application of pulsed dc to suppress bubble incorporation & control deposit morphology during...

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT

MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)

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Objectives

Develop a generic aqueous EPD process applicable to all types of suspension and substrates by use of pulsed DC.

Control the extent of gas bubble incorporation and the morphology of the deposit.

Study and optimize the process parameters to obtain smooth, homogeneous and bubble-free deposits.

Develop understanding on the involved mechanism.

Experimental

Zeta potentialZeta potential

Constant voltage Continuous Constant voltage Continuous DC EPDDC EPD

Constant voltage Pulsed DC EPD

Conventional EPD process

Constant voltage Pulsed DC EPD

Constant voltage Pulsed DC EPD

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING

AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 3 PART – 3 (Coming Soon) (Coming Soon)

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