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HFSS for ECAD: HFSS for ECAD: Package Package ModelingModeling, , MMIC and onMMIC and on--die die
extractionextraction
HFSS for ECAD: HFSS for ECAD: Package Package ModelingModeling, , MMIC and onMMIC and on--die die
extractionextraction
Alain MichelAlain MichelAlain MichelAlain Michel
© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary
Alain MichelAlain MichelBusiness Development Manager,Business Development Manager,
Electronics, EuropeElectronics, Europe
Alain MichelAlain MichelBusiness Development Manager,Business Development Manager,
Electronics, EuropeElectronics, Europe
• Introduction
• HFSS Solver on Demand in Detail
– Create a project from A to Z
• Application
Agenda
© 2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary
• Application
– Package and Board
– MMIC application with UMS PH15 design kit
• Integration in ECAD Flow: ECAD Translator
• New Features in Designer 7.0
• Conclusion
IntroductionIntroductionIntroductionIntroduction
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• MCAD (Mechanical Computer-Aided Design) vs. ECAD (Electronic Computer-Aided Design)
– HFSS application can be mostly split into two families:
• Application originally designed with MCAD: Antennas, Connector, Wave Guide, filters …
• Application originally designed with ECAD: PCB, RFIC,
Why HFSS in Ansoft Designer?
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• Application originally designed with ECAD: PCB, RFIC, MMIC, Planar Antenna, Package …
• HFSS original GUI perfectly address MCAD application needs
• HFSS Solver on Demand provides a new interface for ECAD application
• Available with Ansoft Designer 6.0
• 2D layout design entry
– Import from APD, ODB++
– Full custom layout
• Layers stackup definition
• Easy of Use with setup automation
HFSS Solver on Demand Overview
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• Easily toggle between FEM and MOM solvers
• Support scripted footprint
• HFSS technology for reliable and accurate models
– Adaptative meshing
– 3D Objects: wirebonds, arbitrary shaped vias…
– Finite dielectric
– Support for multimoded wave ports and gap sources
HFSS Solver on Demand HFSS Solver on Demand in Detailin Detail
HFSS Solver on Demand HFSS Solver on Demand in Detailin Detail
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• Standard HFSS design entry uses 3D Object
• HFSS in Designer combine 2D drawing with stackupdefinition
Stackup Definition
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+=
• Define port by selecting edge
• Solver specific properties
• HFSS gap or wave port available
Easy and Automated Port Setup
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• Size setup
• Deembeding available
• PEC launch allows wave port inside air box
Wave Port Setup
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• Radiation Boundary for air box
• Dielectric size setup
• Air box size setup
Boundaries Setup
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• Solution Frequency
• Adaptive solution
• Mixed order elements and iterative solver available
HFSS Solution Setup
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• Rectangular, smith chart … plots
• Current, far and near field display
• Meshing
Post-Processing
-25.00
-12.50
0.00
Y1
Ansoft LLC spir2_20S11_12_dB ANSOFT
Curve Info
S12_3D_HFSSSetup HFSS_gap : Sw eep 1
S11_3D_HFSSSetup HFSS_gap : Sw eep 1
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2.00 4.50 7.00 9.50 12.00 14.50 17.00 19.50F [GHz]
-37.50
5.002.001.000.500.200.00
5.00
-5.00
2.00
-2.00
1.00
-1.00
0.50
-0.50
0.20
-0.20
0.000
10
20
30
40
50
6070
8090100110
120
130
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-120-110
-100 -90 -80-70
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spir2_20Smith Chart 1 ANSOFTCurve Info
S(Port1,Port1)Setup HFSS_gap : Sw eep 1
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
Y1
Ansoft LLC spir2_20S11_12_dB ANSOFT
Curve Info
S11_3D_MoMSetup 3D MoM edge : Sw eep 1
S12_3D_MoMSetup 3D MoM edge : Sw eep 1
S12_3D_HFSSSetup HFSS_gap : Sw eep 1
S11_3D_HFSSSetup HFSS_gap : Sw eep 1
Spirale example
• 1 project 2 setup
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2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00F [GHz]
-45.00
-40.00
-35.00
Package and BoardPackage and BoardPackage and BoardPackage and Board
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• From 2D to 3D
– Finite dielectric definition in stackup
– Use Bondwire type primitive
– Padstack definition for BGAPad
• Quick and easy port
setup
• Display current
MMIC Package example
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• Display current
• Current distribution
Package example
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Stackup Parameterization
Bondwire
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Via
Imported Package Example
• Import from APD/Allegro
• .mcm, .sip, .brd, .anx
• Import stackup and bondwire profile
• Setup solderball profile
• Automatically port setup for pin
• Cutout sub-design
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• Cutout sub-design
Package Cutout
• Cutout region can either be auto generated or determined by user
• Select signal, power and ground nets to create cutout
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Cutout package portion Original package layout
Package/PCB Merge
Copy package
Paste into PCB layout
Independent package and board stackup
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Board
HFSS Solver on Demand
Final Model in Designer
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Dielectrics not rendered
Lumped ports on package bumps
Wave Porton traces end
MMIC application MMIC application with UMS PH15 with UMS PH15
design kitdesign kit
MMIC application MMIC application with UMS PH15 with UMS PH15
design kitdesign kit
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• Provide UMS PH15 Design Kit with passive component simulable with HFSS
• Includes parameterized footprint for
– MIM capacitor
– Spirale inductor
UMS Partnership
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– Tan and TiWSi Resistors
– Vias
• Footprint are both valid for GDS export and HFSS simulation
• Technology file loads design kit components, layer
definition and stackup
• Stackup is defined with regards to process technology definition given by foundry
What is a Design Kit?
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• Create parameterized footprint
– With respect to design rules defined for manufacturing
– With respect to physical design used for HFSS simulation• Layer deposition
• Air bridges
Challenge
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• Air bridges
• ….
Source UMS PH15 design guide
• Shape of the same layer is drawn twice
– User type for manufacturing (GDSII export)
– Signal, dielectric or ground for HFSS simulation
• Stackup definition validated with UMS
• Automatically loaded with the technology file
Layer Definition
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1.00
Cap_0_26pF_merge_nitrideCap_value ANSOFT
Curve Info
cap_pf
Name X Y
m4 7.5000 0.2929
• Good agreement with UMS model
Simulation results:
MIM capacitor 0.26pf
wint_um=28
lint_um=28.5
CapOnGrid_pF=0.263pF
Port1 Port2
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0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00F [GHz]
0.00
0.20
0.40
0.60
0.80
Y1
m4m5
m7
m6
cap_pf_UMS_Model
m4 7.5000 0.2929
m5 7.5000 0.2699
m6 30.0000 0.5092
m7 30.0000 0.4319
Name Delta(Y)
d(m4,m5) -0.0230
d(m6,m7) -0.0773
Spiral Inductor 1.91nh
Ldrawn=1.902nH
Port1
Port2
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Ldrawn=1.902nHNdrawn=4
Longdrawn=1760um
1.00 6.00 11.00 16.00 20.00F [GHz]
1.00
1.50
2.00
2.50
3.00
Y1
Ansoft LLC Self_1_91nhInd_Value_zoom ANSOFT
Curve Info
ind_nh_HFSS
ind_nh_UMS_Model
-20.00
-15.00
-10.00
-5.00
0.00
Y1
LPFS Parameters ANSOFT
Curve Info
Simple LPF
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0.00 10.00 20.00 30.00 40.00 50.00 60.00F [GHz]
-45.00
-40.00
-35.00
-30.00
-25.00
Y1 Curve Info
dB(S(Port1,Port1))
dB(S(Port2,Port1))
• Coupling between components
• No need of internal port
ECAD TranslatorECAD TranslatorECAD TranslatorECAD Translator
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What is ECAD Translator?
• It offers direct import of Cadence
– APD, SiP, Allegro, layout files without creation of an .anx file
– Virtuoso with .anx file creation
• Integrated in Designer
• Must have Cadence installed
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• Support for ODB++
– Common PCB Manufacturing format
• Supported by Mentor, Zuken, Cadence, Altium
Cadence SPB Integration
– Available through ECAD Translators
– Create models in Cadence SPB that are ready for simulation using HFSS Solver on Demand.
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Cadence SPB Integration
– View of the package in the Designer layout editor after export from Allegro Package
Designer
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Virtuoso Integration
• User Interface for Solver on Demand model
creation in Virtuoso
– Lumped ports (vertical and horizontal)
– Simulation setup and sweeps
• Improve storage of database for use with
other designs in the same CDN lib.
• Simplify layer stackup
• Cluster via arrays
Solver on Demand
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• Cluster via arrays
Virtuoso Layout
Setup for Model Export
Layout Cell View Export Process
• Open layout cell view in Cadence and customized Ansys menu to load cadence interface to export to HFSS
• Load or define material to be used in the stackup
• Define and save stackup (only first
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• Define and save stackup (only first time)
• Define port
• Create Flatten cell
• Define Air Box size
• Define HFSS setup
• Export .anx file
• Import .anx file using Ansoft Links from Designer
• Run simulation
Define Stackup
• Add layer in stackup
– Select from LSW Layers for
via and metal
– Add dielectric
– Specify thickness and elevation
• Merge operation (horizontal)
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– Metal
– Dielectric
• Combine operation (Vertical)
– Metal
– Dielectric
• Stackup definition saved at selected levels
– Cell view
– Design library
– Reference library
Merge layer: Ground Pattern
example
• Original cell with ground pattern • Flattened cell with 0.5 um setting
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• Flattened cell with 1.1 um setting
Via Cluster
• Original cell no via cluster • Flattened cell with via cluster
Original cell no via cluster exported Flattened cell with via cluster
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• Original cell no via cluster exported in HFSS Solver on Demand
• Flattened cell with via cluster exported in HFSS Solver on Demand
HFSS Setup
• Define HFSS setup for simulation
– Mesh frequency
– Frequency sweep
– Order of basis functions
– Iterative solver
• Create project
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• Create project
– Create an .anx file for importing in Designer
HFSS Solver On Demand Project
• Import from anx file automatically create project ready to solve:
• Stackup definition created
• Port setup
• HFSS setup
• Air Box defined
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NET_A_LEFT NET_A_RIGHT
ODB++ Import
• ODB++ Import via Designer Links
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HFSS Solver On DemandHFSS Solver On DemandDesigner 7.0Designer 7.0
HFSS Solver On DemandHFSS Solver On DemandDesigner 7.0Designer 7.0
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Layout Editor
– One layout editor for 2D and 3D views
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HFSS Setup Advanced Setting
• Frequency dependent mesh
• Convergence versus output variable
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Parameterized Padstack
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• Target ECAD application
• 2D layout design entry
– 2D Layout + Stackup
• Easy and quick setup of an HFSS project
• HFSS technology for reliable and accurate models
– Adaptative meshing
Conclusion
© 2010 ANSYS, Inc. All rights reserved. 46 ANSYS, Inc. Proprietary
– Adaptative meshing
– 3D Objects: wirebonds, arbitrary shaped vias…
– Finite dielectric
– Support for multimoded wave ports and gap sources
• ECAD Translator offers powerful link with EDA tool– Preparing model for electromagnetic simulation
– Automates settings: ports, setup, boundaries ...
Thank youThank youThank youThank you
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