s a r e u n d e r l in e d

A T E -E 3 1 0 /2 00 6

2M a r c h 9 , 2 0 0 7

T h e in f o rm a t io n p r o v id e d h e r e in w a s b e l ie v e d b y H e x io n S p e c ia l t y C h e m ic a ls (“H e x io n ”) to b e a c c u r a t e a t th e t im e o f p r e p a r a t io n o r p r e p a r e d f r o m s o u r c e s b e l ie v e d t o b e r e l ia b le , b u t i t is th e r e s p o n s ib i l i t y o f t h e u s e r to in v e s t ig a t e a n d u n d e r s t a n d o t h e r p e r t in e n t s o u r c e s o f in f o rm a t io n , t o c o m p ly w it h a l l la w s a n d p r o c e d u r e s a p p l ic a b le to th e s a fe h a n d l in g a n d u s e o f th e p r o d u c t a n d to d e t e rm in e t h e s u i t a b i l i t y o f th e p r o d u c t fo r i t s in t e n d e d u s e . A l l p r o d u c t s s u p p l ie d b y H e x io n a r e s u b je c t t o H e x io n ’s t e rm s a n d c o n d i t io n s o f s a le . H E X IO N M A K E S N O W A R R A N T Y , E X P R E S S O R IM P L IE D , C O N C E R N IN G T H E P R O D U C T O R T H E M E R C H A N T A B IL IT Y O R F IT N E S S T H E R E O F F O R A N Y P U R P O S E O R C O N C E R N IN G T H E A C C U R A C Y O F A N Y IN F O R M A T IO N P R O V ID E D B Y H E X IO N , e x c e p t t h a t th e p r o d u c t s h a l l c o n fo rm to H e x io n ’s s p e c i f ic a t io n s . N o t h in g c o n ta in e d h e r e in c o n s t i t u t e s a n o f f e r fo r t h e s a le o f a n y p r o d u c t .

D is c la im e r

3M a r c h 9 , 2 0 0 7

Introduction

Epikote™ Res ins

New Waterborne Curing Agents

S tarting Formulations

Epikure™ Curing Agents

Binder S ystems by Application

T a b le o f C o n te n t s

4M a r c h 9 , 2 0 0 7

A m b ie n t C u r in g w i t h E p o x y B in d e r s -S o m e Im p o r t a n t A s p e c t s a n d B e n e f i t s

Epikote™ / Epikure™ epoxy binder e a s y t o a p p ly f a v o u r a b le m ix in g r a t io lo w m ix in g v is c o s i t ie s w id e r a n g e p r o c e s s in g t im e p o s s ib le e x c e l le n t w e t t in g p r o p e r t ie s a n d g o o d a d h e s io n t o s u b s t r a t e s h ig h f i l le r le v e ls p o s s ib le h y d r o ly s is r e s is t a n c e o n c o n c r e t e s u r f a c e s g o o d m e c h a n ic a l s t r e n g th a n d h ig h c h e m ic a l r e s is t a n c e

Introduction

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5M a r c h 9 , 2 0 0 7

l iq u id s ta n d a r d B P A r e s in

l iq u id s ta n d a r d B P F r e s in

l iq u id B P A /B P F r e s in , c r y s ta l l is a t io n f r e e

B P A /B P F r e s in , lo w v is c o u s , c r y s ta l l is a t io n f r e e

U n m o d i f ie d E p o x y R e s in s

EpikoteTM 862

EpikoteTM 235

EpikoteTM 144

CH2 OO

EpikoteTM 828 LVEL EpikoteTM 862

Resins, Reactive Diluents and Hardeners

EpikoteTM 828 LVEL

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6M a r c h 9 , 2 0 0 7

1 7 5 - 1 8 31 9 0 0 ± 2 0 0C a r d .E 1 0 P / T PEpikoteTM 260

1 8 4 - 1 9 51 0 0 0 ± 2 0 0C a r d u r a E 1 0 PEpikoteTM 818

1 8 9 - 2 0 01 0 0 0 ± 1 0 0C a r d u r a E 1 0 PEpikoteTM 816 MV

1 9 2 - 2 0 45 0 0 ± 1 0 0C a r d u r a E 1 0 PEpikoteTM 816 LV

1 8 9 - 2 0 01 8 0 0 ± 3 0 0C a r d u r a E 1 0 PEpikoteTM 816

1 6 3 - 1 7 17 0 0 ± 1 0 0H DEpikoteTM 357

Epoxy equivalent

[g/eq.]

Viscos ity at 25°C [mPa·s]

Diluent HeloxyTM

CarduraTM

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L o w v is c o u s e p o x y r e s in s fo r f o rm u la t io n o f f i l le r c o n t a in in g s y s t e m s fo r v a r io u s a p p l ic a t io n s

R e a c t iv e D i lu t e d E p o x y R e s in s

7M a r c h 9 , 2 0 0 7

u n d e rw a te r c u r e1 8 2 ± 4 6 5 0 ± 1 5 0EpikoteTM 03121

h ig h c h e m ic a l r e s is t a n c e1 9 4 ± 5 9 5 0 ± 1 5 0 EpikoteTM 896

b r id g e r e n o v a t io n2 0 0 ± 5 2 5 0 ± 7 5EpikoteTM 04851

c r a c k in je c t io n1 6 9 ± 2 1 2 5 ± 2 5EpikoteTM 03306

c r a c k in je c t io n1 8 0 ± 2 3 2 5 ± 5 0EpikoteTM 03141

ApplicationEpoxy equivalent

[g/eq.]

Viscos ity at 25°C [mPa·s]

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L o w v is c o u s e p o x y r e s in s fo r f o rm u la t io n o f f i l le r c o n t a in in g s y s t e m s fo r v a r io u s a p p l ic a t io n s

M o d i f ie d E p o x y R e s in s

8M a r c h 9 , 2 0 0 7

L o w v is c o s i t y L o w e s t y e l lo w in g c h a r a c t e r is t ic s L o w C h lo r in e c o n te n t / V e r y lo w c o lo r

2 1 0 - 2 2 01 8 0 0 - 2 5 00EponexTM 1510

Epoxy equivalent

[g/eq.]

Viscos ity at 25 °C [mPa·s]

YellowingS tarting Formulations

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S p e c ia l t ie s : H y d r o g e n a te d R e s in s

9M a r c h 9 , 2 0 0 7

Epikure™ adduct hardeners f o r u n iv e r s a l f o rm u la t io n s w it h ta c k -f r e e , g lo s s y s u r f a c e s , l ig h t a n d h ig h w a te r s p o t t in g r e s is t a n c e a s w e l l a s g o o d f in a l m e c h a n ic a l p r o p e r t ie s

Epikure™ mannich base hardeners f o r h ig h -p e r f o rm a n c e g r o u t in g c o m p o u n d s a n d c o n c r e t e a d h e s iv e s

W it h e x c e l le n t m e c h a n ic a l s t r e n g t h , h ig h c h e m ic a l r e s is t a n c e a n d g o o d c u r in g p r o p e r t ie s a t t e m p e r a t u r e s d o w n t o 5 °C

Epikure™ blend hardeners W ith g o o d c o s t/p e r f o rm a n c e -r a t io a n d lo w v is c o s i t y

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E p o x y H a r d e n e r s

1 0M a r c h 9 , 2 0 0 7

Modified adduct hardeners for high-gloss surfaces with broad application range and good water spotting res is tance.

V e r s a t i le h a r d e n e r9 32 0 0 ± 3 0Epikure™ 530

ApplicationH-active equivalent

[g/eq.]

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A d d u c t H a r d e n e r s

1 1M a r c h 9 , 2 0 0 7

S pecialties for low yellowing characteris tics , high res is tance agains t osmotic pressure / damp concrete and VOC-free according to the Decopaint Guideline.

O s m o t ic p r e s s u r e r e s is t a n t6 65 0 0 ± 7 5Epikure™ 04852

L o w y e l lo w in g te n d e n c y1 1 54 5 0 ± 1 5 0Epikure™ 548

L o w y e l lo w in g / v e r s a t i le1 0 56 0 0 ± 1 0 0Epikure™ F205

V e r y lo w y e l lo w in g1 0 96 0 0 ± 1 0 0Epikure™ 196

V O C -f r e e8 53 5 0 ± 1 0 0Epikure™ 05418

[g/eq]

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A d d u c t H a r d e n e r s

1 2M a r c h 9 , 2 0 0 7

H-active-equivalent [g/eq.]

I n je c t io n s y s t e m

U n d e rw a te r -c u r e

V e r s a t i le h a r d e n e r

P o ta b le w a t e r

V e r s a t i le h a r d e n e r

Application

2 7 00 ± 3 00Epikure™ 03121

3 0 0 ± 5 0Epikure™ 03141

5 0 0 ± 2 0 0Epikure™ 185

2 5 00 ± 5 00Epikure™ 105

1 6 0 0 ± 2 00Epikure™ 132

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M a n n ic h B a s e H a r d e n e r s

High reactive hardeners with good mechanical properties and high chemical res is tance.

1 3M a r c h 9 , 2 0 0 7

Amine blend hardeners with good cost/performance-ratio and for special systems

P ip e r e h a b i l i t a t io n5 61 6 ± 5 Epikure™ 3203

H ig h c h e m ic a l r e s is t a n c e3 89 ± 5Epikure™ 270

C r a c k in je c t io n5 12 5 ± 5Epikure™ 03306

[g/eq.]

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B le n d H a r d e n e r s

1 4M a r c h 9 , 2 0 0 7

Epikure™ 8545-W-52

S o lu t io n s t a b i l i t y V e r y lo w f r e e a m in e c o n te n t V is ib le e n d o f p o t-l i f e N o c o -s o lv e n t in th e c u r in g a g e n t Z e r o V O C s y s t e m B e n z y l a lc o h o l f r e e R e s is t a n t a g a in s t w a te r u p t a k e L ig h t c o lo r e d C o r r o s io n r e s is t a n t

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S p e c ia l t ie s – N e w W a te r b o r n e C u r in g A g e n t s

1 5M a r c h 9 , 2 0 0 7

-E p o n e x 1 5 1 0 / E K 1 9 6E P 3 5 7 / E K 5 4 8E P 8 1 6 / E K F 2 0 5Decorative S ystem / Top Coat*

E P 8 1 6 / E K 8 5 4 5 -W -5 2E P 3 5 7 / E K 05 4 1 8E P 3 5 7 / E K 5 3 0 o r E K 5 4 1E P 8 1 6 M V / E K F 2 0 5Self Levelling Flooring*

E P 8 1 6 / E K 8 5 4 5 -W -5 2E P 3 5 7 / E K 1 8 5E P 3 5 7 / E K 5 3 0 o r E K 5 4 1E P 8 1 6 M V / E K F 2 0 5Trowelable Flooring & Grouting*

E P 8 1 6 / E K 8 5 4 5 -W -5 2E P 3 5 7 / E K 04 8 5 2E P 3 5 7 / E K 5 3 0 o r E K 5 4 1E P 8 1 6 L V / E K F 2 0 5 Concrete Primer & Impregnation*

WaterborneS pecialExcellentS tandard

S tandard Industrial Flooring Applications

S pecial S ystems

-E P 03 1 2 1 / E K 0 3 1 2 1Underwater Cure

E P 03 3 0 6 / E K 03 3 0 6E P 0 3 1 4 1 / E K 0 3 1 4 1Crack Injection

-E P 2 6 0 / E K 3 2 0 3Waterway Renovation / Pipe Rehabilitation

-E P 04 8 5 1 / E K 0 4 8 5 2Bridge Renovation

E P 8 1 8 / E K 2 0 7E P 1 4 4 / E K 1 3 2Potable Water S ystem

E P 8 9 6 / E K 2 7 0E P 3 5 7 / E K 1 0 5Chemical Res is tant S ystem

* A l l p r o d u c ts a r e p h e n o l a n d n o n y lp h e n o l f r e e

B in d e r S y s t e m s b y A p p l ic a t io n

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1 6M a r c h 9 , 2 0 0 7

- r e s is t a n t a g a in s t o s m o t ic p r e s s u r e

- g o o d a d h e s io n e v e n o n d a m p c o n c r e t e

Epikote™ 357 w it h Epikure™ 04852

S tandard S ystem

- v e r s a t i le p r im e r fo r e x c e l le n t s u r f a c e s

- d i lu t a b le w it h o r g a n ic s o lv e n t s

- l im i t e d c r o s s l in k in g d e n s i t y y ie ld s in p o o r c h e m ic a l r e s is t a n c e

Epikote™ 816 LV w it h Epikure™ F 205

Epikote™ 357 w it h Epikure™ 530 o r Epikure™ 541Excellent S ystem

S pecial S ystem

Selected Binder Systems

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Waterborne S ystem Epikote™ 816 w it h Epikure™ 8545-W-52- z e r o V O C s y s t e m

C o n c r e t e P r im e r & Im p r e g n a t in g

1 7M a r c h 9 , 2 0 0 7

S tandard S ystem

- v e r s a t i le e p o x y b in d e r s y s t e m - g o o d p r o c e s s in g c h a r a c t e r is t ic s

Epikote™ 357 w it h Epikure™ 530 o r Epikure™ 541Excellent S ystem

S pecial S ystem

- v e r y g o o d c r o s s l in k in g- g o o d c h e m ic a l r e s is t a n c e

Epikote™ 816 MV w it h Epikure™ F 205

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Waterborne S ystem

- z e r o V O C s y s t e m

Epikote™ 816 w it h Epikure™ 8545-W-52

T r o w e la b le F lo o r in g & G r o u t in g

1 8M a r c h 9 , 2 0 0 7

S tandard S ystem

- o p t im a l p r o c e s s in g c h a r a c t e r is t ic s

- h ig h m e c h a n ic a l s t r e n g t h s

- g lo s s y s u r f a c e

Epikote™ 357 w it h Epikure™ 530 o r Epikure™ 541 Excellent S ystem

Epikote™ 816 MV w it h Epikure™ F 205

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- z e r o V O C s y s t e m

Epikote™ 816 w it h Epikure™ 8545-W-52 Waterborne S ystem

S e l f L e v e l l in g F lo o r in g

S pecial S ystem Epikote™ 357 w it h Epikure™ 05418 - V O C -f r e e a c c o r d in g to t h e D e c o p a in t G u id e l in e

- h ig h m e c h a n ic a l s t r e n g t h s

- g lo s s y s u r f a c e

1 9M a r c h 9 , 2 0 0 7

S tandard S ystem

- v e r s a t i le s y s t e m w it h g o o d f in a l p r o p e r t ie s- lo w y e l lo w in g t e n d e n c y- lo w e r r e a c t iv i t y

- o p t im a l p r o c e s s in g c a r a c t e r is t ic s- h ig h m e c h a n ic a l s t r e n g th s- g lo s s y s u r f a c e

Epikote™ 357 w it h Epikure™ 548Excellent S ystem

S pecial S ystem

- lo w e s t y e l lo w in g c h a r a c t e r is t ic s

Eponex™ 1510 w it h Epikure™ 196

Epikote™ 816 w it h Epikure™ F 205

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D e c o r a t iv e S y s t e m / T o p C o a t

2 0M a r c h 9 , 2 0 0 7

S tandard S ystem

- fo r u s e in c h e m ic a l r e s i t a n t t o p c o a t s- v e r y g o o d m e c h a n ic a l p r o p e r t ie s a n d h ig h g la s s t r a n s i t io n te m p e r a t u r e : a p p r o x . 6 2 °C- h ig h c r o s s l in k in g d e n s i t y y ie ld s in lo w f le x ib i l i t y o f t h e f in is h e d p r o d u c t

- v e r y g o o d c r o s s l in k in g- g o o d a d h e s io n e v e n o n d a m p c o n c r e t e- g o o d c h e m ic a l r e s is t a n c e

Excellent S ystem

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C h e m ic a l R e s is t a n t S y s t e m

2 1M a r c h 9 , 2 0 0 7

S tandard S ystem

- fo r c o a t in g s a c c o r d in g to K T W - G u id e l in e , l is t 1 / E u r o p e a n F o o d S a fe t y A p p r o v e d A u th o r i t y (E F S A )- fo r s t o r a g e f a c i l i t ie s a n d ta n k s fo r p o ta b le w a t e r

Excellent S ystem

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P o ta b le W a te r S y s t e m

2 2M a r c h 9 , 2 0 0 7

S pecial S ystem

- u s e fu l f o r v e r s a t i le u n d e r g r o u n d p r e p a r a t io n- g o o d a d h e s io n e v e n o n d a m p c o n r e t e- c e r t i f ic a t e fo r b r id g e s e a l in g s

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B r id g e R e n o v a t io n

2 3M a r c h 9 , 2 0 0 7

S pecial S ystem

- m in im u m w o r k in g t im e o f 6 h o u r s a t a m b ie n t t e m p e r a t u r e- c u r e a t 6 0 – 8 0 °C- c o m p r e s s iv e m o d u lu s a f t e r im p r e g n a t io n > 2 5 0 0 M P a- e a s y im p r e g n a t in g- r e s is t a n c e c r e e p u n d e r s t a t ic lo a d- r e s is t a n t to c le a n in g l iq u id s

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W a te r w a y R e n o v a t io n / P ip e R e h a b i l i t a t io n

2 4M a r c h 9 , 2 0 0 7

S tandard S ystem

- a p p l ic a t io n s : c o n c r e t e c r a c k f i l le r s , s ta b i l iz a t io n o f p o r o u s u n d e r g r o u n d s- m ix in g v is c o s i t y a t 2 5 °C : a p p r o x . 1 0 0 m P a ·s- m ix in g r a t io : 1 0 0 : 3 0 p b w - p o t l i f e : a p p r o x . 8 0 m in

- a p p l ic a t io n s : c o n c r e t e c r a c k f i l le r s- m ix in g v is c o s i t y a t 2 5 °C : a p p r o x . 3 0 0 m P a ·s- m ix in g r a t io : 1 0 0 : 5 0 p b w - p o t l i f e : a p p r o x . 3 0 m in

Excellent S ystem

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C r a c k In je c t io n

2 5M a r c h 9 , 2 0 0 7

S pecial S ystem

- b in d e r fo r t h e f o rm u la t io n o f „O f f S h o r e “ – p a in t c o m p o u n d s- u n d e r w a te r c u r in g- p r o c e s s in g t im e a p p r o x . 2 0 m in u te s

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U n d e r w a te r C u r e

2 6M a r c h 9 , 2 0 0 7

A p p e n d ix I

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2 7M a r c h 9 , 2 0 0 7

T h e c h e m ic a l r e s is t a n c e o f H e x io n b in d e r s y s te m s is te s te d b y e x p o s in g th e s u r f a c e o f f la t s a m p le s to v a r io u s a g g r e s s iv e c h e m ic a ls . A c c o r d in g to D IN E N IS O 8 6 8 S h o r e D h a r d n e s s is m e a s u r e d a s a fu n c t io n o f e x p o s u r e t im e . F o l lo w in g D IN / E N / IS O 2 8 1 2 – 1 , m e th o d 2 , th e te s t is r e a l is e d a t r o o m te m p e r a tu r e .

Chemical Res is tance

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T e s t M e th o d s

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C h e m ic a l r e s is t a n c e is s h o w n in th e fo l lo w in g g r a p h s a s r e la t iv e v a r ia t io n o f S h o r e D h a r d n e s s . T h e s ta r t in g p o in t is d e f in e d a s S h o r e D v a lu e m e a s u r e d a f t e r c u r in g fo r 7 d a t 2 3 °C .T h e te s t d u r a t io n is fo u r w e e k s w i t hc h e m ic a l e x p o s u r e (w i t h te n s e le c te d c h e m ic a ls ) a n d o n e w e e k o f r e la x a t io n w i t h o u t e x p o s u r e to c h e m ic a ls .

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2 9M a r c h 9 , 2 0 0 7

I n th e g r a p h s w h ic h a r e a t t a c h e d to th e p r o d u c t p r o f i le s y o u g e t r e la t iv e v a lu e s o f th e h a r d n e s s b e c a u s e o f b e t t e r c o m p a r a b i l i t y .T h e S h o r e D h a r d n e s s a f t e r s e v e n d a y s c u r in g a t r o o m te m p e r a t u r e is d e f in e d a s th e s ta r t in g p o in t (1 0 0% ).

withoutcontamination

1 week 2 weeks 3 weeks 4 weeks 1 weekrelaxation

PetrolAromatesAlcoholEster/KetoneAcetic Acid 10%DETA 50% in WaterNitric Acid 25%Sulphuric Acid 36%Lactic Acid 10%Brake Fluid

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3 0M a r c h 9 , 2 0 0 7

The applied chemicals contain the following components :

P e t r o l: 4 7 .5 v o l% T o lu e n e ; 3 0 .4 v o l% I s o o c t a n e ; 1 7 .1 v o l% n -H e p t a n e ;3 .0 v o l% M e th a n o l

A r o m a t e s : 6 0 .0 v o l% T o lu e n e ; 3 0 .0 v o l% o -/m -X y le n e ; 1 0 .0 v o l% M e th y l icN a p h t h a le n e

A lc o h o l: 4 8 .0 v o l% M e th a n o l; 4 8 .0 v o l% is o -P r o p a n o l; 4 .0 v o l% W a te r

E s t e r /K e to n e : 5 0 .0 v o l% E th y la c e t a t e ; 5 0 .0 v o l% I s o b u t y lm e t h y lk e t o n e

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back Binder S ystems by Application

3 1M a r c h 9 , 2 0 0 7

S a m p le s o f H e x io n b in d e r s y s te m s a r e p la c e d in a Q U V a c c e le r a te d w e a th e r in g te s te r . T h is e q u ip m e n t r e p r o d u c e s th e d a m a g e (c o lo u r c h a n g e ) th a t o c c u r s o v e r m o n th s o r y e a r s o u td o o r s .

Yellowing Tendency

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3 2M a r c h 9 , 2 0 0 7

Yellowing Tendency

T h e c le a r b in d e r is c u r e d fo r 7 d a y s a t 2 3 ° C . T h e n th e s p e c im e n s a r e e x p o s e d to U V -l ig h t fo r 5 d a y s (U V A -3 4 0 la m p ; 8 0 W /m 2/n m ).

C o lo u r c h a n g e a c c o r d in g to C IE L a b m e t r ic s m e a s u r e d e v e r y 2 4 h o u r s . “b -v a lu e s ” in d ic a t in g y e l lo w in g v s . e x p o s u r e t im e a r e s h o w n o n th e fo l lo w in g g r a p h s .

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3 3M a r c h 9 , 2 0 0 7

R e a c t iv i t y o f a 1 0 0 g r e s in -h a r d e n e r m ix is m e a s u r e d a t a s ta r t in g te m p e r a tu r e o f 2 3 °C .T e m p e r a tu r e t r e n d a n d m a x im u m a r e r e c o r d e d . F o l lo w in g v a lu e s a r e d e f in e d : W o r k in g t im e = p e r io d o f t im e u n t i l ate m p e r a tu r e o f 4 0 °C (th r o u g h e x o th e rm r e a c t io n ) is a c h ie v e d .P o t l i f e = t im e to p e a k te m p e r a t u r e .

Pot Life

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3 4M a r c h 9 , 2 0 0 7

H e x io n is u t i l iz in g “G e ln o rm ® ” e q u ip m e n ta c c o r d in g to D IN 1 6 9 4 5 a n d IS O 9 3 9 6 .A te s t t u b e , p a r t ia l ly f i l le d w it h r e s in -h a r d e n e rm ix a n d e q u ip p e d w it h a p lu n g e r is p la c e din a c o n s ta n t te m p e r a tu r e b a th a t 2 3 °C . T h ep lu n g e r is m o v e d u p in s h o r t in t e r v a ls . I f th eg e l p o in t is r e a c h e d , th e te s t tu b e is l i f t e dw i t h t h e p lu n g e r a n d s to p s a t im e r .

Gel Time

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3 5M a r c h 9 , 2 0 0 7

S urface properties:R e d p ig m e n te d b in d e r s y s te m s a r e a p p l ie d o n g la s s p la t s (th ic k n e s s 1 2 0 µ m ).W e t t in g , le v e l l in g a n d g lo s s a r e d e te rm in e d v is u a l ly a f t e r c u r in g .Early water resistance:A f te r a c u r in g t im e o f 4 , 8 , 2 4 a n d 4 8 h s u r f a c e s a r e a p p l ie d w i t h w a te r . S u r f a c e c h a n g e s a n d fo rm a t io n o f c a r b a m a te a r e d e te rm in e d . T h e te s t s a r e c o n d u c te d a t 1 0 °C a n d 2 3 °C .

S urface / Early Water Res is tance

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3 6M a r c h 9 , 2 0 0 7

Mechanical PropertiesTest S tandards

Compress ive s trength EN IS O 604Tens ile s trength EN IS O 527Flexural s trength EN IS O 178E-modulus EN IS O 178Glass trans ition temperature (Tg - DS C) IEC 1006

T h e m e c h a n ic a l p r o p e r t ie s a r e m e a s u r e d a f t e r s e v e n d a y s c u r in g a t r o o m te m p e r a t u r ep lu s p o s t c u r in g o f 5 h / 5 0 °C a n d 2 h / 1 0 0 °C .T h e s e v a lu e s a r e f o r g e n e r a l in f o rm a t io n o n ly a n d s h o u ld g u id e th e c u s t o m e r in c h o o s in g t h e a p p r o p r ia t e e p o x y s y s t e m . T o s o m e e x te n t t h e y a r e b a s e d o n in d iv id u a l m e a s u r e m e n t s w h ic h a r e s u b je c t t o th e u s u a l f lu c t u a t io n s a n d a r e n o t b in d in g . F o r p r a c t ic a l a p p l ic a t io n s , th e p r o p e r t ie s o f c o a t in g s p r o c e s s e d a n d h a r d e n e d u n d e r b u i ld in g s i t e c o n d i t io n s a r e d e c is iv e .

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3 7M a r c h 9 , 2 0 0 7

P r o d u c t P r o f i le s

EpikoteTM 816 LV

R e a c t iv e ly d i lu t e d e p o x y r e s in

b a s e d o n b is p h e n o l A

E p o x y e q u iv a le n t : 1 9 8 ± 6 g /e q u iv .

V is c o s i t y (2 5 °C ): 5 0 0 ± 1 0 0 m P a ·s

EpikureTM F 205

M o d i f ie d , c y c lo a l ip h a t ic p o ly a m in e -

a d d u c t

H – a c t iv e e q u iv a le n t : 1 0 4 g /e q u iv .

V is c o s i t y (2 5 °C ): 6 0 0 ± 1 0 0 m P a ·s

M ix in g r a t io (r e s in : h a r d e n e r) [p b w ] 1 0 0 : 5 2 .5

P o t l i f e : t t o 4 0 °C 2 8 m int to T m a x 7 0 m in

T m a x 1 0 7 °C

G e l t im e : 2 9 2 m in

Epikote™ 816 LV with Epikure™ F 205

back to main menu

next back Binder S ystems by Application

3 8M a r c h 9 , 2 0 0 7next

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C l i t t le g lo s s , l i t t le ir r e g u la t io n s

Early Water Res is tance (1 = g o o d ... 5 = p o o r)a t 2 3 °C 5a t 1 0 °C 5

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 3 0 6 2 7 6a t 1 0 °C - 2 0 7 2

Chemical Res is tanceYellowing Tendency

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3 9M a r c h 9 , 2 0 0 7

Mechanical Properties

C u r in g 7 d 7 d + p o s t c u r in g

F le x u r a l s t r e n g t h [M P a ] 3 4E - m o d u lu s [M P a ] 8 9 3T e n s i le s t r e n g t h [M P a ] 2 0C o m p r e s s iv e s t r e n g t h [M P a ] 3 2T g – D S C [°C ] 3 6

back to main menu

4 0M a r c h 9 , 2 0 0 7

EpikoteTM 816 MV

E p o x y e q u iv a le n t : 1 9 4 .5 ± 5 .5 g /e q u iv .

V is c o s i t y (2 5 °C ): 1 0 0 0 ± 1 0 0 m P a ·s

EpikureTM F 205

a d d u c t

V is c o s i t y (2 5 °C ): 6 0 0 ± 1 0 0 m P a ·s

T m a x 1 3 8 °C

G e l t im e : m in

Epikote™ 816 MV with Epikure™ F 205

back to main menu

next Binder S ystems by Application

4 1M a r c h 9 , 2 0 0 7next

S urfacea t 2 3 °C l i t t le g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y s u r f a c e

Epikote™ 816 MV with Epikure™ F 205

back to main menu

4 2M a r c h 9 , 2 0 0 7

EpikoteTM 816

V is c o s i t y (2 5 °C ): 1 8 0 0 ± 3 00 m P a ·s

EpikureTM F 205

a d d u c t

V is c o s i t y (2 5 °C ): 6 0 0 ± 1 0 0 m P a ·s

T m a x 1 3 6 °C

G e l t im e : m in

Epikote™ 816 with Epikure™ F 205

back to main menu

4 3M a r c h 9 , 2 0 0 7next

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y s u r f a c e

Epikote™ 816 with Epikure™ F 205

back to main menu

4 4M a r c h 9 , 2 0 0 7

EpikoteTM 357

R e a c t iv e ly d i lu t e d , n o n -c r y s t a l l iz in g

e p o x y r e s in b a s e d o n b is p h e n o l A /F

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

EpikureTM 04852

a d d u c t

H – a c t iv e e q u iv a le n t : 6 6 g /e q u iv .

V is c o s i t y (2 5 °C ): 5 0 0 ± 7 5 m P a ·s

T m a x 2 2 1 °C

Epikote™ 357 with Epikure™ 04852

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4 5M a r c h 9 , 2 0 0 7next

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y s u r f a c e

back to main menu

4 6M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 4 6E - m o d u lu s [M P a ] 3 0 2 8T e n s i le s t r e n g t h [M P a ] 7 3C o m p r e s s iv e s t r e n g t h [M P a ] 9 2T g – D S C [°C ] 5 0 8 5

back to main menu

4 7M a r c h 9 , 2 0 0 7

C h e m ic a l R e s is t a n c e

test method back back to main menu

alues)

W i t h o u t c o n ta m in a t io n

1 w e e k 2 w e e k s 3 w e e k s 4 w e e k s 1 w e e k r e la x a t io n

P e t r o l

A r o m a t e s

A lc o h o l

E s t e r /K e to n e

A c e t ic A c id 1 0%

D E T A 5 0 % in W a te r

N i t r ic A c id 2 5 %

S u lp h u r ic A c id 3 6 %

L a c t ic A c id 1 0%

B r a k e F lu id

4 8M a r c h 9 , 2 0 0 7

back to main menu

4 9M a r c h 9 , 2 0 0 7

Epikote™ 357R e a c t iv e ly d i lu t e d , n o n -c r y s t a l l iz in g

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

Epikure™ 530M o d i f ie d , c y c lo a l ip h a t ic p o ly a m in e -

a d d u c t (n o n y lp h e n o l-f r e e )

V is c o s i t y (2 5 °C ): 2 0 0 ± 3 0 m P a ·s

M ix in g r a t io (r e s in : h a r d e n e r) [p b w ] 1 0 0 : 5 6

T m a x 1 8 4 °C

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5 0M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C g o o d , g lo s s y s u r f a c e w it h l ig h t ir r e g u la t io n s

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 6 3 7 5 8 0a t 1 0 °C 1 5 6 2 7 6

back to main menu

5 1M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 6 5 8 2E - m o d u lu s [M P a ] 2 0 8 4 2 5 9 3T e n s i le s t r e n g t h [M P a ] 3 8 4 7C o m p r e s s iv e s t r e n g t h [M P a ] 7 5 8 2T g – D S C [°C ] 3 9 5 0

back to main menu

5 2M a r c h 9 , 2 0 0 7

alues)

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

test method back back to main menu

5 3M a r c h 9 , 2 0 0 7

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

a d d u c t (n o n y lp h e n o l-f r e e )

V is c o s i t y (2 5 °C ): 2 7 5 ± 5 0 m P a ·s

T m a x 1 9 0 °C

back to main menu

5 4M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C v e r y g o o d , g lo s s y s u r f a c ea t 1 0 °C g o o d , g lo s s y s u r f a c e w it h l ig h t ir r e g u la t io n s

back to main menu

5 5M a r c h 9 , 2 0 0 7

back to main menu

5 6M a r c h 9 , 2 0 0 7

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

W ith o u t c o n ta m in a t io n

alues)

back back to main menu test method

5 7M a r c h 9 , 2 0 0 7

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

a d d u c t

V is c o s i t y (2 5 °C ): 4 5 0 ± 1 5 0 m P a ·s

T m a x 1 3 4 °C

back to main menu

5 8M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C v e r r y g o o d , g lo s s y s u r f a c ea t 1 0 °C l i t t le g lo s s , l i t t le i r r e g u la t io n s

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 3 8 6 8 7 7a t 1 0 °C < 1 0 4 0 7 7

back to main menu

5 9M a r c h 9 , 2 0 0 7

back to main menu

6 0M a r c h 9 , 2 0 0 7

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

alues)

back to main menu backtest method

6 1M a r c h 9 , 2 0 0 7back

Y e l lo w in g

0 1 2 3 4 5

D a y s U V -ir r a d ia t io n s t r e s s (9 2 W /m ²/n m U V A 3 4 0)

b*-Value

E p ik o te ™ 8 1 6 + E p ik u r e ™ F 2 0 5 E p ik o te ™ 3 5 7 + E p ik u r e ™ 5 4 8 E p o n e x ™ 1 5 1 0 + E p ik u r e ™ 1 9 6

Decorative S ystems / Top Coat

back to main menu

6 2M a r c h 9 , 2 0 0 7

Eponex™ 1510H y d r o g e n a te d e p o x y r e s in

B a s e d o n b is p h e n o l A

V is c o s i t y (2 5 °C ): 2 1 5 0 ± 3 5 0 m P a ·s

a d d u c t

V is c o s i t y (2 5 °C ): 6 0 0 ± 1 0 0 m P a ·s

P o t l i f e : t t o 4 0 °C 4 9 m int to T m a x 1 1 1 m in

T m a x 6 6 °C

Eponex™ 1510 with Epikure™ 196

back to main menu

6 3M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C v e r y g o o d , g lo s s y s u r f a c ea t 1 0 °C l i t t le g lo s s , l i t t le i r r e g u la t io n s

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C - 4 8 7 7a t 1 0 °C - - 7 0

back to main menu

6 4M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 4 1E - m o d u lu s [M P a ] 1 4 1 9T e n s i le s t r e n g t h [M P a ] 2 4C o m p r e s s iv e s t r e n g t h [M P a ] 4 1T g – D S C [°C ] 3 5

back to main menu

6 5M a r c h 9 , 2 0 0 7

alues)

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

6 6M a r c h 9 , 2 0 0 7back

Y e l lo w in g

0 1 2 3 4 5

b*-Value

E p ik o te ™ 8 1 6 + E p ik u r e ™ F 2 0 5 E p ik o te ™ 3 5 7 + E p ik u r e ™ 5 4 8 E p o n e x ™ 1 5 1 0 + E p ik u r e ™ 1 9 6

Decorative S ystems / Top Coat

back to main menu

6 7M a r c h 9 , 2 0 0 7

EpikoteTM 357

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

EpikureTM 185

M o d i f ie d , s p e c ia l h a r d e n e r b a s e d o n

p o ly a m in e , f a s t c u r in g

V is c o s i t y (2 5 °C ): 5 0 0 ± 2 0 0 m P a ·s

T m a x 1 9 6 °C

G e l t im e : 9 3 m in

back to main menu

6 8M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C l i t t le g lo s s y s u r f a c ea t 1 0 °C l i t t le g lo s s y s u r f a c e

back to main menu

6 9M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 5 2 4 7E - m o d u lu s [M P a ] 1 8 2 2 9 9 0T e n s i le s t r e n g t h [M P a ] 3 2 3 4C o m p r e s s iv e s t r e n g t h [M P a ] 5 1 4 6T g – D S C [°C ] 3 6 3 6

back to main menu

7 0M a r c h 9 , 2 0 0 7

back back to main menu test method

alues)

P e t r o l

A r o m a t e s

A lc o h o l

E s t e r /K e t o n e

B r a k e F lu id

7 1M a r c h 9 , 2 0 0 7

EpikoteTM 357

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

EpikureTM 105

V is c o s i t y (2 5 °C ): 2 5 00 ± 5 00 m P a ·s

P o t l i f e : t t o 4 0 °C 9 m int to T m a x 1 7 m in

T m a x 2 2 5 °C

back to main menu

7 2M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C l i t t le g lo s s y s u r f a c e

back to main menu

7 3M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 1 1 5 1 0 8E - m o d u lu s [M P a ] 3 1 5 0 3 3 4 0T e n s i le s t r e n g t h [M P a ] 7 9 7 1C o m p r e s s iv e s t r e n g t h [M P a ] 1 1 4 1 1 1T g – D S C [°C ] 5 0 5 0

back to main menu

7 4M a r c h 9 , 2 0 0 7

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

W ith o u t c o n ta m in a t io n

alues)

7 5M a r c h 9 , 2 0 0 7back

Y e l lo w in g

0 1 2 3 4 5

D a y s U V -ir r a d ia t io n s t r e s s (9 2 W /m ²/n m U V W 3 4 0)

b*-Value

E p ik o te ™ 3 5 7 + E p ik u r e ™ 1 0 5 E p ik o te ™ 8 9 6 + E p ik u r e ™ 2 7 0

Chemical Res is tant S ystems

back to main menu

7 6M a r c h 9 , 2 0 0 7

EpikoteTM 03141

V is c o s i t y (2 5 °C ): 3 2 5 ± 5 0 m P a ·s

EpikureTM 03141

V is c o s i t y (2 5 °C ): 3 0 0 ± 5 0 m P a ·s

T m a x 2 0 4 °C

G e l t im e : m in

back to main menu

7 7M a r c h 9 , 2 0 0 7

back to main menu

7 8M a r c h 9 , 2 0 0 7

back to main menu

7 9M a r c h 9 , 2 0 0 7back

Y e l lo w in g

Crack Injection

0 1 2 3 4 5

E p ik o te ™ 0 3 1 4 1 + E p ik u r e ™ 0 3 1 4 1 E p ik o te ™ 0 3 3 0 6 + E p ik u r e ™ 0 3 3 0 6

back to main menu

8 0M a r c h 9 , 2 0 0 7

EpikureTM 03306

M o d i f ie d , c y c lo a l ip h a t ic p o ly a m in e

V is c o s i t y (2 5 °C ): 2 5 ± 5 m P a ·s

T m a x 2 0 4 °C

G e l t im e : m in

EpikoteTM 03306

L o w -v is c o u s , n o n -c r y s t a l l iz in g

V is c o s i t y (2 5 °C ): 1 2 5 ± 2 5 m P a ·s

back to main menu

8 1M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C l i t t le g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y s u r f a c e w it h i r r e g u la t io n s

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 4 5 7 7 8 1a t 1 0 °C - - 7 4

back to main menu

8 2M a r c h 9 , 2 0 0 7

back to main menu

8 3M a r c h 9 , 2 0 0 7back

Y e l lo w in g

Crack Injection

0 1 2 3 4 5

E p ik o te ™ 0 3 1 4 1 + E p ik u r e ™ 0 3 1 4 1 E p ik o te ™ 0 3 3 0 6 + E p ik u r e ™ 0 3 3 0 6

back to main menu

8 4M a r c h 9 , 2 0 0 7

EpikoteTM 03121

V is c o s i t y (2 5 °C ): 6 5 0 ± 1 5 0 m P a ·s

EpikureTM 03121

V is c o s i t y (2 5 °C ): 2 7 00 ± 3 00 m P a ·s

T m a x 2 1 1 °C

G e l t im e : m in

back to main menu

8 5M a r c h 9 , 2 0 0 7

back to main menu

8 6M a r c h 9 , 2 0 0 7

back to main menu

8 7M a r c h 9 , 2 0 0 7back

Y e l lo w in g

Underwater Cure

0 1 2 3 4 5

E p ik o te ™ 0 3 1 2 1 + E p ik u r e ™ 3 1 2 1

back to main menu

8 8M a r c h 9 , 2 0 0 7

EpikoteTM 144

N o n c r y s t a l l iz in g e p o x y r e s in

b a s e d o n b is p h e n o l A /F

V is c o s i t y (2 5 °C ): 4 2 0 0 ± 5 0 0 m P a ·s

EpikureTM 132

H – a c t iv e e q u iv a le n t : 5 2 .5 g /e q u iv .

V is c o s i t y (2 5 °C ): 1 6 0 0 ± 2 00 m P a ·s

T m a x 2 4 8 °C

back to main menu

8 9M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C n o n -g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y s u r f a c e w it h i r r e g u la t io n s

back to main menu

9 0M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 5 2E - m o d u lu s [M P a ] 3 3 3 3T e n s i le s t r e n g t h [M P a ] 5 3C o m p r e s s iv e s t r e n g t h [M P a ] 1 1 8T g – D S C [°C ] 5 6 1 1 1

back to main menu

9 1M a r c h 9 , 2 0 0 7

EpikoteTM 818

N o n c r is t a l ly z in g e p o x y

b a s e d o n b is p h e n o l A /F

V is c o s i t y (2 5 °C ): 1 0 0 0 ± 2 00 m P a ·s

EpikureTM 207

a d d u c t

V is c o s i t y (2 5 °C ): 4 5 0 ± 1 0 0 m P a ·s

T m a x 1 7 1 °C

G e l t im e : m in

back to main menu

9 2M a r c h 9 , 2 0 0 7next

back to main menu

9 3M a r c h 9 , 2 0 0 7

back to main menu

9 4M a r c h 9 , 2 0 0 7

EpikoteTM 04851

V is c o s i t y (2 5 °C ): 2 5 0 ± 5 0 m P a ·s

EpikureTM 04852

a d d u c t

V is c o s i t y (2 5 °C ): 5 0 0 ± 7 5 m P a ·s

T m a x 1 9 6 °C

back to main menu

9 5M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C n o n -g lo s s y , w o r s e s u r f a c e

back to main menu

9 6M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 9 1 9 7E - m o d u lu s [M P a ] 2 9 6 0 2 9 1 0T e n s i le s t r e n g t h [M P a ] 6 2 6 3C o m p r e s s iv e s t r e n g t h [M P a ] 1 0 6 9 6T g – D S C [°C ] 4 5 4 9

back to main menu

9 7M a r c h 9 , 2 0 0 7

alues)

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

9 8M a r c h 9 , 2 0 0 7back

Y e l lo w in g

Bridge Renovation

0 1 2 3 4 5

E p ik o te ™ 0 4 8 5 1 + E p ik u r e ™ 0 4 8 5 2

back to main menu

9 9M a r c h 9 , 2 0 0 7

V is c o s i t y (2 5 °C ): 7 0 0 ± 1 0 0 m P a ·s

a d d u c t (V O C -f r e e )

V is c o s i t y (2 5 °C ): 3 5 0 ± 1 0 0 m P a ·s

T m a x 1 9 0 °C

G e l t im e : m in

back to main menu

1 0 0M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C v e r y g o o d , g lo s s y s u r f a c ea t 1 0 °C g o o d , g lo s s y s u r f a c e w it h l ig h t ir r e g u la t io n s

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 6 5 7 6 8 2a t 1 0 °C 4 8 7 9

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1 0 1M a r c h 9 , 2 0 0 7

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1 0 2M a r c h 9 , 2 0 0 7

W ith o u t c o n t a m in a t io n

alues)

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

1 0 3M a r c h 9 , 2 0 0 7

EpikureTM 270

M o d i f ie d , a l ip h a t ic p o ly a m in e

V is c o s i t y (2 5 °C ): 9 ± 5 m P a ·s

T m a x 2 5 2 °C

EpikoteTM 896

L o w -v is c o u s , n o n -c r y s t a l l iz in g

V is c o s i t y (2 5 °C ): 9 5 0 ± 1 5 0 m P a ·s

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1 0 4M a r c h 9 , 2 0 0 7

S urfacea t 2 3 °C g o o d , g lo s s y s u r f a c ea t 1 0 °C g o o d , l i t t le g lo s s y s u r f a c e

S hore D – Hardness a f t e r 2 4 h 4 8 h 7 da t 2 3 °C 8 3 8 3 8 4 a t 1 0 °C 7 7 8 2 8 2

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1 0 5M a r c h 9 , 2 0 0 7

F le x u r a l s t r e n g t h [M P a ] 1 3 0 1 3 0E - m o d u lu s [M P a ] 3 4 6 0 3 1 7 0T e n s i le s t r e n g t h [M P a ] 6 5 7 5C o m p r e s s iv e s t r e n g t h [M P a ] 1 2 5 1 2 0T g – D S C [°C ] 5 9 7 1

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1 0 6M a r c h 9 , 2 0 0 7

alues)

0W it h o u t c o n t a m in a t io n

P e t r o l

A r o m a t e s

A lc o h o l

B r a k e F lu id

1 0 7M a r c h 9 , 2 0 0 7back

Y e l lo w in g

Chemical Res is tant S ystems

0 d 1 d 2 d 3 d 4 d 5 d

D a y s U V -ir r a d ia t io n s t r e s s (9 2 W /m ²/n m U V W 3 4 0)

b*-Value

E p ik o te ™ 3 5 7 + E p ik u r e ™ 1 0 5 E p ik o te ™ 8 9 6 + E p ik u r e ™ 2 7 0

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1 0 8M a r c h 9 , 2 0 0 7

EpikoteTM 816

V is c o s i t y (2 5 °C ): 1 8 0 0 ± 3 00 m P a ·s

EpikureTM 8545-W-52

N o n -io n ic , w a te r r e d u c ib le ,m o d if ie d

e p o x y -a m in e a d d u c t s u p p l ie d a t 5 2 %

s o l id s in w a te r

V is c o s i t y (2 5 °C ): 1 4 0 0 0 ± 1 0 0 m P a ·s

M ix in g r a t io (r e s in : h a r d e n e r) [p b w ] 1 0 0 : 1 6 5

P o t l i f e : t t o 4 0 °C m int to T m a x m in

T m a x °C

G e l t im e : m in

Epikote™ 816 with Epikure™ 8545-W-52

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1 0 9M a r c h 9 , 2 0 0 7

H e x io n4 8 .3 1E p o n e x 1 5 1 0

1 0 0 .0 0

2 6 .3 2

7 3 .6 8

0 .2 0

0 .8 0

5 .6 9

4 .0 6

1 6 .2 6

4 6 .6 7

Parts by weight

1 0 0 .0 0

2 4 .8 4

7 5 .1 6

0 .2 0

0 .8 0

5 .6 6

4 .0 3

1 6 .1 6

Parts by weight

2 3 .7 9Total part B

Part B

H e x io n2 3 .7 9E p ik u r e 5 5 0

H e x io nE p ik u r e 1 9 6

1 0 0 .0 0Total Part A+B

7 6 .2 1Total part A

B y k C h e m ie0 .2 0B y k A 5 3 0

G r a c e0 .8S y lo id 2 4 4

N a in t s c h5 .6 4S E e x t e n d e r

M o n d o M in e r a ls4 .0 2M ic r o T a lc A T 1

D u P o n t1 6 .1 1T iO 2 R 9 6 0

H e x io n 4 9 .4 4E p ik o t e 8 1 6

S upplierParts by weight

Part A

S ta r t in g F o rm u la t io n s

1 1 0M a r c h 9 , 2 0 0 7

Epikote 816 / Epikure 550

Epikote 816 / Epikure 196

Eponex 1510 / Epikure 196

L o w Y e l lo w in g

1 1 1M a r c h 9 , 2 0 0 7

Formulation % m/m

Epikure 8545-W-52 47.71Epikote 818 29.48Water 22.81

100.00

Optionally a defoamer e.g.Tego Foamex 7447 can be added

Procedure

- Emulsify gradually epoxy resin into curing agent solution with appropriate mixing equipment- Add water until required viscosity is obtained

Properties

Solids content % m/m 55Application viscosity@23°C Pa.s 0.96Tecam gelation time minutes 60

Beck-Koller drying time@23°C hoursSoft gel 0.3Hard gel 2.7

Koenig hardness 1/safter 1 day cure@23°C 47after 7 days cure@23°C 141

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W a te r b a s e d c le a r c o n c r e t e s e a le r

1 1 2M a r c h 9 , 2 0 0 7

CURING AGENT COMPONENT (A) Weight (parts)

Supplier

EPIKURE 8545-W-52 15.91 Hexion

EPIKURE 3253 0.48 Hexion

BYK 045 0.67 BYK CHEMIE

Mix the additive into the EPIKURE curing agents before filler addition

Ti Pure R960 2.75 DuPont

Water 10.76

Disperse the pigment for 10 minutes at 2000 rpm. Add water at 500 rpm

Albaryte 32.59 Sachtleben Chemie

Quartzflour M10 27.20 SCR Sibelco NV

Disperse fillers at 2000 rpm for 10 minutes

Total A 90.36

RESIN COMPONENT (B) Weight (parts)

Supplier

EPIKOTE 816 9.64 Hexion

Total B 9.64

Mix the EPIKURE curing agent base well with the EPIKOTE resin base before application

Total formulation A+B 100.00

S e l f le v e l l in g f lo o r f o r lo w s h r in k a g e

1 1 3M a r c h 9 , 2 0 0 7

Pigment/filler to binder weight ratio 3.4 : 1

Binder / Water ratio 50 : 50

Flow at 23°C (mm) * DIN 53211

after 10 minutes 203

after 24 hours 209

Shore D hardness DIN 53505

after 7 days at 23°C 72

after 1 month at 23°C 75

T y p ic a l p r o p e r t ie s E K 8 5 4 5 -W -5 2s e l f le v e l l in g fo rm u la t io n

1 1 4M a r c h 9 , 2 0 0 7

Competitive material Epikote 816 / Epikure 8545-W-52 Epikure 3253

P r e l im in a r y in f o rm a t io n 3 m m th ic k s e l f-le v e l l in g f lo o r in g fo rm u la t io n

1 1 5M a r c h 9 , 2 0 0 7

S o lu t io n s fo r P ip e R e h a b i l i t a t io n

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1 1 6M a r c h 9 , 2 0 0 7

S o lu t io n s fo r P ip e R e h a b i l i t a t io n

1 1 7M a r c h 9 , 2 0 0 7

A p p e n d ix I IS t a r t in g F o rm u la t io n s

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1 1 8M a r c h 9 , 2 0 0 7

- LF 156 S olvent-free Coating S ystem (Airless S praying)

- LH 151 Thixotropic, electrically conductive primer

- RS 1107/EL S elf levelling, electrically conductive floor coating

- RS 1106 S elf levelling floor coating

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1 1 9M a r c h 9 , 2 0 0 7

Solvent-free Coating Systems, (Airless Spraying)

Component A: Epikote 357 40.0 pbw HEXION Spec ialty Chem icals GmbH, Duisburg Luvothix HT 1 .0 pbw Lehmann & Voss, Hamburg Aerosil 380 0.2 pbw Degussa AG, Frankfurt M icrodol 325 50.8 pbw Norwegian -Talk, Frankfurt Dissolve up to 60°C , then solve w ith Benzyl alcohol 8.0 pbw Biesterfeld, Hamburg Component B:

Epikure 541 20.0 pbw HEXION Spec ialty Chem icals GmbH, Duisburg Novares LA 700 24.0 pbw Rütgers Chem icals, Duisburg Luvothix HT 1 .0 pbw Lehmann & Voss, Hamburg M icrodol 325 51 .0 pbw Norwegian -Talk, Frankfurt Dissolve up to 60 °C , then solve w ith Benzyl alcohol 4.0 pbw Biesterfeld, Hamburg M ixing Ratio : comp. A : comp. B 1 : 1 pbw Pot life : appr. 1 .5 h Density at 20 °C Comp. A : 1 .57 g/cm³ Density at 20 °C Comp. B : 1 .50 g/cm³ Working Pressure : appr. 360 bar

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S tarting Formulation LF 156

1 2 0M a r c h 9 , 2 0 0 7

Thixotropic, solvent-coating conductive enamel as a base coat for electrically

conductive flooring compounds

Component A: Epikote 357 50.00 pbw HEXION Spec ialty Chem icals GmbH, Duisburg BYK 1 41 0.35 pbw BYK-Chemie, Wesel BYKETOL OK 0.1 0 pbw BYK-Chemie, Wesel BYK P 1 04 S 0.05 pbw BYK-Chemie, Wesel Printex L 6 7.5 pbw Degussa, Frankfurt/Main Xylene 42.0 pbw 1 00.0 pbw Component B: Epikure 541 27.5 pbw HEXION Spec ialty Chem icals GmbH, Duisburg Manufactoring: M ixture rat io comp.A : comp.B = 1 00 : 27.5 pbw Tone black Consumption appr. 0.2 kg/m² Ground ing resistance (DIN 51 953) < 5·1 05 Ohm Prepare the substrate to be coated using presently customary methods such as steel shoot b last ing. Porous substrates should be prepared w ith an epoxy primer to prevent absorp tion of the conductive enamel into the substrate. The conductive enamel may not be sanded.

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S tarting Formulation LH 151

1 2 1M a r c h 9 , 2 0 0 7

Self leveling, elektrically conductive,

solvent free floor coating

Component A: Epikote 357 45.00 pbw HEXION Specialty Chem icals GmbH, Duisburg Tego Glide B 1 484 0.30 pbw Tego Chem ie Service GmbH, Essen Byk A 501 0.40 pbw BYK-Chem ie, Wesel Antifloat D 1 4 0.60 pbw Lubrizol Langer & Co, Ritterhude Titand ioxide 2056 1 .72 pbw Kronos Titan GmbH, Leverkusen Bayferrox 306 (black iron oxide) 0.25 pbw Bayer AG, Leverkusen Bayferrox 920 (yellow iron oxide) 0.03 pbw Bayer AG, Leverkusen Plastorit 000 1 5.20 pbw Gustav Grolman, Düsseldorf Quartz powder W8 1 1 .50 pbw Quarzwerke GmbH, Frechen Sigrafil SFC 3 EPB 0.50 pbw SGL Technik GmbH, Meitingen 1 00.00 pbw Component B: Epikure 541 25.00 pbw HEXION Specialty Chem icals GmbH, Duisburg M anufacturing: M ixture ratio comp.A : comp.B = 1 00 : 25 pbw Pot life (1 00 g mixture) appr. 35 minutes Surface bright

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S tarting Formulation RS 1107/EL

1 2 2M a r c h 9 , 2 0 0 7

Self levelling, solvent free, floor coating (grey, ca. RAL 7030)

Component A: Epikote 357 45.00 pbw HEXION Spec ialty Chem icals GmbH, Duisburg Tego Glide B 1 484 0.30 pbw Tego Chem ie Service GmbH, Essen BYK A 501 0.40 pbw BYK-Chem ie, Wesel Antifloat D 1 4 0.60 pbw Lubrizol Langer & Co, Ritterhude Titand ioxide 2056 1 .72 pbw Kronos Titan GmbH, Leverkusen Bayferrox 306 (black iron oxide) 0.25 pbw Bayer AG, Leverkusen Bayferrox 920 (yellow iron oxide) 0.03 pbw Bayer AG, Leverkusen Plastorit 000 1 5.20 pbw Gustav Grolman, Düsseldorf Quartz powder W8 1 1 .50 pbw Quarzwerke GmbH, Frechen EWO-Heavy Spar 25.00 pbw Sachtleben AG, Duisburg 1 00.00 pbw Component B: Epikure 541 25.00 pbw HEXION Spec ialty Chem icals GmbH, Duisburg M anufacturing: M ixture ratio comp.A : comp.B = 1 00 : 25 pbw Pot life (1 00 g mixture) appr. 35 m inutes Surface bright

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S tarting Formulation RS 1106

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