elmo elmo - miniaturising electronics duration: 2002-2005 estimated volume: 100 million euros, of...
Post on 21-Dec-2015
215 Views
Preview:
TRANSCRIPT
ELMO
ELMO - Miniaturising Electronics
Duration: 2002-2005 Estimated volume: 100 million euros,
of which Tekes accounts for approximately50 million euros
Programme Manager: D.Sc. Pentti Koskinen,Tietoneuvos Oy
Further information:www.tekes.fi/english/programmes/ELMO
The objective of the ELMO Programme is to build a widelyapplicable knowledge base for the coming years so that thefocus is on the core competence of the electronics sector.The criteria set for the central themes of the programme,
in other words, for the development trends, are miniaturisation,integration, and cost-efficiency.
The objective of the ELMO Programme is to build a widelyapplicable knowledge base for the coming years so that thefocus is on the core competence of the electronics sector.The criteria set for the central themes of the programme,
in other words, for the development trends, are miniaturisation,integration, and cost-efficiency.
Docs 39889 09-2002
ELMO
Vision-oriented objectives
To promote the technological leadership ofFinland in the sub-areas that are critical fromthe point of view of the electronics sector
To create basis for new businessopportunities
To accumulate high technology knowledge byencouraging research institutes and enter-prises to participate in long-term research
Docs 39889 09-2002
ELMO
Vision-oriented objectives
To develop the innovation environment byenhancing interaction between universities, research institutes and companies
To develop co-operation networks and management of the value chain
To encourage small and medium-sized enterprisesto renew their operations
Docs 39889 09-2002
ELMO
Scenario-oriented results
Intelligent systems take into consideration the
development trends miniaturisation integration cost-efficiency
Optoelectronics and its opportunities new business area
Efficient design processes take into consideration the
core electronics’ value chain
Cost-effective productivity takes into consideration the
core electronics’ value chainDocs 39889
09-2002
ELMO
Key ELMO technologies
Micro-electronics and its materials especially the research on silicon, compound semi-
conductors and optical materials, substrates, andpackaging, together with the related processes,analyses and characteristics
Manufacturing, production, and testing module precision mechanics and manufacturing mechatronics and product processes
Integrated systems resulting in a tested prototype System on Chip System on Package MEMS ...
Future technologies includes long term research projects and preliminary
surveys that are used to steer the ELMO Programme tonew innovative directions
Docs 39889 09-2002
ELMO
Generic technologies supporting the value chain
Embedded software and genericmiddleware, software platforms
Tools and methods Integrated design Modelling and simulation Reliability
Reliability and environment Tools Methods Impact of environmental
requirements on reliability
Docs 39889 09-2002
ELMO
Clusters and project examples
Future technology Printing optoelectronics Ultrafast optical
telecommunications DSP Systems and
Wireless sensors Molecular electronics and
fotonics
Micromaterials & Processes Package and integration Production Passive and active
components Wires, …
Docs 39889 09-2002
Intelligent systems SoP MEMS ASIC+RF Ubi Optical systems Sensors Receivers and
Transmitters Low power and low
voltage system Distributed power
systems, ...
Tools Life long testability Environmental factors, …
Situation in 2002Situation in 2002
ELMO
List of research projects
Technical Research Centre of Finland (VTT),Espoo- ElectroMechanical Microcomponents for Precision ApplicationsUniversity of Jyväskylä - Miniatyrizing Sensors University of Oulu- Distributed Power Supply Dynamics Tampere University of Technology- Component integration Tampere University of Technology- Use of flip-chip techniques in industrial applications Helsinki University of Technology- Implications of IPP and EU environmental directives on future activities of electrical and electronics enterprises Technical Research Centre of Finland (VTT),Espoo- Removal of heavy organic compounds with aqueous ozone processes Technical Research Centre of Finland (VTT)- Monolithic integration of SOI micromechanics and electronics Technical Research Centre of Finland (VTT)- Chemical-mechanical planarisation of silicon wafers Tampere University of Technology, Optoelectronics Research Centre, ORC- Towards Lighter Technologies Tampere University of Technology- Lead free components, their connections and mechanical testing University of Oulu- Testability development of integrated mixed-signal circuits
ELMOUniversity of Oulu- LP/LV CMOS circuit block development for sensor micromodules University of Oulu- Additive precise circuit patterns Helsinki University of Technology- Integration of Radiocommunication Circuits (RADINT) Helsinki University of Technology- Self-organized molecular electronics and photonics (SOMEP) Technical Research Centre of Finland (VTT),Oulu- Optics on future printed circuit board in high speed data transmission applications Tampere University of Technology- Flexible Design Methods for DSP Systems Technical Research Centre of Finland (VTT),Oulu- Printing optoelectronics Helsinki University of Technology- Impact of Miniaturization on Manufacturing and Reliability of Electronics Technical Research Centre of Finland (VTT)- New technologies for passive integration and ALCVD dielectics for mircoelectronics Helsinki University of Technology, Electronic Circuit Design Laboratory- Information Processing via Nonlinear Dynamics and Bifurcation Theory Helsinki University of Technology - Environmental and life cycle issues in design and R&D activities of electrical and electronics enterprises Kajaani Polytechnics- Feasibility study on introduction and testing newelectronics manufacturing technologies in Kajaani region Technical Research Centre of Finland (VTT),Tampere- Intelligent tyre development
List of research projects
top related