affinity 2.0 electroless nickel immersion...

HIGH PERFORMANCE LOW VARIATION FINAL FINISH

Affinity 2.0

Electroless Nickel – Immersion Gold

Global Final Finish Team

April 2017

A Platform Specialty Products Company. 2

MacDermid Enthone Electronics SolutionsLeading Chemical Process Supplier in Global Electronics Markets


GLOBAL PRESENCE


Our Product Offerings

ADVANCED ELECTRONICS FINAL FINISHESMETALLIZATION

ELECTRONICS MATERIALSMEMORY DISK ELECTRONICS SPECIALTIES

Direct Metallization

• Rigid PCBs

• Flex Circuitry

Electroless Copper

Electrolytic Coppers

• High Throw DC

• Periodic Pulse Reverse

• Via Fill / Through Hole Fill

Organic Solderability

Preservative

Immersion Tin

Immersion Silver

ENEPIG

ENIG

Leadframe Adhesion

Promotion

Component Termination

Solderability

Molded Interconnect Devices

Light Emitting Diodes

Solar Cell Metallization

Specialty Treatments for Copper

Dryfilm

Copper Etchant

Resist Strippers

Solder Strippers

Connector Finishing

Oxide and Oxide Alternatives

• High RF Applications

Damascene Copper

Wafer Level Packaging

• Bump Plating

• Copper Pillars

• Redistribution Layers

Preclean and Zincate

Solutions for AI substrate

High Quality EN

• High Corrosion Resistance

• Low Particle Inclusion (PDI)

• Low Pit Count


Our Product Offerings

ADVANCED ELECTRONICS FINAL FINISHESMETALLIZATION

ELECTRONICS MATERIALSMEMORY DISK ELECTRONICS SPECIALTIES

Direct Metallization

• Rigid PCBs

• Flex Circuitry

Electroless Copper

Electrolytic Coppers

• High Throw DC

• Periodic Pulse Reverse

• Via Fill / Through Hole Fill

Organic Solderability

Preservative

Immersion Tin

Immersion Silver

ENEPIG

Affinity ENIG 2.0

Leadframe Adhesion

Promotion

Component Termination

Solderability

Molded Interconnect Devices

Light Emitting Diodes

Solar Cell Metallization

Specialty Treatments for Copper

Dryfilm

Copper Etchant

Resist Strippers

Solder Strippers

Connector Finishing

Oxide and Oxide Alternatives

• High RF Applications

Damascene Copper

Wafer Level Packaging

• Bump Plating

• Copper Pillars

• Redistribution Layers

Preclean and Zincate

Solutions for AI substrate

High Quality EN

• High Corrosion Resistance

• Low Particle Inclusion (PDI)

• Low Pit Count


ENIG PopularityStrength and Weakness Analysis

Advantages……

• Long Shelf Life

• No Tarnish

• No Whiskers

• Consistent Solderability (multiple reflows).

• Aluminum Wirebondable.

• Surface Contact (Keypads)

• High Solderspread

• No Issues with Paste Misprints

Disadvantages……

• More Expensive (CEM/OEM)

• High Temperature Process (PCB Fab)

• Complex Process (PCB Fab)

• Not Re-workable (PCB Fab)

• Ni-Sn Solderjoint (Cu-Sn is preferred)

• Blackpad “Hangover” from the 90’s

HASL OSP Imm Silver Imm Tin ENIG ENEPIG

Planarity No Yes Yes Yes Yes Yes

Solderjoint Cu-Sn Cu-Sn Cu-Sn Cu-Sn Ni-Sn Ni-Sn

Relative Cost $ $ $$ $$ $$$ $$$

IPC Shelf Life No Specification No Specification 12 months 12 months 12 months 12 months

Reflows 6 4 6 2 6 6

Contact E-Test, ICT Difficult E-Test, ICT, Keypad E-Test E-Test, ICT, Keypad E-Test, ICT, Keypad

Press Fit Good Good Good Good Good Good

Au Wirebond No No No No No Yes

Al Wirebond No No Yes No Yes Yes


Affinity ENIG 2.0Reduced Variation - Higher Yield – Lower Operating Cost ENIG

Affinity ENIG 2.0 has been developed from the lead ENIG technologies

from our newly integrated companies combining new innovations from our

collective expertise.

EN Corrosion

• EN corrosion has been engineered out of the process eliminating

concern and discussion with end users and OEM’s.

Six Sigma Development

• Defects and wastes driven out during development and process variation

minimized in production– giving increased uniformity of product,

compliance to OEM and End User specifications and unrivaled reliability.

The Lowest Gold Metal Operating Cost

• Low gold thickness variation over time and between feature sizes

provides excellent control of gold consumption and significant

opportunity for operating cost reduction.


Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

What is Six Sigma and why is it important to your business?

“The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety

of industries for their proficiency at reducing defects and driving process improvement.

A six sigma process produces only 3.4 defects per million opportunities!

We already have a 99% ENIG yield, why would we care about Six Sigma ?

(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!

• 99% take-off success would mean 11 air disasters every day!!!



Affinity ENIG 2.0







• 99% success would mean 11 air disasters every day!!!

(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !

• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).



Affinity ENIG 2.0







• 99% success would mean 11 air disasters every day!!!

(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !

• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).

Six Sigma’s vast tool kit was used throughout research, alpha and beta test phases of Affinity ENIG 2.0.

MacDermid-Enthone’s Six Sigma green and black belts will bring these benefits to your factory.



Affinity ENIG 2.0

EN2 - 4

. 6 M

TO

EN2 - 4

MTO

EN3 - 3

MTO

EN2 -

2 M

TO

EN2 -

1 MTO

EN2 - 0

MTO

EN1 -

4.8 M

TO

EN1 -

4 M

TO

EN1 -

3 M

TO

EN1 -

2 M

TO

EN1 -

1 M

TO

EN 1

- O M

TO

9.2

9.0

8.8

Sam

ple

Mea

n

__X=8.9642

UCL=9.2270

LCL=8.7014

EN2 - 4

. 6 M

TO

EN2 - 4

MTO

EN3 - 3

MTO

EN2 - 2

MTO

EN2 -

1 MTO

EN2 - 0

MTO

EN1 -

4.8 M

TO

EN1 -

4 M

TO

EN1 -

3 M

TO

EN1 -

2 M

TO

EN1 -

1 M

TO

EN 1

- O M

TO

0.4

0.3

0.2

0.1

Sam

ple

StD

ev

_S=0.2695

UCL=0.4625

LCL=0.0764

Xbar-S Chart of Affinity 2.0 EN %PXRF %P measurement over two Electroless Nickel solution lives

ENIG Customer RequiementsIm

po

rta

nce

EN1 -

IG 1

EN1 -

IG 2

EN2 -

IG 1

EN 2

- IG

2

Notes

EN %P Control (8-10% wt/wt) 1 9 9 1 1 EDS and XRF Analysis

EN Plating Rate Control 1 9 9 3 3 IMR Charts

IG Plating Rate Control 2 9 3 1 3 IMR Charts

Functional Soldering (3 Operations) 1 9 9 9 9 LF Solderspread, Ballshear and PTH FILL

Within Panel Au Thickness Distribution 5 9 3 1 3 XRF Analysis

IG Chemistry - Low Au Concentration 2 3 9 3 9 TDS Operating Parameters

IPC 4552 EN Corrosion Spec Conformance 1 9 9 9 9 X-Section

SEM Corrosion Evaluation 5 9 9 3 3 SEM Analysis

MEES Internal X-Section Corrosion Spec 5 3 3 3 9 X-Section/ SEM Analysis

Cosmetic Appearance 1 9 9 1 1 Visual Evaluation

Process Control Simplicity 1 9 3 1 1 IMR Chart and Process Capability Analysis

Electroless Nickel Coverage 1 9 9 3 3 X-Section

Electroless Nickel Resolution 1 9 9 3 3 Visual / X-Section Evaluation

105 93 41 57

201 165 75 129

1st 2nd 4th 3rd

Absolute Weight

Releative Weight

Overall Ranking

Quality Deployment Function

• Used to compare ENIG chemistries during development process.

• Created a focus to improve EN %P control and corrosion.

• Created a focus to eliminate cost.

Measurement System Analysis

• Used to understand Au thickness and EN%P measurement errors.

• Improved measurement of gold thickness and EN %P.

• Improved control of gold thickness and cost.

Statistical Process Control

• Used to ensure “Critical to Quality” process variables are under control.

• Same product every shift and every day.

Strong Performance 9

Acceptable Performance 3

Weak Performance 1

Correlation Key



Affinity ENIG 2.0

Design of Experiments

• Used to optimize and understand effect and Interactions of Key Process Variables.

• Issues engineered out during design stage.

• MacDermid-Enthone service team has a deep understanding of the process.

Capability Analysis

• Used to assess process performance against End User or OEM specifications.

• OEM specifications met.

Reliability Simulations

• Weibull and other reliability simulations undertaken to ensure deposit meets

Industry expectations.

• Reliability confidence when PCB’s are out in the field.


Affinity ENIG 2.0Process Cycle and Equipment

Equipment And Plating Cycle:

Affinity Clean

Affinity Etch

MicroetchPost -Dip

Affinity Activate

PDS

Affinity Activator Post -Dip

Affinity 2.0 Electroless

Nickel

Affinity 2.0 Immersion

Gold

Affinity 2.0 fits into standard ENIG process equipment, giving technical

benefits over incumbent processes.

Equipment improvements available to deliver improved deposit

distribution uniformity for new build or retro fit.

Affinity Nickel 2.0 delivers 0,15-0,23 µ/min plating rate over 5 MTO

giving unrivaled productivity.

Affinity 2.0 has been engineered to be simple to use eliminating the

need for complicated auto-control / analysis systems reducing

engineering time and chance of operator error.


Affinity ENIG 2.0Process Chemistry Overview

Affinity Clean

Affinity Etch

Sulfuric Acid Pre-dip

Affinity Activate PDS

Affinity Post-dip

Affinity Nickel 2.0

Affinity Gold 2.0

Acid Cleaner• Options to take care of NPTH plating and produce chemically clean surfaces for

subsequent processing.

Microetch• Etch options to minimize variation of incoming copper surface.

Activator Pre-dip• Helps minimize occurrence of galvanic skipping.

Palladium Sulfate Based Activator• Low palladium concentration to minimize operating cost and formulated to eliminate

extraneous and skip plating.

Activator Post-dip• Helps to minimize risk of extraneous plating.

Electroless Nickel• Dummy free, stable and easy to use chemistry. Provides superior phosphorous

control, cosmetic appearance and deposit uniformity.

Immersion Gold• Optimized for low gold metal operation with excellent thickness and corrosion control.


AFFINITY ENIG 2.0Pre-Treatment


Affinity ENIG 2.0

There are many variables in the PCB manufacturing process prior to the ENIG process that can effect yield.

Affinity 2.0 has been developed with pretreatment options designed to minimize variation in incoming panel quality.

Pre-Treatment Technology Overview

• Affinity NPTH Cleaner 2.0

• Affinity Etch One

• Affinity Activate PDS

• Excellent cleaning of copper surfaces removing dirt, oils, and copper oxidation ensuring nickel

adhesion and coverage.

• Ties up residual palladium in tooling holes from electroless copper processing preventing

undesired plating.

• Produces cleaned etched surface for optimal palladium adsorption.

• Modifies copper topography to provide uniform low roughness surface for Electroless Nickel

grain formation eliminating larger EN grain boundaries which are more prone to galvanic attack

in Immersion Gold chemistry.

• Optimized to activate copper surfaces and eliminate extraneous plating on a variety of

commonly used and high performance PCB laminates.

• Mild formulation minimizes copper build up and provides long solution life giving high

performance with economical operating cost.


Affinity ENIG 2.0Cleaner Technology

• Affinity Cleaner 1.0 and Affinity NPTH Cleaner 2.0 both provide

effective removal of copper oxide, fingerprints and other soils from

previous manufacturing processes.

• Affinity NPTH Cleaner 2.0 is a two part cleaning system that provides a

solution for elimination of unwanted plating in tooling holes. Utilization of

a palladium poison renders residual palladium inactive during the

cleaning process preventing Electroless Nickel plating.

Ni 2+ Ions

Residual Pd

Pd Poison

Affinity Cleaner 1.0

Affinity NPTH Cleaner 2.0


Affinity ENIG 2.0Microetch Technology

• Excessive copper roughening prior to

soldermask application can result in irregular

grain boundary formation during Electroless

Nickel deposition. Irregular EN grain

boundaries have been cited as potential sites

for excessive corrosion during Immersion Gold

deposition.

• Affinity Etch and Affinity Etch One

microetch processes contain surface

topography modifiers which allow reduction of

surface roughness creating uniform copper

surfaces and resulting in a more uniform

Electroless Nickel surface.

Untreated Roughened Copper Following ENIG

Roughened Copper / Etch One Following ENIG


Affinity ENIG 2.0Microetch Post-Dip Technology

0.35 MTO

• Trapped microetch chemistry in partially plugged via holes can create galvanic cells will enough potential to prevent Electroless Nickel

plating along the connected trace.

• Use of a simple sulphuric acid post dip following microetch is sufficient to assist with removal of the trapped process chemistry.

• MacDermid-Enthone recommend inclusion of this process step to safeguard against galvanic skipping pads without resorting to expensive

proprietary chemistry.

Skipped Pad

Trapped Solution

Via Hole

Bulk EN Solution


Affinity ENIG 2.0Activator Technology

FR-4 Material Aluminum Nitride Ceramic

• Affinity Activate PDS is a palladium sulphate

based activator optimized for compatibility with

common and advanced substrates alike.

• Skip and extraneous free electroless nickel

deposition ensuring yield maximization.

• Operation at 25 ppm of palladium giving low

make cost and drag out losses.

• Mild corrosivity for copper ensures long

working bath.

Arlon 85NIsola P96 Rogers 3010


Affinity ENIG 2.0Activator Post-Dip Technology

0.35 MTO

• Post Dip Chemistry has the ability to removal residual palladium from tight geometries and hold in solution preventing re-deposition.

• This results in cleaner feature edges and a reduction in extraneous plating with problematic spacing and or materials.

Complexor

Palladium


AFFINITY ENIG 2.0Electroless Nickel


Affinity ENIG 2.0Electroless Nickel Technology Overview

Affinity 2.0 Electroless Nickel has been designed to work synergistically with the Affinity 2.0 Pre-Treatment chemistry to ensure a

uniform and consistent initiation of electroless nickel. So what does this mean to the PCB Fabricator ?

Affinity 2.0 Electroless Nickel’s enhanced chemistry delivers……

• “Right first basket” start up.

• Reduced cycle time and cost by elimination of need to dummy plate.

• Efficient even in stop/start situations. No need to worry about start up procedures

• Consistent basket to basket nickel thickness.

• Consistent productivity irrespective of Electroless Nickel solution age.

• Formulation minimizes effect of EN property changes as bath ages = consistent rack to rack deposition.

• Superior control over phosphorous content over long Electroless Nickel life.

• Improved cosmetic appearance of ENIG deposit.

• Consistent corrosion resistance of Electroless Nickel deposit.

• Consistent gold thickness basket to basket.

• Simplified operation.

• Elimination of operator intervention.

• Reduced special cause variation and potential for operator error.


Affinity ENIG 2.0Technology Benefits – Electroless Nickel Plating Rate

Having high and consistent plating rates allows the PCB fabricator high levels of productivity and increased control over EN

thickness without having to adjust Electroless Nickel pH to maintain throughput and the resultant phosphorous content sacrifices.

543210

10

8

6

4

EN MTO

mic

roin

ch

/ m

in

_X=6.833

UCL=7.418

LCL=6.248

543210

0.8

0.6

0.4

0.2

0.0

EN MTO

Mo

vin

g R

an

ge

__MR=0.22

UCL=0.7188

LCL=0

I-MR Chart of Affinity Nickel 2.0 Plating Rate

• Temperature increase from 80 to 86 OC allows consistent

electroless nickel thickness to be achieved over 5 EN MTO’s.• Consistent EN thickness with increasing EN age.

• All EN cells have same plating speed.

• No reduction in productivity.

• Temperature adjustment has no significant effect on the

electroless nickel phosphorous content, and is thus preferred to

pH adjustment.


Affinity ENIG 2.0Phosphorous Content – Measurement System Error

• Neither EDS or XRF showed good %P analysis performance (< 10 % of the tolerance).

• The XRF method showed minimal bias (error reading the standard) and if enough measurements are made the average %P is close to the actual.

• It was determined that averaging 10 XRF measurements provide a suitable measurement system of EN %P.

Reference 9.5762

Mean 9.563224

StDev 0.1054968

6 × StDev (SV) 0.6329809

Tolerance (Tol) 2

Basic Statistics

Bias -0.012976

T 0.6149740

PValue 0.544

(Test Bias = 0)

Bias

Cg 0.63

Cgk 0.59

Capability

%Var(Repeatability) 31.65%

%Var(Repeatability and Bias) 33.84%

Gage name: Waterbury SDD XRF

Date of study: Feb 2016

Reported by: Paul Romaine

Tolerance: 2

Misc:

252321191715131197531

10.5

10.0

9.5

9.0

Observation

%P

Ref

Ref + 0.10 × Tol

Ref - 0.10 × Tol

Run Chart of %P by XRF

Type 1 Gage Study for %P

Reference 9.67

Mean 9.9453

StDev 0.22753

6 × StDev (SV) 1.36518

Tolerance (Tol) 2

Basic Statistics

Bias 0.2753

T 4.68670

PValue 0.000

(Test Bias = 0)

Bias

Cg 0.29

Cgk -0.11

Capability

%Var(Repeatability) 68.26%

%Var(Repeatability and Bias) -181.22%

Gage name: Taiwan GDAC SEM-EDS

Date of study: May 2016

Reported by: Kenny Lin

Tolerance: 2

Misc:

151413121110987654321

10.50

10.25

10.00

9.75

9.50

Observation

%P E

DS

Ref

Ref + 0.10 × Tol

Ref - 0.10 × Tol

Run Chart of %P EDS

Type 1 Gage Study for %P EDS


Technology Benefits – Electroless Nickel Phosphorous Content

• Some traditional EN systems utilize pH adjustment to maintain plating rate with age, thus reducing the EN %P.

• Affinity 2.0 EN uses temperature increase to maintain plating rate and thus no effect on the deposit %P content.

• Thus Affinity 2.0 EN maintain consistent deposit properties over the working life of the chemistry.

• With high MSE associated for EN %P this reduces chance of EOL deposits being out of specification.

Affinity ENIG 2.0

5 MTO4 MTO3 MTO2 MTO1 MTO0 MTO

9

8

7

Sam

ple

Mean

__X=7.925UCL=8.094

LCL=7.756


0.3

0.2

0.1

Sam

ple

StD

ev

_S=0.1731

UCL=0.2971

LCL=0.0491

1

1

1

1

1

Xbar-S Chart of Traditional EN %P

Affinity 5 MTOAffinity 4 MTOAffinity 3 MTOAffinity 2 MTOAffinity 1 MTOAffinity 0 MTO

9

8

7

Sam

ple

Mea

n

__X=8.981

UCL=9.186

LCL=8.776

Affinity 5 MTOAffinity 4 MTOAffinity 3 MTOAffinity 2 MTOAffinity 1 MTOAffinity 0 MTO

0.4

0.3

0.2

0.1

Sam

ple

StD

ev

_S=0.2102

UCL=0.3608

LCL=0.0596

Xbar-S Chart of Affinity 2.0 EN %P


Predictable EN deposit %P allows…

• High conformance to OEM and end user specifications.

• Consistent corrosion resistance.

• Excellent gold thickness control.

• Consistent low level of observed corrosion anomalies.

• Consistently reliable functional performance.

Technology Benefits – Electroless Nickel Phosphorous Content

Several OEM’s already specify an EN phosphorous content of 7 – 10%, but PC Fabricators prefer 8 – 10 % due to improved

corrosion resistance. Out of specification (low) phosphorous content is often cited in failure analysis as root cause of excessive

corrosion. Affinity 2.0 Electroless Nickel demonstrates consistent EN %P allowing consistent corrosion resistance over the

working life contributing to reduced variation in gold thickness as well as minimizing observed corrosion anomalies.

Affinity ENIG 2.0

EN2 - 4

. 6 M

TO

EN2 - 4

MTO

EN3 - 3

MTO

EN2 -

2 M

TO

EN2 -

1 MTO

EN2 - 0

MTO

EN1 -

4.8 M

TO

EN1 -

4 M

TO

EN1 -

3 M

TO

EN1 -

2 M

TO

EN1 -

1 M

TO

EN 1

- O M

TO

9.2

9.0

8.8

Sam

ple

Mea

n

__X=8.9642

UCL=9.2270

LCL=8.7014

EN2 - 4

. 6 M

TO

EN2 - 4

MTO

EN3 - 3

MTO

EN2 - 2

MTO

EN2 -

1 MTO

EN2 - 0

MTO

EN1 -

4.8 M

TO

EN1 -

4 M

TO

EN1 -

3 M

TO

EN1 -

2 M

TO

EN1 -

1 M

TO

EN 1

- O M

TO

0.4

0.3

0.2

0.1Sa

mp

le S

tDev

_S=0.2695

UCL=0.4625

LCL=0.0764

Xbar-S Chart of Affinity 2.0 EN %PXRF %P measurement over two Electroless Nickel solution lives


Affinity ENIG 2.0Technology Benefits – Consistent EN and ENIG Structure

EN

Only

ENIG

• Affinity 2.0 provides a consistent and uniform EN deposit structure over 5 MTO’s. This allows not only consistent gold deposit

but improved cosmetic appearance.

0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO


Affinity ENIG 2.0Technology Benefits – Consistent Cosmetic Appearance

• Affinity 2.0 Electroless Nickel’s highly uniform

structure allows improvement in ENIG cosmetic

appearance.

• Improved “haloing” of PTH-in-ground features.

• Reduced pad-pad color differences between

adjacent pads connected to trace or ground area.


AFFINITY ENIG 2.0Immersion Gold


Affinity ENIG 2.0Technology Benefits- Corrosion Control

Anodic Reaction

Ni → Ni2+ + 2e-

Cathodic Reaction

2[Au(CN)2]- → 2Au+ + 4CN-

2Au+ + 2 e- → 2 Au

Overall Reaction

Ni + 2[Au(CN)2]- → 2Au + [Ni(CN)4]

2-

Immersion gold mechanism involves galvanic

displacement of nickel ions from the EN surface

The point at which EN corrosion leads to reliability

concerns is debated, but this concern is reduced

significantly with Affinity 2.0

PCB fabricators and end users continue to become

more critical of ENIG corrosion, this is reflected in the

recent revision A of IPC4552

Affinity ENIG 2.0 has been developed with these

concerns in mind, delivering low and consistent

corrosion occurrence.

Affinity 2.0

Traditional ENIG


IPC4552 Revision ACorrosion Control

IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to

the ongoing ENIG corrosion acceptability and reliability argument.

Key Points….

• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive

magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.

• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of

Intermetallic Compound (IMC) formation.

• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous

IMC formation, it is NOT considered to be rejectable.

• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for

acceptance criteria shall use optical microscopy at a maximum of 1000X magnification.


IPC4552 Revision ACorrosion Control

IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to

the ongoing ENIG corrosion acceptability and reliability argument.

Key Points….

• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive

magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.

• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of

Intermetallic Compound (IMC) formation.

• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous

IMC formation, it is NOT considered to be rejectable.

• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for

acceptance criteria shall use optical microscopy at a maximum of 1000X magnification.

Non-wetting soldering defects can occur for many reasons. For this reason a consistent and low level of EN corrosion is

advisable to avoid any solderability failure being diagnosed as “Hyper Corrosion”.


Affinity ENIG 2.0Optimization of Galvanic Displacement Reaction

Traditional ENIG

Traditional ENIG - Galvanic Displacement Reaction

1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds. 2. Gold deposit forms with spikes of corrosion.

1b. Oxidation of the EN surface can occur simultaneously.

Gold Deposit

Corrosion Spikes

Electroless Nickel

Copper

Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction

1. Surface Active Agent adsorbs on EN surface 2. Surface Active Agent desorbtion allows 3. Controled replacement of nickel with gold

preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2.

Gold Deposit

Surface Active Agent

Electroless Nickel

Copper

O2 O2

Au+ Ni2+

Ni2+

Ni2+ Ni2+

O2

Au+ Ni2+

Ni2+Ni2+

Ni2+

O2O2


Affinity ENIG 2.0Optimization of Galvanic Displacement Reaction

Traditional ENIG

Affinity ENIG 2.0

Traditional ENIG - Galvanic Displacement Reaction

1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds. 2. Gold deposit forms with spikes of corrosion.

1b. Oxidation of the EN surface can occur simultaneously.

Gold Deposit

Corrosion Spikes

Electroless Nickel

Copper

Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction

1. Surface Active Agent adsorbs on EN surface 2. Surface Active Agent desorbtion allows 3. Controled replacement of nickel with gold

preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2.

Gold Deposit

Surface Active Agent

Electroless Nickel

Copper

O2 O2

Au+ Ni2+

Ni2+

Ni2+ Ni2+

O2

Au+ Ni2+

Ni2+Ni2+

Ni2+

O2O2


Affinity ENIG 2.0Technology Benefits – Corrosion Control


Affinity ENIG 2.0 provides excellent corrosion observations by X-Section and SEM following gold stripping.

PCB Fabricator and End Users will observe consistent and low occurrence of corrosion.

Eliminate concern and discussion over reliability associated with traditional ENIG systems.


Affinity ENIG 2.0Gold Thickness Control: Ability to meet Specification

Revision A to IPC4552.

X̄ - 3s ≥ 0.04 µm [≥1.58 µIn]

X̄ + 3s ≤ 0.1 µm [≤3.94 µIn]

• IPC has added an upper specification limit for gold thickness

• Addition of upper boundary increases need for Gold

thickness control to maintain a capable process.

• IPC allows a lower average Gold thickness is good deposit

distributions can be achieved.

• This offers potential savings in gold metal consumption.


Affinity ENIG 2.0Gold Thickness – IPC4552 Rev A Specification

• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .

• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.

• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).

5.0 MTO4.5 MTO4.0 MTO3.5 MTO3.0 MTO2.5 MTO2.0 MTO1.5 MTO1.0 MTO0.5 MTO0 MTO

2.40

2.25

2.10

Sam

ple

Mea

n

__X=2.2704

UCL=2.3376

LCL=2.2033


0.10

0.05

0.00

Sam

ple

StD

ev

_S=0.0471

UCL=0.0983

LCL=0

Xbar-S Chart of Affinity 2.0 ENIG Gold ThicknessAs per IPC4552 Revision A


Affinity ENIG 2.0Gold Thickness – IPC4552 Rev A Specification

• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .

• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.

• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).

• Potential for reduction in gold consumption - Average gold thickness reduction.


2.40

2.25

2.10

Sam

ple

Mea

n

__X=2.2704

UCL=2.3376

LCL=2.2033


0.10

0.05

0.00

Sam

ple

StD

ev

_S=0.0471

UCL=0.0983

LCL=0

Xbar-S Chart of Affinity 2.0 ENIG Gold ThicknessAs per IPC4552 Revision A


Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Quality and Savings?

• A normal distribution will have 99.7% of all data evenly distributed ± 3 standard deviations from the population mean (µ).

• Therefore 99.85% of all gold thickness measurements will be + 6 standard deviations from the minimum thickness measured.


Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Savings?

• Some PCB fabricators only care about not

exceeding the minimum specification gold

thickness.

• With poorly distributed Immersion Gold thickness

this can lead to significant waste.

Affinity 2.0

Competing ENIG


Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Savings?


exceeding the minimum specification gold

thickness.

• With poorly distributed Immersion Gold thickness

this can lead to significant waste.

• Affinity ENIG 2.0 has been demonstrated to

deliver significantly improved gold thickness

distribution over competitive ENIG systems.

Affinity 2.0

Competing ENIG

Waste $


Affinity ENIG 2.0

Affinity 2.0

Competing ENIG

Cost

Down

Ave Au = 2.0 µIn

Ave Au = 2.8 µIn

Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?


exceeding a minimum specification gold

thickness.

• Poor gold thickness distribution = significant

waste

• Affinity ENIG 2.0 delivers significantly improved

gold thickness distribution compared to

competitive ENIG systems.

• IPC4552 Rev. A allows minimum gold

thickness of 1.58 microinches at three

standard deviations below the average

thickness.


Affinity ENIG 2.0

Affinity 2.0

Competing ENIG

Cost

Down

Ave Au = 2.0 µIn

Ave Au = 2.8 µIn

Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?


exceeding a minimum specification gold

thickness.

• Poor gold thickness distribution = significant

waste

• Affinity ENIG 2.0 delivers significantly improved

gold thickness distribution compared to

competitive ENIG systems.

• IPC4552 Rev. A allows minimum gold thickness

of 1.58 microinches at three standard deviations

below the average thickness.

• This translates directly to cost savings for

processes with tighter gold thickness

distributions.


Affinity ENIG 2.0Technology Benefits – Basket to Basket and Within Panel Gold Thickness Comparison

• .Affinity 2.0 – Shows a consistent average thickness over time (5 EN MTO’s) due to minimized basket-

basket gold variation. Affinity 2.0 also shows superior gold thickness dispersion around the average gold

thickness due to the superior within panel distribution. These two features provide excellent control over

gold thickness and therefore cost.

1

24

3

• Affinity 2.0 and three competitive

ENIG systems were analyzed for

basket to basket gold thickness as

well as within panel gold thickness.

• 4 different pad sizes

• 5 Panel locations

• Over 5 EN MTO’s


Technology Benefits – Proving Cost Savings

Affinity ENIG 2.0

• Affinity ENIG 2.0 deposits have shown consistent low gold distribution vs competitive products in benchmarking exercises.

• Affinity ENIG 2.0 has potential to realize large reductions in gold metal consumption.

3.002.752.502.252.001.751.50

0.35

0.30

0.25

0.20

0.15

0.10

Average Au Thickness

Std

Dev

Traditional MacDermid Enthone 2

Traditional MacDermid Enthone 1

Competition B

Competition C

Competition A-1

Competition E

Competition D

Competition A-2

Affinity 2.0Affinity 2.0Affinity 2.0Affinity 2.0Affinity 2.0

Affinity 2.0

Affinity 2.0

Affinity 2.0Affinity 2.0

Affinity 2.0Affinity 2.0Affinity 2.0

Affinity 2.0

Affinity 2.0 Affinity 2.0

Scatterplot of Std Dev vs Average Au ThicknessAnalysis of Affinity 2.0 ENIG vs Competitive Systems


Affinity ENIG 2.0Technology Benefits – Average Gold Thickness Reduction / Cost Saving Calculation

Au Metal $/g 37.85 Metal Area 15.00%

Incumbent Affinity 2.0

Minimum Gold Thickness microinches

Gold Thickness Standard Deviation 0.2500 0.1500 microinches

Average Au Thickness 2.35 2.05 microinches

Gold Metal Consumed 0.0316 0.0276 gram /panel sq ft

Gold Metal Cost $1.20 $1.044 $ /panel sq ft

Gold Consumption Reduction

Product Estimate Month

Monthly Saving

Annual Saving

1.60

125,000

$19,106.50

$229,278.06

Net Benefit in Gold Consumption Calculation

12.77%

0

0.5

1

1.5

2

2.5

3

0.5 1 1.5 2 2.5 3 3.5

Den

sit

y

Au (microinches)

Gold Thickness DistributionAffinity 2.0 ENIG vs. Competitive System


AFFINITY ENIG 2.0Reliability and Performance Testing


Affinity ENIG 2.0Lead Free Soldering – Introduction

• Affinity ENIG 2.0 Supercoupons TV’s processed at every EN MTO.

•All samples for Lead Free solderability testing were pre-conditioned

by processing X3 as per the attached lead free profile.

•Following Pre-Conditioning these TV’s were assessed for

solderspread and ballshear using as well as PTH fill by lead free

wave soldering.

• Peak Temp of Panel = 255 OC


Affinity ENIG 2.0Technology Benefits – Soldering

Using Alpha CVP-390 SAC305 solderpaste, Affinity 2.0

shows excellent solder wetting properties following X3

lead free reflow.

Solderspread analysis shows high and consistent %

spread measurements from 0 – 5 EN MTO’s.


350

300

250

200

150

100

50

0

Affinity Nickel 2.0 MTO

% S

old

ers

pre

ad

Boxplot of Affinity 2.0 Solderspread vs EN MTO




Affinity 2.0 shows excellent high and consistent ball shear performance.

All failures observed are the preferred ductile failure mode (within solderball).


3.0

2.5

2.0

1.5

1.0

0.5

0.0

Affinity Nickel 2.0 MTO

Kg

Fo

rce

Boxplot of Affinity 2.0 Ball-Shear vs EN MTO

Solder Ball

Laminate

1. Pad/Substrate

2. Intermetallic(IMC)

3. Solder Joint

4. Bulk Solder

0 MTO 1 MTO 2 MTO 5 MTO4 MTO3 MTO



• Supercoupons TV’s were evaluated for PTH filling by passing through

Novastar solderwave equipment under standard conditions for SAC alloy

using Alpha EF6000 Flux.

• % of PTH’s filled to Target conditions of IPC J-Std 003 was calculated.



Affinity 2.0 shows excellent high and consistent PTH filling following X3 lead free reflow - easily

conforming to IPC J-Std 003.

75%

80%

85%

90%

95%

100%


PTH

% F

ill

Affinity 2.0 PTH Filling vs EN MTO

Affinity 2.0 IPC J-Std 003


Affinity ENIG 2.0Value Proposition Statement

$86,000

less

kW*hrsReduction

In Gold Use

Reduction

in Out-of-

Spec Parts

Elimination

of OEM

returns

Benefits

Reduced

Labor costs

Significant operational savings from superior within panel gold

thickness distribution and basket to basket thickness control versus

competitive processes.

Low and consistent corrosion eliminating discussion and concern over

reliability.

Six Sigma approach to R&D and process control provide robust

manufacturing, increased yieild and conformance to end user

specifications.

Process simplicity results in reductions in labor costs, engineering

input, defects and production strain.


Affinity ENIG 2.0Proposal

MacDermid-Enthone propose to process standard test

vehicles through incumbent ENIG process over the

course of the EN life (beginning, middle and end as a

minimum).

MacDermid-Enthone will analyze the gold thickness

distribution, examine the corrosion as well as other key

attributes of the ENIG process and provide a report

detailing the operating cost reduction and technical

benefits in switching to Affinity 2.0.

MacDermid-Enthone will process any additional test

vehicles required by the customer through Affinity ENIG

2.0 and return them for evaluation.


For more information…

John Swanson

Director Surface Finishes

Global

MacDermid Enthone Electronics Solutions

245 Freight St

Waterbury

CT 06702

[email protected]

O +1 203 575 7909

M +1 203 228 0762

Martin Bunce

Global Applications Manager

Lean Six Sigma Black Belt


245 Freight St

Waterbury

CT 06702

[email protected]

O +1 203 575 5772

M +1 203 706 8539

Ryan Tam

Final Finish Product Manager

Asia


4/F, #9 Tongfuyu Industrial Town,

Tanglang, Xili, Nanshan Dist.

Shenzhen, Guangdong

[email protected]

O +8675536905271

M +8613501597927

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