dcp & oil immersion cooling
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Performance Evaluation of Plate-fin and Pin-fin Heat Sinks and Design Optimization of Dynamic Cold Plate (DCP) ByParth Jayeshkumar SoniMS Mechanical Engineering Graduate StudentThe University of Texas at ArlingtonDate:03/21/2016Thesis Advisor: Dr. Dereje AgonaferCommittee Members: Dr. A. Haji-Sheikh Dr. Miguel A AmayaParth Soni Advisor: Dr. Dereje Agonafer1
3/22/2016Parth Soni1
Why Liquid CoolingPower Trends
https://www.cisl.ucar.edu/nar/2006/1.0.sc.jspParth Soni Advisor: Dr. Dereje Agonafer2
23/22/2016Parth Soni
Focus Study 1: Design Validation of Dynamic Cold Plate (DCP)
Study 2: Parametric Study and Performance Comparison of Pin-fin and Plate-fin Heat Sinks for the Application of Oil Immersed Cooling
Parth Soni Advisor: Dr. Dereje Agonafer3
3/22/2016Parth Soni3
Focus Study 1: Design Validation of Dynamic Cold Plate (DCP)
Study 2: Parametric Study and Performance Comparison of Pin-fin and Plate-fin Heat Sinks for the Application of Oil Immersed Cooling
Parth Soni Advisor: Dr. Dereje Agonafer4
3/22/2016Parth Soni4
Original Cold Plate(OCP) vs Dynamic Cold Plate(DCP)One inlet one outletSame water flow for all heat generating componentsParth Soni Advisor: Dr. Dereje Agonafer5
Separate inlet and outlet for different compartment inside cold plateDifferent flow for different compartment
3/22/2016Parth Soni5
What is DCP?Dynamic cold plate is extended version of original cold plate
Parth Soni Advisor: Dr. Dereje Agonafer6
CAD modelFin placementReferance heat generating platform
Parth Soni Advisor: Dr. Dereje Agonafer7Dimensions (in mm)ASICs 14.71 13.31 0.8FPGA 10.5 12.7 0.8Reference Platform
Component QuantityPower(W)Base1-ASIC1(B1)40ASIC115FPGA15LICA1370
ASIC:-Application-Specific Integrated CircuitFPGA:-Field-Programmable Gate ArrayMCM serves as basis for design of solution- Power dissipation of 485W over 78mm 78mm
3/22/2016Parth Soni7
CFD Modeling of DCPParth Soni Advisor: Dr. Dereje Agonafer8
Methodology
Modeling :SolidworksMashing:ICEM CFDAnalysis:Ansys Fluent Parth Soni Advisor: Dr. Dereje Agonafer9
Model of Dynamic Cold Plate
Parth Soni Advisor: Dr. Dereje Agonafer10Dimensions cold lateFoot print : 90*90 mmBase height: 5mm
Fin dimensionsThickness:0.5 mmHeight:2mmLength:29mmPitch:1mm
Dimensions of coverFootprint :90*90 mmHeight: 15mm of inlet outlet:7mm Dimensions from Experimental setup
Purpose of StudyTo visualize the flow in side the cold plateTo validate of the CFD modelFor, Optimization of flow inside cold plateFor, parametric study of DCP
Parth Soni Advisor: Dr. Dereje Agonafer11
MeshUnstructured meshNo of elements:11,15,321Shape of elements: Tetra elementsMesh algorithm:Robust (octree)top-down meshing approachtop-down meshing approach
Parth Soni Advisor: Dr. Dereje Agonafer12
Mesh DensityFin surface:0.001 mFin thickness:0.005mOther surfaces:1mParth Soni Advisor: Dr. Dereje Agonafer13
AnalysisModels in fluentEnergy equationTurbulent model: K-epsilon turbulence modelMaterials used in the modeling
Parth Soni Advisor: Dr. Dereje Agonafer14
K-epsilon Turbulence ModelParth Soni Advisor: Dr. Dereje Agonafer15
Turbulent kinetic energy kEddy Dissipation 10% turbulent intensity from length scale model (Fluent user guide)
Boundary Conditions 4 inlets: Velocity inletsVelocity of water: 4 lpm (Reference experimental data)Temperature: Ambient Pressure : 3000 pa4 outlets: Pressure outletsNo back pressureParth Soni Advisor: Dr. Dereje Agonafer16
3/22/2016Parth Soni16
ResultsParth Soni Advisor: Dr. Dereje Agonafer17
Particle Tracking
Parth Soni Advisor: Dr. Dereje Agonafer18
Temperature Distribution
Parth Soni Advisor: Dr. Dereje Agonafer19This figure shows the heat spread on the copper plateAs temperature of B1 increases neighboring chips also shows some higher temperature
Pressure Drop
Parth Soni Advisor: Dr. Dereje Agonafer20
Pumping power=Pressure drop * Flow ratePumping power= 2.2 W(CFD result)Pumping power=2.76 w(Experimental result)
Validation Between ResultsParth Soni Advisor: Dr. Dereje Agonafer21
Experimental Data: Ruturaj kokates Thesis
3/22/2016Parth Soni21
ConclusionThus, from the CFD results this model is in good agreement with experimental resultsHence, this model can be used for the further study of optimization and parametric study Parth Soni Advisor: Dr. Dereje Agonafer22
Future WorkStudy 1:This model can be used to optimize the design of the DCPCover design optimization for better flow rateParametric study and documentation of different fins and different cover design Parth Soni Advisor: Dr. Dereje Agonafer23
Focus Study 1:Design Validation of Dynamic Cold Plate (DCP)
Study 2: Parametric study and performance comparison of pin fin and plate fin heat sinks for the application of oil immersed cooling Parth Soni Advisor: Dr. Dereje Agonafer24
Study 1Parametric study and performance comparison of pin fin and plate fin heat sinks for the application of oil immersed cooling for open compute generation one serverParth Soni Advisor: Dr. Dereje Agonafer25
Previous StudyValidation of the model using the identical boundary condition generated in experimentDocumentation of parametric study and the performance of the parallel plate heat sink for the oil immersed applicationOptimization of the parallel plate heat sink design
Parth Soni Advisor: Dr. Dereje Agonafer26
Parth Soni Advisor: Dr. Dereje Agonafer27Evaluate the performance of pin fin and plate fin heat sink
Compare the thermal resistance of both the heat sinks with current heat sink in use for open compute server
Motivation
MethodologyPlace plate fin and pin fin heat sink in place of the parallel plate heat sink on the validated modelParametric study of heat sinks for same condition as experimental set upBase height Pin thickness and radius Flow rate Documentation of the performance of both heat sinks
Parth Soni Advisor: Dr. Dereje Agonafer28
3/22/2016Parth Soni28
Types of Heat Sinks
Parth Soni Advisor: Dr. Dereje Agonafer29
http://img.diytrade.com/cdimg/720673/6272157/0/1214899819/pin_fin_heat_sink.jpg
http://www.enertron-inc.com/images/resources/forged/forged_2.JPG
http://www.newegg.ca/Product/Product.aspx?Item=N82E16816101827Parallel plate heat sinkPin fin heat sinkPlate fin heat sink
Parth Soni Advisor: Dr. Dereje Agonafer30Material PropertiesPCB, Ram- FR-4 epoxy resinDensity- 1900 kg/m3Thermal conductivity 0.17 W/m KSpecific heat 749 J/kg KHeat sink - AluminumDensity- 2700 kg/m3Thermal conductivity-218 W/m KSpecific heat- 900 J/Kg K
Mineral Oil Properties31STE Oil Company data sheets and MSDS:http://www.steoil.com/msds-tech-dataDensity 1680 Kg/m3Thermal conductivity 0.13 J/kg KSpecific heat 1680 Re: 4.6
Parth Soni Advisor: Dr. Dereje Agonafer
32 Flow ConditionsInlet temperature:30CVolume rate :1 lpmVelocity : 0.00115 m/sPressure : 6 psiRe : 13.6 Parth Soni Advisor: Dr. Dereje Agonafer
3/22/2016Parth Soni32
CFD Set Up
Parth Soni Advisor: Dr. Dereje Agonafer33Heat sink data:Foot print- 10 cm 7 cmBase height 0.6 cmTotal height 3.1 cmNumber of fins 25Fin radius 0.6 cmModel dataCabinetFootprint: 35*35 cmRamDimension: 14*3*8 cm
Heat sink data:Foot print- 10 cm 7 cmBase height 0.6 cmTotal height 3.1 cmNumber of fins 25Fin thickness 0.4 cm
Why Fixed Flow RatePressure drop in air cooling application is around 4 PaFor parallel plate heat sink in in oil cooling application pressure drop around 0.9 PaWhere as, in oil cooling application pressure drop is around 0.032 Pa
Parth Soni Advisor: Dr. Dereje Agonafer34Pumping power=Pressure drop * Flow rateAdvantage of fix Flow rate conceptLess time consumingEasy to use
3/22/2016Parth Soni34
ResultsParth Soni Advisor: Dr. Dereje Agonafer35
Grid independent StudyParth Soni Advisor: Dr. Dereje Agonafer36Inlet Temperature - 30 CVolume rate 1 lpm
Flow Rate vs Thermal ResistanceParth Soni Advisor: Dr. Dereje Agonafer37Inlet Temperature - 30 C
Base Height vs Thermal ResistanceParth Soni Advisor: Dr. Dereje Agonafer38Inlet Temperature - 30 CVolume rate 1 lpm
Include pic of base3/22/2016Parth Soni38
Fin Height and Fin Radius vs Thermal Resistance for Pin Fin Heat SinkParth Soni Advisor: Dr. Dereje Agonafer39
Highlight optimize zone3/22/2016Parth Soni39
Fin Height And Fin Thickness vs Thermal Resistance for Plate fin heat sinkParth Soni Advisor: Dr. Dereje Agonafer40
ConclusionBase height: Optimize base height can be 0.6cm as after that the thermal resistance is not varying much.Fin height:Fin height shows the optimum result at 2.5 to 3 cm as after that flow passes through lease resistance pathFin radius or thickness:recommended thickness of the fin can be 0.4mm to 0.6 mm (Plate fin) as after that resistance increases and performance decreasesRecommended radius of the fin can be 0.5 to 0.6 mm as after that flow resistance increases and performance decreases
Parth Soni Advisor: Dr. Dereje Agonafer41
Future WorkPerformance of the other available heat sinks can be documented for the same model as well as higher generation serversThis same can be studied for the fix pumping power method
Parth Soni Advisor: Dr. Dereje Agonafer42
Parth Soni Advisor: Dr. Dereje Agonafer43Thank YouQuestions?...
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